FR3053528B1 - Dispositif electronique ayant une banque integree de composants passifs - Google Patents

Dispositif electronique ayant une banque integree de composants passifs Download PDF

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Publication number
FR3053528B1
FR3053528B1 FR1656255A FR1656255A FR3053528B1 FR 3053528 B1 FR3053528 B1 FR 3053528B1 FR 1656255 A FR1656255 A FR 1656255A FR 1656255 A FR1656255 A FR 1656255A FR 3053528 B1 FR3053528 B1 FR 3053528B1
Authority
FR
France
Prior art keywords
electronic device
passive components
integrated bank
bank
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1656255A
Other languages
English (en)
Other versions
FR3053528A1 (fr
Inventor
Nawres Sridi-Convers
Eric Bailly
Jean-Christophe Riou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Electronics and Defense SAS
Original Assignee
Safran Electronics and Defense SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Safran Electronics and Defense SAS filed Critical Safran Electronics and Defense SAS
Priority to FR1656255A priority Critical patent/FR3053528B1/fr
Priority to PCT/EP2017/066391 priority patent/WO2018002368A1/fr
Publication of FR3053528A1 publication Critical patent/FR3053528A1/fr
Application granted granted Critical
Publication of FR3053528B1 publication Critical patent/FR3053528B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
FR1656255A 2016-06-30 2016-06-30 Dispositif electronique ayant une banque integree de composants passifs Active FR3053528B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1656255A FR3053528B1 (fr) 2016-06-30 2016-06-30 Dispositif electronique ayant une banque integree de composants passifs
PCT/EP2017/066391 WO2018002368A1 (fr) 2016-06-30 2017-06-30 Dispositif electronique ayant une banque integree de composants passifs

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1656255A FR3053528B1 (fr) 2016-06-30 2016-06-30 Dispositif electronique ayant une banque integree de composants passifs
FR1656255 2016-06-30

Publications (2)

Publication Number Publication Date
FR3053528A1 FR3053528A1 (fr) 2018-01-05
FR3053528B1 true FR3053528B1 (fr) 2018-11-02

Family

ID=57233596

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1656255A Active FR3053528B1 (fr) 2016-06-30 2016-06-30 Dispositif electronique ayant une banque integree de composants passifs

Country Status (2)

Country Link
FR (1) FR3053528B1 (fr)
WO (1) WO2018002368A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113938138B (zh) * 2021-08-26 2023-05-16 北京遥测技术研究所 一种单片集成开关网络的x频段8通道接收芯片

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6489349A (en) * 1987-06-17 1989-04-03 Tandem Computers Inc Improved vlsi package having a plurality of power plane
FR2713396B1 (fr) * 1993-11-30 1996-02-09 Giat Ind Sa Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.
US6462950B1 (en) * 2000-11-29 2002-10-08 Nokia Mobile Phones Ltd. Stacked power amplifier module
TW586205B (en) * 2001-06-26 2004-05-01 Intel Corp Electronic assembly with vertically connected capacitors and manufacturing method
TW560017B (en) * 2001-07-12 2003-11-01 Hitachi Ltd Semiconductor connection substrate
JP2008053319A (ja) * 2006-08-22 2008-03-06 Nec Electronics Corp 半導体装置
WO2010041589A1 (fr) * 2008-10-08 2010-04-15 株式会社村田製作所 Module composite
JP5464110B2 (ja) * 2010-09-30 2014-04-09 大日本印刷株式会社 電圧変換モジュール
FR2991810B1 (fr) * 2012-06-11 2014-07-04 Sagem Defense Securite Module electronique de puissance pourvu d'une couche de protection
US20140035935A1 (en) * 2012-08-03 2014-02-06 Qualcomm Mems Technologies, Inc. Passives via bar

Also Published As

Publication number Publication date
FR3053528A1 (fr) 2018-01-05
WO2018002368A1 (fr) 2018-01-04

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