WO2011111886A1 - Automatic loading and unloading apparatus for semiconductor package lead frame magazine - Google Patents

Automatic loading and unloading apparatus for semiconductor package lead frame magazine Download PDF

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Publication number
WO2011111886A1
WO2011111886A1 PCT/KR2010/001508 KR2010001508W WO2011111886A1 WO 2011111886 A1 WO2011111886 A1 WO 2011111886A1 KR 2010001508 W KR2010001508 W KR 2010001508W WO 2011111886 A1 WO2011111886 A1 WO 2011111886A1
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WO
WIPO (PCT)
Prior art keywords
magazine
semiconductor package
lead frame
package lead
conveyor
Prior art date
Application number
PCT/KR2010/001508
Other languages
French (fr)
Korean (ko)
Inventor
조현철
최돈철
Original Assignee
(주) 개성엔터프라이즈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주) 개성엔터프라이즈 filed Critical (주) 개성엔터프라이즈
Priority to PCT/KR2010/001508 priority Critical patent/WO2011111886A1/en
Publication of WO2011111886A1 publication Critical patent/WO2011111886A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Definitions

  • the present invention provides an automatic supply and retrieval of a semiconductor package lead frame magazine capable of automatically extracting and automatically supplying and retrieving a semiconductor package lead frame from a magazine for plating a semiconductor package lead frame loaded in a magazine in a semiconductor package lead frame plating process line. Relates to a device.
  • the semiconductor package is composed of a semiconductor chip and a semiconductor package lead frame.
  • the semiconductor package lead frame includes a lead that serves to connect the inside and the outside of the semiconductor package and a support that supports the semiconductor chip. frame).
  • the lead frame is subsequently subjected to surface treatment such as alkali electrolytic degreasing, micro etching, and the like, and then the thin plate member is formed into a predetermined shape by a stamping process or an etching process.
  • the semiconductor chip is disposed. Molded by molding resin and manufactured into semiconductor package
  • the outread exposed to the outside of the molded semiconductor package is exposed to the outside to prevent chemical change (corrosion by oxidation).
  • the surface of is plated.
  • the plating line of the semiconductor package lead frame proceeds with a cleaning, pretreatment, plating, post treatment, and drying process.
  • These plating lines require automation facilities because they cannot rely on the need to improve productivity and manual work, but due to the high environmental factors of hazardous chemicals, it is not only difficult to fully automate. They are exposed to harsh environmental conditions where earplugs and masks must be worn.
  • the present invention has developed a high-speed linear motion and rotational movement means that can automatically supply and retrieve the semiconductor package lead frame at high speed in the plating process of the semiconductor package lead frame, so that the chain belt for plating is continuously operated at high speed while operating between the transfer mechanisms. It aims to provide a semiconductor package lead frame automatic supply and retrieval device that can minimize the distance, reduce installation space, prevent noise, and realize an optimized automation facility without changing existing plating lines.
  • a lead frame plating apparatus comprising: a first magazine supply conveyor for transferring a semiconductor package lead frame loaded in a magazine to a withdrawal position so as to be withdrawn; First linear transport means for sequentially drawing and supplying a semiconductor package lead frame from a magazine transported by the magazine supply conveyor; A first magazine recovery conveyor for recovering a magazine from which the semiconductor package lead frame is drawn out by the first linear transport means; First alignment means for aligning the semiconductor package lead frame transferred by the first linear transfer means; A first rotation transfer means for attaching the semiconductor package lead frame aligned by the first alignment means to the chain belt for plating; a semiconductor package lead frame attached to the chain belt for plating by the first rotation transfer means and completed a plating process Second rotational conveying means for drawing out the semiconductor package lead frame from the
  • the magazine is formed in a layered space in which the semiconductor package lead frame is individually accommodated by a plurality of slots formed opposite to the inner surfaces of both vertical surfaces, and is open to insert / extract the semiconductor package lead frame on the front and back surfaces.
  • a space is formed so that a plurality of semiconductor package lead frames are stacked in layers.
  • the first magazine supply conveyor is provided with a width adjusting means to transfer the semiconductor package lead frame loaded in the magazine to a position for drawing out.
  • the width adjusting means is installed so that either belt frame is guided and movable in a guide rail installed in a direction perpendicular to the traveling direction of the conveyor, and is installed in a direction parallel to the guide rail, that is, perpendicular to the traveling direction of the conveyor. And the lead screw rotated by the step motor is screwed to be guided to the guide rail as the lead screw rotates to be able to supply a magazine of various specifications.
  • the first linear transfer means is screwed to a lead screw driven by a step motor on one side of the first magazine supply conveyor, and receives a magazine loaded with a semiconductor package lead frame, and is vertically spaced by the interval of the semiconductor frames arranged in layers.
  • a pusher installed horizontally to pull out the semiconductor package lead frame loaded in the magazine;
  • a pair of transfer rollers capable of lifting and lowering so that the upper roller is close to and spaced apart from the lower roller, and compresses the semiconductor package lead frame drawn by the pusher to move in the horizontal direction;
  • the semiconductor package from the magazine transported by the magazine supply conveyor which consists of a pusher which is moved up and down and horizontally by a pneumatic cylinder so as to transport the rear end portion of the semiconductor package lead frame transferred by the transport roller to the first rotary transport means.
  • the lead frame is drawn out sequentially.
  • the lift is provided with a width adjusting means, and is periodically raised by the stacked intervals of the semiconductor package lead frame so that the semiconductor package lead frame can be sequentially ejected by accommodating the transferred magazines installed inside the first magazine supply conveyor.
  • the first magazine recovery conveyor is provided with a width adjusting means such as the magazine supply conveyor to adjust the width of the conveyor together with the magazine supply conveyor, and leads the semiconductor package by an ejector installed on the magazine supply conveyor.
  • the frame ejects the extracted magazine.
  • the ejector is provided with a position adjusting means, and consists of a pair of fingers for clamping and lifting and horizontally moving the magazine discharged from the semiconductor package lead frame by the actuator seated on the first magazine recovery conveyor.
  • the first alignment means is advanced and retracted by a pneumatic cylinder installed on a storage table for accommodating the semiconductor package lead frame drawn by the first linear transfer means, and on a moving table which is slidably placed on the guide rail and moved by a screw shaft. It consists of a operative pusher to align the semiconductor package lead frame so that it can be accurately attached to the belt by the first rotational conveying means.
  • the first rotational conveying means is a pneumatic cylinder rotatably installed in the upper portion of the receiving unit of the alignment means and rotatably installed by a servo motor, and another pneumatic cylinder installed in the piston rod of the pneumatic cylinder to linearly reciprocate And a carrier finger for clamping the semiconductor package lead frame aligned by the alignment means to attach the semiconductor package lead frame transferred by the extraction means to the chain belt for plating.
  • the second rotational conveying means clamps and releases the semiconductor package lead frame after the plating process is completed by a pneumatic cylinder rotatably installed by a servomotor and another pneumatic cylinder installed on the piston rod of the pneumatic cylinder to linearly reciprocate. It is composed of a carrier finger to make the semiconductor package lead frame after the plating process is separated from the chain belt for plating to be recovered.
