KR101436028B1 - Semiconductor device inspection apparatus - Google Patents

Semiconductor device inspection apparatus Download PDF

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Publication number
KR101436028B1
KR101436028B1 KR1020130009887A KR20130009887A KR101436028B1 KR 101436028 B1 KR101436028 B1 KR 101436028B1 KR 1020130009887 A KR1020130009887 A KR 1020130009887A KR 20130009887 A KR20130009887 A KR 20130009887A KR 101436028 B1 KR101436028 B1 KR 101436028B1
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KR
South Korea
Prior art keywords
test
unit
pressing
shuttle
loading
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KR1020130009887A
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Korean (ko)
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KR20130099824A (en
Inventor
유홍준
김민성
서용진
유태식
Original Assignee
(주)제이티
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Priority to KR1020120021447 priority Critical
Priority to KR20120021447 priority
Application filed by (주)제이티 filed Critical (주)제이티
Priority claimed from CN201310062540.8A external-priority patent/CN103293426B/en
Publication of KR20130099824A publication Critical patent/KR20130099824A/en
Application granted granted Critical
Publication of KR101436028B1 publication Critical patent/KR101436028B1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01DNON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D17/00Regulating or controlling by varying flow
    • F01D17/10Final actuators
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01DNON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
    • F01D25/00Component parts, details, or accessories, not provided for in, or of interest apart from, other groups
    • F01D25/24Casings; Casing parts, e.g. diaphragms, casing fastenings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02CGAS-TURBINE PLANTS; AIR INTAKES FOR JET-PROPULSION PLANTS; CONTROLLING FUEL SUPPLY IN AIR-BREATHING JET-PROPULSION PLANTS
    • F02C7/00Features, components parts, details or accessories, not provided for in, or of interest apart form groups F02C1/00 - F02C6/00; Air intakes for jet-propulsion plants
    • F02C7/20Mounting or supporting of plant; Accommodating heat expansion or creep
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05DINDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2220/00Application
    • F05D2220/30Application in turbines
    • F05D2220/31Application in turbines in steam turbines

Abstract

The device inspection apparatus according to an embodiment of the present invention includes a first vertical movement device for moving a device pressing tool for picking up an element and pressing it with a test socket in a vertical direction, The pressing tool is configured to be moved in the vertical direction so that the moving position of the element pressing tool in the vertical direction can be accurately set.

Description

SEMICONDUCTOR DEVICE INSPECTION APPARATUS

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus for checking electrical characteristics of a element.

A semiconductor device (hereinafter referred to as an "element") is subjected to various tests such as electrical characteristics, reliability test for heat and pressure by a semiconductor device inspection apparatus after completion of a packaging process.

Inspection of devices can be carried out at room temperature tests conducted at room temperature depending on kinds of devices such as memory devices, non-memory devices such as CPU (Central Processing Unit), GPU (Graphic Processing Unit), LED devices and solar devices, There are various tests such as the heating test performed.

Meanwhile, as the types of IT devices such as smart phones, smart pads, smart TVs, and the like are becoming popular, demand for non-memory devices such as CPUs, that is, LSIs (Large Scale Integration) is rapidly increasing.

However, the LSI has a problem in that it is difficult to use an expensive inspection apparatus because the inspection quantity of the LSI is smaller than that of the standardized memory element inspection apparatus due to the characteristics of a small number of kinds.

It is an object of the present invention to provide an apparatus for inspecting various kinds of LSI devices while rapidly performing inspection of LSI devices of a small variety of types .

It is another object of the present invention to provide an apparatus for inspecting an element which can precisely perform a movement in a horizontal direction and a movement in a vertical direction of a device pressing tool for picking up an element and pressing it with a test socket.

It is still another object of the present invention to provide an apparatus for inspecting a device which can reduce the maintenance cost and can remarkably reduce the production cost of the device by easily configuring the maintenance of the part.

According to an aspect of the present invention, there is provided an apparatus for inspecting an element, comprising: a plurality of loading units; a test unit having a plurality of test sockets for performing a test on elements transferred from the loading unit; An unloading unit for classifying devices tested by the test unit according to a test result; and a device pressurizing unit for picking up the device and pressing the device with the test socket, wherein the device pressing unit picks up the device, A horizontal moving device connected to the element pressing tool to move the element pressing tool to the test socket, and a control unit for controlling the horizontal movement device to move the element pressing tool to the test socket, And a first vertical movement device for vertically moving the element pressing tool to the pressing position.

Wherein the horizontal moving device includes a connecting member which is connected to the supporting shaft extending in the vertical direction from the element pressing tool so as to be movable in the vertical direction while being restricted in movement in the horizontal direction, And may include a driving unit.

The connection member may be formed with a through hole through which the support shaft is inserted so as to penetrate in the vertical direction.

The horizontal driving unit may include a belt connected to the connecting member, a pulley on which the belt is wound, and a rotating motor connected to the pulley.

The first vertical movement device includes a movable block which is connected to the support shaft extending in the vertical direction from the element pressing tool so that movement of the support shaft in the vertical direction is restricted and movable in the horizontal direction, A cam groove inserted in a cam groove formed in the cam member and moving in a vertical direction according to the shape of the cam groove and a lift guide connected to the moving block to guide movement of the moving block in a vertical direction.

The moving block may be provided with a guide rail connected to the end of the support shaft and extending in the horizontal direction to guide the movement of the support shaft in the horizontal direction.

Wherein the device inspection apparatus further comprises a second vertical movement device for linearly moving the element pressing portion with respect to the test portion, and a second vertical movement device for moving the second vertical movement device when the element pressing tool is in contact with the test portion by the second vertical movement device. And a control unit for detecting a load applied to the test unit by the moving device and determining the position of the element pressing tool when the detected load becomes a preset reference load as a pressing position.

The second vertical movement device may include a motor, and the control unit may be configured to detect a load applied to the test unit by detecting a load of the motor.

Wherein the device pressing tool includes a support portion movably installed, at least one picker module detachably coupled to the support portion and coupled with at least one picker, the test socket being supported by a support frame, The lower surface of the picker module can be brought into contact with the upper surface of the support frame.

The device inspection apparatus may further include at least one shuttle unit for transferring the device transferred from the loading unit to the test unit and transferring the device transferred from the testing unit to the unloading unit, And one or more unloading transfer tools for picking up devices from the shuttle and transferring the devices to the unloading unit, wherein the device pressing tool picks up the devices from the shuttle unit, Pressurized to the socket, and pressurized to the test socket to transfer the tested device to the shuttle.

The device testing apparatus may further include a loading buffer unit in which devices transferred from the loading unit are temporarily loaded, and an unloading buffer unit in which devices tested in the testing unit are temporarily loaded.

Wherein the loading transfer tool includes a first loading transfer tool for picking up an element from the loading section and transferring the element to the loading buffer section and a second loading transfer tool for picking up the element from the loading buffer section and transferring the element to the shuttle section, The unloading / conveying tool includes a first unloading / conveying tool for picking up an element from the unloading buffer unit and transferring the element to the unloading unit, and a second unloading / transferring tool for picking up the element from the shuttle unit and transferring the element to the unloading buffer unit. A loading transfer tool.

The shuttle portion is moved between a first element transfer position for transferring the element from the loading portion, a device exchange position for exchanging the element with the test portion, and a second element transfer position for transferring the element to the unloading portion And a first shuttle portion and a second shuttle portion, each of which is provided with at least one shuttle plate.

The device pressing tool may include a first element pressing tool that picks up an element from the shuttle plate of the first shuttle, presses the element into the test socket, and presses the test socket to transfer the tested element to the shuttle plate of the first shuttle. And a second element pressing tool which picks up the element from the second shuttle part shuttle plate, presses the element into the test socket, and presses the test socket and transfers the tested element to the shuttle plate of the second shuttle part have.

The device testing apparatus according to the embodiment of the present invention has an advantage that various types of LSI devices can be inspected while quickly inspecting LSI devices of a small variety of types.

In addition, a device inspection apparatus according to an embodiment of the present invention includes a first vertical movement device for vertically moving a device pressing tool that picks up an element and presses it with a test socket, and includes a cam member, The element pressing tool is configured to be moved in the vertical direction, whereby there is an advantage that the moving position of the element pressing tool in the vertical direction can be accurately set.

In addition, the device testing apparatus according to the embodiment of the present invention has an advantage that the maintenance cost of the device can be reduced, and the production cost of the device can be remarkably reduced.

In addition, a device testing apparatus according to an embodiment of the present invention includes: a support member for picking up a device and pressing the device with a test socket, the support member being removably installed on the support member; And at least one picker module to be coupled is advantageous in that maintenance of the element pressing tool is easy.

