JP5540524B2 - Non-contact IC sheet, non-contact IC card, and booklet provided with a non-contact IC sheet - Google Patents

Description

  The present invention relates to an information medium that performs communication using electromagnetic waves, and particularly to a booklet provided with a non-contact IC sheet, a non-contact IC card, and a non-contact IC sheet.

An information medium that communicates using electromagnetic waves is called a non-contact IC data carrier. Input / output of information such as data / commands and power / clock signals between the non-contact IC data carrier and an external read / write device. Etc. are performed in a non-contact state without using electrical contacts by electromagnetic induction.
In general, the non-contact IC data carrier is formed by superimposing a non-contact IC sheet alone or a coating material into a predetermined mold. For example, if a non-contact IC sheet is overlapped with a coating material made of plastic from one side or both sides and shaped into an ID-1 shape defined by the international standard ISO / IEC 7810, it is a so-called non-contact IC data carrier. It becomes a contact IC card. For example, a non-contact IC sheet is overlapped from one side with a coating material called a cover sheet, and a so-called body page formed of paper or the like is overlapped from the opposite side of the cover sheet. If shaped into a shape, it becomes a booklet-shaped non-contact IC data carrier.

  Thus, the non-contact IC sheet is applied to various non-contact IC data carriers by shaping according to the use. In particular, non-contact IC sheets used for the above-described non-contact IC cards and booklet-shaped non-contact data carriers whose appearance is regarded as important are thin and have few steps with flatness taken into account. Is preferred.

  In the prior art, as a method used for manufacturing a non-contact IC sheet using a wire conductor, for example, the following Patent Document 1 proposes a method of connecting an IC chip and forming a coil on a common substrate. .

  According to this proposal, first, one end of the wire conductor and the first bonding pad of the chip are connected, and then the coil is formed by directly arranging the wire conductor on the common substrate, and finally the wire. One open end of the conductor is connected to the second bonding pad of the IC chip. This enables the connection of the IC chip and the formation of the coil by one continuous operation on the common substrate, or almost simultaneous operation, thereby eliminating the need for using the pre-wound coil. Since it is not necessary to handle the coil or mount it on the IC chip, a non-contact IC sheet can be formed without requiring a complicated process.

  Further, as shown in FIG. 16, the wire conductor 131 used for forming the coil 135 is first connected to the first bonding pad 132, and then, when the coil is disposed, each winding is caused to cross the surface of the IC chip 134. The coil is finally connected to the second bond pad 133. In this way, as shown in FIG. 16, there is no need to wire the wire conductors across the coil windings to establish a connection with the second bond pad, and a particularly thin chip card, that is, a chip The structure of the mounting board is possible.

  In addition to the above-mentioned Patent Document 1, there is no need to prepare a separate contact substrate on which an extended bonding pad is formed when the bonding pad of the IC chip is brought into contact with the wire end as described in Patent Document 2. A method (see FIGS. 17 and 18) has been proposed in which a wire end and a terminal portion which is a bonding pad of an IC chip are brought into direct contact.

  FIG. 17 shows a chip card inlet 110 in which the wire ends 116, 117 of the wire conductor 113 that are wired to the substrate 111 to form the coil 112 are in contact with the terminal portion 118 and the terminal portion 119 of the IC chip 115. Yes. A contact method between the wire end portions 116 and 117 and the terminal portions 118 and 119 which are bonding pads of the IC chip 115 will be described with reference to FIGS.

  In the first step, the wire end portion 116 of the wire conductor 113 is fixed to the substrate 111, and the wire conductor 113 is received in the recess 114 by performing a wiring step of laying the wire conductor 113 on the surface of the substrate 111. Guided through the IC chip 115 and fixed to the substrate.

As shown in FIG. 18, in the second step, the wire conductor 113 is disposed at a position straddling a specific terminal portion 118 that is a bonding pad of the IC chip 115, and then connected to the terminal portion 118 that is a bonding pad.
When such a first step is performed, the wire conductor is accurately aligned with the terminal portion which is a bonding pad.

Japanese Patent No. 2810547 Japanese Patent No. 3721520

  However, in the method of connecting the wire conductor to the first and second bonding pads after the IC chip is fixedly arranged on the substrate as in Patent Document 1, the surface of the IC chip on the bonding pad surface is secured in order to ensure flatness. A layer thickness sufficient to absorb the step between the upper portion of the wire conductor in contact with the substrate and the substrate surface is required.

