KR20140039253A - Semiconductor device inspection apparatus - Google Patents

Abstract

An apparatus for testing elements according to an embodiment of the present invention configures a shuttle plate to be able to attach and detach at a plate fixation unit by the simple operation of the plate detachable unit, wherein the shuttle plate transfers the elements transferred from a loading unit to a test unit and transfers the elements transferred from the test unit to an unloading unit. Therefore the shuttle plate on which the elements are mounted can be replaced easily when the type of element to be tested, especially the size of the element, changes.

Description

SEMICONDUCTOR DEVICE INSPECTION APPARATUS

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus for checking electrical characteristics of a element.

A semiconductor device (hereinafter referred to as an "element") is subjected to various tests such as electrical characteristics, reliability test for heat and pressure by a semiconductor device inspection apparatus after completion of a packaging process.

Inspection of devices can be carried out at room temperature tests conducted at room temperature depending on kinds of devices such as memory devices, non-memory devices such as CPU (Central Processing Unit), GPU (Graphic Processing Unit), LED devices and solar devices, There are various tests such as the heating test performed.

Meanwhile, as the types of IT devices such as smart phones, smart pads, smart TVs, and the like are becoming popular, demand for non-memory devices such as CPUs, that is, LSIs (Large Scale Integration) is rapidly increasing.

However, the LSI has a problem in that it is difficult to use an expensive inspection apparatus because the inspection quantity of the LSI is smaller than that of the standardized memory element inspection apparatus due to the characteristics of a small number of kinds.

It is an object of the present invention to provide an apparatus for inspecting various kinds of LSI devices while rapidly performing inspection of LSI devices of a small variety of types .

It is another object of the present invention to provide an element inspection apparatus which can easily maintain the maintenance of parts, thereby reducing the maintenance cost and remarkably reducing the production cost of the element.

It is still another object of the present invention to provide an element inspection apparatus capable of precisely performing a movement in a horizontal direction and a movement in a vertical direction of a device pressing tool for picking up an element and pressing it with a test socket.

According to an aspect of the present invention, there is provided an apparatus for inspecting an element, comprising: a loading unit for loading a plurality of elements; a test unit for testing a plurality of test sockets for testing the elements transferred from the loading unit; An unloading unit for classifying devices tested by the test unit according to a test result, and an unloading unit for transferring the devices transferred from the loading unit to the test unit and the devices transferred from the test unit to the unloading unit The shuttle plate includes a shuttle plate on which the device is mounted, a plate fixing portion to which the shuttle plate is detachably coupled, and a shuttle plate installed on the plate fixing portion, And a plate detachable portion for fixing the plate to the fixing portion.

The plate detachment unit may include a support fixed to the plate fixing unit, a fixture rotatably connected through a first hinge shaft provided on the support to selectively fix the shuttle plate, An elastic body elastically connecting to the first hinge axis; a pressing body formed in a curved surface to be in contact with the fixing body so as to press the fixing body; and a pressing member connected to the pressing body and movable in the vertical direction A handle rotatably connected to a second hinge shaft provided on the moving body, and a fixing hook provided on the supporting body and fixed to the end of the handle.

The shuttle portion may be provided with a guide rail to which the plate fixing portion is horizontally movable.

The plate fixing part may be provided with a heater for heating the device.

Further, in the device testing apparatus according to the embodiment of the present invention, the device is picked up from the shuttle plate of the shuttle unit, presses the device into the test socket, and transmits the tested device to the shuttle plate of the shuttle unit while being pressed into the test socket And may include one or more element pressing tools.

Here, the shuttle portion may include a first shuttle portion and a second shuttle portion disposed on both sides of the test socket of the test portion.

In this case, the element pressing tool may include a device for picking up an element from the shuttle plate of the first shuttle, pressurizing the test socket with the test socket, and delivering the tested device to the shuttle plate of the first shuttle, A second element pressing tool for picking up an element from the second shuttle part shuttle plate and pressing the test element with the test socket and delivering the tested element to the shuttle plate of the second shuttle part while being pressed into the test socket; . ≪ / RTI >

Meanwhile, the device testing apparatus according to the embodiment of the present invention further includes a cleaning unit installed on one side of the test unit to remove foreign substances from the test socket by spraying air in a state in which the test socket is covered by movement .

The cleaning unit may include a main body for covering the test socket and forming a cleaning space on the test socket, and a driving unit for moving the main body between one side of the test unit and the top of the test socket.

Here, the main body may be provided with an air flow path connected to the air supply device so as to inject air into each of the test sockets, and one or more nozzles receiving air from the air flow path and injecting air into the test socket have.

In addition, the main body is formed to maintain the closed state of the cleaning space, and the main body may be connected to the discharge pipe so that foreign matter together with the air sprayed through the nozzle is discharged to the outside from the cleaning space.

Meanwhile, the device testing apparatus according to the embodiment of the present invention further includes a loading buffer unit in which devices transferred from the loading unit are temporarily loaded, and an unloading buffer unit in which devices tested in the testing unit are temporarily loaded can do.

The device testing apparatus according to the embodiment of the present invention has an advantage that various types of LSI devices can be inspected while quickly inspecting LSI devices of a small variety of types.

In addition, the device testing apparatus according to the embodiment of the present invention has an advantage that the maintenance cost of the device can be reduced, and the production cost of the device can be remarkably reduced.

The device inspection apparatus according to the embodiment of the present invention further includes a vertical movement device for vertically moving the device pressing tool that picks up the device and presses the device with the test socket, The pressing tool is configured to be moved in the vertical direction, whereby there is an advantage that the moving position in the vertical direction of the element pressing tool can be accurately set.

In addition, a device testing apparatus according to an embodiment of the present invention includes: a support member for picking up a device and pressing the device with a test socket, the support member being removably installed on the support member; And at least one picker module to be coupled is advantageous in that maintenance of the element pressing tool is easy.

Further, the device testing apparatus according to the embodiment of the present invention may include a heater and at least one first connector for power supply and signal transmission to the temperature sensor, so that when the device and the picker module are combined, So that there is no need for a separate connection work for power supply and signal transmission, which makes it easy to manufacture and maintain the device.

Further, in the device testing apparatus according to the embodiment of the present invention, the device exchange between the test unit and the loading buffer unit, or the shuttle plate for device exchange between the test unit and the unloading buffer unit, The shuttle plate on which the device is mounted can be easily replaced when the type of the device to be inspected, in particular, the size of the device, is changed.

