KR200197285Y1 - Apparatus for testing semi-conductor device of test handler - Google Patents

Abstract

Disclosed is a device testing apparatus of a test handler that can directly test BGA, CSP, and TSOP type semiconductor devices by using a picker to test sockets. Disclosed is a boat in which a plurality of semiconductor devices to be tested are loaded, a contact picker assembly which picks a certain number of devices in the boat and connects it to a corresponding test socket of a test head, and for moving the contact picker assembly up and down. And means for moving the boat so that the lifting means and the contact picker assembly can pick up devices in the boat and connect them to the test sockets. The boat loads a plurality of semiconductor devices and moves them to a test position above the test head. The boat is formed with a plurality of device accommodation grooves and a plurality of through holes positioned between the storage grooves. Through the through-hole of the boat, the contact picker assembly descends to the test socket, allowing the device to be connected directly to the test socket for testing. On the other hand, the boat is moved in pitch units to a position moved by a certain distance from the initial position by the boat moving means, that is, the position where the contact picker assembly can descend via the through hole of the boat.

Description

Apparatus for testing semi-conductor device of test handler}

The present invention relates to a test handler used to test the function of an electronic component such as an integrated circuit (IC) or a semiconductor chip, and more particularly, to a device testing apparatus of a test handler capable of automatically testing BGA or CSP type semiconductor devices. .

A device manufactured through a predetermined assembly process in the manufacturing process of a semiconductor device is finally subjected to a test process for checking whether a predetermined function is exhibited. The test handler is used in the test process of the semiconductor device as described above, the test is carried out by carrying a predetermined number of devices connected to the test head, and the devices are classified and loaded according to the test results. Such a test handler has been developed and used in an appropriate form according to the shape and type of the semiconductor device.

Conventionally commonly used test handlers are configured to be suitable for testing devices of the shape in which electrodes (also called leads or pins) protrude out of the package. Here, the semiconductor devices are inserted into a device receiving groove formed in the test tray, and each of the receiving grooves is provided with a supporting mechanism called an insert to support the device. The test tray containing a plurality of devices moves along the main circuit of the test handler. When the test tray is located in the test chamber, each device contained in the test tray is raised by raising the test head provided in the test chamber. Is electrically connected to the socket of the test head to perform the test.

However, since the general test handler as described above has an indirect connection structure in which each device housed in the test tray is electrically connected to the socket of the test head through a separate lead provided in the test tray, the reliability of the test The problem is being raised in. In addition, the structure of the test tray is complicated, such as a support mechanism for supporting the device or a lead for connecting the socket to the test tray, which is not only difficult to manufacture the test tray but also increases the manufacturing cost. have.

Recently, due to the high integration of semiconductors, a ball grid array (BGA) or chip size package (CSP) type semiconductor device in which a plurality of electrodes are arranged in an area array form on a lower surface of a package has been developed and produced. In the CSP type semiconductor device, since the electrodes are arranged on the lower surface of the device, the test cannot be performed with a conventional test handler. Therefore, there is a demand for the development of equipment for automatically testing a BGA or CSP type semiconductor device.

The present invention has been made in view of the above, and it is possible to improve the electrical characteristics and simplify the structure of the test tray by picking each semiconductor device in the test tray and directly connecting it to the socket of the test head. Its purpose is to provide a device testing device for test handlers.

Another object of the present invention is to provide a device testing apparatus for a test handler that can automatically test a BGA or CSP type semiconductor device.

1 is a perspective view schematically showing a device testing apparatus of a test handler according to an embodiment of the present invention;

2a and 2b is a front view and a side view showing in detail the structure of the device testing apparatus shown in FIG.

3a and 3b is a plan view and a cross-sectional view showing the structure of the boat of the device testing apparatus according to the present invention,

4a and 4b is a plan view and a cross-sectional view showing the structure of the socket provided in the test head of the device testing apparatus according to the present invention,

5a and 5b is a plan view and a cross-sectional view showing the structure of the contact guide plate of the device testing apparatus according to the present invention,

6a and 6b are views for explaining the operation of the device testing apparatus according to the present invention, 6a is a front view showing the device is adsorbed by the picker, 6b is a device connected to the test socket by the picker Shown front view,

7 is a flowchart illustrating a device testing method of a test handler according to the present invention, and

FIG. 8 is a cross-sectional view of main parts showing a state in which a device is connected to a test socket improved to test a TSOP semiconductor device as a modification of the present invention.

