KR20050058554A - Transfer mechanism of semiconductor package - Google Patents

Abstract

The present invention relates to a semiconductor package transfer mechanism, and in particular, having a pair of semiconductor package transfer devices that operate independently of each other, each semiconductor package transfer device shares the semiconductor packages with each other and alternately transfers them to the vision inspection device, The transfer efficiency can be improved.

Description

Transfer mechanism of semiconductor package

The present invention relates to a semiconductor package transfer mechanism, and more particularly, to a pair of semiconductor package transfer devices that operate independently of each other, wherein each semiconductor package transfer device shares the semiconductor packages with each other and alternately transfers them to the vision inspection device. It relates to a semiconductor package transfer mechanism.

In general, the semiconductor package is subjected to a process of molding a resin paper on the upper surface of the semiconductor substrate after attaching a semiconductor chip (chip) having a high integrated circuit such as transistors and capacitors formed on a semiconductor substrate made of silicon. After the molding process, a solder ball (BGA), which acts as a lead frame, is adhered to a lower surface of the semiconductor substrate to make the chip energize, and then cut into individual semiconductor packages using a cutting device. This process is commonly referred to as singulation. After the singulation, after cleaning and drying to remove foreign substances on the surface of the semiconductor package, the individual semiconductor package is inspected for defects.

As such, the individual semiconductor packages that have been cut in the cutting device and subjected to the cleaning and drying processes are transferred to the vision inspection device by the semiconductor package transfer device.

The conventional semiconductor package transfer device is described in detail in the handler system for cutting a semiconductor package device (published no. 2002-0049954) and the semiconductor package stacking table apparatus (published no. 2002-0049956) previously filed and filed by the present applicant. Is disclosed.

1 to 3, such a conventional semiconductor transfer mechanism is disclosed.

Figure 1 is a plan view schematically showing a conventional semiconductor package transfer mechanism, Figures 2a to 2c is a view showing a conventional semiconductor package transfer device, Figure 3 is a plan view showing a turntable of the conventional semiconductor package transfer device to be.

Reference numeral S denotes a semiconductor package cutting machine, W denotes a semiconductor package washing machine, D denotes a semiconductor package drying machine, and T denotes a semiconductor package tray stacking device. Hereinafter, other configurations of the handler system including the above are described in the above publications, and thus, detailed descriptions thereof will be omitted, and description will be given focusing on the parts related to the semiconductor package transfer device and the transfer mechanism.

As shown in Figures 1 to 3, the conventional semiconductor package transfer device 10 is for receiving the dried semiconductor package from the drying device (D) for transfer to the vision inspection pickup device (20). The semiconductor package transfer device 10 includes a transfer guide rail 11, a horizontal transfer member 12 installed on the transfer guide rail 11, and a horizontal movement of the horizontal transfer member 12. Drive means (not shown), a servo motor 14 installed on the horizontal transfer member 12, and a turntable 15 installed to rotate by receiving rotational force from an upper portion of the servo motor 14. It is configured by. Here, the turntable 15 is a single body in which the first loading portion 16a and the second loading portion 16b are arranged side by side on the upper surface thereof, and the first loading portion 16a and the second loading portion 16b The loading groove 17 on which the semiconductor package is loaded and the free space portion 18 not loaded are arranged in a cross-matrix form. In addition, a guide inclined portion is formed at the edge portion of the loading groove 17.

In this way, the turntable pick-up device 40 is lowered from the upper part of the first loading part 16a in order to absorb the semiconductor package from the drying device D and load the semiconductor package on the turntable 15. Is loaded into the first loading portion 16a, and then rises again, moves to the upper portion of the second loading portion 16b, and then descends to load the second loading portion of the remaining semiconductor package into the second loading portion 16b. .

Therefore, since the dried semiconductor package is placed in the first loading portion 16a and the second loading portion 16b of the turntable 15 having the guide inclination portion, the semiconductor package is correctly loaded in the loading groove 17 without error. The semiconductor package supply failure rate is significantly reduced.

According to this configuration, however, even when the semiconductor package is completely loaded in the first loading portion 16a, the turntable 15 transfers the semiconductor package to the vision inspection portion until the remaining semiconductor packages are loaded in the second loading portion 16b. Can not. Therefore, the transfer operation is delayed, causing a problem that a package processing speed (UPH) per unit time of the semiconductor package handler device is lowered.