  Also, in order to place the coil without routing the wire conductor across the coil winding to establish a connection with the second bond pad, each winding is crossed across the surface of the chip and finally the coil is In the method of connecting to the second bonding pad, not only does the layer thickness need to absorb the step between the upper portion of the wire conductor crossing the IC chip surface and the substrate surface, but the end surface of a general IC chip is a protective film. In addition to being protected by the above-mentioned end surface, it has a characteristic that cracks are likely to occur from the end surface, and the end surface of an extended bonding pad called a general lead frame is not chamfered unless there are special circumstances. Not considered.

  For this reason, in the manufacturing process of the non-contact IC data carrier, the wire conductor crossing the IC chip surface and the end face of the IC chip, or the wire conductor guided by the extended bond pad and the end face of the extended bond pad are used. The interference may cause a short circuit between the wire conductors due to IC chip breakage, wire conductor breakage, or wire conductor stripping.

  Also, in the one described in Patent Document 2, since the wire conductor 113 crosses the surface of the IC chip 115, the same problem as in the above Patent Document 1 occurs, and the wire conductor 113 crosses the space portion of the recess 114. There is a problem that the wire conductor 113 is easily disconnected at this portion.

  Therefore, the present invention solves such a problem, and is a non-contact IC sheet which is thin and smooth in a non-contact IC sheet having a chip unit and an antenna coil, and has improved interference between the wire conductor forming the antenna coil and the chip unit. The purpose is to provide a seat.

The present invention is a non-contact IC sheet having a chip unit and a wire conductor constituting an antenna coil, wherein the wire conductor is disposed on a plate surface of the substrate, and a window hole is formed in the substrate. The chip unit is disposed with the bonding pad positioned in the window hole portion, and the wire conductor and the bonding pad are connected in the window hole.
In the non-contact IC sheet according to the first aspect of the present invention, the wire conductor is disposed on one plate surface of the substrate, the bonding pad is disposed on the other plate surface side of the substrate, The window hole is composed of a first window hole and a second window hole, the bonding pad is composed of a first bonding pad and a second bonding pad, and the first and second bonding pads are respectively The first and second window holes are disposed so that one end and the other end of the wire conductor are in the first and second window holes 2, respectively. is connected to a second respective bond pads, the substrate is a thermoplastic material, it may be decided to sealed soften or melt the first window hole and a second window holes parts.
In the non-contact IC sheet according to the first aspect of the present invention, the width of the window hole is the movement of the wire conductor in the width direction in a state where the wire conductor is positioned in the window hole. It may be the dimension which regulates.
In the non-contact IC sheet according to the first aspect of the present invention, a side surface of the window hole from the one plate surface to the other plate surface is an inclined surface, and the wire conductor is disposed along the inclined surface. It may be.
In the non-contact IC sheet according to the first aspect of the present invention, the substrate may be a thermoplastic material sheet.
In the non-contact IC sheet according to the first aspect of the present invention, the substrate may be composed of an electrically insulating material and an adhesive layer for fixing the wire conductor .
A non-contact IC card according to a second aspect of the present invention includes the non-contact IC sheet of the present invention.
The booklet which is the third aspect of the present invention is a booklet provided with the non-contact IC sheet of the present invention.

According to the present invention, the window hole is disposed in the portion where the connection pad of the chip unit is located on the substrate on which the wire conductor forming the antenna coil is disposed, so that it is thin and excellent in planar smoothness, and the wire. A non-contact IC sheet with improved interference between the conductor and the chip unit is possible. That is, since the connection pad of the chip unit and the wire conductor are connected through the window hole, a non-contact IC sheet that is insulated by the substrate other than the window hole and does not interfere with the chip unit and the wire conductor can be manufactured. .
In addition, since the wire conductor can be disposed on the substrate facing the chip unit, it is possible to eliminate the overlap of the wire conductor when the antenna coil is formed, and it is possible to manufacture a non-contact IC sheet having excellent planar smoothness.
In addition, since the connection between the connection pad of the chip unit and the wire conductor is made in the window hole, it is possible to prevent the IC chip from being broken, the wire conductor from being disconnected, and the like.