Further, the device testing apparatus according to the embodiment of the present invention may include a heater and at least one first connector for power supply and signal transmission to the temperature sensor, so that when the device and the picker module are combined, So that there is no need for a separate connection work for power supply and signal transmission, which makes it easy to manufacture and maintain the device.

Further, in the device testing apparatus according to the embodiment of the present invention, the device exchange between the test unit and the loading buffer unit, or the shuttle plate for device exchange between the test unit and the unloading buffer unit, The shuttle plate on which the device is mounted can be easily replaced when the type of the device to be inspected, in particular, the size of the device, is changed.

1 is a plan view schematically showing an element inspection apparatus according to an embodiment of the present invention.
2 is a plan view schematically showing an example of a plate member of the loading buffer unit and the unloading buffer unit in the device testing apparatus of FIG.
3 is a cross-sectional view schematically showing the first shuttle portion and the second shuttle portion in the device testing apparatus of FIG.
FIG. 4 is a perspective view schematically showing a plate detachment section for fixing the shuttle plate to the plate fixing section in the first shuttle section and the second shuttle section of FIG. 3;
5 and 6 are schematic views for explaining the operation of the plate detachment unit of FIG.
7 is a cross-sectional view showing an element pressing tool provided in the element testing apparatus of FIG.
8 is an exploded perspective view of a picker provided in the element pressing tool of Fig.
9 is a perspective view showing a support portion of the element pressing tool of Fig.
Fig. 10 is a perspective view showing the picker module of the element pressing tool of Fig. 7; Fig.
11 is a cross-sectional view for explaining an operation in which the picker module is coupled to the support in the element pressing tool of FIG.
12 is a sectional view showing another example of the element pressing tool provided in the element testing apparatus of FIG.
13 is an enlarged cross-sectional view of a part of the element pressing tool of Fig.
Figs. 14 and 15 are schematic diagrams showing a horizontal moving device and a first vertical moving device for moving the element pressing tool provided in the element testing apparatus of Fig. 1 in the horizontal direction and the vertical direction.
16 is a cross-sectional view schematically showing a horizontal moving apparatus for moving the element pressing tool provided in the element testing apparatus of Fig. 1 in the horizontal direction.
17 is a longitudinal sectional view schematically showing a first vertical moving device for vertically moving an element pressing tool provided in the element testing apparatus of FIG.
18 is a schematic view showing a configuration for setting the pressing position of the element pressing tool in the element inspection apparatus of Fig.
19 is an enlarged cross-sectional view of part of the configuration of Fig.

Hereinafter, a device testing apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 1, an apparatus for inspecting an element according to an embodiment of the present invention includes: a loading unit 100 in which a plurality of elements 1 are loaded; A testing unit 300 for testing the elements 1 transferred from the loading unit 100; And an unloading unit 500 for sorting and loading the devices 1 according to a test result of the test unit 300. [

The device 1 to be tested can be a memory semiconductor, a non-memory device such as a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and a system LSI (Large Scale Integration). The element 1 may be a non-memory element, in particular, an element in which ball-shaped connecting terminals are formed on the bottom surface.

The method of transferring the elements 1 between the loading unit 100, the test unit 300, and the unloading unit 500 can be performed by various methods.

The loading unit 100 and the unloading unit 500 are configured such that one or more trays 2 loaded with a plurality of elements 1 are stacked, and various configurations are possible according to the design. The loading unit 100 and the unloading unit 500 may be provided with a tray loading unit (not shown) on which a plurality of trays 2 can be loaded.

For example, in the loading section 100, a plurality of trays 2 are appropriately arranged so that the elements 1 can be successively picked up and transported. Then, the tray 2 from which the elements 1 are emptied can be replaced with the tray 2 filled with the elements 1. For example, a certain batch of trays 2 can be loaded into the tray loading section automatically or manually.

The empty tray 2 after the elements 1 are drawn out from the loading part 100 can be transferred to the unloading part 500 by a tray transfer part (not shown). It is also possible to prevent the tray 2 from being pulled out of the tray 2 before the empty tray 2 is transferred to the unloading section 500 (Inverted).

On the other hand, the unloading unit 500 may be configured similar to the loading unit 100. For example, in the unloading portion 500, a plurality of empty trays 2 may be appropriately disposed according to the sorting class so that the elements 1 can be sorted and stacked in succession according to the test result . In the unloading portion 500, the tray 2 filled with the tested elements 1 can be replaced with the empty tray 2.

A tray buffer unit (not shown) in which the empty tray 2 is temporarily loaded is additionally provided between the loading unit 100 and the unloading unit 500 so that the empty tray 2 can be temporarily loaded. Can be installed.

A plurality of receiving grooves 2a can be formed in the tray 2 so that a plurality of elements 1 can be loaded. For example, the plurality of receiving grooves 2a may be formed on the tray 2 in a matrix of 8x16 or the like.

As shown in Figures 1 and 2, the loading portion 100 and the test portion 300 (not shown) may be arranged so that the speed at which the element 1 is conveyed may be increased, or the plurality of elements 1 may be heated sufficiently A loading buffer unit 200 may be installed in which the elements 1 transferred from the tray 2 of the loading unit 100 are temporarily loaded. The devices 1 that have been tested by the test unit 300 are temporarily placed between the test unit 300 and the unloading unit 500 so that the speed at which the devices 1 are transferred can be increased. An unloading buffer unit 400 may be provided. Therefore, the device 1 to be tested can be transferred from the loading unit 100, temporarily loaded in the loading buffer unit 200 and then transferred to the test unit 300, May be transferred from the test unit 300 to temporarily be loaded in the unloading buffer unit 400 and then transferred to the unloading unit 500.

Particularly, in the loading buffer unit 200 and the unloading buffer unit 500, a relatively large number of elements 1 can be loaded in comparison with the tray 2 in which a relatively small number of elements 1 are loaded have.

2, the loading buffer unit 200 and the unloading buffer unit 400 include a plurality of loading grooves 211 and 411 formed on the upper surface thereof so that the plurality of elements 1 can be loaded thereon Like plate members 210 and 410 which are formed in a plate shape.

The plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 may be substantially identical to each other. However, if it is necessary to heat (preheat) the element 1 in order to test the element 1, a heating means such as a heater may be added to the plate member 210 of the loading buffer unit 200.

The loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 are arranged in the intervals of the test sockets 310 of the test unit 300 Or may be arranged to match the spacing of the receiving grooves 2a of the tray 2.

The intervals between the receiving grooves 2a of the tray 2 and the spacing between the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 The distance between the test receptacles 310 of the test part 300 may be n times, for example, twice as long as the distance between the receiving grooves 2a of the tray 2.

The plate members 210 and 410 are configured to temporarily load the elements 1 and exchange elements with the test unit 300. The plate members 210 and 410 may be fixedly installed inside the device testing apparatus, And so on.

As shown in FIG. 1, the test unit 300 is for testing the device 1 transferred from the loading buffer unit 200, and can have various configurations according to the type of test. The test unit 300 is provided with a plurality of test sockets 310 to which the device 1 is pressed. For example, a plurality of test sockets 310 are provided with a terminal connected to a power source, and an energization test for the element 1 can be performed through the process of pressing the element 1 to the terminal.

The test sockets 310 may be arranged in various matrices such as 8x2, 8x4, and so on. The test socket 310 is a configuration for connection between the element 1 and the terminal for testing the element 1, and various configurations are possible. Such a test socket 310 can be installed to be replaceable depending on the type of device, test type, and the like.

Meanwhile, the test unit 300 may be an independent configuration in which the test socket 310 and the rest of the configuration are modularized, and may be implemented as a PCB board in which the test socket 310 is installed as a simple structure. Particularly, when the test unit 300 is implemented as a PCB board on which the test socket 310 is mounted, the test socket 300 is characterized for each test so that the configuration cost of the test unit 300, which is relatively expensive, .

On the other hand, various tests can be performed in the test unit 300. More preferably, the test section 300 can be configured to be capable of testing the device 1 at temperatures above room temperature.

In the case of a test related to a temperature such as a high temperature test, the test part 300 may be provided with a chamber member surrounding the area including the test socket 310 to minimize the temperature change.

The device exchange between the test unit 300 and the loading buffer unit 200 or between the test unit 300 and the unloading buffer unit 400 is not directly performed, 1 to the test unit 300 and to transfer the device 1 transferred from the test unit 300 to the unloading buffer unit 400. The shuttle units 610, The shuttle units 610 and 620 may have various configurations such as a device exchange between the test unit 300 and the loading buffer unit 200 or a device exchange between the test unit 300 and the unloading buffer unit 400 It is possible.