Explanation of symbols on the main parts of the drawings

10; test head 11; test socket

12; connection pin 20; boat

22; device storage groove 23; through hole

25; grip groove 30; contact picker assembly

31; picker 33; vacuum pad

34; elevating plate 36; contact guide pin

38; buffer means 40; picker assembly lifting means

41; motor 42; pinion

43; rack bar 44; guide means

50; boat moving means 51; gripping member

52; turning part 52a; turning bar

52b; swing block 52c; pneumatic cylinder

53; drive part 53a; motor

53b; ball screw 53c; ball nut

53d; connecting member 60; contact guide plate

62; socket exposed hole 63; contact guide pin hole

The device testing apparatus of the test handler according to the present invention for achieving the above object is, a boat on which a plurality of semiconductor devices to be tested are loaded, a predetermined number of devices in the boat to pick the corresponding test socket of the test head A contact picker assembly for connecting to the lift picker, a lift means for moving the contact picker assembly up and down, and a means for moving the boat to allow the contact picker assembly to pick devices in the boat and connect them to the test socket.

The boat loads a plurality of semiconductor devices and moves them to a test position above the test head. The boat is formed with a plurality of device accommodation grooves and a plurality of through holes positioned between the storage grooves. Through the through-hole of the boat, the contact picker assembly descends to the test socket, allowing the device to be connected directly to the test socket for testing. On the other hand, the boat is moved in pitch units to a position moved by a certain distance from the initial position by the boat moving means, that is, the position where the contact picker assembly can descend via the through hole of the boat.

The contact picker assembly includes a plurality of pickers and a plurality of pickers in which four picker members each having a vacuum pad capable of adsorbing a device are arranged in a square and are installed on the upper part of the test head so as to be movable upward and downward. Lifting plates for supporting a plurality of pickers so as to simultaneously adsorb a certain number of devices in the boat and connect them to the test sockets, and the lifting plates and pickers, respectively, are provided to And buffer means for absorbing / relaxing.

The contact picker assembly elevating means is entered through the frame from a motor as a drive source provided on an upper side of the frame installed on the top of the contact picker assembly, a pinion coupled to the motor shaft, and an upper center of the contact picker assembly, A rack engaged with the pinion is formed along a longitudinal direction, and includes a rack bar that moves up and down as the motor is driven, and means for guiding the lifting motion of the contact picker assembly.

The boat moving means moves the boat from the initial position by a distance corresponding to 1/2 pitch of the device receiving groove pitch so that the contact picker assembly can be lowered to the test socket via the boat through hole while the device is picking the device. Ensure that the vacuum pad of the contact picker assembly and the through hole of the boat and the socket of the test head are in line. Here, at the initial position of the boat, the vacuum pad of the contact picker assembly and the device receiving groove of the boat are located in a straight line, so that the picker can suck the device. The boat moving means includes a gripping member rotatably installed adjacent to the boat so as to gripping the boat by being selectively inserted into a gripping groove formed on one side of the boat, and a gripping member such that the gripping member is inserted into the gripping groove. And a driving unit for linearly moving the holding member in a state in which the boat is held by the turning unit.

Here, the revolving part includes a revolving rod that rotatably supports the gripping member, a revolving block coupled to an end of the revolving rod, and a pneumatic cylinder for revolving the revolving block. The drive unit may include a motor serving as a driving source, a ball screw coupled to the motor shaft, a ball nut coupled to the ball screw to linearly move as the ball screw rotates, and connecting the ball nut to the pivot unit. A connecting member is provided.

According to a preferred embodiment of the present invention, the upper portion of the test head may be provided with a contact guide plate provided with a plurality of socket exposure holes for guiding the socket connection of the device by the picker. Each picker is provided with a plurality of pairs of contact guide pins, and the contact guide plate is formed with a plurality of contact guide pin holes into which the contact guide pins of the picker are inserted to guide the device connection position to the test socket. Can be.

In addition, the test socket is configured to have a connection pin arrangement structure capable of testing a BGA or CSP type semiconductor device, that is, a connection pin arrangement structure in which a plurality of connection pins are arranged in an area array form on the lower surface of the socket. This enables the automatic testing of BGA or CSP type semiconductor devices that could not be tested using conventional test handlers.

