HUT76992A - Method of making radio frequency identification tags - Google Patents

Abstract

A radio frequency tag and its antenna structure are manufactured using wire bonding. A semiconductor chip is placed and attached upon an organic film substrate. The antenna consisting of one or more thin wires is created on the substrate and connected to contacts on the chip using a wire bonding machine. Alternate embodiments using a plurality of semiconductors on a strip of substrate are also disclosed. The chip may be protected with encapsulant and the chip and antenna combination may be sealed between layers of organic film.

Description

COPIES ^

A method for producing a radio frequency identification tag using wire binding technology. A semiconductor chip is placed and fixed on an organic film carrier. The antenna consists of one or more thin wires, which are formed on a substrate and connected to the connections on the semiconductor chip using a wire binding machine. Alternative embodiments utilize multiple semiconductor chips on a single carrier tape. Semiconductor chips can be protected by a wrapping material and the semiconductor chip antenna combination can be encapsulated between organic film layers.

• · · ρ9701699

Method for Generating a Radio Frequency Identification Tag

DISCLOSURE

COPIES

BACKGROUND OF THE INVENTION The present invention relates to radio frequency (RF) tagging, more particularly to a method for producing a small, cheap radio frequency tag that transmits a tag information bit sequence.

Electronic circuits are usually built on printed circuit boards or flexible media. Printed circuit boards may be made of epoxy resin or epoxy glass, where one of the generic classes for such boards is commonly known as class FR4. Alternatively, flexible substrates which include copper structures on a polyamide are used. These circuits are used primarily in automotive, consumer electronics, and generally for connecting.

Semiconductor circuits are commonly known as chips, according to well-known technology known as "chips". wirebonding to a printed circuit board or a flexible substrate. These wires consist of very thin wires of 25 gm diameter and very short wires. The length of each wire used for wire joints is generally of the order of 1 mm and this length is justified by several reasons listed below:

1) The small wire diameter strongly weakens the wire.

2) Generally, a circuit element must be wired with many wires, and longer wires would increase the risk of electrical short circuit.

3) Increasing the length of the wires increases both the self-induction and mutual induction of the wires, which reduces the electrical power of the circuit.

Radio Frequency Identification (RFID) is just one of many known technologies for identifying objects. The heart of the radio frequency identification system is an information carrier tag that operates in response to an encoded radio frequency signal received from a base station. The tag reflects the incoming radio frequency carrier signal, and more accurately sends it back to the base station. The • · ·

-2 information is transmitted such that the tag modulates the reflected signal according to a pre-programmed information protocol.

The tag consists of a semiconductor chip containing radio frequency circuitry, logic, and memory. The attachment also includes an antenna, often with separate parts, capacities, diodes, active attachments, a battery, a carrier for the parts, joints between the parts, and a cover that provides some physical protection. Another group of tags, namely passive tags, do not have a battery, but derive their energy from the radio frequency signal used to query them. Radio frequency identification tags are usually manufactured by mounting individual elements on a printed circuit board. This is accomplished either by short wire joints or by solder joints between the board and the circuit elements. The printed circuit board may be either ceramic or epoxy glass fiber. The antenna is usually made up of wire loops soldered to the circuit board, or a metal pattern etched or applied to the printed circuit board. The whole assembly is encased in a plastic housing or molded into a three-dimensional plastic block.

Although RFID technology is not as widespread as other identification technologies, such as the bar code system, it can be expected to spread rapidly in some significant areas, primarily for identifying moving objects and vehicles.

The lack of infrastructure for the production of tags, the relatively high cost of tags, the bulk of most tags, sensitivity and range issues, and the need to read many tags at the same time, have hampered the spread of RFID. According to our current knowledge, the tag will cost approximately 900-1800 HUF. The manufacturing companies focused primarily on goal-oriented applications during production. Some known solutions are used to identify railcars, and are now beginning to be used in RFID tags in automated tolling industries, such as toll roads, bridges, and the like. Radio frequency tags are currently being tested in the role of contactless tickets, which could be used massively in public transport. Also • ·

-3directory frequency identification tags are used as employee identification and access badges and security badges. Radio frequency identification systems are also commercially available, such as those used for animal identification or for tracking products on the production line.

One of the not-insignificant limitations of manufacturing RFID tags from printed circuit boards or flexible substrates is that they must first produce a flexible substrate or printed circuit board. For very large volumes of attachments, such as over a hundred million pieces of attachments, new factories must first be built to meet the needs of the printed circuit board or carrier manufacturers of the attachments. In addition, radio frequency tags produced by this technology prove too expensive for many applications. For example, a barcode identification system is a technology that can be implemented and deployed at a much lower cost than existing and known RFID tagging technology.

