WO2021006627A1 - Apparatus for inspecting element - Google Patents

Apparatus for inspecting element Download PDF

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Publication number
WO2021006627A1
WO2021006627A1 PCT/KR2020/008947 KR2020008947W WO2021006627A1 WO 2021006627 A1 WO2021006627 A1 WO 2021006627A1 KR 2020008947 W KR2020008947 W KR 2020008947W WO 2021006627 A1 WO2021006627 A1 WO 2021006627A1
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WO
WIPO (PCT)
Prior art keywords
test
unit
axis direction
inspected
loading
Prior art date
Application number
PCT/KR2020/008947
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French (fr)
Korean (ko)
Inventor
유홍준
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(주)제이티
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Publication of WO2021006627A1 publication Critical patent/WO2021006627A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

Definitions

  • the present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus that inspects a plurality of elements and then classifies them according to an inspection result.
  • a semiconductor device (hereinafter referred to as a'device') undergoes various tests such as electrical characteristics, heat, and pressure reliability tests by a device inspection device, which is one of device handlers, while going through many processes such as a semiconductor process and a packaging process.
  • the device inspection device also needs to increase the processing speed per unit time to improve productivity.
  • the production quantity is relatively small, and a device inspection device suitable for inspection of LSI devices such as system LSIs of various types is required.
  • the present invention recognizes the need as described above, and provides a device inspection apparatus suitable for inspection of LSI devices, such as a system LSI having a relatively small production quantity and a variety of types.
  • Another object of the present invention is to provide a device inspection apparatus and a device inspection method capable of remarkably increasing the inspection speed for an element having a relatively long inspection time.
  • the device 1 is seated and the test socket 111 for inspection is n ⁇ m in the X-axis direction and Y-axis direction ( n and m are arranged in an array of 2 or more natural numbers), and are installed on the upper side of each of the test modules 110 and a plurality of test modules 110 stacked up and down, and corresponding to each of the test sockets 111
  • At least one test unit 100 including a plurality of pressing tools 120 that pressurize the test socket 111 and pick up the device 1 from the test socket 111 by vertical movement;
  • Loading/unloading position P1 for loading the device 1 from the tray 20 in which the devices 1 to be tested are loaded and unloading the tested device 1, the test module 110 and the device ( 1) at least one auxiliary shuttle unit 300 moving between the element exchange positions (P2) for exchanging;
  • a loading unit 410 in which the trays 20 in which the elements 1 to be inspected are loaded are located; Disclosed is an element
  • Each test module 110 of the test unit 100 is a replacement for exchanging an inspection position (M1) located directly under the pressure tool 120 and the auxiliary shuttle unit 300 and the element 1 It is installed to be movable between positions M2 and picks up the tested device 1 from the test module 110 located at the exchange position M2 and loads the device 1 to be tested, and the device It may include a first main transfer tool 510 for picking up the element 1 to be inspected with respect to the auxiliary shuttle unit 300 positioned at the exchange position P2 and loading the inspected element 1.
  • the first main transfer tool 510 may be moved to a position corresponding to the vertical height of the test module 110 of each of the test units 100 by the vertical direction moving part 590.
  • the auxiliary shuttle unit 300 includes an auxiliary shuttle plate 310 in which an element seating unit 311 is installed, and the auxiliary shuttle plate 310 at the loading/unloading position P1 and the element exchange. It includes an auxiliary shuttle moving drive unit that moves to the position P2, and the auxiliary shuttle plate 310 includes an element seating unit 211 in the X-axis direction and the Y-axis direction n ⁇ 2m (n, m is a natural number of 2 or more. ) Can be arranged.
  • One or more auxiliary shuttle plates 310 may be installed in consideration of an element exchange speed for the test unit 100.
  • the auxiliary shuttle plate 310 has a pitch in the X-axis direction formed by the element seating portions 211 in consideration of the element pick-up and place of the first main transfer tool 510 in the first main transfer tool 510.
  • the pickers 511 may be arranged to be the same as the pitch formed by them.
  • the auxiliary shuttle plate 310 has a first pitch in the X-axis direction of the element seating part 211 equal to the pitch made by the pickers 511 of the first main transfer tool 510 at the element exchange position P2. It may have a pitch and may have a second pitch smaller than the first pitch at the loading/unloading position P1.
  • the test unit 100 may be disposed in plural in the X-axis direction, and the loading part 410 and the unloading part 420 may be disposed in a pair in the X-axis direction.
  • a tres logistics part 600 for supplying and discharging a tray to the outside may be installed.
  • the device inspection device includes the number of test modules and the logistics transfer path of the device so that the device inspection speed can be optimized for a relatively long inspection process compared to the loading of the device from the tray and the unloading of the device to the tray There is an advantage of maximizing the device inspection efficiency of the device by optimizing it.
  • the device inspection device includes a tray and an auxiliary shuttle unit that performs element exchange as well as a test module and an element exchange, and by movably installing the test module for element exchange with the auxiliary shuttle unit, element exchange
  • a tray and an auxiliary shuttle unit that performs element exchange as well as a test module and an element exchange
  • FIG. 1 is a layout view showing an element inspection apparatus according to a first embodiment of the present invention.
  • FIG. 2A to 2E are conceptual diagrams illustrating an element exchange process in a test unit of the device inspection apparatus of FIG. 1.
  • FIG. 3 is a front view showing the configuration of a test unit and a main shuttle unit of the device inspection apparatus of FIG. 1.
  • 4A to 4H are conceptual diagrams illustrating a process of transferring an element between the auxiliary shuttle plate and the test unit in the device inspection apparatus of FIG. 1.
  • 5A to 5G are conceptual diagrams showing a process of replacing a test module and a pressure tool in the device inspection apparatus of FIG. 1.
  • FIG. 6 is a conceptual diagram showing an example of a configuration of a CCU unit among the device inspection apparatus of FIG. 1.
  • FIG. 7 is a layout diagram showing an element inspection apparatus according to a second embodiment of the present invention.
  • 8A to 8E are conceptual diagrams showing a device transfer process between a loading unit, an auxiliary shuttle plate, and a test unit.
  • the device 1 is seated and the test socket 111 for inspection is n ⁇ m (n, m is a natural number of 2 or more), and is installed on the upper side of the plurality of test modules 110 and the plurality of test sockets 111 that are stacked up and down and corresponding to each test socket 111
  • At least one test unit 100 including a pressing tool 120 for pressing the test socket 111 and picking up the device 1 from the test socket 111 by vertical movement;
  • the device to be tested 1 is transferred to the space between the test socket 111 and the pressure tool 120 with the device to be tested 1 loaded, and receives the tested device 1 from the pressure tool 120
  • the loading/unloading position P1 for loading the device 1 from the tray 20 in which the devices 1 to be inspected are loaded, and unloading the tested device 1, the main shuttle unit 200, and the device ( 1) at least one auxiliary shuttle unit 300 moving between the element exchange positions (P2) for
  • the test unit 100 includes a plurality of test sockets 111 arranged in an array of n ⁇ m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction, for example, 4 ⁇ 4, It is installed on the upper side of a plurality of test sockets 111, corresponding to each test socket 111, pressurizing the test socket 111 during inspection, and picking up the device 1 from the test socket 111 by moving up and down.
  • n ⁇ m is a natural number of 2 or more
  • the device 1 is mounted and the test socket 111 for inspection is arranged in an array of n ⁇ m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction.
  • the arranged test module 110 and the plurality of test sockets 111 are installed on the upper side, correspond to each test socket 111, pressurize the test socket 111 at the time of inspection, and lift the device 1
  • the pressure tool 120 picked up from the test socket 111 may be configured as one module 101.
  • the test module 110 is configured in which the device 1 is mounted and the test socket 111 for inspection is arranged in an array of n ⁇ m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction.
  • n ⁇ m n, m is a natural number of 2 or more
  • the pressing tool 120 is installed on the upper side of the plurality of test sockets 111 to correspond to each test socket 111, pressurize the test socket 111 during inspection, and test the device 1 by moving up and down.
  • a configuration for picking up from the socket 111 various configurations are possible.
  • the pressurization tool 120 corresponds to the arrangement of the test socket 111 to pick up and release each element 1 by pneumatic pressure, and the CCU units 121 are fixed.
  • various configurations are possible, such as including a vertical drive unit for moving the CCU unit 121 up and down.
  • the pressing tool 120 after picking up the element 1 by each of the CCU units 121, by pressing the element to the test socket 111 by lowering to perform the inspection on the element 1 .
  • FIG. 1 one module composed of the test module 110 and the pressing tool 120 is shown in FIG. 1 for performing a large number of device tests in consideration of the fact that the test speed is slow compared to the loading and unloading speed of the device 1
  • FIG. 3 when viewed from the front, a plurality of arrangements are possible in a horizontal direction, and a plurality of arrangements are possible, such as being arranged in a double layer upward.
  • one module composed of the test module 110 and the pressing tool 120 may change the type of the device 1 to be inspected.
  • a test module corresponding to the type of the changed device 1 ( 110) and the pressure tool 120 need to be replaced.
  • the present invention is characterized in that it includes a configuration that can be automatically replaced when the type of element 1 is changed in relation to the test module 110 and the pressing tool 120.
  • the pressing tool 120 as shown in Fig. 6, a head portion 121a for picking up and pressing the element 1, and an auto clamp 121b for coupling the head portion 121a to the main body. ) Can be included.
  • the pressing part 120 is a damping part 121e for alleviating the impact when the head part 121a contacts the element 1, and the test socket 111 for smooth contact on the test socket 111.
  • a floating portion 121d for imparting a fine degree of freedom to the head portion 121a may be additionally provided.
  • the pressing tool 120 descends in response to the head portions 121a of the pressing tool 1 20 corresponding to the test socket 111 of the test module 110.
  • the head part 121a is separated from the main body by the auto clamp 121b of the pressing tool 120 and placed in the test socket 111. Is settled.
  • the head portion 121a is separated and the test module 110 seated in the test socket 111 is discharged from the test portion 100 to the outside for replacement.
  • the pressure tool 120 is lowered to the pressure tool 120 as shown in FIG. 5F.
  • the part 121a is combined.
  • the pressure tool 120 to which the new head portion 121a is coupled rises upward and then can perform the above-described test operation.
  • the main shuttle unit 200 is installed in one or more and moves to the space between the test socket 111 and the pressure tool 120 in a state in which the device 1 to be inspected is loaded, and performs inspection from the pressure tool 120.
  • Various configurations are possible as a configuration in which the finished device 1 is received and the device 1 to be inspected is picked up by the pressing tool 120.
  • main shuttle unit 200 may have various configurations according to the arrangement and structure of the test unit 100 described above.
  • the main shuttle unit 200 is arranged in an array of n ⁇ m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction, and the CCU unit 121 of the pressing tool 120 And a main shuttle plate 210 in which element seating portions 211 are installed according to the number, and a main shuttle moving drive unit 230 for moving the main shuttle plate 210 to an element exchange position.
  • the main shuttle plate 210 is arranged and numbered in the CCU unit 121 of the pressing tool 120 arranged in an arrangement of n ⁇ m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction.
  • n ⁇ m n, m is a natural number of 2 or more
  • Various configurations are possible as a configuration in which the device mounting portions 211 on which the device is mounted accordingly are installed.
  • the element seating part 211 installed on the main shuttle plate 210 receives the element 1 picked up by the CCU unit 121 of the pressure tool 120 and then delivers the element 1 to be inspected immediately afterwards. It is preferable that it is arranged twice in at least one of the row direction (X-axis direction) and column direction (Y-axis direction) so that it is possible.
  • the element seating part 211 installed on the main shuttle plate 210 receives the element 1 picked up by the CCU unit 121 of the pressure tool 120 and the element 1 to be inspected immediately thereafter. It can be arranged twice in the column direction (Y-axis direction) to be able to transmit.
  • the element seating portion 211 is configured as described above, the element seating portion 211 is arranged in the column direction (Y-axis direction) with respect to the number of arrangements of the CCU unit 121, as shown in FIGS. 2A to 2E.
  • the element seating portion 211 is arranged in double (8 rows), any one of the odd and even rows is transferred to the element 1 picked up in the CCU unit 121, and the other rows of the odd and even rows receive the CCU unit 121
  • the element 1 to be inspected can be loaded so that) is picked up.
  • the element exchange position between the CCU unit 121 and the element seating portion 211 may be alternately changed.
  • the main shuttle moving drive unit 230 is a configuration for moving the main shuttle plate 210 to an element exchange position, and various configurations are possible according to a moving method of the main shuttle plate 210.
  • the main shuttle moving drive unit 230 includes a first horizontal moving unit 231 for moving the main shuttle plate 210 in the X-axis direction array direction, and the main shuttle plate 210 ) To move the test unit 100 in the vertical direction 232 in the Z-axis direction, and the main shuttle plate 210 between the pressing tool 120 and the test module 110, that is, in the Y-axis direction. It may include a second horizontal direction moving part.
  • the main shuttle plate 210 is installed in one or more in consideration of the element exchange speed for the test unit 100, and the main shuttle moving drive unit 230 is configured according to the number and movement structure of the main shuttle plate 210. Various configurations are possible.
  • the auxiliary shuttle unit 300 is installed in one or more loading/unloading for loading the device 1 from the tray 20 loaded with the devices 1 to be inspected, and unloading the tested device 1
  • Various configurations are possible as a configuration that moves between the position P1 and the element exchange position P2 for exchanging the main shuttle unit 200 and the element 1.
  • the auxiliary shuttle unit 300 is arranged in the CCU unit 121 of the pressing tool 120 arranged in an arrangement of n ⁇ m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction And a number, more preferably an auxiliary shuttle plate 310 in which the element seating portions 311 on which the element is seated according to the arrangement and number of the element seating portions 211 on the main shuttle plate 210 are installed, and the auxiliary shuttle plate ( It may include an auxiliary shuttle moving driver (not shown) for moving 310) to the element exchange position.
  • the auxiliary shuttle plate 310 is the element seating of the main shuttle plate 210 in which the element seating part 211 is arranged in an array of n ⁇ 2m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction.
  • n ⁇ 2m n, m is a natural number of 2 or more
  • Various configurations are possible as a configuration in which the device mounting portions 311 on which the device 1 is mounted are installed according to the arrangement and number of the parts 211.