These are perspective views which show schematic structure of the principal part of the non-contact IC sheet shown as one Embodiment of this invention. These are sectional drawings which looked at the cross section of the A-A 'part shown in FIG. 1 in the arrow direction. These are sectional drawings which show another example of a window hole. These are sectional drawings of an example of a chip unit. These are exploded perspective views showing a first embodiment of the present invention. FIG. 6 is a cross-sectional view of the cross section of the B-B ′ portion shown in FIG. 5 as viewed in the direction of the arrow. These are figures which show an example of the manufacturing method of the 1st Example of this invention. FIG. 8 is a cross-sectional view of the C-C ′ section shown in FIG. 7 as viewed in the direction of the arrow. These are sectional drawings of the non-contact IC data carrier which arrange | positions a non-contact IC sheet in a center page. FIG. 10 is an enlarged view of the IC data carrier portion shown in FIG. 9. These are sectional drawings of a non-contact IC data carrier when a non-contact IC sheet is disposed on the cover sheet side. These are exploded perspective views showing a second embodiment of the present invention. FIG. 13 is a cross-sectional view of the cross section of the D-D ′ portion shown in FIG. These are figures which show an example of the manufacturing method of the 1st Example of this invention. It is sectional drawing which looked at the cross section of the E-E 'part shown in FIG. 14 in the arrow direction. It is a figure which shows a 1st prior art example. It is a figure which shows the 2nd prior art example. It is sectional drawing which looked at the cross section of the F-F 'part shown in FIG. 17 in the arrow direction.

Embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic configuration diagram showing a main part of a non-contact IC sheet shown as one embodiment of the present invention.

  In this figure, reference numeral 1 indicates a substrate, and window holes 2 and 3 are formed in the substrate 1.

  A wire conductor 4 is disposed on one plate surface of the substrate 1, and the first wire conductor region 5 (one end portion of the wire conductor) of the wire conductor 4 traverses substantially the center of the window hole 2. And is fixed to the substrate 1 by a wire conductor arranging device (not shown).

  The last wire conductor region 6 (the other end of the wire conductor) of the wire conductor 3 is disposed so as to cross almost the center of the window hole 3 and is fixed to the substrate 1 by the wire conductor arranging device.

  A chip unit 7 is disposed on the other plate surface side of the substrate 1. The chip unit 7 includes a first bonding pad 8 and a second bonding pad 9.

  Here, based on FIG. 1, first, the outer wire conductor end side is disposed as the first wire conductor region 5, and then the inner wire conductor end side is disposed as the last conductor region 6. The end side may be the first wire conductor region and the outer wire conductor end side may be the last conductor region, and the arrangement order of the wire conductors is not limited and is included in the present invention.

The chip unit 7 fixes the wire conductor 4 to the substrate 1 after fixing the wire conductor 4 to the substrate 1. That is, the chip unit 7 is fixed so that the bonding pads 8 and 9 are located in the corresponding window holes 2 and 3 and guided across the window hole 2 by the connection head 11 shown in FIG. 2 of the wire conductor connection device. A part of the first wire conductor region 5 is connected to the bonding pad 8.
Subsequently, a part of the last wire conductor region 6 guided across the window hole 3 by the connection head 11 of the wire conductor connecting device is connected to the bonding pad 9. The connection in this case is performed using thermocompression bonding, welding, solder, conductive adhesive, or the like.

  In this configuration, the window holes 2 and 3 have a rectangular outline shape, and are through holes that penetrate in the direction between the plate surfaces of the substrate 1 with the same outline shape.

  Further, the width dimension of the window holes 2 and 3 is a dimension that regulates the movement in the width direction of the regions 5 and 6 in a state where the regions 5 and 6 of the wire conductor 4 are located inside thereof, that is, the diameter of the wire conductor 4. It is the same dimension as (width dimension).

  FIG. 2 is a cross-sectional view of the cross section of the A-A ′ portion shown in FIG. 1 as viewed in the direction of the arrow, and shows a cross section of the portion of the window hole 3. In addition, since the connection structure in the portion of the window hole 2 is the same as the connection structure of the portion of the window hole 3, the reference numerals of the corresponding elements in the portion of the window hole 2 are shown in parentheses in FIG.

  Here, a part of the first wire conductor region 5 and the bonding pad 8 are connected first, but a part of the last wire conductor region 6 and the bonding pad 9 may be connected first, and are included in the present invention. There is no restriction on the connection order. Further, in FIG. 2, a part of the wire conductor region is shown to be connected to a corresponding bonding pad at only one point, but a plurality of points are connected, and a plurality of window holes are arranged to connect a plurality of bonding pads. This is also included in the present invention.