WO 93/18493 discloses a method for producing a radio frequency detection or identification tag that achieves a relatively long detection distance using as few components as possible. This means that a ferromagnetic antenna coil and an integrated circuit chip may be required. The antenna coil consists of insulated wire threads that are directly connected to the insert without a carrier or conductor frame.

It is therefore our intention to provide a radio frequency identification system with significantly better capabilities and properties than the present one, more specifically an identification tag. Within this, we aim to provide an improved, inexpensive radio frequency identification tag that can be manufactured from ordinary mass-produced materials. It is also our object to provide an improved RFID tag that can be manufactured economically and in very large quantities.

SUMMARY OF THE INVENTION The present invention is a novel radio frequency tag which contains a semiconductor circuit comprising logic, memory, and radio frequency circuits. The semiconductor circuitry is mounted on a carrier and is capable of receiving radio frequency signals through an antenna connected to the main circuit by means of its dedicated connections.

SUMMARY OF THE INVENTION An object of the present invention is to provide a radio frequency identification tag comprising attaching a semiconductor chip to an organic carrier according to the present invention, comprising a first and a second connection, memory and a logic step for modulating a radio frequency signal attaching its end to a first length of the semiconductor chip by means of a wire binding device, winding the first wire to a first length with the wire binding machine, attaching the first wire to the organic substrate, cutting the first end of the first wire at a first length, and securing it using a wire binding machine, winding the second wire to a second length with the wire binding machine, the second wire to the organic substrate and the second wire is cut off at a second length and forms with the first wire and the second wire an antenna for receiving a signal having a specific frequency, where the signal is modulated by the logic stage of the semiconductor chip and radiated by the antenna.

In a preferred embodiment of the method according to the invention, the first and second lengths of the first and second wires are equal to a quarter wavelength of the specified frequency.

According to a further preferred embodiment of the process according to the invention, the semiconductor chip and the first and second connections are coated with a encapsulating material using any encapsulating material comprising epoxy, silicone or polymeric material.

It is also advantageous according to the invention to attach the semiconductor chip to the substrate using adhesive, whereby the adhesive can be any adhesive comprising acrylic, silicone and urethanes.

It is also advantageous according to the invention to attach the semiconductor chip to the substrate by heating the substrate or by heating the semiconductor chip and the wires with a wire fixing adhesive ··· ·

-5 either attached to the substrate by heating the substrate or by heating the wires, wherein the wire fixing adhesive may be any adhesive comprising epoxy, silicone and phenolic butyric acid.

It is also preferred that the substrate, the semiconductor chip and the first and second wire polyesters and polyethylene are covered with a single layer organic topcoat made of organic film and bonded to the substrate, the semiconductor chip and the first and second wires by heating.

In addition, it is advantageous for the organic topsheet to have an outer layer and an inner layer, wherein the outer layer is an organic film and the inner layer is a cover adhesive and the latter is pressure sensitive topsheet and the organic topsheet is heated and pressurized to the substrate, attached to semiconductor chips and wires, and the topcoat adhesive is a copolymer containing ethyl vinyl acetate or an acrylic, silicone and urethane adhesive.

It is also preferred according to the invention to cover the top of the support with an attached organic top cover and to cover the bottom of the support with an attached lower cover.

The present invention further provides a method for producing a radio frequency tag comprising attaching a semiconductor chip to an organic carrier in accordance with the present invention, comprising a first and a second connection of a semiconductor chip, memory and a logic step for modulating a radio frequency signal securing the end to a first connection of a semiconductor chip with a wire binding device, winding the first wire to a first length with the wire binding machine, securing the first wire to the organic substrate, cutting off the first end of the first wire at a first length and then securing the second using a wire wrapping machine, the second wire is wound with the wire wrapping machine to a second length, the other cut end of the second wire being is attached to the second connection point on the support, and the second wire is cut off at the second length, and the antenna receives a signal having a specific frequency with the first wire and the second wire.

-6, wherein the signal is modulated by the logic degree of the semiconductor chip and the modulated signal is radiated by the antenna.

In addition, the present invention is based on a method for producing a radio frequency tag comprising attaching at least three semiconductor chips to an organic carrier tape according to the present invention, wherein each of the semiconductor chips has first and second terminals, memory, and log frequency modulated RF signals. securing the first end of a first wire to a first connection on a first semiconductor chip with a wire binding machine, releasing the first wire to a first length with the wire binding machine, and securing the first cut end of the first wire to a first connection on a second terminal on a second semiconductor chip; cut and then secure the second end of a second wire to the second connection of the first semiconductor chip with a wire binding machine and winding the second wire to a second length with the wire wrapping machine, and securing the other cut end of the second wire to a first connection on a third semiconductor chip, and cutting the second wire at the second cut end at the second length and the first wire at the first semiconductor cutting between the second semiconductor chip and the second wire between the first semiconductor chip and the third semiconductor chip, wherein the first and second wires form an antenna receiving a signal at a specific frequency, and the signal is modulated by the logic stage of the semiconductor chip and radiate through.