  • the second alignment means is moved forward and backward by a pneumatic cylinder installed on a movable table for receiving the semiconductor package lead frame separated by the second rotary conveying means and slidably placed on the guide rail and moved by a screw shaft. It consists of a working pusher to align the semiconductor package lead frame so that it can be accurately transported to the recovery magazine.
  • the second linear conveying means includes: a pusher mounted on the piston rod of the pneumatic cylinder so as to push the semiconductor package lead frame placed in the holder to load the semiconductor package lead frame aligned by the second alignment means into a magazine;
  • the upper roller may move up and down so as to be spaced apart from the lower roller, thereby compressing the semiconductor package lead frame drawn by the pusher and compressing the horizontal package direction.
  • the horizontal and vertical movement of the semiconductor package lead frame is performed by a pair of transfer rollers and a pneumatic cylinder installed in the horizontal direction and the vertical direction so that the semiconductor package lead frame transferred to the transfer roller reaches the magazine.
  • a pusher for pushing and transporting the rear end portion In order to receive the semiconductor package lead frame supplied by the pusher, a screw is coupled to a lead screw driven by a step motor on one side of the second magazine supply conveyor to receive a magazine in which the semiconductor package lead frame is not loaded. It consists of lifts that are lifted in the vertical direction by the interval of the layered semiconductor frame to load the semiconductor package lead frame in the magazine.
  • the second magazine supply conveyor is provided with a width adjusting means to transfer the magazine in a state where the semiconductor package lead frame is not loaded to a position for accommodating the semiconductor package lead frame.
  • the width adjusting means is installed such that the belt frame is guided to the guide rail is installed in a direction perpendicular to the traveling direction of the conveyor, such as the first magazine supply conveyor, and is installed to be movable, parallel to the guide rail, that is, the conveyor
  • the lead screw rotated by the servo motor is installed at right angles to the traveling direction of the screw and is guided to the guide rail as the lead screw rotates, thereby providing magazines of various specifications.
  • the second magazine recovery conveyor is provided with the same width adjusting means as the second magazine supply conveyor to adjust the width of the conveyor together with the second magazine supply conveyor, and is installed on the upper side of the second magazine supply conveyor.
  • the magazine on which the semiconductor package lead frame is loaded is discharged by the second discharge means.
  • the second discharge means has a width adjusting means, and is composed of a pair of fingers that clamp, lift and horizontally move the magazine discharged from the semiconductor package lead frame by the actuator to be seated on the second magazine recovery conveyor.
  • the present invention is to minimize the operating distance between the transfer mechanism while the chain belt for plating continuously running at high speed to reduce the installation space and to prevent noise, and to add an automated equipment optimized for the existing installation line in various standards and types It becomes possible to install.
  • FIG. 2 is a front view of the system of the present invention
  • Figure 3 is a front view of the automatic supply and automatic recovery device of the present invention
  • Figure 4 is a side view of the automatic supply and automatic recovery device of the present invention
  • FIG. 5 is a plan view of a conveyor for supplying a first magazine of the present invention.
  • Figure 6 is a side view of the first magazine feed conveyor of the present invention
  • FIG. 8 is a front view of the lower lifter of the present invention.
  • FIG. 10 is a plan view of the upper lifter of the present invention.
  • FIG. 11 is a front view of the upper lifter of the present invention.
  • Figure 13 is a plan view of the ejector of the present invention.
  • Figure 15 is a side view of the ejector of the present invention
  • 16 is a plan view of the transfer roller mechanism of the present invention.
  • 17 is a front view of the transfer roller mechanism of the present invention.
  • 19 is a plan view of the first magazine recovery conveyor of the present invention.
  • 20 is a front view of the first magazine collecting conveyor of the present invention.
  • 21 is a side view of the first magazine collecting conveyor of the present invention.
  • Figure 22 is a plan view of the alignment means of the present invention.
  • Figure 23 is a front view of the alignment means of the present invention.
  • 24 is an overall plan view of the alignment means of the present invention.
  • 25 is an overall front view of the alignment means of the present invention.
  • Figure 26 is an overall side view of the alignment means of the present invention.
  • FIG. 27 is an overall front view of the rotation conveying means of the present invention.
  • Figure 28 is a plan view of the rotational conveying means of the present invention
  • 29 is a front view of the rotation conveying means of the present invention.
  • Figure 31 is a front view of the pusher of the present invention
  • the apparatus of the present invention is a chain belt system (CVS) installed in a conventional plating line that performs washing, pretreatment, plating, post-treatment and drying processes, and the chain for supplying a semiconductor package lead frame (LF) to the plating line.
  • CVS chain belt system
  • LF semiconductor package lead frame
  • the automatic feeding device (A) is the first magazine feed conveyor (1), the first linear feed means (2), the first magazine collecting conveyor (3), the first alignment means (4), the first rotary feed means ( 5), the automatic recovery device (B) comprises a second rotary feed means (5), a second alignment means (7), a second linear feed means (8), a second magazine feed conveyor (9), and a first Consists of two magazine recovery conveyor (10).
  • the first magazine supply conveyor 1 is provided with a wheel 12, on the wheel shafts 11, 11a on which belt frames 10, 10a, 10b, which are installed at both sides of the right side of the chain belt system CVS, are fixed before and after. 12a, 12b, and 12c are fixed so that the pair of wheels 12 and 12a and the belts 13 and 13a installed on the wheels 12b and 12c are driven by the power of the driving motor 14,
  • the belt frame 10a on which the one wheel 12b, 12c and the belt 13a are installed is guided by the guide rails 15, 15a installed in a direction perpendicular to the traveling direction of the conveyor, and the wheel shafts 11, 11a. It is installed to be movable in the axial direction of the.
  • the belt frame 10a which is movably installed along the guide rails 15, 15a, is attached to the lead screws 16, 16a, which are bearing-installed on the belt frames 10, 10b between the belt frames 10, 10b on both sides.
  • the lead screws 16 and 16a are fastened to move in both directions, the width between the belts 12, 12a and 12b, 12c can be adjusted according to the size of the magazine (M).
  • the pair of lead screws 16 and 16a rotate in the same direction by interlocking with the belts 13b installed on the wheels 12d and 12e fixed to one end exposed to the outside of the belt frame 10.
  • the belt frame 10b fixed to the wheel shafts 11 and 11a and the Han Chinese ends of the lead screws 16 and 16a are bearing-mounted, and a drive motor 17 is installed at the front and a step motor 18 at the rear. It is installed.
  • the drive shaft of the drive motor 17 is connected to the wheel shaft 11 to drive the belts 13 and 13a so as to transfer the magazine M placed on the belts 13 and 13a to the first linear transfer means 2. Let's do it.