FIG. 3 is a diagram illustrating another example of the window hole 3.
In this example, the window hole 3 has the same rectangular shape as the opening shown in FIG. 2 when viewed from the direction orthogonal to the surface of the substrate 1 on which the wire conductor 4 is disposed. The internal shape is different from FIG.
That is, the window hole 3 has an inclined surface 3a in which the wall surface in the extending direction of the first wire conductor region 6 gradually falls in the arrow Y1 direction from one plate surface 1a of the substrate 1 toward the other plate surface 1b, It consists of an inclined surface 3b that gradually falls in the direction of the arrow Y2.

  The wire conductor region 6 proceeds in the direction of the connection pad 9 along the inclined surface 3a with respect to the window hole 3, and after being connected to the connection pad 9, is guided to the outside of the window hole 3 along the inclined surface 3b. . According to this configuration, the wire conductor region 6 can be guided along the inclined surfaces 3a and 3b, so that the wire conductor region 6 can be avoided from being bent forcibly, and the wire conductor region 6 can be broken or damaged. Can be prevented.

  Here, the chip unit 7 shown in FIG. 1 is shown as a chip unit having a cross-sectional structure shown in FIG. 4 having an extended bonding pad called a lead frame, but the IC chip itself has a bonding pad. Alternatively, a structure having an IC chip other than the structure shown in FIG. 4 and an extended bonding pad is also included in the present invention. In FIG. 4, reference numeral 12 denotes an IC chip, and 13a and 13b denote bonding wires.

  Also, as shown in FIG. 1, an opening 10 may be disposed in the substrate 1 to absorb the stepped portion of the chip unit 7, and the non-contact data carrier using the non-contact IC sheet 100 of the present invention is thin, In addition, it is suitable for reducing the level difference considering the planar smoothness.

  The wire conductor 4 is not limited to copper and aluminum, but may be any material that exhibits conductivity, and may be a stranded wire such as a plated one or a litz wire. Further, the cross-sectional shape of the wire conductor 4 is not particularly limited including circles, squares, long squares, etc., and it may be arranged on the substrate. In addition, if the cross-sectional area is the same, a thin flat wire type whose cross-sectional shape is longer than a circle may be suitable for reducing high-frequency resistance.

  The shapes of the window holes 2 and 3 are not particularly limited including round, square, long circle, and long square, and may have an opening area where the wire conductor can be connected to the bonding pad. Further, as already described, the cross-sectional shape of the opening of the window hole 3 shown in FIG. 3 is substantially matched to the bent shape of the wire conductor to fill the gap between the bonding pad surface and the wire conductor so that the wire conductor does not float. It is also included in the present invention.

  Further, the contour shape of the opening portions of the window holes 2 and 3 is set to a shape that restricts the movement of the wire conductor 4 in the width direction in a state where the wire conductor 4 is located in the inside thereof, so that the wire conductor 4 is placed in the window hole. This is effective in reinforcing the connecting portion between the wire conductor 4 and the bonding pad by being held by the wall surface of the substrate 1 along the wire conductor arrangement direction. Furthermore, the sheet | seat which used the thermoplastic material for the board | substrate 1 is used, and after connecting a wire conductor and a joining pad, the window hole part after a connection is sealed by applying a heat to a window hole part and softening or melting a thermoplastic material. There is also an advantage that the connecting portion between the wire conductor and the bonding pad can be reinforced.

Base material 1 is polyethylene (PE), polypropylene (PP), polystyrene (PE), polyester (PET, PEN, PB), polycarbonate (PC), polyimide (PI), acrylonitrile-butadiene-styrene (ABS), liquid crystal polymer. (LCP) or the like can be used, and polyvinyl chloride (PVC), amorphous polyethylene terephthalate (PETG), or the like that can be softened or melted at a relatively low temperature is preferable.
The sealing of the window hole portion after the connection is additionally performed in a non-contact IC data carrier manufacturing process in which heat is applied to the non-contact IC sheet 100 of the present invention such as a subsequent heat laminating process. Also good.

  In addition, a base material using a thermosetting material such as phenol (PF) or epoxy (EP), a base material using a fiber material such as paper, or a base material such as synthetic paper using synthetic resin as a main material A substrate on which an adhesive layer for fixing the conductor 4 is disposed can be used.

  When the wire conductor 4 is disposed on the substrate 1 so as to cross the winding, an electric wire covered with an insulating film such as polyurethane resin or polyester resin can be used. It is desirable to peel the film from the located wire conductor region by ultrasonic waves, heater heating, laser heating or the like.