The present invention further provides a method for making a radio frequency tag, the first and second terminals of a wire being attached to an organic substrate according to the present invention by attaching a first semiconductor chip to an organic substrate comprising a first and a second connection, memory and a logic stage modulating a frequency. securing with a wire binding machine, winding the first wire through one or more wire guides with a wire binding machine, securing the cut end of the wire to a second connection in the semiconductor, and terminating the wire at the second connection in receiving a folded dipole antenna and modulating the signal with the logic stage of the semiconductor chip and modulating the signal with the ant we radiate it with food.

• ΊΑ. According to a preferred embodiment of the method according to the invention, the semiconductor chip has two and more pairs of first and second connections, and the steps from attaching the semiconductor chip to the carrier to cutting the wire are repeated for each pair of connections to create more than one folded dipole antenna.

In another preferred embodiment of the method of the invention, the wire guide pin is a guide pin protruding from the substrate, or a guide pin temporarily engaged with the substrate or raised in the substrate by an air stream or mechanical pin to secure the wire guided down the wire.

In addition, the present invention is based on a method for producing a plurality of radio frequency tags in which at least four semiconductor chips according to the present invention are arrayed on an organic carrier tape, each of the semiconductor chips having first, second, third and fourth connections, memory and comprising a logic stage modulating the RF signal, securing the first end of a first wire to a first connection of a first semiconductor chip with a wire binding machine, lowering the first wire to a first length with the wire binding machine, securing the first cut end of the first wire to the second connection of a second semiconductor chip cutting at the first distance to the first cut end, securing the second end of a second wire to the second connection of the first semiconductor chip the second wire is lowered to a second length by the wire wrapping machine, and the second cut end of the second wire is secured to the first connection on a third semiconductor chip by the wire wrapping machine, and the second wire is cut at a second distance at the second cut end, securing the third end to the third connection of the first chip with the wire-binding machine and lowering the third wire with the wire-binding machine to a third length and securing the third cut end of the third wire to the fourth connection of a fourth semiconductor chip using the wire-binding machine; cut at the cut end at a third length, and then fix the fourth end of a fourth wire to the fourth connection of the first semiconductor chip using a wire rope machine, the fourth wire to the wire rope machine using the fourth length is unwound, the fourth wire fourth cut end of the carrier connector. ···. ......

• .......... ·;

-8, and cutting the fourth wire at the fourth cut end of the fourth length and cutting the first wire between the first and second semiconductor chips, the second wire between the first and third semiconductor chips, and the third wire at the first and fourth cutting between semiconductor chips, the first, second, third and fourth wires forming two antennas (1020, 1030) for receiving signals at a specified frequency, modulating the signals with the logic stage of the semiconductor chip and transmitting the modulated signals with the antenna.

A preferred embodiment of the method according to the invention is that the connecting connection on the substrate is a connection on a fifth semiconductor chip and the fourth wire is cut between the first and fifth semiconductor chips.

Finally, it is preferred that both antennas consist of two wires of the same length.

The invention will now be described in more detail with reference to the accompanying drawing, which illustrates an exemplary embodiment of a method for producing a radio frequency identification tag and some exemplary embodiments of the tag produced by it. In the drawing it is

Figure 1 illustrates the steps of a possible embodiment of the process of the invention by means of a flowchart, a

2A-2K. Figures 1A and 2 illustrate the various stages of manufacture of the radio frequency tag created by the method described in Figure 1 and the various stages of completion of the tag;

3A-3E. Figures

4A-4B. FIGS. 6A to 5B illustrate possible embodiments of the various steps of the method, a top plan view and an embodiment of a radio frequency tag. A side view of the antenna wires with a metal connector at the end

A and 5B. Figure 5B illustrates radio frequency tags formed as continuous strips in single and in Figure 5B. Figure 2 is a multiple embodiment,

·· · ·

-9, which can be formed by transverse cut-off into individual RFID tags,

Figure 6 is a side view of a manufactured tag strip to be cut into individual RFID tag segments with a knife blade row,

Figure 7 illustrates a pin used for manufacturing a loop antenna, around which the antenna is guided in a loop shape,

Fig. 8 shows a pin inserted into the carrier and also for guiding the loop antenna;

Fig. 9 shows a tab bent out of the carrier material under which the wire forming the antenna can be clamped and

Fig. 10 shows a sandwich structure of a radio frequency extension with two loop antennas laminated between organic enclosures.