  • the drive shaft of the step motor 18 is connected to the lead screw 16a to drive the belt 13b so as to interlock another lead screw 16a with the lead screw 16 and thus between the belts 12, 12a, 12b, 12c. Provides power to adjust the width of the step motor 18
  • a space in which the semiconductor package lead frame LF is individually accommodated is formed in a layered manner by a plurality of slots formed opposite to the inner surfaces of both vertical surfaces, and the semiconductor package lead frame LF is disposed on the front and back surfaces thereof.
  • An open space is formed so that this insertion / ejection can be made in a known configuration in which a plurality of semiconductor package lead frames are stacked in layers.
  • the first linear conveying means 2 consists of a vertical conveying means 20 and a horizontal conveying means 25.
  • the vertical conveying means 20 consists of a lower lift 200 and an upper lift 220.
  • the lower lift 200 has a lead screw 203 installed vertically at the center between vertical guide rails 202 and 202a fixed to both front surfaces of the vertical frame 201 in the vertical direction, and a stepping motor for lifting the rear surface thereof.
  • the 204 is fixed and connected to the lead screw 203 and the belt pulley 205.
  • the lead screw 203 is fastened to the center of the body 207 while the body 207 of the magazine support 206 is fixed to the front of the vertical guide rails 202 and 202a so as to be slidably movable.
  • the magazine pedestal 206 can be moved up and down along the guide rails 202 and 202a by the lead screw 203 which rotates in the correct position by the power of the "
  • a pair of fingers 208 and 208a are installed side by side on the front surface of the body 207 to which the magazine pedestal 206 is fixed, so that the supplied magazine M can be clamped.
  • the body 207 is provided with guide rails 209 and 209a and lead screws 210 in the horizontal direction on the front of the body 207 so that the width between the fingers 208 and 208a can be adjusted according to the magazine M size.
  • One finger 208 is fixed to the body 207, the other finger 208a is fastened to the lead screw 210 while being installed to be slidably movable on the guide rails 209 and 209a.
  • One end of the lead screw 210 is supported by a bearing on the body 207, and the other end is fastened to the finger 208a to be installed on one side of the body 207 to adjust the power of the step motor 213. To drive.
  • the pneumatic cylinder 211 is fixed to the outside of the finger 208a in the horizontal direction, and the pusher 212 is installed at the tip of the piston rod of the pneumatic cylinder 211 penetrating inward of the finger 208a, the magazine (M) It can be intercepted.
  • the upper lift 220 has a lead screw 223 vertically installed at the center between guide rails 222 and 222a fixed to both front surfaces of the vertical frame 221 in the vertical direction, and a stepping motor 224 for the rear surface of the upper lift 220. ) Is fixed and connected to the lead screw 223 and the belt pulley 224.
  • the lead screw 223 is fastened to the center of the vertical guide rails 222 and 222a so that the vertical portion 227 of the vertical movable table 226 is slidably movable in front of the vertical guide rails 222 and 222a.
  • the vertical moving table 226 can be moved up and down along the guide rails 222 and 222a by the lead screw 223 rotating at the correct position by the power of the lift step motor 224.
  • the lead screw 223 is supported by the bearing on the vertical frame 221, the lower end is fastened to the vertical portion 227 of the vertical movable table 226, the stepping motor for the lift is installed on the back of the vertical frame 221 Drive by the power of (224).
  • One pneumatic cylinder 228 is fixed to the upper portion of the vertical movable table 226 in the traveling direction of the conveyor, and a pair of guide rails 229 and 229a parallel to the traveling direction of the conveyor are fixed to the bottom surface.
  • opposing upper horizontal slides 230 and 230a and fingers 232 and 232a may be installed to clamp the supplied magazine M, and the upper horizontal slides 230 and 230a may be clamped.
  • the front end is connected and fixed to the piston rod of the pneumatic cylinder 228 so that when the pneumatic cylinder 228 is driven to reciprocate along the guide rails 229 and 229a to transfer the clamped magazine M.
  • the pneumatic cylinder 234 is fixed to the outside of the finger 232a in the horizontal direction, the pusher 235 is installed at the tip of the piston rod of the pneumatic cylinder 234 penetrating inward of the finger 232a, the magazine (M) It can be intercepted.
  • the fingers 232 and 232a may adjust widths that are opposed to each other according to the size of the magazine M by the width adjusting means.
  • the width adjusting means includes a pair of guide rails 231 and 231a installed at a lower portion of the upper horizontal slides 230 and 230a in a direction crossing the guide rails 229 and 229a, and one end of the lower horizontal slides 233.
  • the lead screw 236 is supported by a bearing and the other end is fastened to the finger, and the width adjustment step motor 237 fixed to the lower horizontal moving table 233a to drive the lead screw 236 is a finger
  • the lower horizontal movable table 233a having the fixed portion 232a sliding along the guide rails 231 and 231a may adjust the width.
  • the horizontal conveying means 25 is composed of an ejector 250 and a conveying roller mechanism 255.
  • the ejector 250 is fastened to the fixing piece 253 of the extraction pneumatic cylinder 252 on the upper surface of the support 251.
  • the extraction pneumatic cylinder 252 is installed toward the open space of the magazine M, which is gradually stepped up by the lower lift 200 or the upper lift 220, and the semiconductor package lead frame LF loaded in the magazine M. ) Is extracted from the magazine (M) and transported horizontally to a position where the feed roller can be pinched.
  • the fixing piece 253 to which the fixing tool 253 is coupled may be formed in a long hole to change the fixed position according to the specification of the magazine M, thereby accurately extracting the semiconductor package lead frame LF from the magazine M. Can be.
  • the transfer roller mechanism 255 compresses the guide 256 for guiding the semiconductor package lead frame LF extracted by the ejector 250 and the semiconductor package lead frame LF introduced through the guide 256.
  • a pair of conveying rollers 257 and 257a for conveying, and the conveying rollers 257 and 257a are capable of lifting and lowering so as to be close to and spaced apart from each other,
  • It consists of a drive motor 258 for driving the transfer roller 257.
  • the conveying rollers 257 and 257a on one side are guided to the guide rails 260 by a lead screw 260 rotating by the adjusting tool 259 to adjust the width according to the size of the semiconductor package lead frame LF.
  • the first magazine recovery conveyor 3 is provided with a width adjusting means such as the magazine supply conveyor to adjust the width of the conveyor together with the magazine supply conveyor, which is installed at the upper part of the magazine supply conveyor 1.
  • the magazine M accommodated by the upper lift 220 which transfers the magazine M from which the semiconductor package lead frame LF is extracted by the ejector 250 is discharged.
  • the first alignment means 4 is composed of a receiving table 40, a pusher 41 and a position adjusting means to align the semiconductor package lead frame LF conveyed by the conveying rollers 257, 257a and then the first rotational conveyance. By means of means 5 it can be transferred to the plating line.
  • the storage table 40 accommodates the semiconductor package lead frame LF transported by the transfer rollers 257 and 257a to stay in the stopped state.
  • the pusher 41 is installed on the piston rod of the pneumatic cylinder 42 fixed horizontally, and is installed horizontally toward the storage table 40.
