JP3611793B2 - IC card manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a non-contact type IC card that exchanges information signals wirelessly.
[0002]
[Prior art]
In recent years, IC cards having a security function, a personal authentication function, and the like are widely used as contactless IC cards that transmit and receive information between terminal devices by electromagnetic induction.
[0003]
Conventionally, as this type of IC card, for example, Japanese Patent No. 2810547 discloses one in which a wire constituting an antenna is joined or embedded on the surface of a substrate by ultrasonic vibration or the like.
[0004]
[Problems to be solved by the invention]
However, in such a conventional IC card, when a retrofitted capacitor is provided on the substrate, there are problems that the number of parts and man-hours increase and the thickness of the IC card increases.
[0005]
The present invention has been made in view of the above problems, and an object thereof is to provide a method of manufacturing an IC card that does not require a retrofitted capacitor.
[0006]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a noncontact IC card comprising: a substrate; an IC chip provided on the substrate; an IC terminal provided on the IC chip; and a conductor connected to the IC terminal and fused onto the substrate. In a method of manufacturing an IC card comprising an antenna configured and a capacitor configured by a conductive wire connected to an IC terminal and extending substantially in parallel on the substrate, the capacitor by a conductive wire extending substantially in parallel on the antenna substrate; Forming a positioning portion that is fused to the substrate across the IC terminal, and then welding the conducting wire to the IC terminal by a fusing head after the conductor is fused to the substrate across the IC terminal. To do.
[0014]
Operation and effect of the invention
According to the first invention, the IC chip constitutes a transmission / reception circuit via the antenna and the capacitor, and transmits and receives information signals by induction using an electromagnetic wave as a medium.
[0015]
Since the capacitor is constituted by a conductive wire provided on the substrate, it is not necessary to provide a retrofitted capacitor on the substrate, and the thickness of the IC card does not need to be increased.
[0020]
And since a conducting wire is welded to an IC terminal after fixing a conducting wire across an IC terminal, each terminal part does not come off from each IC terminal at the time of welding, and both are electrically connected reliably.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
[0022]
As shown in FIG. 1, an IC card 1 includes a substrate 2 formed in a substantially rectangular shape, an IC chip 3 disposed on the substrate 2, an antenna 4 electrically connected to the IC chip 3, and a substrate 2. And an exterior film (not shown) attached on top.
[0023]
The IC chip 3 is arranged at a predetermined position on the substrate 2 by a robot hand or the like, and is fixed to the substrate 2 by an adhesive bonded on the substrate 2.
[0024]
The IC chip 3 has a pair of IC terminals 5 and 6 to which an antenna 4 is connected. A transmission / reception circuit, a power supply circuit, and the like that exchange information signals by electromagnetic induction with an electromagnetic wave as a medium with a terminal device via the antenna 4. An arithmetic processing circuit, a memory circuit, and the like are provided.
[0025]
The antenna 4 is constituted by a conductive wire 10 provided on the substrate 2, an antenna coil portion 10 c arranged in a substantially rectangular coil shape, terminal portions 10 a and 10 b connected to the IC terminals 5 and 6 of the IC chip 3, Positioning portions 10d, 10e, 10f, and 10g that are fixed to the substrate 2 across the IC terminals 5 and 6 are provided. The IC chip 3 is disposed inside the antenna 4, and a portion 10h connecting one end of the antenna coil portion 10c of the antenna 4 and the positioning portion 10f straddles the antenna coil portion 10c.
[0026]
And although it is the place made into the summary of this invention, the capacitor | condenser 7 is comprised with the conducting wire 10 provided on the board | substrate 2. FIG. The capacitor 7 constitutes a transmission / reception circuit together with the IC chip 3 and the antenna 4.
[0027]
The capacitor 7 includes an antenna coil portion 10c and a capacitor constituting portion 10j extending substantially in parallel along the antenna coil portion 10c. The capacitor-forming portion 10j is connected to the IC terminal 6 via the positioning portion 10 g and the extension portion 10i. That is, the antenna 4 and the capacitor 7 are formed by a single continuous wire 10.