The apparatus for inspecting an element according to an embodiment of the present invention is characterized in that the apparatus is stopped for the replacement of the adsorption pad and the adsorption pad can be automatically replaced from the picker in comparison with the prior art in which the apparatus is manually restarted after replacement The provision of the adsorption pad exchanging unit also has the advantage that the productivity of the equipment can be greatly improved.

In addition, the device testing apparatus according to the embodiment of the present invention further includes a cleaning unit installed on one side of the test unit, for spraying air in a state in which the test socket is covered by movement, to remove foreign substances from the test socket There is an advantage in that foreign substances are present in the test socket to prevent a test error or a test operation from being impossible, thereby greatly improving the performance of the device.

1 is a plan view schematically showing an element inspection apparatus according to an embodiment of the present invention.
2 is a plan view schematically showing an example of a plate member of the loading buffer unit and the unloading buffer unit in the device testing apparatus of FIG.
3 is a cross-sectional view schematically showing the first shuttle portion and the second shuttle portion in the device testing apparatus of FIG.
FIG. 4 is a perspective view schematically showing a plate detachment section for fixing the shuttle plate to the plate fixing section in the first shuttle section and the second shuttle section of FIG. 3;
5 and 6 are schematic views for explaining the operation of the plate detachment unit of FIG.
7 is a cross-sectional view schematically showing a cleaning section in the element inspection apparatus of FIG.
8 is a plan view schematically showing a cleaning section in the element inspection apparatus of FIG.
Fig. 9 is a cross-sectional view showing the element pressing tool in the element testing apparatus of Fig. 1; Fig.
10 is a perspective view showing a support portion of the element pressing tool of FIG.
11 is a perspective view showing the picker module of the element pressing tool of Fig.
12 is a cross-sectional view for explaining an operation in which the picker module is coupled to the support in the element pressing tool of FIG.
13 and 14 are schematic diagrams showing a horizontal moving device and a vertical moving device for moving the device pressing tool in the horizontal direction and the vertical direction in the device testing apparatus of FIG.
Fig. 15 is a cross-sectional view schematically showing a horizontal moving device for moving the element pressing tool in the horizontal direction in the element testing apparatus of Fig. 1;
16 is a longitudinal sectional view schematically showing a vertical moving device for moving the element pressing tool in the vertical direction in the element testing apparatus of FIG.
17 is a perspective view showing a part of a picker and an adsorption pad provided in a loading transfer tool, an unloading transfer tool, or element pressing tool for transferring a device in the vertical transfer device of FIG.
Fig. 18 is a perspective view showing the structure of the adsorption pad exchange part for automatic exchange of adsorption pads in the picker of Fig. 17; Fig.
Figs. 19 to 21 are partial cross-sectional views of the adsorption pad exchange portion showing the process of exchanging adsorption pads from the picker of Fig.
Figs. 22 and 23 are partial plan views of the adsorption pad exchange portion showing a process of exchanging adsorption pads from the picker of Fig.

Hereinafter, a device testing apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 1, an apparatus for inspecting an element according to an embodiment includes: a loading unit 100 in which a plurality of elements 1 are loaded; A testing unit 300 for testing the elements 1 transferred from the loading unit 100; And an unloading unit 500 for sorting and loading the devices 1 according to a test result of the test unit 300. [

The device 1 to be tested can be a memory semiconductor, a non-memory device such as a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and a system LSI (Large Scale Integration). The element 1 may be a non-memory element, in particular, an element in which ball-shaped connecting terminals are formed on the bottom surface.

The method of transferring the elements 1 between the loading unit 100, the test unit 300, and the unloading unit 500 can be performed by various methods.

The loading unit 100 and the unloading unit 500 are configured such that one or more trays 2 loaded with a plurality of elements 1 are loaded, and various configurations are possible according to the design. The loading unit 100 and the unloading unit 500 may be provided with a tray loading unit (not shown) on which a plurality of trays 2 can be loaded.

For example, in the loading section 100, a plurality of trays 2 are appropriately arranged so that the elements 1 can be successively picked up and transported. The tray 2 from which the elements 1 are emptied can be replaced with the tray 2 filled with the elements 1. [ For example, a certain batch of trays 2 can be loaded into the tray loading section automatically or manually.

The empty tray 2 after the elements 1 are drawn out from the loading part 100 can be transferred to the unloading part 500 by a tray transfer part (not shown). It is also possible to prevent the tray 2 from being pulled out of the tray 2 before the empty tray 2 is transferred to the unloading section 500 (Inverted).

On the other hand, the unloading unit 500 may be configured similar to the loading unit 100. For example, in the unloading portion 500, a plurality of empty trays 2 may be appropriately disposed according to the sorting class so that the elements 1 can be sorted and stacked in succession according to the test result . In the unloading portion 500, the tray 2 filled with the tested elements 1 can be replaced with the empty tray 2.

A tray buffer unit (not shown) in which the empty tray 2 is temporarily loaded is additionally provided between the loading unit 100 and the unloading unit 500 so that the empty tray 2 can be temporarily loaded. Can be installed.

A plurality of receiving grooves 2a can be formed in the tray 2 so that a plurality of elements 1 can be loaded. For example, the plurality of receiving grooves 2a may be formed on the tray 2 in a matrix of 8x16 or the like.

As shown in Figures 1 and 2, the loading portion 100 and the test portion 300 (not shown) may be arranged so that the speed at which the element 1 is conveyed may be increased, or the plurality of elements 1 may be heated sufficiently A loading buffer unit 200 may be installed in which the elements 1 transferred from the tray 2 of the loading unit 100 are temporarily loaded. In order to increase the speed at which the element 1 is transferred, the testing unit 300 is provided at a position facing the loading buffer unit 200 with respect to the testing unit 300, The unloading buffer unit 400 may be temporarily loaded. Therefore, the device 1 to be tested can be transferred from the loading unit 100, temporarily loaded in the loading buffer unit 200 and then transferred to the test unit 300, May be transferred from the test unit 300 to temporarily be loaded in the unloading buffer unit 400 and then transferred to the unloading unit 500.

Particularly, in the loading buffer unit 200 and the unloading buffer unit 500, a relatively large number of elements 1 can be loaded in comparison with the tray 2 in which a relatively small number of elements 1 are loaded have.

2, the loading buffer unit 200 and the unloading buffer unit 400 include a plurality of loading grooves 211 and 411 formed on the upper surface thereof so that the plurality of elements 1 can be loaded thereon Like plate members 210 and 410 which are formed in a plate shape.

The plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 may be substantially identical to each other. However, if it is necessary to heat (preheat) the element 1 in order to test the element 1, a heating means such as a heater may be added to the plate member 210 of the loading buffer unit 200.

The loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 are arranged in the intervals of the test sockets 310 of the test unit 300 Or may be arranged to match the spacing of the receiving grooves 2a of the tray 2.

The intervals between the receiving grooves 2a of the tray 2 and the spacing between the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 The distance between the test receptacles 310 of the test part 300 may be n times, for example, twice as long as the distance between the receiving grooves 2a of the tray 2.

The plate members 210 and 410 are configured to temporarily load the elements 1 and exchange elements with the test unit 300. The plate members 210 and 410 may be fixedly installed inside the element inspection apparatus, And so on.

As shown in FIG. 1, the test unit 300 is for testing the device 1 transferred from the loading buffer unit 200, and can have various configurations according to the type of test. The test unit 300 is provided with a plurality of test sockets 310 through which the device 1 is transferred from the loading buffer unit 200 to be loaded. For example, a plurality of test sockets 310 may be provided with a terminal connected to a power source, so that a conduction test for the device 1 can be performed.

The test sockets 310 may be arranged in various matrices such as 8x2, 8x4, and so on. The test socket 310 is configured for connection with the terminal of the element 1 for testing the element 1, and various configurations are possible. Such a test socket 310 can be installed to be replaceable depending on the type of device, test type, and the like.

Meanwhile, the test unit 300 can be configured as a PCB board having a test socket 310, which is a simple structure, and can be independently configured as a modularized structure. In particular, when the test unit 300 is implemented as a PCB board having the test socket 310, the configuration cost of the test unit 300, which is relatively expensive, can be remarkably reduced.

Meanwhile, the test unit 300 can be variously tested, and more preferably, it can be configured to be tested at a room temperature or a room temperature or more.

Also, in the case of a test related to a temperature such as a high temperature test, the test unit 300 may be provided with a chamber member surrounding the area including the test socket 310 to minimize the temperature change.

The device exchange between the test unit 300 and the loading buffer unit 200 or between the test unit 300 and the unloading buffer unit 400 is not directly performed, 1 to the test unit 300 and to transfer the device 1 transferred from the test unit 300 to the unloading buffer unit 400. The shuttle units 610, The shuttle units 610 and 620 may have various configurations such as a device exchange between the test unit 300 and the loading buffer unit 200 or a device exchange between the test unit 300 and the unloading buffer unit 400 It is possible.

For example, as shown in FIGS. 1 and 3, the shuttle units 610 and 620 include a first element transfer position for receiving the element 1 from the loading unit 100, a first element transfer position for transferring the element 1 from the loading unit 100, A first shuttle part 610 which is moved between a device exchange position for exchanging the device 1 and a second device transfer position for transferring the device 1 to the unloading part 500, A first element transfer position for transferring the element 1, a device exchange position for exchanging the element 1 with the test portion 300 and a second element transfer position for transferring the element 1 to the unloading portion 500. [ And a second shuttle portion 620 that is moved between the transfer positions. Here, the first element transfer position, the element exchange position, and the second element transfer position may be variously arranged according to the configuration of the apparatus, and may be arranged in a straight line sequentially.

The first shuttle 610 and the second shuttle 620 may be disposed on both sides of the test socket 310 with the test socket 310 of the test unit 300 interposed therebetween. The first shuttle 610 and the second shuttle 620 include guide rails 611 and 621 installed opposite to each other with the test portion 300 as a center and guide rails 611 and 621 horizontally along the guide rails 611 and 621 A first element transfer position for receiving the element from the loading buffer unit 200, a device exchange position for the test unit 300, and a second element transfer position for transferring the element to the unloading buffer unit 400 One or more shuttle plates 612 and 622 which are alternately moved and on which the elements 1 are loaded and a plate 626 which is detachably coupled to the shuttle plates 612 and 622 and is adapted to be moved along the guide rails 611 and 621 And may include fixing portions 613 and 623.

The guide rails 611 and 621 can be variously configured to guide the movement of the shuttle plates 612 and 622.

The shuttle plates 612 and 622 are connected to the shuttle plates 612 and 622 so that the element 1 can be exchanged between the test unit 300 and the loading buffer unit 200 or between the test unit 300 and the unloading buffer unit 400. [ At least one element seating groove is formed.

The plate fixing portions 613 and 623 are provided for the convenience of replacement of the shuttle plates 612 and 622. The plate fixing portions 613 and 623 may be provided with a heater for heating the element 1 or the like. Since the shuttle plates 612 and 622 are detachably attached to the plate fixing portions 613 and 623 so that when the type of the element 1 to be inspected and particularly the size of the element 1 is changed, The shuttle plates 612 and 622 can be replaced.

The plate fixing portions 613 and 623 may be provided with plate detachable portions 614 and 624 for detachably fixing the shuttle plates 612 and 622 to the plate fixing portions 613 and 623. The plate detachable parts 614 and 624 can be variously configured as detachable attachment and detachment of the shuttle plates 612 and 622 at the plate fixing parts 613 and 623 and can be easily detached and attached to the shuttle plates 612 and 622 Lt; / RTI >

4 to 6, the plate detachable portions 614 and 624 include support bodies 614a and 624a fixed to the plate fixing portions 613 and 623, support bodies 614a and 624a, Fixed bodies 614b and 624b which are rotatably connected through first hinge shafts 614c and 624c provided on the first and second hinge shafts 614a and 624b and selectively fix the shuttle plates 612 and 622 by rotation, Elastic bodies 614d and 624d for elastically connecting the first and second hinge shafts 614a and 624b to the first hinge shafts 614c and 624c and a pressing surface contacting the fixing bodies 614b and 624b and contacting the fixing bodies 614b and 624b And press members 614i and 624i for pressing the fixed bodies 614b and 624b and movable in the vertical direction (Z-axis direction) inside the supports 614a and 624a, which are connected to the press members 614i and 624i Handles 614e and 624e which are rotatably connected to second hinge shafts 614f and 624f provided on the moving bodies 614e and 624e and second and third hinge shafts 614a and 624b which are rotatably connected to the supporting bodies 614a and 624a install And fixed hooks 614h and 624h to which the ends of the handles 614g and 624g are hooked and fixed.

The fixtures 614b and 624b may be formed in a bent shape substantially in the shape of the letter 'L' and the shuttle plates 612 and 622 may be formed by the bent portions contacting the edges of the shuttle plates 612 and 622, Can be fixed to the plate fixing portions 613 and 623.

