KR850001975B1 - 반도체장치 및 그 제조방법 - Google Patents

반도체장치 및 그 제조방법 Download PDF

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Publication number
KR850001975B1
KR850001975B1 KR1019810004865A KR810004865A KR850001975B1 KR 850001975 B1 KR850001975 B1 KR 850001975B1 KR 1019810004865 A KR1019810004865 A KR 1019810004865A KR 810004865 A KR810004865 A KR 810004865A KR 850001975 B1 KR850001975 B1 KR 850001975B1
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KR
South Korea
Prior art keywords
semiconductor device
semiconductor element
adhesive
manufacturing
semiconductor
Prior art date
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Expired
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KR1019810004865A
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English (en)
Korean (ko)
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KR830008396A (ko
Inventor
히데오 이나요시
아끼라 스즈끼
구니히로 쓰보사끼
도요이찌 우에다
다이스께 마끼노
노부오 이찌무라
가즈나리 스즈끼
Original Assignee
가부시기 가이샤 히다찌 세이사꾸쇼
미다 가쓰시게루(三田勝茂)
히다찌 가세이 고교 가부시기 가이샤
히다찌 마이크로컴퓨터 엔지니어링 주식회사
요꾜야마 료오지
가모시모 겐이찌
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시기 가이샤 히다찌 세이사꾸쇼, 미다 가쓰시게루(三田勝茂), 히다찌 가세이 고교 가부시기 가이샤, 히다찌 마이크로컴퓨터 엔지니어링 주식회사, 요꾜야마 료오지, 가모시모 겐이찌 filed Critical 가부시기 가이샤 히다찌 세이사꾸쇼
Publication of KR830008396A publication Critical patent/KR830008396A/ko
Application granted granted Critical
Publication of KR850001975B1 publication Critical patent/KR850001975B1/ko
Expired legal-status Critical Current

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    • H10W74/40—
    • H10W20/40—
    • H10W70/417—
    • H10W74/111—
    • H10W74/121—
    • H10W74/473—
    • H10W72/01515—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/075—
    • H10W72/30—
    • H10W72/325—
    • H10W72/352—
    • H10W72/353—
    • H10W72/354—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

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  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019810004865A 1980-12-10 1981-12-09 반도체장치 및 그 제조방법 Expired KR850001975B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP173287 1980-12-10
JP55173287A JPS57111034A (en) 1980-12-10 1980-12-10 Semiconductor device and its manufacture

Publications (2)

Publication Number Publication Date
KR830008396A KR830008396A (ko) 1983-11-18
KR850001975B1 true KR850001975B1 (ko) 1985-12-31

Family

ID=15957645

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019810004865A Expired KR850001975B1 (ko) 1980-12-10 1981-12-09 반도체장치 및 그 제조방법

Country Status (9)

Country Link
US (1) US4803543A (enExample)
JP (1) JPS57111034A (enExample)
KR (1) KR850001975B1 (enExample)
DE (1) DE3148786A1 (enExample)
FR (1) FR2496984B1 (enExample)
GB (1) GB2089126B (enExample)
IT (1) IT1172862B (enExample)
MY (1) MY8600414A (enExample)
SG (1) SG94185G (enExample)

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US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
DE68926086T2 (de) * 1988-10-12 1996-08-14 Semiconductor Energy Lab Verfahren zum Herstellen elektrischer Anordnungen
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
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JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
FI105605B (fi) * 1989-04-27 2000-09-15 Siemens Ag Planarisoiva eriste
GB2239244B (en) * 1989-11-14 1994-06-01 David Durand Moisture resistant electrically conductive cements and methods for making and using same
US5183593A (en) * 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
JPH0724270B2 (ja) * 1989-12-14 1995-03-15 株式会社東芝 半導体装置及びその製造方法
JP2893782B2 (ja) * 1990-01-19 1999-05-24 日立化成工業株式会社 導電性接着剤および半導体装置
IT1238150B (it) * 1990-01-31 1993-07-09 Procedimento per l'accoppiamento a caldo di strutture sottili in materiale sintetico come tessuti, tessuti non tessuti, moquettes ed altro, a manufatti in materiale sintetico
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5258139A (en) * 1990-04-20 1993-11-02 Hitachi Chemical Company, Ltd. Epoxy resin and adhesive composition containing the same
US5188767A (en) * 1990-04-27 1993-02-23 Hitachi Chemical Co., Ltd. Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder
JPH0521655A (ja) * 1990-11-28 1993-01-29 Mitsubishi Electric Corp 半導体装置および半導体装置用パツケージ
ATE141546T1 (de) * 1991-10-31 1996-09-15 Canon Kk Polymerzusammensetzung für transfer-giessen zur herstellung eines farbstrahlaufzeichnungskopfes und unter deren verwendung hergestellter farbstrahlaufzeichnungskopf
US5363080A (en) * 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
DE4238113A1 (de) * 1992-11-12 1994-05-19 Mikroelektronik Und Technologi Anordnung zur spannungsfreien Chipmontage
FR2713396B1 (fr) * 1993-11-30 1996-02-09 Giat Ind Sa Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.
TW324737B (en) * 1994-03-30 1998-01-11 Gould Wlectronics Inc Epoxy adhesive composition and copper foil and laminate using the same
US5969414A (en) * 1994-05-25 1999-10-19 Advanced Technology Interconnect Incorporated Semiconductor package with molded plastic body
JPH09155918A (ja) * 1995-12-07 1997-06-17 Matsushita Electric Ind Co Ltd 樹脂封止電子製品の製造方法
US6073339A (en) * 1996-09-20 2000-06-13 Tdk Corporation Of America Method of making low profile pin-less planar magnetic devices
JP3355122B2 (ja) 1998-01-08 2002-12-09 富士通株式会社 光モジュールの封止方法
AU4802199A (en) * 1998-07-28 2000-02-21 Hitachi Chemical Company, Ltd. Semiconductor device and method for manufacturing the same
US6849806B2 (en) * 2001-11-16 2005-02-01 Texas Instruments Incorporated Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US6835592B2 (en) * 2002-05-24 2004-12-28 Micron Technology, Inc. Methods for molding a semiconductor die package with enhanced thermal conductivity
CN1672475B (zh) * 2002-06-27 2011-11-23 Ppg工业俄亥俄公司 有凹入或伸长分离接头片的单层或多层印刷电路板及其制造方法
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
JP2007234800A (ja) * 2006-02-28 2007-09-13 Tdk Corp 電子部品及びその製造方法
JP5382484B2 (ja) * 2006-11-13 2014-01-08 住友ベークライト株式会社 接着剤層付き半導体素子の製造方法および半導体パッケージの製造方法
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
US9508622B2 (en) * 2011-04-28 2016-11-29 Freescale Semiconductor, Inc. Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
TWI569385B (zh) 2011-05-27 2017-02-01 住友電木股份有限公司 半導體裝置之製造方法
JP6119094B2 (ja) * 2011-12-27 2017-04-26 住友ベークライト株式会社 半導体装置
JP6119832B2 (ja) * 2015-12-04 2017-04-26 住友ベークライト株式会社 半導体装置
JP7446125B2 (ja) * 2020-02-21 2024-03-08 エイブリック株式会社 半導体装置およびその製造方法