  • the position adjusting means is provided with a movable base 44 in which a pneumatic cylinder 42 is fixed to guide rails 44 and 44a fixed to the upper base 43 so as to be movable, and one end thereof as a bearing on the base 44. While being supported, the other end of the lead screw rotatably supported by the support end portion 46 having the opening groove 45 formed on the fixing member 44 on which the pneumatic cylinder 42 is fixed is rotated by the adjustment knob 47 ( 48, and a fastener 49 fastened to the support end 46 to fasten the lead screw 46 to tighten the opening groove 45.
  • the first rotary feed means 5 is composed of a pneumatic cylinder 50, carrier fingers 51 and 51a, and position adjusting means of the carrier fingers 51 and 51a.
  • the pneumatic cylinder 50 is rotatably installed on the receiving table 40 of the first alignment means 4 and rotatably installed by the servomotor 52.
  • Carrier fingers 51 and 51a are mounted on the piston rod of the pneumatic cylinder 50 to drive another pneumatic cylinder 51 which linearly reciprocates to align the semiconductor package lead frame LF aligned by the alignment means. It is clamped and attached to the plating chain belt (CV).
  • CV plating chain belt
  • Positioning means of the carrier fingers (51, 51a) is a movable table (55) which is slidably installed on the guide rails (54, 54a) fixed to the upper portion of the fixing table (53) fixed to the piston rod of the pneumatic cylinder (50)
  • Carrier fingers 51 and 52a are installed on the guide rails, and the movable table 55 is slidably installed on the guide rails 55 and 55a fixed to the upper part of the fixing table 53, and one end thereof is attached to the fixing table 53. Supported by a bearing, the other end is composed of a lead screw 56 fastened to the movable table 55.
  • the automatic recovery device B includes a second rotary feed means 5, a second alignment means 7, a second linear feed means 8, a second magazine supply conveyor 9, and a second magazine recovery conveyor ( 10).
  • the second rotational conveying means 6 has the same configuration as the first rotational conveying means 2, so that the semiconductor package lead frame, which has completed the plating process, can be recovered from the chain belt for plating.
  • the second alignment means 7 has the same configuration as the first alignment means 4, and the pusher 70 for supplying the semiconductor package lead frame LF of the holder 40 to the transfer rollers 257, 257A. ) Is further provided to align the semiconductor package lead frame after the plating process so as to be accurately transferred to the recovery magazine.
  • the pusher 70 is a pneumatic cylinder 71 is installed horizontally on the holder 70, a pneumatic cylinder 73 is fixed perpendicular to the bracket 72 is fixed to the pneumatic cylinder 71, and the pneumatic It is composed of a push rod 74 that is fixed to the piston rod tip of the cylinder 73 and pushes the semiconductor package lead frame LF, and is installed at a position close to the storage table 40.
  • the second linear transfer means 8 has the same configuration as the first linear transfer means 2, thereby loading the semiconductor package lead frame into a magazine supplied without the semiconductor package lead frame loaded.
  • the second magazine supply conveyor 9 has the same configuration as the first magazine supply conveyor 1 to transfer the magazine in a state where the semiconductor package lead frame is not loaded to a position for accommodating the semiconductor package lead frame.
  • the second magazine recovery conveyor 10 has the same configuration as the first magazine recovery conveyor 3 to discharge the magazine loaded with the semiconductor package lead frame.
  • a plating chain belt CV is installed on a pair of belt pulleys 300 and 300a, and the semiconductor package lead frame LF is separated from the plating chain belt CV. It consists of a clipper 400 of known construction that possibly secures.
  • a plurality of magazines M and a semiconductor package lead frame LF are sequentially and simultaneously supplied and recovered.
  • one magazine M and a semiconductor package lead frame LF are provided. This conveying state will be described, and the position and sign of the sensor operated in each section are omitted.
  • the optimum position is selected for the automatic supply device A and the automatic recovery device B using the width adjusting means and the position adjusting means according to the size of the magazine M and the semiconductor package lead frame LF.
  • the automatic supply device A attaches a semiconductor package lead frame LF supplied from a magazine M in which a plurality of semiconductor package lead frames LF are stacked in a layer to a chain belt CV for an infinitely orbital plating. Transfer to the line.
  • the optimum position selection of the first magazine supply conveyor 1 is performed by driving the step motor 18 in the forward and reverse directions so that the lead belts 16 and 16a interlock with each other, and the belt 13a on which the belt 13a is disposed to face each other. The distance between) is adjusted. Thereafter, a plurality of magazines M on which the semiconductor package lead frame LF is loaded is introduced into the first magazine supply conveyor 1, and the driving motor 17 is driven so that the magazines M of the belts 13 and 13a are loaded. When the rear end is reached, the sensor is sensed and the driving motor 17 is stopped.
  • the lead screw 203 is driven by the power transmitted to the belt pulley 205 by the lift step motor 204 installed on the lower lift 200 of the vertical transfer means 20.
  • the magazine pedestal 206 is rotated, the magazine pedestal 206 is stepped up by the interval in which the semiconductor package lead frame LF is loaded.
  • the extraction pneumatic cylinder 252 constituting the ejector 250 moves forward and backward, and the push rod 255 transfers one semiconductor package lead frame LF to the transfer roller ( 257, 257a), the magazine pedestal 206 is subjected to a two-step lift operation.
  • the transfer rollers 257 and 257a compress the semiconductor package lead frame LF and the power of the driving motor 258 reaches the transfer roller 257a. As a result, the semiconductor package lead frame LF moves horizontally toward the alignment means 4 and the rotation transfer means 5.
  • the tip portion of the semiconductor package lead frame LF exiting the transfer rollers 257, 257a does not reach the storage table 40 of the alignment means 4 sufficiently.
  • the pneumatic cylinder lowers, moves linearly, and rises linearly. The pusher moving and returning completely pushes the semiconductor package lead frame LF to the storage table 40.
  • the optimum positioning of the feed rollers 257, 257a is because the feed rollers 257, 257a of one side, which are fastened to the lead screw 260, which are interlocked by rotating the adjusting tool 259 in the forward and reverse directions, are guided and moved on the guide rails. Is determined accordingly.
  • the first magazine recovery conveyor ( 3) is transported and discharged. That is, when the lift step motor 224 is driven, the power transmitted to the belt pulley 225 rotates the lead screw 223 so that the vertical portion 227 is guided to the guide rails 222 and 222a to open the magazine M. Fingers 232 and 232a are lowered to a clamping position, and both fingers 232 and 232a pinch the magazine M by the pusher 235 which the pneumatic cylinder 234 drives and moves forward.
  • the lift step motor 224 is driven in the reverse direction so that the lower end of the magazine M reaches a position higher than the belt of the first magazine collecting conveyor 3.
  • the fingers 232 and 232a are raised until the upper side, and the pneumatic cylinder 228 is driven so that the upper horizontal movable plates 230 and 230a having the fingers 232 and 232a installed are guided to the guide rails 229 and 2292a to move horizontally. Reach on the magazine recovery conveyor 3.