The fixed hooks 614h and 624h are formed such that the operator can pinch the ends of the handles 614g and 624g by turning the handles 614g and 624g or release the hooks of the ends of the handles 614g and 624g .

According to this configuration, as the moving bodies 614e and 624e move in the vertical direction according to the displacements of the handles 614g and 624g, the pressing bodies 614i and 624i move in the vertical direction, The posture of the fixing bodies 614b and 624b can be changed according to the shape of the curved surface of the pressing surface of the pressing bodies 614i and 624i that are in contact with the fixing members 614a and 624b. When the posture of the fixing bodies 614b and 624b is changed, the posture of the fixing bodies 614b and 624b can be kept constant by the elastic force of the elastic bodies 614d and 624d.

The movement of the moving bodies 614e and 624e in the vertical direction can be performed by rotating the handles 614g and 624g around the second hinge shafts 614f and 624f. On the other hand, when the handles 614g and 624g are caught by the fixing hooks 614h and 624h, rotation of the handles 614g and 624g is limited, and accordingly, the movement of the moving bodies 614e and 624e and the pressing bodies 614i and 624i The movement in the vertical direction is restricted, so that the posture of the fixing bodies 614b and 624b can be prevented from being changed arbitrarily.

The handle 614g and 624g are fixed around the second hinge shafts 614f and 624f in a state where the shuttle plates 612 and 622 are fixed by the fixing bodies 614b and 624b as shown in Fig. The elastic force of the elastic members 614d and 624d is applied to the pressing members 614i and 624i and the moving members 614e and 624e while the elastic members 614d and 624d are rotated in the direction away from the hooks 614h and 624h The bodies 614i and 624i and the moving bodies 614e and 624e move downward and the positions of the pressing surfaces of the pressing bodies 614i and 624i contacting the fixing bodies 614b and 624b are changed, 624b are displaced from the shuttle plates 612, 622 (clockwise in Fig. 5) about the first hinge shafts 614c, 624c by the elastic force of the elastic members 614d, 624d, Thus, as shown in Fig. 6, the fixing of the shuttle plates 612 and 622 can be released.

6, when the shuttle plates 612 and 622 are unlocked, the handles 614g and 624g are pivoted about the second hinge shafts 614f and 624f by the fixing hooks 614h and 624h The pressing members 614i and 624i and the moving bodies 614e and 624e move in the upward direction in the process of rotating the pressing members 614i and 624i in the direction in which the pressing members 614i and 624i rotate (counterclockwise in Fig. 6) The positions of the pressing surfaces of the pressing members 614i and 624i that contact the fixing members 614b and 624b are changed so that the fixing members 614b and 624b are rotated about the first hinge shafts 614c and 624c, , The shuttle plates 612 and 622 are fixed by the fixing bodies 614b and 624b as shown in Fig. 5 (Fig. 6) . When the shuttle plates 612 and 622 are fixed by the fixed bodies 614b and 624b, the elastic forces of the elastic bodies 614d and 624d act on the fixed bodies 614b and 624b, Can be prevented from rotating arbitrarily.

As described above, according to the embodiment of the present invention, the plate detachable parts 614 and 624 for detachably fixing the shuttle plates 612 and 622 to the plate fixing parts 613 and 623 are provided with the handles 614g and 624g The shuttle plates 612 and 622 are configured to be able to perform an operation of releasing the fixing and unlocking of the shuttle plates 612 and 622 by a simple operation of rotating the shuttle plates 612 and 622, There is an effect that can be performed.

In this case, the test unit 300 stops the operation of the device testing apparatus, removes foreign substances by manual operation, and then performs device inspection There was a need to restart the device.

Therefore, a cleaning unit 700 for removing foreign substances from the test socket 310 by spraying air in a state in which the test socket 310 is installed in a state of being installed on one side of the test unit 300 is provided desirable.

The cleaning unit 700 may have various configurations. 7 and 8, the cleaning unit 700 includes a main body 710 for covering the test socket 310 and forming a cleaning space on the top of the test socket 310, And a driving unit 720 for moving the main body 710 between one side of the unit 300 and the top of the test socket 310.

The main body 710 may have various configurations such as a configuration for covering the test socket 310 and forming a cleaning space on the top of the test socket 310 and various shapes such as a bowl shape for forming a closed cleaning space Air is supplied from an air flow path 711 and an air flow path 711 connected to an air supply device (not shown) so as to inject air into each test socket 310, and air is injected into the test socket 310 One or more nozzles 712 may be provided.

In addition, the main body 710 can be connected to the discharge pipe 713 to discharge the foreign matter from the cleaning space to the outside together with the air sprayed through the nozzle 712.

The driving unit 720 may have various configurations such as a hydraulic cylinder and a pneumatic cylinder for moving the main body 710 between one side of the test unit 300 and the test socket 310.

When the guide rails 611 and 621 are provided in the first shuttle 610 and the second shuttle 620, the cleaning unit 700 is provided with the first shuttle 610 and the second shuttle 610, The driving unit 720 may be installed on the guide rail 620 to linearly move the main body 710 in a direction parallel to the guide rails 611 and 621.

One or more loading and unloading tools 810 (810) for transferring the element 1 from the loading unit 100 to the shuttle units 610 and 620 while being moved between the loading unit 100 and the shuttle units 610 and 620, , 814 can be installed. In this case, one loading / unloading tool 810, 814 moves between the loading unit 100 and the shuttle units 610, 620, picking up the devices 1 from the loading unit 100 and moving the shuttle units 610, 620, respectively. As described above, when the loading buffer unit 200 is installed, the loading and conveying tools 810 and 814 are arranged to pick up the element 1 from the loading unit 100 and transfer the element 1 to the loading buffer unit 200 1 loading transfer tool 810 and a second loading transfer tool 814 for picking up the element 1 from the loading buffer section 200 and transferring it to the shuttle sections 610 and 620.

In addition, one or more unloading and conveying tools (not shown) for picking up the devices 1 from the shuttle units 610 and 620 and transferring them to the unloading unit 500 while being moved between the shuttle units 610 and 620 and the unloading unit 500, (820, 824) can be installed. In this case, one unloading / conveying tool 820, 824 moves between the shuttle portions 610, 620 and the unloading portion 500 to pick up the element 1 from the shuttle portions 610, To the loading unit 500. When the unloading buffer unit 400 is installed as described above, the unloading and transferring tools 820 and 824 pick up the element 1 from the unloading buffer unit 400 and remove the unloading buffer unit 400 from the unloading unit 500, And a second unloading / transporting tool 824 for picking up the element 1 from the shuttle units 610 and 620 and transferring it to the unloading buffer unit 400. The first unloading / can do.