For example, as shown in FIGS. 1 and 3, the shuttle units 610 and 620 include a first element transfer position for receiving the element 1 from the loading unit 100, a first element transfer position for transferring the element 1 from the loading unit 100, A first shuttle part 610 which is moved between a device exchange position for exchanging the device 1 and a second device transfer position for transferring the device 1 to the unloading part 500, A first element transfer position for transferring the element 1, a device exchange position for exchanging the element 1 with the test portion 300 and a second element transfer position for transferring the element 1 to the unloading portion 500. [ And a second shuttle portion 620 that is moved between the transfer positions. Here, the first element transfer position, the element exchange position, and the second element transfer position may be variously arranged according to the configuration of the apparatus, and may be arranged in a straight line sequentially.

The first shuttle 610 and the second shuttle 620 may be disposed on both sides of the test socket 310 with the test socket 310 of the test unit 300 interposed therebetween. The first shuttle 610 and the second shuttle 620 include guide rails 611 and 621 installed opposite to each other with the test portion 300 as a center and guide rails 611 and 621 horizontally along the guide rails 611 and 621 A first element transfer position for receiving the element from the loading buffer unit 200, a device exchange position for the test unit 300, and a second element transfer position for transferring the element to the unloading buffer unit 400 One or more shuttle plates 612 and 622 which are alternately moved and on which the elements 1 are loaded and a plate plate 612 and 622 which are detachably coupled to move along the guide rails 611 and 621, (613, 623).

The guide rails 611 and 621 can be variously configured to guide the movement of the shuttle plates 612 and 622.

The shuttle plates 612 and 622 are connected to the shuttle plates 612 and 622 so that the element 1 can be exchanged between the test unit 300 and the loading buffer unit 200 or between the test unit 300 and the unloading buffer unit 400. [ At least one element seating groove is formed.

The plate fixing portions 613 and 623 are provided for the convenience of replacement of the shuttle plates 612 and 622. The plate fixing portions 613 and 623 may be provided with a heater for heating the element 1 or the like. Since the shuttle plates 612 and 622 are detachably attached to the plate fixing portions 613 and 623 so that the element 1 is seated when the type of the element 1 to be inspected, The shuttle plates 612 and 622 can be replaced.

The plate fixing portions 613 and 623 may be provided with plate detachable portions 614 and 624 for detachably fixing the shuttle plates 612 and 622 to the plate fixing portions 613 and 623. The plate detachable parts 614 and 624 can be variously configured as detachable attachment and detachment of the shuttle plates 612 and 622 at the plate fixing parts 613 and 623 and can be easily detached and attached to the shuttle plates 612 and 622 Lt; / RTI >

4 to 6, the plate detachable portions 614 and 624 include support bodies 614a and 624a fixed to the plate fixing portions 613 and 623, support bodies 614a and 624a, Fixed bodies 614b and 624b which are rotatably connected through first hinge shafts 614c and 624c provided on the first hinge shafts 614a and 624b and selectively fix the shuttle plates 612 and 622 by rotation, Elastic bodies 614d and 624d for resiliently supporting the first and second hinge shafts 614a and 614b on the first hinge shafts 614c and 624c and a pressing surface contacting the fixing bodies 614b and 624b and contacting the fixing bodies 614b and 624b in a curved surface (Z-axis direction) inside the supports 614a and 624a, which are connected to the press members 614i and 624i, and press members 614i and 624i which are formed in the support members 614a and 624a and press the fixing members 614b and 624b, Handles 614e and 624e which are rotatably connected to second hinge shafts 614f and 624f provided on the moving bodies 614e and 624e and support members 614a and 624a which are rotatably connected to the moving bodies 614e and 624e, Installed in It may comprise a fixed hook (614h, 624h) which end is fixed hanging of the handle (614g, 624g).

The fixtures 614b and 624b may be formed in a bent shape substantially in the shape of the letter 'L' and the shuttle plates 612 and 622 may be formed by the bent portions contacting the edges of the shuttle plates 612 and 622, Can be fixed to the plate fixing portions 613 and 623.

As the elastic members 614d and 624d, for example, a torsion spring may be used.

The fixed hooks 614h and 624h are formed such that the operator can pinch the ends of the handles 614g and 624g by turning the handles 614g and 624g or release the hooks of the ends of the handles 614g and 624g .

According to this configuration, as the moving bodies 614e and 624e move in the vertical direction according to the displacements of the handles 614g and 624g, the pressing bodies 614i and 624i move in the vertical direction, The posture of the fixing bodies 614b and 624b can be changed according to the shape of the curved surface of the pressing surface of the pressing bodies 614i and 624i that are in contact with the fixing members 614a and 624b. When the posture of the fixing bodies 614b and 624b is changed, the posture of the fixing bodies 614b and 624b can be kept constant by the elastic force of the elastic bodies 614d and 624d.

The movement of the moving bodies 614e and 624e in the vertical direction can be performed by rotating the handles 614g and 624g around the second hinge shafts 614f and 624f. On the other hand, when the handles 614g and 624g are caught by the fixing hooks 614h and 624h, rotation of the handles 614g and 624g is limited, and accordingly, the movement of the moving bodies 614e and 624e and the pressing bodies 614i and 624i The movement in the vertical direction is restricted, so that the posture of the fixing bodies 614b and 624b can be prevented from being changed arbitrarily.

The handle 614g and 624g are fixed around the second hinge shafts 614f and 624f in a state where the shuttle plates 612 and 622 are fixed by the fixing bodies 614b and 624b as shown in Fig. The elastic force of the elastic members 614d and 624d is applied to the pressing members 614i and 624i and the moving members 614e and 624e while the elastic members 614d and 624d are rotated in the direction away from the hooks 614h and 624h The bodies 614i and 624i and the moving bodies 614e and 624e move downward and the positions of the pressing surfaces of the pressing bodies 614i and 624i contacting the fixing bodies 614b and 624b are changed, 624b are displaced from the shuttle plates 612, 622 (clockwise in Fig. 5) about the first hinge shafts 614c, 624c by the elastic force of the elastic members 614d, 624d, Thus, as shown in Fig. 6, the fixing of the shuttle plates 612 and 622 can be released.

6, when the shuttle plates 612 and 622 are unlocked, the handles 614g and 624g are pivoted about the second hinge shafts 614f and 624f by the fixing hooks 614h and 624h The pressing members 614i and 624i and the moving bodies 614e and 624e are moved upward in the process of rotating the pressing members 614i and 624h in the direction in which the pressing members 614i and 624i are rotated (counterclockwise in Fig. 6) The positions of the pressing surfaces of the pressing members 614i and 624i that contact the fixing members 614b and 624b are changed so that the fixing members 614b and 624b are rotated about the first hinge shafts 614c and 624c, , The shuttle plates 612 and 622 are fixed by the fixing bodies 614b and 624b as shown in Fig. 5 (Fig. 6) . When the shuttle plates 612 and 622 are fixed by the fixed bodies 614b and 624b, the elastic forces of the elastic bodies 614d and 624d act on the fixed bodies 614b and 624b, Can be prevented from rotating arbitrarily.

As described above, according to the embodiment of the present invention, the plate removing portions 614 and 624 detachably fixing the shuttle plates 612 and 622 to the plate fixing portions 613 and 623 rotate the handles 614g and 624g The shuttle plates 612 and 622 can be easily locked and unlocked by performing a simple operation of releasing the locking and unlocking of the shuttle plates 612 and 622 There is an effect that can be done.

One or more loading and unloading tools 810 (810) for transferring the element 1 from the loading unit 100 to the shuttle units 610 and 620 while being moved between the loading unit 100 and the shuttle units 610 and 620, , 814 can be installed. In this case, one loading / unloading tool 810, 814 moves between the loading unit 100 and the shuttle units 610, 620, picking up the devices 1 from the loading unit 100 and moving the shuttle units 610, 620, respectively. As described above, when the loading buffer unit 200 is installed, the loading and conveying tools 810 and 814 are arranged to pick up the element 1 from the loading unit 100 and transfer the element 1 to the loading buffer unit 200 1 loading transfer tool 810 and a second loading transfer tool 814 for picking up the element 1 from the loading buffer section 200 and transferring it to the shuttle sections 610 and 620.

In addition, one or more unloading and conveying tools (not shown) for picking up the devices 1 from the shuttle units 610 and 620 and transferring them to the unloading unit 500 while being moved between the shuttle units 610 and 620 and the unloading unit 500, (820, 824) can be installed. In this case, one unloading / conveying tool 820, 824 moves between the shuttle portions 610, 620 and the unloading portion 500 to pick up the element 1 from the shuttle portions 610, To the loading unit 500. When the unloading buffer unit 400 is installed as described above, the unloading and transferring tools 820 and 824 pick up the element 1 from the unloading buffer unit 400 and remove the unloading buffer unit 400 from the unloading unit 500, And a second unloading / transporting tool 824 for picking up the element 1 from the shuttle units 610 and 620 and transferring it to the unloading buffer unit 400. The first unloading / can do.