  • the lift step motor 224 is driven in the reverse direction again, and the fingers 232 and 23a are lowered to lower the magazine M on the first magazine recovery conveyor 3 and then return to the original position.
  • the optimal positioning of the upper lift 220 is determined by the step motor 237 for width adjustment and the lower horizontal moving table 233a having the one finger 232a fixed along the guide rails 231 and 31a. do.
  • the semiconductor package lead frame LF which has reached the storage table 40 of the first alignment means 4 through the rollers ⁇ above, is pushed forward by the pusher 41 in the horizontal direction by the pneumatic cylinder 42. The direction of the straight line is aligned.
  • the optimal positioning of the pusher 41 is to release the tightening force of the fastener 49, and the pneumatic cylinder 42 including the pusher 41 by the lead screw 48 that rotates when the adjustment knob 27 is rotated in the forward and reverse directions. This is done by adjusting the position of.
  • the pneumatic cylinder 50 descends, and when the carrier fingers 51 and 51a reach the side ends of the semiconductor package lead frame LF, the pneumatic cylinders 51 and 51a are operated. Fingers 51 and 51a crimp the side ends of the semiconductor package lead frame LF.
  • the servomotor 520 When it is detected that the carrier fingers 51 and 51a clamp the semiconductor package lead frame LF, the servomotor 520 is driven so that the pneumatic cylinder 50 together with the carrier fingers 51 and 51a is plated with a chain belt CV. Rotate at an angle of about 90 ° to the plate, to the plating chain belt CV of the semiconductor package lead frame LF, and then release the clamping and return to the original position.
  • the optimal positioning of the carrier fingers 51 and 51a is performed by rotating the lead screw 56 so that the carrier 55 is guided and moved to the guide rails 55 and 55a, thereby moving the carrier fingers 51 and 51a into the semiconductor package. This is performed by adjusting the distance between the lead frame 0 and the side cross section.
  • the plating chain belt CV receives the semiconductor package lead frame LF in a state in which it is temporarily stopped by the clipper 400 as in a known method so that plating can be performed in a predetermined order.
  • the lift operation for extracting the semiconductor package lead frame LF is performed by the step-up operation of the lower lift 200 and the upper lift 220 which discharges the magazine M, but the lower lift ( It is also possible to have the upper lift 220 perform the step-up and discharge operations of the magazine M simultaneously without the 200.
  • the automatic recovery device B includes a second rotary feed means 5, a second alignment means 7, a second linear feed means 8, a second magazine supply conveyor 9, and a second magazine recovery conveyor ( 10) is a magazine in which the semiconductor package lead frame LF is not loaded by detaching the semiconductor package lead frame LF that has passed through the plating line by hanging on the chain belt CV for plating. Collect it in M) and collect it.
  • This automatic recovery device (B) is for the second rotary transfer means 5, the second alignment means (7), the second linear transfer means (8), the second magazine supply conveyor (9), the second magazine recovery Conveyor 10 is the same as the configuration of the automatic supply device (A) described above, but is further provided with a pusher 70 for supplying the semiconductor package lead frame (LF) from the storage table 40 to the transfer roller (), The pusher for transferring the semiconductor package lead frame LF from the transfer roller to the storage table 40 is omitted.

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Abstract

Disclosed is an automatic loading and unloading apparatus for a semiconductor package lead frame magazine. The present invention comprises: a first magazine supply conveyor, which transports a magazine; a first linear transporting means, which consecutively extracts semiconductor package lead frames from the transported magazine; a first magazine unloading conveyor, which unloads the magazine, from which the semiconductor package lead frames have been extracted by the first linear transporting means; a first aligning means, which aligns the semiconductor package lead frames that have been transported by the first linear transporting means; a first rotational transporting means, which attaches the semiconductor package lead frames that have been aligned by the first aligning means to a plating chain belt; a second rotational transporting means, which extracts from the plating chain belt the semiconductor package lead frames that have been attached to the plating chain belt by the first rotational transporting means and have completed the plating process; a second aligning means, which aligns the semiconductor package lead frames that have been extracted by the second rotational transporting means; a second linear transporting means, which loads the semiconductor package lead frames that have been aligned by the aligning means to the magazine; a second magazine supply conveyor, which inputs the magazine to the storage location, in order to unload the semiconductor package lead frames that are provided by the second linear transporting means; and a second magazine unloading conveyor, which unloads the magazine that has been inputted by the second magazine supply conveyor, and which receives the semiconductor package lead frames by the second linear transporting means, wherein the plating chain belt continuously drives at a high speed while minimizing the activation distance between the transporting apparatus, resulting in a smaller installation space and prevention of noise, and enables optimal automated equipment without changing the existing plating line.

Description

[규칙 제26조에 의한 보정 25.05.2010]　반도체 패키지 리드 프레임 매거진의 자동 공급 및 회수 장치[Correction 25.05.2010] by Rule 26. Automatic supply and retrieval of semiconductor package lead frame magazine
본 발명은 반도체 패키지 리드 프레임 도금 공정 라인에서 매거진에 적재된 반도체 패키지 리드 프레임을 도금하기 위하여 매거진으로부터 반도체 패키지 리드 프레임을 추출하여 자동적으로 공급하고 회수할 수 있는 반도체 패키지 리드 프레임 매거진의 자동 공급 및 회수 장치에 관한 것이다.The present invention provides an automatic supply and retrieval of a semiconductor package lead frame magazine capable of automatically extracting and automatically supplying and retrieving a semiconductor package lead frame from a magazine for plating a semiconductor package lead frame loaded in a magazine in a semiconductor package lead frame plating process line. Relates to a device.
반도체 패키지(package)는 반도체 칩(chip)과 반도체 패키지 리드 프레임으로 이루어지는데, 상기 반도체 패키지 리드 프레임은 반도체 패키지의 내부와 외부를 연결해주는 역할을 하는 도선(lead)과 반도체 칩을 지지해주는 지지체(frame)의 역할을 하는 것이다. 이러한 리드 프레임은 통상적으로 소재인 박판부재에 대하여 신뢰성을 향상시키기 위해서 후속적으로 알칼리전해탈지, 마이크로 에칭 등의 표면처리를 실시한 다음 스탬핑 공정 또는 에칭공정에 의해서 박판부재를 소정 형상으로 성형하게 된다.The semiconductor package is composed of a semiconductor chip and a semiconductor package lead frame. The semiconductor package lead frame includes a lead that serves to connect the inside and the outside of the semiconductor package and a support that supports the semiconductor chip. frame). In order to improve the reliability of the thin plate member, which is usually a raw material, the lead frame is subsequently subjected to surface treatment such as alkali electrolytic degreasing, micro etching, and the like, and then the thin plate member is formed into a predetermined shape by a stamping process or an etching process.