On the other hand, conventionally, the semiconductor package transferred by the semiconductor package transfer device was transferred to a single vision inspection device 30 to which a pair of vision inspection pick-up devices 20 which are installed oppositely are fixed. Although a fixed single vision inspection apparatus is provided, it is preferable that one vision inspection apparatus 30 is correspondingly installed on one picker. However, since the vision inspection apparatus 30 is expensive, a pair of pickup apparatuses are installed to share a single vision inspection apparatus by 1/2 to reduce the process cost.

However, since the vision inspection apparatus 30 is shared by the pair of pickup apparatuses, the vision inspection apparatus 30 can only utilize half of the vision inspection region when inspecting a package picked up by the pickup apparatus. There was a problem that the efficiency of the.

In addition, the conventional pickup inspection apparatus 20 for vision inspection has a problem that the pickup and transfer time is delayed because the vision inspection apparatus 30 absorbs and transports a larger amount of semiconductor packages than the vision inspection apparatus 30 can at once. . That is, since the vision inspection pick-up device 20 picks up and transports eight semiconductor packages in a row, the transfer is delayed until all eight are picked up, and vision inspection cannot be efficiently performed.

Accordingly, an object of the present invention has been proposed to solve the conventional problems as described above, the present invention is to provide a semiconductor package transfer mechanism in which a pair of independently operated transfer device to share the semiconductor package alternately transfer. .

Another object of the present invention is to provide a semiconductor package transfer mechanism capable of transferring a semiconductor package to a vision inspection apparatus more effectively by installing a plurality of sets of vision inspection pickup apparatuses that operate independently.

It is still another object of the present invention to provide a semiconductor package transfer mechanism in which a pickup device for vision inspection can pick up only the maximum photographing portion of the vision inspection device and immediately transfer it.

The object of the present invention is a semiconductor package transfer mechanism for transferring individual semiconductor packages that have undergone cutting, cleaning, and drying processes to a vision inspection device, the movable frame being movably installed along one direction axis, and rotating on the movable frame. It is possible to include a pair of semiconductor package transfer device consisting of a turntable is installed on the upper surface and the loading groove on which the semiconductor package is seated and the free space portion is not stacked in a matrix form, each of the semiconductor package transfer device is independent of each other It is achieved by providing a semiconductor package transfer mechanism which is controlled to operate so as to share the semiconductor package with each other to transfer to the vision inspection device alternately.

The loading grooves are formed symmetrically with each other on each turntable provided in the pair of transfer devices.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

4 is a plan view schematically showing a preferred embodiment of the semiconductor package transfer mechanism according to the present invention.

Here, reference numeral S denotes a semiconductor package cutting machine, W denotes a semiconductor package washing machine, D denotes a semiconductor package drying machine, and T denotes a semiconductor package tray stacking device. do. Hereinafter, a description will be given focusing on the parts related to the semiconductor package transfer device and the transfer mechanism.

As shown in FIG. 4, the semiconductor package transfer mechanism according to an embodiment of the present invention is composed of a semiconductor package transfer apparatus, a vision inspection pickup apparatus, and a vision inspection apparatus 300. The semiconductor package transfer device, the pickup device for vision inspection, and the vision inspection device 300 are naturally arranged in the order of process progress.

The semiconductor package transfer apparatus is configured to transfer the dried semiconductor package to the vision inspection unit, and includes a first transfer apparatus 100a and a second transfer apparatus 100b that operate independently. The first transfer device 100a and the second transfer device 100b are controlled to operate independently of each other, thereby sharing the semiconductor packages with each other and alternately transferring them to the vision inspection device 300.

5A to 5C are respectively a perspective view, a plan view, and a front view of the semiconductor package transfer device shown in FIG. 4, and FIG. 6 is a plan view showing the turntable of the semiconductor package transfer device shown in FIG.

As shown in FIGS. 5A to 5B, the first transfer apparatus 100a and the second transfer apparatus 100b move to the first transfer guide rail 110a and the second transfer guide rail 110b, respectively. First servo motor 140a installed above the first horizontal transfer member 120a and the second horizontal transfer member 120b, the first horizontal transfer member 120a, and the second horizontal transfer member 120b. ) And the second servo motor 140b, the first servo motor 140a, and the second servo motor 140b are rotatably installed on the first servo motor 140a and the second servo motor 140b. It consists of a first turntable 150a and a second turntable 150b rotated by.