Figure 1 illustrates the steps of an embodiment of the preferred method of the present invention which includes preparation of the semiconductor chip 205, wire bonding and enclosure.

In step 110, a semiconductor chip is placed on and attached to the organic substrate 210 (see also FIG. 2). In a preferred embodiment, the semiconductor chip 205 is a radio frequency semiconductor chip 205. Similar structures are known from U.S. Patent Application Serial No. 08 / 303,976, filed September 9, 1994, entitled Radio Identification Tag, the entire contents of which are hereby incorporated by reference.

The semiconductor chip 205 (Fig. 2A) is applied to the substrate 210 by a component insertion device 202. Equipment 202 is a well-known and widely used equipment in the semiconductor manufacturing industry and does not require any further description. The semiconductor chip 205 can be attached to the substrate 210 by various preferred methods. In particular, the semiconductor chip 205 may be glued to the substrate 210. Recommended adhesives for this purpose are:

-10 pressure sensitive adhesives such as acrylics, silicones, urethanes, and the like. The adhesive is applied to the substrate 210 by an adhesive dispensing machine. Alternatively, an epoxy drop may be introduced between the semiconductor chip 205 and the substrate 210. According to another preferred method of attaching the semiconductor pin 205 to the substrate 210, the substrate 210 may be heated by a target means, such as a heating block 212. The heating rod 212 may be directly contacted with the bottom of the substrate 210 located on the other side of the substrate 210 where the semiconductor chip 205 is to be mounted. Thus, during heating of the substrate 210, it partially flows and becomes sticky so that semiconductor chip 205 can be easily fixed in the flow region. In another equally preferred embodiment, the semiconductor chip 205 itself is heated. This may also be accomplished by placing the semiconductor chip 205 on the substrate 210 and then heating the semiconductor chip 205 locally, causing the substrate 210 to flow or melt under the semiconductor chip 205 and adhere to the semiconductor chip 205. The heating of the semiconductor chip 205 may be effected, for example, by a laser device 206 or by other known means. The adhesive for attaching the semiconductor chip 205 may also be formed as a layer 211 formed on the substrate 210. Other joining methods used in the art for this purpose may also be used to join the two elements together.

The semiconductor pin 200 has at least two electrical connections 207, 208 which are used to establish a connection to a radio frequency antenna. The antenna is attached to the electrical terminals 207, 208 and is fabricated in a novel way by wire bonding (see Figure 2B). In a preferred antenna configuration, a first antenna connection is secured to the first connection 207 in step 120 using a wire binding tool. The tools used in this operation are suitable for performing ultrasonic joints, ball joints, laser joints, thermocompression joints, solder joints, or a combination thereof.

In step 130, the wires 131, 132 used as the antenna are shown in FIG. 4a, after the first connection has been made. In this step, more wires 131, 132 are unwound or straightened than in the prior art because the unwound wire 131, 132 itself is used as part of the extension antenna according to the invention. The length of the unwound wire 131, 132 is determined by the frequency of the resonant antenna.

·· '. S · Σ ”. ·’ ·· *.

· '·' * - '· «· -» · «. < _er *. * ·

11 In step 130, the wire 131, 132 still has to be wound in a controlled manner by the movement and speed of the head of the wire binding tool so that the unwound wire 131, 132 is not stretched too far. This is a common practice in the field of wire bonding, that is to say, 1-3 mm of coiled wire 131, 132, but in the present invention, this control requires that it be performed over longer distances. In addition, in some cases, the head may need to be retarded relative to the wire feed 131, 132 so that a curve or loop can be formed during the design of the antenna component. This solution is suitable for antennas with a length of 10-1000 mm.

In step 140, the other end of the first wire 131, 132 is cut off and the cut end of the wire 131, 132 is left unattached. Cutting can be accomplished by any known method, including 213 blades, blade cutting, mechanical tearing, mechanical cutting, laser cutting, and the like. In Steps 150, 160 and 170 of Figure 1, the second wire 131, 132 repeats steps 120, 130 and 140 previously described.

The cut ends of the wires 131, 132 can be held or secured in various ways at desired locations (steps 130 and 160). For example, the cut end of the wire 131, 132 may be secured to the substrate 210 by a small adhesive drop 169 attached thereto (see also Figures 2D and 2G). The adhesive drop 169 is dispensed with 168 nozzles. The other end of the wire 131, 132 may also be secured by heating the substrate 210 itself locally at the point where the end of the wire 131, 132 simply sticks to the substrate 210 material. Local heating of substrate 210 is a well-known technique and can only be accomplished with a heating tool or focused laser beam 236 in a small, defined area. Adhesives used for gluing are also known, including various epoxy materials, silicones and phenolic butyric acid. It is noted that the wires 131, 132 can be fastened in steps 130 and 160 before or after steps 140 and 170. If the end of the wire 131, 132 is fixed after being cut off, the cut end of the wire 131, 132 can be temporarily pressed onto the substrate 210 before being attached thereto.