The loading transfer tool 810, 814 and the unloading transfer tool 820, 824 may be configured to be identical or similar to each other. The loading conveying tools 810 and 814 and the unloading and conveying tools 820 and 824 are provided with a plurality of pickers for picking up the element 1 and a plurality of pickers for picking up the elements 1 in the up and down direction And a driving device for driving movement of the plurality of pickers in the horizontal direction (XY direction) or the like.

The picker is composed of a suction pad for picking up the element 1 and transferring it to a predetermined position, which is capable of various configurations and forms a vacuum pressure on the upper surface of the element 1, and a pneumatic cylinder for transmitting air pressure to the suction pad .

The pickers are spaced from the receiving grooves 2a of the loading unit 100 and the tray 2 of the unloading unit 500 and between the loading buffer unit 200 and the plate members 210 and 410 of the unloading buffer unit 400 The vertical and vertical intervals can be adjusted in consideration of the case where the spacing between the loading grooves 211 and 411 of the semiconductor elements 10 is different from each other. However, in order to transfer a larger number of semiconductor elements 10, Can be fixed.

The driving device for moving the plurality of pickers may be configured in various manners according to the driving mode of the pickers, and may include a vertical moving device for moving the pickers up and down, and a left and right moving device for moving in the lateral direction. The up-and-down moving device may be configured to move the entire pickers up and down at a time, or may be separately connected to each of the pickers so that each of the pickers is independently moved up and down. The left-right moving apparatus can be configured in various ways according to the moving mode of the pickers, and can be configured to be capable of moving in a single direction in the X direction or in the Y direction, or in the X-Y direction.

Meanwhile, while moving between the test unit 300 and the shuttle units 610 and 620, the device 1 is picked up from the shuttle units 610 and 620 and pressurized by the test socket 310, Device pushing tools 830 and 840 for transferring the tested devices to the shuttle units 610 and 620 may be installed. The element pressing tools 830 and 840 are configured to transfer the element 1 between the test portion 300 and the first shuttle portion 610 and between the test portion 300 and the second shuttle portion 620, Various configurations are possible according to the transporting mode of the element 1. [ The element pressing tools 830 and 840 move between the first shuttle part 610 and the test part 300 to pick up the element 1 from the first shuttle part 610 and press the element 1 to the test socket 310 A first element pressing tool 830 for pressing the test socket 310 to transfer the tested element to the first shuttle 610 and a second element pressing tool 830 for moving the second shuttle 620 and the test part 300 The second shuttle 620 is configured to pick up the device 1 and pressurize it to the test socket 310 and press the test socket 310 to transfer the tested device to the second shuttle 620. [ Tool 840. < / RTI > As described above, when the element pressing tools 830 and 840 are constituted as a pair, the pair of element pressing tools 830 and 840 can be moved in conjunction with each other for convenience of device replacement.

For example, as shown in Figs. 7 to 13, the element pressing tools 830 and 840 may have the same or similar structure as the loading transfer tools 810 and 814 and the unloading and conveying tools 820 and 824, . The element pressing tools 830 and 840 may include a plurality of pickers 831 and 841 for picking up the element 1. [

The spacing between the loading grooves 211 and 411 of the plate members 210 and 410 may be set to be shorter than the interval between the element pressing tools 210 and 410, For example, 1/2 of the interval between the pickers 831 and 841 of the first and second optical pickups 830 and 840. Where n is a natural number greater than or equal to 2.

Particularly, the loading grooves 211 and 411 of the plate members 210 and 410 of the unloading buffer unit 400 are arranged in 16 × 8 and the test sockets 310 of the test unit 300 are arranged in 8 × 4 The element pressing tools 830 and 840 include pickers 831 and 841 arranged at 8 × 4 intervals corresponding to the test sockets 310 of the test portion 300 so that 8 × 4 elements (1). Particularly, when the pickers of the first loading transport tool 810 are arranged in 8x4 (8x2) so that a larger number of semiconductor elements 10 can be transported, the picker of the element pressing tools 830 and 840, (831, 841) may be arranged in 8x4 (8x2).

The element pressing tools 830 and 840 are disposed in the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400, It is unnecessary to adjust the interval between the pickers 831 and 841 by skipping or stacking, so that the device can be transported faster.

On the other hand, the element pressing tools 830 and 840 need to be replaced with the pickers 831 and 841 in accordance with the type and size of the element 1. [

7 to 13, the element pressing tools 830 and 840 include support portions 833 and 843 movably installed inside the device testing apparatus and detachable support portions 833 and 843 attached to the support portions 833 and 843. [ And may include one or more picker modules 834 and 844 coupled to one or more pickers 831 and 841, respectively.

The support portions 833 and 843 can be of any configuration as long as they can support the picker modules 834 and 844. The support portions 833 and 843 may be provided with first support plates 833a and 843b whose lower surfaces are planar so that the picker modules 834 and 844 can be detachably fixed.

The picker modules 834 and 844 are provided with second support plates 835 and 845 having upper surfaces that are in close contact with the lower surfaces of the first support plates 833a and 843b and second support plates 835 and 845 coupled to the second support plates 835 and 845 The heating blocks 838 and 848 coupled to the dampers 839 and 849 and the picking blocks 836 and 846 coupled to the heating blocks 838 and 848, (831, 841) that are fixed to the optical discs (836, 846).

8, each of the pickers 831 and 841 includes a hollow coupling member 891 fixed to the picking blocks 836 and 846 and a hollow coupling member 891 detachably coupled to an end of the coupling member 891. [ And an adsorption pad 892 of the adsorbing layer 892. The engaging member 891 can be detachably fixed to the pick block 836 and 846 by a guide member 893. [ The pickers 831 and 841 may be provided to the picker modules 834 and 844 in a state where the coupling member 891 and the absorption pad 892 are coupled to each other. The suction pad 892 can be connected to the suction passage 899 through the engagement member 891. The absorption pad 892 may be made of a flexible material such as rubber, synthetic resin, or the like.

The dampers 839 and 849 serve to adjust the contact force of the element 1 with respect to the test socket 1 in the process of pressing the element 1 into the test socket 310, And to absorb the force exerted thereon. For example, the dampers 839 and 949 include chambers 839d and 849d in which a predetermined space is formed and in which pneumatic passages 839c and 849c communicating with the space are formed, and chambers 839d and 849d in the chambers 839d and 849d, And the pressing members 839b and 849b that are connected to the pickers 831 and 841 through the heating blocks 838 and 848 to press the elastic films 839a and 849a . According to this configuration, when air pressure is applied to the inner spaces of the chambers 839d and 849d through the air passageways 839c and 849c, the elastic membranes 839a and 849a are elastically deformed and pressurized to the pressure members 839b and 849b A predetermined pressure is applied. Therefore, when the element 1 is pressed by the test socket 310 by the elasticity of the pneumatic pressure acting on the inside of the chambers 839d and 849d and the elastic films 839a and 849a, Can be determined. The pressure applied to the pressing members 839b and 849b by the elasticity of the pneumatic pressure acting on the inside of the chambers 839d and 849d and the elastic films 839a and 849a causes the element 1 to contact the test socket 310, The force applied to the picker modules 834 and 844 can be buffered.

On the other hand, when a plurality of picker modules 834 and 844 are provided in the element pressing tools 830 and 840, the pneumatic pressure acting on the inner space of the chambers 839d and 849d is controlled according to the plurality of picker modules 834 and 844 Can be adjusted differently. That is, in the process of pressing the plurality of elements 1 to the plurality of test sockets 310 using the plurality of picker modules 834 and 844, the plurality of elements 1 are uniformly applied to the plurality of test sockets 310 It is necessary to pressurize it with a single contact force so that the tests on the plurality of elements 1 can be simultaneously performed uniformly. However, the specifications of the plurality of picker modules 834 and 844, that is, the positions of the pickers 831 and 841, the elasticity of the elastic films 839a and 849a, the assembly tolerance, The plurality of devices 1 may not be uniformly pressed to the plurality of test sockets 310. [ Therefore, the pneumatic pressures applied to the inner spaces of the chambers 839d and 849d can be individually adjusted according to the plurality of picker modules 834 and 844, whereby the pneumatic pressures are adjusted according to the specifications of the plurality of picker modules 834 and 844 The plurality of devices 1 can be pressed against the plurality of test sockets 310 with a uniform contact force.

On the other hand, considering that the damper 839, 849 operated by pneumatic pressure is installed on the picker modules 834, 844, the support portions 833, 843 and the picker modules 834, 844 are provided with the dampers 839, Pneumatic connection passages 833b, 843b, 835b and 845b communicating with the pneumatic passages 839c and 849c may be formed. These pneumatic connection passages 833b, 843b, 835b and 845b are formed in the first plates 833a and 843a of the support portions 833 and 843 and connected to a first pneumatic connection passage 833b 844 of the picker modules 834, 844 to communicate the pneumatic passages 839c, 849c of the first pneumatic connecting passages 833b, 843b and the dampers 839, 849 with the second plates 835, And second pneumatic connection passages 835b and 845b formed in the first and second passageways. The picker modules 834 and 844 are coupled to the support portions 833 and 843 without any additional operation for connecting the air pressure generating sources and the pneumatic passages 839c and 849c of the dampers 839 and 849, And the pneumatic passages 839c and 849c of the dampers 839 and 849 can be automatically connected.

