KR20220132673A - 반도체 디바이스 제작에서의 주석 옥사이드 막들 - Google Patents
반도체 디바이스 제작에서의 주석 옥사이드 막들 Download PDFInfo
- Publication number
- KR20220132673A KR20220132673A KR1020227032676A KR20227032676A KR20220132673A KR 20220132673 A KR20220132673 A KR 20220132673A KR 1020227032676 A KR1020227032676 A KR 1020227032676A KR 20227032676 A KR20227032676 A KR 20227032676A KR 20220132673 A KR20220132673 A KR 20220132673A
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- Prior art keywords
- substrate
- tin oxide
- layer
- plasma
- etching
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Drying Of Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Formation Of Insulating Films (AREA)
- Semiconductor Memories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020247002427A KR102829108B1 (ko) | 2017-02-17 | 2018-02-13 | 반도체 디바이스 제작에서의 주석 옥사이드 막들 |
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762460573P | 2017-02-17 | 2017-02-17 | |
| US62/460,573 | 2017-02-17 | ||
| US201762479709P | 2017-03-31 | 2017-03-31 | |
| US62/479,709 | 2017-03-31 | ||
| US15/894,635 US10546748B2 (en) | 2017-02-17 | 2018-02-12 | Tin oxide films in semiconductor device manufacturing |
| US15/894,635 | 2018-02-12 | ||
| KR1020197026772A KR102580008B1 (ko) | 2017-02-17 | 2018-02-13 | 반도체 디바이스 제작에서의 주석 옥사이드 막들 |
| PCT/US2018/018019 WO2018152115A1 (en) | 2017-02-17 | 2018-02-13 | Tin oxide films in semiconductor device manufacturing |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197026772A Division KR102580008B1 (ko) | 2017-02-17 | 2018-02-13 | 반도체 디바이스 제작에서의 주석 옥사이드 막들 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247002427A Division KR102829108B1 (ko) | 2017-02-17 | 2018-02-13 | 반도체 디바이스 제작에서의 주석 옥사이드 막들 |
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Families Citing this family (53)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12051589B2 (en) | 2016-06-28 | 2024-07-30 | Lam Research Corporation | Tin oxide thin film spacers in semiconductor device manufacturing |
| US9824893B1 (en) | 2016-06-28 | 2017-11-21 | Lam Research Corporation | Tin oxide thin film spacers in semiconductor device manufacturing |
| KR102722138B1 (ko) | 2017-02-13 | 2024-10-24 | 램 리써치 코포레이션 | 에어 갭들을 생성하는 방법 |
| US10546748B2 (en) | 2017-02-17 | 2020-01-28 | Lam Research Corporation | Tin oxide films in semiconductor device manufacturing |
| US10745282B2 (en) | 2017-06-08 | 2020-08-18 | Applied Materials, Inc. | Diamond-like carbon film |
| CN109545684B (zh) * | 2017-09-22 | 2020-11-27 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
| US10734238B2 (en) | 2017-11-21 | 2020-08-04 | Lam Research Corporation | Atomic layer deposition and etch in a single plasma chamber for critical dimension control |
| US10515815B2 (en) | 2017-11-21 | 2019-12-24 | Lam Research Corporation | Atomic layer deposition and etch in a single plasma chamber for fin field effect transistor formation |
| US10658174B2 (en) | 2017-11-21 | 2020-05-19 | Lam Research Corporation | Atomic layer deposition and etch for reducing roughness |
| US11276572B2 (en) * | 2017-12-08 | 2022-03-15 | Tokyo Electron Limited | Technique for multi-patterning substrates |
| US10446394B2 (en) * | 2018-01-26 | 2019-10-15 | Lam Research Corporation | Spacer profile control using atomic layer deposition in a multiple patterning process |
| US11355353B2 (en) | 2018-01-30 | 2022-06-07 | Lam Research Corporation | Tin oxide mandrels in patterning |
| KR102841279B1 (ko) | 2018-03-19 | 2025-07-31 | 램 리써치 코포레이션 | 챔퍼리스 (chamferless) 비아 통합 스킴 (scheme) |
| US20190385828A1 (en) * | 2018-06-19 | 2019-12-19 | Lam Research Corporation | Temperature control systems and methods for removing metal oxide films |
| US20190390341A1 (en) * | 2018-06-26 | 2019-12-26 | Lam Research Corporation | Deposition tool and method for depositing metal oxide films on organic materials |
| US10867804B2 (en) * | 2018-06-29 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Patterning method for semiconductor device and structures resulting therefrom |