그리고, 리드 프레임은 도금층을 형성하는 공정과, 반도체칩이 배치되는 부위를 마련하는 다운셋(downset)공정, 테이핑(taping)공정 및 포밍(forming)공정을 통하여 완성된 후, 반도체칩이 배치되며 성형수지에 의해 몰딩되어 반도체 패키지로 제작된다After the lead frame is completed through a process of forming a plating layer, a downset process of providing a portion where the semiconductor chip is disposed, a taping process, and a forming process, the semiconductor chip is disposed. Molded by molding resin and manufactured into semiconductor package
리드 프레임을 사용하여 반도체 패키지를 제조함에 있어서, 몰딩 공정을 마친 후에는 성형 완료된 반도체 패키지의 외부로 노출되는 아웃리드가 화학적 변화(산화에 의한 부식)를 일으키는 것을 방지하기 위하여 외부로 노출된 아웃리드의 표면을 도금 처리하게 된다.In manufacturing a semiconductor package using a lead frame, after completion of the molding process, the outread exposed to the outside of the molded semiconductor package is exposed to the outside to prevent chemical change (corrosion by oxidation). The surface of is plated.
일반적으로 반도체 패키지 리드 프레임의 도금라인은 세척, 전처리, 도금, 후처리, 건조과정으로 진행되고 있다. 이러한 도금라인은 생산성을 향상시키기 위한 필요성과 수작업에 의존할 수 없어서 자동화 설비를 필요로 하지만 유해성 화공약품의 습도가 높은 환경적인 요인으로 인하여 완전한 자동화가 어려울 뿐만 아니라, 현재 해당공정에서 근무하는 작업자 들은 귀마개, 마스크를 반드시 착용하여야 하는 열악한 환경조건에 노출되어 있다.In general, the plating line of the semiconductor package lead frame proceeds with a cleaning, pretreatment, plating, post treatment, and drying process. These plating lines require automation facilities because they cannot rely on the need to improve productivity and manual work, but due to the high environmental factors of hazardous chemicals, it is not only difficult to fully automate. They are exposed to harsh environmental conditions where earplugs and masks must be worn.
지금까지 반도체 패키지 리드 프레임을 도금하기 위한 반도체 패키지 리드 프레임 자동 공급 및 회수 장치는 도금용 체인 벨트가 고속으로 연속 구동하여야 하고, 리드 프레임을 도금용 체인 벨트에 공급하여 고정시키는 위치 사이에 높이 편차가 크기 때문에 장치가 구동을 하기 위하여 많은 작업공간을 필요로 하고, 소음이 발생하게 되며, 무엇보다도 도금 라인이 다양한 규격과 유형으로 설치되어 있기 때문에 기존에 시설된 도금 라인에 최적화될 수 있는 자동화 시스템을 구현하기 어려운 문제점이 있다.Until now, the automatic supply and retrieval of semiconductor package lead frame for plating semiconductor package lead frame has to be continuously driven by the chain belt for plating at high speed, and the height deviation between the positions for supplying and fixing the lead frame to the chain belt for plating is fixed. Due to its size, the device requires a lot of work space for driving, noise is generated, and most of all, the plating system is installed in various standards and types, so it is possible to optimize the automation system that can be optimized for existing plating lines. There is a problem that is difficult to implement.
본 발명은 반도체 패키지 리드 프레임의 도금 공정에서 반도체 패키지 리드 프레임을 고속으로 자동 공급 및 회수할 수 있는 고속 직선 운동 및 회전 운동 수단을 개발하여 도금용 체인 벨트가 고속으로 연속 구동하면서도 이송 기구 사이에 작동거리를 최소화시켜서 설치 공간이 작고 소음을 방지하며, 기존에 시설된 도금 라인을 변경하지 않고 최적화된 자동화 설비를 구현할 수 있는 반도체 패키지 리드 프레임 자동 공급 및 회수 장치를 제공하고자 하는 것이다.The present invention has developed a high-speed linear motion and rotational movement means that can automatically supply and retrieve the semiconductor package lead frame at high speed in the plating process of the semiconductor package lead frame, so that the chain belt for plating is continuously operated at high speed while operating between the transfer mechanisms. It aims to provide a semiconductor package lead frame automatic supply and retrieval device that can minimize the distance, reduce installation space, prevent noise, and realize an optimized automation facility without changing existing plating lines.
본 발명이 의도하는 목적을 달성하기 위한 기술적인 특징은 다수개의 반도체 패키지 리드 프레임이 층상으로 적재되는 매거진으로부터 공급되는 반도체 리드프레임을 무한궤도상의 도금용 체인 벨트에 부착시켜서 도금 라인으로 이동시키는 반도체 패키지 리드 프레임 도금 장치에 있어서, 매거진에 적재된 반도체 패키지 리드 프레임을 인출시킬 수 있도록 인출 위치로 이송시키는 제1 매거진 공급용 컨베이어; 상기 매거진 공급용 컨베이어에 의하여 이송된 매거진으로부터 반도체 패키지 리드 프레임을 순차적으로 인출시켜서 공급하는 제1 직선 이송 수단; 상기 제1 직선 이송 수단에 의하여 반도체 패키지 리드 프레임이 인출된 매거진을 회수하는 제1 매거진 회수용 컨베이어; 상기 제1 직선 이송 수단에 의하여 이송된 반도체 패키지 리드 프레임을 정렬하는 제1 정렬 수단; 상기 제1 정렬 수단에 의하여 정렬된 반도체 패키지 리드 프레임을 도금용 체인 벨트에 부착시키는 제1 회전 이송 수단;상기 제1 회전 이송 수단에 의하여 도금용 체인 벨트에 부착되어 도금 공정을 마친 반도체 패키지 리드 프레임을 회수하기 위하여 도금용 체인 벨트로부터 반도체 패키지 리드 프레임을 인출시키는 제2 회전 이송 수단; 상기 제2 회전 이송 수단에 의하여 벨트로부터 인출된 반도체 패키지 리드 프레임을 정렬하는 제2 정렬 수단; 상기 정렬 수단에 의하여 정렬된 반도체 패키지 리드 프레임을 매거진에 적재시키기 위한 제2 직선 이송 수단; 상기 제2 직선 이송 수단에 의하여 공급되는 반도체 패키지 리드 프레임을 회수하기 위하여 반도체 패키지 리드 프레임이 적재되지 아니한 매거진을 수납 위치로 투입시키는 제2 매거진 공급용 컨베이어; 상기 제2 매거진 공급용 컨베이어에 의하여 투입되어 상기 제2 직선 이송 수단에 의하여 반도체 패키지 리드 프레임이 수납된 매거진을 회수하는 제2 매거진 회수용 컨베이어 를 포함하는 것을 특징으로 한다.Technical features for achieving the object of the present invention is a semiconductor package for attaching a semiconductor lead frame supplied from a magazine in which a plurality of semiconductor package lead frames are stacked in a layer attached to a chain belt for plating on an orbit to move to a plating line A lead frame plating apparatus, comprising: a first magazine supply conveyor for transferring a semiconductor package lead frame loaded in a magazine to a withdrawal position so as to be withdrawn; First linear transport means for sequentially drawing and supplying a semiconductor package lead frame from a magazine transported by the magazine supply conveyor; A first magazine recovery conveyor for recovering a magazine from which the semiconductor package lead frame is drawn out by the first linear transport means; First alignment means for aligning the semiconductor package lead frame transferred by the first linear transfer means; A first rotation transfer means for attaching the semiconductor package lead frame aligned by the first alignment means to the chain belt for plating; a semiconductor package lead frame attached to the chain belt for plating by the first rotation transfer means and completed a plating process Second rotational conveying means for drawing out the semiconductor package lead frame from the chain belt for plating to recover the metal; Second alignment means for aligning the semiconductor package lead frame drawn out from the belt by the second rotational transfer means; Second linear transfer means for loading the semiconductor package lead frame aligned by the alignment means into a magazine; A second magazine supply conveyor which feeds a magazine in which the semiconductor package lead frame is not loaded into a storage position to recover the semiconductor package lead frame supplied by the second linear transfer means; And a second magazine recovery conveyor which is fed by the second magazine supply conveyor and recovers a magazine in which the semiconductor package lead frame is accommodated by the second linear transfer means.
