FR2713396B1 - Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé. - Google Patents

Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.

Info

Publication number
FR2713396B1
FR2713396B1 FR9314318A FR9314318A FR2713396B1 FR 2713396 B1 FR2713396 B1 FR 2713396B1 FR 9314318 A FR9314318 A FR 9314318A FR 9314318 A FR9314318 A FR 9314318A FR 2713396 B1 FR2713396 B1 FR 2713396B1
Authority
FR
France
Prior art keywords
electronic components
modules
encapsulated
encapsulating
encapsulating electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9314318A
Other languages
English (en)
Other versions
FR2713396A1 (fr
Inventor
Gilles Bureau
Colette Lacabanne
Emmanuel Oreau
Jean-Marc Ferrandiz
Poec Jacques Le
Yvan Segui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giat Industries SA
Original Assignee
Giat Industries SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giat Industries SA filed Critical Giat Industries SA
Priority to FR9314318A priority Critical patent/FR2713396B1/fr
Priority to CA002154480A priority patent/CA2154480A1/fr
Priority to PCT/FR1994/001394 priority patent/WO1995015579A1/fr
Priority to EP95902812A priority patent/EP0682809A1/fr
Publication of FR2713396A1 publication Critical patent/FR2713396A1/fr
Application granted granted Critical
Publication of FR2713396B1 publication Critical patent/FR2713396B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
FR9314318A 1993-11-30 1993-11-30 Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé. Expired - Fee Related FR2713396B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9314318A FR2713396B1 (fr) 1993-11-30 1993-11-30 Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.
CA002154480A CA2154480A1 (fr) 1993-11-30 1994-11-30 Procede d'encapsulation de composants ou de modules electroniques et dispositfs encapsules par ledit procede
PCT/FR1994/001394 WO1995015579A1 (fr) 1993-11-30 1994-11-30 Procede d'encapsulation de composants ou de modules electroniques et dispositfs encapsules par ledit procede
EP95902812A EP0682809A1 (fr) 1993-11-30 1994-11-30 Procede d'encapsulation de composants ou de modules electroniques et dispositfs encapsules par ledit procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9314318A FR2713396B1 (fr) 1993-11-30 1993-11-30 Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.

Publications (2)

Publication Number Publication Date
FR2713396A1 FR2713396A1 (fr) 1995-06-09
FR2713396B1 true FR2713396B1 (fr) 1996-02-09

Family

ID=9453371

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9314318A Expired - Fee Related FR2713396B1 (fr) 1993-11-30 1993-11-30 Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.

Country Status (4)

Country Link
EP (1) EP0682809A1 (fr)
CA (1) CA2154480A1 (fr)
FR (1) FR2713396B1 (fr)
WO (1) WO1995015579A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2740608B1 (fr) * 1995-10-25 1997-12-19 Giat Ind Sa Procede pour deposer un revetement de protection sur les composants d'une carte electronique
EP1084029A4 (fr) * 1998-01-27 2003-05-14 Richard L Jacobs Dispositifs electroniques ayant des parties thermodynamiques encapsulantes predominant sur des parties thermostatiques encapsulantes
FR2817397B1 (fr) * 2000-11-24 2003-10-17 Alstom Procede pour augmenter la duree de vie d'un composant semi-conducteur de puissance et module electronique comportant un composant ainsi protege
FR3053528B1 (fr) * 2016-06-30 2018-11-02 Safran Electronics & Defense Dispositif electronique ayant une banque integree de composants passifs
EP3404675A1 (fr) 2017-05-15 2018-11-21 EBG Elektronische Bauelemente GmbH Résistance de puissance
FR3114643B1 (fr) 2020-09-25 2022-09-09 Nexter Munitions Fusee electronique pour projectile

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH560999A5 (fr) * 1973-08-16 1975-04-15 Bbc Brown Boveri & Cie
US4173664A (en) * 1978-01-20 1979-11-06 Union Carbide Corporation Parylene stabilization
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
JPS60249392A (ja) * 1984-05-24 1985-12-10 ティーディーケイ株式会社 電磁シ−ルド材料
JPS615583A (ja) * 1984-06-20 1986-01-11 Hitachi Ltd 太陽電池モジユ−ル
JPS6167247A (ja) * 1984-09-10 1986-04-07 Nec Corp 混成集積回路
JPH02134838A (ja) * 1988-11-16 1990-05-23 Hitachi Ltd 樹脂封止型半導体装置およびその製造方法およびそれに用いる中間層形成装置
JP2681167B2 (ja) * 1988-10-12 1997-11-26 株式会社半導体エネルギー研究所 電子装置作製方法
JP2674670B2 (ja) * 1989-09-19 1997-11-12 富士通株式会社 半導体装置の製造方法
JPH05275487A (ja) * 1991-11-22 1993-10-22 Sumitomo 3M Ltd 電子部品表面保護材、その表面保護材を備えた電子部品、およびその表面保護材を使用した電子部品の電気的接続方法

Also Published As

Publication number Publication date
CA2154480A1 (fr) 1995-06-08
WO1995015579A1 (fr) 1995-06-08
EP0682809A1 (fr) 1995-11-22
FR2713396A1 (fr) 1995-06-09

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20120731