• ·

According to a further method of fixing the cut end of the wire 12Α 131, 132 on the substrate 210, the wire 131, 132 may be heated so that the cut end becomes hot so that it melts on contact with the substrate 210. Wire 131, 132 may be heated at position 231 by inductive heating 237, but may be heated by resistance heating 235, laser heating 236, or any other suitable means. Alternatively, a portion of the substrate 210 below the wire 131, 132 may be heated so that some or all of the wire 131, 132 is thereby embedded in the substrate 210. This effect can also be achieved by heating the wire 131, 132 itself and pushing the heated wire 131, 132 into the substrate 210, partially or completely, by applying pressure 246. This is illustrated in FIG. It can also be achieved by heating the substrate 210 from below with a heating block 212 such that the wire 131, 132 adheres to the softened portion of the substrate 210. In addition, of course, the pressure relief device 246 may be heated, for example by heating the resistor 235, so that the wire 131, 132 is simultaneously subjected to pressure and heat and is thereby embedded in the substrate 210.

Note that in carrying out the above steps, more than one wire 131 or 132 may be attached to a single connection 208 or 207, unwound, attached to the substrate 210, and the excess portion may be trimmed. In this case, the different wires 131, 132 extend on the substrate 210 in different directions relative to one another.

In step 180 of Figure 1, the semiconductor chip 205 is provided with a protective housing as shown in Figure 2H. The dispensing nozzle 281 applies a drop of encapsulant 282 to the surface of the semiconductor chip 205, thereby forming a protective coating 283. The encapsulating material 282 may be an epoxy material, silicone material or other polymeric material. In a preferred embodiment, the encapsulant 282 is translucent, thereby protecting the photosensitive circuit portions of the semiconductor chip 205.

In step 190, the finished semiconductor chip and antenna structure 205 is encapsulated between an organic (lower) housing 293 and an (upper) housing 294 (Fig. 21) using a roller laminator which passes the sandwich assembly between heated rollers 295 and 296. The organic lid 293, 294 is a single layer of polyester, polyethylene or other thermoplastic organic film. In a preferred embodiment, the film may consist of two layers, namely an inner layer 297 made of copolymer ethyl vinyl acetate and an outer layer 298 made of polyester. In an alternative embodiment, only a single layer, such as an upper cover 294, is provided.

Figure 3 illustrates the positioning (Fig. 3A), binding (Figures 3B and 3C, unwinding (Fig. 3D) and cutting (Fig. 3E) of wire 331. In Fig. 3A, wire 331 is a semiconductor chip 305. 307, which is bonded to substrate 210. In Figure 3B, wire 331 is bonded to connection 307 using ultrasonic energy 334. In Figure 3C, bond 333 is completed and retractor 332 is withdrawn from the surface, as shown in Figure 3D. Wire 331 is wound therefrom, and in Figure 3E, wire 331 is cut at a predetermined length with a blade 340.

4A. 4B and 4B. 4A and 4B illustrate an embodiment of an extension 400 according to the present invention wherein the wires 431 and 432 are connected to metallic connections 445 and 446. 4A. Fig. 4B illustrates how semiconductor chip 405 on organic substrate 410 is connected to terminals 445 and 446 by means of wires 431 and 432; Figure 4A shows the same but in side view.

Connections 445 and 446 serve to fix the cut ends of wires 431 and 432 used as antennas. Connectors 445 and 446 can be made of gold, silver, aluminum, copper, nickel or alloys thereof. They may be applied to the substrate 410 or other suitable material (e.g., silicon or other metal) as a thin layer affixed to the surface of the substrate 410. In a preferred embodiment, nothing other than the antenna wire ends 431 and 432 is connected to the connectors 445 and 446.

5A. Fig. 6A shows a continuous strip 500 of semiconductor chips 505, 515, 525 arranged on an organic substrate 502, the wires 531, 532 being used as antennas for the first and second terminals 507, 508. The wires 531, 532 are each half wavelength long. Following the attachment and closure operations shown in FIGS. 2 and 3, the tape 500 500 of the extensions 501 is 541, 542, 543, and so on. cut into segments using knife blades 561 along the boundary lines marked with dashed lines 551 and 552. In a preferred embodiment, the blades 561 are bladed midway-

14 between the semiconductor chips 505, 515, 525, such as 533, 534, 535, 536, etc., which are interrupted and cut between them. each piece of wire will be a quarter wavelength.