The loading transfer tool 810, 814 and the unloading transfer tool 820, 824 may be configured to be identical or similar to each other. The loading conveying tools 810 and 814 and the unloading and conveying tools 820 and 824 are provided with a plurality of pickers for picking up the element 1 and a plurality of pickers for picking up the elements 1 in the up and down direction And a driving device for driving movement of the plurality of pickers in the horizontal direction (XY direction) or the like.

The picker is composed of a suction pad for picking up the element 1 and transferring it to a predetermined position, which is capable of various configurations and forms a vacuum pressure on the upper surface of the element 1, and a pneumatic cylinder for transmitting air pressure to the suction pad .

The pickers are spaced from the receiving grooves 2a of the loading unit 100 and the tray 2 of the unloading unit 500 and between the loading buffer unit 200 and the plate members 210 and 410 of the unloading buffer unit 400 The vertical and vertical intervals can be adjusted in consideration of the case where the spacing between the loading grooves 211 and 411 of the semiconductor elements 10 is different from each other. However, in order to transfer a larger number of semiconductor elements 10, Can be fixed.

The driving device may be configured in various manners according to the driving mode of the pickers, and may include a vertical moving device for moving the pickers up and down, and a left and right moving device for moving in the horizontal direction. The up-and-down moving device may be configured to move the entire pickers up and down at a time, or may be separately connected to each of the pickers so that each of the pickers is independently moved up and down. The left-right moving apparatus can be configured in various ways according to the moving mode of the pickers, and can be configured to be capable of moving in a single direction in the X direction or in the Y direction, or in the X-Y direction.

Meanwhile, while moving between the test unit 300 and the shuttle units 610 and 620, the device 1 is picked up from the shuttle units 610 and 620 and pressurized by the test socket 310, Device pushing tools 830 and 840 for transferring the tested devices to the shuttle units 610 and 620 may be installed. The element pressing tools 830 and 840 are configured to transfer the element 1 between the test portion 300 and the first shuttle portion 610 and between the test portion 300 and the second shuttle portion 620, Various configurations are possible according to the transporting mode of the element 1. [ The element pressing tools 830 and 840 move between the first shuttle part 610 and the test part 300 to pick up the element 1 from the first shuttle part 610 and press the element 1 to the test socket 310 A first element pressing tool 830 for pressing the test socket 310 to transfer the tested element to the first shuttle 610 and a second element pressing tool 830 for moving the second shuttle 620 and the test part 300 The second shuttle 620 is configured to pick up the device 1 and pressurize it to the test socket 310 and press the test socket 310 to transfer the tested device to the second shuttle 620. [ Tool 840. < / RTI > As described above, when the element pressing tools 830 and 840 are constituted as a pair, the pair of element pressing tools 830 and 840 can be moved in conjunction with each other for convenience of device replacement.

9 to 12, the element pressing tools 830 and 840 may have the same or similar structure as the loading transfer tools 810 and 814 and the unloading and conveying tools 820 and 824, respectively have. The element pressing tools 830 and 840 may include a plurality of pickers 831 and 841 for picking up the element 1. [

The spacing between the loading grooves 211 and 411 of the plate members 210 and 410 may be set to be shorter than the interval between the element pressing tools 210 and 410, For example, 1/2 of the interval between the pickers 831 and 841 of the first and second optical pickups 830 and 840. Where n is a natural number greater than or equal to 2.

Particularly, the loading grooves 211 and 411 of the plate members 210 and 410 of the unloading buffer unit 400 are arranged in 16 × 8 and the test sockets 310 of the test unit 300 are arranged in 8 × 4 The element pressing tools 830 and 840 include pickers 831 and 841 arranged at 8 × 4 intervals corresponding to the test sockets 310 of the test portion 300 so that 8 × 4 elements (1). Particularly, when the pickers of the first loading transport tool 810 are arranged in 8x4 (8x2) so that a larger number of semiconductor elements 10 can be transported, the picker of the element pressing tools 830 and 840, (831, 841) may be arranged in 8x4 (8x2).

The element pressing tools 830 and 840 are disposed in the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400, It is unnecessary to adjust the interval between the pickers 831 and 841 by skipping or stacking, so that the device can be transported faster.

On the other hand, the element pressing tools 830 and 840 need to be replaced with the pickers 831 and 841 in accordance with the type and size of the element 1. [

9 to 12, the element pressing tools 830 and 840 include supporting portions 833 and 843 which are installed so as to be movable in the element testing apparatus, Detachably coupled and includes one or more picker modules 834 and 844 to which one or more pickers 831 and 841 are coupled.

The support portions 833 and 843 can be of any configuration as long as they can support the picker modules 834 and 844.

For example, a fastening unit 850 for fastening the support portions 833 and 843 and the picker modules 834 and 844 may be provided at one side of the support portions 833 and 843 and the picker modules 834 and 844, A first support unit 860 for supporting the picker modules 834 and 844 on the support portions 833 and 843 may be provided on the other side of the first and second pickers 833 and 843 and the picker modules 834 and 844. According to this configuration, the support portions 833 and 843 and the picker modules 834 and 844 can be fastened to each other by the fastening unit 850 in a state where they are supported by the first support unit 860.

The fastening unit 850 includes a ring 851 provided on one side of the picker modules 834 and 844 and a ring moving member 852 for moving the ring 851 in the up and down direction, And a hooking member 853 provided on the hook 851 and hooked on the hook 851. According to such a configuration, the ring 861 is hooked on the hooking member 853 and the hook 851 is pulled downward by using the hooking member 852, so that the hooks 833 and 843 and the picker module 834, and 844 can be fastened to each other.