| KR102733170B1 (ko) * | 2018-09-21 | 2024-11-21 | 램 리써치 코포레이션 | 금속-산화물 에칭 및 챔버 컴포넌트들 보호 |
| JP7565916B2 (ja) | 2018-10-05 | 2024-10-11 | ラム リサーチ コーポレーション | 処理チャンバの表面からの金属汚染物質の除去 |
| US10845704B2 (en) * | 2018-10-30 | 2020-11-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Extreme ultraviolet photolithography method with infiltration for enhanced sensitivity and etch resistance |
| US12248252B2 (en) * | 2018-11-16 | 2025-03-11 | Lam Research Corporation | Bubble defect reduction |
| TWI757659B (zh) * | 2018-11-23 | 2022-03-11 | 美商應用材料股份有限公司 | 碳膜的選擇性沉積及其用途 |
| CN111415860B (zh) * | 2019-01-07 | 2026-01-30 | 东京毅力科创株式会社 | 用于对基底进行多重图案化的方法 |
| US11189499B2 (en) * | 2019-03-28 | 2021-11-30 | Tokyo Electron Limited | Atomic layer etch (ALE) of tungsten or other metal layers |
| US11145509B2 (en) | 2019-05-24 | 2021-10-12 | Applied Materials, Inc. | Method for forming and patterning a layer and/or substrate |
| KR102748920B1 (ko) * | 2019-06-27 | 2024-12-30 | 램 리써치 코포레이션 | 교번하는 에칭 및 패시베이션 프로세스 |
| WO2021021279A1 (en) | 2019-08-01 | 2021-02-04 | Applied Materials, Inc. | Dose reduction of patterned metal oxide photoresists |
| JP7427155B2 (ja) * | 2019-08-23 | 2024-02-05 | 東京エレクトロン株式会社 | 別の金属及び誘電体に対してチューニング可能な選択性を有するチタン含有材料層の非プラズマエッチング |
| US11276560B2 (en) * | 2019-08-30 | 2022-03-15 | Mattson Technology, Inc. | Spacer etching process |
| WO2021158482A1 (en) * | 2020-02-03 | 2021-08-12 | Tokyo Electron Limited | Method for using ultra-thin etch stop layers in selective atomic layer etching |
| US11232952B2 (en) * | 2020-03-05 | 2022-01-25 | Nanya Technology Corporation | Semiconductor device structure with fine patterns and method for forming the same |
| US12191202B2 (en) * | 2020-05-15 | 2025-01-07 | Tokyo Electron Limited | Contact openings in semiconductor devices |
| EP3919979A1 (en) | 2020-06-02 | 2021-12-08 | Imec VZW | Resistless patterning mask |
| US11621172B2 (en) | 2020-07-01 | 2023-04-04 | Applied Materials, Inc. | Vapor phase thermal etch solutions for metal oxo photoresists |
| US12416863B2 (en) | 2020-07-01 | 2025-09-16 | Applied Materials, Inc. | Dry develop process of photoresist |
| CN115699255A (zh) * | 2020-07-02 | 2023-02-03 | 应用材料公司 | 用于光刻应用的光刻胶层上的碳的选择性沉积 |
| CN115735263A (zh) * | 2020-07-23 | 2023-03-03 | 朗姆研究公司 | 使用锡氧化物的先进自对准多重图案化 |
| CN115699266B (zh) | 2020-08-31 | 2025-11-07 | 株式会社力森诺科 | 等离子体蚀刻方法和半导体元件的制造方法 |
| WO2022099635A1 (zh) * | 2020-11-13 | 2022-05-19 | 苏州晶湛半导体有限公司 | 衬底及其制作方法 |
| CN116457919A (zh) * | 2020-12-15 | 2023-07-18 | 应用材料公司 | 用于半导体图案化应用的氧化锡及碳化锡材料 |
| KR20230147642A (ko) * | 2021-02-24 | 2023-10-23 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법 및 기판 처리 장치 |
| JP7773277B2 (ja) * | 2021-04-14 | 2025-11-19 | 東京エレクトロン株式会社 | 基板処理方法 |
| US12584216B2 (en) | 2021-04-21 | 2026-03-24 | Lam Research Corporation | Minimizing tin oxide chamber clean time |
| US20230028297A1 (en) * | 2021-07-23 | 2023-01-26 | Micron Technology, Inc. | Methods of forming an apparatus comprising silicon carbide materials and related microelectronic devices and systems |
| US12009211B2 (en) | 2021-11-12 | 2024-06-11 | Tokyo Electron Limited | Method for highly anisotropic etching of titanium oxide spacer using selective top-deposition |
| TWI773628B (zh) * | 2022-01-19 | 2022-08-01 | 華邦電子股份有限公司 | 半導體結構及其形成方法 |
| TWI821875B (zh) * | 2022-01-21 | 2023-11-11 | 力晶積成電子製造股份有限公司 | 半導體結構的製造方法 |
| US12438045B2 (en) * | 2022-03-07 | 2025-10-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure formation |
| CN120530478A (zh) * | 2023-01-27 | 2025-08-22 | 东京毅力科创株式会社 | 基板处理方法及基板处理系统 |
| US20240266149A1 (en) * | 2023-02-03 | 2024-08-08 | Tokyo Electron Limited | Methods for Semiconductor Process Chamber |
| KR20250017194A (ko) * | 2023-07-25 | 2025-02-04 | 주식회사 히타치하이테크 | 플라스마 처리 방법 |
| US20250046614A1 (en) * | 2023-07-31 | 2025-02-06 | Tokyo Electron Limited | SELECTIVE ATOMIC LAYER ETCH OF Si-BASED MATERIALS |
| TWI899624B (zh) * | 2023-08-24 | 2025-10-01 | 華邦電子股份有限公司 | 半導體結構及其形成方法 |