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BE497999A (enExample) * 1949-09-09
DE956987C (de) * 1951-06-20 1957-01-24 Hoechst Ag Verfahren zur Herstellung von selbsterhaertenden, gegen den Angriff chemischer Substanzen, besonders gegen Saeuren, bestaendige Bindungen ergebenden Massen
US2779668A (en) * 1953-04-02 1957-01-29 Union Carbide & Carbon Corp Epoxy resin modified phenol resin abrasive
GB768125A (en) * 1953-09-03 1957-02-13 Shell Refining & Marketing Co Improvements in or relating to resinous compositions comprising a glycidyl polyetherand a phenol-formaldehyde resin
US3439235A (en) * 1966-11-14 1969-04-15 Gen Electric Epoxy encapsulated semiconductor device
GB1206759A (en) * 1967-07-20 1970-09-30 Standard Telephones Cables Ltd Semiconductor devices
US3566208A (en) * 1968-02-02 1971-02-23 Fairchild Camera Instr Co Pin socket
US3600246A (en) * 1968-05-17 1971-08-17 Rca Corp Method of making laminated semiconductor devices
US3849187A (en) * 1970-03-08 1974-11-19 Dexter Corp Encapsulant compositions for semiconductors
US4076869A (en) * 1970-10-23 1978-02-28 Ciba-Geigy Corporation Hardenable epoxy resin compositions and process for making the same
NL158025B (nl) * 1971-02-05 1978-09-15 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting, vervaardigd volgens deze werkwijze.
US3975757A (en) * 1974-05-31 1976-08-17 National Semiconductor Corporation Molded electrical device
JPS5141962A (enExample) * 1974-10-07 1976-04-08 Nippon Electric Co
JPS52107036A (en) * 1976-03-04 1977-09-08 Shoei Chemical Ind Co Electrically conductive paint
JPS52144099A (en) * 1976-05-26 1977-12-01 Hitachi Ltd Epoxy resin compositions
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
JPS54111768A (en) * 1978-02-22 1979-09-01 Hitachi Ltd Semiconductor device of resin sealing type
JPS54141568A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
US4248920A (en) * 1978-04-26 1981-02-03 Tokyo Shibaura Denki Kabushiki Kaisha Resin-sealed semiconductor device
US4356505A (en) * 1978-08-04 1982-10-26 Bell Telephone Laboratories, Incorporated Conductive adhesive system including a conductivity enhancer
GB2028828B (en) * 1978-08-04 1982-09-22 Western Electric Co Conductive adhesive system including a conductivity enhancer
US4210704A (en) * 1978-08-04 1980-07-01 Bell Telephone Laboratories, Incorporated Electrical devices employing a conductive epoxy resin formulation as a bonding medium
US4297401A (en) * 1978-12-26 1981-10-27 Minnesota Mining & Manufacturing Company Liquid crystal display and photopolymerizable sealant therefor
JPS6015152B2 (ja) * 1980-01-09 1985-04-17 株式会社日立製作所 樹脂封止半導体メモリ装置

Also Published As

Publication number Publication date
IT1172862B (it) 1987-06-18
IT8168603A0 (it) 1981-12-09
GB2089126A (en) 1982-06-16
DE3148786A1 (de) 1982-07-29
US4803543A (en) 1989-02-07
JPS634701B2 (enExample) 1988-01-30
JPS57111034A (en) 1982-07-10
KR830008396A (ko) 1983-11-18
SG94185G (en) 1986-07-25
MY8600414A (en) 1986-12-31
GB2089126B (en) 1985-03-13
FR2496984A1 (fr) 1982-06-25
FR2496984B1 (fr) 1985-11-08

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