The first supporting unit 860 includes a projecting piece 861 protruding from the other side of the picker modules 834 and 844 by a predetermined length and a projecting piece 861 provided on the other side of the supporting portions 833 and 843, And a protruding eccentric portion 862 fixed and fixed. The projecting and flattening portion 862 includes a first support member 863 projecting from the lower side of the support portions 833 and 843 by a predetermined length so as to provide a space into which the projecting piece 861 is inserted, And a second support member 864 which is supported by the support portion 863 and is spaced apart from the lower side of the support portions 833 and 843 by a predetermined distance. The second support member 864 is brought into contact with the projecting piece 861 so that the projecting piece 861 can be easily inserted into the space between the lower side of the support portions 833 and 843 and the second support member 864 It is preferable that the surface is formed as a curved surface. The projecting and unfixing portion 862 includes an elastic member 865 for elastically supporting the second supporting member 864 and a fixing member 866 for fixing the elastic member 865 to the supporting portions 833 and 843, . ≪ / RTI > The second supporting member 864 is resiliently supported by the elastic member 865 so that the protruding piece 861 can be easily inserted into the space between the lower side of the supporting portions 833 and 843 and the second supporting member 864 Can be inserted. After the protruding piece 861 is inserted into the space between the lower side of the supporting portions 833 and 843 and the second supporting member 864, the elastic member 865 presses the second supporting member 864 The protruded piece 861 can be firmly fixed so as not to be detached from the space between the lower side of the supporting portions 833 and 843 and the second supporting member 864.

According to such a configuration, the protruding piece 861 is inserted into the space between the lower side of the supporting portions 833 and 843 and the second supporting member 864, and the loop 851 is inserted into the hooking member 853 And the support portions 833 and 843 and the picker modules 834 and 844 can be coupled to each other by a simple operation of pulling the ring 851 downward by using the ring moving member 862.

The support portions 833 and 843 and the picker modules 834 and 844 are provided with support portions 833 and 843 so that the operation of coupling the support portions 833 and 843 and the picker modules 834 and 844 to each other can be more easily performed. And a second supporting unit 870 for guiding the upper side of the picker modules 834 and 844 to be in close contact with each other.

The second supporting unit 870 includes a protruding bar 871 protruding from the upper surface of the picker modules 834 and 844 and having a head 875 having a stepped portion formed thereon, A head receiving portion 872 in which the head 875 of the protruding bar 871 is received and a head insertion hole 874 into which the head 875 is inserted can be formed. The head 875 is received in the head receiving portion 872 through the head inserting hole 874 in the process of coupling the supporting portions 833 and 843 and the picker modules 834 and 844 to each other And the step portion of the head 875 is caught by the holding plate 873 by the relative horizontal movement of the picker modules 834 and 844 relative to the supporting portions 833 and 843, 834, 844 can be supported.

The second support unit 870 also serves to fix the support portions 833 and 843 and the picker modules 834 and 844 to each other so that the first support unit 860 and the second support unit 870 It is also possible to have a configuration in which only one is provided.

A positioning unit 880 is provided between the support portions 833 and 843 and the picker modules 834 and 844 to determine the coupling position between the support portions 833 and 843 and the picker modules 834 and 844 .

For example, the positioning unit 880 includes a protruding rod 881 protruding from the upper surface of the picker module 834, 844 and a protruding rod 881 penetrating from the lower side of the supports 833, 843, And may include a protruding bar insertion groove 882 to be inserted. According to this configuration, the protruding rods 881 are inserted into the protruding rod insertion grooves 882 while the supporting portions 833 and 843 and the picker modules 834 and 844 are coupled with each other, And the coupling positions of the picker modules 834 and 844 can be determined.

On the other hand, in a state where the supporting portions 833 and 843 and the picker modules 834 and 844 are coupled to each other, the lower side of the supporting portions 833 and 843 and the upper side of the picker modules 834 and 844 are brought into close contact with each other. A sensing sensor 889 for sensing that the lower surfaces of the support portions 833 and 843 and the upper surfaces of the picker modules 834 and 844 are in close contact with each other is provided in the support portions 833 and 843 or the picker modules 834 and 844 . The present invention is not limited to this and the sensor 889 may be disposed on the upper side of the support members 833 and 843 As shown in FIG. The sensing sensor 889 may be a pressure sensor that senses surface contact. It is possible to detect whether or not the lower side of the support portions 833 and 843 and the upper side of the picker module 834 and 844 are in close contact with each other by using the detection sensor 889. Based on the detection result, the support portions 833 and 843 And the picker modules 834 and 844 are coupled to each other.

It is preferable that the element pressing tools 830 and 840 for picking up the element 1 on the test part 300 are also configured to heat the element 1 as the test part 300 needs to perform the test under a certain temperature Do. Accordingly, the heaters 838 and 848 may be provided in the picker modules 834 and 844. [

In this case, the picker modules 834 and 844 are connected to the heaters 838 and 848 to directly sense the temperature of the heaters 838 and 848 or to be connected to other objects connected to the heaters 838 and 848, 838, and 848 may be further provided.

At this time, considering that the heaters 838 and 848 or the temperature sensors 832 and 842 are installed, the picker modules 834 and 844 may be provided with the supporting members 833 and 843 and the heat insulating members 835 and 845 for heat- And one or more first connectors 836 and 846 for power supply and signal transmission to the heaters 838 and 848 or the temperature sensors 832 and 842 may be provided.

The supporting portions 833 and 843 are connected to the first connectors 836 and 846 to be connected to the heaters 838 and 848 and the temperature sensors 832 and 842 when the first and second connectors 836 and 844 are coupled with the picker modules 834 and 844, And second connectors 837 and 847 for transmitting signals.

The terminals of the first connectors 836 and 846 and the terminals of the second connectors 837 and 847 can be electrically connected to each other by a method of being inserted into each other or the like.

The first and second connectors 836 and 847 and the first and second connectors 837 and 847 constitute the heater 838 and 837 by the coupling of the picker modules 834 and 844 and the supports 833 and 843 without any separate connection operation. , 848, and temperature sensors 832, 842, respectively. That is, the first connectors 836 and 846 and the second connectors 837 and 847 are provided at portions where the picker modules 834 and 844 and the supporting portions 833 and 843 are in contact with each other when the picker modules 834 and 844 And the supporting portions 833 and 843, respectively.

On the other hand, as described above, the element pressing tools 830 and 840 press the element 1 to the test socket 310 to firmly couple the element 1 to the test socket 310, The dampers 839 and 849 may be provided on the pickup modules 834 and 844 in order to buffer the force applied to the element 1 picked up by the pickers 831 and 841. [ For example, the dampers 839 and 849 may be provided with elastic films 839a and 849a and pressing members 839b and 849b for pressing the elastic membranes 839a and 849a when the element 1 is pressed , It is possible to buffer the force applied to the element 1 by the elasticity of the elastic films 839a and 849a. The force applied to the element 1 by the dampers 839 and 849 is buffered so that the element 1 is pressed against the test socket 310 while the element pressing tools 830 and 840 press the element 1 to the test socket 310 So that damage can be prevented.