| EP4632881A1 (en) | 2023-09-12 | 2025-10-15 | LG Energy Solution, Ltd. | Cell assembly and battery pack including same |
Family Cites Families (196)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5826603B2 (ja) | 1976-09-01 | 1983-06-03 | 日電バリアン株式会社 | 透明導電膜のプラズマエツチング方法 |
| US4778562A (en) | 1984-08-13 | 1988-10-18 | General Motors Corporation | Reactive ion etching of tin oxide films using neutral reactant gas containing hydrogen |
| US4544444A (en) | 1984-08-15 | 1985-10-01 | General Motors Corporation | Reactive ion etching of tin oxide films using silicon tetrachloride reactant gas |
| JPS6151379A (ja) * | 1984-08-22 | 1986-03-13 | Fujitsu Ltd | カセツトキヤリヤ |
| JPS62136579A (ja) | 1985-12-09 | 1987-06-19 | Victor Co Of Japan Ltd | エツチング方法 |
| JPS62179774A (ja) | 1986-02-04 | 1987-08-06 | Fujitsu Ltd | イメ−ジセンサの製造方法 |
| US4708766A (en) | 1986-11-07 | 1987-11-24 | Texas Instruments Incorporated | Hydrogen iodide etch of tin oxide |
| US4750980A (en) | 1986-11-07 | 1988-06-14 | Texas Instruments Incorporated | Process for etching tin oxide |
| JP2593305B2 (ja) | 1987-02-02 | 1997-03-26 | 日本ペイント株式会社 | ポジ型感光性樹脂組成物 |
| JP2644758B2 (ja) * | 1987-07-22 | 1997-08-25 | 株式会社日立製作所 | レジスト除去方法及び装置 |
| US4824763A (en) | 1987-07-30 | 1989-04-25 | Ekc Technology, Inc. | Triamine positive photoresist stripping composition and prebaking process |
| JP3001891B2 (ja) * | 1987-10-01 | 2000-01-24 | グンゼ株式会社 | 透明導電膜のエッチング方法及びその装置 |
| JP3001894B2 (ja) | 1988-09-30 | 2000-01-24 | グンゼ株式会社 | 多層薄膜素子のエッチング方法及びその装置 |
| FR2640809B1 (fr) * | 1988-12-19 | 1993-10-22 | Chouan Yannick | Procede de gravure d'une couche d'oxyde metallique et depot simultane d'un film de polymere, application de ce procede a la fabrication d'un transistor |
| US4878993A (en) | 1988-12-22 | 1989-11-07 | North American Philips Corporation | Method of etching thin indium tin oxide films |
| JP2521815B2 (ja) * | 1989-08-17 | 1996-08-07 | 沖電気工業株式会社 | 透明導電膜のエッチング方法 |
| US5032221A (en) | 1990-05-07 | 1991-07-16 | Eastman Kodak Company | Etching indium tin oxide |
| US5171401A (en) | 1990-06-04 | 1992-12-15 | Eastman Kodak Company | Plasma etching indium tin oxide |
| US5318664A (en) | 1990-06-25 | 1994-06-07 | General Electric Company | Patterning of indium-tin oxide via selective reactive ion etching |
| JPH05267701A (ja) * | 1992-03-18 | 1993-10-15 | Taiyo Yuden Co Ltd | 酸化錫透明導電膜のパターニング方法 |
| RU2053584C1 (ru) | 1992-05-26 | 1996-01-27 | Научно-исследовательский институт измерительных систем | Способ формирования топологического рисунка пленки диоксида олова |
| JPH06151379A (ja) * | 1992-11-09 | 1994-05-31 | Hitachi Ltd | Itoのエッチング方法 |
| US5286337A (en) | 1993-01-25 | 1994-02-15 | North American Philips Corporation | Reactive ion etching or indium tin oxide |
| KR100290875B1 (ko) | 1993-04-20 | 2001-09-17 | 김영환 | 폴리머필림형성에의한이방성에치방법 |
| DE4337309A1 (de) | 1993-08-26 | 1995-03-02 | Leybold Ag | Verfahren und Vorrichtung zum Ätzen von dünnen Schichten, vorzugsweise von Indium-Zinn-Oxid-Schichten |
| JPH0781600A (ja) | 1993-09-09 | 1995-03-28 | Nissan Motor Co Ltd | 車両用操舵制御装置 |
| KR0135165B1 (ko) * | 1993-10-15 | 1998-04-22 | 윤정환 | 다층레지스트를 이용한 패턴형성방법 |
| US5723366A (en) | 1994-09-28 | 1998-03-03 | Sanyo Electric Co. Ltd. | Dry etching method, method of fabricating semiconductor device, and method of fabricating liquid crystal display device |
| JP3469955B2 (ja) | 1994-12-06 | 2003-11-25 | 東京エレクトロン株式会社 | エッチング方法 |
| US5607602A (en) | 1995-06-07 | 1997-03-04 | Applied Komatsu Technology, Inc. | High-rate dry-etch of indium and tin oxides by hydrogen and halogen radicals such as derived from HCl gas |
| JP4127869B2 (ja) | 1995-09-28 | 2008-07-30 | 三井化学株式会社 | 乾式エッチング方法 |
| US5843277A (en) | 1995-12-22 | 1998-12-01 | Applied Komatsu Technology, Inc. | Dry-etch of indium and tin oxides with C2H5I gas |
| US20020031920A1 (en) | 1996-01-16 | 2002-03-14 | Lyding Joseph W. | Deuterium treatment of semiconductor devices |
| JP3587622B2 (ja) | 1996-06-20 | 2004-11-10 | 三井化学株式会社 | エッチングガス |