매거진은 양쪽 수직면의 내측면에 대향하여 형성되는 다수개의 슬롯에 의하여 반도체 패키지 리드 프레임이 개별적으로 수용되는 공간이 층상으로 형성되고, 전면과 배면에는 반도체 패키지 리드 프레임이 삽입/배출될 수 있도록 개방된 공간이 형성되어 다수개의 반도체 패키지 리드 프레임이 층상으로 적재된다.The magazine is formed in a layered space in which the semiconductor package lead frame is individually accommodated by a plurality of slots formed opposite to the inner surfaces of both vertical surfaces, and is open to insert / extract the semiconductor package lead frame on the front and back surfaces. A space is formed so that a plurality of semiconductor package lead frames are stacked in layers.
제1 매거진 공급용 컨베이어는 폭 조절 수단을 구비하여 상기 매거진에 적재된 반도체 패키지 리드 프레임을 인출시키기 위한 위치로 이송시킨다.The first magazine supply conveyor is provided with a width adjusting means to transfer the semiconductor package lead frame loaded in the magazine to a position for drawing out.
폭 조절 수단은 어느 한편의 벨트 프레임이 컨베이어의 진행방향에 대하여 직각 방향으로 설치되는 가이드 레일에 안내되어 이동 가능하게 설치되면서, 상기 가이드 레일과 나란한 방향, 즉 컨베이어의 진행방향에 대하여 직각 방향으로 설치되고 스텝모터에 의하여 회전하는 리드 스크루가 나사 결합되어 리드 스크루가 회전함에 따라 가이드 레일에 안내되어 이동할 수 있게 됨으로써 다양한 규격의 매거진을 공급할 수 있게 된다. The width adjusting means is installed so that either belt frame is guided and movable in a guide rail installed in a direction perpendicular to the traveling direction of the conveyor, and is installed in a direction parallel to the guide rail, that is, perpendicular to the traveling direction of the conveyor. And the lead screw rotated by the step motor is screwed to be guided to the guide rail as the lead screw rotates to be able to supply a magazine of various specifications.
제1 직선 이송 수단은 상기 제1 매거진 공급용 컨베이어의 한편에서 스텝 모터로 구동하는 리드 스크루에 나사 결합되어, 반도체 패키지 리드 프레임이 장전되어 공급되는 매거진을 받아서 층상으로 설치된 반도체 프레임의 간격만큼 수직 방향으로 올려주는 리프트와; 수평으로 설치되어 매거진에 장전된 반도체 패키지 리드 프레임을 인출시키는 푸셔와; 상부의 로울러가 하부의 로울러에 근접하고 이격될 수 있도록 승강이동 가능하게 되어 푸셔에 의하여 인출되는 반도체 패키지 리드 프레임을 압착하여 수평 진행 방향으로 이송시키는 한 쌍의 이송 로울러와; 상기 이송 로울러에 의하여 이송된 반도체 패키지 리드 프레임의 후단부를 제1 회전 이송 수단까지 이송시킬 수 있도록 공압실린더에 의하여 상하 및 수평 이동하는 푸셔로 구성되어 상기 매거진 공급용 컨베이어에 의하여 이송된 매거진으로부터 반도체 패키지 리드 프레임을 순차적으로 인출시킨다.The first linear transfer means is screwed to a lead screw driven by a step motor on one side of the first magazine supply conveyor, and receives a magazine loaded with a semiconductor package lead frame, and is vertically spaced by the interval of the semiconductor frames arranged in layers. With a lift to lift; A pusher installed horizontally to pull out the semiconductor package lead frame loaded in the magazine; A pair of transfer rollers capable of lifting and lowering so that the upper roller is close to and spaced apart from the lower roller, and compresses the semiconductor package lead frame drawn by the pusher to move in the horizontal direction; The semiconductor package from the magazine transported by the magazine supply conveyor, which consists of a pusher which is moved up and down and horizontally by a pneumatic cylinder so as to transport the rear end portion of the semiconductor package lead frame transferred by the transport roller to the first rotary transport means. The lead frame is drawn out sequentially.
상기 리프트는 폭 조절 수단을 구비하며, 제1 매거진 공급용 컨베이어의 안쪽에 설치되어 이송된 매거진을 수납하여 반도체 패키지 리드 프레임이 순차적으로 이젝트될 수 있도록 반도체 패키지 리드 프레임이 적층된 간격만큼 주기적으로 상승하게 되는데, 제1 매거진 공급용 컨베이어와 제1 매거진 배출용 컨베이어 사이에서 수직으로 왕복이동하며 이젝트 단계별로 매거진을 주기적으로 상승시키고, 이젝트가 완료된 매거진을 제1 매거진 배출용 컨베이어에 운반하는 하나의 리프트로 구성될 수 있고, 제1 매거진 공급용 컨베이어의 안쪽에서 매거진을 수납하여 이젝트 단계별로 상승하는 하부 리프트와, 반도체 패키지 리드 프레임이 완전히 이젝트된 매거진을 클램핑하여 제1 매거진 회수용 컨베이어에 이송시키는 상부 리프트로 구성될 수 있다. The lift is provided with a width adjusting means, and is periodically raised by the stacked intervals of the semiconductor package lead frame so that the semiconductor package lead frame can be sequentially ejected by accommodating the transferred magazines installed inside the first magazine supply conveyor. One lift for reciprocating vertically between the first magazine feed conveyor and the first magazine discharge conveyor and periodically raising the magazine in the ejecting stage, and carrying the ejected magazine to the first magazine discharge conveyor. It may be composed of, and the upper lift to receive the magazine from the inside of the first magazine supply conveyor to rise in step by step, and the upper surface of the semiconductor package lead frame clamping the magazine completely ejected to the first magazine recovery conveyor It can be configured as a lift.