Further, the test socket may be configured to have a connection pin arrangement structure for testing a TSOP type semiconductor device, wherein the electrode of the device is connected to the lower end of the contact picker assembly when the device is connected to the test socket. Preferably, the pressing members of the non-conductor for pressing them against the connection pins are provided.

Objects and features of the present invention as described above will become more apparent by describing the preferred embodiments of the present invention in detail with reference to the accompanying drawings.

1 is a perspective view schematically showing a device testing apparatus of a test handler according to an embodiment of the present invention, Figures 2a and 2b is a front view and a side view showing in detail the structure of the device testing apparatus shown in Figure 1, Figure 3a And 3b is a plan view and a cross-sectional view showing the structure of the boat of the device testing apparatus according to the present invention, Figures 4a and 4b is a plan view and a cross-sectional view showing the structure of the socket provided in the test head of the device testing apparatus according to the present invention, and 5a and 5b are a plan view and a cross-sectional view showing the structure of the contact guide plate of the device testing apparatus according to the present invention.

In the drawings, reference numeral 10 is a test head, 20 is a boat, 30 is a contact picker assembly, 40 is a contact picker assembly lifting means, 50 is a boat moving means, and 60 is a contact guide plate.

The test head 10 is connected to a tester (not shown) and is located in a test chamber (not shown) of the test handler. The test head 10 is arranged with a plurality of test sockets 11 as shown in Figs. 4A and 4B. The semiconductor device to be tested is inserted into the test socket 11 and the test is performed in an electrically connected state. To this end, the test socket 11 is provided with a plurality of connection pins 12, which are arranged in an area array form on the entire lower surface of the socket to enable testing of BGA or CSP type semiconductor devices. do.

The boat 20 loads a plurality of devices to be tested and moves them to a test position on the test head 10. As shown in 3a and 3b, the boat 20 has a plurality of accommodating grooves 22 in which the device is accommodated in the boat body 21 having a substantially rectangular plate shape, and between the accommodating grooves 22. The through hole 23 having a predetermined size is formed. In the example of illustration, 32 device accommodating grooves 22 are arranged in four rows and eight columns, and an example of the boat 20 in which eighteen through holes 23 are formed between each column of the device accommodating grooves 22 is shown. However, the number of such device receiving groove 22 and the through hole 23 can be further increased.

The contact picker assembly 30 is installed on the test head 10 so as to be movable upward and downward. The contact picker assembly 30 is fixed in the device receiving groove 22 of the boat 20 moved to the test position above the test head 10. After picking up and increasing the number of devices, the device is inserted into the test socket 11 while descending to the test socket 11 through the through hole 23 of the boat 20 while the device is picked up. 11) allow electrical testing to proceed. This contact picker assembly 30 has a plurality of pickers 31, lifting plates 34 and cushioning means 38, as shown in Figs. 1, 2A and 2B.

Each of the pickers 31 includes four picker members 32 arranged in a substantially square shape, and end portions of the picker members 32 are provided with vacuum pads 33 for vacuum suction of the devices. In addition, a vacuum hole 32a is formed in each of the picker members 32 so as to reach a vacuum pad 33 at a lower portion thereof, and a vacuum hose 35 is connected to the vacuum hole 32a. The picker 31 is preferably configured in a group of four, so that 16 devices in the boat 20 can be picked at the same time, but is not necessarily limited to this, may be configured in any number and arrangement. . On the other hand, each of the pickers 31 as described above is provided with a pair of contact guide pins 36 in the substantially center portion of the picker member 32 disposed to face left and right in FIG. This will be described later.

The lifting plate 34 supports the plurality of pickers 31 so that the plurality of pickers 31 can move simultaneously to pick devices and connect the picked devices to the test sockets 11.

The buffer means 38 is configured between the plurality of pickers 31 and the lifting plate 34, respectively, the picker 31 is possible to flow in a predetermined gap range with respect to the lifting plate 34. The picker 31 is elastically connected to the elevating plate 34 so as to. The buffer means 38 is coupled to the first buffer plate 38a coupled to the upper portion of each picker 31 and to the lifting plate 34 at a position corresponding to the first buffer plate 38a, respectively. A plurality of connecting bars 38c for connecting the second buffer plate 38b, the first buffer plate 38a to the second buffer plate 38b so as to be able to flow within a predetermined range, and the plurality of connection bars 38c. On the connecting bar 38c, respectively. A plurality of compression coil springs 38d interposed therebetween and resiliently support the first buffer plate 38a downward with respect to the second buffer plate 38b. As a result, the picker 31 may elastically flow upon contact with the test socket 11 while safely connecting the device to the test socket 11.