The element pressing tools 830 and 840 are moved in the horizontal direction (Y-axis direction) and the vertical direction (X-axis direction) while the element pressing tools 830 and 840 are moved in the first shuttle part 610 and the second shuttle part 620, To the test socket 310 of the test section 310 and moves the tested device 1 from the test socket 310 to the first shuttle section 610 and the second shuttle section 620.

For example, as shown in FIG. 13 to FIG. 16, the horizontal movement (horizontal movement) of the element pressing tools 830 and 840, which are respectively connected with the element pressing tools 830 and 840, A device 801 is provided and a vertical moving device 802 is connected to each of the element pressing tools 830 and 840 so as to move the element pressing tools 830 and 840 in the vertical direction (Z axis direction).

The horizontal movement device 801 includes a connection member 830a and 840a extending in the vertical direction from the element pressing tools 830 and 840 and connected to the vertical movement direction of the support shafts 830a and 840a, And 840b and a horizontal driving unit 803 for moving the connecting members 830b and 840b in the horizontal direction.

The support shafts 830a and 840a are formed in the connection members 830b and 840b in such a manner that the support shafts 830a and 840a are vertically moved through the connection members 830b and 840b so that the movement of the support shafts 830a and 840a in the horizontal direction is restricted, Through holes 830c and 840c into which the support shafts 830a and 840a are inserted can be formed. As the supporting shafts 830a and 840a are inserted into the through holes 830c and 840c of the connecting members 830b and 840b, the horizontal movement of the supporting shafts 830a and 840a is transmitted to the connecting members 830b and 840b But the movement of the support shafts 830a and 840a in the vertical direction is not constrained. The through holes 830c and 840c can also serve to guide the movement of the support shafts 830a and 840a in the vertical direction.

The horizontal driving unit 803 includes a belt 803a connected to the connecting members 830b and 840b, a pulley 803b around which the belt 803a is wound, a rotary motor 803b connected to the pulley 803b Not shown). According to such a construction, the pulley 803b is rotated by the rotational force of the rotation motor (not shown), and the connecting members 830b and 840b connected to the belt 803a and the belt 803a by the rotation of the pulley 803b, The supporting shafts 830a and 840a and the element pressing tools 830 and 840 connected to the connecting members 830b and 840b can be moved in the horizontal direction. The present invention is not limited to this and may be applied to a case where the horizontal driving unit 803 is operated by hydraulic pressure or pneumatic pressure Various types of horizontal transfer mechanisms such as an actuator, a linear motor or a ball screw device may be used.

The vertical movement device 802 is configured to move the support shafts 830a and 840a extending in the vertical direction from the element pressing tools 830 and 840 in a vertical direction by restricting movement The cam followers 830e and 840e connected to the moving blocks 830d and 840d and the cam members 830g and 840f in which the cam grooves 830f and 840f into which the cam follower 830e and 840e are inserted are formed, And 840h connected to the moving blocks 830d and 840d and elevation guides 830h and 840h for guiding movement of the moving blocks 830d and 840d in the vertical direction.

The guide blocks 830i and 840i are connected to the ends of the support shafts 830a and 840a and extend in the horizontal direction to guide the movement of the support shafts 830a and 840a in the horizontal direction . Thus, the support shafts 830a and 840a can be moved in the horizontal direction along the guide rails 830i and 840i.

Driving motors 830j and 840j are connected to the cam members 830g and 840g so that the cam members 830g and 840g can be rotated by driving the driving motors 830j and 840j. The cam members 830g and 840g may be provided in pairs so as to be connected to the pair of element pressing tools 830 and 840, respectively.

The cam grooves 830f and 840f are formed to include a first radius section and a second radius section having a constant radius and a variable section connecting the first radius section and the second radius section. When the cam grooves 830f and 840f are configured as described above, the element pressing tools 830 and 840 are positioned on the upper side when the cam yarn movements 830e and 840e are in the first radius section having a small radius, The device pressing tools 830 and 840 are moved upward or downward when the moving cam followers 830e and 840e are in the variable section and the moving speed of the moving cam followers 830e and 840e is larger than that of the second The element pressing tools 830 and 840 are kept in a lower position.

The moving blocks 830d and 840d can be connected to the cam members 830g and 840g through insertion of the cam followers 830e and 840e into the cam grooves 830f and 840f. The moving blocks 830d and 840d are connected to the elevation guides 830h and 840h and can move up and down in the vertical direction. Therefore, when the cam members 830g and 840g are rotated, the cam followers 830e and 840e move in the vertical direction in accordance with the shapes of the cam grooves 830f and 840f, and thus are connected to the cam followers 830e and 840e The moving blocks 830d and 840d can be moved in the vertical direction and the element pressing tools 830 and 840 connected to the moving blocks 830d and 840d and the supporting shafts 830a and 840a can be moved in the vertical direction .

The elevation guides 830h and 840h can be fixed to the fixture 804 provided on the upper portions of the moving blocks 830d and 840d. However, the present invention is not limited to this, and various configurations can be used for the elevation guides 830h and 840h as long as it can guide the elevation of the moving blocks 830d and 840d.

According to such a configuration, the element pressing tools 830 and 840 are moved in the horizontal direction by the horizontal moving device 801, and thereby, between the first shuttle part 610 and the test socket 310, The element pressing tools 830 and 840 can be moved in the horizontal direction between the shuttle part 620 and the test socket 310. [ The element pressing tools 830 and 840 are vertically moved by the vertical movement device 802 in the upper part of the first shuttle part 610, the upper part of the second shuttle part 620 and the upper part of the test socket 310 The device 1 can be picked up or the device 1 can be loaded while being moved. These element pressing tools 830 and 840 move vertically at the top of the test socket 310 to move the element 1 to the test socket 310 in order to firmly couple the element 1 to the test socket 310 It is possible to perform the function of pressing with a constant force.

As described above, since the element pressing tools 830 and 840 are moved in the vertical direction in accordance with the rotation of the cam members 830g and 840g, the moving position of the element pressing tools 830 and 840 in the vertical direction can be accurately set .

On the other hand, the loading conveying tools 810 and 814 for unloading the element 1, the unloading and conveying tools 820 and 824, or the pickers 891 of the element pressing tools 830 and 840, An adsorption pad 892 having a material such as rubber is coupled to the end of the element 1 so as to facilitate adsorption of the element 1. When there is a change in the element 1 and there is a defect in adsorption due to wear, The adsorption pad 892 must be replaced.

However, the replacement of the adsorption pad 892 is performed by manual operation in the conventional case, so that the pickers 891 are separated and replaced one by one.