  • the element exchange between the main shuttle plate 210 and the auxiliary shuttle plate 310 is transferred by the first main transfer tool 510.
  • the element seating portion 311 installed on the auxiliary shuttle plate 310 is attached to the first main transfer tool 510 that picks up the element 1 from the element seating portion 211 of the main shuttle plate 210.
  • the element seating part 311 installed on the auxiliary shuttle plate 310 receives the element 1 picked up by the first main transfer tool 510 and the element 1 to be inspected immediately after that It may be arranged twice in the column direction (Y-axis direction) to be picked up by the main transfer tool 510.
  • the auxiliary shuttle movement driving unit is a configuration for moving the auxiliary shuttle plate 310 to the element exchange position, and various configurations are possible according to a moving method of the auxiliary shuttle plate 310.
  • auxiliary shuttle plates 310 may be installed in consideration of the element exchange speed for the test unit 100, and may be installed corresponding to the number of main shuttle plates 210.
  • the pitch formed by the element seating portions 211 is the first main transfer tool 510 in consideration of the element pickup and place of the first main transfer tool 510. It is preferable that the pickers 511 of) are arranged in the same pitch as the pitch.
  • the pitch formed by the device seating portions 211 is minimized as much as possible.
  • the auxiliary shuttle plate 310 is, as shown in FIG. 1, in the element exchange position with the first main transfer tool 510, the X-axis direction pitch of the element seating part 211 is the first main transfer It is preferable to have a first pitch equal to the pitch formed by the pickers 511 of the tool 510, and to have a second pitch smaller than the first pitch at the element exchange position with the auxiliary transfer tools 520 and 530.
  • the auxiliary shuttle plate 310 may include a pitch adjusting unit for adjusting a pitch of the device seating unit 211 in the X-axis direction.
  • the pitch adjustment unit may have various configurations such as a cylinder and a link assembly.
  • the first main transfer tool 510 between the main shuttle unit 200 and the auxiliary shuttle unit 300, the device 1 that has been inspected seated on the element seating unit 211 of the main shuttle plate 210 After the pickup is lowered, it is moved onto the auxiliary shuttle plate 310 to deliver the element 1 to the empty element seating portion 311, and then immediately seated in the element seating portion 311 to pick up the element 1 to be inspected.
  • the first main transfer tool 510 and the auxiliary shuttle plate 310 relatively horizontally move for loading and picking up the element 1.
  • the first main transfer tool 510 is moved onto the main shuttle plate 210 to place the element 1 to be inspected on the empty element seating portion 211, and then the element seating portion of the main shuttle plate 210 The inspected element 1 mounted on 211 is picked up.
  • main shuttle plate 210 and the first main transfer tool 510 move horizontally relative to each other.
  • the first main transfer tool 510 includes a plurality of pickers (not shown) arranged in an arrangement of the CCU unit 120 described above, that is, n ⁇ m (n, m is a natural number of 2 or more). I can.
  • the plurality of pickers are configured to pick up or place elements, and various configurations are possible according to the pickup decoration.
  • a plurality of pickers may be arranged at a pitch corresponding to the arrangement of the CCU unit 120, that is, a pitch in the X-axis and Y-axis directions, or the pitches may be variable.
  • the element seating part 211 of the main shuttle plate 210 is X Pickers 511 arranged in the same manner as the arrangement of n ⁇ 2m in the axial direction and the Y-axis direction may be provided.
  • the first main transfer tool 510 includes pickers 511 in which the element seating portion 211 of the main shuttle plate 210 is arranged in the same manner as the arrangement of n ⁇ 2m in the X-axis direction and the Y-axis direction. If you do, faster element replacement is possible.
  • the first main transfer tool 510 exchanges the element 1 between the main shuttle plate 210 and the auxiliary shuttle plate 310 as follows.
  • the tested element 1 is picked up and assisted. It is moved onto the shuttle plate 310.
  • the test unit 100 presses the device 1 mounted on the test socket 111 by the pressing tool 120.
  • the auxiliary shuttle plate 310 has an element seating portion 311 on which the element 1 to be tested is seated while skipping one row in the row direction, among the pickers of the first main transfer tool 510. The element 1 is moved to a position corresponding to the position where it was not picked up.
  • the first main transfer tool 510 picks up the element 1 from the element seat 311 on which the element 1 to be tested is seated, as shown in FIG. 4B, and is located in an adjacent row.
  • the tested element 1 is placed on the empty element seating part 311.
  • the main shuttle plate 210 is in a state in which the tested elements 1 are seated in the element seating part 211 while skipping one row in the row direction, and the first main transfer tool 510, Pickers 511 which have not picked up the element 1 are positioned in the element seating part 211 in which the elements 1 that have been tested are mounted while skipping one row in the column direction.
  • the first main transfer tool 510 descends and picks up the device 1 from the device seat 211 on which the tested device 1 is seated, and is located in an adjacent row. After placing the element 1 to be tested on the empty element seating part 211, as shown in FIG. 4F, the first main transfer tool 510 is moved upward.
  • the element 1, which has been tested by the auxiliary transfer tools 520 and 530, is transferred to the unloading unit 420, and the element 1 to be newly inspected is transferred to the loading unit 410 ).
  • the first main transfer tool 510 and the main shuttle plate 210 which have finished exchanging the elements, are moved into the test unit 100 and are tested through the processes of FIGS. 2A to 2E, and FIGS. 4G and 4H.
  • the unit 100 and the element 1 are exchanged.
  • the main shuttle plate 210 may have a multi-stage moving structure 212 as shown in FIGS. 4A to 4H for smooth movement.
  • the multi-stage movement structure 412 may implement a relatively long movement of the main shuttle plate 210 by providing a plurality of guide rails 212a, 212b, 212c for long-distance movement.
  • the loading unit 410 is a configuration in which the trays 20 in which the elements 1 to be inspected are loaded are located, and various configurations are possible according to the loading and moving method of the tray 20.
  • the tray 20 is a configuration in which the device 1 is loaded and transported so that it can be supplied from the outside, and various configurations are possible depending on the type of device and related companies.
  • the unloading unit 420 is a configuration in which the trays 20 on which the inspected elements 1 are loaded are located, and various configurations are possible according to a loading and moving method of the tray 20.
  • the tray 20 is a configuration in which the device 1 is loaded and transported so that it can be supplied from the outside, and various configurations are possible depending on the type of device and related companies.
  • the arrangement and structure of the tray 20 in the unloading unit 420 can be configured in various ways according to the number of grades of the elements 1 to be divided and classification criteria.
  • the loading unit 410 and the unloading unit 420 may be arranged in a variety of ways, such as using a conventional technology, and an empty tray for temporary supply and temporary loading of the tray 20 A sub (not shown) may be disposed.
  • the loading unit 410 and the unloading unit 420 may be disposed in a pair on the left and the right when viewed from the front, as illustrated in FIG. 1, in consideration of the UPH of the device.
  • the loading unit 410 and the unloading unit 420 are arranged in a pair on the left and right when viewed from the front, the same type of device 1 is inspected through the left and right sides. Tray supply and discharge may be performed, or tray supply and discharge for inspection of different types of elements 1 may be performed on the left and right sides respectively.
  • a tres logistics unit 600 for supplying and discharging a tray to the outside may be installed at the front side of the loading unit 410 and the unloading unit 420.
  • the tray logistics unit 600 is installed on the front side of the loading unit 410 and the unloading unit 420 to receive the tray from the distribution line installed on the upper side and transfer it to the loading unit 410 and the unloading unit 420 Alternatively, the tray may be received from the loading unit 410 and the unloading unit 420 and discharged to the outside.
  • the tray logistics unit 600 may be installed in a pair of paths TR1 and TR2 connected to the distribution line on the left and right sides.
  • the tray is input and output using one path TR1, and when two types of devices are inspected, each path TR1, TR2 according to the type. You can enter and exit the tray using.
  • the device in the inspection of two types of devices, the device is largely divided based on the planar arrangement of the device, and the left side is the first type device, and the right side is the second type device.
  • test distribution of the numbers of the test unit 100 may be variously set.
  • Element exchange between at least one of the loading unit 410 and the unloading unit 420 and the auxiliary shuttle unit 300 may be performed by one or more auxiliary transfer tools 520 and 530.
  • the auxiliary transfer tools 520 and 530 are configured to exchange elements between at least one of the loading unit 410 and the unloading unit 420 and the auxiliary shuttle unit 300, wherein a plurality of elements are picked up. Can be equipped with pickers.
  • the pickers can be configured in various ways according to the pickup method of the device 1, and can be arranged in various ways such as 8 ⁇ 2, and can be arranged identical to or separately from the number and arrangement of the pickers of the first main transfer tool 510. have.
  • the pickers include pitches in the X-axis direction and Y-axis direction of the device seating groove on the tray 20 and the pitches in the X-axis direction and the Y-axis direction of the element seating portion 311 on the auxiliary shuttle plate 310. Since it may be different from each other, the pitch may be varied in at least one of the X-axis direction and the Y-axis direction.
  • the supply of the tray 20 from the outside and the discharge of the tray 20 to the outside can be configured in various ways, such as comprising a tray logistics system that automatically supplies and discharges the tray 20.
  • the device inspection apparatus shown in FIG. 1 to 6 is configured to move the main shuttle plate 210 between the test modules 110 arranged up and down in delivering the device to the test modules 110 stacked up and down. As a result, there is a problem that the height of the upper and lower arrangement of the test modules 110 is too high.
  • the entire configuration can be simplified and element replacement can be quickly performed.
  • the device 1 is seated and the test socket 111 for inspection is in the X-axis direction and Y
  • a plurality of test modules 110 are arranged in an array of n ⁇ m (n, m is a natural number of 2 or more) in the axial direction and are stacked up and down, and each test socket is installed on the upper side of each of the test modules 110
  • the device that has been inspected (1) is picked up, the device to be inspected (1) is loaded, and the device (1) to be inspected is picked up with respect to the auxiliary shuttle unit (300) located at the element exchange position (P2), It includes a first
  • the device 1 is mounted and the test socket 111 for inspection is arranged in an array of n ⁇ m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction.
  • a plurality of test modules 110 that are stacked up and down and installed on the upper side of each of the test modules 110 to correspond to each test socket 111 to pressurize the test socket 111 during inspection and move up and down.
  • a configuration including a plurality of pressing tools 120 to pick up the device 1 from the test socket 111 by, except for the movement of the test module 110 the same or similar to the first embodiment of the present invention Do.
  • the main shuttle unit 200 described above is not moved between the test module 110 and the pressing tool 120, so that the gap between the test module 110 and the pressing tool 120 is Is minimized.
  • test module 110 as shown in Figure 7 to Figure 9g, the inspection position (M1) located directly under the pressure tool 120, the auxiliary shuttle unit 300 and the element (1) exchange It is installed to be movable between the exchange positions (M2).
  • the moving structure of the test module 110 includes a guide unit (not shown) for guiding the movement of the test module 110 and a driving unit (not shown) for driving the movement of the test module 110 along the guide unit.
  • a guide unit for guiding the movement of the test module 110
  • a driving unit for driving the movement of the test module 110 along the guide unit.
  • the at least one auxiliary shuttle unit 300 is a loading/unloading position (P1) for loading the device 1 from the tray 20 in which the devices 1 to be inspected are loaded and unloading the tested device 1 ) And the test module 110 and the device exchange position (P2) for exchanging the device (1), various configurations are possible.
  • the at least one auxiliary shuttle unit 300 is the same as or similar to the first embodiment described above, and a detailed description thereof will be omitted.
  • the loading unit 410 is a configuration in which the trays 20 on which the elements 1 to be inspected are loaded are located and are the same as or similar to those of the first embodiment described above, and thus a detailed description thereof will be omitted.
  • the unloading unit 420 is the same as or similar to the first embodiment described above as a configuration in which the trays 20 on which the inspected elements 1 are loaded are located, and a detailed description thereof will be omitted.
  • the first main transfer tool 510 picks up the inspected element 1 from the test module 110 located at the exchange position M2, loads the element 1 to be inspected, and loads the element 1 to be inspected, and the element exchange position P2
  • a variety of configurations are possible as a configuration in which the device 1 to be inspected is picked up and the device 1 that has been inspected is loaded with respect to the auxiliary shuttle unit 300 located at ).
  • the first main transfer tool 510 is used to directly exchange elements with the test module 110 instead of the main shuttle unit 200. It differs from the first embodiment in that.
  • test modules 110 are stacked up and down and installed, the relative positions of the test modules 110 and the upper and lower sides are different, so a response is required.
  • the first main transfer tool 510 is preferably installed so that the relative vertical height for each of the test modules 110 is variable, and in consideration of the difficulty of moving the test module 110 upside down, each test module 110 ), it is preferable to be installed so as to be able to move up and down in a position corresponding to the vertical height of).
  • the first main transfer tool 510 includes a vertical moving part 590 that can move in the Y-axis direction and moves up and down, as in the first embodiment.
  • the first main transfer tool 510 like the X-Y-Z movement module 501, is preferably installed to enable movement in the Z-axis direction in addition to movement in the X-axis direction and the Y-axis direction.
  • the device exchange with the test module 110 can be performed more quickly.
  • the first main transfer tool 510 moves in the X-axis direction to each test module 110.
  • the device exchange with each test module 110 can be performed more quickly by performing the device exchange.
  • test module 110 moves from the inspection position M1 to the exchange position M2, as shown in FIG. 8A.
  • the first main transfer tool 510 moves to the inspection position M1 while picking up the element 1 to be inspected, and as shown in FIG. 8B, the element that has finished inspection in the test module 110 ( Pick up 1).
  • the test socket 111 on the test module 110 needs to be located at a position corresponding to the picker picking up the s.
  • test module 110 through the relative movement of the main moving tool 510 and the test module 110, for example, moving in the Y-axis direction of the test module 110 or moving in the Y-axis direction of the main moving tool 510 )
  • On the test socket 111 is moved to a position corresponding to the picker picking up the element 1 to be inspected, as shown in FIG. 8C.
  • the test socket 111 on the test module 110 is moved to a position corresponding to the picker picking up the device 1 to be tested, as shown in FIG. 8C, the device 1 to be tested is the test module It is loaded on the test socket 111 on (110).
  • test module 110 in which the element to be inspected 1 is loaded in the test socket 111 returns to the inspection position M1, as shown in FIG. 8D, and after the return, the pressing tool 120, the element For the inspection of (1), it descends and presses each element (1).
  • the main moving tool 510 which has completed the element exchange with the test module 110, is moved to the element exchange position P2 where the auxiliary shuttle unit 300 is located, as shown in Figs. 8D and 8E to assist. Element exchange with the shuttle unit 300 is performed.
  • the element exchange process of the auxiliary shuttle unit 300 and the main moving tool 510 at the element exchange position P2 is similar to those of Figs. 4A to 4C, so a detailed description thereof will be omitted.

Abstract

Disclosed is an apparatus for inspecting an element, comprising: one or more test units (100) including a plurality of test modules (110) on which elements (1) are mounted, and in which test sockets (111) for inspection are arranged in an array of n×m (n and m are natural numbers of 2 or more) in the X-axis direction and the Y-axis direction, the test modules being arranged so as to be stacked vertically, and a plurality of pressurizing tools (120) respectively installed on the upper sides of the test modules (110) to respectively correspond to the test sockets (111) and pressurize the test sockets (111) during inspection, and for picking up the elements (1) from the test sockets (111) by means of vertical movement; one or more auxiliary shuttle units (300) moving between a loading/unloading position (P1) for loading each element (1) from a tray (20) in which the elements (1) to be inspected are loaded and for unloading each inspected element (1), and an element exchange position (P2) for exchanging each of the test modules (110) and each of the elements (1); a loading unit (410) in which trays (20) having the elements (1) to be inspected loaded therein are positioned; and an unloading unit (420) in which the trays (20) having the inspected elements (1) loaded therein are positioned.

Description

소자검사장치Element inspection device
본 발명은, 소자검사장치에 관한 것으로서, 보다 상세하게는 다수의 소자들을 검사한 후 검사결과에 따라서 분류하는 소자검사장치에 관한 것이다.The present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus that inspects a plurality of elements and then classifies them according to an inspection result.
반도체소자(이하 '소자'라 한다)는 반도체공정, 패키징공정 등 많은 공정을 거치면서 소자핸들러의 하나인 소자검사장치에 의하여 전기특성, 열이나 압력에 대한 신뢰성 검사 등 다양한 검사를 거친다.A semiconductor device (hereinafter referred to as a'device') undergoes various tests such as electrical characteristics, heat, and pressure reliability tests by a device inspection device, which is one of device handlers, while going through many processes such as a semiconductor process and a packaging process.
한편 소자는 시장에서의 경쟁이 치열해짐에 따라서 원가절감이 절실히 요청되는 실정이다. 따라서 소자검사장치 또한 단위시간당 처리속도를 증가시켜 생산성을 향상시킬 필요가 있다.Meanwhile, as competition in the market becomes fiercer, cost reduction is urgently required. Therefore, the device inspection device also needs to increase the processing speed per unit time to improve productivity.
특히 대량으로 생산되는 메모리소자와는 달리 상대적으로 생산수량이 적으며 종류가 다양한 시스템 LSI와 같은 LSI소자에 대한 검사에 적합한 소자검사장치가 필요하다.In particular, unlike memory devices that are produced in large quantities, the production quantity is relatively small, and a device inspection device suitable for inspection of LSI devices such as system LSIs of various types is required.
본 발명은 상기와 같은 필요성을 인식하여, 상대적으로 생산수량이 적으며 종류가 다양한 시스템 LSI와 같은 LSI소자에 대한 검사에 적합한 소자검사장치를 제공하는 데 있다.The present invention recognizes the need as described above, and provides a device inspection apparatus suitable for inspection of LSI devices, such as a system LSI having a relatively small production quantity and a variety of types.
본 발명의 다른 목적은 상대적으로 긴 검사시간을 가지는 소자에 대한 검사속도를 현저하게 높일 수 있는 소자검사장치 및 소자검사방법을 제공하는 데 있다.Another object of the present invention is to provide a device inspection apparatus and a device inspection method capable of remarkably increasing the inspection speed for an element having a relatively long inspection time.
본 발명은 상기와 같은 본 발명의 목적을 달성하기 위하여 창출된 것으로서, 본 발명은, 소자(1)가 안착되며 검사를 위한 테스트소켓(111)이 X축방향 및 Y축방향으로 n×m(n, m은 2 이상의 자연수)의 배열로 배치되며 상하로 적층되어 배치되는 복수의 테스트모듈(110)들과, 상기 테스트모듈(110) 각각의 상측에 설치되어 상기 각 테스트소켓(111)에 대응되어 검사시에 테스트소켓(111)에 가압하고 상하이동에 의하여 소자(1)를 상기 테스트소켓(111)로부터 픽업하는 복수의 가압툴(120)들을 포함하는 하나 이상의 테스트부(100)와; 검사될 소자(1)들이 적재된 트레이(20)로부터 소자(1)를 로딩하고 검사를 마친 소자(1)를 언로딩하는 로딩/언로딩위치(P1)와 상기 테스트모듈(110)와 소자(1)를 교환하는 소자교환위치(P2) 사이를 이동하는 하나 이상의 보조셔틀부(300)와; 검사될 소자(1)들이 적재된 트레이(20)들이 위치되는 로딩부(410)와; 검사를 마친 소자(1)들이 적재되는 트레이(20)들이 위치된 언로딩부(420)를 포함하는 소자검사장치를 개시한다.The present invention was created to achieve the object of the present invention as described above, in the present invention, the device 1 is seated and the test socket 111 for inspection is n×m in the X-axis direction and Y-axis direction ( n and m are arranged in an array of 2 or more natural numbers), and are installed on the upper side of each of the test modules 110 and a plurality of test modules 110 stacked up and down, and corresponding to each of the test sockets 111 At least one test unit 100 including a plurality of pressing tools 120 that pressurize the test socket 111 and pick up the device 1 from the test socket 111 by vertical movement; Loading/unloading position P1 for loading the device 1 from the tray 20 in which the devices 1 to be tested are loaded and unloading the tested device 1, the test module 110 and the device ( 1) at least one auxiliary shuttle unit 300 moving between the element exchange positions (P2) for exchanging; A loading unit 410 in which the trays 20 in which the elements 1 to be inspected are loaded are located; Disclosed is an element inspection apparatus including an unloading unit 420 in which trays 20 on which the inspected elements 1 are loaded are provided.
상기 테스트부(100)의 각 테스트모듈(110)은, 상기 가압툴(120)의 직하방에 위치되는 검사위치(M1)와 상기 보조셔틀부(300)와 소자(1)를 교환하기 위한 교환위치(M2) 사이에서 이동가능하게 설치되며, 상기 교환위치(M2)에 위치된 상기 테스트모듈(110)로부터 검사를 마친 소자(1)를 픽업하고 검사될 소자(1)를 적재하며, 상기 소자교환위치(P2)에 위치된 보조셔틀부(300)에 대하여 검사될 소자(1)를 픽업하고 검사를 마친 소자(1)를 적재하는 제1메인이송툴(510)을 포함할 수 있다.Each test module 110 of the test unit 100 is a replacement for exchanging an inspection position (M1) located directly under the pressure tool 120 and the auxiliary shuttle unit 300 and the element 1 It is installed to be movable between positions M2 and picks up the tested device 1 from the test module 110 located at the exchange position M2 and loads the device 1 to be tested, and the device It may include a first main transfer tool 510 for picking up the element 1 to be inspected with respect to the auxiliary shuttle unit 300 positioned at the exchange position P2 and loading the inspected element 1.
상기 제1메인이송툴(510)은, 수직방향이동부(590)에 의하여 상기 각 테스트부(100)의 테스트모듈(110)의 수직높이에 대응되는 위치로 이동될 수 있다.The first main transfer tool 510 may be moved to a position corresponding to the vertical height of the test module 110 of each of the test units 100 by the vertical direction moving part 590.
상기 보조셔틀부(300)는, 소자가 안착되는 소자안착부(311)들이 설치된 보조셔틀플레이트(310)와, 상기 보조셔틀플레이트(310)를 상기 로딩/언로딩위치(P1)와 상기 소자교환위치(P2)로 이동시키는 보조셔틀이동구동부를 포함하며, 상기 보조셔틀플레이트(310)는, 소자안착부(211)가 X축방향 및 Y축방향으로 n×2m(n, m은 2 이상의 자연수)의 배열로 배치될 수 있다.The auxiliary shuttle unit 300 includes an auxiliary shuttle plate 310 in which an element seating unit 311 is installed, and the auxiliary shuttle plate 310 at the loading/unloading position P1 and the element exchange. It includes an auxiliary shuttle moving drive unit that moves to the position P2, and the auxiliary shuttle plate 310 includes an element seating unit 211 in the X-axis direction and the Y-axis direction n×2m (n, m is a natural number of 2 or more. ) Can be arranged.
상기 보조셔틀플레이트(310)는, 상기 테스트부(100)에 대한 소자교환속도를 고려하여 하나 이상으로 설치될 수 있다.One or more auxiliary shuttle plates 310 may be installed in consideration of an element exchange speed for the test unit 100.
상기 보조셔틀플레이트(310)는, 상기 제1메인이송툴(510)의 소자 픽업 및 플레이스를 고려하여 상기 소자안착부(211)들이 이루는 X축방향 피치가 상기 제1메인이송툴(510)의 픽커(511)들이 이루는 피치와 동일하게 배치될 수 있다.The auxiliary shuttle plate 310 has a pitch in the X-axis direction formed by the element seating portions 211 in consideration of the element pick-up and place of the first main transfer tool 510 in the first main transfer tool 510. The pickers 511 may be arranged to be the same as the pitch formed by them.
상기 보조셔틀플레이트(310)는, 상기 소자안착부(211)의 X축방향 피치가 상기 소자교환위치(P2)에서 제1메인이송툴(510)의 픽커(511)들이 이루는 피치와 동일한 제1피치를 가지며, 상기 로딩/언로딩위치(P1)에서 상기 제1피치보다 작은 제2피치를 가질 수 있다.The auxiliary shuttle plate 310 has a first pitch in the X-axis direction of the element seating part 211 equal to the pitch made by the pickers 511 of the first main transfer tool 510 at the element exchange position P2. It may have a pitch and may have a second pitch smaller than the first pitch at the loading/unloading position P1.
상기 테스트부(100)는, X축방향으로 복수로 배치되며, 상기 로딩부(410) 및 상기 언로딩부(420)는, X축방향으로 한 쌍으로 배치될 수 있다.The test unit 100 may be disposed in plural in the X-axis direction, and the loading part 410 and the unloading part 420 may be disposed in a pair in the X-axis direction.
상기 로딩부(410) 및 상기 언로딩부(420)의 전방에는, 외부와의 트레이공급 및 배출을 위한 트레물류부(600)가 설치될 수 있다.In front of the loading part 410 and the unloading part 420, a tres logistics part 600 for supplying and discharging a tray to the outside may be installed.
본 발명에 따른 소자검사장치는, 트레이로부터의 소자의 로딩 및 트레이로의 소자의 언로딩 속도에 비하여 소자검사속도가 상대적으로 긴 검사공정에 최적화될 수 있도록 테스트모듈의 숫자 및 소자의 물류이송경로를 최적화함으로써 장치의 소자검사효율을 극대화할 수 있는 이점이 있다.The device inspection device according to the present invention includes the number of test modules and the logistics transfer path of the device so that the device inspection speed can be optimized for a relatively long inspection process compared to the loading of the device from the tray and the unloading of the device to the tray There is an advantage of maximizing the device inspection efficiency of the device by optimizing it.
또한 본 발명에 따른 소자검사장치는, 트레이와 소자교환을 수행함과 아울러 테스트모듈과 소자교환을 수행하는 보조셔틀부를 구비하고 보조셔틀부와 소자교환을 위하여 테스트모듈을 이동가능하게 설치함으로써, 소자교환을 신속하게 수행하고 장치의 크기를 컴팩트하게 구성할 수 있는 이점이 있다.In addition, the device inspection device according to the present invention includes a tray and an auxiliary shuttle unit that performs element exchange as well as a test module and an element exchange, and by movably installing the test module for element exchange with the auxiliary shuttle unit, element exchange There is an advantage of being able to quickly perform and compact the size of the device.
도 1은, 본 발명의 제1실시예에 따른 소자검사장치를 보여주는 배치도이다.1 is a layout view showing an element inspection apparatus according to a first embodiment of the present invention.
도 2a 내지 도 2e는, 도 1의 소자검사장치 중 테스트부에서의 소자교환과정을 보여주는 개념도들이다.2A to 2E are conceptual diagrams illustrating an element exchange process in a test unit of the device inspection apparatus of FIG. 1.
도 3은, 도 1의 소자검사장치 중 테스트부 및 메인셔틀부의 구성을 보여주는 정면도이다.3 is a front view showing the configuration of a test unit and a main shuttle unit of the device inspection apparatus of FIG. 1.
도 4a 내지 도 4h는, 도 1의 소자검사장치 중 보조셔틀플레이트로부터 테스트부 사이의 소자의 이송과정을 보여주는 개념도들이다.4A to 4H are conceptual diagrams illustrating a process of transferring an element between the auxiliary shuttle plate and the test unit in the device inspection apparatus of FIG. 1.
도 5a 내지 도 5g는, 도 1의 소자검사장치 중 테스트모듈 및 가압툴의 교체과정과정을 보여주는 개념도들이다.5A to 5G are conceptual diagrams showing a process of replacing a test module and a pressure tool in the device inspection apparatus of FIG. 1.
도 6은, 도 1의 소자검사장치 중 CCU유닛의 구성의 일예를 보여주는 개념도이다.6 is a conceptual diagram showing an example of a configuration of a CCU unit among the device inspection apparatus of FIG. 1.
도 7은, 본 발명의 제2실시예에 따른 소자검사장치를 보여주는 배치도이다.7 is a layout diagram showing an element inspection apparatus according to a second embodiment of the present invention.
도 8a 내지 도 8e는, 로딩부, 보조셔틀플레이트 및 테스트부 사이의 소자 이송과정을 보여주는 개념도들이다.8A to 8E are conceptual diagrams showing a device transfer process between a loading unit, an auxiliary shuttle plate, and a test unit.
이하 본 발명에 따른 소자검사장치에 관하여 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, a device inspection apparatus according to the present invention will be described with reference to the accompanying drawings.
본 발명에 따른 소자검사장치는, 도 1 내지 도 3에 도시된 바와 같이, 소자(1)가 안착되며 검사를 위한 테스트소켓(111)이 X축방향 및 Y축방향으로 n×m(n, m은 2 이상의 자연수)의 배열로 배치되며 상하로 적층되어 배치되는 복수의 테스트모듈(110)들과,복수의 테스트소켓(111)들의 상측에 설치되어 각 테스트소켓(111)에 대응되어 검사시에 테스트소켓(111)에 가압하고 상하이동에 의하여 소자(1)를 테스트소켓(111)로부터 픽업하는 가압툴(120)을 포함하는 하나 이상의 테스트부(100)와; 검사될 소자(1)가 적재된 상태로 테스트소켓(111) 및 가압툴(120) 사이의 공간으로 이동하여 가압툴(120)로부터 검사를 마친 소자(1)를 전달받고 검사될 소자(1)이 가압툴(120)에 의하여 픽업되는 하나 이상의 메인셔틀부(200)와; 검사될 소자(1)들이 적재된 트레이(20)로부터 소자(1)를 로딩하고 검사를 마친 소자(1)를 언로딩하는 로딩/언로딩위치(P1)와 메인셔틀부(200)와 소자(1)를 교환하는 소자교환위치(P2) 사이를 이동하는 하나 이상의 보조셔틀부(300)와; 검사될 소자(1)들이 적재된 트레이(20)들이 위치되는 로딩부(410)와; 검사를 마친 소자(1)들이 적재되는 트레이(20)들이 위치된 언로딩부(420)를 포함한다.In the device inspection apparatus according to the present invention, as shown in FIGS. 1 to 3, the device 1 is seated and the test socket 111 for inspection is n×m (n, m is a natural number of 2 or more), and is installed on the upper side of the plurality of test modules 110 and the plurality of test sockets 111 that are stacked up and down and corresponding to each test socket 111 At least one test unit 100 including a pressing tool 120 for pressing the test socket 111 and picking up the device 1 from the test socket 111 by vertical movement; The device to be tested 1 is transferred to the space between the test socket 111 and the pressure tool 120 with the device to be tested 1 loaded, and receives the tested device 1 from the pressure tool 120 At least one main shuttle unit 200 picked up by the pressing tool 120; The loading/unloading position P1 for loading the device 1 from the tray 20 in which the devices 1 to be inspected are loaded, and unloading the tested device 1, the main shuttle unit 200, and the device ( 1) at least one auxiliary shuttle unit 300 moving between the element exchange positions (P2) for exchanging; A loading unit 410 in which the trays 20 in which the elements 1 to be inspected are loaded are located; It includes an unloading unit 420 in which the trays 20 on which the inspected elements 1 are loaded are located.
상기 테스트부(100)는, X축방향 및 Y축방향으로 n×m(n, m은 2 이상의 자연수), 예를 들면 4×4의 배열로 배치된 복수의 테스트소켓(111)들과, 복수의 테스트소켓(111)들의 상측에 설치되어 각 테스트소켓(111)에 대응되어 검사시에 테스트소켓(111)에 가압하고 상하이동에 의하여 소자(1)를 테스트소켓(111)로부터 픽업하는 가압툴(120)을 포함하는 구성으로서 다양한 구성이 가능하다.The test unit 100 includes a plurality of test sockets 111 arranged in an array of n×m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction, for example, 4×4, It is installed on the upper side of a plurality of test sockets 111, corresponding to each test socket 111, pressurizing the test socket 111 during inspection, and picking up the device 1 from the test socket 111 by moving up and down. As a configuration including the tool 120, various configurations are possible.
예로서, 상기 테스트부(100)는, 소자(1)가 안착되며 검사를 위한 테스트소켓(111)이 X축방향 및 Y축방향으로 n×m(n, m은 2 이상의 자연수)의 배열로 배치된 테스트모듈(110)과, 복수의 테스트소켓(111)들의 상측에 설치되어 각 테스트소켓(111)에 대응되어 검사시에 테스트소켓(111)에 가압하고 상하이동에 의하여 소자(1)를 테스트소켓(111)로부터 픽업하는 가압툴(120)을 하나의 모듈(101)로서 구성될 수 있다.For example, in the test unit 100, the device 1 is mounted and the test socket 111 for inspection is arranged in an array of n×m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction. The arranged test module 110 and the plurality of test sockets 111 are installed on the upper side, correspond to each test socket 111, pressurize the test socket 111 at the time of inspection, and lift the device 1 The pressure tool 120 picked up from the test socket 111 may be configured as one module 101.
상기 테스트모듈(110)은, 소자(1)가 안착되며 검사를 위한 테스트소켓(111)이 X축방향 및 Y축방향으로 n×m(n, m은 2 이상의 자연수)의 배열로 배치되는 구성으로서 소자(1)에 대한 검사환경을 제공하는 구성으로서 다양한 구성이 가능하다.The test module 110 is configured in which the device 1 is mounted and the test socket 111 for inspection is arranged in an array of n×m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction. As a configuration that provides an inspection environment for the device 1, various configurations are possible.
상기 가압툴(120)은, 복수의 테스트소켓(111)들의 상측에 설치되어 각 테스트소켓(111)에 대응되어 검사시에 테스트소켓(111)에 가압하고 상하이동에 의하여 소자(1)를 테스트소켓(111)로부터 픽업하는 구성으로서, 다양한 구성이 가능하다.The pressing tool 120 is installed on the upper side of the plurality of test sockets 111 to correspond to each test socket 111, pressurize the test socket 111 during inspection, and test the device 1 by moving up and down. As a configuration for picking up from the socket 111, various configurations are possible.
예로서, 상기 가압툴(120)은, 테스트소켓(111)의 배열에 대응되어 각 소자(1)를 공압에 의하여 픽업 및 픽업해제하는 CCU유닛(121)들과, CCU유닛(121)들이 고정되며 CCU유닛(121)들을 상하로 이동시키는 상하구동부를 포함하는 등 다양한 구성이 가능하다.For example, the pressurization tool 120 corresponds to the arrangement of the test socket 111 to pick up and release each element 1 by pneumatic pressure, and the CCU units 121 are fixed. And various configurations are possible, such as including a vertical drive unit for moving the CCU unit 121 up and down.
그리고 상기 가압툴(120)은, 각 CCU유닛(121)들에 의하여 소자(1)를 픽업한 후 하강에 의하여 테스트소켓(111)에 소자를 가압함으로써 소자(1)에 대한 검사를 수행하게 된다.And the pressing tool 120, after picking up the element 1 by each of the CCU units 121, by pressing the element to the test socket 111 by lowering to perform the inspection on the element 1 .
한편 상기 테스트모듈(110) 및 가압툴(120)로 구성된 하나의 모듈은, 소자(1)의 로딩 및 언로딩 속도에 비하여 검사속도가 늦은 점을 고려하여 많은 수의 소자검사 수행을 위하여 도 1 내지 도 3에 도시된 바와 같이 전방에서 보았을 때 수평방향으로 복수개로 배치되며, 또한 상측으로 복층으로 배치되는 등 다양한 배치가 가능하다.On the other hand, one module composed of the test module 110 and the pressing tool 120 is shown in FIG. 1 for performing a large number of device tests in consideration of the fact that the test speed is slow compared to the loading and unloading speed of the device 1 As shown in FIG. 3, when viewed from the front, a plurality of arrangements are possible in a horizontal direction, and a plurality of arrangements are possible, such as being arranged in a double layer upward.
또한 상기 테스트모듈(110) 및 가압툴(120)로 구성된 하나의 모듈은, 검사대상인 소자(1)의 종류가 변경될 수 있는바, 이를 위하여 변경된 소자(1)의 종류에 대응되는 테스트모듈(110) 및 가압툴(120)로 교체가 필요하다.In addition, one module composed of the test module 110 and the pressing tool 120 may change the type of the device 1 to be inspected. For this purpose, a test module corresponding to the type of the changed device 1 ( 110) and the pressure tool 120 need to be replaced.
이에 본 발명은, 테스트모듈(110) 및 가압툴(120)과 관련하여 소자(1)의 종류 변경시 자동으로 교체할 수 있는 구성을 포함함을 특징으로 한다.Accordingly, the present invention is characterized in that it includes a configuration that can be automatically replaced when the type of element 1 is changed in relation to the test module 110 and the pressing tool 120.
이를 위하여 상기 가압툴(120)은, 도 6에 도시된 바와 같이, 소자(1)의 픽업 및 가압을 수행하는 헤드부(121a)와, 헤드부(121a)를 본체에 결합시키는 오토클램프(121b)를 포함할 수 있다.To this end, the pressing tool 120, as shown in Fig. 6, a head portion 121a for picking up and pressing the element 1, and an auto clamp 121b for coupling the head portion 121a to the main body. ) Can be included.
이때 상기 가압부(120)는, 헤드부(121a)가 소자(1)와의 접촉시 충격을 완하시키기 위한 댐핑부(121e)와, 테스트소켓(111) 상의 원활한 접촉을 위하여 테스트소켓(111)에 대한 헤드부(121a)의 미세한 자유도를 부여하기 위한 플로팅부(121d)를 추가로 구비할 수 있다.At this time, the pressing part 120 is a damping part 121e for alleviating the impact when the head part 121a contacts the element 1, and the test socket 111 for smooth contact on the test socket 111. A floating portion 121d for imparting a fine degree of freedom to the head portion 121a may be additionally provided.
이하, 검사대상인 소자(1)의 규격, 특히 외형 크기의 변화가 있는 경우 테스트모듈(110) 및 가압툴(120)의 교체과정을 첨부된 도 5a 내지 도 5g를 참조하여 설명한다.Hereinafter, when there is a change in the standard of the device 1 to be inspected, particularly the external size, the replacement process of the test module 110 and the pressure tool 120 will be described with reference to FIGS.
도 5a에 도시된 바와 같이, 가압툴(120)은, 가압툴1(20)의 헤드부(121a)들이 테스트모듈(110)의 테스트소켓(111)에 대응되어 하강하게 된다.As shown in FIG. 5A, the pressing tool 120 descends in response to the head portions 121a of the pressing tool 1 20 corresponding to the test socket 111 of the test module 110.
상기 가압툴(120)의 하강 후, 도 5b 및 도 5c에 도시된 바와 같이, 가압툴(120) 중 오토클램프(121b)에 의하여 본체로부터 헤드부(121a)가 분리되어 테스트소켓(111)에 안착된다.After the lowering of the pressing tool 120, as shown in Figs. 5b and 5c, the head part 121a is separated from the main body by the auto clamp 121b of the pressing tool 120 and placed in the test socket 111. Is settled.
한편 헤드부(121a)가 분리되어 테스트소켓(111)에 안착되면, 도 5c에 도시된 바와 같이, 헤드부(121a)가 분리된 가압툴(120)을 상승하게 된다.On the other hand, when the head portion 121a is separated and seated on the test socket 111, the pressure tool 120 from which the head portion 121a is separated is lifted, as shown in FIG. 5C.
그리고 도 5d에 도시된 바와 같이, 헤드부(121a)가 분리되어 테스트소켓(111)에 안착된 테스트모듈(110)이 교체를 위하여 테스트부(100)로부터 외부로 배출된다.And, as shown in FIG. 5D, the head portion 121a is separated and the test module 110 seated in the test socket 111 is discharged from the test portion 100 to the outside for replacement.
그리고 도 5e에 도시된 바와 같이, 새로운 헤드부(121a) 및/또는 테스트모듈(110)로 교체된 후 테스트부(100) 내부로 다시 도입된다.And, as shown in FIG. 5E, after being replaced with a new head portion 121a and/or the test module 110, it is introduced into the test portion 100 again.
한편 새로운 헤드부(121a) 및/또는 테스트모듈(110)이 테스트부(100) 내부로 도입되면 가압툴(120)은, 도 5f에 도시된 바와 같이, 하강함으로써 가압툴(120)에 새로운 헤드부(121a)가 결합된다.On the other hand, when the new head portion 121a and/or the test module 110 is introduced into the test unit 100, the pressure tool 120 is lowered to the pressure tool 120 as shown in FIG. 5F. The part 121a is combined.
마지막으로 새로운 헤드부(121a)가 결합된 가압툴(120)은, 도 5g에 도시된 바와 같이, 상측으로 상승한 후 앞서 설명한 테스트 동작을 수행할 수 있게 된다.Finally, the pressure tool 120 to which the new head portion 121a is coupled, as shown in FIG. 5G, rises upward and then can perform the above-described test operation.
상기 메인셔틀부(200)는, 하나 이상으로 설치되어 검사될 소자(1)가 적재된 상태로 테스트소켓(111) 및 가압툴(120) 사이의 공간으로 이동하여 가압툴(120)로부터 검사를 마친 소자(1)를 전달받고 검사될 소자(1)이 가압툴(120)에 의하여 픽업되는 구성으로서 다양한 구성이 가능하다.The main shuttle unit 200 is installed in one or more and moves to the space between the test socket 111 and the pressure tool 120 in a state in which the device 1 to be inspected is loaded, and performs inspection from the pressure tool 120. Various configurations are possible as a configuration in which the finished device 1 is received and the device 1 to be inspected is picked up by the pressing tool 120.
특히 상기 메인셔틀부(200)는, 앞서 설명한 테스트부(100)의 배치 및 구조에 따라서 다양한 구성이 가능하다.In particular, the main shuttle unit 200 may have various configurations according to the arrangement and structure of the test unit 100 described above.
예로서, 상기 메인셔틀부(200)는, X축방향 및 Y축방향으로 n×m(n, m은 2 이상의 자연수)의 배열로 배치된 가압툴(120)의 CCU유닛(121)의 배치 및 숫자에 맞춰 소자가 안착되는 소자안착부(211)들이 설치된 메인셔틀플레이트(210)와, 메인셔틀플레이트(210)를 소자교환위치로 이동시키는 메인셔틀이동구동부(230)를 포함할 수 있다.As an example, the main shuttle unit 200 is arranged in an array of n×m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction, and the CCU unit 121 of the pressing tool 120 And a main shuttle plate 210 in which element seating portions 211 are installed according to the number, and a main shuttle moving drive unit 230 for moving the main shuttle plate 210 to an element exchange position.
상기 메인셔틀플레이트(210)는, X축방향 및 Y축방향으로 n×m(n, m은 2 이상의 자연수)의 배열로 배치된 가압툴(120)의 CCU유닛(121)의 배치 및 숫자에 맞춰 소자가 안착되는 소자안착부(211)들이 설치되는 구성으로서 다양한 구성이 가능하다.The main shuttle plate 210 is arranged and numbered in the CCU unit 121 of the pressing tool 120 arranged in an arrangement of n×m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction. Various configurations are possible as a configuration in which the device mounting portions 211 on which the device is mounted accordingly are installed.
여기서 상기 메인셔틀플레이트(210)에 설치되는 소자안착부(211)는, 가압툴(120)의 CCU유닛(121)에 픽업된 소자(1)를 전달받고 그 직후 검사될 소자(1)를 전달할 수 있도록 행방향(X축방향) 및 열방향(Y축방향) 중 적어도 하나의 방향으로 2배로 배치됨이 바람직하다.Here, the element seating part 211 installed on the main shuttle plate 210 receives the element 1 picked up by the CCU unit 121 of the pressure tool 120 and then delivers the element 1 to be inspected immediately afterwards. It is preferable that it is arranged twice in at least one of the row direction (X-axis direction) and column direction (Y-axis direction) so that it is possible.
예로서, 상기 메인셔틀플레이트(210)에 설치되는 소자안착부(211)는, 가압툴(120)의 CCU유닛(121)에 픽업된 소자(1)를 전달받고 그 직후 검사될 소자(1)를 전달할 수 있도록 열방향(Y축방향)으로 2배로 배치될 수 있다.As an example, the element seating part 211 installed on the main shuttle plate 210 receives the element 1 picked up by the CCU unit 121 of the pressure tool 120 and the element 1 to be inspected immediately thereafter. It can be arranged twice in the column direction (Y-axis direction) to be able to transmit.
상기와 같이 소자안착부(211)가 구성되면, 소자안착부(211)는, 도 2a 내지 도 2e에 도시된 바와 같이, CCU유닛(121)의 배열숫자에 대하여 열방향(Y축방향)으로 2배(8열)로 배치되면, 홀수열 및 짝수열 중 어느 하나의 열은 CCU유닛(121)에 픽업된 소자(1)를 전달받고, 홀수열 및 짝수열 중 나머지 열은 CCU유닛(121)이 픽업하도록 검사될 소자(1)가 적재될 수 있다.When the element seating portion 211 is configured as described above, the element seating portion 211 is arranged in the column direction (Y-axis direction) with respect to the number of arrangements of the CCU unit 121, as shown in FIGS. 2A to 2E. When arranged in double (8 rows), any one of the odd and even rows is transferred to the element 1 picked up in the CCU unit 121, and the other rows of the odd and even rows receive the CCU unit 121 The element 1 to be inspected can be loaded so that) is picked up.
상기 CCU유닛(121) 및 소자안착부(211) 사이에서 소자교환위치는 번갈아가면서 변경될 수 있다.The element exchange position between the CCU unit 121 and the element seating portion 211 may be alternately changed.
상기 메인셔틀이동구동부(230)는, 메인셔틀플레이트(210)를 소자교환위치로 이동시키는 구성으로서 메인셔틀플레이트(210)의 이동방식에 따라서 다양한 구성이 가능하다.The main shuttle moving drive unit 230 is a configuration for moving the main shuttle plate 210 to an element exchange position, and various configurations are possible according to a moving method of the main shuttle plate 210.
예로서, 상기 메인셔틀이동구동부(230)는, 메인셔틀플레이트(210)를 테스트부(100)가 X축방향 배열방향으로 이동시키는 제1수평방향이동부(231)와, 메인셔틀플레이트(210)를 테스트부(100)가 Z축방향 배열방향으로 이동시키는 상하이동부(232)와, 메인셔틀플레이트(210)를 가압툴(120) 및 테스트모듈(110) 사이, 즉 Y축방향으로 이동시키는 제2수평방향이동부를 포함할 수 있다.For example, the main shuttle moving drive unit 230 includes a first horizontal moving unit 231 for moving the main shuttle plate 210 in the X-axis direction array direction, and the main shuttle plate 210 ) To move the test unit 100 in the vertical direction 232 in the Z-axis direction, and the main shuttle plate 210 between the pressing tool 120 and the test module 110, that is, in the Y-axis direction. It may include a second horizontal direction moving part.
한편 상기 메인셔틀플레이트(210)는, 테스트부(100)에 대한 소자교환속도를 고려하여 하나 이상으로 설치되며, 메인셔틀이동구동부(230)는 메인셔틀플레이트(210)의 숫자 및 이동구조에 따라서 다양한 구성이 가능하다.Meanwhile, the main shuttle plate 210 is installed in one or more in consideration of the element exchange speed for the test unit 100, and the main shuttle moving drive unit 230 is configured according to the number and movement structure of the main shuttle plate 210. Various configurations are possible.
상기 보조셔틀부(300)는, 하나 이상으로 설치되어 검사될 소자(1)들이 적재된 트레이(20)로부터 소자(1)를 로딩하고 검사를 마친 소자(1)를 언로딩하는 로딩/언로딩위치(P1)와 메인셔틀부(200)와 소자(1)를 교환하는 소자교환위치(P2) 사이를 이동하는 구성으로서 다양한 구성이 가능하다.The auxiliary shuttle unit 300 is installed in one or more loading/unloading for loading the device 1 from the tray 20 loaded with the devices 1 to be inspected, and unloading the tested device 1 Various configurations are possible as a configuration that moves between the position P1 and the element exchange position P2 for exchanging the main shuttle unit 200 and the element 1.
예로서, 상기 보조셔틀부(300)는, X축방향 및 Y축방향으로 n×m(n, m은 2 이상의 자연수)의 배열로 배치된 가압툴(120)의 CCU유닛(121)의 배치 및 숫자, 보다 바람직하게는 메인셔틀플레이트(210) 상의 소자안착부(211)의 배치 및 숫자에 맞춰 소자가 안착되는 소자안착부(311)들이 설치된 보조셔틀플레이트(310)와, 보조셔틀플레이트(310)를 소자교환위치로 이동시키는 보조셔틀이동구동부(미도시)를 포함할 수 있다.As an example, the auxiliary shuttle unit 300 is arranged in the CCU unit 121 of the pressing tool 120 arranged in an arrangement of n×m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction And a number, more preferably an auxiliary shuttle plate 310 in which the element seating portions 311 on which the element is seated according to the arrangement and number of the element seating portions 211 on the main shuttle plate 210 are installed, and the auxiliary shuttle plate ( It may include an auxiliary shuttle moving driver (not shown) for moving 310) to the element exchange position.
상기 보조셔틀플레이트(310)는, 소자안착부(211)가 X축방향 및 Y축방향으로 n×2m(n, m은 2 이상의 자연수)의 배열로 배치된 메인셔틀플레이트(210)의 소자안착부(211)의 배치 및 숫자에 맞춰 소자(1)가 안착되는 소자안착부(311)들이 설치되는 구성으로서 다양한 구성이 가능하다.The auxiliary shuttle plate 310 is the element seating of the main shuttle plate 210 in which the element seating part 211 is arranged in an array of n×2m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction. Various configurations are possible as a configuration in which the device mounting portions 311 on which the device 1 is mounted are installed according to the arrangement and number of the parts 211.
여기서 상기 메인셔틀플레이트(210) 및 보조셔틀플레이트(310) 사이의 소자교환은, 제1메인이송툴(510)에 의하여 이송된다.Here, the element exchange between the main shuttle plate 210 and the auxiliary shuttle plate 310 is transferred by the first main transfer tool 510.
그리고, 상기 보조셔틀플레이트(310)에 설치되는 소자안착부(311)는, 메인셔틀플레이트(210)의 소자안착부(211)에서 소자(1)를 픽업한 제1메인이송툴(510)에 의하여 소자(1)를 전달받고 그 직후 검사될 소자(1)가 제1메인이송툴(510)에 의하여 전달될 수 있도록 행방향(X축방향) 및 열방향(Y축방향) 중 적어도 하나의 방향으로 2배로 배치됨이 바람직하다.In addition, the element seating portion 311 installed on the auxiliary shuttle plate 310 is attached to the first main transfer tool 510 that picks up the element 1 from the element seating portion 211 of the main shuttle plate 210. At least one of a row direction (X-axis direction) and a column direction (Y-axis direction) so that the element 1 to be inspected immediately after receiving the element 1 is transferred by the first main transfer tool 510. It is preferable to be arranged twice in the direction.
예로서, 상기 보조셔틀플레이트(310)에 설치되는 소자안착부(311)는, 제1메인이송툴(510)에 픽업된 소자(1)를 전달받고 그 직후 검사될 소자(1)가 제1메인이송툴(510)에 의하여 픽업될 수 있도록 열방향(Y축방향)으로 2배로 배치될 수 있다.For example, the element seating part 311 installed on the auxiliary shuttle plate 310 receives the element 1 picked up by the first main transfer tool 510 and the element 1 to be inspected immediately after that It may be arranged twice in the column direction (Y-axis direction) to be picked up by the main transfer tool 510.
상기 보조셔틀이동구동부는, 보조셔틀플레이트(310)를 소자교환위치로 이동시키는 구성으로서 보조셔틀플레이트(310)의 이동방식에 따라서 다양한 구성이 가능하다.The auxiliary shuttle movement driving unit is a configuration for moving the auxiliary shuttle plate 310 to the element exchange position, and various configurations are possible according to a moving method of the auxiliary shuttle plate 310.
한편 상기 보조셔틀플레이트(310)는, 테스트부(100)에 대한 소자교환속도를 고려하여 하나 이상으로 설치되며, 메인셔틀플레이트(210)의 숫자에 대응되어 설치될 수 있다.Meanwhile, one or more auxiliary shuttle plates 310 may be installed in consideration of the element exchange speed for the test unit 100, and may be installed corresponding to the number of main shuttle plates 210.
또한 상기 보조셔틀플레이트(310)는, 제1메인이송툴(510)의 소자 픽업 및 플레이스를 고려하면 소자안착부(211)들이 이루는 피치, 구체적으로 X축방향 피치가 제1메인이송툴(510)의 픽커(511)들이 이루는 피치와 동일하게 배치됨이 바람직하다.In addition, in the auxiliary shuttle plate 310, the pitch formed by the element seating portions 211, specifically, the pitch in the X-axis direction, is the first main transfer tool 510 in consideration of the element pickup and place of the first main transfer tool 510. It is preferable that the pickers 511 of) are arranged in the same pitch as the pitch.
그러나, 후술하는 보조이송툴(520, 530)의 소자 픽업 및 플레이스를 고려하면 소자안착부(211)들이 이루는 피치, 구체적으로 X축방향 피치가 가급적이면 최소화되는 것이 바람직하다.However, in consideration of the device pickup and placement of the auxiliary transfer tools 520 and 530 to be described later, it is preferable that the pitch formed by the device seating portions 211, specifically the pitch in the X-axis direction, is minimized as much as possible.
이를 위하여 상기 보조셔틀플레이트(310)는, 도 1에 도시된 바와 같이, 제1메인이송툴(510)과의 소자교환위치에서는, 소자안착부(211)의 X축방향 피치가 제1메인이송툴(510)의 픽커(511)들이 이루는 피치와 동일한 제1피치를 가지며, 보조이송툴(520, 530)과의 소자교환위치에서는 제1피치보다 작은 제2피치를 가짐이 바람직하다.To this end, the auxiliary shuttle plate 310 is, as shown in FIG. 1, in the element exchange position with the first main transfer tool 510, the X-axis direction pitch of the element seating part 211 is the first main transfer It is preferable to have a first pitch equal to the pitch formed by the pickers 511 of the tool 510, and to have a second pitch smaller than the first pitch at the element exchange position with the auxiliary transfer tools 520 and 530.
한편 상기 보조셔틀플레이트(310)은, 소자안착부(211)의 X축방향 피치의 조절을 위한 피치조절부가 구비할 수 있다.Meanwhile, the auxiliary shuttle plate 310 may include a pitch adjusting unit for adjusting a pitch of the device seating unit 211 in the X-axis direction.
상기 피치조절부는, 실린더, 링크조립체 등 다양한 구성이 가능하다.The pitch adjustment unit may have various configurations such as a cylinder and a link assembly.
상기 제1메인이송툴(510)은, 메인셔틀부(200) 및 보조셔틀부(300) 사이에서 메인셔틀플레이트(210)의 소자안착부(211)에 안착된 검사를 마친 소자(1)를 픽업하안 후 보조셔틀플레이트(310) 상으로 이동되어 빈 소자안착부(311)에 소자(1)를 전달한 후에 곧바로 소자안착부(311)에 안착돈 검사될 소자(1)를 픽업한다.The first main transfer tool 510, between the main shuttle unit 200 and the auxiliary shuttle unit 300, the device 1 that has been inspected seated on the element seating unit 211 of the main shuttle plate 210 After the pickup is lowered, it is moved onto the auxiliary shuttle plate 310 to deliver the element 1 to the empty element seating portion 311, and then immediately seated in the element seating portion 311 to pick up the element 1 to be inspected.
여기서 제1메인이송툴(510) 및 보조셔틀플레이트(310)은, 소자(1)의 적재 및 픽업을 위하여 상대적으로 수평이동을 수행한다.Here, the first main transfer tool 510 and the auxiliary shuttle plate 310 relatively horizontally move for loading and picking up the element 1.
그리고 상기 제1메인이송툴(510)은, 메인셔틀플레이트(210) 상으로 이동되어 빈 소자안착부(211)에 검사될 소자(1)를 안착시킨 후 메인셔틀플레이트(210)의 소자안착부(211)에 안착된 검사를 마친 소자(1)를 픽업한다. In addition, the first main transfer tool 510 is moved onto the main shuttle plate 210 to place the element 1 to be inspected on the empty element seating portion 211, and then the element seating portion of the main shuttle plate 210 The inspected element 1 mounted on 211 is picked up.
이를 위하여 메인셔틀플레이트(210) 및 제1메인이송툴(510)은, 서로 상대 수평이동한다.To this end, the main shuttle plate 210 and the first main transfer tool 510 move horizontally relative to each other.
한편 상기 제1메인이송툴(510)은, 앞서 설명한 CCU유닛(120)의 배열, 즉 n×m(n, m은 2 이상의 자연수)의 배열로 배치된 복수의 픽커(미도시)들을 구비할 수 있다.Meanwhile, the first main transfer tool 510 includes a plurality of pickers (not shown) arranged in an arrangement of the CCU unit 120 described above, that is, n×m (n, m is a natural number of 2 or more). I can.
상기 복수의 픽커들은, 소자를 픽업하거나 플레이스하는 구성으로서 픽업장식에 따라서 다양한 구성이 가능하다.The plurality of pickers are configured to pick up or place elements, and various configurations are possible according to the pickup decoration.
한편 상기 제1메인이송툴(510)은, 복수의 픽커들이 CCU유닛(120)의 배열, 즉 X축 및 Y축방향의 피치에 대응되는 피치로 배치되거나, 피치들이 가변될 수 있다.Meanwhile, in the first main transfer tool 510, a plurality of pickers may be arranged at a pitch corresponding to the arrangement of the CCU unit 120, that is, a pitch in the X-axis and Y-axis directions, or the pitches may be variable.
또한 상기 제1메인이송툴(510)은, 도 4a 내지 도 4h에 도시된 바와 같이, 메인셔틀플레이트(210)와의 신속한 소자교환을 위하여 메인셔틀플레이트(210)의 소자안착부(211)가 X축방향 및 Y축방향으로 n×2m의 배열과 동일하게 배열된 픽커(511)들을 구비할 수 있다.In addition, the first main transfer tool 510, as shown in Figs. 4A to 4H, the element seating part 211 of the main shuttle plate 210 is X Pickers 511 arranged in the same manner as the arrangement of n×2m in the axial direction and the Y-axis direction may be provided.
특히 상기 제1메인이송툴(510)은, 메인셔틀플레이트(210)의 소자안착부(211)가 X축방향 및 Y축방향으로 n×2m의 배열과 동일하게 배열된 픽커(511)들을 구비하면 보다 신속한 소자교환이 가능하다.In particular, the first main transfer tool 510 includes pickers 511 in which the element seating portion 211 of the main shuttle plate 210 is arranged in the same manner as the arrangement of n×2m in the X-axis direction and the Y-axis direction. If you do, faster element replacement is possible.
상기와 같은 상기 제1메인이송툴(510)은, 다음과 같이 메인셔틀플레이트(210) 및 보조셔틀플레이트(310) 사이에서 소자(1)를 교환한다.The first main transfer tool 510 as described above exchanges the element 1 between the main shuttle plate 210 and the auxiliary shuttle plate 310 as follows.
먼저, 도 4a에 도시된 바와 같이, n×2m의 배열과 동일하게 배열된 픽커(511)들을 통하여, 열방향으로 하나의 열을 건너띄면서 테스트를 마친 소자(1)를 픽업한 상태에서 보조셔틀플레이트(310) 상으로 이동된다.First, as shown in FIG. 4A, through pickers 511 arranged in the same manner as the n×2m array, while skipping one row in the column direction, the tested element 1 is picked up and assisted. It is moved onto the shuttle plate 310.
이때 상기 테스트부(100)는, 가압툴(120)에 의하여 소자(1)를 테스트소켓(111) 상에 안착된 소자(1)를 가압한다.At this time, the test unit 100 presses the device 1 mounted on the test socket 111 by the pressing tool 120.
또한 상기 보조셔틀플레이트(310)는, 열방향으로 하나의 열을 건너띄면서 테스트가 수행될 소자(1)가 안착된 소자안착부(311)가 제1메인이송툴(510)의 픽커들 중 소자(1)를 픽업하지 않은 위치와 대응되는 위치로 이동된다.In addition, the auxiliary shuttle plate 310 has an element seating portion 311 on which the element 1 to be tested is seated while skipping one row in the row direction, among the pickers of the first main transfer tool 510. The element 1 is moved to a position corresponding to the position where it was not picked up.
한편 상기 제1메인이송툴(510)은, 도 4b에 도시된 바와 같이, 테스트가 수행될 소자(1)가 안착된 소자안착부(311)로부터 소자(1)를 픽업하고, 인접한 열에 위치된 빈 소자안착부(311)에 테스트를 마친 소자(1)를 플레이스한다.Meanwhile, the first main transfer tool 510 picks up the element 1 from the element seat 311 on which the element 1 to be tested is seated, as shown in FIG. 4B, and is located in an adjacent row. The tested element 1 is placed on the empty element seating part 311.
그리고 상기 제1메인이송툴(510)은, 도 4c에 도시된 바와 같이, 상측으로 상승한 후, 도 4d에 도시된 바와 같이, 메인셔틀플레이트(210)의 상측으로 이동된다.And the first main transfer tool 510, as shown in Figure 4c, after rising upward, as shown in Figure 4d, is moved to the upper side of the main shuttle plate 210.
이때 상기 메인셔틀플레이트(210)는, 열방향으로 하나의 열을 건너띄면서 테스트를 마친 소자(1)들이 소자안착부(211)에 안착된 상태이며, 제1메인이송툴(510)은, 열방향으로 하나의 열을 건너띄면서 테스트를 마친 소자(1)들이 안착된 소자안착부(211)에 소자(1)를 픽업하지 않은 픽커(511)들이 위치된다.At this time, the main shuttle plate 210 is in a state in which the tested elements 1 are seated in the element seating part 211 while skipping one row in the row direction, and the first main transfer tool 510, Pickers 511 which have not picked up the element 1 are positioned in the element seating part 211 in which the elements 1 that have been tested are mounted while skipping one row in the column direction.
그리고 상기 제1메인이송툴(510)은, 도 4e에 도시된 바와 같이, 하강하여 테스트를 마친 소자(1)가 안착된 소자안착부(211)로부터 소자(1)를 픽업하고, 인접한 열에 위치된 빈 소자안착부(211)에 테스트가 수행될 소자(1)를 플레이스한 후, 도 4f에 도시된 바와 같이, 제1메인이송툴(510)은, 상측으로 이동된다.In addition, the first main transfer tool 510, as shown in FIG. 4E, descends and picks up the device 1 from the device seat 211 on which the tested device 1 is seated, and is located in an adjacent row. After placing the element 1 to be tested on the empty element seating part 211, as shown in FIG. 4F, the first main transfer tool 510 is moved upward.
이때 상기 보조셔틀플레이트(310)는, 보조이송툴(520, 530)에 의하여 테스트를 마친 소자(1)가 언로딩부(420)로 전달되고, 새로 검사될 소자(1)가 로딩부(410)로부터 전달받는다.At this time, in the auxiliary shuttle plate 310, the element 1, which has been tested by the auxiliary transfer tools 520 and 530, is transferred to the unloading unit 420, and the element 1 to be newly inspected is transferred to the loading unit 410 ).
한편 상기 제1메인이송툴(510)과 소자교환을 마친 메인셔틀플레이트(210)는, 테스트부(100) 내부로 이동되어, 도 2a 내지 도 2e, 및 도 4g 및 도 4h의 과정을 통하여 테스트부(100)와 소자(1)를 교환한다.On the other hand, the first main transfer tool 510 and the main shuttle plate 210, which have finished exchanging the elements, are moved into the test unit 100 and are tested through the processes of FIGS. 2A to 2E, and FIGS. 4G and 4H. The unit 100 and the element 1 are exchanged.
이때 상기 메인셔틀플레이트(210)는, 원할한 이동을 위하여 도 4a 내지 도 4h와 같이 다단식 이동구조(212)를 구비할 수 있다.At this time, the main shuttle plate 210 may have a multi-stage moving structure 212 as shown in FIGS. 4A to 4H for smooth movement.
상기 다단식 이동구조(412)는, 원거리의 이동을 위하여 복수의 가이드레일(212a, 212b, 212c)들을 구비함으로써 메인셔틀플레이트(210)의 상대적으로 긴 거리의 이동을 구현할 수 있다.The multi-stage movement structure 412 may implement a relatively long movement of the main shuttle plate 210 by providing a plurality of guide rails 212a, 212b, 212c for long-distance movement.
상기 로딩부(410)는, 검사될 소자(1)들이 적재된 트레이(20)들이 위치되는 구성으로서 트레이(20)의 적재 및 이동방식에 따라서 다양한 구성이 가능하다.The loading unit 410 is a configuration in which the trays 20 in which the elements 1 to be inspected are loaded are located, and various configurations are possible according to the loading and moving method of the tray 20.
그리고 상기 트레이(20)는, 소자(1)가 외부로부터 공급될 수 있도록 적재되어 이송되는 구성으로서 소자의 종류 및 관련회사에 따라서 다양한 구성이 가능하다.In addition, the tray 20 is a configuration in which the device 1 is loaded and transported so that it can be supplied from the outside, and various configurations are possible depending on the type of device and related companies.
상기 언로딩부(420)는, 검사를 마친 소자(1)들이 적재되는 트레이(20)들이 위치되는 구성으로서, 트레이(20)의 적재 및 이동방식에 따라서 다양한 구성이 가능하다.The unloading unit 420 is a configuration in which the trays 20 on which the inspected elements 1 are loaded are located, and various configurations are possible according to a loading and moving method of the tray 20.
그리고 상기 트레이(20)는, 소자(1)가 외부로부터 공급될 수 있도록 적재되어 이송되는 구성으로서 소자의 종류 및 관련회사에 따라서 다양한 구성이 가능하다.In addition, the tray 20 is a configuration in which the device 1 is loaded and transported so that it can be supplied from the outside, and various configurations are possible depending on the type of device and related companies.
그리고 상기 언로딩부(420)에서 트레이(20)의 배치방식 및 구조는 분률될 소자(1)의 등급의 수, 분류 기준에 따라서 다양한 구성이 가능하다.In addition, the arrangement and structure of the tray 20 in the unloading unit 420 can be configured in various ways according to the number of grades of the elements 1 to be divided and classification criteria.
한편 상기 로딩부(410) 및 언로딩부(420)의 배치 및 트레이이동구조는, 종래의 기술을 활용하는 등 다양한 배치가 가능하며, 트레이(20)의 임시공급, 임시적재 등을 위한 빈트레이부(미도시)가 배치될 수 있다.On the other hand, the loading unit 410 and the unloading unit 420 may be arranged in a variety of ways, such as using a conventional technology, and an empty tray for temporary supply and temporary loading of the tray 20 A sub (not shown) may be disposed.
또한 상기 로딩부(410) 및 언로딩부(420)는, 장치의 UPH를 고려하여, 도 1에 도시된 바와 같이, 전방에서 보았을 때 좌측 및 우측에 한 쌍으로 배치될 수 있다.In addition, the loading unit 410 and the unloading unit 420 may be disposed in a pair on the left and the right when viewed from the front, as illustrated in FIG. 1, in consideration of the UPH of the device.
특히 상기와 같이, 상기 로딩부(410) 및 언로딩부(420)가 전방에서 보았을 때 좌측 및 우측에 한 쌍으로 배치된 경우, 좌측 및 우측을 통하여 동일한 종류의 소자(1)의 검사를 위한 트레이의 공급 및 배출이 수행되거나, 좌측 및 우측 각각에 서로 다른 종류의 소자(1)의 검사를 위한 트레이의 공급 및 배출이 수행될 수 있다.In particular, as described above, when the loading unit 410 and the unloading unit 420 are arranged in a pair on the left and right when viewed from the front, the same type of device 1 is inspected through the left and right sides. Tray supply and discharge may be performed, or tray supply and discharge for inspection of different types of elements 1 may be performed on the left and right sides respectively.
그리고 상기 로딩부(410) 및 언로딩부(420)의 전방측에는, 외부와의 트레이공급 및 배출을 위한 트레물류부(600)가 설치될 수 있다.In addition, at the front side of the loading unit 410 and the unloading unit 420, a tres logistics unit 600 for supplying and discharging a tray to the outside may be installed.
상기 트레이물류부(600)는, 로딩부(410) 및 언로딩부(420)의 전방측에 설치되어 상측에 설치된 물류라인으로부터 트레이를 공급받아 로딩부(410) 및 언로딩부(420)에 전달하거나, 로딩부(410) 및 언로딩부(420)로부터 트레이를 전달받아 외부로 배출될 수 있다.The tray logistics unit 600 is installed on the front side of the loading unit 410 and the unloading unit 420 to receive the tray from the distribution line installed on the upper side and transfer it to the loading unit 410 and the unloading unit 420 Alternatively, the tray may be received from the loading unit 410 and the unloading unit 420 and discharged to the outside.
이때, 상기 트레이물류부(600)는, 좌측 및 우측에 물류라인과 연결되는 경로(TR1, TR2)가 한 쌍으로 설치될 수 있다.In this case, the tray logistics unit 600 may be installed in a pair of paths TR1 and TR2 connected to the distribution line on the left and right sides.
그리고 상기 소자검사장치가 한 종류의 소자를 검사하는 경우, 하나의 경로(TR1)를 이용하여 트레이를 입출하고, 두 종류의 소자를 검사하는 경우, 그 종류에 따라서 각각의 경로(TR1, TR2)를 이용하여 트레이를 입출할 수 있다.In addition, when the device inspection device inspects one type of device, the tray is input and output using one path TR1, and when two types of devices are inspected, each path TR1, TR2 according to the type. You can enter and exit the tray using.
이때, 두 종류의 소자의 검사에 있어서, 장치의 평면배치를 기준으로 크게 양분하여, 왼쪽은 제1종의 소자, 오른쪽은 제2종의 소자에 대한 검사를 수행할 수 있다.In this case, in the inspection of two types of devices, the device is largely divided based on the planar arrangement of the device, and the left side is the first type device, and the right side is the second type device.
여기서 소자의 종류에 따라서 검사속도가 다른 경우, 테스트부(100)의 숫자의 검사배분은, 다양하게 설정될 수 있음은 물론이다.Here, when the test speed is different according to the type of device, the test distribution of the numbers of the test unit 100 may be variously set.
상기 로딩부(410) 및 언로딩부(420) 중 적어도 하나 및 보조셔틀부(300) 사이의 소자교환은, 하나 이상의 보조이송툴(520, 530)에 의하여 수행될 수 있다.Element exchange between at least one of the loading unit 410 and the unloading unit 420 and the auxiliary shuttle unit 300 may be performed by one or more auxiliary transfer tools 520 and 530.
상기 보조이송툴(520, 530)은, 로딩부(410) 및 언로딩부(420) 중 적어도 하나 및 보조셔틀부(300) 사이에서 소자를 교환하는 구성으로서, 소자(1)를 픽업하는 복수의 픽커들을 구비할 수 있다.The auxiliary transfer tools 520 and 530 are configured to exchange elements between at least one of the loading unit 410 and the unloading unit 420 and the auxiliary shuttle unit 300, wherein a plurality of elements are picked up. Can be equipped with pickers.
상기 픽커들은, 소자(1)의 픽업방식에 따라서 다양한 구성이 가능하며, 8×2 등 다양한 배열이 가능하며, 제1메인이송툴(510)의 픽커의 숫자 및 배치와 동일하거나 별도로 배치될 수 있다.The pickers can be configured in various ways according to the pickup method of the device 1, and can be arranged in various ways such as 8×2, and can be arranged identical to or separately from the number and arrangement of the pickers of the first main transfer tool 510. have.
도한 상기 픽커들은, 트레이(20) 상의 소자안착홈의 X축방향 및 Y축방향의 피치들과, 보조셔틀플레이트(310) 상의 소자안착부(311)의 X축방향 및 Y축방향의 피치들이 서로 다를 수 있는바, X축방향 및 Y축방향 중 적어도 일방향으로 피치가 가변될 수 있다.Also, the pickers include pitches in the X-axis direction and Y-axis direction of the device seating groove on the tray 20 and the pitches in the X-axis direction and the Y-axis direction of the element seating portion 311 on the auxiliary shuttle plate 310. Since it may be different from each other, the pitch may be varied in at least one of the X-axis direction and the Y-axis direction.
한편 외부로부터의 트레이(20)의 공급 및 외부로의 트레이(20) 배출은, 자동으로 트레이(20)를 공급하고 배출하는 트레이물류시스템으로 이루어지는 등 다양한 구성이 가능하다.On the other hand, the supply of the tray 20 from the outside and the discharge of the tray 20 to the outside can be configured in various ways, such as comprising a tray logistics system that automatically supplies and discharges the tray 20.
한편 도 1 내 도 6에 도시된 소자검사장치는, 상하로 적층된 테스트모듈(110)로 소자를 전달함에 있어서 상하로 배치된 테스트모듈(110)들 사이로 메인셔틀플레이트(210)를 이동하도록 구성되는바, 테스트모듈(110)들의 상하 배치 높이가 지나치게 높아지는 문제점이 있다.Meanwhile, the device inspection apparatus shown in FIG. 1 to 6 is configured to move the main shuttle plate 210 between the test modules 110 arranged up and down in delivering the device to the test modules 110 stacked up and down. As a result, there is a problem that the height of the upper and lower arrangement of the test modules 110 is too high.
이에 테스트모듈(110)로의 소자전달에 있어서 메인셔틀플레이트를 사용하는 대신에 테스트모듈을 이동시킴으로써 전체 구성을 간소화함과 아울러 소자교환을 신속하게 수행할 수 있다.Accordingly, in the device transfer to the test module 110, by moving the test module instead of using the main shuttle plate, the entire configuration can be simplified and element replacement can be quickly performed.
이하 본 발명의 제2실시예에 따른 소자검사장치에 관하여 설명한다.Hereinafter, a device inspection apparatus according to a second embodiment of the present invention will be described.
본 발명의 제2실시예에 따른 소자검사장치는, 도 7 내지 도 9g에 도시된 바와 같이, 본 발명은, 소자(1)가 안착되며 검사를 위한 테스트소켓(111)이 X축방향 및 Y축방향으로 n×m(n, m은 2 이상의 자연수)의 배열로 배치되며 상하로 적층되어 배치되는 복수의 테스트모듈(110)들과, 테스트모듈(110) 각각의 상측에 설치되어 각 테스트소켓(111)에 대응되어 검사시에 테스트소켓(111)에 가압하고 상하이동에 의하여 소자(1)를 테스트소켓(111)로부터 픽업하는 복수의 가압툴(120)들을 포함하는 하나 이상의 테스트부(100)와; 검사될 소자(1)들이 적재된 트레이(20)로부터 소자(1)를 로딩하고 검사를 마친 소자(1)를 언로딩하는 로딩/언로딩위치(P1)와 테스트모듈(110)와 소자(1)를 교환하는 소자교환위치(P2) 사이를 이동하는 하나 이상의 보조셔틀부(300)와; 검사될 소자(1)들이 적재된 트레이(20)들이 위치되는 로딩부(410)와; 검사를 마친 소자(1)들이 적재되는 트레이(20)들이 위치된 언로딩부(420)를 포함하며, 테스트부(100)의 각 테스트모듈(110)은, 가압툴(120)의 직하방에 위치되는 검사위치(M1)와 보조셔틀부(300)와 소자(1)를 교환하기 위한 교환위치(M2) 사이에서 이동가능하게 설치되며, 교환위치(M2)에 위치된 테스트모듈(110)로부터 검사를 마친 소자(1)를 픽업하고 검사될 소자(1)를 적재하며, 소자교환위치(P2)에 위치된 보조셔틀부(300)에 대하여 검사될 소자(1)를 픽업하고 검사를 마친 소자(1)를 적재하는 제1메인이송툴(510)을 포함한다.In the device inspection apparatus according to the second embodiment of the present invention, as shown in FIGS. 7 to 9G, in the present invention, the device 1 is seated and the test socket 111 for inspection is in the X-axis direction and Y A plurality of test modules 110 are arranged in an array of n×m (n, m is a natural number of 2 or more) in the axial direction and are stacked up and down, and each test socket is installed on the upper side of each of the test modules 110 One or more test units (100) including a plurality of pressing tools (120) corresponding to 111 to pressurize the test socket (111) during inspection and pick up the device (1) from the test socket (111) by vertical movement. )Wow; Loading/unloading position (P1) for loading the device (1) from the tray (20) in which the device (1) to be inspected is loaded and unloading the device (1) that has been tested, and the test module (110) and device (1) At least one auxiliary shuttle unit 300 moving between the element exchange positions P2 for exchanging ); A loading unit 410 in which the trays 20 in which the elements 1 to be inspected are loaded are located; Includes an unloading unit 420 in which the trays 20 on which the tested elements 1 are loaded are located, and each test module 110 of the test unit 100 is directly under the pressing tool 120 It is installed to be movable between the inspection position (M1) located and the exchange position (M2) for exchanging the auxiliary shuttle unit 300 and the element 1, from the test module 110 located at the exchange position (M2) The device that has been inspected (1) is picked up, the device to be inspected (1) is loaded, and the device (1) to be inspected is picked up with respect to the auxiliary shuttle unit (300) located at the element exchange position (P2), It includes a first main transfer tool 510 for loading (1).
상기 하나 이상의 테스트부(100)는, 소자(1)가 안착되며 검사를 위한 테스트소켓(111)이 X축방향 및 Y축방향으로 n×m(n, m은 2 이상의 자연수)의 배열로 배치되며 상하로 적층되어 배치되는 복수의 테스트모듈(110)들과, 테스트모듈(110) 각각의 상측에 설치되어 각 테스트소켓(111)에 대응되어 검사시에 테스트소켓(111)에 가압하고 상하이동에 의하여 소자(1)를 테스트소켓(111)로부터 픽업하는 복수의 가압툴(120)들을 포함하는 구성으로서, 테스트모듈(110)의 이동을 제외하고는 본 발명의 제1실시예와 동일하거나 유사하다.In the one or more test units 100, the device 1 is mounted and the test socket 111 for inspection is arranged in an array of n×m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction. And a plurality of test modules 110 that are stacked up and down and installed on the upper side of each of the test modules 110 to correspond to each test socket 111 to pressurize the test socket 111 during inspection and move up and down. As a configuration including a plurality of pressing tools 120 to pick up the device 1 from the test socket 111 by, except for the movement of the test module 110, the same or similar to the first embodiment of the present invention Do.
특히 상기 테스트부(100)는, 앞서 설명한 메인셔틀부(200)가 테스트모듈(110) 및 가압툴(120) 사이에 이동되지 않는바 테스트모듈(110) 및 가압툴(120) 사이의 간격이 최소화된다.In particular, in the test unit 100, the main shuttle unit 200 described above is not moved between the test module 110 and the pressing tool 120, so that the gap between the test module 110 and the pressing tool 120 is Is minimized.
한편 상기 테스트모듈(110)은, 도 7 내지 도 9g에 도시된 바와 같이, 가압툴(120)의 직하방에 위치되는 검사위치(M1)와 보조셔틀부(300)와 소자(1)를 교환하기 위한 교환위치(M2) 사이에서 이동가능하게 설치된다.On the other hand, the test module 110, as shown in Figure 7 to Figure 9g, the inspection position (M1) located directly under the pressure tool 120, the auxiliary shuttle unit 300 and the element (1) exchange It is installed to be movable between the exchange positions (M2).
여기서 상기 테스트모듈(110)의 이동구조는, 테스트모듈(110)의 이동을 가이드하는 가이드부(미도시)와, 가이드부를 따라서 테스트모듈(110)의 이동을 구동하는 구동부(미도시)를 포함하는 등 다양한 구성이 가능하다.Here, the moving structure of the test module 110 includes a guide unit (not shown) for guiding the movement of the test module 110 and a driving unit (not shown) for driving the movement of the test module 110 along the guide unit. A variety of configurations are possible.
상기 하나 이상의 보조셔틀부(300)는, 검사될 소자(1)들이 적재된 트레이(20)로부터 소자(1)를 로딩하고 검사를 마친 소자(1)를 언로딩하는 로딩/언로딩위치(P1)와 테스트모듈(110)와 소자(1)를 교환하는 소자교환위치(P2) 사이를 이동하는 구성으로서 다양한 구성이 가능하다.The at least one auxiliary shuttle unit 300 is a loading/unloading position (P1) for loading the device 1 from the tray 20 in which the devices 1 to be inspected are loaded and unloading the tested device 1 ) And the test module 110 and the device exchange position (P2) for exchanging the device (1), various configurations are possible.
상기 하나 이상의 보조셔틀부(300)는, 앞서 설명한 제1실시예와 동일하거나 유사한바 자세한 설명은 생략한다.The at least one auxiliary shuttle unit 300 is the same as or similar to the first embodiment described above, and a detailed description thereof will be omitted.
상기 로딩부(410)는, 검사될 소자(1)들이 적재된 트레이(20)들이 위치되는 구성으로서 앞서 설명한 제1실시예와 동일하거나 유사한바 자세한 설명은 생략한다.The loading unit 410 is a configuration in which the trays 20 on which the elements 1 to be inspected are loaded are located and are the same as or similar to those of the first embodiment described above, and thus a detailed description thereof will be omitted.
상기 언로딩부(420)는, 검사를 마친 소자(1)들이 적재되는 트레이(20)들이 위치되는 구성으로서 앞서 설명한 제1실시예와 동일하거나 유사한바 자세한 설명은 생략한다.The unloading unit 420 is the same as or similar to the first embodiment described above as a configuration in which the trays 20 on which the inspected elements 1 are loaded are located, and a detailed description thereof will be omitted.
상기 제1메인이송툴(510)은, 교환위치(M2)에 위치된 테스트모듈(110)로부터 검사를 마친 소자(1)를 픽업하고 검사될 소자(1)를 적재하며, 소자교환위치(P2)에 위치된 보조셔틀부(300)에 대하여 검사될 소자(1)를 픽업하고 검사를 마친 소자(1)를 적재하는 구성으로서 다양한 구성이 가능하다.The first main transfer tool 510 picks up the inspected element 1 from the test module 110 located at the exchange position M2, loads the element 1 to be inspected, and loads the element 1 to be inspected, and the element exchange position P2 A variety of configurations are possible as a configuration in which the device 1 to be inspected is picked up and the device 1 that has been inspected is loaded with respect to the auxiliary shuttle unit 300 located at ).
여기서 본 발명의 제2실시예에서는 메인셔틀부(200)의 구성이 없는바, 제1메인이송툴(510)은, 메인셔틀부(200) 대신에 테스트모듈(110)과 직접 소자교환을 하는점에서 제1실시예와는 차이가 있다.Here, in the second embodiment of the present invention, since there is no configuration of the main shuttle unit 200, the first main transfer tool 510 is used to directly exchange elements with the test module 110 instead of the main shuttle unit 200. It differs from the first embodiment in that.
특히 테스트모듈(110)들이 상하로 적층되어 설치되어 있어 각 테스트모듈(110)과의 상하 상대위치가 달라져 이에 대한 대응이 필요하다.In particular, since the test modules 110 are stacked up and down and installed, the relative positions of the test modules 110 and the upper and lower sides are different, so a response is required.
이에 상기 제1메인이송툴(510)은, 각 테스트모듈(110)들에 대한 상대 상하높이가 가변되도록 설치됨이 바람직하며, 테스트모듈(110)의 상하이동이 어려운 점을 고려하여 각 테스트모듈(110)의 수직높이에 대응되는 위치로 상하이동 가능하게 설치됨이 바람직하다.Accordingly, the first main transfer tool 510 is preferably installed so that the relative vertical height for each of the test modules 110 is variable, and in consideration of the difficulty of moving the test module 110 upside down, each test module 110 ), it is preferable to be installed so as to be able to move up and down in a position corresponding to the vertical height of).
이를 위하여 상기 제1메인이송툴(510)은, 제1실시예에서와 같이 Y축방향으로 이동이 가능하면서 아울러 상하로 이동시키는 수직방향이동부(590)를 포함함이 바람직하다.To this end, it is preferable that the first main transfer tool 510 includes a vertical moving part 590 that can move in the Y-axis direction and moves up and down, as in the first embodiment.
즉, 상기 제1메인이송툴(510)은, X-Y-Z 이동모듈(501)같이 X축 방향이동 및 Y축 방향이동에 더하여 Z축 방향이동이 가능하도록 설치됨이 바람직하다.That is, the first main transfer tool 510, like the X-Y-Z movement module 501, is preferably installed to enable movement in the Z-axis direction in addition to movement in the X-axis direction and the Y-axis direction.
상기와 같이 테스트모듈(110)의 이동, 구체적으로 Y축방향의 이동 및 제1메인이동툴(510)의 조합에 의하여 복수의 테스트모듈(110)들이 상하로 적층된 테스트부(100)의 각 테스트모듈(110)과의 소자교환을 보다 신속하게 수행할 수 있다.Each of the test units 100 in which a plurality of test modules 110 are stacked vertically by a combination of the movement of the test module 110, specifically the movement in the Y-axis direction and the first main movement tool 510 as described above. The device exchange with the test module 110 can be performed more quickly.
더 나아가 복수의 테스트모듈(110)들이 상하로 적층된 테스트부(100)가 X축방향으로 복수로 배치된 경우 제1메인이송툴(510)이 X축방향으로 이동하여 각 테스트모듈(110)과 소자교환을 수행함으로써 각 테스트모듈(110)과의 소자교환을 보다 신속하게 수행할 수 있다.Furthermore, when a plurality of test units 100 in which a plurality of test modules 110 are stacked up and down are disposed in a plurality in the X-axis direction, the first main transfer tool 510 moves in the X-axis direction to each test module 110. The device exchange with each test module 110 can be performed more quickly by performing the device exchange.
한편 테스트모듈(110) 및 제1메인이송툴(510)의 소자교환은 도 8a 내지 도 8c에 도시된 바와 같다.Meanwhile, element replacement of the test module 110 and the first main transfer tool 510 is as shown in FIGS. 8A to 8C.
먼저 테스트모듈(110)은, 도 8a에 도시된 바와 같이, 검사위치(M1)에서 교환위치(M2)로 이동한다.First, the test module 110 moves from the inspection position M1 to the exchange position M2, as shown in FIG. 8A.
이때 제1메인이송툴(510)은, 검사될 소자(1)를 픽업한 상태로 검사위치(M1)로 이동하고, 도 8b에 도시된 바와 같이, 테스트모듈(110)에서 검사를 마친 소자(1)를 픽업한다.At this time, the first main transfer tool 510 moves to the inspection position M1 while picking up the element 1 to be inspected, and as shown in FIG. 8B, the element that has finished inspection in the test module 110 ( Pick up 1).
한편 제1메인이동툴(510)이 검사를 마친 소자(1)를 픽업하면 검사될 소자(1)를 테스트모듈(110) 상의 테스트소켓(111)에 적재되어야 하는바, 검사될 소자(1)를 픽업하고 있는 픽커에 대응되는 위치로 테스트모듈(110) 상의 테스트소켓(111)이 위치될 필요가 있다.Meanwhile, when the first main moving tool 510 picks up the tested device 1, the device 1 to be tested should be loaded in the test socket 111 on the test module 110, and the device to be tested 1 The test socket 111 on the test module 110 needs to be located at a position corresponding to the picker picking up the s.
이에 상기 메인이동툴(510) 및 테스트모듈(110)의 상대이동, 예를 들면 테스트모듈(110)의 Y축방향이동 또는 메인이동툴(510)의 Y축방향이동을 을 통하여 테스트모듈(110) 상의 테스트소켓(111)이 도 8c에 도시된 바와 같이, 검사될 소자(1)를 픽업하고 있는 픽커에 대응되는 위치로 이동된다.Accordingly, the test module 110 through the relative movement of the main moving tool 510 and the test module 110, for example, moving in the Y-axis direction of the test module 110 or moving in the Y-axis direction of the main moving tool 510 ) On the test socket 111 is moved to a position corresponding to the picker picking up the element 1 to be inspected, as shown in FIG. 8C.
한편 테스트모듈(110) 상의 테스트소켓(111)이 도 8c에 도시된 바와 같이, 검사될 소자(1)를 픽업하고 있는 픽커에 대응되는 위치로 이동되면, 검사될 소자(1)는, 테스트모듈(110) 상의 테스트소켓(111)에 적재된다.Meanwhile, when the test socket 111 on the test module 110 is moved to a position corresponding to the picker picking up the device 1 to be tested, as shown in FIG. 8C, the device 1 to be tested is the test module It is loaded on the test socket 111 on (110).
그리고 검사될 소자(1)가 테스트소켓(111)에 적재된 테스트모듈(110)은, 도 8d에 도시된 바와 같이, 검사위치(M1)로 복귀하며, 복귀 후 가압툴(120)은, 소자(1)의 검사를 위하여 하강하여 각 소자(1)를 가압한다.And the test module 110 in which the element to be inspected 1 is loaded in the test socket 111 returns to the inspection position M1, as shown in FIG. 8D, and after the return, the pressing tool 120, the element For the inspection of (1), it descends and presses each element (1).
한편 테스트모듈(110)과의 소자교환을 마친 메인이동툴(510)은, 도 8d 및 도 8e에 도시된 바와 같이, 보조셔틀부(300)가 위치된 소자교환위치(P2)로 이동되어 보조셔틀부(300)와 소자교환을 수행한다.On the other hand, the main moving tool 510, which has completed the element exchange with the test module 110, is moved to the element exchange position P2 where the auxiliary shuttle unit 300 is located, as shown in Figs. 8D and 8E to assist. Element exchange with the shuttle unit 300 is performed.
소자교환위치(P2)에서의 보조셔틀부(300) 및 메인이동툴(510)의 소자교환과정은 도 4a 내지 도 4c와 유사한바 자세한 설명은 생략한다.The element exchange process of the auxiliary shuttle unit 300 and the main moving tool 510 at the element exchange position P2 is similar to those of Figs. 4A to 4C, so a detailed description thereof will be omitted.
이상은 본 발명에 의해 구현될 수 있는 바람직한 실시예의 일부에 관하여 설명한 것에 불과하므로, 주지된 바와 같이 본 발명의 범위는 위의 실시예에 한정되어 해석되어서는 안 될 것이며, 위에서 설명된 본 발명의 기술적 사상과 그 근본을 함께 하는 기술적 사상은 모두 본 발명의 범위에 포함된다고 할 것이다.Since the above is only described with respect to some of the preferred embodiments that can be implemented by the present invention, as well known, the scope of the present invention should not be limited to the above embodiments and should not be interpreted. It will be said that both the technical idea and the technical idea together with the fundamental are included in the scope of the present invention.

Claims (9)

  1. 소자(1)가 안착되며 검사를 위한 테스트소켓(111)이 X축방향 및 Y축방향으로 n×m(n, m은 2 이상의 자연수)의 배열로 배치되며 상하로 적층되어 배치되는 복수의 테스트모듈(110)들과, 상기 테스트모듈(110) 각각의 상측에 설치되어 상기 각 테스트소켓(111)에 대응되어 검사시에 테스트소켓(111)에 가압하고 상하이동에 의하여 소자(1)를 상기 테스트소켓(111)로부터 픽업하는 복수의 가압툴(120)들을 포함하는 하나 이상의 테스트부(100)와;The device 1 is mounted and the test sockets 111 for inspection are arranged in an array of n×m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction, and are stacked up and down. The modules 110 and the test module 110 are installed on the upper side of each of the test modules 110, correspond to the test sockets 111, pressurize the test socket 111 during inspection, and lift the device 1 One or more test units 100 including a plurality of pressing tools 120 picked up from the test socket 111;
    검사될 소자(1)들이 적재된 트레이(20)로부터 소자(1)를 로딩하고 검사를 마친 소자(1)를 언로딩하는 로딩/언로딩위치(P1)와 상기 테스트모듈(110)와 소자(1)를 교환하는 소자교환위치(P2) 사이를 이동하는 하나 이상의 보조셔틀부(300)와;Loading/unloading position P1 for loading the device 1 from the tray 20 in which the devices 1 to be tested are loaded and unloading the tested device 1, the test module 110 and the device ( 1) at least one auxiliary shuttle unit 300 moving between the element exchange positions (P2) for exchanging;
    검사될 소자(1)들이 적재된 트레이(20)들이 위치되는 로딩부(410)와;A loading unit 410 in which the trays 20 in which the elements 1 to be inspected are loaded are located;
    검사를 마친 소자(1)들이 적재되는 트레이(20)들이 위치된 언로딩부(420)를 포함하는 소자검사장치.Device inspection apparatus comprising an unloading unit 420 in which the trays 20 on which the inspected elements 1 are loaded are located.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 테스트부(100)의 각 테스트모듈(110)은, 상기 가압툴(120)의 직하방에 위치되는 검사위치(M1)와 상기 보조셔틀부(300)와 소자(1)를 교환하기 위한 교환위치(M2) 사이에서 이동가능하게 설치되며,Each test module 110 of the test unit 100 is a replacement for exchanging an inspection position (M1) located directly under the pressure tool 120 and the auxiliary shuttle unit 300 and the element 1 It is installed to be movable between positions (M2),
    상기 교환위치(M2)에 위치된 상기 테스트모듈(110)로부터 검사를 마친 소자(1)를 픽업하고 검사될 소자(1)를 적재하며, 상기 소자교환위치(P2)에 위치된 보조셔틀부(300)에 대하여 검사될 소자(1)를 픽업하고 검사를 마친 소자(1)를 적재하는 제1메인이송툴(510)을 포함하는 것을 특징으로 하는 소자검사장치.An auxiliary shuttle unit (1) that has been inspected is picked up from the test module 110 located in the exchange position (M2), loads the device to be inspected (1), and is located in the element exchange position (P2). An element inspection apparatus comprising a first main transfer tool (510) for picking up the element (1) to be inspected with respect to 300 and loading the inspected element (1).
  3. 청구항 2에 있어서,The method according to claim 2,
    상기 제1메인이송툴(510)은,The first main transfer tool 510,
    수직방향이동부(590)에 의하여 상기 각 테스트부(100)의 테스트모듈(110)의 수직높이에 대응되는 위치로 이동되는 것을 특징으로 하는 소자검사장치.The device inspection apparatus, characterized in that the vertical direction moving part (590) moves to a position corresponding to the vertical height of the test module (110) of each of the test parts (100).
  4. 청구항 2에 있어서,The method according to claim 2,
    상기 보조셔틀부(300)는,The auxiliary shuttle unit 300,
    소자가 안착되는 소자안착부(311)들이 설치된 보조셔틀플레이트(310)와, The auxiliary shuttle plate 310 in which the device seating portions 311 are installed,
    상기 보조셔틀플레이트(310)를 상기 로딩/언로딩위치(P1)와 상기 소자교환위치(P2)로 이동시키는 보조셔틀이동구동부를 포함하며,And an auxiliary shuttle moving driver for moving the auxiliary shuttle plate 310 to the loading/unloading position P1 and the element exchange position P2,
    상기 보조셔틀플레이트(310)는, 소자안착부(211)가 X축방향 및 Y축방향으로 n×2m(n, m은 2 이상의 자연수)의 배열로 배치되는 것을 특징으로 하는 소자검사장치.The auxiliary shuttle plate 310 is an element inspection apparatus, characterized in that the element seating portion 211 is arranged in an array of n×2m (n, m is a natural number of 2 or more) in the X-axis direction and the Y-axis direction.
  5. 청구항 4에 있어서,The method of claim 4,
    상기 보조셔틀플레이트(310)는, 상기 테스트부(100)에 대한 소자교환속도를 고려하여 하나 이상으로 설치되는 것을 특징으로 하는 소자검사장치.The device inspection device, characterized in that at least one auxiliary shuttle plate (310) is installed in consideration of an element exchange rate for the test unit (100).
  6. 청구항 4에 있어서,The method of claim 4,
    상기 보조셔틀플레이트(310)는, 상기 제1메인이송툴(510)의 소자 픽업 및 플레이스를 고려하여 상기 소자안착부(211)들이 이루는 X축방향 피치가 상기 제1메인이송툴(510)의 픽커(511)들이 이루는 피치와 동일하게 배치되는 것을 특징으로 하는 소자검사장치.The auxiliary shuttle plate 310 has a pitch in the X-axis direction formed by the element seating portions 211 in consideration of the element pickup and place of the first main transfer tool 510. Device inspection device, characterized in that the pickers 511 are arranged to be the same as the pitch formed.
  7. 청구항 6에 있어서,The method of claim 6,
    상기 보조셔틀플레이트(310)는,The auxiliary shuttle plate 310,
    상기 소자안착부(211)의 X축방향 피치가 상기 소자교환위치(P2)에서 제1메인이송툴(510)의 픽커(511)들이 이루는 피치와 동일한 제1피치를 가지며, The X-axis direction pitch of the element seating part 211 has a first pitch equal to the pitch made by the pickers 511 of the first main transfer tool 510 at the element exchange position P2,
    상기 로딩/언로딩위치(P1)에서 상기 제1피치보다 작은 제2피치를 가지는 것을 특징으로 하는 소자검사장치.And a second pitch smaller than the first pitch at the loading/unloading position (P1).
  8. 청구항 1 내지 청구항 7 중 어느 하나의 항에 있어서,The method according to any one of claims 1 to 7,
    상기 테스트부(100)는, X축방향으로 복수로 배치되며,The test unit 100 is disposed in plurality in the X-axis direction,
    상기 로딩부(410) 및 상기 언로딩부(420)는, X축방향으로 한 쌍으로 배치된 것을 특징으로 하는 소자검사장치.The loading part 410 and the unloading part 420 are arranged in a pair in the X-axis direction.
  9. 청구항 8에 있어서,The method of claim 8,
    상기 로딩부(410) 및 상기 언로딩부(420)의 전방에는, 외부와의 트레이공급 및 배출을 위한 트레물류부(600)가 설치된 것을 특징으로 하는 소자검사장치.A device inspection device, characterized in that in front of the loading unit 410 and the unloading unit 420, a tres logistics unit 600 for supplying and discharging a tray to the outside is installed.
PCT/KR2020/008947 2019-07-08 2020-07-08 Apparatus for inspecting element WO2021006627A1 (en)

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