The contact picker assembly elevating means 40 moves the contact picker assembly 30 up and down, thereby picking the device in its picker 31 and inserting the picked device into the test socket 11, It allows you to connect. As shown in Figs. 1, 2A and 2B, the elevating means 40 includes a motor 41, a pinion 42, a rack bar 43, and a guide means 44, which are driving sources.

The motor 41 is fixed and installed at an upper side of the frame 45 installed on the contact picker assembly 30, and an AC servo motor is used.

The pinion 42 is coupled to the shaft of the motor 41. In addition, the rack bar 43 is penetrated through the frame 45 from the upper center of the contact picker assembly 30, more specifically, from the upper center of the lifting plate 34, and the pinion 42 along the longitudinal direction. The rack 43a meshes with and is formed, and moves up and down as the motor 41 is driven.

The guide means 44 guides the lifting motion of the contact picker assembly 30, and a pair of guide shafts 44a penetrating through the frame 45 from both upper sides of the lifting plate 34 and the guide shaft 44a. And a pair of guide bushes 44b fixed to the frame 45 so as to support the guide sacks 44a to be movable.

The boat moving means 50 allows the boat 20 to descend to the test socket 11 via the through hole 23 of the boat 20 while the contact picker assembly 30 picks the device. ) Is moved from the initial position by a distance corresponding to 1/2 pitch of the pitch of the device receiving groove 22. This allows the contact picker assembly 30 to descend and pick the device while the boat 20 is in its initial position, and through the through hole 23 thereof while the boat 20 is moved in pitch units. The device can be connected to the test socket 11 while descending. The boat moving means 50 is provided with a holding member 51, the turning portion 52 and the drive unit (53).

The gripping member 51 is rotatably installed adjacent to the boat 20 to grip the boat 20 by being selectively inserted into the gripping groove 25 formed on one side of the boat 20. Here, the gripping grooves 25 may be formed at the front and rear ends of the boat 20, respectively, and may be formed in the gripping member 51 to correspond to the gripping grooves 25.

The pivot 52 supports the gripping member 51, and rotates the gripping member 51 at a predetermined angle so that the gripping member 51 is inserted into the gripping groove 25. The revolving part 52 includes a revolving rod 52a rotatably supporting the gripping member 51, a revolving block 52b coupled to an end of the revolving rod 52a, and the revolving block 52b. It is composed of a pneumatic cylinder (52c) connected to the opposite side of the pivoting rod (52a) of the pivoting block (52b). When the pneumatic cylinder (52c) is operated, the turning block 52b is turned, thereby turning the turning bar 52a connected to the end of the turning block 52b, the holding member 51 is The gripping groove 25 of the boat 20 is inserted.

The driving part 53 linearly moves the holding member 51 in a state in which the boat 20 is gripped by the turning part 52. The driving part 53 is a ball nut 53a which is a driving source, a ball screw 53b coupled to the motor shaft, and a ball nut coupled to the ball screw 53b to move linearly as the ball screw 53b rotates. 53c and the connection member 53d which connects the ball nut 53c and the swivel rod 52a of the said turning part. The revolving rod 52a is connected to the revolving block 52b while being rotatable through the connecting member 53d, and the revolving block 52b is supported on the rear surface of the connecting member 53d. When the motor 53a is driven by such a configuration, the ball nut 53c linearly moves along the ball screw 53b connected thereto. Thus, the ball nut 53c and the connection member 53d are used. The boat 20 is moved by the connected turning rod 52a moving in the traveling direction of the ball nut 53c.

On the other hand, the contact guide plate 60, as shown in Figure 2a, is installed on top of the test head 10, which serves to guide the socket connection of the device by the picker 31. As shown in FIGS. 5A and 5B, the contact guide plate 60 is arranged in the same arrangement as the arrangement of the plurality of test sockets 11 provided in the test head 10 inside the rectangular plate-shaped body 61. A plurality of socket exposed holes 62 are formed. The picker 31 inserts and connects the device to the test socket 11 via the socket exposure hole 62. In addition, the contact guide plate 60 is formed such that a plurality of contact guide pin holes 63 are disposed between the socket exposure holes 62. The contact guide pin hole 63 serves to guide the device connection to the test socket 11 by receiving the contact guide pin 36 provided therein when the picker 31 is lowered. The device can thereby be correctly inserted into the socket 11 and electrically connected to the socket 11.

