FI961375A - Muovikapseloitu SAW-laite ja kapselointimenetelmä - Google Patents

Muovikapseloitu SAW-laite ja kapselointimenetelmä Download PDF

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Publication number
FI961375A
FI961375A FI961375A FI961375A FI961375A FI 961375 A FI961375 A FI 961375A FI 961375 A FI961375 A FI 961375A FI 961375 A FI961375 A FI 961375A FI 961375 A FI961375 A FI 961375A
Authority
FI
Finland
Prior art keywords
saw device
encapsulation method
plastic encapsulated
encapsulated saw
plastic
Prior art date
Application number
FI961375A
Other languages
English (en)
Swedish (sv)
Other versions
FI961375A0 (fi
Inventor
Michael John Anderson
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23648658&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FI961375(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of FI961375A0 publication Critical patent/FI961375A0/fi
Publication of FI961375A publication Critical patent/FI961375A/fi

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
FI961375A 1995-04-03 1996-03-26 Muovikapseloitu SAW-laite ja kapselointimenetelmä FI961375A (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/416,126 US5760526A (en) 1995-04-03 1995-04-03 Plastic encapsulated SAW device

Publications (2)

Publication Number Publication Date
FI961375A0 FI961375A0 (fi) 1996-03-26
FI961375A true FI961375A (fi) 1996-10-04

Family

ID=23648658

Family Applications (1)

Application Number Title Priority Date Filing Date
FI961375A FI961375A (fi) 1995-04-03 1996-03-26 Muovikapseloitu SAW-laite ja kapselointimenetelmä

Country Status (6)

Country Link
US (1) US5760526A (fi)
EP (1) EP0736972B1 (fi)
JP (1) JPH08288776A (fi)
DE (1) DE69602794T2 (fi)
DK (1) DK0736972T3 (fi)
FI (1) FI961375A (fi)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6388203B1 (en) 1995-04-04 2002-05-14 Unitive International Limited Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
WO1996031905A1 (en) 1995-04-05 1996-10-10 Mcnc A solder bump structure for a microelectronic substrate
JP3580082B2 (ja) * 1997-04-22 2004-10-20 株式会社村田製作所 チップ状部品の実装構造および実装方法
EP0899787A3 (en) * 1997-07-25 2001-05-16 Mcnc Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structurs formed thereby
JP3196693B2 (ja) * 1997-08-05 2001-08-06 日本電気株式会社 表面弾性波装置およびその製造方法
US6359333B1 (en) 1998-03-31 2002-03-19 Honeywell International Inc. Wafer-pair having deposited layer sealed chambers
US6036872A (en) 1998-03-31 2000-03-14 Honeywell Inc. Method for making a wafer-pair having sealed chambers
NO322272B1 (no) * 1999-03-26 2006-09-04 Kongsberg Maritime As Sensor og system for overvaking av temperatur inne i vanskelig tilgjengelige, bevegelige deler
US6182342B1 (en) * 1999-04-02 2001-02-06 Andersen Laboratories, Inc. Method of encapsulating a saw device
JP2002076831A (ja) * 2000-08-28 2002-03-15 Nec Corp リードフレームおよびそれを使用するｓａｗフィルタ
JP3418373B2 (ja) * 2000-10-24 2003-06-23 エヌ・アール・エス・テクノロジー株式会社 弾性表面波装置及びその製造方法
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US6960828B2 (en) 2002-06-25 2005-11-01 Unitive International Limited Electronic structures including conductive shunt layers
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7259499B2 (en) * 2004-12-23 2007-08-21 Askew Andy R Piezoelectric bimorph actuator and method of manufacturing thereof
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
DE102006005994A1 (de) * 2006-02-08 2007-08-16 Infineon Technologies Ag Halbleiterbauteil mit einem Halbleiterchip und Verfahren zur Herstellung derartiger Halbleiterbauteile
US7576470B2 (en) * 2007-04-30 2009-08-18 Honeywell International Inc. Mechanical packaging of surface acoustic wave device for sensing applications
US8325047B2 (en) * 2009-04-08 2012-12-04 Sabic Innovative Plastics Ip B.V. Encapsulated RFID tags and methods of making same
JP2013051512A (ja) * 2011-08-30 2013-03-14 Nippon Dempa Kogyo Co Ltd 水晶振動子
GB2516079A (en) * 2013-07-10 2015-01-14 Melexis Technologies Nv Method for hermetically sealing with reduced stress
DE102016114566A1 (de) * 2015-08-10 2017-02-16 Bürkert Werke GmbH Folienwandler und Aktorstreifen für einen Folienwandler