| US5667631A (en) | 1996-06-28 | 1997-09-16 | Lam Research Corporation | Dry etching of transparent electrodes in a low pressure plasma reactor |
| EP0998758A1 (en) | 1997-06-25 | 2000-05-10 | Applied Komatsu Technology, Inc. | Dry-etching of indium and tin oxides |
| US6036876A (en) * | 1997-06-25 | 2000-03-14 | Applied Komatsu Technology, Inc. | Dry-etching of indium and tin oxides |
| TW328624B (en) | 1997-07-15 | 1998-03-21 | Powerchip Semiconductor Corp | The manufacturing method for MOS with gate-side air-gap structure |
| US20010008227A1 (en) * | 1997-08-08 | 2001-07-19 | Mitsuru Sadamoto | Dry etching method of metal oxide/photoresist film laminate |
| GB9726511D0 (en) | 1997-12-13 | 1998-02-11 | Philips Electronics Nv | Thin film transistors and electronic devices comprising such |
| US6083844A (en) | 1997-12-22 | 2000-07-04 | Lam Research Corporation | Techniques for etching an oxide layer |
| US6368978B1 (en) | 1999-03-04 | 2002-04-09 | Applied Materials, Inc. | Hydrogen-free method of plasma etching indium tin oxide |
| US6326301B1 (en) | 1999-07-13 | 2001-12-04 | Motorola, Inc. | Method for forming a dual inlaid copper interconnect structure |
| KR100327346B1 (ko) | 1999-07-20 | 2002-03-06 | 윤종용 | 선택적 폴리머 증착을 이용한 플라즈마 식각방법 및 이를이용한 콘택홀 형성방법 |
| JP4554011B2 (ja) | 1999-08-10 | 2010-09-29 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
| KR100447263B1 (ko) | 1999-12-30 | 2004-09-07 | 주식회사 하이닉스반도체 | 식각 폴리머를 이용한 반도체 소자의 제조방법 |
| US6789910B2 (en) | 2000-04-12 | 2004-09-14 | Semiconductor Energy Laboratory, Co., Ltd. | Illumination apparatus |
| KR100856451B1 (ko) | 2000-04-25 | 2008-09-04 | 도쿄엘렉트론가부시키가이샤 | 소재의 플라즈마 세정장치 및 방법 |
| US6580475B2 (en) | 2000-04-27 | 2003-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
| US6428859B1 (en) | 2000-12-06 | 2002-08-06 | Angstron Systems, Inc. | Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD) |
| US6416822B1 (en) | 2000-12-06 | 2002-07-09 | Angstrom Systems, Inc. | Continuous method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD) |
| US6750394B2 (en) | 2001-01-12 | 2004-06-15 | Sharp Kabushiki Kaisha | Thin-film solar cell and its manufacturing method |
| US6623653B2 (en) * | 2001-06-12 | 2003-09-23 | Sharp Laboratories Of America, Inc. | System and method for etching adjoining layers of silicon and indium tin oxide |
| JP2003068155A (ja) | 2001-08-30 | 2003-03-07 | Ulvac Japan Ltd | 透明導電性膜のドライエッチング方法 |
| US7547635B2 (en) | 2002-06-14 | 2009-06-16 | Lam Research Corporation | Process for etching dielectric films with improved resist and/or etch profile characteristics |
| KR100542736B1 (ko) | 2002-08-17 | 2006-01-11 | 삼성전자주식회사 | 원자층 증착법을 이용한 산화막의 형성방법 및 이를이용한 반도체 장치의 캐패시터 형성방법 |
| JP4748986B2 (ja) | 2002-11-01 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR100520680B1 (ko) * | 2003-06-30 | 2005-10-11 | 주식회사 하이닉스반도체 | 플래시 메모리소자의 플로팅 게이트 및 그 형성방법 |
| US6953705B2 (en) | 2003-07-22 | 2005-10-11 | E. I. Du Pont De Nemours And Company | Process for removing an organic layer during fabrication of an organic electronic device |
| KR100574952B1 (ko) | 2003-11-04 | 2006-05-02 | 삼성전자주식회사 | 스플릿 게이트형 비휘발성 반도체 메모리 소자 제조방법 |
| US7435610B2 (en) | 2003-12-31 | 2008-10-14 | Chung Yuan Christian University | Fabrication of array pH sensitive EGFET and its readout circuit |
| JP2005217240A (ja) | 2004-01-30 | 2005-08-11 | Matsushita Electric Ind Co Ltd | ドライエッチング装置およびドライエッチング方法 |
| JP4655939B2 (ja) | 2004-02-09 | 2011-03-23 | 旭硝子株式会社 | 透明電極の製造方法 |
| US7220687B2 (en) * | 2004-06-25 | 2007-05-22 | Applied Materials, Inc. | Method to improve water-barrier performance by changing film surface morphology |
| US7910288B2 (en) | 2004-09-01 | 2011-03-22 | Micron Technology, Inc. | Mask material conversion |
| US7355672B2 (en) | 2004-10-04 | 2008-04-08 | Asml Netherlands B.V. | Method for the removal of deposition on an optical element, method for the protection of an optical element, device manufacturing method, apparatus including an optical element, and lithographic apparatus |