Hereinafter, the operation of the device testing apparatus of the test handler according to the present invention configured as described above will be described with reference to FIGS. 6A and 6B and 7.

6A is a front view showing a state in which a device is adsorbed by the picker, and 6b is a front view showing a state in which the device is connected to the test socket by the picker. And, Figure 7 is a flow chart for explaining the device testing method of the test handler according to the present invention.

First, a plurality of devices to be tested by the device loading means (not shown) are loaded into the device receiving groove 22 of the boat 20 (S100). The boat 20 on which the device is loaded is moved to a test chamber (not shown) of the handler through a predetermined path, and is moved to a test position above the test head 10 located in the test chamber and stopped (S110). ).

When the boat 20 is moved to the upper portion of the test head 10 and stopped, the plurality of pickers 31 disposed thereon descend and vacuum pick up a predetermined number of devices in the boat 20 (S120). ). Here, the picker 31 which picked the device rises again to the initial position.

When the picker 31 picked up the device, the boat moving means 50 is operated to move the boat 20 by a distance corresponding to 1/2 the pitch of the device accommodation groove 22 from the initial position. The through hole 23 of the boat 20 is positioned on the lifting path of the picker 31 (S130).

Thereafter, the picker 31 descends to the test socket 11 via the through hole 23 of the boat 20 and inserts the picked device into the socket 11 so as to be electrically connected (S140). . At this time, since the picker 31 is in contact with the socket 11 while the shock absorbing means 38 elastically flows, a plurality of devices are uniformly connected to the connection pins 12 of the corresponding socket 11. Will be able to maintain. In this state, a predetermined test is performed (S150).

When the test is completed, the picker 31 is raised to the initial position via the through hole 23 of the boat 20 in the state of picking the device, and after the picker 31 is raised to the initial position, the boat ( 20 is returned to the initial position (S160).

When the boat 20 returns to the initial position, the picker 31 descends again to load the device into the receiving groove 22 of the boat 20 (S170). It rises again to the initial position (S180).

The above process is repeated until the test of all devices loaded on the boat 20 is completed.

As described above, the device testing apparatus of the test handler according to the present invention uses a plurality of device accommodating grooves 22 and a boat 20 in which a through hole 23 is formed between the accommodating grooves 22. First, a predetermined number of devices in the boat 20 are picked by the vacuum adsorption method using the picker 31, and then the boat 20 is connected to its through hole 23 and the socket of the test head 10 ( 11) moves the picker 31 to the socket 11 so as to coincide with it, and then lowers the picker 31 through the through hole 23 of the boat 20 to the socket 11 so that the picked device 31 is picked up by the socket 11. ) Directly.

Meanwhile, in the above description, a device for testing a BGA or CSP type semiconductor device in which a plurality of electrodes are arranged in an area array form on a bottom surface of a package has been described. It can also be used for testing TSOP semiconductor devices protruding from both sides of the package.

A main part of the device testing apparatus of the test handler partially improved to test the TSOP type semiconductor device as described above is shown in FIG. 8.

As shown, in the variant of the present invention, the connecting pins 12 'of the test socket 11' are arranged on both sides of the socket 11 'such that they are arranged in the same manner as the electrodes of the device 70. Then, the vacuum pad 33 'coupled to the end of the picker has a non-conductive pressing member 33'a for pressing the electrodes of the device 70 when the socket 70 of the device 70 is connected by the vacuum pad 33'. Is provided.

In addition, the other configuration and operation constituting the device testing apparatus is the same as the embodiment of the present invention described above, the detailed illustration and description will be omitted here.

As such, the present invention not only can directly test a BGA or CSP type semiconductor device by directly connecting it to a test socket, but also can perform a test automatically by connecting a TSOP type semiconductor device directly to a test socket through partial simple improvement. Can be.

According to the present invention as described above, since the device to be tested and the test socket are directly connected, the reliability of the inspection due to the improvement of the electrical characteristics can be improved.

In addition, since the boat does not need to install a separate insert or lead for connecting the device and the socket as in the prior art, the structure of the boat can be simplified, thus making the boat easy to manufacture and reducing the manufacturing cost. Can be saved.

