JP4077541B2 - Non-contact IC card manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a contactless IC card and a method for manufacturing the same, and more particularly to a structure of an antenna coil and a method for forming the antenna coil.
[0002]
[Prior art]
As this type of non-contact IC card, as shown in FIG. 4, a circuit board 1 on which electronic components are mounted, and connected to the circuit board 1 to transmit / receive information via a predetermined medium such as electromagnetic coupling and radio waves An antenna coil 2 that is sealed with a coating resin 3 is known (see Japanese Patent Application Laid-Open Nos. 9-1969 and 9-1970).
[0003]
In the case of using a winding coil in which a thin metal wire such as a copper wire having a circular or rectangular cross section is used as the antenna coil 2 among the components of such a non-contact IC card, conventionally, A wire coil is formed on one of the two coated resin films, and the wound coil and the circuit board are attached to the one coated resin film by attaching the other coated resin film to the wound coil. The circuit board is sealed with a coating resin.
[0004]
[Problems to be solved by the invention]
However, in such a conventional non-contact IC card, the antenna coil is a winding coil formed by winding a thin metal wire such as a copper wire in a spiral shape. It is difficult to maintain the shape of the wound winding coil, and it is difficult to accurately form the winding coil into a regular shape such as a square shape. In particular, it was extremely difficult to form a winding coil having a complicated shape.
[0005]
The present invention has been made in order to solve the above-described conventional problems, and a non-contact IC that improves the manufacturability of an antenna coil by configuring the antenna coil from a winding coil formed by a specific method. An object is to provide a card and a method for manufacturing the card .
[0006]
[Means for Solving the Problems]
Therefore, a non-contact IC card manufacturing method according to claim 1 comprises a circuit board on which electronic components are mounted, and an antenna coil that is connected to the circuit board and transmits and receives information via a predetermined medium. A non-contact IC card manufacturing method in which a winding coil is sealed with a coating resin, and is arranged in a predetermined shape on the upper surface of a drive unit that is reciprocally slidably driven in a vertical direction and a horizontal direction. A plurality of needle members that are attached and extend upward are moved upward by a longitudinal slide of the drive unit, and the cover resin is made of heat-fusion resin that is heat-sealed to each other, and each of the drive units A step of inserting into the lower film of the two lower and upper films disposed above the upper film, and on each of the lower films, each needle portion projecting a thin metal wire from the lower film The winding coil wound in a predetermined shape is formed by sequentially applying the winding coil, the lower film and the driving unit are slid laterally, and the winding coil is placed on each needle member. The lower film is moved at a position where the winding coil of the lower film is formed by a predetermined length while being held, and the lower film is moved at a position where the winding coil is formed. The upper film is attached to the film by heat sealing, and the winding coil and the circuit board are sealed between the two films, and the sealing of the winding coil and the circuit board is completed. Then, the step of moving each needle member downward by sliding in the longitudinal direction of the drive unit and retracting it from the lower film; and the lower side of the needle member by sliding in the lateral direction of the drive unit Move to the position to insert the film Characterized in that it comprises a step of ascribed, the.
According to a second aspect of the present invention, there is provided a method for manufacturing a non-contact IC card , wherein the needle member is arranged and attached to the upper surface of the drive unit so as to have a polygonal shape or a similar shape, and the winding coil has many It is characterized by being spirally wound into a square or similar shape .
[0010]
The operation of the present invention will be described.
In the invention according to claim 1, the plurality of needle members in the drive unit are moved upward by sliding of the drive unit, inserted into the lower film, and the thin metal wires are protruded from the lower film to the respective needle members protruding from the lower film. The winding coil which comprises an antenna coil is formed on a lower film by applying in order and winding in predetermined spiral shape. Then, the lower film and the drive unit are respectively slid in the horizontal direction, and the portion of the lower film where the winding coil is formed is kept a predetermined length while holding the winding coil on each needle member. At this moving position, the two films are bonded to each other by heat fusion, and the winding coil and the circuit board are sealed between the two films. After that, each needle member is moved downward by the slide of the drive unit to be moved away from the lower film, and further, each needle member is moved back to the position where it is inserted into the lower film by the lateral slide of the drive unit. Let Therefore, when manufacturing a non-contact IC card, the winding of the metal thin wire itself for forming the winding coil constituting the antenna coil is an easy task, and the winding coil is accurately shaped into a regular shape, for example, a square shape. In addition, it is easy to form a winding coil having a complicated shape, and thus the manufacturability of the antenna coil can be improved. Furthermore, by bonding the two films together by thermal fusion, the circuit board and the winding coil can be easily covered with the coating resin, and the shape of the formed winding coil is also sealed. Up to the process can be held by each needle member, so that the productivity of the non-contact IC card can be improved.