Here, the first horizontal transfer member 120a and the second horizontal transfer member 120b are horizontally moved by predetermined driving means (not shown). Such drive means may be selectively adopted according to design conditions, linear motion systems well known in the art such as screw shaft and nut member combinations, rack and pinion combinations, belt and pulley combinations, and chain and sprocket wheel combinations.

As shown in FIG. 6, the first turntable 150a and the second turntable 150b each have a loading groove 154 on which a semiconductor package is loaded and a free space portion 156 not stacked. The first loading portion 152a and the second loading portion 152b are provided. The loading groove 154 and the free space 156 are formed symmetrically on the first turntable 150a and the second turntable 150b so as to effectively load the semiconductor packages arranged in a matrix form after drying is completed. have.

In addition, the loading groove 154 and the free space portion 156 are disposed in the first loading portion 152a and the second loading portion 152b, respectively. 150a) and the second turntable 150b to accurately load without error, and to accurately process the guide inclined portion formed on the edge of the loading groove 154 for accurate loading.

As described above, in the present embodiment, since the first transfer device 100a and the second transfer device 100b operate independently of each other, the semiconductor package is loaded on the first turntable 150a or the second turntable 150b. Immediately transferred to vision inspection area. That is, when a semiconductor package is loaded on one turntable, the transfer operation can be performed immediately without waiting for loading on the other turntable.

On the other hand, according to circumstances, a pair of independent turntables formed by crossing the loading groove 154 on which the semiconductor package is seated and the free space portion 156 not loaded may be formed in a plurality of sets.

The pickup device for vision inspection absorbs the semiconductor package transferred by the first turntable 150a or the second turntable 150b and transfers the semiconductor package to the upper portion of the vision inspection apparatus 300. When the vision inspection is completed, the vision inspection is completed. According to the result, the semiconductor package is classified into good or bad and placed in a tray (not shown) seated on a tray feeder (not shown).

The vision inspection pickup device is composed of four vision inspection pickers 200 that operate independently of each other. However, the vision inspection picker 200 is not limited to four, and the number of the vision inspection pickers 200 may vary depending on conditions.

For reference, the conventional vision inspection pick-up apparatus was provided with two vision inspection pickers for absorbing eight semiconductor packages in a row.

Each vision inspection picker 200 has a structure capable of absorbing a semiconductor package loaded on the first turntable 150a or the second turntable 150b. For example, the vision inspection picker 200 may include a picker head (not shown) for absorbing a semiconductor package, and a vacuum means (not shown) for providing an adsorptive force to the picker head. In addition, each vision inspection picker 200 is installed to be horizontally moved along the picker guide rail 210 by a predetermined horizontal transfer means (not shown). In addition, the picker head is configured to be vertically movable by a predetermined vertical transfer means (not shown).

Each of the vision inspection pickers 200 is controlled to absorb the maximum amount of semiconductor packages that the vision inspection apparatus 300 can photograph at one time and immediately transfer the same to the vision inspection apparatus 300. Each of the vision inspection pickers 200 according to the present exemplary embodiment is designed to pick up the semiconductor package in a two-row square array and transfer the semiconductor package to the vision inspection apparatus 300 without delay.

However, when the photographing capacity or the photographing range of the vision inspection apparatus 300 is increased, the vision inspection picker 200 may also be designed to absorb and transport the maximum photographing portion of the vision inspection apparatus 300. That is, the multi-column array (m × n; m≥2, n≥2) or the multicolumn square array (m × m; m≥2) corresponding to the one-time maximum photographing area of the vision inspection apparatus 300 It can be designed to transfer.

The vision inspection apparatus 300 is for inspecting whether a semiconductor package is defective. The vision inspection apparatus 300 is movably installed on the vision inspection guide rail 310 installed in a direction crossing the movement path of the vision inspection picker 200. As such, since the vision inspection apparatus 300 is installed to be movable, the semiconductor inspection apparatus 300 is moved to a position capable of photographing all the semiconductor packages transferred to the vision inspection region 320 while being absorbed by the vision inspection picker 200. In addition, the semiconductor package may be inspected for defects.