The present invention is characterized in that the adsorption pad 892 coupled to the pickers 891 of at least one of the loading transfer tools 810 and 814, the unloading and conveying tools 820 and 824 or the element pressing tools 830 and 840, The adsorbing pad exchanging part 900 can automatically exchange the adsorbing material. The picker 891 is provided with pickers 831 and 841 provided on the picking and element pressing tools 830 and 840 provided in the loading and conveying tools 810 and 814 and unloading and conveying tools 820 and 824, .

As shown in Figs. 18 to 23, the adsorption pad exchanging unit 900 considers the moving lines of the loading / conveying tools 810 and 814, the unloading / conveying tools 820 and 824 or the element pressing tools 830 and 840 A plurality of absorption pad accommodating portions 910 in which a plurality of absorption pad accommodating spaces 911 are formed in which the absorption pad 892 of the picker 891 is inserted and a plurality of absorption pad accommodating portions 911 And a suction pad pickup unit 920 installed at least partially to pick up the absorption pad accommodated in the absorption pad accommodation space 911.

At least a part of the absorption pad accommodating portions 910 provided with the absorption pad pickup portion 920 may be configured such that the absorption pad 892 can be separated and accommodated by the pad pickup portion 920 from the pickers 891. [ The adsorption pad accommodating space 911 is empty and at least a part of the adsorption pad accommodating portion 910 of the adsorption pad pick-up portions 920 is connected to a new adsorption pad (not shown) to be replaced by the picker 891 from which the adsorption pad 892 has been removed 892 are inserted.

The absorption pad accommodating portion 910 is formed by disposing a plurality of absorption pads 892 to separate and accommodate the absorption pad 892 from the pickers 891 by the pad pickup portion 920, And a new adsorption pad 892 to be replaced is inserted in the picker 891. [

As an example, the absorption pad receiving portion 910 may include a receiving portion main body 912 having a plurality of absorption pad receiving spaces 911 formed therein.

The accommodating portion main body 912 may have various configurations as a configuration in which the adsorption pad accommodating spaces 911 are formed.

The adsorption pad accommodating space 911 has a structure in which the adsorption pad 892 separated from the picker 891 is received or a new adsorption pad 892 to be coupled to the picker 891 from which the adsorption pad 892 is detached is housed If the absorption pad 892 can be accommodated, various configurations such as grooves are possible.

The absorption pad pickup section 920 is configured to separate the absorption pad 892 by the pad pickup section 920 from the picker 891. The absorption pad pickup section 920 is provided in the receiving section body 912, And is configured to be inserted into the adsorption pad accommodating space 911 in a state of being coupled to the adsorption pad 891 and then to pick up the adsorption pad 892. [

For example, the suction pad pickup unit 920 can be configured in various ways according to the pick-up method such as pick-up / pick-up release through engagement and release, clamping using a ring type clamper, Do.

As another example, the suction pad pickup unit 920 includes a moving member 921 which is installed to move in a direction parallel to the upper surface, that is, in a horizontal direction, while covering the upper surface of the receiving unit main body 912 .

At this time, the shifting member 921 can be variously configured as a structure for picking up / unlocking by engaging and releasing by horizontal movement. For example, as shown in Figs. 18 to 23, A plurality of penetrating portions 922 formed so as to penetrate through the suction pad accommodating space 911 while being coupled to the picker 891 and connected to each of the penetrating portions 922, Includes a plurality of engaging portions 923 formed to engage the adsorption pad 892 and move only the picker 891 when the engaging portion 892 is moved from the adsorption pad accommodating space 911 in a state of being coupled to the picker 891 .

Particularly, in order to enhance the hooking effect by the moving member 921, the attracting pad 892 may be formed with a protruding portion 892a that is more protruded than the outer circumferential surface of the picker 891, 891 and is smaller than the outer circumferential surface of the protrusion 892a so that the adsorption pad 892 can be caught when the picker 891 moves upward.

The shifting member 921 of the adsorption pad pickup section 920 has a maximum radius of the adsorption pad 892 in consideration of the difference in radius between the adsorption pad 892 and the picker 891 to which the adsorption pad 892 is coupled, By providing a larger penetration portion 922 and an engagement portion 923 having a small radius at least at a portion of the absorption pad 892 so that when the absorption pad 892 is inserted into the absorption pad accommodation space 911, It may be configured to position the penetration portion 922 on the space 911 and to position the engagement portion 923 when separating the adsorption pad 892 from the picker 891. [

The shifting member 921 of the suction pad pickup unit 920 is moved to the hooking and releasing position of the suction pad 892. Although not shown, the shifting member 921 of the suction pad pickup unit 920 is linearly moved by a linear moving device, The movement can be driven.

On the other hand, when it is desired to replace the adsorption pad 892 in the loading conveying tools 810 and 814, the unloading / conveying tools 820 and 824 or the picker 891 of the element pressing tools 830 and 840, 900 to the absorption pad accommodating portion 910 to which the absorption pad pickup portion 920 is coupled to separate the absorption pad 892 (Figs. 19 to 21), and then a new absorption pad 892 The new adsorption pad 892 is moved (FIG. 20 and FIG. 21) after moving to the accommodated adsorption pad receiving portion 910, and the device 1 is transferred after the replacement of the adsorption pad 892 is completed.

On the other hand, the configuration relating to the loading transfer tool 810, 814, the unloading / conveying tool 820, 824, or the element pressing tool 830, 840 for transferring the element 1 as described above may be performed in advance A device handler for performing a sorting process for performing sorting of devices according to a result of an inspection or for inspecting devices and for performing an inspecting and sorting process for sorting devices according to the inspections, The present invention can be applied to a device handler for transferring a plurality of elements by a transfer tool.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

1: device 310: test socket
610: first shuttle part 620: second shuttle part
611, 621: guide rails 612, 622: shuttle plate
613, 623: plate fixing portions 614, 624: plate detachment portion

Claims (1)

A loading section in which a plurality of elements are loaded;
A test unit provided with a plurality of test sockets for performing a test on elements transferred from the loading unit;
An unloading unit for classifying devices tested by the test unit according to a test result; And
And at least one shuttle part for transferring the element transferred from the loading part to the test part and transferring the element transferred from the test part to the unloading part,
The shuttle unit includes a shuttle plate on which the device is mounted, a plate fixing part to which the shuttle plate is detachably coupled, and a plate removing part installed on the plate fixing part to fix the shuttle plate to the plate fixing part. Device inspection apparatus characterized in that.

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