[0011]
In the invention according to claim 2 , if the needle member is arranged and attached to the drive portion so as to have a polygonal shape or the like , the winding coil can be easily formed into a polygonal shape or a similar shape.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an example of a non-contact IC card manufactured using the non-contact IC card manufacturing method according to the present invention. This non-contact IC card includes a circuit board 10 on which electronic components are mounted, and an antenna coil 11 connected to the circuit board 10 for transmitting and receiving information via a predetermined medium such as electromagnetic coupling and radio waves, and a covering resin. 12 is configured to be sealed. Here, the coating resin 12 is composed of two films made of a heat-sealing resin, for example, polyester, which are heat-sealed to each other.
[0018]
Next, FIG. 2 shows an example of a manufacturing apparatus that executes the method of manufacturing a non-contact IC card according to the present invention . That is, the lower film 12A of the two lower and upper films 12A and 12B is wound around the winding portion 15, and is pulled out from the winding portion 15 in the lateral direction indicated by the arrow in FIG. The film is extended and slid rightward in the figure by a film slide means (not shown).
[0019]
The upper film 12B is wound around a winding portion 16 disposed at a position offset from the winding portion 15 by a predetermined distance in the lateral direction above the winding portion 15. 2 is pulled out in the horizontal direction indicated by the arrow in FIG. 2 which is the same as the direction in which the lower film 12A extends from the winding unit 16, and is slid rightward in the drawing by a film slide means (not shown).
[0020]
The winding portion 15 near the lower position of the lower side of the film 12A, the drive unit 17, respectively reciprocally slidably driven in the vertical and horizontal directions as indicated by arrows in FIG. 2 are arranged. On the upper surface of the drive unit 17, a plurality of shapes that are arranged in a predetermined shape, for example, a polygonal shape or a similar shape (in this embodiment, a shape in which one side of a quadrangle is recessed inwardly in a square shape) are extended upward. A needle member 13 is attached.
[0021]
Based on the operation of the manufacturing apparatus having such a configuration, a method for manufacturing a non-contact IC card according to the present invention will be described.
First, each needle member 13 is moved upward by an upward slide drive as indicated by an arrow on the upper side of FIG. 2 of the drive unit 17 at the original position indicated by A in FIG. 2 and inserted into the lower film 12A. (Step of inserting a needle member in the method of manufacturing a non-contact IC card of the present invention).
Next, on the lower film 12A, a copper coil as a thin metal wire is sequentially applied to each needle member 13 protruding from the lower film 12A, thereby winding the winding coil 14 wound in a predetermined shape. (The step of forming the winding coil in the method of manufacturing a non-contact IC card of the present invention).
Thereafter, the lower film 12A and the drive unit 17 are respectively slid rightward in FIG. 2, and the winding coil of the lower film 12A is formed while holding the winding coil 14 on each needle member 13. 2 is moved to a position indicated by B in FIG. 2 (in the method for manufacturing a non-contact IC card according to the present invention, the step in which the portion where the winding coil is formed is moved by a predetermined length. ).
Next, the upper film 12B is attached to the lower film 12A by heat-sealing at the moving position (position indicated by B in FIG. 2) of the portion of the lower film 12A where the winding coil 14 is formed. Then, the winding coil 14 and the circuit board 10 are sealed between the two films 12A and 12B (in the manufacturing method of the non-contact IC card of the present invention, the winding coil and the circuit board are Sealing between the films).
After the winding coil 14 and the circuit board 10 have been sealed in this way, each needle member 13 is moved downward by a downward sliding drive as indicated by the arrow on the lower side of FIG. And retreating from the lower film 12A (step of retreating the needle member in the non-contact IC card manufacturing method of the present invention).
Thereafter, each needle member 13 is moved to the original position indicated by A from the position indicated by B in FIG. 2 by the leftward sliding drive of the drive unit 17 in FIG. (The step of moving and returning the needle member in the non-contact IC card manufacturing method of the present invention).
[0024]
The upper film 12B is slid in the right direction in FIG. 2 along with the movement return of each needle member 13 as described above, and prepares for the next winding coil formation and the winding coil and circuit board sealing.
Such a process is repeated to form a winding coil, and the winding coil and the circuit board sealed are sequentially sent to the right in FIG.
[0026]
The winding coil 14 can be easily formed in a complicated polygonal shape or a similar shape, and can be easily formed in a hexagonal shape as shown in FIG. 4, for example.
