KR20220132673A - 반도체 디바이스 제작에서의 주석 옥사이드 막들 - Google Patents

반도체 디바이스 제작에서의 주석 옥사이드 막들 Download PDF

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KR20220132673A
KR20220132673A KR1020227032676A KR20227032676A KR20220132673A KR 20220132673 A KR20220132673 A KR 20220132673A KR 1020227032676 A KR1020227032676 A KR 1020227032676A KR 20227032676 A KR20227032676 A KR 20227032676A KR 20220132673 A KR20220132673 A KR 20220132673A
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South Korea
Prior art keywords
substrate
tin oxide
layer
plasma
etching
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KR1020227032676A
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English (en)
Korean (ko)
Inventor
정이 유
사만다 탄
유 지앙
후이-정 우
리처드 와이즈
양 판
네이더 샴마
보리스 볼로스키
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램 리써치 코포레이션
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Priority to KR1020247002427A priority Critical patent/KR102829108B1/ko
Publication of KR20220132673A publication Critical patent/KR20220132673A/ko
Abandoned legal-status Critical Current

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    • HELECTRICITY
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    • H10P76/40Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/405Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their composition, e.g. multilayer masks
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    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/692Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6938Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
    • H01L21/0337
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    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
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    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3424Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
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    • H10P50/26Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials
    • H10P50/264Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means
    • H10P50/266Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only
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    • H10P50/267Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas
    • H10P50/268Dry etching; Plasma etching; Reactive-ion etching of conductive or resistive materials by chemical means by vapour etching only using plasmas of silicon-containing layers
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    • H10P72/722Details of electrostatic chucks

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  • Drying Of Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Formation Of Insulating Films (AREA)
  • Semiconductor Memories (AREA)
KR1020227032676A 2017-02-17 2018-02-13 반도체 디바이스 제작에서의 주석 옥사이드 막들 Abandoned KR20220132673A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020247002427A KR102829108B1 (ko) 2017-02-17 2018-02-13 반도체 디바이스 제작에서의 주석 옥사이드 막들

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US201762460573P 2017-02-17 2017-02-17
US62/460,573 2017-02-17
US201762479709P 2017-03-31 2017-03-31
US62/479,709 2017-03-31
US15/894,635 US10546748B2 (en) 2017-02-17 2018-02-12 Tin oxide films in semiconductor device manufacturing
US15/894,635 2018-02-12
KR1020197026772A KR102580008B1 (ko) 2017-02-17 2018-02-13 반도체 디바이스 제작에서의 주석 옥사이드 막들
PCT/US2018/018019 WO2018152115A1 (en) 2017-02-17 2018-02-13 Tin oxide films in semiconductor device manufacturing

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