[0028]
The length of the capacitor component 10j and the interval with respect to the antenna coil unit 10c are arbitrarily set so as to have the capacitance required for the capacitor 7.
[0029]
As shown in FIG. 2, the conductive wire 10 has one conductor 11 and a self-bonding layer 13 that covers the conductor 11. The self-bonding layer 13 is formed of a thermoplastic resin and melts by heat.
[0030]
The cross section of the conductor 11 is circular. However, the present invention is not limited to this, and the cross section of the conductor 11 may be rectangular to increase the capacitance.
[0031]
The substrate 2 has a thin plate-like card body 15 made of various resins or paper, and a fusion layer 16 formed by coating the surface of the card body 15 with a thermoplastic resin.
[0032]
FIG. 3 shows a device 20 for assembling the antenna 4 to the substrate 2. The apparatus 20 includes a melting head 21 that feeds the conductive wire 10 and ultrasonically vibrates, a cutter 22 that cuts the conductive wire 10, a fusing head 23 that welds the conductive wire 10 to the IC terminals 5 and 6, and these are tertiary on the substrate 2. A drive mechanism (not shown) that moves in the original direction is provided.
[0033]
The melting head 21 moves while ultrasonically oscillating by pressing the conductive wire 10 onto the substrate 2. As a result, the self-bonding layer 13 of the conductive wire 10 and the fusion layer 16 of the substrate 2 are melted, and the melting head 21 embeds and fixes the conductive wire 10 on the substrate 2 along the locus.
[0034]
The fusing head 23 heats the terminal portions 10a and 10b of the conducting wire 10 while pressing them against the IC terminals 5 and 6, respectively. As a result, the self-bonding layer 13 of the conductive wire 10 is broken, and the conductors 11 are welded to the IC terminals 5 and 6 so that the electrical connection between them is reliably performed.
[0035]
The apparatus 20 forms the antenna 4 and the capacitor 7 in the following procedure.
(1) The conducting wire 10 coming out of the melting head 21 is pressed against the substrate 2 to form a positioning portion 10 d embedded in the substrate 2 in the vicinity of the IC terminal 5.
(2) Subsequently, the melting head 21 is passed over the IC terminal 5 of the IC chip 3.
(3) Subsequently, the melting head 21 is moved while pressing the conductive wire 10 against the substrate 2 to form a positioning portion 10 e embedded in the substrate 2 in the vicinity of the IC terminal 5.
(4) Subsequently, the melt head 21 is rotated while pressing the lead wire 10 against the substrate 2 to form the antenna coil portion 10c embedded in the substrate 2 along the trajectory.
(5) Subsequently, the melting head 21 is passed over the antenna coil portion 10c.
(6) Subsequently, the melting head 21 is moved while pressing the conductive wire 10 against the substrate 2 to form the positioning portion 10 f embedded in the substrate 2 in the vicinity of the IC terminal 6.
(7) Subsequently, the melting head 21 is passed over the IC terminal 6 of the IC chip 3.
(8) Subsequently, the melting head 21 is moved while pressing the conductive wire 10 against the substrate 2 to form the positioning portion 10 g embedded in the substrate 2 in the vicinity of the IC terminal 6.
(9) Subsequently, the melting head 21 is moved while pressing the conductive wire 10 against the substrate 2 to form the capacitor constituting portion 10j embedded in the substrate 2 along the antenna coil portion 10c.
(10) Subsequently, in a state where the conducting wire 10 is pressed against the substrate 2 by the melting head 21, the conducting wire 10 is cut by the cutter 22, and the winding of the antenna 4 is completed.
(11) Next, the fusing head 23 heats and welds the terminal portions 10a and 10b of the conducting wire 10 against the IC terminals 5 and 6 while pressing them.
[0036]
Next, the operation of the embodiment of the present invention configured as described above will be described.
[0037]
The IC chip 3 constitutes a transmission / reception circuit via an antenna 4 and a capacitor 7 and exchanges information signals by electromagnetic induction using electromagnetic waves as a medium.