| US7338907B2 (en) | 2004-10-04 | 2008-03-04 | Sharp Laboratories Of America, Inc. | Selective etching processes of silicon nitride and indium oxide thin films for FeRAM device applications |
| US7868304B2 (en) | 2005-02-07 | 2011-01-11 | Asml Netherlands B.V. | Method for removal of deposition on an optical element, lithographic apparatus, device manufacturing method, and device manufactured thereby |
| EP1707952A1 (de) | 2005-03-31 | 2006-10-04 | Micronas GmbH | Gassensitiver Feldeffekttransistor mit Luftspalt und Verfahren zu dessen Herstellung |
| DE102005031469A1 (de) | 2005-07-04 | 2007-01-11 | Merck Patent Gmbh | Medium zur Ätzung von oxidischen, transparenten, leitfähigen Schichten |
| JP5096669B2 (ja) | 2005-07-06 | 2012-12-12 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
| US7561247B2 (en) | 2005-08-22 | 2009-07-14 | Asml Netherlands B.V. | Method for the removal of deposition on an optical element, method for the protection of an optical element, device manufacturing method, apparatus including an optical element, and lithographic apparatus |
| US7393736B2 (en) | 2005-08-29 | 2008-07-01 | Micron Technology, Inc. | Atomic layer deposition of Zrx Hfy Sn1-x-y O2 films as high k gate dielectrics |
| US8317929B2 (en) | 2005-09-16 | 2012-11-27 | Asml Netherlands B.V. | Lithographic apparatus comprising an electrical discharge generator and method for cleaning an element of a lithographic apparatus |
| US7372058B2 (en) | 2005-09-27 | 2008-05-13 | Asml Netherlands B.V. | Ex-situ removal of deposition on an optical element |
| US7405160B2 (en) | 2005-12-13 | 2008-07-29 | Tokyo Electron Limited | Method of making semiconductor device |
| KR20070076721A (ko) | 2006-01-19 | 2007-07-25 | 삼성전자주식회사 | 웨이퍼의 박막 형성 공정 개선 방법 |
| JP4609335B2 (ja) | 2006-02-02 | 2011-01-12 | 富士電機システムズ株式会社 | 炭化珪素半導体基板のドライエッチング方法 |
| US20080061030A1 (en) | 2006-09-13 | 2008-03-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods for patterning indium tin oxide films |
| US7666578B2 (en) | 2006-09-14 | 2010-02-23 | Micron Technology, Inc. | Efficient pitch multiplication process |
| CN101153396B (zh) | 2006-09-30 | 2010-06-09 | 中芯国际集成电路制造(上海)有限公司 | 等离子刻蚀方法 |
| US7709056B2 (en) | 2007-05-16 | 2010-05-04 | Uchicago Argonne, Llc | Synthesis of transparent conducting oxide coatings |
| US7923373B2 (en) | 2007-06-04 | 2011-04-12 | Micron Technology, Inc. | Pitch multiplication using self-assembling materials |
| US7833893B2 (en) | 2007-07-10 | 2010-11-16 | International Business Machines Corporation | Method for forming conductive structures |
| KR100955265B1 (ko) | 2007-08-31 | 2010-04-30 | 주식회사 하이닉스반도체 | 반도체 소자의 미세패턴 형성방법 |
| US20100320457A1 (en) | 2007-11-22 | 2010-12-23 | Masahito Matsubara | Etching solution composition |
| US8349196B2 (en) | 2007-12-06 | 2013-01-08 | Intevac, Inc. | System and method for commercial fabrication of patterned media |
| US8247315B2 (en) | 2008-03-17 | 2012-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Plasma processing apparatus and method for manufacturing semiconductor device |
| US7811924B2 (en) * | 2008-06-16 | 2010-10-12 | Applied Materials, Inc. | Air gap formation and integration using a patterning cap |
| US8435608B1 (en) | 2008-06-27 | 2013-05-07 | Novellus Systems, Inc. | Methods of depositing smooth and conformal ashable hard mask films |
| FR2936651B1 (fr) | 2008-09-30 | 2011-04-08 | Commissariat Energie Atomique | Dispositif optoelectronique organique et son procede d'encapsulation. |
| JP5446648B2 (ja) | 2008-10-07 | 2014-03-19 | 信越化学工業株式会社 | パターン形成方法 |
| KR20100044029A (ko) | 2008-10-21 | 2010-04-29 | 주식회사 하이닉스반도체 | 반도체 소자의 제조 방법 |
| KR20100052598A (ko) | 2008-11-11 | 2010-05-20 | 삼성전자주식회사 | 미세 패턴의 형성방법 |
| US8492282B2 (en) * | 2008-11-24 | 2013-07-23 | Micron Technology, Inc. | Methods of forming a masking pattern for integrated circuits |
| KR101642384B1 (ko) | 2008-12-19 | 2016-07-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 트랜지스터의 제작 방법 |