5B. FIG. 5A, 5A, 5B, 510, 570, 570, 590, 590 are illustrated in a series of strips 500, 550, 560, 570, 580, 590 on organic substrate 50 in triples of first and second 551 and 553, 561 and 563, 571 and 573, 574 and 575, respectively. Wires 577 and 578 as well as third and fourth connections 552 and 554, 562 and 564, 594 and 595, 581 and 583, 591 and 593 are connected as described above. In a preferred embodiment, the wires 511,512, 513 and 514 each have a half wavelength. Following the fastening and closing operations shown in Figures 2 and 3, the semi-finished product 501 of the extensions 501 is blade 522, 523, 524, and so on. separate dashed lines 517, 518, 519, 520, 521, etc. along dashed lines. segments. In a further preferred embodiment, the cutting lines formed by the blade blade 561 are located halfway between the semiconductor chips 550, 560, 570, 580, 590 and thus cut 556, 565, 566, 576, 567, 568 and so on between them. . each wire segment will be a quarter wavelength long. In another preferred embodiment, 52, 523, 524, and so on. cuts can be made simultaneously by means of a plurality of aligned knife blades 561.

Each of the semiconductor chips (e.g., the 590 semiconductor chip) has a wire (typically the 593A wire) that is not connected to any connection or other semiconductor chip. In such cases, the end of this 593A wire may be secured to substrate 502 by any of the methods previously described. In a preferred embodiment, the wire 593A may be connected to a connector (typically connector 593B) formed on carrier 502 as shown in Figure 4. Note also that FIG. 3A, three rows (one of which is the same as the ribbon shown in FIG. 5A), but the number of each row may vary according to the number of such ribbons that can be formed side by side on the carrier 502.

Fig. 6 is a side view of a radio frequency tag strip 610, which is cut into individual segments 611, 612, 613 by cutting blades 640 and 641 in cutting planes 650.

• · · • · · * ·· · ♦

Fig. 7 shows a detail of the manufacture of a loop antenna 700 when a loop antenna is formed using a temporary guide pin 720. The guide pin 720 is flush with the recess 750 on the surface of the carrier 710. After the wire 730 has been previously connected to the connection 207 shown in Figure 2, the wire 730 is lowered by the wire tie head 740 in accordance with step 130, while the wire 730 is guided around the temporary guide pin 720. This operation is repeated mirrored at the other end of the carrier 710 and connected to one end of the wire 730 to the connector 208 shown in FIG. 2 to completely create the desired loop antenna. This temporary guide pin 720 is then lifted in step 751 from the carrier 710 to complete the operation. The wire 730 may be secured to the substrate 710 by one of the methods described above.

Figure 8 illustrates an embodiment of a loop antenna 800 except that the guide pin 820 implanted in the carrier 810 is used instead of the temporary guide pin 720 shown in Figure 7. After the wire 830 is secured to the connection 207 shown in Figure 2, it is unwound with a wire binding head 840, thereby bypassing the guide pin 820 protruding from the carrier 810. This operation is repeated mirror-like at the other end of the carrier 810, and the other free end of the unwound wire 830 is connected to the connection 208 of FIG. 2 to form the desired loop antenna. It is also a difference from the embodiment shown in Fig. 7 that the guide pin 820 remains in place on the carrier 810 even after the loop antenna is formed.

Figure 9 is also a schematic diagram of the construction of a loop antenna 900 using a pre-cut conductor core 920 pre-cut into the carrier 910 and protruding from its plane. Conventionally, the guide groove 920 is deflected from the plane of the carrier 910 by, for example, an air nozzle 925 or a pin 926. After attaching the wire 930 at the first end to the connection 207 of Figure 2, the wire 930 is unwound by the wire tie head 940 and is guided through the raised guide tongue 920 as it is moved. This operation is repeated mirrored at the other end of the carrier 910, and the other free end of the wire 930 is connected to the connection 208 of Figure 2, thereby forming a loop antenna. Subsequently, if the mechanical nozzle 925 or pin 926 which pushes the guide flap 920 away is removed, the guide tongue 920 is resiliently retracted and the wire 930 is held firmly in position on the support 910.

- 16Α 7-9. In some preferred embodiments of the methods illustrated in Figures 1 to 4, the wire may be attached to the substrate by any other means, such as heat and / or pressure, as mentioned or described above.

Figure 10 illustrates the final step in the manufacture of a radio frequency tag 100, whereby a plurality of antennas 1020 (and 1030) were first created using 1064 and 1065 pressures by attaching wires 1025 (and 1035) to connections 1006 and 1008 (1007 and 1009). Subsequently, encapsulant material 1030 is dispensed to cover semiconductor chip 1005 and connections 1006 and 1009. The carrier 1040 is placed under an organic lid 1045. In a preferred embodiment, the organic lid 1045 comprises an outer layer of polyethylene 1060 and an inner layer of ethyl vinyl acetate 1050. 1064 heat and 1065 pressures were applied to seal the assembled package. In another preferred embodiment, a lower lid 1046 is placed underneath the splice 1000 and laminated with the lid 1045.