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4028646A (en) * 1974-12-30 1977-06-07 Matsushita Electric Industrial Co., Ltd. Elastic surface wave devices and method for making the same
GB1512593A (en) * 1975-03-13 1978-06-01 Murata Manufacturing Co Elastic surface wave filter
US4037176A (en) * 1975-03-18 1977-07-19 Matsushita Electric Industrial Co., Ltd. Multi-layered substrate for a surface-acoustic-wave device
US4096455A (en) * 1977-02-23 1978-06-20 Tektronix, Inc. Surface wave termination for saw device
JPS53109458A (en) * 1977-03-07 1978-09-25 Hitachi Ltd Element for elastic surface wave
US4191905A (en) * 1977-06-17 1980-03-04 Citizen Watch Company Limited Sealed housings for a subminiature piezoelectric vibrator
JPS5925486B2 (ja) * 1977-11-15 1984-06-18 シチズン時計株式会社 圧電振動子の容器
US4270105A (en) * 1979-05-14 1981-05-26 Raytheon Company Stabilized surface wave device
US4405875A (en) * 1980-07-24 1983-09-20 Kiyoshi Nagai Hermetically sealed flat-type piezo-electric oscillator assembly
US4586382A (en) * 1982-09-29 1986-05-06 Schlumberger Technology Corporation Surface acoustic wave sensors
US4512198A (en) * 1982-09-29 1985-04-23 Schlumberger Technology Corporation Surface acoustic wave sensors
US5594979A (en) * 1984-09-13 1997-01-21 Raytheon Company Method for packaging a surface acoustic wave device
JPS61152112A (ja) * 1984-12-26 1986-07-10 Hitachi Ltd 弾性表面波装置
JPS6297418A (ja) * 1985-10-23 1987-05-06 Clarion Co Ltd 弾性表面波装置のパツケ−ジ方法
US5091051A (en) * 1986-12-22 1992-02-25 Raytheon Company Saw device method
US5010270A (en) * 1986-12-22 1991-04-23 Raytheon Company Saw device
JPS6437132U (fi) * 1987-08-31 1989-03-06
JPH02170611A (ja) * 1988-12-22 1990-07-02 Clarion Co Ltd 弾性表面波装置
US5095240A (en) * 1989-11-13 1992-03-10 X-Cyte, Inc. Inductively coupled saw device and method for making the same
US5051645A (en) * 1990-01-30 1991-09-24 Johnson Service Company Acoustic wave H2 O phase-change sensor capable of self-cleaning and distinguishing air, water, dew, frost and ice
JPH0456510A (ja) * 1990-06-26 1992-02-24 Clarion Co Ltd 弾性表面波装置
JP2673993B2 (ja) * 1990-07-02 1997-11-05 日本無線株式会社 表面弾性波装置
US5215546A (en) * 1990-09-04 1993-06-01 Motorola, Inc. Method and apparatus for SAW device passivation
JPH04170811A (ja) * 1990-11-05 1992-06-18 Fujitsu Ltd 弾性表面波デバイス
US5208504A (en) * 1990-12-28 1993-05-04 Raytheon Company Saw device and method of manufacture
JPH05291864A (ja) * 1992-04-10 1993-11-05 Matsushita Electric Ind Co Ltd 弾性表面波素子実装回路とその製造方法
JP3222220B2 (ja) * 1992-10-19 2001-10-22 株式会社村田製作所 チップ型圧電共振子の製造方法

Also Published As

Publication number Publication date
JPH08288776A (ja) 1996-11-01
US5760526A (en) 1998-06-02
FI961375A0 (fi) 1996-03-26
DK0736972T3 (da) 1999-11-15
EP0736972B1 (en) 1999-06-09
EP0736972A1 (en) 1996-10-09
DE69602794T2 (de) 2000-03-09
DE69602794D1 (de) 1999-07-15

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