| US9640396B2 (en) | 2009-01-07 | 2017-05-02 | Brewer Science Inc. | Spin-on spacer materials for double- and triple-patterning lithography |
| JP5356516B2 (ja) | 2009-05-20 | 2013-12-04 | 株式会社東芝 | 凹凸パターン形成方法 |
| TWD134077S1 (zh) | 2009-06-19 | 2010-04-01 | 林清智; | 沙發 |
| US8163094B1 (en) | 2009-07-23 | 2012-04-24 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Method to improve indium bump bonding via indium oxide removal using a multi-step plasma process |
| WO2011123675A1 (en) | 2010-04-01 | 2011-10-06 | President And Fellows Of Harvard College | Cyclic metal amides and vapor deposition using them |
| US9892917B2 (en) | 2010-04-15 | 2018-02-13 | Lam Research Corporation | Plasma assisted atomic layer deposition of multi-layer films for patterning applications |
| US9390909B2 (en) | 2013-11-07 | 2016-07-12 | Novellus Systems, Inc. | Soft landing nanolaminates for advanced patterning |
| US8435901B2 (en) | 2010-06-11 | 2013-05-07 | Tokyo Electron Limited | Method of selectively etching an insulation stack for a metal interconnect |
| US9487600B2 (en) | 2010-08-17 | 2016-11-08 | Uchicago Argonne, Llc | Ordered nanoscale domains by infiltration of block copolymers |
| JP2012099517A (ja) * | 2010-10-29 | 2012-05-24 | Sony Corp | 半導体装置及び半導体装置の製造方法 |
| US8747964B2 (en) | 2010-11-04 | 2014-06-10 | Novellus Systems, Inc. | Ion-induced atomic layer deposition of tantalum |
| US8901016B2 (en) | 2010-12-28 | 2014-12-02 | Asm Japan K.K. | Method of forming metal oxide hardmask |
| US9111775B2 (en) | 2011-01-28 | 2015-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Silicon structure and manufacturing methods thereof and of capacitor including silicon structure |
| KR20120125102A (ko) | 2011-05-06 | 2012-11-14 | 한국화학연구원 | 원자층 증착법을 이용한 주석산화물 박막의 제조방법 |
| KR20130015145A (ko) * | 2011-08-02 | 2013-02-13 | 삼성전자주식회사 | 반도체 소자의 미세 패턴 형성 방법 |
| US9190316B2 (en) | 2011-10-26 | 2015-11-17 | Globalfoundries U.S. 2 Llc | Low energy etch process for nitrogen-containing dielectric layer |
| TWI479663B (zh) * | 2011-12-22 | 2015-04-01 | 友達光電股份有限公司 | 陣列基板及其製作方法 |
| US8735993B2 (en) | 2012-01-31 | 2014-05-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFET body contact and method of making same |
| CN104115300B (zh) * | 2012-02-15 | 2017-02-22 | 应用材料公司 | 沉积包封膜的方法 |
| JP6015893B2 (ja) | 2012-02-28 | 2016-10-26 | 国立研究開発法人産業技術総合研究所 | 薄膜トランジスタの製造方法 |
| JP6004420B2 (ja) | 2012-03-14 | 2016-10-05 | 国立研究開発法人産業技術総合研究所 | 不揮発性化合物の除去方法 |
| WO2013141232A1 (ja) | 2012-03-23 | 2013-09-26 | 三洋電機株式会社 | 太陽電池及びその製造方法 |
| US8987047B2 (en) | 2012-04-02 | 2015-03-24 | Samsung Display Co., Ltd. | Thin film transistor, thin film transistor array panel including the same, and method of manufacturing the same |
| US10861978B2 (en) | 2012-04-02 | 2020-12-08 | Samsung Display Co., Ltd. | Display device |
| US9048294B2 (en) | 2012-04-13 | 2015-06-02 | Applied Materials, Inc. | Methods for depositing manganese and manganese nitrides |
| CN103426809B (zh) | 2012-05-18 | 2016-02-03 | 中芯国际集成电路制造(上海)有限公司 | 一种基于自对准双图案的半导体制造方法 |
| US8916477B2 (en) * | 2012-07-02 | 2014-12-23 | Novellus Systems, Inc. | Polysilicon etch with high selectivity |
| JPWO2014010310A1 (ja) | 2012-07-10 | 2016-06-20 | シャープ株式会社 | 半導体素子の製造方法 |
| US20140060574A1 (en) | 2012-09-04 | 2014-03-06 | Matheson Tri-Gas | In-situ tco chamber clean |
| JP2014086500A (ja) | 2012-10-22 | 2014-05-12 | Tokyo Electron Ltd | 銅層をエッチングする方法、及びマスク |
| SG2013083654A (en) | 2012-11-08 | 2014-06-27 | Novellus Systems Inc | Methods for depositing films on sensitive substrates |
| TWI539626B (zh) * | 2012-12-21 | 2016-06-21 | 鴻海精密工業股份有限公司 | 發光二極體及其製造方法 |
| WO2014103901A1 (en) | 2012-12-25 | 2014-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US9153486B2 (en) * | 2013-04-12 | 2015-10-06 | Lam Research Corporation | CVD based metal/semiconductor OHMIC contact for high volume manufacturing applications |
| US9437443B2 (en) | 2013-06-12 | 2016-09-06 | Globalfoundries Inc. | Low-temperature sidewall image transfer process using ALD metals, metal oxides and metal nitrides |