Based on the above description, one of ordinary skill in the art will realize many equivalent embodiments of the invention, each of which is within the scope of the invention claimed. For example, the methods shown in Figures 2, 3 and 5 can also be used to generate radio frequency tags, each of which is connected to multiple antennas at different angles (i.e., non-orthogonal) to each other.

• · ·

- 17 Patent claims

Claims (16)

A method for producing a radio frequency identification tag, comprising: attaching a semiconductor chip (205) to an organic carrier (210), modulating the first and second connections (207, 208), memory and a frequency of a radio frequency signal with a specific frequency. comprising: stepping one end of a first wire (131) to a first connection (208) of a semiconductor chip (205) by means of a wire binding device, winding the first wire (131) with the wire binding machine to a first length, the first wire (131) 210) is attached, the first end of the first wire (131) is cut off at a first length, and the first end of a second wire (132) is secured to the second connection (207) of the semiconductor chip using a wire binding machine. machine, unwind the second wire (Fig. 13) 2) affixed to the organic substrate (210) and cut off the second wire (132) at a second length and form with the first wire (131) and the second wire (132) an antenna for receiving a signal of a specified frequency, wherein the signal is 205) is modulated by its logic stage and radiated by the antenna. Method according to claim 1, characterized in that the first and second lengths of the first and second wires (131, 132) are equal to a quarter wavelength of the specified frequency. The method of claim 1, wherein the semiconductor chip (205) and the first and second connections (207, 208) are coated with a encapsulating material (283), wherein the encapsulating material (283) comprises an epoxy, silicone or polymeric material. any encapsulating material (283) is used. The method of claim 1, wherein the semiconductor chip (205) is bonded to the substrate (210), wherein the adhesive adhesive can be any adhesive comprising acrylic, silicone, and urethanes. The method of claim 1, wherein the semiconductor chip (205) is bonded to the substrate (210) by heating the substrate (210) or by heating the semiconductor chip (205), and the wires are bonded with a wire fixing adhesive (169) or (210) by heating or wiring Heating (18, 131, 132) to the substrate (210), wherein the wire fixing adhesive (169) can be any adhesive comprising epoxy, silicone and phenolic butyric acid. The method of claim 1, wherein the substrate (210), the semiconductor chip (205), and the first and second wires (131, 132) are provided with a single layer organic topcoat which is formed as any organic film including polyester and polylene. Covered (294) and heated to the substrate (210), the semiconductor chip (205) and the first and second wires (131, 132). The method of claim 6, wherein the organic topsheet (294) has an outer layer (298) and an inner layer (297), wherein the outer layer (298) is an organic film, the inner layer (297). comprising a topcoat adhesive, the latter pressure-sensitive topcoat and the organic topsheet (294) being heated and pressurized to the substrate (210), the semiconductor chip (205) and the wires (131, 132), and the topcoat containing ethyl vinyl acetate copolymer or adhesive containing acrylics, silicones and urethanes. The method of claim 1, wherein the top of the substrate (210) is covered by an attached organic top cover (294) and the bottom of the substrate (210) is covered by an attached lower lid (293). A method for producing a radio frequency tag, comprising: attaching a semiconductor chip (205) to an organic carrier (210), a first and a second connection (207, 208), a memory, and a logic stage for modulating a radio frequency signal. comprising: securing the first end of a first wire (131) to a first connection (208) of a semiconductor chip (205) by means of a wire binding device, winding the first wire (131) with a wire binding machine, the first wire (131) to the organic substrate (210) securing, cutting the first end of the first wire (131) at a first length, and securing the second end of a second wire (132) to the second connection (207) of the semiconductor chip using a wire binding machine, the second wire (132) the second wire (32) is a second sheet at its end, it is secured to the second junction on the substrate (210) and the second junction. - cutting 19 (132) at the second length and forming an antenna receiving a signal at a specified frequency with the first wire (131) and the second wire (132), wherein the signal is modulated by the logic degree of the semiconductor chip (205) and radiated. . A method for producing a radio frequency tag, comprising attaching to the tape (500) of an organic carrier (502) at least three semiconductor chips (505, 515, 525), the first and second connections (505, 515, 525) of each of the semiconductor chips (505, 515, 525). 