FIG. 7 is a reference diagram illustrating a state when a semiconductor package is transferred to the vision inspection apparatus 300 by the vision inspection picker 200 and subjected to vision inspection. In this figure, the number and alignment of semiconductor packages P adsorbed by one vision inspection picker 200 are shown as one embodiment.

As illustrated in FIG. 7, the picker 200 for vision inspection absorbs four semiconductor packages P to be arranged in two rows of squares, and thus, four semiconductor packages P are disposed on the vision inspection apparatus 300. ) Is positioned in the vision inspection area 320.

As described above, in the present invention, since the picker 200 for vision inspection absorbs and transports the semiconductor packages arranged in two rows of squares, the four semiconductor packages P are vision-inspected at one time. Therefore, the process speed can be remarkably improved as compared with the conventional semiconductor package transfer mechanism that vision-tests two semiconductor packages. Therefore, while using the vision inspection apparatus 300 normally used in the conventional semiconductor package handler system as it is, while utilizing the vision inspection possible area as much as possible without waste, it is possible to drastically improve the processing speed of vision inspection. This will contribute to the improvement of Unit Per Hour (UPH) throughout the package handler system.

In addition, in the present invention, since the picker 200 for vision inspection picks up only the maximum photographing portion of the vision inspection apparatus 300 and immediately transfers it, it is possible to prevent the delay of pickup and transfer time.

Meanwhile, the number and alignment of the semiconductor packages P adsorbed by one vision inspection picker 200 are not limited to four square arrays, and the number and alignment of the semiconductor packages that are vision inspected in the vision inspection region 320. The method is also not limited to two-row square arrays. Generally, a vision inspection area is formed in a circular shape. In the case of a large vision inspection device, semiconductor packages are picked up and transferred in a multi-row square array (ie, 3 × 3, 4 × 4 ...), and the vision The inspection apparatus 300 may be designed to move to the lower portion of the vision inspection picker 200 to perform vision inspection at one time. If the photographing area of the vision inspection apparatus 300 is not circular but rectangular, the vision inspection picker 200 may be designed to pick up and transport the semiconductor package in a multi-column square array (m × m; m ≧ 2). have.

On the other hand, whether each of the vision inspection picker 200 to adsorb the semiconductor package loaded on the turntable of the first tentable 150a or the second turntable 150b and transported is controlled to be appropriately selected according to the situation Lose.

As described above, in the semiconductor package transport apparatus according to the present invention, a pair of independently operated first turntables 150a and second turntables 150b share the semiconductor packages and alternately transfer them, and the vision inspection apparatus 300 at once. Since it is composed of a plurality of independent vision inspection pickers 200 that continuously transfer a quantity of semiconductor packages that can be vision inspected, productivity can be improved by reducing congestion and waiting time of the semiconductor package in the process. will be.

4, the process of the semiconductor package transfer mechanism according to the present invention will be described.

Here, only processes related to the semiconductor package transfer mechanism will be described, and descriptions of other processes such as a cutting process, a cleaning process, and an upper vision inspection process will be omitted for convenience.

First, the turntable pickup apparatus 400 sucks the semiconductor package, which has been cleaned and dried, from the drying apparatus D, and loads the first loading portion on the first loading portion 152a of the first turntable 150a. The semiconductor package loaded on the first loading portion 152a is adsorbed to the first turntable 150a by vacuum means. When the loading of the semiconductor package of the amount allocated to the first turntable 150a is completed, the turntable pickup device 400 is raised to secondaryly load the semiconductor package of the remaining amount to the second turntable 150b. Initiate the action. At this time, the first turntable 150a, which has already been loaded, moves to the position where the vision inspection picker 200 is located along the transfer guide rail 110a without delay.

At this time, the stand-by vision inspection picker 200 absorbs four stacked semiconductor packages in two rows as soon as the first turntable 150a arrives at the pickup area, and then, without delay, the guide rail for vision inspection without delay. To 310). At the same time, the vision inspection apparatus 300 moves toward the vision inspection picker 200 which is moved to the vision inspection unit, and when the vision inspection picker 200 arrives at the vision inspection region 320, Vision inspection of semiconductor package at once to check for defects.

When the vision inspection is completed as described above, the vision inspection picker 200 moves to the tray T area while the semiconductor package is absorbed and classifies the semiconductor package as good or defective according to the vision inspection result. ), The vision inspection process is completed.