[0027]
According to the manufacturing method of the non-contact IC card, a plurality of needle members 13, and it is moved upward by the direction of the slide drive on the drive unit 17, inserted into the lower side of the film 12A, projecting from the lower side of the film 12A A winding coil 14 constituting the antenna coil 11 is formed by sequentially hooking each needle member 13 and winding it into a predetermined spiral shape, and the lower film 12A and the driving unit 17 are respectively laterally arranged. Slide and move the portion of the lower film 12A where the winding coil 14 is formed by a predetermined length while holding the winding coil 14 on each needle member 13, and at this moving position, two films The winding coil 14 and the circuit board 10 are sealed between the two films 12A and 12B, and then each needle member 13 is moved below the drive unit 17 This is because the drive unit 17 is moved back to the original position, that is, the position where each needle member 13 is inserted into the lower film 12A. When manufacturing a non-contact IC card, the winding of the copper wire itself for forming the winding coil 14 constituting the antenna coil 11 is an easy task, and the winding coil 14 is formed into a regular shape such as a square shape. In addition, the winding coil 14 having a complicated shape can be easily formed, and the manufacturability of the antenna coil 11 can be improved. Furthermore, the circuit board 10 and the winding coil 14 can be easily covered with the coating resin 12 by sticking the two films 12A and 12B together by thermal fusion, and the formed windings The shape of the coil 14 can also be held by each needle member 13 until the sealing step, and as a result, the manufacturability of the non-contact IC card can be improved.
[0028]
【The invention's effect】
As described above, according to the invention according to claim 1, when manufacturing a non-contact IC card, the winding of the metal thin wire itself for forming the winding coil constituting the antenna coil becomes an easy operation, The winding coil can be accurately formed into a regular shape, for example, a square shape, and the winding coil having a complicated shape can be easily formed, thereby improving the manufacturability of the antenna coil. Furthermore, by bonding the two films together by thermal fusion, the circuit board and the winding coil can be easily covered with the coating resin, and the shape of the formed winding coil is also sealed. Up to the process can be held by each needle member, so that the productivity of the non-contact IC card can be improved.
[0029]
According to the invention which concerns on Claim 2 , if a needle member is arrange | positioned and attached to a drive part so that it may become a polygon or a shape similar to this , a winding coil can be easily formed in a polygon or a shape similar to this.
[0032]
[Brief description of the drawings]
FIG. 1 is a plan view showing an embodiment of a contactless IC card according to the present invention. FIG. 2 is a schematic view showing an example of an apparatus for carrying out the method of manufacturing the contactless IC card according to the embodiment. FIG. 4 is a perspective view showing the structure of a conventional non-contact IC card.
DESCRIPTION OF SYMBOLS 10 Circuit board 11 Antenna coil 12 Coating resin 12A Film 12B Film 13 Needle member 14 Winding coil

Claims (2)

A non-contact IC in which a circuit board on which electronic components are mounted and a winding coil that constitutes an antenna coil that is connected to the circuit board and transmits and receives information via a predetermined medium are sealed with a coating resin. A card manufacturing method comprising:
A plurality of needle members, which are arranged and attached in a predetermined shape on the upper surface of a drive unit that is reciprocally driven in a vertical direction and a horizontal direction, respectively, and extend upward, are moved upward by a vertical slide of the drive unit. And a step of inserting into the lower film of the two lower and upper films disposed above the drive unit, each of which is made of a heat-sealing resin that is heat-sealed as the coating resin. ,
On the film of the lower and forming the winding coils wound in a predetermined shape of the spiral by sequentially multiplying each needle member protruding metal wires from the film of the lower side,
Slide the lower film and the drive part laterally, and move the part of the lower film where the winding coil is formed by a predetermined length while holding the winding coil on each needle member. And a process of
In moving position of the part winding coil is formed of the lower film, the upper film to the film of the lower side adhered by thermal fusion, two said and said circuit board with said winding coils a step of sealing between the film,
After the sealing of the winding coil and the circuit board is finished, each needle member is moved downward by sliding in the longitudinal direction of the drive unit, and retreated from the lower film,
Moving each needle member back to a position where it is inserted into the lower film by sliding in the lateral direction of the drive unit; and
A method for manufacturing a non-contact IC card, comprising: It said needle member, characterized in that the upper surface of the drive unit mounted is disposed so that the polygon or shape similar thereto, the winding coils Ru spirally wound in a shape similar to a polygon or it The method for producing a non-contact IC card according to claim 1.

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