[0038]
Since the capacitor 7 is constituted by the conductive wire 10 provided on the substrate 2, it is not necessary to provide a retrofitted capacitor on the substrate 2, and the thickness of the IC card 2 does not need to be increased.
[0039]
Since the capacitor 7 uses the conducting wire 10 constituting the antenna 4, an increase in the number of parts and man-hours can be suppressed. Further, the part of the antenna coil part 10c that faces the capacitor component part 10j has both the function of the antenna 4 and the function of the capacitor 7, thereby reducing the amount of the conductive wire 10 and effectively using the limited space on the substrate 2. it can.
[0040]
By changing the length of the capacitor component 10j of the capacitor 7, the capacitance can be easily adjusted.
[0041]
Since the antenna 4 and the capacitor 7 have a structure in which the self-bonding layer 13 of the conductive wire 10 and the bonding layer 16 of the substrate 2 are fused to each other by heat generated by ultrasonic vibration, the antenna 4 and the capacitor 7 are bonded to the substrate 2. Can be securely fixed against. Further, the degree of freedom with respect to the shapes of the antenna 4 and the capacitor 7 is increased, and the antenna 4, the capacitor 7, and the IC chip 3 can be accommodated in a limited space on the substrate 2.
[0042]
The terminal portions 10a and 10b made of the conductive wire 10 are heated by the fusing head 23, so that the self-bonding layer 13 is broken and the electrical connection between the conductors 11 and the IC terminals 5 and 6 is reliably performed. .
[0043]
By fixing the lead wire 10 to the IC terminal 5 and 6 after fixing the lead wire 10 across the IC terminals 5 and 6, the terminal portions 10 a are formed from above the IC terminals 5 and 6 when being welded by the fusing head 23. , 10b does not come off and the electrical connection between the two is ensured.
[0044]
Further, by successively welding the terminal portions 10a and 10b through one fusing head 23, the tact time for forming the antenna 4 is shortened, and the cost of the IC card 1 is reduced.
[0045]
As another embodiment, only one of the self-bonding layer 13 of the conducting wire 10 and the fusion layer 16 of the substrate 2 may be provided to fuse the conducting wire 10 and the substrate 2.
[0046]
As another embodiment, as shown in FIG. 4, a capacitor 7 may be configured by providing capacitor components 10 m and 10 n extending from the IC terminals 5 and 6.
[0047]
As a reference example, as shown in FIG. 5, a bellows-like bent part 10p extending from the IC terminal 6 may be provided to have a capacitor function and a coil function.
[0048]
As a reference example, as shown in FIG. 6, a bellows-like bent portion 10q may be provided in the middle of an antenna coil portion 10c constituting the antenna 4, and this may have a capacitor function and a coil function.
[0049]
The present invention is not limited to the above-described embodiment, and it is obvious that various modifications can be made within the scope of the technical idea.
[Brief description of the drawings]
FIG. 1 is a plan view of an IC card showing an embodiment of the present invention.
FIG. 2 is a cross-sectional view of a conducting wire and a substrate.
FIG. 3 is a configuration diagram of an assembling apparatus.
FIG. 4 is a plan view of an IC card showing another embodiment.
FIG. 5 is a plan view of an IC card showing a reference example .
FIG. 6 is a plan view of an IC card showing a reference example .
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 IC card 2 Board | substrate 3 IC chip 4 Antenna 5, 6 IC terminal 7 Capacitor 10 Conductor 10a, 10b Terminal part 10c Antenna coil part 10d-10g Positioning part 10j Capacitor structure part 11 Conductor 13 Self-fusion layer 16 Fusion layer

Claims (1)

A substrate,
An IC chip provided on the substrate;
An IC terminal provided on the IC chip;
An antenna constituted by a conductive wire connected to the IC terminal and fused on the substrate;
A capacitor connected to the IC terminal;
In an IC card manufacturing method comprising:
The capacitor by a conductive wire extending substantially in parallel on the antenna substrate;
Forming a positioning part that fuses the lead wire to the substrate across the IC terminal;
A method of manufacturing an IC card, comprising: fusing a conductive wire to the substrate across the IC terminal and then welding the conductive wire to the IC terminal by a fusing head.

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