The picking blocks 836 and 846 are portions where the pickers 831 and 841 are supported and a suction passage 899 communicating with the suction pads 892 of the pickers 831 and 841 may be formed therein.

The suction passage 899 is connected to a vacuum pressure source (not shown) to function as a passage through which the air is sucked. By sucking air along the suction passage 899, a negative pressure can be formed in the suction pad 892 And the element 1 can be adsorbed to the adsorption pad 892 by this negative pressure. The suction passage 899 may be formed inside the picker modules 834 and 844 but is not limited thereto and may be a separate tube connected to the suction pad 892 .

Considering that the picker blocks 836 and 846 having suction channels 899 communicating with the suction pads 892 are provided in the picker modules 834 and 844, the support portions 833 and 843 and the picker module 834 and 844 may be formed with vacuum communication passages 833c, 843c, 835c and 845c connected to the suction passage 899 through a tube or the like. These vacuum pressure connection passages 833c, 843c, 835c and 845c are formed in the first plates 833a and 843a of the support portions 833 and 843 and are connected to a first vacuum pressure connection The second vacuum pressure connection passages 835c and 832c formed in the second plates 835 and 845 of the picker modules 834 and 844 to communicate with the passages 833c and 843c and the first vacuum pressure connection passages 833c and 843c, 845c. Therefore, the picker modules 834 and 844 are coupled to the support portions 833 and 843 without any additional work for connecting the vacuum pressure source and the suction passage 899, so that the vacuum pressure source and the suction passage 899 It can be connected automatically.

The heating blocks 838 and 848 as heating parts for heating the element 1 are controlled by the dampers 839 and 849 and the picker 838 so that the test part 300 can perform the test on the element 1 at a constant temperature. Blocks 836 and 846, respectively. The heating blocks 838 and 848 may be provided with heaters 838a and 848a.

When a plurality of picker modules 834 and 844 are provided in the element pressing tools 830 and 840, a plurality of heaters 838a and 848a may be provided in the plurality of picker modules 834 and 844, respectively. In such a case, the plurality of heaters 838a and 848a can be independently controlled according to the plurality of picker modules 834 and 844.

In this case, the picker modules 834 and 844 are connected to the heaters 838a and 848a to directly sense the temperature of the heaters 838a and 848a or to be connected to other objects connected to the heaters 838a and 848a, 838a, and 848a may be further provided. A plurality of temperature sensors 838b and 848b may be provided in each of the plurality of picker modules 834 and 844 when the plurality of heaters 838a and 848a are provided in the plurality of picker modules 834 and 844, respectively. The plurality of temperature sensors 838b and 848b sense the temperatures of the plurality of heaters 838a and 848a and detect the temperature of the plurality of heaters 838a and 848a according to the results sensed by the plurality of temperature sensors 838b and 848b Can be controlled.

As described above, the heaters 838a and 848a and the temperature sensors 838b and 848b are provided for the respective picker modules 834 and 844, respectively, and the heaters 838a and 848b ) Can be independently controlled so that the temperature can be adjusted independently according to the characteristics of the plurality of elements 1 picked up by the element pressing tools 830 and 840 to test the plurality of elements 1 Can be performed accurately.

At this time, considering that the heaters 838a and 848a or the temperature sensors 838b and 848b are installed in the picker modules 834 and 844, the first plates 833a and 843b of the supports 833 and 843, The second plates 835 and 845 of the first and second plates 844 and 844 may be made of a heat insulating material. Further, a heat insulating member (not shown) may be provided between the heating blocks 838 and 848 and the dampers 839 and 849 and between the dampers 839 and 849 and the second plates 835 and 845. The picker modules 834 and 844 may also be provided with one or more first connectors 91 for power supply and signal transmission to the heaters 838a and 848a or the temperature sensors 838b and 848b.

The supporting portions 833 and 843 are connected to the first connector 91 when coupled with the picker modules 834 and 844 to supply power to the heaters 838a and 848a and the temperature sensors 838b and 848b And a second connector 92 for transmitting a signal may be provided.

The terminals of the first connector 91 and the terminals of the second connector 92 may be electrically connected to each other by a method of being inserted into each other or the like.

By the combination of the picker modules 834 and 844 and the supporting portions 833 and 843, the heaters 838a and 848a can be connected to each other without any separate connection work by the construction of the first connector 91 and the second connector 92, , Power supply to the temperature sensors 838b and 848b, and signal transmission may be possible. That is, the first connector 91 and the second connector 92 are provided at portions where the picker modules 834 and 844 and the support portions 833 and 843 are in contact with each other to connect the picker modules 834 and 844 and the support portions 833, and 843, respectively.

As another example of the heating unit for heating the element 1, the element pressing tool 830 or 840 is provided with the element 1 picked up by the pickers 831 and 841 as shown in Figs. 12 and 13 A heating gas spray unit for spraying the heating gas toward the shower head can be provided. The element 1 can be heated by the heating gas injected into the element 1 by the heating gas injection unit so that a high temperature test for the element 1 can be performed. When a plurality of picker modules 834 and 844 are provided in the element pressing tools 830 and 840, a plurality of heating gas injection units may be provided in the plurality of picker modules 834 and 844, respectively. In such a case, the temperature of the heating gas injected by the plurality of heating gas injection units can be independently controlled according to the plurality of picker modules 834 and 844.

The heating gas injection unit includes a guide member 893 disposed around the outer periphery of the adsorption pad 892 and forming a jetting port 894 through which the heating gas is jetted together with the adsorption pad 892 and a jetting member 893 communicating with the jetting port 894 And a heating gas passage 895 connected to a heating gas supplier 896 for supplying a heating gas. The heating gas flow path 895 may be formed inside the heating blocks 838 and 848. The shape of the heating jetting port 894 may be formed in various shapes such that the heating gas jetted through the jetting port 894 can be jetted toward the element 1 adsorbed on the adsorption pad 892. [ The guide member 893 is spaced apart from the outer circumferential surface of the adsorption pad 892 by a predetermined distance so that the injection port 894 can be formed around the outer periphery of the adsorption pad 892, And may be coupled to the pick corner blocks 836 and 846 to enclose them. The injection port 894 can be connected to the heating gas supplier 896 through the heating gas flow path 895. The heated gas flow path 895 may be formed inside the picker modules 834 and 844 but is not limited thereto and the heating gas flow path 895 may be a separate tube connected to the adsorption pad 892 Can be.

According to such a configuration, when the element 1 is adsorbed to the adsorption pad 892 of the pickers 831 and 841 of the element pressing tools 830 and 840, The heating element is sprayed from the injection port 894 formed around the outer periphery of the adsorption pad 892 and the element 1 can be heated while the injected heating gas hits the element 1 adsorbed on the adsorption pad 892. [ As compared with the case where the element 1 is heated by using the heaters 838a and 848a to the picker modules 834 and 844 since the heating of the element 1 is directly performed by the heating body, The temperature of the element 1 can be quickly heated and the temperature drop of the element 1 can be minimized so that the inspection of the element 1 can be performed at a predetermined temperature Can be accurately performed.

The heater 838a and 848a may not be installed in the picker modules 838 and 844 when the injection port 894 through which the heating gas is injected is formed around the outer periphery of the adsorption pad 892. Accordingly, It is possible to eliminate the complexity of designing and the difficulty of assembling the heaters 838a, 848a for the heaters 838, 844. Of course, the heaters 838a and 848a and the heating gas injection unit may be provided together with the picker modules 838 and 844.

In addition, in the course of the element pressing tools 830 and 840 pressing the element 1 to the test socket 310, the heating gas may be injected from the injection port 894, and the injected heating gas may be injected into the test socket 310 The test socket 310 can be heated while being collided. As compared with the case where the test socket 310 is directly heated by heating the test socket 310 and the heater is installed in the test socket 310 and the test socket 310 is heated using the heater, It is possible to eliminate the complexity of the design and the difficulty of assembling the heater for installing the heater.

On the other hand, the picker modules 834 and 844 may be provided with temperature sensors 838b and 848b for sensing the temperature of the heating gas. Accordingly, the temperature of the heating gas injected toward the element 1 can be controlled according to the result sensed by the temperature sensors 838b and 848b. A plurality of temperature sensors 838b and 848b may be provided in the plurality of picker modules 834 and 844, respectively, when a plurality of heating gas injection units are provided in the plurality of picker modules 834 and 844, respectively. The plurality of temperature sensors 838b and 848b sense the temperature of the heating gas injected toward the picked up element 1 in each picker module 834 and 844 and the temperature sensed by the plurality of temperature sensors 838b and 848b Depending on the result, the temperature of the heating gas can be controlled.