  Further, according to the present invention, the connection between the first or last wire conductor region 5, 6 and the bonding pad 8, 9 is made only through the window hole. An electric wire that is electrically insulated and is not covered with an insulating film can be used for the wire conductor 4. The wire conductor regions 5 and 6 positioned so as to cross the window holes 2 and 3 are formed by ultrasonic waves, heater heating, laser heating, or the like. There is also an advantage that film peeling is unnecessary.

  In the substrate 1 using the above-described thermoplastic material, the connection between the first or last wire conductor region and the 5, 6 bonding pads is softened or melted by using the thermoplastic, so that the window holes 2, 3 after connection are formed. Sealed and the connection part of the wire conductor 4 and the bonding pads 8 and 9 was reinforced. However, a base material using a thermosetting material such as phenol (PF) or epoxy (EP), or a fiber material such as paper was used. In the substrate 1 in which an adhesive layer for fixing the wire conductor 4 is arranged on a base material 1 such as a synthetic paper whose main raw material is a base material or a synthetic resin, a sealing material is filled in a window hole portion for reinforcement. Is preferred.

  This technique can also be applied to a substrate using a thermoplastic material. As the sealing material, an epoxy resin, an epoxy resin added with a plastic polymer, a silicone resin, a phenol resin, a polyimide resin, or the like can be used.

  In addition, it is particularly preferable to use a conductive sealing material in which a conductive substance such as metal powder is added to an epoxy resin or a silicone-modified resin. If a conductive sealing material is used, it is possible to simultaneously connect, reinforce, and seal the first or last wire conductor region 5, 6 and the bonding pads 8, 9, and the manufacturing process can be simplified. is there.

  In general, when sealing with a sealing material, it is necessary to strictly manage the amount and fluidity of the sealing material. The sealing material for sealing the window hole is quantified by the window holes 2 and 3 formed by the bonding pads 8 and 9 of the chip unit 7 disposed on the substrate 1, and further the flow of the sealing material There is also an advantage in manufacturing such that it is possible to give freedom to the sex.

  Further, the wire conductor regions 5 and 6 and the bonding pads 8 and 9 may be connected by using solder, and the solder and the bonding pad conductor or the wire conductors 5 and 6 are alloyed, so that the reliability of conduction is also improved. Highly suitable. Furthermore, sealing and reinforcing the window holes 2 and 3 using a sealing material after connection is also included in the present invention, particularly when a thermoplastic substrate is used, the window holes 2 and 3 after connection. It is also included in the present invention to soften or melt and seal.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 5 shows a first embodiment of the present invention. In the first embodiment, an IC chip is mounted on a 100 μm-thick glass epoxy substrate having a length of 11.9 mm × width of 12.9 mm, and the IC chip is molded resin having a height of 9.1 mm × width of 9.1 mm × height of 0.3 mm. A non-contact IC sheet for a non-contact data carrier having a booklet shape of 125 mm in length and 88 mm in width using the IC module 14 having the bonding pads 18 and 19 extended on the glass epoxy substrate 15 will be described. .

  Referring to FIG. 5 in detail, the non-contact IC sheet 100 of the first embodiment has a mold resin portion of the IC module 14 at the position where the IC module 14 is disposed by a non-contact IC sheet forming apparatus (not shown). A fitting hole 22 of 9.7 mm × 9.7 mm that is slightly larger than the outer shape of the mold resin so as to be fitted, and a substantially circular window hole of φ1.0 mm corresponding to the positions of the bonding pads 18 and 19 of the IC module 14 A copper wire conductor 23 having a diameter of 100 μm is disposed on a heat-resistant PET-G substrate 17 having a length of 125 mm, a width of 88 mm, and a thickness of 0.1 mm on which 20 and 21 are formed.

  The copper wire conductor 23 is fixed to the heat-resistant PET-G sheet substrate 17 while the first wire conductor region 24 is guided so as to cross almost the center of the window hole 20 by a wire conductor arranging device (not shown). 23 is formed as an antenna coil by being fixed to the heat-resistant PET-G substrate 17 in a coil shape by a wire conductor arranging device (not shown).

  Subsequently, the final wire conductor region 25 is fixed to the heat-resistant PET-G substrate 17 while being guided so as to cross almost the center of the window hole 21 by a wire conductor arranging device (not shown). At this time, the copper wire conductor 23 is disposed between the fitting hole 22 for fitting the mold resin portion, the window hole 20 corresponding to the position of the bonding pad 18, and the window hole 21 corresponding to the bonding pad position 19. It is possible to prevent the copper wire conductors 23 from overlapping and use a wire conductor without an insulation coating. Furthermore, since the wire conductors do not overlap, the non-contact IC sheet 100 which is thin and excellent in planar smoothness can be configured.

