KR101588809B1 - Testing apparatus of device - Google Patents
Testing apparatus of device Download PDFInfo
- Publication number
- KR101588809B1 KR101588809B1 KR1020140147358A KR20140147358A KR101588809B1 KR 101588809 B1 KR101588809 B1 KR 101588809B1 KR 1020140147358 A KR1020140147358 A KR 1020140147358A KR 20140147358 A KR20140147358 A KR 20140147358A KR 101588809 B1 KR101588809 B1 KR 101588809B1
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- KR
- South Korea
- Prior art keywords
- disposed
- vacuum
- housing
- regulator
- lower plate
- Prior art date
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
BACKGROUND OF THE
Conventionally, in a device testing apparatus, a certain number of devices are transported in a test step of a semiconductor device, connected to a test head so that a test is performed, and the devices are sorted according to the result of the test and classified.
The handler for performing the above operation is complicated in the structure of the test tray such as the addition of a lead for connection with the socket provided in the test tray for each of the devices accommodated in the test tray, In addition, this increases the production cost.
Korean Patent Registration No. 0197285 (Patent Document 1) discloses a semiconductor device having a test head provided with a plurality of test sockets through which semiconductor devices to be inspected are inserted and electrically connected; 1. A member for moving a plurality of semiconductor devices to a test position above the test head, comprising: a boat having a plurality of receiving grooves for receiving a device and a plurality of through holes formed between the receiving grooves; A contact picker assembly mounted on the test head so as to be vertically movable, for picking up the device on the boat and directly connecting the socket to the socket of the test head; And the boat is moved from the initial position to the device retracting
The conventional device testing apparatus such as
SUMMARY OF THE INVENTION An object of the present invention is to provide a device testing apparatus capable of contacting a device with a test head with high accuracy.
It is another object of the present invention to provide a method of manufacturing a magnetic recording medium in which an error is not generated even when a device is moved using an elastic member and a steel ball, So that the precision of the device testing apparatus can be improved.
The device testing apparatus of the present invention includes: an upper plate having a plurality of compressed air fitting portions for supplying compressed air with an interval; A plurality of first and second housings disposed at lower portions of the upper plate at respective intervals; A lower plate disposed at a lower portion of the second housing and having a vacuum tube at one side thereof and a vacuum fitting portion for supplying a vacuum to the vacuum tube; A picker having a nozzle disposed at a lower portion of the lower plate and having a guide pin receiving portion formed at an interval therebetween and having a vacuum pad at its center; And a socket board in which a plurality of test sockets accommodating devices are disposed. The second housing and the lower plate are provided with first and second magnet members spaced apart from each other in order to compensate for errors generated during contact. .
The first and second housings of the present invention include an air hole formed on an upper surface thereof, a piston disposed below the air hole, a plurality of elastic members disposed in the piston and performing a damping action corresponding to the operation of the piston, A steel ball disposed at a lower portion of the elastic member, and a thrust bearing disposed at a lower portion of the steel ball.
The device testing apparatus of the present invention includes a plurality of solenoid valves connected to a compressed air fitting portion and a vacuum fitting portion, a vacuum generator connected to the solenoid valve and providing a vacuum to the vacuum fitting portion, And a control unit composed of a plurality of regulators for providing air of a predetermined pressure to the first and second regulators.
The device testing apparatus of the present invention is advantageous in that a predetermined pressure can be constantly maintained during device contact because the device testing apparatus is kept constant by using a regulator that automatically regulates the air pressure according to the size of the device.
The device testing apparatus of the present invention has an advantage that the device can be stably contacted and tested by allowing the device to be freely supported in fine movement using an elastic member and a steel ball and moving the device to its original position by using a magnet upon deformation have.
1 is a schematic perspective view of a device testing apparatus of the present invention,
FIG. 2 is a perspective view showing a contact device in which a top plate is removed from a device testing apparatus of the present invention,
3 is a cross-sectional view of a device testing apparatus of the present invention,
4 is a view showing a control part which is a main part of the present invention.
Hereinafter, an embodiment of a device testing apparatus according to the present invention will be described with reference to the accompanying drawings.
1 to 3, the
As shown in FIG. 1, the
As shown in FIGS. 2 and 3, the first and
As shown in FIGS. 2 and 3, the
The first and
As shown in FIG. 3, the
On the other hand, when the
As shown in FIG. 3, the
As shown in FIG. 3, the
4, the
In the plurality of
Accordingly, the plurality of regulators of the present invention are configured to control the pressure of the air more precisely because the regulator is used to reduce the pressure or to break the vacuum while adjusting the pressure of the air according to the size of the device 65.
Hereinafter, the operation of the device testing apparatus of the present invention will be described in detail.
First, the device 65 is stored (accommodated) in a plurality of
When the
The air compressed at the predetermined pressure pushes the
The
On the other hand, when the test of the device 65 is completed, the air passing through the
If the test operation of the device 65 is repeatedly performed as described above, the first and
As described above, the device testing apparatus of the present invention has an advantage that the device test can be stably performed by moving the deformation caused by the impact in the device testing to the original position using the first and second magnet members .