As described above, the heating gas injection unit and the temperature sensors 838b and 848b are provided for each of the picker modules 834 and 844, respectively. The temperature of the heating element can be independently controlled so that the temperature is independently controlled according to the characteristics of the plurality of elements 1 picked up by the element pressing tools 830 and 840 to perform a test Can be performed more accurately.

The support portions 833 and 843 are provided on one side of the support portions 833 and 843 and the picker modules 834 and 844 so that the picker modules 834 and 844 can be detachably coupled to the support portions 833 and 843. [ And a fastening unit 850 for fastening the picker modules 834 and 844 to the support parts 833 and 843. The picker module 834 and 844 may be provided on the other side of the support parts 833 and 843 and the picker modules 834 and 844, , 844) for supporting the first support unit (860). According to this configuration, the support portions 833 and 843 and the picker modules 834 and 844 can be fastened to each other by the fastening unit 850 in a state where they are supported by the first support unit 860.

The fastening unit 850 includes a ring 851 provided on one side of the picker modules 834 and 844 and a ring moving member 852 for moving the ring 851 in the up and down direction, And a hooking member 853 provided on the hook 851 and hooked on the hook 851. According to such a configuration, the ring 861 is hooked on the hooking member 853 and the hook 851 is pulled downward by using the hooking member 852, so that the hooks 833 and 843 and the picker module 834, and 844 can be fastened to each other.

The first supporting unit 860 includes a projecting piece 861 protruding from the other side of the picker modules 834 and 844 by a predetermined length and a projecting piece 861 provided on the other side of the supporting portions 833 and 843, And a protruding eccentric portion 862 fixed and fixed. The protruding and uneven portions 862 protrude in a predetermined length from the lower side of the supporting portions 833 and 843, that is, the lower side of the first plates 833a and 843a, so as to provide a space into which the protruded pieces 861 are inserted And a second support member 864 which is supported on the first support member 863 and spaced apart from the lower side of the support portions 833 and 843 by a predetermined distance . The second support member 864 is brought into contact with the projecting piece 861 so that the projecting piece 861 can be easily inserted into the space between the lower side of the support portions 833 and 843 and the second support member 864 It is preferable that the surface is formed as a curved surface. The projecting and unfixing portion 862 includes an elastic member 865 for elastically supporting the second supporting member 864 and a fixing member 866 for fixing the elastic member 865 to the supporting portions 833 and 843, . ≪ / RTI > The second supporting member 864 is resiliently supported by the elastic member 865 so that the protruding piece 861 can be easily inserted into the space between the lower side of the supporting portions 833 and 843 and the second supporting member 864 Can be inserted. After the protruding piece 861 is inserted into the space between the lower side of the supporting portions 833 and 843 and the second supporting member 864, the elastic member 865 presses the second supporting member 864 The protruded piece 861 can be firmly fixed so as not to be detached from the space between the lower side of the supporting portions 833 and 843 and the second supporting member 864.

According to such a configuration, the protruding piece 861 is inserted into the space between the lower side of the supporting portions 833 and 843 and the second supporting member 864, and the loop 851 is inserted into the hooking member 853 And the support portions 833 and 843 and the picker modules 834 and 844 can be coupled to each other by a simple operation of pulling the ring 851 downward by using the ring moving member 862.

The support portions 833 and 843 and the picker modules 834 and 844 are provided with support portions 833 and 843 so that the operation of coupling the support portions 833 and 843 and the picker modules 834 and 844 to each other can be more easily performed. And a second supporting unit 870 for guiding the upper surfaces of the first and second plates 835 and 845 to be in close contact with each other.

The second supporting unit 870 includes a protruding bar 871 protruding from the upper surface of the picker modules 834 and 844 and having a head 875 having a stepped portion formed thereon, A head receiving portion 872 in which the head 875 of the protruding bar 871 is received and a head insertion hole 874 into which the head 875 is inserted can be formed. The head 875 is received in the head receiving portion 872 through the head inserting hole 874 in the process of coupling the supporting portions 833 and 843 and the picker modules 834 and 844 to each other And the step portion of the head 875 is caught by the holding plate 873 by the relative horizontal movement of the picker modules 834 and 844 relative to the supporting portions 833 and 843, 834, 844 can be supported.

The second support unit 870 also serves to fix the support portions 833 and 843 and the picker modules 834 and 844 to each other so that the first support unit 860 and the second support unit 870 But only one of them may be provided.

A positioning unit 880 is provided between the support portions 833 and 843 and the picker modules 834 and 844 to determine the coupling position between the support portions 833 and 843 and the picker modules 834 and 844 .

For example, the positioning unit 880 includes a protruding rod 881 protruding from the upper surface of the picker module 834, 844 and a protruding rod 881 penetrating from the lower side of the supports 833, 843, And may include a protruding bar insertion groove 882 to be inserted. According to this configuration, the protruding rods 881 are inserted into the protruding rod insertion grooves 882 while the supporting portions 833 and 843 and the picker modules 834 and 844 are coupled with each other, And the coupling positions of the picker modules 834 and 844 can be determined.

On the other hand, in a state where the supporting portions 833 and 843 and the picker modules 834 and 844 are coupled to each other, the lower side of the supporting portions 833 and 843 and the upper side of the picker modules 834 and 844 are brought into close contact with each other. A sensing sensor 889 for sensing that the lower surfaces of the support portions 833 and 843 and the upper surfaces of the picker modules 834 and 844 are in close contact with each other is provided in the support portions 833 and 843 or the picker modules 834 and 844 . The present invention is not limited to this and the sensor 889 may be disposed on the upper side of the support members 833 and 843 As shown in FIG. The sensing sensor 889 may be a pressure sensor that senses surface contact. It is possible to detect whether or not the lower surface of the support portions 833 and 843 and the upper surface of the picker module 834 and 844 are in close contact with each other by using the detection sensor 889. The support portions 833 and 843 And the picker modules 834 and 844 are coupled to each other.

The element pressing tools 830 and 840 are moved in the horizontal direction (Y-axis direction) and the vertical direction (X-axis direction) while the element pressing tools 830 and 840 are moved in the first shuttle part 610 and the second shuttle part 620, To the test socket 310 of the test section 310 and moves the tested device 1 from the test socket 310 to the first shuttle section 610 and the second shuttle section 620.

For example, as shown in Figs. 14 to 17, in order to move the element pressing tools 830 and 840 in the horizontal direction (Y-axis direction) A first vertical moving device 802 is provided which is connected to the device pressing tools 830 and 840 in order to move the device pressing tools 830 and 840 in the vertical direction (Z-axis direction) do.

The horizontal movement device 801 includes a connection member 830a and 840a extending in the vertical direction from the element pressing tools 830 and 840 and connected to the vertical movement direction of the support shafts 830a and 840a, And 840b and a horizontal driving unit 803 for moving the connecting members 830b and 840b in the horizontal direction.

The support shafts 830a and 840a are formed in the connection members 830b and 840b so as to be vertically penetrated and connected to the connection members 830b and 840b so that the movement of the support shafts 830a and 840a in the horizontal direction is restricted, Through holes 830c and 840c into which the shafts 830a and 840a are inserted can be formed. As the supporting shafts 830a and 840a are inserted into the through holes 830c and 840c of the connecting members 830b and 840b, the horizontal movement of the supporting shafts 830a and 840a is transmitted to the connecting members 830b and 840b But the movement of the support shafts 830a and 840a in the vertical direction is not constrained. The through holes 830c and 840c can also serve to guide the movement of the support shafts 830a and 840a in the vertical direction.

The horizontal driving unit 803 includes a belt 803a connected to the connecting members 830b and 840b, a pulley 803b around which the belt 803a is wound, a rotary motor 803b connected to the pulley 803b Not shown). According to such a construction, the pulley 803b is rotated by the rotational force of the rotation motor (not shown), and the connecting members 830b and 840b connected to the belt 803a and the belt 803a by the rotation of the pulley 803b, The supporting shafts 830a and 840a and the element pressing tools 830 and 840 connected to the connecting members 830b and 840b can be moved in the horizontal direction. In the embodiment of the present invention, the horizontal driving unit 803 is provided with the belt 803a and the pulley 803b. However, the present invention is not limited thereto. The horizontal driving unit 803 may be a hydraulic or pneumatic A variety of horizontal transport mechanisms may be used, including actuated actuators, linear motors or ballscrew devices.