| JP6353636B2 (ja) | 2013-06-21 | 2018-07-04 | 東京エレクトロン株式会社 | 酸化チタン膜の除去方法および除去装置 |
| JP6164954B2 (ja) | 2013-07-02 | 2017-07-19 | 株式会社日立システムズ | 認証サーバ、認証方法、およびプログラム |
| KR20150012540A (ko) * | 2013-07-25 | 2015-02-04 | 삼성디스플레이 주식회사 | 유기발광표시장치의 제조방법. |
| US9310684B2 (en) | 2013-08-22 | 2016-04-12 | Inpria Corporation | Organometallic solution based high resolution patterning compositions |
| US9275873B2 (en) | 2013-09-26 | 2016-03-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Masking process and structures formed thereby |
| US9752422B2 (en) | 2013-11-04 | 2017-09-05 | Donaldson Engineering, Inc. | Direct electrical steam generation for downhole heavy oil stimulation |
| US9129906B2 (en) | 2013-12-05 | 2015-09-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Self-aligned double spacer patterning process |
| US9614053B2 (en) * | 2013-12-05 | 2017-04-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Spacers with rectangular profile and methods of forming the same |
| US9171703B2 (en) | 2013-12-20 | 2015-10-27 | Seagate Technology Llc | Apparatus with sidewall protection for features |
| US9379010B2 (en) | 2014-01-24 | 2016-06-28 | Intel Corporation | Methods for forming interconnect layers having tight pitch interconnect structures |
| WO2015115399A1 (ja) | 2014-01-28 | 2015-08-06 | 太陽化学工業株式会社 | 炭素膜を備える構造体及び炭素膜を形成する方法 |
| US9385028B2 (en) | 2014-02-03 | 2016-07-05 | Applied Materials, Inc. | Air gap process |
| US20150247238A1 (en) | 2014-03-03 | 2015-09-03 | Lam Research Corporation | Rf cycle purging to reduce surface roughness in metal oxide and metal nitride films |
| US9269590B2 (en) | 2014-04-07 | 2016-02-23 | Applied Materials, Inc. | Spacer formation |
| US9209038B2 (en) * | 2014-05-02 | 2015-12-08 | GlobalFoundries, Inc. | Methods for fabricating integrated circuits using self-aligned quadruple patterning |
| US9285673B2 (en) * | 2014-07-10 | 2016-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Assist feature for a photolithographic process |
| US9515156B2 (en) | 2014-10-17 | 2016-12-06 | Lam Research Corporation | Air gap spacer integration for improved fin device performance |
| US9640371B2 (en) | 2014-10-20 | 2017-05-02 | Lam Research Corporation | System and method for detecting a process point in multi-mode pulse processes |
| KR102952227B1 (ko) | 2014-10-23 | 2026-04-13 | 인프리아 코포레이션 | 유기 금속 용액 기반의 고해상도 패터닝 조성물 및 상응하는 방법 |
| US11114742B2 (en) | 2014-11-25 | 2021-09-07 | View, Inc. | Window antennas |
| TWI633596B (zh) * | 2015-01-14 | 2018-08-21 | 聯華電子股份有限公司 | 形成溝渠的方法 |
| US9673059B2 (en) | 2015-02-02 | 2017-06-06 | Tokyo Electron Limited | Method for increasing pattern density in self-aligned patterning integration schemes |
| US9478433B1 (en) | 2015-03-30 | 2016-10-25 | Applied Materials, Inc. | Cyclic spacer etching process with improved profile control |
| WO2016161287A1 (en) | 2015-04-02 | 2016-10-06 | Tokyo Electron Limited | Trench and hole patterning with euv resists using dual frequency capacitively coupled plasma (ccp) |
| KR102329363B1 (ko) | 2015-04-20 | 2021-11-19 | 보드 오브 레젼츠, 더 유니버시티 오브 텍사스 시스템 | 대면적 다단 나노구조의 제조 |
| US9806252B2 (en) * | 2015-04-20 | 2017-10-31 | Lam Research Corporation | Dry plasma etch method to pattern MRAM stack |
| US9870899B2 (en) | 2015-04-24 | 2018-01-16 | Lam Research Corporation | Cobalt etch back |
| US10049892B2 (en) | 2015-05-07 | 2018-08-14 | Tokyo Electron Limited | Method for processing photoresist materials and structures |
| KR102399578B1 (ko) | 2015-06-05 | 2022-05-17 | 램 리써치 코포레이션 | GaN 및 다른 III-V 족 재료들의 원자층 에칭 |
| US9653571B2 (en) | 2015-06-15 | 2017-05-16 | International Business Machines Corporation | Freestanding spacer having sub-lithographic lateral dimension and method of forming same |
| CN107924816B (zh) | 2015-06-26 | 2021-08-31 | 东京毅力科创株式会社 | 具有含硅减反射涂层或硅氧氮化物相对于不同膜或掩模的可控蚀刻选择性的气相蚀刻 |
| US9523148B1 (en) | 2015-08-25 | 2016-12-20 | Asm Ip Holdings B.V. | Process for deposition of titanium oxynitride for use in integrated circuit fabrication |