  Next, on the stage of a non-contact IC sheet forming apparatus (not shown), the IC module 14 is disposed at a position where the fitting hole 16 of 12.5 mm × 13.5 mm, which is slightly larger than the glass epoxy substrate, is 125 mm × 88 mm × thickness. A heat-resistant PET-G substrate 15 having a thickness of 0.1 mm is disposed, and the IC module 14 is mounted in a floating state in the fitting hole 16.

  Making the fitting hole 16 slightly larger than the glass epoxy substrate not only rounds out the dimensional error of the IC module 14 but also prevents the IC module 14 from riding on the heat-resistant PET-G substrate 15. Particularly preferred for improvement. Furthermore, it is particularly preferable that the thickness of the heat-resistant PET-G substrate 15 and the thickness of the glass epoxy substrate be substantially the same for improving the planar smoothness of the IC module portion of the non-contact IC data carrier.

  A fitting hole 22 for fitting the heat-resistant PET-G substrate 17 on which the antenna coil is formed to the mold resin portion is formed on the heat-resistant PET-G substrate 15 on which the IC module 14 is mounted on the stage. Overlapping to fit the part. FIG. 6 is a cross-sectional view for explaining a connection between a part of the wire conductor region 25 and the bonding pad 19 and shows a cross section of the window hole 21 portion.

  The window hole 20 portion has the same configuration as the window hole 21 portion, and the reference numerals of the components of the window hole 21 portion are shown in parentheses in FIG. As shown in FIG. 6, the two-component mixed type cream solder 26 is filled in the window hole 21, and the cream solder 26 is melted by the beam irradiation 36 emitted from the beam irradiation head 27 of the non-contact IC sheet forming apparatus. The window hole 21 is sealed and filled while connecting a part of the conductor region 25 and the bonding pad 19.

  Sealing and filling the window hole 21 is preferable for smoothing the flat surface of the non-contact IC sheet 100, and has an advantage that the window hole portion after the connection can be sealed to reinforce the connection portion between the wire conductor and the bonding pad.

  Next, a 9.7 mm × 9.7 mm fit slightly larger than the outer shape of the mold resin so that the mold resin portion of the IC module 14 fits on the heat-resistant PET-G substrate 17 side on the stage at the position where the IC module 14 is disposed. A fitting hole 38 for fitting the heat-resistant PET-G substrate 34 of 125 mm in length, 88 mm in width, and 0.2 mm in thickness, in which the joint hole 38 is formed, is fitted in the resin sealing portion of the IC module 14. In this way, the core sheet substrate 39 is obtained. At this time, selecting the thickness of the heat-resistant PET-G substrate 34 so as to be approximately equal to the thickness of the IC module 14 and the core sheet substrate 39 is particularly preferable for flattening the non-contact IC sheet 100.

  Next, heat fusion is performed so that the core sheet substrate 39 is sandwiched between a PET-G substrate 32 having a length of 125 mm × width of 88 mm × thickness of 0.15 mm and a PET-G substrate 33 of length 125 mm × width 88 mm × thickness of 0.15 mm. By attaching it, it becomes a non-contact IC sheet 100 for a non-contact data carrier having a booklet shape of 125 mm long × 88 mm wide.

  As one method of manufacturing the non-contact IC sheet 100, four antenna coils are arranged on one heat-resistant PET-G substrate having a length of 310 mm, a width of 210 mm, and a thickness of 0.1 mm, and the configuration shown in FIG. 6 is used. A combined non-contact IC sheet 31 is shown in FIG.

Manufacturing the composite non-contact IC sheet 31 not only increases the production efficiency, but also has an effect of reducing stress on the IC module 14 because the pressure can be applied more uniformly during the heat fusion press.
FIG. 8 shows a cross-sectional structure of the non-contact IC sheet 100 IC module 14 portion. A non-contact IC sheet substrate 31 combined for booklet processing using a booklet processing machine (not shown) is cut into a non-contact IC sheet substrate 30 of length 280 mm × width 91 mm combined as two-sided non-contact IC sheet 100. (See FIG. 7).