In the first vertical movement device 802, the vertical movements of the support shafts 830a and 840a extending in the vertical direction from the element pressing tools 830 and 840 are constrained and connected to be movable in the horizontal direction The cam followers 830e and 840e connected to the moving blocks 830d and 840d and the cam members 830f and 840f in which the cam followers 830e and 840e are inserted are formed 830g and 840g connected to the moving blocks 830d and 840d and elevation guides 830h and 840h for guiding movement of the moving blocks 830d and 840d in the vertical direction.

Guide rods 830i and 840i are connected to the end portions of the support shafts 830a and 840a and extend in the horizontal direction to guide the movement of the support shafts 830a and 840a in the horizontal direction . Thus, the support shafts 830a and 840a can be moved in the horizontal direction along the guide rails 830i and 840i.

Driving motors 830j and 840j are connected to the cam members 830g and 840g so that the cam members 830g and 840g can be rotated by driving the driving motors 830j and 840j. The cam members 830g and 840g may be provided in pairs so as to be connected to the pair of element pressing tools 830 and 840, respectively.

The cam grooves 830f and 840f are formed to include a first radius section and a second radius section having a constant radius and a variable section connecting the first radius section and the second radius section. When the cam grooves 830f and 840f are configured as described above, the element pressing tools 830 and 840 are positioned on the upper side when the cam yarn movements 830e and 840e are in the first radius section having a small radius, The device pressing tools 830 and 840 are moved upward or downward when the moving cam followers 830e and 840e are in the variable section and the moving speed of the moving cam followers 830e and 840e is larger than that of the second The element pressing tools 830 and 840 are kept in a lower position.

The moving blocks 830d and 840d can be connected to the cam members 830g and 840g through insertion of the cam followers 830e and 840e into the cam grooves 830f and 840f. The moving blocks 830d and 840d are connected to the elevation guides 830h and 840h and can move up and down in the vertical direction. Therefore, when the cam members 830g and 840g are rotated, the cam followers 830e and 840e move in the vertical direction in accordance with the shapes of the cam grooves 830f and 840f, and thus are connected to the cam followers 830e and 840e The movable blocks 830d and 840d can be moved in the vertical direction and the element pressing tools 830 and 840 connected to the movable blocks 830d and 840d and the supporting shafts 830a and 840a can be moved in the vertical direction .

The elevation guides 830h and 840h can be fixed to the fixture 804 provided at the upper portion of the movable blocks 830d and 840d. However, the present invention is not limited to this, and various configurations can be used as the elevation guides 830h and 840h as long as they can guide the elevating and lowering of the moving blocks 830d and 840d.

According to such a configuration, the element pressing tools 830 and 840 are moved in the horizontal direction by the horizontal moving device 801, and thereby, between the first shuttle part 610 and the test socket 310, The element pressing tools 830 and 840 can be moved in the horizontal direction between the shuttle part 620 and the test socket 310. [ The element pressing tools 830 and 840 are vertically moved by the first vertical movement device 802 to the upper portion of the first shuttle portion 610 and the upper portion of the second shuttle portion 620 and the upper portion of the test socket 310, The element 1 can be picked up or the element 1 can be loaded. These element pressing tools 830 and 840 move vertically at the top of the test socket 310 to move the element 1 to the test socket 310 in order to firmly couple the element 1 to the test socket 310 It is possible to perform the function of pressing with a constant force.

As described above, since the element pressing tools 830 and 840 are moved in the vertical direction in accordance with the rotation of the cam members 830g and 840g, the moving position of the element pressing tools 830 and 840 in the vertical direction can be accurately set .

Also, in the process of the test of the device 1 being pressed by the test socket 310, the pressurized state of the device 1 with respect to the test socket 310 must be maintained for a predetermined time. For this purpose, when only a linear movement motor such as a rotary motor or a linear motor of the ball screw device is used without using the cam members 830g and 840g, a relatively large voltage for pressing the element 1 is continuously applied to the linear movement motor The pressing force of the element 1 with respect to the test socket 310 is applied to the driving motors 830j and 840j when the cam members 830g and 840g are used Irrespective of changes in the voltage applied to the cam members 830g and 840g. Therefore, when the first vertical movement device 802 for moving the element pressing tools 830 and 840 in the vertical direction includes the cam members 830g and 840g, the cam members 830g and 840g are used There is an effect that the energy can be saved as compared with the case where only the linear movement motor is used.

On the other hand, depending on the type of the device 1 to be tested or the type of the test socket 310 so that the device 1 can be precisely pressed to the test socket 310 so that the test on the device 1 can be accurately performed, The pressing position at which the pickers 831 and 841 of the tools 830 and 840 are to be positioned can be changed. It is also necessary to check and check whether the element pressing tools 830 and 840 are accurately lowered to the pressing position and press the element 1 to the test socket 310. [

Accordingly, in order to change or confirm the pressing position of the element pressing tools 830 and 840, the horizontal moving device 801 and the first vertical moving device 802 connected to the element pressing tools 830 and 840 are moved up and down It is necessary to determine whether or not the pressing positions of the element pressing tools 830 and 840 are to be set at the pressing position, that is, the reference position, by rotating the cam members 830g and 840g.

8 and 9, a horizontal moving device 801, and a first vertical moving device 802, as shown in FIGS. 18 and 19, for the device testing apparatus according to the embodiment of the present invention. A second vertical movement device 805 for moving the element pressing part linearly in the vertical direction by being connected to the pressing part and a second vertical movement device 805 for moving the element pressing tools 830 and 840 by the second vertical movement device 805, 830 when the detected load reaches a preset reference load, and detects the load applied to the test part 300 by the second vertical movement device 805 when the load is applied to the test tool 300. [ And a control unit 807 for determining the position of the pressing position as a pressing position.

The second vertical movement device 805 may also be connected to the first vertical movement device 802 and the horizontal movement device 801 and in this case the first vertical movement device 802 and the horizontal movement device 801 may be connected together And can be raised and lowered by the second vertical movement device 805, whereby the element pressing tools 830 and 840 can be raised and lowered.

The portions of the element pressing tools 830 and 840 which contact the test portion 300 are positioned on the lower sides of the picker modules 834 and 844 located around the pickers 831 and 841, As shown in Fig. To this end, a portion of the lower side of the pick ground blocks 836 and 846, which is in contact with the test portion 300, may be made of a metal such as aluminum.

The portion where the element pressing tools 830 and 840 contact with the test portion 300 may be the upper surface of the support frame 312 supporting the test socket 310. For this, the portion of the upper surface of the support frame 312 where the element pressing tools 830 and 840 are contacted may be made of a metal such as aluminum. The element pressing tools 830 and 840 are pressed while the lower side of the picker modules 834 and 844 is in contact with the upper surface of the support frame 312 in the process of pressing the element 1 to the test socket 310, The pressing position of the element 1 with respect to the test socket 310 is determined.

Therefore, when the height of the support frame 312 varies depending on the type of the element 1, the type of the test socket 310, or the type of the terminal 311 provided in the test socket 310, It can be determined whether or not the element 1 is located at the pressing position by judging whether or not the lower surface of the element pressing tools 830 and 840 is in contact with the upper surface of the support frame 312. [

For this purpose, it is possible to consider a method of providing a sensor for detecting whether the lower side of the element pressing tool 830 is in contact with the upper surface of the support frame 312. However, in such a case, There is a problem in that the configuration of the element pressing tools 830 and 840 and the test socket 310 becomes complicated when considering the installation position of the sensor and the like.

Therefore, when the element pressing tools 830 and 840 are brought into contact with the test portion 300, the change amount of the load of the second vertical movement device 805 is sensed, and the test portion 300, And a control unit 807 for determining the position of the element pressing tools 830 and 840 as a pressing position when the detected load reaches a preset reference load.

When the second vertical movement device 805 is a belt conveyance mechanism that is connected to the ball screw device including the motor 806 or the motor 806 through a pulley, Similarly, it can be connected to the motor 806 to sense a load such as the torque of the motor 806. When the element pressing tools 830 and 840 are lowered by the second vertical movement device 805 in a state where the element pressing tools 830 and 840 are not in contact with the test portion 300, The amount of change in the load of the motor 806 sensed by the controller 807 is not large. However, when the element pressing tools 830 and 840 contact the test unit 300, the load sensed by the controller 807 increases. The controller 807 senses the load of the motor 806 and uses the sensed load to move the second vertical movement device 805 when the element pressing tools 830 and 840 are in contact with the test portion 300. [ And the position of the element pressing tools 830 and 840 when the detected load reaches a preset reference load is determined as the pressing position.

As another example, when the second vertical movement device 805 is a linear motor that operates using electromagnetic interaction between the permanent magnet and the electromagnet, the control unit 807 can be configured to sense the load of the linear motor.

Hereinafter, a method of setting the pressing positions of the element pressing tools 830 and 840 using the above-described configuration will be described.

