KR960009141A - 광 결합기 패키지 리드 프레임 및 그 방법 - Google Patents
광 결합기 패키지 리드 프레임 및 그 방법 Download PDFInfo
- Publication number
- KR960009141A KR960009141A KR1019950028884A KR19950028884A KR960009141A KR 960009141 A KR960009141 A KR 960009141A KR 1019950028884 A KR1019950028884 A KR 1019950028884A KR 19950028884 A KR19950028884 A KR 19950028884A KR 960009141 A KR960009141 A KR 960009141A
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- package lead
- optocoupler package
- optocoupler
- frame
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/298,697 US5489800A (en) | 1994-08-31 | 1994-08-31 | Dual channel small outline optocoupler package and method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960009141A true KR960009141A (ko) | 1996-03-22 |
Family
ID=23151648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950028884A KR960009141A (ko) | 1994-08-31 | 1995-08-31 | 광 결합기 패키지 리드 프레임 및 그 방법 |
Country Status (5)
Country | Link |
---|---|
US (2) | US5489800A (ko) |
EP (1) | EP0700100A3 (ko) |
JP (1) | JP3754471B2 (ko) |
KR (1) | KR960009141A (ko) |
MY (1) | MY115370A (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2267797A1 (de) * | 1997-07-29 | 2010-12-29 | OSRAM Opto Semiconductors GmbH | Optoelektronisches Bauelement |
US6388319B1 (en) * | 1999-05-25 | 2002-05-14 | International Rectifier Corporation | Three commonly housed diverse semiconductor dice |
KR100633113B1 (ko) * | 1999-07-02 | 2006-10-11 | 롬 가부시키가이샤 | 전자부품 |
JP3741935B2 (ja) * | 2000-05-11 | 2006-02-01 | シャープ株式会社 | 光結合素子 |
US6556750B2 (en) * | 2000-05-26 | 2003-04-29 | Fairchild Semiconductor Corporation | Bi-directional optical coupler |
DE60136964D1 (de) * | 2001-01-30 | 2009-01-22 | Infineon Technologies Ag | Anschlusskamm für einen optokoppler |
JP2002314138A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
JP4101468B2 (ja) * | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
US6633030B2 (en) * | 2001-08-31 | 2003-10-14 | Fiarchild Semiconductor | Surface mountable optocoupler package |
US6683370B1 (en) * | 2003-04-15 | 2004-01-27 | Motorola, Inc. | Semiconductor component and method of manufacturing same |
US6919625B2 (en) * | 2003-07-10 | 2005-07-19 | General Semiconductor, Inc. | Surface mount multichip devices |
US7196313B2 (en) * | 2004-04-02 | 2007-03-27 | Fairchild Semiconductor Corporation | Surface mount multi-channel optocoupler |
CN100433282C (zh) * | 2006-02-23 | 2008-11-12 | 华南师范大学 | 功率型发光二极管器件及其制造方法 |
US20080079012A1 (en) * | 2006-09-29 | 2008-04-03 | Grote Industries, Inc. | Illuminated devices utilizing transparent light active sheet material with integrated light emitting diode (LED), and methods and kit therefor |
JP2009141080A (ja) * | 2007-12-05 | 2009-06-25 | Toshiba Corp | リードフレームおよび半導体装置 |
TWI384591B (zh) * | 2008-11-17 | 2013-02-01 | Everlight Electronics Co Ltd | 發光二極體電路板 |
US7973393B2 (en) | 2009-02-04 | 2011-07-05 | Fairchild Semiconductor Corporation | Stacked micro optocouplers and methods of making the same |
US7900521B2 (en) * | 2009-02-10 | 2011-03-08 | Freescale Semiconductor, Inc. | Exposed pad backside pressure sensor package |
US9006759B2 (en) | 2010-04-15 | 2015-04-14 | Citizen Electronics Co., Ltd. | Light-emitting device |
US8587099B1 (en) * | 2012-05-02 | 2013-11-19 | Texas Instruments Incorporated | Leadframe having selective planishing |
US9166131B2 (en) * | 2013-07-17 | 2015-10-20 | Tai-Yin Huang | Composite LED package and its application to light tubes |
CN106206528B (zh) * | 2016-09-07 | 2018-08-28 | 四川上特科技有限公司 | 基于双向tvs高压脉冲抑制的整流桥及其制作工艺 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3993529A (en) * | 1971-12-09 | 1976-11-23 | Farkas Robert D | Apparatus for treating plastic loads |
DE2431375C3 (de) * | 1974-06-29 | 1978-03-09 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Herstellen eines optoelektronischen Koppelelementes |
FR2436505A1 (fr) * | 1978-09-12 | 1980-04-11 | Radiotechnique Compelec | Dispositif optoelectronique a emetteur et recepteur couples |
US5049527A (en) * | 1985-06-25 | 1991-09-17 | Hewlett-Packard Company | Optical isolator |
US4794431A (en) * | 1986-04-21 | 1988-12-27 | International Rectifier Corporation | Package for photoactivated semiconductor device |
DE3633181C2 (de) * | 1986-09-30 | 1998-12-10 | Siemens Ag | Reflexlichtschranke |
US4755474A (en) * | 1986-12-22 | 1988-07-05 | Motorola Inc. | Method of assembling an optocoupler |
US5237205A (en) * | 1989-10-02 | 1993-08-17 | Advanced Micro Devices, Inc. | Ground plane for plastic encapsulated integrated circuit die packages |
US5329131A (en) * | 1991-05-17 | 1994-07-12 | U.S. Philips Corporation | Opto-electronic coupler having improved moisture protective housing |
US5521992A (en) * | 1994-08-01 | 1996-05-28 | Motorola, Inc. | Molded optical interconnect |
-
1994
- 1994-08-31 US US08/298,697 patent/US5489800A/en not_active Expired - Fee Related
-
1995
- 1995-05-30 US US08/454,471 patent/US5677245A/en not_active Expired - Lifetime
- 1995-08-11 MY MYPI95002349A patent/MY115370A/en unknown
- 1995-08-16 JP JP22961795A patent/JP3754471B2/ja not_active Expired - Lifetime
- 1995-08-25 EP EP95113368A patent/EP0700100A3/en not_active Withdrawn
- 1995-08-31 KR KR1019950028884A patent/KR960009141A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP3754471B2 (ja) | 2006-03-15 |
MY115370A (en) | 2003-05-31 |
US5489800A (en) | 1996-02-06 |
EP0700100A2 (en) | 1996-03-06 |
US5677245A (en) | 1997-10-14 |
EP0700100A3 (en) | 1996-12-04 |
JPH0878723A (ja) | 1996-03-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |