WO2014003286A1 - Wafer gripper - Google Patents

Wafer gripper Download PDF

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Publication number
WO2014003286A1
WO2014003286A1 PCT/KR2013/001412 KR2013001412W WO2014003286A1 WO 2014003286 A1 WO2014003286 A1 WO 2014003286A1 KR 2013001412 W KR2013001412 W KR 2013001412W WO 2014003286 A1 WO2014003286 A1 WO 2014003286A1
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WO
WIPO (PCT)
Prior art keywords
wafer
axis
frame
holder
moved
Prior art date
Application number
PCT/KR2013/001412
Other languages
French (fr)
Korean (ko)
Inventor
송병호
Original Assignee
주식회사 엔제닉
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120069362A external-priority patent/KR101402317B1/en
Application filed by 주식회사 엔제닉 filed Critical 주식회사 엔제닉
Publication of WO2014003286A1 publication Critical patent/WO2014003286A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Definitions

  • the present invention relates to a wafer gripper, and more particularly, the wafer stored in the wafer pusher is supported by both sides in a manner of noise and at the same time supporting the lower portion of the wafer.
  • a wafer gripper in which deformation is minimized.
  • Diffusion furnaces used in the furnace equipment for manufacturing semiconductor devices are used as devices for injecting certain impurities into the surface of semiconductor wafers or growing oxide films. Is used.
  • the wafer carrier transfer device is largely provided with a wafer transfer conveyor, a wafer pusher, a wafer gripper, a boat transfer, and an elevator.
  • the wafer gripper is installed between the boat transfer and the wafer transfer conveyor, and the boat transfer is installed between the wafer gripper and the elevator.
  • a method of transferring a wafer carrier using the wafer carrier transfer device having such a configuration will be briefly described as follows.
  • the wafer stored in the wafer transfer conveyor is lifted by the pusher to load the wafer carrier, and the wafer thus lifted is held by the wafer gripper and mounted on the boat transfer.
  • the wafer mounted on the boat transfer as described above is moved to the elevator, and the elevator moves the moved wafer to the furnace equipment.
  • the conventional wafer gripper 100 has a grip arm 102, an arm driver 104 for driving the grip arm 102, and one support shaft 106 connecting the arm driver 104 and the grip arm 102. ).
  • the arm driver 104 may be configured to tilt at an angle of about 90 ° to prevent protrusion of the wafer loaded on the wafer carrier C and the first shaft 104a for advancing and retracting the grip arm 102.
  • the grip carrier module 100 is provided with a wafer carrier and a wafer loaded therein. Due to the weight, the support shaft 106 is bent, so that there is a problem that the mechanical life is reduced.
  • the present invention has been made to solve the above-described problems, the object of the present invention is to support the lower side of the wafer at the same time the noise stored in a way to approach the wafer stored in the wafer pusher from both sides to distribute the weight of the wafer in three places It is to provide a wafer gripper in which deformation due to the load of the wafer is minimized.
  • the elastic force of the pressing spring is provided in the operation of holding the side of the wafer to provide a wafer gripper that can hold the wafer more stably.
  • the wafer gripper includes: an X-axis frame installed on an upper portion of the wafer pusher; an X-axis moving unit moved along the X-axis frame; and the X-axis moving unit A Z-axis frame connected to and moved up and down; and a Y-axis frame connected to a lower portion of the Z-axis frame and disposed perpendicularly to the X-axis frame; and connected to the Y-axis frame to be operated in the Y-axis direction. And a towing unit for pulling the wafer stored in the wafer pusher.
  • the towing portion the first holder for pressing both sides of the wafer; and the second holder; is provided, the first holder and the second holder, the extending block extending up and down; and one side of the extension block It is installed so as to face each other, a plurality of fingers in which the wafer is inserted is arranged in a row, the lower finger member is formed a support surface for supporting the lower surface of the wafer is erected;
  • the X-axis rail is formed along the longitudinal direction of the X-axis frame; and the X-axis moving bracket is inserted into the X-axis rail, and connected to the X-axis moving unit; characterized in that it further comprises.
  • the Z-axis guide bracket formed on the X-axis moving bracket; and the Z-axis rail is formed along the longitudinal direction of the Z-axis frame, and coupled to the Z-axis guide bracket.
  • the Y-axis frame may include: a connecting bracket connected to the Z-axis frame; a fixed frame fixed to the lower portion of the connecting bracket; and a Y-axis frame connected to the lower portion of the fixed frame and moved in the Y-axis direction.
  • a moving frame having a first rail formed thereon; and a first grip part connected to the moving frame and having a movable plate extending in a Y-axis direction, and having a first holder disposed below the movable plate.
  • a Y-axis moving unit connected to the rail and moving in the Y-axis direction; and a Y-axis second rail formed along an inner side surface of the movable plate to be connected to the Y-axis moving unit to move the plate; And a second grip part provided with a holder.
  • first holder and the second holder an extended block extending up and down; and is installed to face each other on one side of the extension block, a plurality of fingers in which the wafer is inserted is arranged in a row, the lower wafer And a finger member having a support surface for supporting the bottom surface thereof.
  • the finger member is detachable from the extension portion, and between the finger member and the extension block a pressing spring for providing a pressing force when restraining the wafer to the first holder and the second holder; .
  • the wafer stored in the wafer pusher supports the lower part of the wafer at the same time as the noise in a manner of approaching from both sides, so that the weight of the wafer is dispersed at three places to minimize deformation due to the load of the wafer. It has the advantage of being.
  • FIG. 1 is a schematic flowchart of a wafer transfer module according to a preferred embodiment of the present invention.
  • FIG 2 is a front view of a wafer transfer module according to a preferred embodiment of the present invention.
  • FIG 3 is a perspective view of a wafer transfer module according to a preferred embodiment of the present invention.
  • Figure 4 is a perspective view of a state in which a vertical wafer transfer conveyor of the wafer transfer module according to an embodiment of the present invention is omitted.
  • FIG. 5 is a perspective view and a partially enlarged view of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
  • FIG. 6 is a front view of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
  • FIG. 7 is a side view of a vertical type wafer transfer conveyor in accordance with a preferred embodiment of the present invention.
  • FIG. 8 is a perspective view of a cassette of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
  • FIG. 9 is a front view of the cassette of the vertical type wafer transfer conveyor according to the preferred embodiment of the present invention.
  • FIG. 10 is a perspective view and a partially enlarged view of the pusher according to the preferred embodiment of the present invention.
  • 11 and 12 are side views showing the removal of the wafer with a pusher according to a preferred embodiment of the present invention.
  • FIG. 13 is a perspective view and a partially enlarged view of a gripper according to a preferred embodiment of the present invention.
  • FIG. 14 is a front view of a boat transfer according to a preferred embodiment of the present invention.
  • 15 is a perspective view of an elevator according to a preferred embodiment of the present invention.
  • 16 to 19 are state diagrams showing the state of moving the wafer to the wafer transfer module according to an embodiment of the present invention.
  • 20 to 21 is a schematic configuration diagram of a wafer gripper according to the prior art.
  • FIG. 1 is a schematic flowchart of transferring a wafer to a wafer transfer module according to a preferred embodiment of the present invention.
  • the present invention which will be described later, performs a process as shown in FIG.
  • the wafer transfer module includes all of the first to third processes to be described later.
  • the wafer is mounted in a cassette provided in a vertical type wafer transfer conveyor to be described later, and the wafer transfer conveyor is driven and loaded.
  • the wafer is removed from the cassette by using a wafer pusher to move the wafer stored in the cassette loaded as described above to the furnace, and the wafer thus removed is caught by the wafer gripper and moved to the boat transfer.
  • the wafer is then transferred to the elevator by boat transfer, then mounted in the elevator and lifted to move the wafer to the furnace, which is then moved to the next process in the furnace.
  • FIGS. 2 to 4 are a perspective view and a front view of a wafer transfer module according to a preferred embodiment of the present invention, as shown in Figures 2 to 4, the present invention is a vertical type wafer transfer conveyor 100, wafer The first process portion (a) consisting of the pusher 200, the wafer gripper 300, the second process portion (b) consisting of the boat transfer 400 and the third process portion (composing the elevator 500) c), and the wafer is sequentially moved by the first process portion (a), the second process portion (b), and the third process portion (c).
  • FIG. 5 is a perspective view and a partially enlarged view of a vertical wafer transfer conveyor according to a preferred embodiment of the present invention
  • FIG. 6 is a front view of a vertical wafer transfer conveyor according to a preferred embodiment of the present invention
  • FIG. A side view of a vertical type wafer transfer conveyor according to an embodiment is shown.
  • Vertical type wafer transfer conveyor 100 includes a pulley 110, a cassette 120 and a rail 130.
  • two pairs of pulleys 110 are formed in a vertical direction, and two sets of pairs of pulleys 110 are provided such that the pulleys 110 are symmetrical with each other.
  • the upper or lower pulleys are connected to each other via the rotation shaft 111 so as to be rotatable at the same time by the motor (M).
  • the pulley 110 as described above is connected to each other via a timing belt 120 and rotated at the same time, the rotation of any one of the pulley motor of the pair of pulleys (110) paired in the vertical direction ( M) is installed, the rotation of the motor (M) is transmitted to the timing belt 120, the other one pulley is rotated.
  • the timing belt 120 can accurately transmit rotation, but is preferably made of rubber. When made of rubber material, the tension may be changed, so it may be made of metal chain.
  • timing belt 120 is connected to the cassette 140 via a clamp 141 to rotate the cassette 140 in a constant trajectory, as shown in a partially enlarged view of FIG. 5.
  • the clamp 141 is fixed to the groove formed in the inner peripheral surface of the timing belt 120.
  • the cassette 140 includes a main body 150 on which the wafer 1 is mounted and a transfer unit 160 provided on both sides of the main body 150.
  • the transfer unit 160 is connected to the timing belt 120 and the rail 130 on one side and the other side in a state in which the transfer unit 160 is rotatably installed on the main body 150 so that the warpage does not occur.
  • the main body 150 includes a pair of plates 151 and a plurality of connecting rods 152 connecting the plates 151 to each other, and the connecting rods 152 may include a plurality of wafers 1 to be inserted therein.
  • the insertion groove 153 is formed.
  • FIG. 8 shows that the connecting rods 152 are paired two by six, and the lower two connecting rods support the lower side of the wafer when the wafer 1 is inserted in the upright state.
  • Four connecting rods support the left and right sides of the wafer, respectively.
  • the lower two connecting rods are spaced apart from each other by a predetermined distance.
  • the reason for the separation is that the wafer pusher 200, which will be described later, enters between the lower two connecting rods to remove the wafer 1 stored in the cassette 140. To make it work.
  • the transfer unit 160 is a member connected to both the timing belt 120 and the rail 130, the transfer unit 160 is rotatably connected to the side plate 162, such a transfer unit 160
  • a clamp 141 is formed at one side and a tracking plate 163 is formed at the other side with respect to the rotation center of the center.
  • the clamp 141 is a timing belt 120.
  • the tracking plate 163 is connected to the rail 130, respectively.
  • the tracking plate 161 is moved along the rail 130, so the tracking plate 163 is a rail 130 and a ball bearing ( 162 is connected via a medium, it is preferable that the departure prevention block 164 is provided to prevent the departure from the rail (130).
  • the rail 130 is a member installed outside the timing belt 120 described above, and the rail 130 is generally made of a metal material.
  • the rail 130 is connected to the tracking plate 163 and serves to guide the cassette 140 moved by the timing belt 120.
  • the cassettes may be moved along the timing belt 120 and the rail 130 having different sized trajectories. 140) does not tilt or flip upside down.
  • Vertical type wafer transfer conveyor 100 according to a preferred embodiment of the present invention as described above can be installed in a narrow space because the cassette 140 is rotated in the vertical direction along the timing belt 120 and the rail 130. Therefore, space utilization can be improved.
  • FIGS. 11 and 12 are side views showing a state of removing a wafer with a wafer pusher according to a preferred embodiment of the present invention.
  • the wafer pusher 200 to be described later is installed adjacent to the vertical type wafer transfer conveyor 100 described above, the wafer pusher 200 is a wafer stored in the cassette 140 It serves to remove the wafer 1 from the cassette 140 by pushing (1) to the upper portion, and is not limited to the vertical type wafer transfer conveyor 100 because it can be used in various places.
  • the wafer pusher 200 includes an X-axis frame 210, an X-axis moving unit 220, a Y-axis frame 230, a Z-axis frame 240, and a separation unit 250. do.
  • the X-axis frame 210 is a member installed adjacent to the lower portion of the vertical type wafer transfer conveyor 100 described above, such an X-axis frame 210 is a skeleton of the wafer transfer module, as shown in FIG. It is connected to the frame frame forming a 10.
  • the X-axis frame 210 is formed with an X-axis rail 211 along the longitudinal direction, the X-axis rail 211 is connected to the X-axis moving unit 220, the X-axis moving unit 220 ) Includes an X-axis moving bracket 221 coupled to the X-axis rail 211 and moved in the X-axis direction.
  • the Y-axis frame 230 is a member that is connected to the X-axis moving unit 220 to move in the X-axis direction, the Y-axis frame 230 is installed perpendicular to the X-axis frame 210.
  • the Y-axis frame 230, the Y-axis rail 231 is formed along the longitudinal direction, the Y-axis rail 231 is coupled to the Y-axis moving bracket 232, such a Y-axis moving bracket 232 ) Is connected to the Z-axis frame 240 to move the Z-axis frame 240 in the Y-axis direction.
  • the Z-axis frame 240 is a member which is connected to the Y-axis moving bracket 232 coupled to the Y-axis rail 231 and moved along the Y-axis frame 230.
  • the Z-axis frame 240 is formed with a Z-axis rail 241 along the longitudinal direction, the Z-axis rail 241 is connected to the Z-axis moving bracket 242 to be moved in the Z-axis direction, this The separation unit 250 to be described later is connected to the Z-axis moving bracket 242.
  • the separating part 250 is a member that is connected to and moved up and down in accordance with the driving pattern of the Z-axis moving bracket 242 by connecting the Z-axis frame 240 and the Z-axis moving bracket 242 as described above. As shown in FIG. 10 to FIG. 12, the pair of upper and lower posts 251, the finger blocks 252, and the finger members 253 are included.
  • the pair of upper and lower posts 251 is connected to the Z-axis moving bracket 242, as shown in Figures 10 to 12, and extends to the upper side (Z-axis direction), such a pair of upper and lower posts (
  • the finger block 252 is connected to the upper portion of the 251, the finger member 253 is installed in the vertical direction (Z-axis direction) on the finger block 252.
  • the finger block 252 is fixed to the upper and lower posts 251, and fixed to the fixed block 254, and the finger member 253. It is composed of a removable block 255 is installed, accordingly, it is easy to replace with a new removable block 255 when the finger member 253 is worn or broken.
  • the finger blocks 252 may push the wafer 1 stored in the cassette 140 upward when the Z-axis movement bracket 242 rises after approaching the lower portion of the cassette 140 described above. It is preferable to have a separation distance less than the separation distance between the two connecting rods 152 on the lower side of the cassette 140.
  • the finger member 253 is a member in which a plurality of fingers 266 are arranged in a line along an upper surface of the finger block 252, and is inserted in the cassette 140 described above between the plurality of fingers 266.
  • the wafer 1 is fitted.
  • Finger 256 as described above is preferably made of a ceramic (Ceramic) or quartz (Quartz) material to prevent damage to the wafer, and is formed in the shape of a pencil, the head 257, the body (from the top) 258 and the lower end 259.
  • the head portion 257 is formed in a conical shape to facilitate the entry of the wafer 1, the body portion 258 is connected to the lower portion of the head portion 257 in a rod shape, the lower end 259 is rod-shaped Is formed, but is connected to the finger block 252 with a cross section smaller than the cross section of the body portion 258.
  • the chip generated while the wafer 1 is inserted into the finger 256 is lowered, more specifically, the lower end 259. It serves to discharge smoothly to the gap between, accordingly, the upper surface of the finger block 252 (upper surface of the removable block) inclined surface (chip) discharged from the lower end of the finger 256 to move smoothly ( 260 is preferably formed.
  • FIG. 13 is a perspective view and a partially enlarged view of a wafer gripper according to a preferred embodiment of the present invention.
  • the wafer gripper 300 to be described later is installed adjacent to the upper portion of the above-described wafer pusher 200, the wafer gripper 300 is a wafer (stored in the cassette 140) In the state in which 1) is lifted up to the wafer pusher 200, the wafer 1 is moved to the outside of the vertical type wafer transfer conveyor 100 and then moved to the boat transfer 400 to be described later.
  • the wafer gripper 300 as described above may not be limited to the vertical wafer pusher 200 since it may be used in various places.
  • the wafer gripper 300 includes an X axis frame 310, an X axis moving unit 320, a Z axis frame 330, a Y axis frame 340, and a towing unit 350. do.
  • the X-axis frame 310 is a member installed on the wafer pusher 200, the X-axis frame 310 as shown in Figure 4, the X-axis frame 210 of the above-described wafer pusher 200 It is connected to the frame (10) forming the skeleton of the wafer transfer module in the same way.
  • the X-axis frame 310 is formed with an X-axis rail 311 along the longitudinal direction, the X-axis rail 311 is connected to the X-axis moving unit 320, the X-axis moving unit 320 The X-axis moving bracket 321 coupled to the X-axis rail 311 is moved in the X-axis direction is included.
  • a Z-axis guide bracket 322 protrudes from the X-axis movement bracket 321 in the Y-axis direction, and the Z-axis guide bracket 322 is connected to the Z-axis frame 330 to move up and down.
  • the Z-axis rail 331 is provided on the Z-axis frame 330 so that movement in the vertical direction (Z-axis direction) is secured while the Z-axis frame 330 is connected to the Z-axis guide bracket 322. Is formed.
  • the Y-axis frame 340 is a member connected to the lower portion of the above-described Z-axis frame 330 perpendicular to the X-axis frame 310, the Y-axis frame 340 is a connecting bracket 341
  • the fixed frame 342 and the moving frame 343 are included, and the towing unit 350 includes a first grip part 360 and a second grip part 370.
  • the Y-axis frame 340 is a member that is moved in the Y-axis direction so that the traction unit 350 can hold the wafer, the traction unit 350 is the wafer 1 in the state that the Y-axis frame 340 is moved It is a member that plays a role.
  • the connecting bracket 341 is a member connected to the Z-axis frame 330, and a fixed frame 342 is connected to a lower portion of the connecting bracket 341.
  • a lower portion of the fixed frame 342 is connected to the moving frame 343 which is moved in the Y-axis direction, the fixed frame 342 and the moving frame 343 is connected via a separate moving unit 344 Accordingly, a rail (not shown) may be formed on the bottom surface of the fixed frame 342.
  • the first Y-axis rail 345 is formed along the longitudinal direction of the movable frame 343, and the Y-axis first unit 345 is connected to the Y-axis moving unit 346 to move from side to side.
  • the first grip part 360 of the traction part 350 is connected to the moving frame 343, and the first grip part 360 includes a movable plate 361 and a first holder 362. As shown in FIG. 13, the movable plate 361 extends in the Y-axis direction while being fixed to the lower surface of the movable frame 343, and a first holder 362 is disposed below the movable plate 361. Is formed.
  • a second grip part 370 is connected to the Y-axis moving unit 346, and the second grip part 370 may include the movable plate 3 so that interference does not occur when the movable plate 361 is driven in the Y-axis direction.
  • 361 is preferably connected via a separate plate 371 extending in the X-axis direction.
  • the second grip portion 370 is provided with a movable groove 372 to prevent the interference with the movable plate 361 and to move the movable plate 361 is inserted, the second holder 373 in the lower portion ) Is moved in the Y-axis direction according to the movement pattern of the Y-axis movement unit 346.
  • the first grip part 360 as described above is the second grip part 370 of the Y-axis moving unit when the moving frame 343 is moved to the upper part of the separation part 250 of the wafer pusher 200.
  • the wafer 1 is held while approaching the grip 360.
  • first holder 362 and the second holder 373 are extended blocks 380 provided in the first holder 362 and the second holder 373, respectively, as shown in a partially enlarged view of FIG. 13.
  • a finger member 381 which is installed to face each other on one side of the extension block 380, wherein the fingers 382 are arranged in a line along the length direction.
  • the finger 382 is a member that presses and grips the side surface while the wafer 1 is upright, two or more lines are provided to prevent the wafer from being rotated to one side while the wafer 1 is fitted to the finger 382. desirable.
  • the first entry portion into which the wafer 1 enters to fit the wafer 3 smoothly into the finger 382 may be manufactured in a conical shape.
  • the support surface 383 is formed below the finger member 381 so as to support the lower surface of the standing wafer 1.
  • the finger 382 is made of the same ceramic or quartz material as the finger 256 of the wafer pusher 200 described above, and the finger member 381 may be easily replaced when the finger 382 is worn or damaged. Is preferably detached from the extension block 380.
  • a pressure spring 384 may be installed between the finger member 381 and the extension block 380, as shown in the partially enlarged view of FIG.
  • the pressure spring 384 as described above may be provided with an elastic force when pressing the wafer 1 that is erected using the first holder 362 and the second holder 373, thereby more firmly fixing the wafer 1. .
  • both sides of the wafer 1 lifted by the wafer pusher 200 are held by the fingers 382, and at the same time, the lower side of the wafer 1 is supported by the support surface 383. It can be characterized by holding the wafer 1 stably at three points except the upper side of the wafer by supporting it.
  • the pressing force of the pressure spring 384 can hold the wafer 1 more firmly.
  • the boat transfer 400 receives the wafer 1 moved by the wafer pusher 200 and the wafer gripper 300 described above to the elevator 500 to be described later. It serves to convey.
  • the boat transfer 400 as described above includes a boat 410 on which a wafer is seated, a transfer unit 420 for moving the boat 410 to the elevator 500, and the transfer unit 420 to the elevator 500. It is composed of a horizontal frame 430 that serves as a moving rail, the boat 410, as shown in Figure 21, the wafer 1 in turn by the wafer gripper 300, the boat 410 in turn from one side Is loaded on.
  • the transfer unit 420 may be lifted along the horizontal frame 430. It will be moved to 500.
  • the elevator 500 serves to receive the boat 410 of the boat transfer 400 described above and deliver it to the furnace.
  • Elevator 500 as described above is installed in the frame frame 10 of the wafer transfer module in the vertical direction, a pair of Z-axis frame 510 is provided with a Z-axis rail 511, the Z-axis frame 510 Z-axis moving unit 520 connected to each other, a fixed frame 530 connected to the Z-axis moving unit 520 in the Y-axis direction, and connected to the fixed frame 530 to move in the Y-axis direction Y-axis frame 540 is provided.
  • a Y-axis rail 541 is formed in the Y-axis frame 540, the Y-axis rail 541 is connected to the fixed frame 540 so that the Y-axis frame 540 is moved in the Y-axis direction
  • the Y axis moving unit 550 is formed.
  • the Y-axis frame 540 and the Z-axis moving unit 510 coupled with the boat 410 are each preferably driven by a power source (eg, a servo motor).
  • the elevator 500 according to the preferred embodiment allows the synchronous control when moving the Z-axis, the left, right horizontal and tilt control of the boat 410 when moving the Y-axis.
  • the operator puts the wafer 1 upright in the cassette 140.
  • the worker attaches a storage means (not shown) to the cassette 140, the storage means may be stored the history of the type of wafer 1, the production site, the production company, the production date.
  • the storage means as described above may be made of a bar code printed sticker, it may be made of an RFID card, such storage means is a sensor unit (S) provided in the vertical type wafer transfer conveyor 100 shown in FIG. It can be detected by, and the detected information of the storage means may be transmitted to a controller (not shown).
  • S sensor unit
  • control unit serves to move the plurality of cassettes 140 that are moved along the timing belt 120 and the rail 130, and the wafer pusher 200 holds the wafer 1 stored in the cassette 140.
  • the process of raising, the process of holding the wafer 1 lifted by the wafer pusher 200 with the wafer gripper 300, and the wafer 1 caught with the wafer gripper 300 are moved to the boat transfer 400 to the elevator 500.
  • the process of moving and the process of moving the wafer 1 moved to the elevator 500 to a furnace may be performed.
  • the amount, type, etc. of the wafer required for the furnace can be determined based on the information of the wafer 1 stored in the controller.
  • the cassette 140 moved along the rail 130 is detached from the wafer 1 stored in the cassette 140 by the wafer pusher 200 at a predetermined position.
  • Figures 11 to 12 and 16 show how the stored wafer is removed.
  • the procedure for detaching and removing the wafer 1 stored in the cassette 140 by the wafer pusher 200 is as follows.
  • the position (XY, Z coordinate) of the cassette 140 is sensed, and the X-axis moving unit 221 is moved along the X-axis rail 211, and then the Y-axis moving unit (down to the lower side of the cassette 140)
  • the Z-axis frame 240 is moved along the 231.
  • the Z-axis moving unit 242 is raised in the state in which the Z-axis frame 240 is moved.
  • the finger member 253 enters the lower portion of the cassette 140 to move the wafer 1 to the cassette 140.
  • the wafer 1 detached from the cassette 140 by the wafer pusher 200 receives the towing unit 350 of the wafer gripper 300, and the towing unit 350 is transferred to the wafer 1.
  • a brief description will be given of the order in which the wafer 1 is received.
  • the position (X, Y, Z coordinate) of the wafer 1 is removed by the finger member 253 of the wafer pusher 200, and the X-axis moving unit 321 is the X-axis rail 311 Next, the moving frame 343 is moved in the Y-axis direction.
  • first grip part 360 and the second grip part 370 may be moved in a state in which the first grip part 360 and the second grip part 370 do not collide with the wafer 1.
  • the Z axis frame 330 is lowered along the Z axis guide bracket 322.
  • the Y-axis moving unit 340 is driven to press both sides of the wafer 1 stored in the wafer pusher 200.
  • the wafer pusher 200 is moved to an initial position and exits the outside of the vertical type wafer transfer conveyor 100, and the wafer gripper 300 is moved in the Y-axis direction to the outside of the vertical type wafer transfer conveyor 100.

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Abstract

According to the present invention as described above, a wafer stored in a wafer pusher is held by being approached from both sides, and the lower portion of the wafer is supported at the same time so that the weight of the wafer is distributed over three spots and deformation of the wafer due to loading is minimized.

Description

웨이퍼 그립퍼Wafer gripper
본 발명은 웨이퍼 그립퍼에 관한 것으로서, 더 상세하게는 웨이퍼 푸셔에 보관된 웨이퍼를 양측에서 접근하는 방식으로 잡음과 동시에, 웨이퍼의 하부를 지지하므로 웨이퍼의 무게를 3곳에서 분산하여 웨이퍼의 하중에 의한 변형이 최소화되는 웨이퍼 그립퍼에 관한 것이다.The present invention relates to a wafer gripper, and more particularly, the wafer stored in the wafer pusher is supported by both sides in a manner of noise and at the same time supporting the lower portion of the wafer. A wafer gripper in which deformation is minimized.
본 발명은 2012년 06월 27일 출원된 한국특허출원 제10-2012-0069362호의 출원일의 이익을 주장하며, 그 내용 전부는 본 명세서에 포함된다.The present invention claims the benefit of the filing date of Korean Patent Application No. 10-2012-0069362, filed June 27, 2012, the entire contents of which are incorporated herein.
반도체 소자를 제조하기 위한 노(Furnace) 장비 중에서 사용되는 확산로는 반도체 웨이퍼의 표면에 소정의 불순물을 주입하거나 산화막을 성장시키는 장치로 사용되는데, 반도체 웨이퍼를 확산로에 적재하기 위해 웨이퍼 캐리어 이송장치가 사용된다.Diffusion furnaces used in the furnace equipment for manufacturing semiconductor devices are used as devices for injecting certain impurities into the surface of semiconductor wafers or growing oxide films. Is used.
상기 웨이퍼 캐리어 이송장치는 크게, 웨이퍼 이송 컨베이어, 웨이퍼 푸셔, 웨이퍼 그립퍼, 보트 트랜스퍼, 엘리베이터를 구비한다.The wafer carrier transfer device is largely provided with a wafer transfer conveyor, a wafer pusher, a wafer gripper, a boat transfer, and an elevator.
상기 웨이퍼 그립퍼는 보트 트랜스퍼와 웨이퍼 이송 컨베이어 사이에 설치되며, 보트 트랜스퍼는 웨이퍼 그립퍼와 엘리베이터 사이에 설차된다.The wafer gripper is installed between the boat transfer and the wafer transfer conveyor, and the boat transfer is installed between the wafer gripper and the elevator.
이러한 구성의 웨이퍼 캐리어 이송장치를 이용하여 웨이퍼 캐리어를 이송하는 방법을 간단히 설명하면 다음과 같다.A method of transferring a wafer carrier using the wafer carrier transfer device having such a configuration will be briefly described as follows.
웨이퍼 캐리어 로딩 신호가 입력되면, 웨이퍼 캐리어를 로딩하기 위해 웨이퍼 이송 컨베이어에 보관된 웨이퍼를 푸셔로 들어올리고, 이렇게 들어올려진 웨이퍼를 웨이퍼 그립퍼로 잡아 보트 트랜스퍼에 탑재한다.When the wafer carrier loading signal is input, the wafer stored in the wafer transfer conveyor is lifted by the pusher to load the wafer carrier, and the wafer thus lifted is held by the wafer gripper and mounted on the boat transfer.
상기와 같이 보트 트랜스퍼에 탑재된 웨이퍼는 엘리베이터까지 이동되며, 엘리베이터는 이렇게 이동된 웨이퍼를 노 장비로 이동시킨다.The wafer mounted on the boat transfer as described above is moved to the elevator, and the elevator moves the moved wafer to the furnace equipment.
상기한 구성의 웨이퍼 캐리어 이송장치에 있어서, 웨이퍼 그립퍼의 개략적인 구성을 도 20 및 21을 참조로 살펴보면 다음과 같다.In the wafer carrier transfer apparatus having the above configuration, a schematic configuration of the wafer gripper will be described with reference to FIGS. 20 and 21.
종래의 웨이퍼 그립퍼(100)은 그립 암(102)과, 그립 암(102)을 구동하는 암 구동부(104)와, 암 구동부(104)와 그립 암(102)을 연결하는 한 개의 지지축(106)을 포함한다. 상기 암 구동부(104)는 그립 암(102)을 전진 및 후진시키는 제1 축(104a)과, 웨이퍼 캐리어(C)에 적재된 웨이퍼의 돌출을 방지하도록 90°정도의 각도로 틸트 동작을 하는 제2 축(104b)과, 웨이퍼 캐리어를 들기 위해 상승 및 하강하는 제3 축(104c)과, 웨이퍼 캐리어를 잡기 위해 록/언록(lock/unlock) 작동되는 제4 축(104d)을 구비한다.The conventional wafer gripper 100 has a grip arm 102, an arm driver 104 for driving the grip arm 102, and one support shaft 106 connecting the arm driver 104 and the grip arm 102. ). The arm driver 104 may be configured to tilt at an angle of about 90 ° to prevent protrusion of the wafer loaded on the wafer carrier C and the first shaft 104a for advancing and retracting the grip arm 102. Two axes 104b, a third axis 104c that rises and falls to lift the wafer carrier, and a fourth axis 104d that is locked / unlocked to hold the wafer carrier.
그러나, 상기와 같은 종래의 그립 암 모듈(100)은 상기 그립 암(102)이 한 개의 지지축(106)에 의해서만 암 구동부(104)에 지지되어 있으므로, 웨이퍼 캐리어 및 이의 내부에 적재된 웨이퍼의 무게로 인해 상기 지지축(106)이 휘어지게 되어 기계적 수명이 저하되는 문제점이 있다.However, in the conventional grip arm module 100 as described above, since the grip arm 102 is supported by the arm drive unit 104 only by one support shaft 106, the grip carrier module 100 is provided with a wafer carrier and a wafer loaded therein. Due to the weight, the support shaft 106 is bent, so that there is a problem that the mechanical life is reduced.
본 발명은 상술한 문제점을 해결하고자 안출된 것으로서, 본 발명의 목적은 웨이퍼 푸셔에 보관된 웨이퍼를 양측에서 접근하는 방식으로 잡음과 동시에, 웨이퍼의 하부를 지지하므로 웨이퍼의 무게를 3곳에서 분산하여 웨이퍼의 하중에 의한 변형이 최소화되는 웨이퍼 그립퍼를 제공하는 것이다.The present invention has been made to solve the above-described problems, the object of the present invention is to support the lower side of the wafer at the same time the noise stored in a way to approach the wafer stored in the wafer pusher from both sides to distribute the weight of the wafer in three places It is to provide a wafer gripper in which deformation due to the load of the wafer is minimized.
또한, 웨이퍼의 측면을 잡는 동작에서 가압스프링의 탄성력이 제공되므로 웨이퍼를 더욱 안정적으로 잡을 수 있는 웨이퍼 그립퍼를 제공하는 것이다.In addition, the elastic force of the pressing spring is provided in the operation of holding the side of the wafer to provide a wafer gripper that can hold the wafer more stably.
상기와 같은 문제점을 해결하기 위해 본 발명에 따른 웨이퍼 그립퍼는, 웨이퍼 푸셔의 상부에 설치되는 X축 프레임;과, 상기 X축 프레임을 따라 이동되는 X축 이동유닛;과, 상기 X축 이동유닛에 연결되어 상하로 이동되는 Z축 프레임;과, 상기 Z축 프레임의 하부에 연결되며, 상기 X축 프레임과 수직하게 배치되는 Y축 프레임;과, 상기 Y축 프레임에 연결되어 Y축 방향으로 작동되며, 웨이퍼 푸셔에 보관된 웨이퍼를 견인하는 견인부;가 포함되는 것을 특징으로 한다.In order to solve the above problems, the wafer gripper according to the present invention includes: an X-axis frame installed on an upper portion of the wafer pusher; an X-axis moving unit moved along the X-axis frame; and the X-axis moving unit A Z-axis frame connected to and moved up and down; and a Y-axis frame connected to a lower portion of the Z-axis frame and disposed perpendicularly to the X-axis frame; and connected to the Y-axis frame to be operated in the Y-axis direction. And a towing unit for pulling the wafer stored in the wafer pusher.
또한, 상기 견인부에는, 웨이퍼의 양측을 가압하는 제1홀더;와 제2홀더;가 구비되며, 상기 제1홀더와 제2홀더는, 상하로 연장형성된 연장블럭;과, 상기 연장블럭의 일측에 서로 마주보도록 설치되며, 웨이퍼가 끼워지는 다수의 핑거가 일렬로 배치되고, 하부에는 세워진 웨이퍼의 하면을 지지하는 지지면이 형성되는 핑거부재;가 포함되는 것을 특징으로 한다.In addition, the towing portion, the first holder for pressing both sides of the wafer; and the second holder; is provided, the first holder and the second holder, the extending block extending up and down; and one side of the extension block It is installed so as to face each other, a plurality of fingers in which the wafer is inserted is arranged in a row, the lower finger member is formed a support surface for supporting the lower surface of the wafer is erected;
또한, 상기 X축 프레임의 길이방향을 따라 형성되는 X축 레일;과, 상기 X축 레일에 끼워져 이동되며, 상기 X축 이동유닛과 연결되는 X축 이동브라켓;이 더 포함되는 것을 특징으로 한다.In addition, the X-axis rail is formed along the longitudinal direction of the X-axis frame; and the X-axis moving bracket is inserted into the X-axis rail, and connected to the X-axis moving unit; characterized in that it further comprises.
또한, 상기 X축 이동브라켓에 형성되는 Z축 가이드브라켓;과, 상기 Z축 프레임의 길이 방향을 따라 형성되되, 상기 Z축 가이드브라켓과 결합되는 Z축 레일;이 포함되는 것을 특징으로 한다.In addition, the Z-axis guide bracket formed on the X-axis moving bracket; and the Z-axis rail is formed along the longitudinal direction of the Z-axis frame, and coupled to the Z-axis guide bracket.
또한, 상기 Y축 프레임은, 상기 Z축 프레임과 연결되는 연결브라켓;과, 상기 연결브라켓의 하부에 고정되는 고정프레임;과, 상기 고정프레임의 하부에 연결되어 Y축 방향으로 이동되며, Y축 제1레일이 형성되는 이동프레임;과, 상기 이동프레임에 연결되며, Y축 방향으로 가동플레이트가 연장형성되되, 이 가동플레이트의 하부에는 제1홀더가 구비되는 제1그립부;와, 상기 Y축 레일에 연결되어 Y축 방향으로 이동되는 Y축 이동유닛;과, 상기 Y축 이동유닛에 연결되며, 상기 가동플레이트가 끼워져 이동되도록 내측면을 따라 Y축 제2레일이 형성되고, 하부에는 제2홀더가 구비되는 제2그립부;가 포함되는 것을 특징으로 한다.The Y-axis frame may include: a connecting bracket connected to the Z-axis frame; a fixed frame fixed to the lower portion of the connecting bracket; and a Y-axis frame connected to the lower portion of the fixed frame and moved in the Y-axis direction. A moving frame having a first rail formed thereon; and a first grip part connected to the moving frame and having a movable plate extending in a Y-axis direction, and having a first holder disposed below the movable plate. A Y-axis moving unit connected to the rail and moving in the Y-axis direction; and a Y-axis second rail formed along an inner side surface of the movable plate to be connected to the Y-axis moving unit to move the plate; And a second grip part provided with a holder.
또한, 상기 제1홀더와 제2홀더는, 상하로 연장형성된 연장블럭;과, 상기 연장블럭의 일측에 서로 마주보도록 설치되며, 웨이퍼가 끼워지는 다수의 핑거가 일렬로 배치되고, 하부에는 세워진 웨이퍼의 하면을 지지하는 지지면이 형성되는 핑거부재;가 포함되는 것을 특징으로 한다.In addition, the first holder and the second holder, an extended block extending up and down; and is installed to face each other on one side of the extension block, a plurality of fingers in which the wafer is inserted is arranged in a row, the lower wafer And a finger member having a support surface for supporting the bottom surface thereof.
또한, 상기 핑거부재는 상기 연장부와 탈착되며, 상기 핑거부재와 연장블럭의 사이에는 상기 제1홀더와 제2홀더로 웨이퍼의 구속시 가압력을 제공하는 가압스프링;이 더 포함되는 것을 특징으로 한다.In addition, the finger member is detachable from the extension portion, and between the finger member and the extension block a pressing spring for providing a pressing force when restraining the wafer to the first holder and the second holder; .
이상 상술한 바와 같은 본 발명에 의하면, 웨이퍼 푸셔에 보관된 웨이퍼를 양측에서 접근하는 방식으로 잡음과 동시에, 웨이퍼의 하부를 지지하므로 웨이퍼의 무게를 3곳에서 분산하여 웨이퍼의 하중에 의한 변형이 최소화되는 장점이 있다.According to the present invention as described above, the wafer stored in the wafer pusher supports the lower part of the wafer at the same time as the noise in a manner of approaching from both sides, so that the weight of the wafer is dispersed at three places to minimize deformation due to the load of the wafer. It has the advantage of being.
또한, 웨이퍼의 측면을 잡는 동작에서 가압스프링의 탄성력이 제공되므로 웨이퍼를 더욱 안정적으로 잡을 수 있는 장점이 있다.In addition, since the elastic force of the pressure spring is provided in the operation of holding the side of the wafer there is an advantage that can hold the wafer more stably.
도 1은 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈의 개략적인 플로우챠트이다.1 is a schematic flowchart of a wafer transfer module according to a preferred embodiment of the present invention.
도 2는 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈의 정면도이다.2 is a front view of a wafer transfer module according to a preferred embodiment of the present invention.
도 3은 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈의 사시도이다.3 is a perspective view of a wafer transfer module according to a preferred embodiment of the present invention.
도 4는 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈 중 버티컬 타입 웨이퍼 이송 컨베이어가 생략된 상태의 사시도이다.Figure 4 is a perspective view of a state in which a vertical wafer transfer conveyor of the wafer transfer module according to an embodiment of the present invention is omitted.
도 5는 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 사시도 및 부분확대도이다.5 is a perspective view and a partially enlarged view of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
도 6은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 정면도이다.6 is a front view of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
도 7은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 측면도이다.7 is a side view of a vertical type wafer transfer conveyor in accordance with a preferred embodiment of the present invention.
도 8은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 카세트의 사시도이다.8 is a perspective view of a cassette of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
도 9는 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 카세트의 정면도이다.9 is a front view of the cassette of the vertical type wafer transfer conveyor according to the preferred embodiment of the present invention.
도 10은 본 발명의 바람직한 실시예에 따른 푸셔의 사시도 및 부분확대도이다.10 is a perspective view and a partially enlarged view of the pusher according to the preferred embodiment of the present invention.
도 11와 도 12는 본 발명의 바람직한 실시예에 따른 푸셔로 웨이퍼를 탈거하는 모습을 보인 측면도이다.11 and 12 are side views showing the removal of the wafer with a pusher according to a preferred embodiment of the present invention.
도 13은 본 발명의 바람직한 실시예에 따른 그립퍼의 사시도 및 부분확대도이다.13 is a perspective view and a partially enlarged view of a gripper according to a preferred embodiment of the present invention.
도 14는 본 발명의 바람직한 실시예에 따른 보트 트랜스퍼의 정면도이다.14 is a front view of a boat transfer according to a preferred embodiment of the present invention.
도 15는 본 발명의 바람직한 실시예에 따른 엘리베이터의 사시도이다.15 is a perspective view of an elevator according to a preferred embodiment of the present invention.
도 16 내지 도 19는 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈로 웨이퍼를 이동하는 모습을 보인 상태도이다.16 to 19 are state diagrams showing the state of moving the wafer to the wafer transfer module according to an embodiment of the present invention.
도 20 내지 도 21은 종래기술에 따른 웨이퍼 그립퍼의 개략적인 구성도이다.20 to 21 is a schematic configuration diagram of a wafer gripper according to the prior art.
이하, 첨부된 도면을 참조하여, 본 발명의 실시예들을 설명하기로 한다. 각 도면에 제시된 동일한 부호는 동일한 부재를 나타낸다. 본 발명을 설명함에 있어, 관련된 공지 기능 혹은 구성에 관한 구체적인 설명은 본 발명의 요지를 모호하지 않게 하기 위하여 생략한다.Hereinafter, with reference to the accompanying drawings, it will be described embodiments of the present invention. Like reference numerals in the drawings denote like elements. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the subject matter of the present invention.
도 1은 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈로 웨이퍼를 이송하는 개략적인 플로우차트로서, 후술할 본 발명은 도 1에 도시된 바와 같은 순서의 공정을 수행한다.FIG. 1 is a schematic flowchart of transferring a wafer to a wafer transfer module according to a preferred embodiment of the present invention. The present invention, which will be described later, performs a process as shown in FIG.
여기서, 웨이퍼 이송모듈은 후술할 제1공정 내지 제3공정을 모두 포함하는 것이다.Here, the wafer transfer module includes all of the first to third processes to be described later.
먼저, 웨이퍼를 후술할 버티컬 타입 웨이퍼 이송 컨베이어에 구비된 카세트에 장착하고, 웨이퍼 이송 컨베이어를 구동시켜 로딩을 한다.First, the wafer is mounted in a cassette provided in a vertical type wafer transfer conveyor to be described later, and the wafer transfer conveyor is driven and loaded.
이후, 상기와 같이 로딩되는 카세트에 보관된 웨이퍼를 퍼니스로 이동시키기 위해 웨이퍼 푸셔를 이용하여 웨이퍼를 카세트로부터 탈거하고, 이렇게 탈거된 웨이퍼를 웨이퍼 그립퍼로 잡아서 보트 트랜스퍼로 이동시킨다.Then, the wafer is removed from the cassette by using a wafer pusher to move the wafer stored in the cassette loaded as described above to the furnace, and the wafer thus removed is caught by the wafer gripper and moved to the boat transfer.
이후, 보트 트랜스퍼로 웨이퍼를 엘리베이터까지 이동시킨 다음, 엘리베이터에 탑재하고 상승시켜 웨이퍼를 퍼니스로 이동시키며, 이렇게 이동된 웨이퍼는 퍼니스에서 다음 공정으로 진행된다.The wafer is then transferred to the elevator by boat transfer, then mounted in the elevator and lifted to move the wafer to the furnace, which is then moved to the next process in the furnace.
도 2 내지 도 4에는 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈의 사시도와 정면도가 도시되어 있는데, 도 2 내지 도 4에 도시된 바와 같이, 본 발명은 버티컬 타입 웨이퍼 이송 컨베이어(100), 웨이퍼 푸셔(200), 웨이퍼 그립퍼(300)로 구성되는 제1공정부(a)와, 보트 트랜스퍼(400)로 구성되는 제2공정부(b) 및 엘리베이터(500)로 구성되는 제3공정부(c)를 포함하며, 웨이퍼는 제1공정부(a), 제2공정부(b) 및 제3공정부(c)에 의해 순차적으로 이동된다.2 to 4 are a perspective view and a front view of a wafer transfer module according to a preferred embodiment of the present invention, as shown in Figures 2 to 4, the present invention is a vertical type wafer transfer conveyor 100, wafer The first process portion (a) consisting of the pusher 200, the wafer gripper 300, the second process portion (b) consisting of the boat transfer 400 and the third process portion (composing the elevator 500) c), and the wafer is sequentially moved by the first process portion (a), the second process portion (b), and the third process portion (c).
먼저, 제1공정부(a)의 버티컬 타입 웨이퍼 이송 컨베이어에 대해 설명한다.First, the vertical type wafer transfer conveyor of the 1st process part (a) is demonstrated.
도 5는 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 사시도 및 부분확대도, 도 6은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 정면도, 도 7은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 측면도가 도시되어 있다.5 is a perspective view and a partially enlarged view of a vertical wafer transfer conveyor according to a preferred embodiment of the present invention, FIG. 6 is a front view of a vertical wafer transfer conveyor according to a preferred embodiment of the present invention, and FIG. A side view of a vertical type wafer transfer conveyor according to an embodiment is shown.
본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어(100)는 풀리(110)와 카세트(120) 및 레일(130)이 포함된다.Vertical type wafer transfer conveyor 100 according to a preferred embodiment of the present invention includes a pulley 110, a cassette 120 and a rail 130.
상기 풀리(110)는 도 5 내지 도 7에 도시된 바와 같이, 상하 방향으로 2개가 한 쌍을 이루며, 이러한 항쌍의 풀리(110)가 좌우에 서로 대칭되도록 2세트가 설치된다. 상기와 같은 풀리(110)는 모터(M)에 의해 동시에 회전가능하도록 상측 또는 하측의 풀리들은 서로 회전축(111)을 매개로 연결된다.As shown in FIGS. 5 to 7, two pairs of pulleys 110 are formed in a vertical direction, and two sets of pairs of pulleys 110 are provided such that the pulleys 110 are symmetrical with each other. As the pulley 110 as described above, the upper or lower pulleys are connected to each other via the rotation shaft 111 so as to be rotatable at the same time by the motor (M).
또한, 상기와 같은 풀리(110)는 타이밍벨트(120)를 매개로 서로 연결되어 동시에 회전되는데, 이러한 회전은 상기 상하방향으로 짝을 이루는 한 쌍의 풀리(110) 중 어느 하나의 풀리에 모터(M)가 설치되고, 모터(M)의 회전이 타이밍벨트(120)로 전달되어 나머지 하나의 풀리가 회전된다.In addition, the pulley 110 as described above is connected to each other via a timing belt 120 and rotated at the same time, the rotation of any one of the pulley motor of the pair of pulleys (110) paired in the vertical direction ( M) is installed, the rotation of the motor (M) is transmitted to the timing belt 120, the other one pulley is rotated.
상기와 같은 타이밍벨트(120)는 기어처럼 등 간격의 홈을 가진 풀리(110)에 정확히 맞물리도록 내주면에 같은 간격의 홈을 가지므로 회전을 정확하게 전달할 수가 있으며, 고무재질로 제작되는 것이 바람직하지만, 고무재질로 제작될 경우 장력이 변동될 수 있으므로 금속재질의 체인으로 제작될 수도 있다.Since the timing belt 120 as described above has grooves of equal intervals on the inner circumferential surface so as to be precisely engaged with the pulleys 110 having equally spaced grooves like gears, the timing belt 120 can accurately transmit rotation, but is preferably made of rubber. When made of rubber material, the tension may be changed, so it may be made of metal chain.
또한, 상기 타이밍벨트(120)는 도 5의 부분확대도에 도시된 바와 같이, 클램프(141)를 매개로 카세트(140)에 연결되어 카세트(140)를 일정한 궤적으로 회전시키는 역할을 하는데, 상기 클램프(141)는 타이밍벨트(120)의 내주면에 형성된 홈에 맞물려 고정된다.In addition, the timing belt 120 is connected to the cassette 140 via a clamp 141 to rotate the cassette 140 in a constant trajectory, as shown in a partially enlarged view of FIG. 5. The clamp 141 is fixed to the groove formed in the inner peripheral surface of the timing belt 120.
상기 카세트(140)는 도 8 내지 도 9에 도시된 바와 같이, 웨이퍼(1)가 장착되는 본체(150)와, 이 본체(150)의 양측에 구비되는 이송유닛(160)으로 구성되며, 카세트(140)의 이동시 뒤틀림이 발생되지 않도록 상기 이송유닛(160)은 본체(150)에 회전가능하게 설치된 상태에서 일측과 타측이 각각 타이밍벨트(120)와 레일(130)에 연결된다.8 to 9, the cassette 140 includes a main body 150 on which the wafer 1 is mounted and a transfer unit 160 provided on both sides of the main body 150. The transfer unit 160 is connected to the timing belt 120 and the rail 130 on one side and the other side in a state in which the transfer unit 160 is rotatably installed on the main body 150 so that the warpage does not occur.
상기 본체(150)는 한 쌍의 플레이트(151)와, 이 플레이트(151)를 서로 연결하는 다수의 연결봉(152)으로 구성되는데, 상기 연결봉(152)에는 웨이퍼(1)가 삽입될 수 있도록 다수의 삽입홈(153)이 형성된다.The main body 150 includes a pair of plates 151 and a plurality of connecting rods 152 connecting the plates 151 to each other, and the connecting rods 152 may include a plurality of wafers 1 to be inserted therein. The insertion groove 153 is formed.
도 8에는 상기 연결봉(152)이 2개씩 짝을 이루어 총 6개 구비되는 것이 도시되어 있는데, 하측 2개의 연결봉은 웨이퍼(1)가 세워진 상태로 삽입되어 있을 때 웨이퍼의 하측을 지지하며, 나머지 4개의 연결봉은 웨이퍼의 좌,우측을 각각 지지한다.FIG. 8 shows that the connecting rods 152 are paired two by six, and the lower two connecting rods support the lower side of the wafer when the wafer 1 is inserted in the upright state. Four connecting rods support the left and right sides of the wafer, respectively.
또한, 상기 하측 2개의 연결봉은 서로 일정거리 이격되는데, 이렇게 이격되는 이유는 후술할 웨이퍼 푸셔(200)가 하측 2개의 연결봉들 사이로 진입되어 카세트(140)에 보관된 웨이퍼(1)를 탈거 할 수 있도록 하기 위함이다.In addition, the lower two connecting rods are spaced apart from each other by a predetermined distance. The reason for the separation is that the wafer pusher 200, which will be described later, enters between the lower two connecting rods to remove the wafer 1 stored in the cassette 140. To make it work.
한편, 상기 본체(150)의 양측에는 도 8 내지 도 9에 도시된 바와 같이, 대체로 "ㄴ"자 형상으로 절곡된 측판(161)이 연결되며, 이 측판(161)에는 도 5의 부분확대도와 도 8 내지 도 9에 도시된 바와 같은 이송유닛(160)이 연결된다Meanwhile, as shown in FIGS. 8 to 9, side plates 161 that are bent in a "b" shape are connected to both sides of the main body 150, and the side plates 161 are partially enlarged views of FIG. 5. Transfer unit 160 as shown in Figures 8 to 9 is connected
상기와 같은 이송유닛(160)은 타이밍벨트(120)와 레일(130) 모두에 연결되는 부재로서, 이러한 이송유닛(160)은 상기 측판(162)에 회전가능하게 연결되며, 이러한 이송유닛(160)의 회전중심을 기준으로 일측에는 클램프(141)가, 타측에는 트랙킹 플레이트(163)가 각각 형성되는데, 도 5의 부분확대도에 도시된 바와 같이, 상기 클램프(141)는 타이밍벨트(120)와, 상기 트랙킹 플레이트(163)는 레일(130)과 각각 연결된다.The transfer unit 160 is a member connected to both the timing belt 120 and the rail 130, the transfer unit 160 is rotatably connected to the side plate 162, such a transfer unit 160 A clamp 141 is formed at one side and a tracking plate 163 is formed at the other side with respect to the rotation center of the center. As shown in a partially enlarged view of FIG. 5, the clamp 141 is a timing belt 120. And, the tracking plate 163 is connected to the rail 130, respectively.
상기 클램프(141)는 타이밍벨트(120)에 고정된 상태로 이동되는 것임에 반해, 상기 트랙킹 플레이트(161)는 레일(130)을 따라 이동되므로 트랙킹 플레이트(163)는 레일(130)과 볼베어링(162)을 매개로 연결되며, 레일(130)에서 이탈이 방지되도록 이탈방지블럭(164)이 구비되는 것이 바람직하다.Whereas the clamp 141 is fixed to the timing belt 120, the tracking plate 161 is moved along the rail 130, so the tracking plate 163 is a rail 130 and a ball bearing ( 162 is connected via a medium, it is preferable that the departure prevention block 164 is provided to prevent the departure from the rail (130).
상기 레일(130)은 상술한 타이밍벨트(120)의 외측에 설치되는 부재로서, 이러한 레일(130)은 금속재질로 제작되는 것이 일반적이다. 또한, 상기 레일(130)은 상기 트랙킹 플레이트(163)와 연결되어 타이밍벨트(120)에 의해 이동되는 카세트(140)를 가이드하는 역할을 한다.The rail 130 is a member installed outside the timing belt 120 described above, and the rail 130 is generally made of a metal material. In addition, the rail 130 is connected to the tracking plate 163 and serves to guide the cassette 140 moved by the timing belt 120.
상기와 같이 레일(130)을 따라 이동되는 트랙킹 플레이트(163)는 본체(150)와 회전가능하도록 설치되므로 서로 다른 크기의 궤적을 갖는 타이밍벨트(120)와 레일(130)을 따라 이동되어도 카세트(140)가 기울어지거나 상하반전되지 아니한다.Since the tracking plate 163 moved along the rail 130 as described above is rotatably installed with the main body 150, the cassettes may be moved along the timing belt 120 and the rail 130 having different sized trajectories. 140) does not tilt or flip upside down.
상술한 바와 같은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어(100)는 카세트(140)가 타이밍벨트(120)와 레일(130)을 따라 상하방향으로 회전됨으로 인하여 좁은 공간에도 설치가 가능하므로 공간활용도가 증진될 수 있다.Vertical type wafer transfer conveyor 100 according to a preferred embodiment of the present invention as described above can be installed in a narrow space because the cassette 140 is rotated in the vertical direction along the timing belt 120 and the rail 130. Therefore, space utilization can be improved.
다음으로, 제1공정부(a)의 웨이퍼 푸셔에 대해 설명한다.Next, the wafer pusher of the 1st process part (a) is demonstrated.
도 10은 본 발명의 바람직한 실시예에 따른 웨이퍼 푸셔의 사시도 및 부분확대도, 도 11과 도 12는 본 발명의 바람직한 실시예에 따른 웨이퍼 푸셔로 웨이퍼를 탈거하는 모습을 보인 측면도이다.10 is a perspective view and a partially enlarged view of a wafer pusher according to a preferred embodiment of the present invention, and FIGS. 11 and 12 are side views showing a state of removing a wafer with a wafer pusher according to a preferred embodiment of the present invention.
후술할 웨이퍼 푸셔(200)는 도 3 내지 도 4에 도시된 바와 같이, 상술한 버티컬 타입 웨이퍼 이송 컨베이어(100)에 인접하여 설치되는데, 이러한 웨이퍼 푸셔(200)는 카세트(140)에 보관된 웨이퍼(1)를 상부로 밀어올려 카세트(140)로부터 웨이퍼(1)를 탈거하는 역할을 하며, 상술한 버티컬 타입 웨이퍼 이송 컨베이어(100)가 아니라도 다양한 곳에 사용될 수 있으므로 이에 한정되지 아니한다.3 to 4, the wafer pusher 200 to be described later is installed adjacent to the vertical type wafer transfer conveyor 100 described above, the wafer pusher 200 is a wafer stored in the cassette 140 It serves to remove the wafer 1 from the cassette 140 by pushing (1) to the upper portion, and is not limited to the vertical type wafer transfer conveyor 100 because it can be used in various places.
본 발명의 바람직한 실시예에 따른 웨이퍼 푸셔(200)는 X축 프레임(210), X축 이동유닛(220), Y축 프레임(230), Z축 프레임(240) 및 분리부(250)가 포함된다.The wafer pusher 200 according to the preferred embodiment of the present invention includes an X-axis frame 210, an X-axis moving unit 220, a Y-axis frame 230, a Z-axis frame 240, and a separation unit 250. do.
상기 X축 프레임(210)은 상술한 버티컬 타입 웨이퍼 이송 컨베이어(100)의 하부에 에 인접하여 설치되는 부재로서, 이러한 X축 프레임(210)은 도 4에 도시된 바와 같이, 웨이퍼 이송모듈의 골격을 이루는 골조프레임(10)에 연결된다.The X-axis frame 210 is a member installed adjacent to the lower portion of the vertical type wafer transfer conveyor 100 described above, such an X-axis frame 210 is a skeleton of the wafer transfer module, as shown in FIG. It is connected to the frame frame forming a 10.
또한, 상기 X축 프레임(210)에는 길이방향을 따라 X축 레일(211)이 형성되며, 이러한 X축 레일(211)에는 X축 이동유닛(220)이 연결되는데, 상기 X축 이동유닛(220)에는 X축 레일(211)에 결합되어 X축 방향으로 이동되는 X축 이동브라켓(221)이 포함된다.In addition, the X-axis frame 210 is formed with an X-axis rail 211 along the longitudinal direction, the X-axis rail 211 is connected to the X-axis moving unit 220, the X-axis moving unit 220 ) Includes an X-axis moving bracket 221 coupled to the X-axis rail 211 and moved in the X-axis direction.
상기 Y축 프레임(230)은 X축 이동유닛(220)에 연결되어 X축 방향으로 이동되는 부재로서, 이러한 Y축 프레임(230)은 상기 X축 프레임(210)에 수직하게 설치된다.The Y-axis frame 230 is a member that is connected to the X-axis moving unit 220 to move in the X-axis direction, the Y-axis frame 230 is installed perpendicular to the X-axis frame 210.
또한, 상기 Y축 프레임(230)에는 길이방향을 따라 Y축 레일(231)이 형성되며, 이러한 Y축 레일(231)에는 Y축 이동브라켓(232)이 결합되는데, 이러한 Y축 이동브라켓(232)은 Z축 프레임(240)과 연결되어 Z축 프레임(240)을 Y축 방향으로 이동시킨다.In addition, the Y-axis frame 230, the Y-axis rail 231 is formed along the longitudinal direction, the Y-axis rail 231 is coupled to the Y-axis moving bracket 232, such a Y-axis moving bracket 232 ) Is connected to the Z-axis frame 240 to move the Z-axis frame 240 in the Y-axis direction.
상기 Z축 프레임(240)은 상술한 바와 같이, Y축 레일(231)에 결합된 Y축 이동브라켓(232)에 연결되어 Y축 프레임(230)을 따라 이동되는 부재이다.As described above, the Z-axis frame 240 is a member which is connected to the Y-axis moving bracket 232 coupled to the Y-axis rail 231 and moved along the Y-axis frame 230.
또한, 상기 Z축 프레임(240)에는 길이방향을 따라 Z축 레일(241)이 형성되는데, 이러한 Z축 레일(241)에는 Z축 방향으로 이동되는 Z축 이동브라켓(242)이 연결되며, 이 Z축 이동브라켓(242)에는 후술할 분리부(250)가 연결된다.In addition, the Z-axis frame 240 is formed with a Z-axis rail 241 along the longitudinal direction, the Z-axis rail 241 is connected to the Z-axis moving bracket 242 to be moved in the Z-axis direction, this The separation unit 250 to be described later is connected to the Z-axis moving bracket 242.
상기 분리부(250)는 상술한 Z축 프레임(240)과 Z축 이동브라켓(242)을 매개로 연결되어 Z축 이동브라켓(242)의 구동패턴에 따라 승하강되는 부재로서, 이러한 분리부(250)는 도 10 내지 도 12에 도시된 바와 같이, 한 쌍의 상하포스트(251), 핑거블럭(252), 핑거부재(253)로 구성된다.The separating part 250 is a member that is connected to and moved up and down in accordance with the driving pattern of the Z-axis moving bracket 242 by connecting the Z-axis frame 240 and the Z-axis moving bracket 242 as described above. As shown in FIG. 10 to FIG. 12, the pair of upper and lower posts 251, the finger blocks 252, and the finger members 253 are included.
상기 한 쌍의 상하포스트(251)는 도 10 내지 도 12에 도시된 바와 같이, Z축 이동브라켓(242)에 연결되되, 상측(Z축 방향)으로 연장형성되며, 이러한 한 쌍의 상하포스트(251)의 상부에는 핑거블럭(252)이 연결되고, 상기 핑거블럭(252)에는 핑거부재(253)가 상하방향(Z축 방향)으로 설치된다.The pair of upper and lower posts 251 is connected to the Z-axis moving bracket 242, as shown in Figures 10 to 12, and extends to the upper side (Z-axis direction), such a pair of upper and lower posts ( The finger block 252 is connected to the upper portion of the 251, the finger member 253 is installed in the vertical direction (Z-axis direction) on the finger block 252.
상기 핑거블럭(252)은 도 10의 부분확대도에 도시된 바와 같이, 상하포스트(251)와 연결되는 고정블럭(254)과, 이 고정블럭(254)에 탈착되며, 상기 핑거부재(253)가 설치되는 탈착블럭(255)으로 구성되는데, 이에 따라, 핑거부재(253)의 마모 또는 파손시 새로운 탈착블럭(255)으로 교체가 용이하다.As shown in the partial enlarged view of FIG. 10, the finger block 252 is fixed to the upper and lower posts 251, and fixed to the fixed block 254, and the finger member 253. It is composed of a removable block 255 is installed, accordingly, it is easy to replace with a new removable block 255 when the finger member 253 is worn or broken.
또한, 상기 핑거블럭(252)들은 상술한 카세트(140)의 하부로 접근된 후 Z축 이동브라켓(242)의 상승시 상술한 카세트(140)에 보관된 웨이퍼(1)를 상측으로 밀어올릴 수 있도록 상기 카세트(140)의 하측 2개의 연결봉(152)들 사이의 이격거리 보다 적은 이격거리를 갖는 것이 바람직하다.In addition, the finger blocks 252 may push the wafer 1 stored in the cassette 140 upward when the Z-axis movement bracket 242 rises after approaching the lower portion of the cassette 140 described above. It is preferable to have a separation distance less than the separation distance between the two connecting rods 152 on the lower side of the cassette 140.
상기 핑거부재(253)는 핑거블럭(252)의 상면을 따라 다수의 핑거(266)가 일렬로 배치되는 부재로서, 이러한 다수의 핑거(266)들 사이에는 상술한 카세트(140)에 삽입되어 있는 웨이퍼(1)가 끼워진다.The finger member 253 is a member in which a plurality of fingers 266 are arranged in a line along an upper surface of the finger block 252, and is inserted in the cassette 140 described above between the plurality of fingers 266. The wafer 1 is fitted.
상기와 같은 핑거(256)는 웨이퍼의 손상이 방지되도록 세라믹(Ceramic) 또는 석영(Quartz) 재질로 제작되는 것이 바람직하며, 대체로 연필의 형상으로 형성되되, 상측부터 머리부(257), 몸통부(258) 및 하단부(259)로 구성된다. Finger 256 as described above is preferably made of a ceramic (Ceramic) or quartz (Quartz) material to prevent damage to the wafer, and is formed in the shape of a pencil, the head 257, the body (from the top) 258 and the lower end 259.
상기 머리부(257)는 웨이퍼(1)의 진입이 용이하도록 원뿔형으로 형성되며, 몸통부(258)는 상기 머리부(257)의 하부에 봉형상으로 연결되고, 하단부(259)는 봉형상으로 형성되되, 상기 몸통부(258)의 횡단면보다 작은 횡단면을 갖은 상태로 핑거블럭(252)에 연결된다.The head portion 257 is formed in a conical shape to facilitate the entry of the wafer 1, the body portion 258 is connected to the lower portion of the head portion 257 in a rod shape, the lower end 259 is rod-shaped Is formed, but is connected to the finger block 252 with a cross section smaller than the cross section of the body portion 258.
상기와 같이 핑거(256)의 하단부(259)가 몸통부(258)보다 작게 형성되면, 웨이퍼(1)가 핑거(256)에 끼워지면서 발생되는 칩이 하부로, 좀 더 구체적으로 하단부(259) 사이의 틈으로 원활하게 배출되도록 하는 역할을 하며, 이에 따라, 상기 핑거블럭(252)의 상면(탈착블럭의 상면)에는 상기 핑거(256)의 하단부에서 배출되는 칩이 원활하게 하향이동되도록 경사면(260)이 형성되는 것이 바람직하다.As described above, when the lower end 259 of the finger 256 is formed smaller than the body 258, the chip generated while the wafer 1 is inserted into the finger 256 is lowered, more specifically, the lower end 259. It serves to discharge smoothly to the gap between, accordingly, the upper surface of the finger block 252 (upper surface of the removable block) inclined surface (chip) discharged from the lower end of the finger 256 to move smoothly ( 260 is preferably formed.
다음으로, 제1공정부(a)의 웨이퍼 그립퍼에 대해 설명한다.Next, the wafer gripper of the 1st process part (a) is demonstrated.
도 13은 본 발명의 바람직한 실시한 실시예에 따른 웨이퍼 그립퍼의 사시도 및 부분확대도이다.13 is a perspective view and a partially enlarged view of a wafer gripper according to a preferred embodiment of the present invention.
후술할 웨이퍼 그립퍼(300)는 도 3 내지 도 4에 도시된 바와 같이, 상술한 웨이퍼 푸셔(200)의 상부에 인접하여 설치되는데, 이러한 웨이퍼 그립퍼(300)는 카세트(140)에 보관된 웨이퍼(1)를 웨이퍼 푸셔(200)로 들어올린 상태에서 웨이퍼(1)를 잡아 버티컬 타입 웨이퍼 이송 컨베이어(100)의 외부로 이동시킨 다음, 후술할 보트 트랜스퍼(400)로 이동시키는 역할을 한다.3 to 4, the wafer gripper 300 to be described later is installed adjacent to the upper portion of the above-described wafer pusher 200, the wafer gripper 300 is a wafer (stored in the cassette 140) In the state in which 1) is lifted up to the wafer pusher 200, the wafer 1 is moved to the outside of the vertical type wafer transfer conveyor 100 and then moved to the boat transfer 400 to be described later.
상기와 같은 웨이퍼 그립퍼(300)는 상술한 버티컬 웨이퍼 푸셔(200)가 아니라도 다양한 곳에 사용될 수 있으므로 이에 한정되지 아니한다.The wafer gripper 300 as described above may not be limited to the vertical wafer pusher 200 since it may be used in various places.
본 발명의 바람직한 실시예에 따른 웨이퍼 그립퍼(300)는 X축 프레임(310), X축 이동유닛(320), Z축 프레임(330), Y축 프레임(340) 및 견인부(350)가 포함된다.The wafer gripper 300 according to the preferred embodiment of the present invention includes an X axis frame 310, an X axis moving unit 320, a Z axis frame 330, a Y axis frame 340, and a towing unit 350. do.
상기 X축 프레임(310)은 웨이퍼 푸셔(200)의 상부에 설치되는 부재로서, 이러한 X축 프레임(310)은 도 4에 도시된 바와 같이, 상술한 웨이퍼 푸셔(200)의 X축 프레임(210)과 동일하게 웨이퍼 이송모듈의 골격을 이루는 골조프레임(10)에 연결된다.The X-axis frame 310 is a member installed on the wafer pusher 200, the X-axis frame 310 as shown in Figure 4, the X-axis frame 210 of the above-described wafer pusher 200 It is connected to the frame (10) forming the skeleton of the wafer transfer module in the same way.
상기 X축 프레임(310)에는 길이방향을 따라 X축 레일(311)이 형성되며, 이러한 X축 레일(311)에는 X축 이동유닛(320)이 연결되는데, 상기 X축 이동유닛(320)에는 X축 레일(311)에 결합되어 X축 방향으로 이동되는 X축 이동브라켓(321)이 포함된다.The X-axis frame 310 is formed with an X-axis rail 311 along the longitudinal direction, the X-axis rail 311 is connected to the X-axis moving unit 320, the X-axis moving unit 320 The X-axis moving bracket 321 coupled to the X-axis rail 311 is moved in the X-axis direction is included.
또한, 상기 X축 이동브라켓(321)에는 Y축 방향으로 Z축 가이드브라켓(322)이 돌출형성되는데, 이러한 Z축 가이드브라켓(322)에는 Z축 프레임(330)이 연결되어 상하로 이동된다.In addition, a Z-axis guide bracket 322 protrudes from the X-axis movement bracket 321 in the Y-axis direction, and the Z-axis guide bracket 322 is connected to the Z-axis frame 330 to move up and down.
이에 따라, 상기 Z축 프레임(330)이 Z축 가이드브라켓(322)에 연결된 상태로 상하방향(Z축 방향)으로의 이동이 확보되도록 상기 Z축 프레임(330)에는 Z축 레일(331)이 형성된다.Accordingly, the Z-axis rail 331 is provided on the Z-axis frame 330 so that movement in the vertical direction (Z-axis direction) is secured while the Z-axis frame 330 is connected to the Z-axis guide bracket 322. Is formed.
상기 Y축 프레임(340)은 상술한 Z축 프레임(330)의 하부에 X축 프레임(310)과 수직하게 배치된 상태로 연결되는 부재로서, 이러한 Y축 프레임(340)은 연결브라켓(341), 고정프레임(342), 이동프레임(343)이 포함되며, 상기 견인부(350)는 제1그립부(360)와 제2그립부(370)가 포함된다.The Y-axis frame 340 is a member connected to the lower portion of the above-described Z-axis frame 330 perpendicular to the X-axis frame 310, the Y-axis frame 340 is a connecting bracket 341 The fixed frame 342 and the moving frame 343 are included, and the towing unit 350 includes a first grip part 360 and a second grip part 370.
상기 Y축 프레임(340)은 견인부(350)가 웨이퍼를 잡을 수 있도록 Y축 방향으로 이동되는 부재이며, 상기 견인부(350)는 Y축 프레임(340)이 이동된 상태에서 웨이퍼(1)를 잡는 역할을 하는 부재이다.The Y-axis frame 340 is a member that is moved in the Y-axis direction so that the traction unit 350 can hold the wafer, the traction unit 350 is the wafer 1 in the state that the Y-axis frame 340 is moved It is a member that plays a role.
상기 연결브라켓(341)은 Z축 프레임(330)과 연결되는 부재로서, 이러한 연결브라켓(341)의 하부에는 고정프레임(342)이 연결된다.The connecting bracket 341 is a member connected to the Z-axis frame 330, and a fixed frame 342 is connected to a lower portion of the connecting bracket 341.
또한, 상기 고정프레임(342)의 하부에는 Y축 방향으로 이동되는 이동프레임(343)이 연결되는데, 상기 고정프레임(342)과 이동프레임(343)은 별도의 이동유닛(344)을 매개로 연결되며, 이에 따라 상기 고정프레임(342)의 하면에는 도시되지 않은 레일이 형성될 수 있다.In addition, a lower portion of the fixed frame 342 is connected to the moving frame 343 which is moved in the Y-axis direction, the fixed frame 342 and the moving frame 343 is connected via a separate moving unit 344 Accordingly, a rail (not shown) may be formed on the bottom surface of the fixed frame 342.
상기와 같은 이동프레임(343)에는 Y축 제1레일(345)이 길이방향을 따라 형성되며, 이 Y축 제1레일(345)에는 Y축 이동유닛(346)이 연결되어 좌우로 이동된다.The first Y-axis rail 345 is formed along the longitudinal direction of the movable frame 343, and the Y-axis first unit 345 is connected to the Y-axis moving unit 346 to move from side to side.
한편, 상기 이동프레임(343)에는 상기 견인부(350)의 제1그립부(360)가 연결되는데, 이러한 제1그립부(360)는 가동플레이트(361)와 제1홀더(362)가 포함되며, 상기 가동플레이트(361)는 도 13에 도시된 바와 같이, 이동프레임(343)의 하면에 고정된 상태로 Y축 방향으로 연장형성되며, 가동플레이트(361)의 하부에는 제1홀더(362)가 형성된다.Meanwhile, the first grip part 360 of the traction part 350 is connected to the moving frame 343, and the first grip part 360 includes a movable plate 361 and a first holder 362. As shown in FIG. 13, the movable plate 361 extends in the Y-axis direction while being fixed to the lower surface of the movable frame 343, and a first holder 362 is disposed below the movable plate 361. Is formed.
또한, 상기 Y축 이동유닛(346)에는 제2그립부(370)가 연결되는데, 이러한 제2그립부(370)는 상기 가동플레이트(361)가 Y축 방향으로 구동시 간섭이 발생되지 않도록 가동플레이트(361)의 상부에 X축 방향으로 연장형성된 별도의 플레이트(371)를 매개로 연결되는 것이 바람직하다.In addition, a second grip part 370 is connected to the Y-axis moving unit 346, and the second grip part 370 may include the movable plate 3 so that interference does not occur when the movable plate 361 is driven in the Y-axis direction. 361 is preferably connected via a separate plate 371 extending in the X-axis direction.
상기와 같은 제2그립부(370)에는 상기 가동플레이트(361)와 간섭을 방지함과 동시에 가동플레이트(361)가 끼워져 이동될 수 있도록 가동홈(372)이 형성되며, 하부에는 제2홀더(373)가 구비되어 상기 Y축 이동유닛(346)의 이동패턴에 따라 Y축 방향으로 이동된다.The second grip portion 370 is provided with a movable groove 372 to prevent the interference with the movable plate 361 and to move the movable plate 361 is inserted, the second holder 373 in the lower portion ) Is moved in the Y-axis direction according to the movement pattern of the Y-axis movement unit 346.
즉, 상기와 같은 제1그립부(360)는 웨이퍼 푸셔(200)의 분리부(250)의 상부까지 이동프레임(343)이 이동된 상태에서 Y축 이동유닛의 제2그립부(370)가 제1그립부(360)로 접근하면서 웨이퍼(1)를 잡는 것이다.That is, the first grip part 360 as described above is the second grip part 370 of the Y-axis moving unit when the moving frame 343 is moved to the upper part of the separation part 250 of the wafer pusher 200. The wafer 1 is held while approaching the grip 360.
한편, 상기 제1홀더(362)와 제2홀더(373)는 도 13의 부분확대도에 도시된 바와 같이, 제1홀더(362)와 제2홀더(373)에 각각 구비되는 연장블럭(380)과, 이 연장블럭(380)의 일측에 서로 마주보도록 설치되는 핑거부재(381)로 구성되는데, 상기 핑거부재(380)에는 핑거(382)가 길이방향을 따라 일렬로 배치된다.Meanwhile, the first holder 362 and the second holder 373 are extended blocks 380 provided in the first holder 362 and the second holder 373, respectively, as shown in a partially enlarged view of FIG. 13. ) And a finger member 381 which is installed to face each other on one side of the extension block 380, wherein the fingers 382 are arranged in a line along the length direction.
상기와 같은 핑거(382)는 웨이퍼(1)가 세워진 상태에서 측면을 가압하여 잡는 부재이므로 웨이퍼(1)가 핑거(382)에 끼워진 상태에서 웨이퍼가 일측으로 회전이 방지되도록 2줄 이상 구비되는 것이 바람직하다.Since the finger 382 is a member that presses and grips the side surface while the wafer 1 is upright, two or more lines are provided to prevent the wafer from being rotated to one side while the wafer 1 is fitted to the finger 382. desirable.
또한, 도 13의 부분확대도에 도시된 바와 같이, 핑거(382)에 웨이퍼(1)가 원활하게 끼워지도록 웨이퍼(1)가 진입되는 초입부분은 원뿔형상으로 제작되는 것이 좋을 것이다.In addition, as shown in a partially enlarged view of FIG. 13, the first entry portion into which the wafer 1 enters to fit the wafer 3 smoothly into the finger 382 may be manufactured in a conical shape.
한편, 상기 핑거부재(381)의 하부에는 세워진 웨이퍼(1)의 하면을 지지하도록 지지면(383)이 형성되는 것이 바람직하다.On the other hand, it is preferable that the support surface 383 is formed below the finger member 381 so as to support the lower surface of the standing wafer 1.
또한, 상기 핑거(382)는 상술한 웨이퍼 푸셔(200)의 핑거(256)와 동일한 세라믹 또는 석영 재질로 제작되며, 이러한 핑거(382)의 마모 또는 파손시 교체가 용이하도록 상기 핑거부재(381)는 연장블럭(380)과 탈착되는 것이 바람직하다. 상기 핑거부재(381)와 연장블럭(380)의 사이에는 도 13의 부분확대도에 도시된 바와 같이, 가압스프링(384)이 설치되는 것도 좋을 것이다.In addition, the finger 382 is made of the same ceramic or quartz material as the finger 256 of the wafer pusher 200 described above, and the finger member 381 may be easily replaced when the finger 382 is worn or damaged. Is preferably detached from the extension block 380. A pressure spring 384 may be installed between the finger member 381 and the extension block 380, as shown in the partially enlarged view of FIG.
상기와 같은 가압스프링(384)은 상기 제1홀더(362)와 제2홀더(373)를 이용하여 세워진 웨이퍼(1)의 가압시 탄성력이 제공되어 웨이퍼(1)를 더욱 견고히 고정시킬 수 있을 것이다.The pressure spring 384 as described above may be provided with an elastic force when pressing the wafer 1 that is erected using the first holder 362 and the second holder 373, thereby more firmly fixing the wafer 1. .
즉, 본 발명의 바람직한 실시예에 따른 웨이퍼 그립퍼는 웨이퍼 푸셔(200)로 들어올려진 웨이퍼(1)의 양측을 핑거(382)로 잡고, 이와 동시에 웨이퍼(1)의 하측을 지지면(383)으로 지지하여 웨이퍼의 상측을 제외한 3점에서 웨이퍼(1)를 안정적으로 잡는 것이 특징이라 할 수 있다.That is, in the wafer gripper according to the preferred embodiment of the present invention, both sides of the wafer 1 lifted by the wafer pusher 200 are held by the fingers 382, and at the same time, the lower side of the wafer 1 is supported by the support surface 383. It can be characterized by holding the wafer 1 stably at three points except the upper side of the wafer by supporting it.
또한, 웨이퍼(1)의 양측을 잡을 때, 가압스프링(384)의 가압력에 의해 웨이퍼(1)를 더욱 견고하게 잡을 수 있다.In addition, when holding both sides of the wafer 1, the pressing force of the pressure spring 384 can hold the wafer 1 more firmly.
다음으로, 보트 트랜스퍼로 구성되는 제2공정부(b)에 대해 설명한다.Next, the 2nd process part b comprised by boat transfer is demonstrated.
도 14에는 보트 트랜스퍼의 정면도가 도시되어 있는데, 이러한 보트 트랜스퍼(400)는 상술한 웨이퍼 푸셔(200)와 웨이퍼 그립퍼(300)에 의해 이동되는 웨이퍼(1)를 전달받아 후술할 엘리베이터(500)로 전달하는 역할을 한다.14 shows a front view of the boat transfer, the boat transfer 400 receives the wafer 1 moved by the wafer pusher 200 and the wafer gripper 300 described above to the elevator 500 to be described later. It serves to convey.
상기와 같은 보트 트랜스퍼(400)는 웨이퍼가 안착되는 보트(410)와, 이 보트(410)를 엘리베이터(500)까지 이동시키는 트랜스퍼유닛(420)과 이 트랜스퍼유닛(420)을 엘리베이터(500)까지 이동시키는 레일의 역할을 하는 수평프레임(430)으로 구성되며, 상기 보트(410)에는 도 21에 도시된 바와 같이, 웨이퍼(1)가 웨이퍼 그립퍼(300)에 의해 일측부터 차례차례 보트(410)에 적재된다.The boat transfer 400 as described above includes a boat 410 on which a wafer is seated, a transfer unit 420 for moving the boat 410 to the elevator 500, and the transfer unit 420 to the elevator 500. It is composed of a horizontal frame 430 that serves as a moving rail, the boat 410, as shown in Figure 21, the wafer 1 in turn by the wafer gripper 300, the boat 410 in turn from one side Is loaded on.
즉, 제2공정부(b)의 보트 트랜스퍼(400)는 보트(410)에 기설정된 갯수의 웨이퍼(예:300장)가 안착되면, 트랜스퍼유닛(420)이 수평프레임(430)을 따라 엘리베이터(500)까지 이동되는 것이다.That is, in the boat transfer 400 of the second process unit (b), when the predetermined number of wafers (eg, 300 sheets) are seated on the boat 410, the transfer unit 420 may be lifted along the horizontal frame 430. It will be moved to 500.
다음으로, 엘리베이터로 구성되는 제3공정부(c)에 대해 설명한다.Next, the 3rd process part c comprised by elevator is demonstrated.
도 15에는 엘리베이터의 사시도가 도시되어 있는데, 이러한 엘리베이터(500)는 상술한 보트 트랜스퍼(400)의 보트(410)를 전달받아 퍼니스로 전달하는 역할을 한다.15 is a perspective view of the elevator. The elevator 500 serves to receive the boat 410 of the boat transfer 400 described above and deliver it to the furnace.
상기와 같은 엘리베이터(500)는 웨이퍼 이송모듈의 골조프레임(10)에 상하방향으로 설치되며, Z축 레일(511)이 구비되는 한 쌍의 Z축 프레임(510)과, 이 Z축 프레임(510)에 각각 연결되는 Z축 이동유닛(520)과, 이 Z축 이동유닛(520)에 Y축 방향으로 연결되는 고정프레임(530)과, 이 고정프레임(530)에 연결되어 Y축 방향으로 이동되는 Y축 프레임(540)이 구비된다. Elevator 500 as described above is installed in the frame frame 10 of the wafer transfer module in the vertical direction, a pair of Z-axis frame 510 is provided with a Z-axis rail 511, the Z-axis frame 510 Z-axis moving unit 520 connected to each other, a fixed frame 530 connected to the Z-axis moving unit 520 in the Y-axis direction, and connected to the fixed frame 530 to move in the Y-axis direction Y-axis frame 540 is provided.
또한, 상기 Y축 프레임(540)에는 Y축 레일(541)이 형성되고, 이 Y축 레일(541)에는 상기 고정프레임(540)과 연결되어 Y축 프레임(540)이 Y축 방향으로 이동되도록 Y축 이동유닛(550)이 형성된다.In addition, a Y-axis rail 541 is formed in the Y-axis frame 540, the Y-axis rail 541 is connected to the fixed frame 540 so that the Y-axis frame 540 is moved in the Y-axis direction The Y axis moving unit 550 is formed.
한편, 도 18에 도시된 바와 같이, 상기 각각의 Y축 프레임(540)의 단부는 보트(410)의 양측과 결합되며, 이렇게 엘리베이터(500)로 이동되는 보트(410)에는 웨이퍼(1)가 수용된 상태이다.On the other hand, as shown in Figure 18, the end of each of the Y-axis frame 540 is coupled to both sides of the boat 410, the wafer 410 is moved to the elevator 500 in this way the wafer 1 The state of acceptance.
또한, 상기와 같이 보트(410)와 결합된 Y축 프레임(540)과 Z축 이동유닛(510)은 모두 각각 동력원(예:서보모터)에 의해 구동되는 것이 바람직한데, 이에 따라, 본 발명의 바람직한 실시예에 따른 엘리베이터(500)는 Z축 이동시에는 동기제어 하고, Y축 이동시에는 보트(410)의 좌,우 수평 및 기울기의 제어가 가능하도록 한다.In addition, as described above, the Y-axis frame 540 and the Z-axis moving unit 510 coupled with the boat 410 are each preferably driven by a power source (eg, a servo motor). The elevator 500 according to the preferred embodiment allows the synchronous control when moving the Z-axis, the left, right horizontal and tilt control of the boat 410 when moving the Y-axis.
한편, 상기와 같은 엘리베이터와 보트의 결합은 도 15의 부분홧대도에 도시된 바와 같이, 보트의 길이방향 양측 끝단에 형성된 결합브라켓(411)과 이동브라켓의 단부에 구비된 결합봉(560)의 결합에 의해 이루어질 수 있다.On the other hand, the combination of the elevator and the boat as shown in Fig. 15, the coupling of the coupling bracket 411 and the end of the movable bracket 560 formed on both ends in the longitudinal direction of the boat By coupling.
이하, 상기와 같은 구성을 갖는 웨이퍼 이송모듈로 퍼니스에 웨이퍼를 이송하는 동작을 순서대로 설명한다. 설명에 앞서 후술할 모든 부재들의 이동은 별도의 동력원(예:서보모터)에 의해 이루어질 수 있다.Hereinafter, the operation of transferring the wafer to the furnace with the wafer transfer module having the above configuration will be described in order. The movement of all members to be described below before the description may be made by a separate power source (eg, a servo motor).
먼저, 작업자는 카세트(140)에 웨이퍼(1)를 세워서 끼워넣는다. 이때, 작업자는 카세트(140)에 도시되지 않은 저장수단을 부착하는데, 이러한 저장수단은 웨이퍼(1)의 종류, 생산지, 생산기업, 생산날짜 등의 이력이 저장될 수 있다.First, the operator puts the wafer 1 upright in the cassette 140. At this time, the worker attaches a storage means (not shown) to the cassette 140, the storage means may be stored the history of the type of wafer 1, the production site, the production company, the production date.
상기와 같은 저장수단은 바코드가 인쇄된 스티커로 제작될 수도 있으나, RFID 카드로 제작될 수도 있는데, 이러한 저장수단은 도 5에 도시된 버티컬 타입 웨이퍼 이송 컨베이어(100)에 구비된 센서부(S)에 의해 감지될 수 있으며, 이렇게 감지된 저장수단의 정보는 도시되지 않은 제어부로 전송될 수 있을 것이다.The storage means as described above may be made of a bar code printed sticker, it may be made of an RFID card, such storage means is a sensor unit (S) provided in the vertical type wafer transfer conveyor 100 shown in FIG. It can be detected by, and the detected information of the storage means may be transmitted to a controller (not shown).
또한, 상기 제어부는 타이밍벨트(120)와 레일(130)을 따라 이동되는 다수의 카세트(140)를 이동시키는 역할과, 웨이퍼 푸셔(200)로 카세트(140)에 보관된 웨이퍼(1)를 들어올리는 공정, 웨이퍼 푸셔(200)로 들어올려진 웨이퍼(1)를 웨이퍼 그립퍼(300)로 잡는 공정, 웨이퍼 그립퍼(300)로 잡은 웨이퍼(1)를 보트 트랜스퍼(400)로 이동시켜 엘리베이터(500)로 이동시키는 공정, 엘리베이터(500)로 이동된 웨이퍼(1)를 퍼니스로 이동시키는 공정을 수행할 수 있다.In addition, the control unit serves to move the plurality of cassettes 140 that are moved along the timing belt 120 and the rail 130, and the wafer pusher 200 holds the wafer 1 stored in the cassette 140. The process of raising, the process of holding the wafer 1 lifted by the wafer pusher 200 with the wafer gripper 300, and the wafer 1 caught with the wafer gripper 300 are moved to the boat transfer 400 to the elevator 500. The process of moving and the process of moving the wafer 1 moved to the elevator 500 to a furnace may be performed.
이에 따라, 상기 제어부에 보관된 웨이퍼(1)의 정보에 의해 퍼니스에 필요한 웨이퍼의 양, 종류 등을 판단할 수 있다.Accordingly, the amount, type, etc. of the wafer required for the furnace can be determined based on the information of the wafer 1 stored in the controller.
또한, 상기와 같이 레일(130)을 따라 이동되는 카세트(140)는 정해진 위치에서 웨이퍼 푸셔(200)에 의해 카세트(140)에 보관된 웨이퍼(1)가 탈착되는데, 이렇게 웨이퍼 푸셔에 의해 카세트에 보관된 웨이퍼가 탈거되는 모습이 도 11 내지 도 12 및 도 16에 도시되어 있다.In addition, as described above, the cassette 140 moved along the rail 130 is detached from the wafer 1 stored in the cassette 140 by the wafer pusher 200 at a predetermined position. Figures 11 to 12 and 16 show how the stored wafer is removed.
상기와 같이 웨이퍼 푸셔(200)로 카세트(140)에 보관된 웨이퍼(1)를 탈착하는 순서에 대해 간략하게 설명하면 다음과 같다.As described above, the procedure for detaching and removing the wafer 1 stored in the cassette 140 by the wafer pusher 200 is as follows.
먼저, 카세트(140)의 위치(X.Y,Z 좌표)를 감지하고, X축 이동유닛(221)이 X축 레일(211)을 따라 이동된 다음, 카세트(140)의 하측까지 Y축 이동유닛(231)을 따라 Z축 프레임(240)이 이동된다.First, the position (XY, Z coordinate) of the cassette 140 is sensed, and the X-axis moving unit 221 is moved along the X-axis rail 211, and then the Y-axis moving unit (down to the lower side of the cassette 140) The Z-axis frame 240 is moved along the 231.
상기와 같이 Z축 프레임(240)이 이동된 상태에서 Z축 이동유닛(242)이 상승하며, 이에 따라 카세트(140)의 하부로 핑거부재(253)가 진입하면서 웨이퍼(1)를 카세트(140)로부터 탈거한다.As described above, the Z-axis moving unit 242 is raised in the state in which the Z-axis frame 240 is moved. As a result, the finger member 253 enters the lower portion of the cassette 140 to move the wafer 1 to the cassette 140. Remove from
상기와 같이 웨이퍼 푸셔(200)에 의해 카세트(140)로부터 탈거된 웨이퍼(1)는 도 17에 도시된 바와 같이, 웨이퍼 그립퍼(300)의 견인부(350)가 전달받는데, 견인부(350)로 웨이퍼(1)를 전달받는 순서에 대해 간략하게 설명하면 다음과 같다.As shown in FIG. 17, the wafer 1 detached from the cassette 140 by the wafer pusher 200 receives the towing unit 350 of the wafer gripper 300, and the towing unit 350 is transferred to the wafer 1. A brief description will be given of the order in which the wafer 1 is received.
먼저, 상기 웨이퍼 푸셔(200)의 핑거부재(253)에 의해 웨이퍼(1)가 탈거된 위치(X,Y,Z 좌표)를 감지하고, X축 이동유닛(321)이 X축 레일(311)을 따라 이동된 다음 이동프레임(343)이 Y축 방향으로 이동된다.First, the position (X, Y, Z coordinate) of the wafer 1 is removed by the finger member 253 of the wafer pusher 200, and the X-axis moving unit 321 is the X-axis rail 311 Next, the moving frame 343 is moved in the Y-axis direction.
이때, 제1그립부(360)와 제2그립부(370)가 웨이퍼(1)와 충돌되지 않는 폭을 가진 상태로 이동되는 것이 바람직할 것이다.In this case, the first grip part 360 and the second grip part 370 may be moved in a state in which the first grip part 360 and the second grip part 370 do not collide with the wafer 1.
상기와 같이 제1그립부(360)와 제2그립부(370)가 웨이퍼 푸셔(200)의 상부로 이동이 된 후, Z축 프레임(330)이 Z축 가이드브라켓(322)을 따라 하강한 다음, Y축 이동유닛(340)을 구동시켜 웨이퍼 푸셔(200)에 보관된 웨이퍼(1)의 양측을 가압한다.After the first grip part 360 and the second grip part 370 are moved to the upper portion of the wafer pusher 200 as described above, the Z axis frame 330 is lowered along the Z axis guide bracket 322. The Y-axis moving unit 340 is driven to press both sides of the wafer 1 stored in the wafer pusher 200.
이후, 웨이퍼 푸셔(200)는 초기위치로 이동되어 버티컬 타입 웨이퍼 이송 컨베이어(100)의 외부로 빠져나오며, 상기 웨이퍼 그립퍼(300)는 Y축 방향으로 이동되어 버티컬 타입 웨이퍼 이송 컨베이어(100)의 외부로 빠져나온다.Thereafter, the wafer pusher 200 is moved to an initial position and exits the outside of the vertical type wafer transfer conveyor 100, and the wafer gripper 300 is moved in the Y-axis direction to the outside of the vertical type wafer transfer conveyor 100. Exits.
이후, 웨이퍼 그립퍼(300)는 도 18에 도시된 바와 같이, 보트 트랜스퍼(400)로 이동되어 웨이퍼(1)를 탑재하고, 보트 트랜스퍼(400)에 기설정된 갯수의 웨이퍼(1)가 이동되면, 도 18에 도시된 바와 같이, 보트(410)를 엘리베이터(500)에 탑재하기 위해 X축 방향으로 이동한다.Subsequently, as shown in FIG. 18, when the wafer gripper 300 is moved to the boat transfer 400 to mount the wafer 1, and the predetermined number of wafers 1 are moved to the boat transfer 400, As shown in FIG. 18, the boat 410 is moved in the X-axis direction for mounting the elevator 500.
이후, 도 19에 도시된 바와 같이, 엘리베리터(500)를 이용하여 웨이퍼(1)가 탑재된 보트(410)를 상승시켜 퍼니스로 이동하면 웨이퍼 이송모듈의 이송과정이 완료된다.Subsequently, as shown in FIG. 19, when the boat 410 on which the wafer 1 is mounted is raised using the elevator 500 and moved to the furnace, the transfer process of the wafer transfer module is completed.
도면과 명세서에서 최적의 실시예들이 개시되었다. 여기서, 특정한 용어들이 사용되었으나, 이는 단지 본 발명을 설명하기 위한 목적에서 사용된 것이지 의미한정이나 특허청구범위에 기재된 본 발명의 범위를 제한하기 위하여 사용된 것은 아니다. 그러므로, 본 기술 분야의 통상의 지식을 가진자라면, 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 따라서, 본 발명의 진정한 기술적 보호범위는 첨부된 특허청구범위의 기술적 사상에 의해 정해져야 할 것이다.The best embodiments have been disclosed in the drawings and specification. Herein, specific terms have been used, but they are used only for the purpose of describing the present invention and are not used to limit the scope of the present invention as defined in the meaning or claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (7)

  1. 웨이퍼 푸셔의 상부에 설치되는 X축 프레임;과An X-axis frame installed on the wafer pusher; and
    상기 X축 프레임을 따라 이동되는 X축 이동유닛;과An X-axis moving unit moved along the X-axis frame; And
    상기 X축 이동유닛에 연결되어 상하로 이동되는 Z축 프레임;과A Z-axis frame connected to the X-axis moving unit and moved up and down; and
    상기 Z축 프레임의 하부에 연결되며, 상기 X축 프레임과 수직하게 배치되는 Y축 프레임;과A Y-axis frame connected to a lower portion of the Z-axis frame and disposed perpendicular to the X-axis frame; and
    상기 Y축 프레임에 연결되어 Y축 방향으로 작동되며, 웨이퍼 푸셔에 보관된 웨이퍼를 견인하는 견인부;가 포함되는 것을 특징으로 하는 웨이퍼 그립퍼.And a towing unit connected to the Y-axis frame and operated in the Y-axis direction to pull the wafer stored in the wafer pusher.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 견인부에는, 웨이퍼의 양측을 가압하는 제1홀더;와 제2홀더;가 구비되며,The towing unit includes: a first holder for pressing both sides of the wafer; and a second holder;
    상기 제1홀더와 제2홀더는, 상하로 연장형성된 연장블럭;과The first holder and the second holder, the extending block extending up and down; And
    상기 연장블럭의 일측에 서로 마주보도록 설치되며, 웨이퍼가 끼워지는 다수의 핑거가 일렬로 배치되고, 하부에는 세워진 웨이퍼의 하면을 지지하는 지지면이 형성되는 핑거부재;가 포함되는 것을 특징으로 하는 웨이퍼 그립퍼.A finger member which is installed to face each other on one side of the extension block, a plurality of fingers in which the wafer is inserted are arranged in a row, and a lower finger member having a support surface for supporting a lower surface of the wafer which is standing thereon; Gripper.
  3. 청구항 1에 있어서,The method according to claim 1,
    상기 X축 프레임의 길이방향을 따라 형성되는 X축 레일;과X-axis rail formed along the longitudinal direction of the X-axis frame; And
    상기 X축 레일에 끼워져 이동되며, 상기 X축 이동유닛과 연결되는 X축 이동브라켓;이 더 포함되는 것을 특징으로 하는 웨이퍼 그립퍼.And an X-axis moving bracket inserted into the X-axis rail and connected to the X-axis moving unit.
  4. 청구항 3에 있어서,The method according to claim 3,
    상기 X축 이동브라켓에 형성되는 Z축 가이드브라켓;과Z-axis guide bracket formed on the X-axis moving bracket; And
    상기 Z축 프레임의 길이 방향을 따라 형성되되, 상기 Z축 가이드브라켓과 결합되는 Z축 레일;이 포함되는 것을 특징으로 하는 웨이퍼 그립퍼.And a Z-axis rail formed along a length direction of the Z-axis frame and coupled to the Z-axis guide bracket.
  5. 청구항 1에 있어서,The method according to claim 1,
    상기 Y축 프레임은,The Y-axis frame,
    상기 Z축 프레임과 연결되는 연결브라켓;과A connecting bracket connected to the Z-axis frame; and
    상기 연결브라켓의 하부에 고정되는 고정프레임;과A fixed frame fixed to the lower portion of the connection bracket; and
    상기 고정프레임의 하부에 연결되어 Y축 방향으로 이동되며, Y축 제1레일이 형성되는 이동프레임;과A moving frame connected to a lower portion of the fixed frame and moving in the Y-axis direction and having a first Y-axis rail;
    상기 이동프레임에 연결되며, Y축 방향으로 가동플레이트가 연장형성되되, 이 가동플레이트의 하부에는 제1홀더가 구비되는 제1그립부;와A first grip part connected to the movable frame and having a movable plate extending in a Y-axis direction, the first grip being provided at a lower portion of the movable plate;
    상기 Y축 레일에 연결되어 Y축 방향으로 이동되는 Y축 이동유닛;과Y-axis moving unit connected to the Y-axis rail and moved in the Y-axis direction; And
    상기 Y축 이동유닛에 연결되며, 상기 가동플레이트가 끼워져 이동되도록 내측면을 따라 Y축 제2레일이 형성되고, 하부에는 제2홀더가 구비되는 제2그립부;가 포함되는 것을 특징으로 하는 웨이퍼 그립퍼.A wafer gripper connected to the Y-axis moving unit and having a second Y-axis rail formed along an inner surface thereof so that the movable plate is inserted and moved, and having a second holder at a lower portion thereof. .
  6. 청구항 5에 있어서,The method according to claim 5,
    상기 제1홀더와 제2홀더는,The first holder and the second holder,
    상하로 연장형성된 연장블럭;과An extension block extending vertically; and
    상기 연장블럭의 일측에 서로 마주보도록 설치되며, 웨이퍼가 끼워지는 다수의 핑거가 일렬로 배치되고, 하부에는 세워진 웨이퍼의 하면을 지지하는 지지면이 형성되는 핑거부재;가 포함되는 것을 특징으로 하는 웨이퍼 그립퍼.A finger member which is installed to face each other on one side of the extension block, a plurality of fingers in which the wafer is inserted are arranged in a row, and a lower finger member having a support surface for supporting a lower surface of the wafer, which is set up thereon; Gripper.
  7. 청구항 6에 있어서,The method according to claim 6,
    상기 핑거부재는 상기 연장부와 탈착되며, The finger member is detachable from the extension,
    상기 핑거부재와 연장블럭의 사이에는 상기 제1홀더와 제2홀더로 웨이퍼의 구속시 가압력을 제공하는 가압스프링;이 더 포함되는 것을 특징으로 하는 웨이퍼 그립퍼.And a pressing spring for providing a pressing force when the wafer is restrained by the first holder and the second holder between the finger member and the extension block.
PCT/KR2013/001412 2012-06-27 2013-02-22 Wafer gripper WO2014003286A1 (en)

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KR1020120069362A KR101402317B1 (en) 2012-06-14 2012-06-27 Wafer gripper
KR10-2012-0069362 2012-06-27

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104972451A (en) * 2014-04-08 2015-10-14 上海微电子装备有限公司 Mechanical arm for mask transmission
CN110937218A (en) * 2019-10-29 2020-03-31 西南医科大学附属医院 Clinical medicine bacterial resource library system

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Publication number Priority date Publication date Assignee Title
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features
KR940007230Y1 (en) * 1992-02-12 1994-10-14 김광호 Gripper of wafer transfer equipment for semiconductor manufacture
KR100230932B1 (en) * 1996-07-22 1999-11-15 황인길 Equipment for automatic solder ball placement
KR20010096566A (en) * 2000-04-11 2001-11-07 윤종용 Semiconductor wafer cleaning apparatus and method thereof using the same
KR20110023026A (en) * 2009-08-28 2011-03-08 (유)에스엔티 Cassette transfer apparatus for solar cell wafer and wafer texturing apparatus for solar cell using the same

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features
KR940007230Y1 (en) * 1992-02-12 1994-10-14 김광호 Gripper of wafer transfer equipment for semiconductor manufacture
KR100230932B1 (en) * 1996-07-22 1999-11-15 황인길 Equipment for automatic solder ball placement
KR20010096566A (en) * 2000-04-11 2001-11-07 윤종용 Semiconductor wafer cleaning apparatus and method thereof using the same
KR20110023026A (en) * 2009-08-28 2011-03-08 (유)에스엔티 Cassette transfer apparatus for solar cell wafer and wafer texturing apparatus for solar cell using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104972451A (en) * 2014-04-08 2015-10-14 上海微电子装备有限公司 Mechanical arm for mask transmission
CN110937218A (en) * 2019-10-29 2020-03-31 西南医科大学附属医院 Clinical medicine bacterial resource library system

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