First, the first element pressing tool 830 of the element pressing tools 830 and 840 is positioned on the upper portion of the test portion 300 having a predetermined height, that is, the upper portion of the support frame 312, The first element pressing tool 830 is positioned at the lowest position where the first element pressing tool 830 can be lowered by the rotation of the cam member 830a by rotating the cam member 830g connected to the pressing tool 830 .

Then, the second vertical movement device 805 is operated to gradually lower the element pressing portion 830 while gradually lowering the element pressing portion 830. At the same time, the control unit 807 detects the load applied to the test unit 300 by the first element pressing tool 830 through sensing the load of the second vertical movement unit 805.

18 and 19, as the first element pressing tool 830 is lowered by the second vertical movement device 805, the first element pressing tool 830 contacts the test portion 300 , Whereby the load applied to the test portion 300 by the first element pressing tool 830 is changed. At this time, when the load applied to the test unit 300 by the first element pressing tool 830 becomes the reference load, the control unit 807 determines that the position of the first element pressing tool 830 coincides with the preset pressing position And the operation of the second vertical movement device 805 is stopped.

After completing the process of setting the pressing position of the first element pressing tool 830 as described above, the process of setting the pressing position of the second element pressing tool 840 is performed by the first element pressing tool 830, In the same manner as in the process of setting the pressing position of the pressing member.

When the pressing position of the element pressing tools 830 and 840 is set through the above process, the pressing force of the element 1 pushing the element 1 to the test socket 310 by the element pressing tools 830 and 840 The test procedure can be performed.

When it is necessary to adjust the pressing position of the element pressing tools 830 and 840 according to the type of the element 1 or the type of the test socket 310, Alternatively, if it is necessary to confirm and check whether the element pressing tools 830 and 840 are correctly lowered to the pressing position and press the element 1 to the test socket 310, the second vertical movement device 805, The device pressing tools 830 and 840 are lowered to be in contact with the test portion 300 and the load of the second vertical movement device 805 is sensed and the test load is applied to the test portion 300 The pressing position of the element pressing tools 830 and 840 is determined as the pressing position by determining the position of the element pressing tools 830 and 840 when the detected load becomes the preset reference load It can be determined easily and accurately.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

1: device 310: test socket
610: first shuttle part 620: second shuttle part
801: Horizontal moving device 802: First vertical moving device
830, 840: element pressing tool 830b, 840b:
830g, 840g: Cam member 805: Second vertical movement device

Claims (14)

  1. A loading section in which a plurality of elements are loaded;
    A test unit provided with a plurality of test sockets for performing a test on elements transferred from the loading unit;
    An unloading unit for classifying devices tested by the test unit according to a test result; And
    And a device pressing portion for picking up the device and pressing the device with the test socket,
    The device pressing portion includes:
    At least one element pressing tool that picks up the element and presses the element into the test socket by linear movement in the vertical direction;
    A horizontal moving device connected to the element pressing tool to horizontally move the element pressing tool to an upper portion of the test socket; And
    Wherein the element pressing tool is located at the upper portion of the test socket by the horizontal moving device so as to press the element to the test socket, the element pressing tool linearly moves in the vertical direction by rotation of the cam member, Wherein the device inspection apparatus comprises:
  2. The method according to claim 1,
    The horizontal movement device comprises:
    A connection member having a support shaft extending in the vertical direction from the element pressing tool so as to be movable in a vertical direction while restricting movement in a horizontal direction; And
    And a horizontal driving unit for moving the connecting member in a horizontal direction.
  3. The method of claim 2,
    Wherein the connection member is formed with a through hole through which the support shaft is inserted so as to penetrate in the vertical direction.
  4. The method of claim 2,
    Wherein the horizontal driver comprises:
    A belt connected to the connecting member;
    A pulley on which the belt is wound; And
    And a rotation motor connected to the pulley.
  5. The method according to claim 1,
    The first vertical movement device includes:
    A movable block extending in a vertical direction from the element pressing tool so that movement of the support axes in the vertical direction is constrained and movable in a horizontal direction, respectively;
    A cam follower connected to the moving block and inserted in a cam groove formed in the cam member and moving in a vertical direction according to a shape of the cam groove; And
    And an elevation guide connected to the moving block to guide the movement of the moving block in the vertical direction.
  6. The method of claim 5,
    Wherein the movable block is provided with a guide rail connected to an end of the support shaft and extending in a horizontal direction to guide movement of the support shaft in a horizontal direction.
  7. The method according to claim 1,
    A second vertical movement device for linearly moving the element pressing portion with respect to the test portion; And
    When the element pushing tool is brought into contact with the test portion by the second vertical movement device, detects a load applied to the test portion by the second vertical movement device, and when the detected load reaches a preset reference load And a control unit for determining the position of the element pressing tool of the second pressing unit as a pressing position.
  8. The method of claim 7,
    Wherein the second vertical movement device comprises a motor,
    Wherein the control unit detects a load applied to the test unit by detecting a load of the motor.
  9. The method of claim 7,
    The element pressing tool includes a support portion movably installed, and at least one picker module detachably coupled to the support portion and coupled with at least one picker,
    The test socket is supported on a support frame,
    And the lower surface of the picker module is brought into contact with the upper surface of the support frame by the descent of the element pressing tool.
  10. The method according to any one of claims 1 to 9,
    At least one shuttle part for transferring the element transferred from the loading part to the test part and transferring the element transferred from the test part to the unloading part;
    One or more loading and unloading tools for picking up devices from the loading unit and delivering them to the shuttle unit; And
    And at least one unloading / transporting tool for picking up the device from the shuttle and delivering it to the unloading unit,
    Wherein the element pressing tool picks up an element from the shuttle part, presses the element into the test socket, and transmits the tested element to the shuttle part while being pressed into the test socket.
  11. The method of claim 10,
    A loading buffer unit for temporarily loading an element transferred from the loading unit; And
    Further comprising an unloading buffer unit for temporarily loading the tested devices in the test unit.
  12. The method of claim 11,
    Wherein the loading transfer tool includes a first loading transfer tool for picking up an element from the loading section and transferring the element to the loading buffer section and a second loading transfer tool for picking up the element from the loading buffer section and transferring the element to the shuttle section,
    The unloading / conveying tool includes a first unloading / conveying tool for picking up an element from the unloading buffer unit and transferring the element to the unloading unit, and a second unloading / transferring tool for picking up the element from the shuttle unit and transferring the element to the unloading buffer unit. And a loading transfer tool.
  13. The method of claim 10,
    The shuttle portion is moved between a first element transfer position for transferring the element from the loading portion, a device exchange position for exchanging the element with the test portion, and a second element transfer position for transferring the element to the unloading portion And a first shuttle portion and a second shuttle portion, each of which is provided with at least one shuttle plate.
  14. 14. The method of claim 13,
    The element pressing tool includes:
    A first element pressing tool which picks up an element from the shuttle plate of the first shuttle, presses the element into the test socket, and presses the test socket and transfers the tested element to the shuttle plate of the first shuttle; And
    And a second element pressing tool which picks up the element from the second shuttle part shuttle plate, presses the element into the test socket, and presses the test socket and transfers the tested element to the shuttle plate of the second shuttle part. Device.
KR1020130009887A 2012-02-29 2013-01-29 Semiconductor device inspection apparatus KR101436028B1 (en)

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CN201310062540.8A CN103293426B (en) 2012-02-29 2013-02-28 Inspection device for components
PCT/KR2013/001648 WO2013129873A1 (en) 2012-02-29 2013-02-28 Apparatus for testing elements
CN201310062576.6A CN103293458B (en) 2012-02-29 2013-02-28 Inspection device for components
PCT/KR2013/001647 WO2013129872A1 (en) 2012-02-29 2013-02-28 Apparatus for testing elements
TW102107308A TWI497088B (en) 2012-02-29 2013-03-01 Semiconductor device inspection apparatus
TW102107310A TWI497089B (en) 2012-02-29 2013-03-01 Semiconductor device inspection apparatus

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KR1020130009890A KR101417773B1 (en) 2012-02-29 2013-01-29 Semiconductor device inspection apparatus and semiconductor device pressing tool
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KR1020130009889A KR101417772B1 (en) 2012-02-29 2013-01-29 Semiconductor device inspection apparatus
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KR20130099826A (en) 2013-09-06
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KR20130099782A (en) 2013-09-06
KR20130099874A (en) 2013-09-06
KR20130099824A (en) 2013-09-06
KR20140053082A (en) 2014-05-07
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KR20140043106A (en) 2014-04-08
TWI497088B (en) 2015-08-21
KR101417772B1 (en) 2014-07-15
KR102000950B1 (en) 2019-07-17
TWI497089B (en) 2015-08-21
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KR20140043107A (en) 2014-04-08
KR20130099827A (en) 2013-09-06
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TW201341822A (en) 2013-10-16
TW201341823A (en) 2013-10-16

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