  Using a booklet processing machine (not shown), the non-contact IC sheet 30 is combined into a two-sided non-contact IC sheet 30 so as to be sandwiched between one center page 51 and the other center page 52 as shown in FIG. The contact IC data carrier is cut into an ID-3 shape 29 (see FIG. 7) of 125 mm in length and 88 mm in width to form a booklet-shaped non-contact IC data carrier 50.

  As shown in FIG. 9, in the case of a non-contact IC data carrier in which the non-contact IC sheet 30 is arranged on the center page, the center page on which the adhesive material is applied on the front and back of the non-contact IC data carrier as shown in FIG. In order to prevent remarkable thermal deformation due to high temperature when bonding by thermal fusion, it is more desirable to use a substrate having high thermal fusion at low temperature as the PET-G sheet substrates 32 and 33.

  Further, in the case of a non-contact IC data carrier in which the non-contact IC sheet 30 is disposed on the cover sheet side, one surface of the non-contact IC sheet is overlapped with one surface of the cover sheet 55 as shown in FIG. In addition, there is a method in which the body page 57 formed of paper is bonded to the other surface of the cover sheet 55 and the other surface of the non-contact IC sheet, and a PET-G substrate is used to improve the adhesion. Instead of 32 and 33, porous synthetic paper may be used.

  FIG. 12 shows a second embodiment of the present invention. In the second embodiment, an ID-1 shape using an IC chip 62 having bonding pads 63 and 64 of φ100 μm and height of 25 μm on the IC chip itself of 3.5 mm long × 3.5 mm wide × 0.18 mm thick. The non-contact IC card will be described.

  Referring to FIG. 12 in detail, the non-contact IC card of the second embodiment is a non-contact IC card forming device (not shown), and bonding pads 63 and 64 of the IC chip 62 are arranged at the positions where the IC chip 62 is disposed. PI board with a thickness of 25 μm coated with hot melt 81 (see FIG. 15) having a length of 60 mm × width of 90 mm and a thickness of 30 μm in which substantially circular window holes 65 and 66 of φ0.1 mm are formed corresponding to the positions of A copper wire conductor 67 having a diameter of 50 μm is disposed on 61.

  The copper wire conductor 67 is embedded and fixed in the hot melt 81 applied on the PI substrate 61 while the first wire conductor region 68 is guided so as to cross almost the center of the window hole 65 by a wire conductor arranging device (not shown). Further, the copper wire conductor 67 is embedded and fixed in a hot melt 81 applied on the PI substrate 61 in a coil shape by a wire conductor arranging device, thereby forming an antenna coil.

  Subsequently, the last wire conductor region 69 is embedded and fixed in the hot melt 81 applied on the PI substrate 61 while being guided by the wire conductor arranging device so as to cross almost the center of the window hole 66. At this time, the copper wire conductor 67 is disposed between the region 79 corresponding to the position of the IC chip 62, the window hole 65 corresponding to the position of the bonding pad 63, and the window hole 66 corresponding to the position of the bonding pad 64. It is possible to prevent the copper wire conductors 67 from overlapping and to use a wire conductor without an insulation coating. Further, since the wire conductors do not overlap, it is possible to form a thin non-contact IC card having excellent planar smoothness.

  Here, the advantage of using a wire conductor without an insulating coating is that it is less expensive than a conductor coated with an insulating coating.

  Next, on the stage of the non-contact IC card forming apparatus (not shown), the IC chip 62 is disposed at the position where the IC chip 62 is disposed, and has a fitting hole 70 of 3.7 mm × 3.7 mm that is slightly larger than the IC chip 62. A PET-G substrate 71 having a thickness of 0.18 mm is arranged, and the IC chip 62 is mounted in a floating state in the fitting hole 70. Making the fitting hole 70 slightly larger than the IC chip 62 not only rounds the dimensional error of the IC chip 62, but also prevents the IC chip 62 from riding on the PET-G substrate 71, thereby improving the planar smoothness. Is particularly preferred.

  Furthermore, selecting the thickness of the PET-G substrate 71 so as to be substantially equal to the thickness of the IC chip 62 is particularly preferable for smoothing the flat surface of the non-contact IC card. Window holes 65 and 66 for fitting the PI substrate 61 on which the antenna coil is formed to the positions of the bonding pads 63 and 64 on the PET-G substrate 71 on which the IC chip 62 is mounted on the stage are the bonding pads of the IC chip 62. Superimpose to fit 63, 64.