The device testing apparatus of the present invention can be widely applied to a handler for testing various kinds of semiconductor devices and a semiconductor testing apparatus like this.
10: Air hole 12: Compressed air fitting part
20: upper plate 25: piston
30: elastic member 40: first housing
50: second housing 55:
60: Lower plate 65: Device
70:
120:
Claims (9)
An upper plate having a plurality of pressurized air fitting portions for supplying compressed air and spaced apart from each other;
A plurality of first and second housings disposed at intervals below the upper plate, the first housing being vertically disposed on an upper portion of the second housing;
A lower plate disposed at a lower portion of the second housing and having a vacuum tube at one side thereof and a vacuum fitting portion for supplying a vacuum to the vacuum tube;
A picker having a nozzle disposed at a lower portion of the lower plate and having a guide pin receiving portion formed at an interval therebetween and having a vacuum pad at its center;
And a socket board in which a plurality of test sockets accommodating devices are arranged,
Wherein the first housing includes an air hole formed in an upper surface thereof, a piston disposed below the air hole, and a plurality of elastic members disposed in the piston and performing a damping action corresponding to the operation of the piston, A steel ball is disposed between the housing and the second housing, and the second housing has a thrust bearing disposed at a lower portion of the steel ball,
The first and second magnet members are disposed on the second housing and the lower plate at intervals so as to compensate for an error generated when the picker nozzle and the device are in contact with each other and the first magnet member is disposed on both sides of the second housing And the second magnet member is disposed on both sides of the lower plate, and the first and second magnet members are disposed in the vertical direction so as to face each other.
Wherein a piston of the first housing is provided with a lip o-ring at an outer periphery thereof.
Wherein the steel ball is disposed inside the extended portion formed in the gap to be centered while acting as a rolling bearing.
Wherein the first and second housings are fastened together by a fastening member and the second housing and the lower plate are fastened together by fastening members.
Wherein the first and second magnet members are formed of different magnetic poles.
The device testing apparatus includes a plurality of solenoid valves connected to a compressed air fitting portion and a vacuum fitting portion, a vacuum generator connected to the solenoid valve and providing a vacuum to the vacuum fitting portion, and a vacuum generator connected to the solenoid valve, Further comprising a control unit comprising a plurality of regulators for providing air of predetermined pressure or breaking vacuum.
The plurality of regulators are for setting a pressure according to the type of the device. The plurality of regulators include a main regulator, a primary regulator connected to the main regulator and breaking the vacuum, and a secondary regulator connected to the main regulator The device testing apparatus comprising:
Wherein the plurality of regulators are for setting a pressure according to the type of the device, and are constituted by a main regulator and a secondary regulator which is connected to the main regulator and which is an electropneumatic regulator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140147358A KR101588809B1 (en) | 2014-10-28 | 2014-10-28 | Testing apparatus of device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140147358A KR101588809B1 (en) | 2014-10-28 | 2014-10-28 | Testing apparatus of device |
Publications (1)
Publication Number | Publication Date |
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KR101588809B1 true KR101588809B1 (en) | 2016-01-26 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020140147358A KR101588809B1 (en) | 2014-10-28 | 2014-10-28 | Testing apparatus of device |
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KR (1) | KR101588809B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240012951A (en) * | 2022-07-21 | 2024-01-30 | 주식회사 티에프이 | Picker assembly for adsorbing semiconductor package |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100197285B1 (en) | 1994-05-31 | 1999-06-15 | 아다찌 마사루 | Clutch cover assembly having clutch disk wear compensation means |
KR200197285Y1 (en) * | 2000-04-14 | 2000-09-15 | 삼성전자주식회사 | Apparatus for testing semi-conductor device of test handler |
JP2001135649A (en) * | 1999-08-25 | 2001-05-18 | Ckd Corp | Lock device and tracing device using it |
KR20130099826A (en) * | 2012-02-29 | 2013-09-06 | (주)제이티 | Semiconductor device inspection apparatus |
-
2014
- 2014-10-28 KR KR1020140147358A patent/KR101588809B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100197285B1 (en) | 1994-05-31 | 1999-06-15 | 아다찌 마사루 | Clutch cover assembly having clutch disk wear compensation means |
JP2001135649A (en) * | 1999-08-25 | 2001-05-18 | Ckd Corp | Lock device and tracing device using it |
KR200197285Y1 (en) * | 2000-04-14 | 2000-09-15 | 삼성전자주식회사 | Apparatus for testing semi-conductor device of test handler |
KR20130099826A (en) * | 2012-02-29 | 2013-09-06 | (주)제이티 | Semiconductor device inspection apparatus |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240012951A (en) * | 2022-07-21 | 2024-01-30 | 주식회사 티에프이 | Picker assembly for adsorbing semiconductor package |
KR102679460B1 (en) * | 2022-07-21 | 2024-06-28 | 주식회사 티에프이 | Picker assembly for adsorbing semiconductor package |
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