| KR102508142B1 (ko) | 2015-10-13 | 2023-03-08 | 인프리아 코포레이션 | 유기주석 옥사이드 하이드록사이드 패터닝 조성물, 전구체 및 패터닝 |
| US9996004B2 (en) | 2015-11-20 | 2018-06-12 | Lam Research Corporation | EUV photopatterning of vapor-deposited metal oxide-containing hardmasks |
| US10229837B2 (en) | 2016-02-04 | 2019-03-12 | Lam Research Corporation | Control of directionality in atomic layer etching |
| TWI661466B (zh) | 2016-04-14 | 2019-06-01 | Tokyo Electron Limited | 使用具有多種材料之一層的基板圖案化方法 |
| US9824893B1 (en) | 2016-06-28 | 2017-11-21 | Lam Research Corporation | Tin oxide thin film spacers in semiconductor device manufacturing |
| US12051589B2 (en) | 2016-06-28 | 2024-07-30 | Lam Research Corporation | Tin oxide thin film spacers in semiconductor device manufacturing |
| US9997369B2 (en) | 2016-09-27 | 2018-06-12 | International Business Machines Corporation | Margin for fin cut using self-aligned triple patterning |
| US9859153B1 (en) | 2016-11-14 | 2018-01-02 | Lam Research Corporation | Deposition of aluminum oxide etch stop layers |
| CN108321079B (zh) | 2017-01-16 | 2021-02-02 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
| KR102722138B1 (ko) | 2017-02-13 | 2024-10-24 | 램 리써치 코포레이션 | 에어 갭들을 생성하는 방법 |
| US10546748B2 (en) | 2017-02-17 | 2020-01-28 | Lam Research Corporation | Tin oxide films in semiconductor device manufacturing |
| JP2018160556A (ja) | 2017-03-23 | 2018-10-11 | 三菱電機株式会社 | 薄膜トランジスタ基板、薄膜トランジスタ基板の製造方法、液晶表示装置、および薄膜トランジスタ |
| US10559461B2 (en) | 2017-04-19 | 2020-02-11 | Lam Research Corporation | Selective deposition with atomic layer etch reset |
| US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
| US11075079B2 (en) | 2017-11-21 | 2021-07-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Directional deposition for semiconductor fabrication |
| US11355353B2 (en) | 2018-01-30 | 2022-06-07 | Lam Research Corporation | Tin oxide mandrels in patterning |
| KR102841279B1 (ko) | 2018-03-19 | 2025-07-31 | 램 리써치 코포레이션 | 챔퍼리스 (chamferless) 비아 통합 스킴 (scheme) |
| CA3219374A1 (en) | 2018-04-11 | 2019-10-17 | Inpria Corporation | Monoalkyl tin compounds with low polyalkyl contamination, their compositions and methods |
| WO2019216092A1 (ja) | 2018-05-08 | 2019-11-14 | ソニーセミコンダクタソリューションズ株式会社 | 酸化物半導体膜のエッチング方法および酸化物半導体加工物ならびに電子デバイス |
| KR20200144580A (ko) | 2018-05-11 | 2020-12-29 | 램 리써치 코포레이션 | Euv 패터닝 가능한 하드 마스크들을 제조하기 위한 방법들 |
| US20190390341A1 (en) | 2018-06-26 | 2019-12-26 | Lam Research Corporation | Deposition tool and method for depositing metal oxide films on organic materials |
| US10867804B2 (en) | 2018-06-29 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Patterning method for semiconductor device and structures resulting therefrom |
| US10840082B2 (en) | 2018-08-09 | 2020-11-17 | Lam Research Corporation | Method to clean SnO2 film from chamber |
| US10845704B2 (en) | 2018-10-30 | 2020-11-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Extreme ultraviolet photolithography method with infiltration for enhanced sensitivity and etch resistance |
| KR102748920B1 (ko) | 2019-06-27 | 2024-12-30 | 램 리써치 코포레이션 | 교번하는 에칭 및 패시베이션 프로세스 |
| US11551038B2 (en) | 2019-07-01 | 2023-01-10 | Adobe Inc. | Unified shape representation |
| KR102577300B1 (ko) | 2020-04-17 | 2023-09-08 | 삼성에스디아이 주식회사 | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 |
| CN115698372A (zh) | 2020-06-15 | 2023-02-03 | 朗姆研究公司 | 在室清洁中的锡氧化物的移除 |
| CN115768777A (zh) | 2020-07-03 | 2023-03-07 | 恩特格里斯公司 | 制备有机锡化合物的方法 |
| US20220189771A1 (en) | 2020-12-10 | 2022-06-16 | Applied Materials, Inc. | Underlayer film for semiconductor device formation |
| KR20230146029A (ko) | 2021-02-12 | 2023-10-18 | 램 리서치 코포레이션 | 양자 효율 포토레지스트 및 이의 방법 |
| US12584216B2 (en) | 2021-04-21 | 2026-03-24 | Lam Research Corporation | Minimizing tin oxide chamber clean time |
| JP2024179774A (ja) | 2023-06-16 | 2024-12-26 | 矢崎総業株式会社 | コネクタ、コネクタ製造方法及びワイヤハーネス |
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