  13 is a cross-sectional view of the cross section of the DD ′ portion shown in FIG. 12 as viewed in the direction of the arrow, and is a cross-sectional view for explaining a connection between a part of the wire conductor region 69 and the bonding pad 64. The cross section of the window hole 66 part is shown. Since the configuration of the window hole 65 is the same as the configuration of the window hole 66, the reference numerals of the components of the window hole 65 are shown in parentheses in FIG. As shown in FIG. 13, the bonding pad 64 is connected to a part of the last wire conductor region 69 using the ultrasonic connection head 80.

  Next, a PET-G substrate 73 (see FIG. 15) 60 mm long × 90 mm wide × thickness 0.21 mm is superimposed on the PET-G substrate 71 side on the stage, and further 60 mm long × 90 mm wide on the PI substrate 61 side. X After a PET-G substrate 72 having a thickness of 0.175 mm is overlaid, it is integrated by heat fusion to form a core sheet substrate 74. At this time, selecting the thickness of the PET-G substrates 72 and 73 so that the IC chip 62 is substantially in the center of the core sheet substrate 74 eliminates the warp of the non-contact IC card and further causes physical stress on the IC chip 62. It is particularly effective in improving the strength against

  Next, the core sheet substrate 74 shown in FIG. 12 is sandwiched between a stretched PET substrate 75 having a length of 60 mm × width of 90 mm × thickness of 0.15 mm and a stretched PET substrate 76 of length 60 mm × width 90 mm × thickness of 0.15 mm. The ID-1 shape non-contact IC card is formed by bonding and bonding to an ID-1 shape 77 using a cutting machine (not shown).

As one of the methods for manufacturing an ID-1 shaped non-contact IC card, six antenna coils are arranged on a 25 μm thick PI substrate coated with a hot melt of 200 μm long × 200 mm wide and 30 μm thick, FIG. 14 shows a non-contact IC sheet 78 that is combined using the configuration shown in FIG.
Manufacturing the composite non-contact IC sheet 78 not only increases the production efficiency, but also has an effect of reducing stress on the IC chip 62 because the pressure can be applied more uniformly during the heat fusion press.

  FIG. 15 shows a cross-sectional structure of the IC chip 62 portion of the non-contact IC card. The composite non-contact IC sheet substrate 78 shown in FIG. 14 is cut into an ID-1 shape 77 non-contact IC card using a cutting machine (not shown). At this time, the non-contact IC card of ID-1 shape 77 may be embedded with a magnetic tape. Moreover, the printing process may be given. Further, at this time, a contact module is embedded, and a hybrid card having both non-contact and contact functions may be used.

1, 17, 33, 61 Substrate 1a, 1b Plate surface 2, 20, 65 First window hole 3, 21, 66 Second window hole 4, 23, 67 Wire conductor 5, 24, 68 One end (First wire conductor area)
6, 25, 69 The other end (last wire conductor region)
7 Chip units 8, 18, 63 First bonding pads 9, 19, 64 Second bonding pad 10 Opening 26 Sealing material (cream solder)
30... Non-contact IC sheet substrate 31, 78, 100... Non-contact IC sheet 50 Booklet provided with non-contact IC sheet

Claims (6)

A non-contact IC sheet having a chip unit and a wire conductor constituting an antenna coil,
The wire conductor is disposed on one plate surface of the substrate,
A first bonding pad and a second bonding pad provided on both sides of the IC chip with an IC chip provided in the chip unit interposed therebetween are disposed on the other plate surface side of the substrate,
A first window hole and a second window hole are formed in the substrate;
The first bonding pad and the second bonding pad are respectively disposed in the first window hole and the second window hole portion;
The wire conductor and the bonding pad are connected in the first window hole and the second window hole,
The non-contact IC sheet, wherein the substrate is a thermoplastic material, and the first window hole and the second window hole are softened or melted to be sealed. The non-contact IC sheet according to claim 1,
The non-contact dimension of the window hole is a dimension that regulates the movement of the wire conductor in the width direction in a state where the wire conductor is positioned in the window hole. IC sheet. In the non-contact IC sheet according to claim 1 or 2,
A side surface from the one plate surface of the window hole toward the other plate surface is an inclined surface,
A non-contact IC sheet, wherein the wire conductor is disposed along the inclined surface. In the non-contact IC sheet according to any one of claims 1 to 3,
The substrate, the non-contact IC sheet you characterized in that it consists of an adhesive layer for fixing the wire conductor and an electrically insulating material.   The non-contact IC card provided with the non-contact IC sheet in any one of Claims 1-4.   The booklet provided with the non-contact IC sheet in any one of Claims 1-5.

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