507, 508), memory, and logic stage modulating a radio frequency signal at a specific frequency, the first end of a first wire (531) is attached to a first connection (508) formed by a first semiconductor chip (505), the first wire (531) being releasing the first cut end of the first wire (531) to a second connection (507) on a second semiconductor chip (515) by a wire binding machine, cutting the wire (531) at a first cut end at a first length, and then cutting the second end of a second wire For the second connection (507) of the semiconductor chip (505), a wire rope is attached winding the second wire to a second length with a forcing machine and a wire binding machine, and securing the other cut end of the second wire (532) to a first connection (507) on a third semiconductor chip (525), and a second wire (532) cutting at the second cut end and cutting the first wire (531) between the first semiconductor chip (505) and the second semiconductor chip (515) and the second wire (532) the first semiconductor chip (505) and the third semiconductor chip (525). wherein the first and second wires (531, 532) form an antenna receiving a signal at a specified frequency, and the signal is modulated by a logic stage of the semiconductor chip (505, 515, 525) and radiates the modulated signal through the antenna. 11. A method for producing a radio frequency tag, the method comprising: attaching a first and second connection, a memory and a logic stage modifying a frequency with a specific frequency to modulating a radio frequency signal to an organic carrier, attaching the first end of a wire to the first connection formed by the semiconductor chip; winding the first wire around one or more wire guides, securing the cut end of the wire to a second connection formed on the semiconductor, and cutting the wire away from the cut end of the second connection, where the wire is output at a frequency 20 and modulating the signal by the logic stage of the semiconductor chip and radiating the modulated signal to the antenna. The method of claim 11, wherein the semiconductor chip has two or more pairs of first and second connections, and the steps from attaching the semiconductor chip to the carrier to cutting the wire are repeated for each pair of connections to create more than one folded dipole antenna. The method of claim 11, wherein the wire guide pin is a guide pin (820) protruding from the carrier, or a guide pin (720) temporarily engaged with the carrier, or a tab (920) cut into the carrier and raised by an air stream or mechanical pin. for fastening wire guided down from the plane of the substrate by a wire binding machine. 14. A method for producing a plurality of radio frequency tags, wherein at least four semiconductor chips are affixed to an organic carrier tape, each of the semiconductor chips having first, second, third, and fourth terminals, and memory and a first frequency modulation logic stage modulating securing the first end to a first connection of a first semiconductor chip with a wire binding machine, lowering the first wire to a first length with the wire binding machine, securing the first cut end of the first wire to a second connection of a second semiconductor chip using a wire binding machine; securing the second end of the second wire to the second connection of the first semiconductor chip with a wire binding machine, lowering the second wire with the wire binding machine to a second length and securing the second cut end of the second wire to a first connection on a third semiconductor chip by means of the wire binding machine, and cutting the second wire at a second distance at the second cut end, securing the third end of a third wire to the third connection of the first chip. and lowering the third wire with the wire wrapping machine to a third length and securing the third cut end of the third wire to the fourth connection of a fourth semiconductor chip using the wire wrapping machine and cutting the third wire at the third cut end at a third length and then the fourth end of a fourth wire attach the fourth wire to the fourth connection of the first semiconductor chip using the wire binding machine, the fourth wire using the wire binding machine -Wound to -21, fasten the fourth cut end of the fourth wire to the carrier joint and cut the fourth wire at the fourth cut end of the fourth wire, and cut the first wire between the first and second semiconductor chips, the second wire between the first and third cut between the semiconductor chip and cut the third wire between the first and fourth semiconductor chips, wherein the first, second, third and fourth wires form two antennas (1020, 1030) for receiving signals at a specified frequency, signals are modulated and the modulated signals are transmitted by the antenna. 15. The method of claim 14, wherein the connector on the substrate is a connector on a fifth semiconductor chip and the fourth wire is cut between the first and fifth semiconductor chips. The method of claim 14, wherein each antenna (1020, 1030) comprises two wires of the same length. Imazott: Dr. Bq ^ sch Attilán 4, Attorney at Law DR. ATTILA BOGSCH lawyer flogsc / ί <fc Partnerg 1051 Budapest Bajcsy-Zsilinszky út 16. Tel 118-1111, Fax: 137-7828 · P970 1699 1/10 DISCLOSURE COPIES FIG. 4 · «.q PUBLICATIONS ρ97θ ¹⁰ * EXAMPLE 9T0i ° 3/10 DISCLOSURE COPIES FIG. 2E co C \ J co t-L 4/10 PÉLDÁíMVY * FIG. 2 H I • * · · · * ···· »» ♦ · «. »· Ίΐ9θ 5/10 DISCLOSURE COPIES FIG. 3B Q CD CO UO 6/10 DISCLOSURE EXAMPLE ^ v CD • »« · PUBLISHING ^7/10 EDITORIAL ^z VS '9 IS 593Λ · »· DISCLOSURE EXAMPLE ³ FIG. ί PRESENTATION FIG. EXAMPLE 8 ^ * »» · * » FIG. 9 910 z