On the other hand, apart from the above process, the remaining semiconductor package, which is a secondary loading amount, is loaded on the second loading portion 152b of the second turntable 150b by the turntable pickup device 400, and the semiconductor package is loaded. The second turn table 150b moves to the position where the vision inspection picker 200 is located similarly to the first turn table 150a. At this time, the turntable pickup device 400 is moved back toward the drying device (D) to adsorb a new semiconductor package.

As the above process is repeated, the transfer process of the dried semiconductor package is performed.

Although the preferred embodiment of the present invention has been described above, the present invention may use various changes, modifications, and equivalents. It is clear that the present invention can be applied in the same manner by appropriately modifying the above embodiments. For example, although the present invention describes a package to be supplied from a turntable to a pickup device, not only the package supplied from the turntable (which may include a plurality of attached strips), but also any other package source. It is within the scope of the present invention if any one of the plurality of pick-up devices is picked up and moved by the pick-up device, and thus the vision-testing device can move to the pick-up device side where the package is picked up and inspect the package. It should be interpreted.

As described above, in the semiconductor package transfer mechanism according to the present invention, since a pair of turntables operating independently of each other share the semiconductor packages and transfer them alternately, the semiconductor packages can be quickly transferred to the vision inspection unit.

That is, in the present invention, since the pair of turntables are configured to operate independently of each other to share the semiconductor packages and transfer them, the first and second loading parts are disposed on one turntable and the remaining loads are completed. The conventional problem that the semiconductor package cannot be transported until the semiconductor package is loaded in the second loading part is solved.

In addition, the semiconductor package transfer mechanism according to the present invention is designed to be organically combined with a plurality of vision inspection pickers that operate independently of each other, which significantly reduces the process stagnation time and waiting time of the semiconductor package throughout the handler system. .

In addition, if the semiconductor package transfer mechanism according to the present invention is designed to be organically combined with a vision inspection apparatus installed to be movable across the movement path of the vision inspection picker, the maximum photographing capacity of the vision inspection apparatus can be utilized without waste. This means that the vision inspection throughput per unit time can be greatly improved even without installing expensive vision inspection devices.

Accordingly, the present invention enables the transfer operation, the pick-up operation, and the vision inspection operation to be effectively performed, thereby remarkably increasing the unit per hour (UPH) of the semiconductor package handler system.

1 is a plan view schematically showing a conventional semiconductor package transfer mechanism.

2A to 2C are a perspective view, a plan view, and a front view, respectively, of a conventional semiconductor package transfer device.

Figure 3 is a plan view showing a turntable of the conventional semiconductor package transfer apparatus.

Figure 4 is a plan view schematically showing a semiconductor package transfer mechanism according to an embodiment of the present invention.

5A to 5C are a perspective view, a plan view, and a front view, respectively, of the semiconductor package transfer device shown in FIG.

FIG. 6 is a plan view showing a turntable of the semiconductor package transfer device shown in FIG. 4; FIG.

FIG. 7 is a reference diagram showing a state when the semiconductor package is transferred to the vision inspection apparatus and vision inspection by the vision inspection pickup apparatus shown in FIG. 4; FIG.

* Description of the symbols for the main parts of the drawings *

100a: first transfer device 100b: second transfer device

110a: guide rail for the first transfer 110b: guide rail for the second transfer

150a: first turntable 150b: second turntable

152a: first loading part 152b: second loading part

154: loading groove 156: free space

200: Vision inspection picker 210: Picker guide rail

300: vision inspection device 310: vision inspection guide rail

Claims (2)

In the semiconductor package transfer mechanism for transferring individual semiconductor packages that have been cut, cleaned and dried to a vision inspection device, A pair of semiconductor package transfer devices each consisting of a movable frame movably installed along one direction axis, and a turntable rotatably installed on the movable frame and having a loading groove on which the semiconductor package is seated and a free space portion not loaded. Including, Wherein each of the semiconductor package transfer devices is controlled to operate independently of each other to share the semiconductor packages with each other and alternately transfer them to the vision inspection device. The method of claim 1, The stacking groove is a semiconductor package transfer mechanism, characterized in that formed on each turntable provided in the pair of transfer devices symmetrical to each other.