In addition, BGA and CSP type semiconductor devices can be automatically tested as well as TSOP type semiconductor devices can be automatically tested through simple structure changes.

On the other hand, while shown and described with respect to the preferred embodiment of the present invention, but the present invention is not limited to the above embodiment, the field to which the subject innovation belongs without departing from the gist of the subject innovation claimed in the claims below Of course, any one of ordinary skill in the art that various modifications can be made, of course, such modifications are within the scope of the claims.

Claims (11)

A test head provided with a plurality of test sockets in which a semiconductor device as an object to be tested is inserted and electrically connected to the test object; A member for loading a plurality of semiconductor devices and moving them to a test position above the test head, the boat having a plurality of accommodation grooves in which the devices are stored and a plurality of through holes formed between the storage grooves; A contact picker assembly mounted on top of the test head, the contact picker assembly picking a device on the boat and directly connecting the socket to the test head; Elevating means for moving the contact picker assembly up and down; And Move the boat by a distance corresponding to 1/2 pitch of the device receiving groove pitch from the initial position so that the contact picker assembly can be lowered to the test socket via the through hole of the boat while the device is picking the device. And a means for testing the device of a test handler. The method of claim 1, wherein the contact picker assembly, A plurality of pickers in which four picker members each having a vacuum pad capable of absorbing a device at an end thereof are arranged in a square shape; An elevating plate for supporting the plurality of pickers such that the plurality of pickers simultaneously adsorbs a certain number of devices on the boat and connects them to a test socket; And And buffering means configured to respectively absorb between the lifting plate and the picker to absorb / mitigate an impact generated when the device is connected to the socket by the picker. The method of claim 2, wherein the buffer means, A first buffer plate coupled to an upper portion of each picker; Second buffer plates respectively coupled to the lifting plates at positions corresponding to the first buffer plates; A plurality of connecting bars connecting the first buffer plate and the second buffer plate so that the first buffer plate can flow within a predetermined gap with respect to the second buffer plate; And And a plurality of compression coil springs interposed in the plurality of connection bars to elastically support the first cushioning plate with respect to the second buffering plate, respectively. The contact guide plate of claim 2, wherein a plurality of contact guide pins are provided at an upper portion of the test head, the contact guide plate having a plurality of socket exposure holes for guiding socket connection of the device by the picker. And a plurality of contact guide pin holes through which the contact guide pin is inserted in the contact guide plate to guide the device connection position with respect to the test socket. According to claim 1, The contact picker assembly lifting means, A motor as a driving source fixed to an upper side of a frame installed on an upper portion of the contact picker assembly; A pinion coupled to the motor shaft; A rack bar penetrating through the frame from an upper center of the contact picker assembly, the rack bar being engaged with the pinion along a longitudinal direction, and moving up and down as the motor is driven; And And means for guiding the lifting motion of the contact picker assembly. 6. The apparatus of claim 5, wherein the guide means comprises: a pair of guide shafts penetrating through the frame from both upper sides of the contact picker assembly, and a pair of fixed to the frame to movably support the guide shaft. Device testing device for test handlers, characterized by a guide bush. According to claim 1, The boat moving means, A gripping member rotatably installed adjacent to the boat so as to grip the boat by being selectively inserted into a gripping groove formed on one side of the boat; A turning part for rotating the holding member at a predetermined angle so that the holding member is inserted into the holding groove; And And a driving unit for linearly moving the gripping member in a state of gripping the boat by the pivoting unit. The method of claim 7, wherein the turning portion, A pivoting rod rotatably supporting the gripping member; A swing block coupled to an end of the pivot rod; And Pneumatic cylinder for pivoting the swing block; Device testing apparatus of a test handler comprising a. The method of claim 7, wherein the driving unit, A motor which is a driving source; A ball screw coupled to the motor shaft; A ball nut coupled to the ball screw and linearly moving as the ball screw rotates; And And a connecting member connecting the ball nut and the pivot part. The device testing apparatus of claim 1, wherein the test socket has a connection pin arrangement structure for testing a BGA or CSP type semiconductor device. The test socket of claim 1, wherein the test socket has a connection pin arrangement structure for testing a TSOP type semiconductor device, wherein a lower end of the contact picker assembly is connected to the test socket when the device is connected to the test socket. Device testing apparatus for a test handler, characterized in that each pressing member of the non-conductor for pressing the electrodes against the connecting pin.