제1 매거진 회수용 컨베이어는 상기 매거진 공급용 컨베이어와 같은 폭 조절 수단이 구비되어 매거진 공급용 컨베이어와 함께 컨베이어의 폭을 조절할 수 있게 되면서, 매거진 공급용 컨베이어의 상부에 설치되는 이젝터에 의하여 반도체 패키지 리드 프레임이 추출된 매거진을 배출시킨다.The first magazine recovery conveyor is provided with a width adjusting means such as the magazine supply conveyor to adjust the width of the conveyor together with the magazine supply conveyor, and leads the semiconductor package by an ejector installed on the magazine supply conveyor. The frame ejects the extracted magazine.
상기 이젝터는 위치 조절 수단을 구비하고, 액추에이터에 의하여 반도체 패키지 리드 프레임이 배출된 매거진을 클램핑하여 승강 및 수평 이동시켜서 제1 매거진 회수용 컨베이어에 안착시키는 한 쌍의 핑거로 구성된다. The ejector is provided with a position adjusting means, and consists of a pair of fingers for clamping and lifting and horizontally moving the magazine discharged from the semiconductor package lead frame by the actuator seated on the first magazine recovery conveyor.
제1 정렬 수단은 상기 제1직선이송 수단에 의하여 인출된 반도체 패키지 리드 프레임을 수납하는 수납대와, 가이드 레일에 슬라이딩 가능하게 놓여져서 스크류 샤프트에 의하여 이동하는 이동대에 설치되는 공압실린더에 의하여 진퇴 작동하는 푸셔로 구성되어 반도체 패키지 리드 프레임이 제1 회전 이송 수단에 의하여 벨트에 정확하게 부착될 수 있도록 정렬시킨다.The first alignment means is advanced and retracted by a pneumatic cylinder installed on a storage table for accommodating the semiconductor package lead frame drawn by the first linear transfer means, and on a moving table which is slidably placed on the guide rail and moved by a screw shaft. It consists of a operative pusher to align the semiconductor package lead frame so that it can be accurately attached to the belt by the first rotational conveying means.
제1 회전 이송 수단은 상기 정렬 수단의 수납대 상부에 회전 가능하게 설치되고 서보모터로 회전 가능하게 설치되는 공압실린더와, 상기 공압실린더의 피스톤 로드에 설치되어 직선 왕복 이동하는 또 하나의 공압실린더에 의하여 상기 정렬 수단에 의하여 정렬된 반도체 패키지 리드 프레임을 클램핑하여 상기 추출수단에 의하여 이송된 반도체 패키지 리드 프레임을 도금용 체인 벨트에 부착시키는 캐리어 핑거로 구성된다.The first rotational conveying means is a pneumatic cylinder rotatably installed in the upper portion of the receiving unit of the alignment means and rotatably installed by a servo motor, and another pneumatic cylinder installed in the piston rod of the pneumatic cylinder to linearly reciprocate And a carrier finger for clamping the semiconductor package lead frame aligned by the alignment means to attach the semiconductor package lead frame transferred by the extraction means to the chain belt for plating.
제2 회전 이송 수단은 서보모터로 회전가능하게 설치되는 공압실린더와, 상기 공압실린더의 피스톤로드에 설치되어 직선 왕복 이동하는 또 하나의 공압실린더에 의하여 도금 공정을 마친 반도체 패키지 리드 프레임을 클램핑하여 이탈시키는 캐리어 핑거로 구성되어 도금공정을 마친 반도체 패키지 리드 프레임을 도금용 체인 벨트로부터 이탈시켜서 회수할 수 있게 한다.The second rotational conveying means clamps and releases the semiconductor package lead frame after the plating process is completed by a pneumatic cylinder rotatably installed by a servomotor and another pneumatic cylinder installed on the piston rod of the pneumatic cylinder to linearly reciprocate. It is composed of a carrier finger to make the semiconductor package lead frame after the plating process is separated from the chain belt for plating to be recovered.
제2 정렬 수단은 상기 제2 회전 이송 수단에 의하여 분리된 반도체 패키지 리드 프레임을 수납하는 수납대와, 가이드 레일에 슬라이딩 가능하게 놓여져서 스크류 샤프트에 의하여 이동하는 이동대에 설치되는 공압실린더에 의하여 진퇴 작동하는 푸셔로 구성되어 반도체 패키지 리드 프레임을 회수용 매거진으로 정확하게 이송될 수 있도록 정렬시킨다.The second alignment means is moved forward and backward by a pneumatic cylinder installed on a movable table for receiving the semiconductor package lead frame separated by the second rotary conveying means and slidably placed on the guide rail and moved by a screw shaft. It consists of a working pusher to align the semiconductor package lead frame so that it can be accurately transported to the recovery magazine.
제2 직선 이송 수단은 상기 제2정렬 수단에 의하여 정렬된 반도체 패키지 리드 프레임을 매거진에 적재시키기 위하여 수납대에 놓여진 반도체 패키지 리드 프레임을 밀어낼 수 있도록 공압실린더의 피스톤 로드에 설치되는 푸셔와; 상기 푸셔에 의하여 이송된 반도체 패키지 리드 프레임을 매거진에 근접시키기 위하여 상부의 로울러가 하부의 로울러에 근접하고 이격될 수 있도록 승강이동 가능하게 되어 푸셔에 의하여 인출되는 반도체 패키지 리드 프레임을 압착하여 수평 진행 방향으로 이송시키는 한 쌍의 이송 로울러와, 상기 이송 로울러로 이송된 반도체 패키지 리드 프레임이 매거진에 도달할 수 있도록 수평방향과 수직방향으로 설치되는 공압실린더에 의하여 수평이동 및 승강작동하여 반도체 패키지 리드 프레임의 후단부를 밀어서 이송시키는 푸셔와; 상기 푸셔에 의하여 공급되는 반도체 패키지 리드 프레임을 수납하기 위하여 상기 제2 매거진 공급용 컨베이어의 한편에서 스텝 모터로 구동하는 리드 스크루에 나사 결합되어 반도체 패키지 리드 프레임이 장전되지 아니한 상태로 공급되는 매거진을 받아서 층상으로 설치된 반도체 프레임의 간격만큼 수직 방향으로 올려주는 리프트로 구성되어 반도체 패키지 리드 프레임을 매거진에 적재시키게 된다.The second linear conveying means includes: a pusher mounted on the piston rod of the pneumatic cylinder so as to push the semiconductor package lead frame placed in the holder to load the semiconductor package lead frame aligned by the second alignment means into a magazine; In order to move the semiconductor package lead frame transferred by the pusher close to the magazine, the upper roller may move up and down so as to be spaced apart from the lower roller, thereby compressing the semiconductor package lead frame drawn by the pusher and compressing the horizontal package direction. The horizontal and vertical movement of the semiconductor package lead frame is performed by a pair of transfer rollers and a pneumatic cylinder installed in the horizontal direction and the vertical direction so that the semiconductor package lead frame transferred to the transfer roller reaches the magazine. A pusher for pushing and transporting the rear end portion; In order to receive the semiconductor package lead frame supplied by the pusher, a screw is coupled to a lead screw driven by a step motor on one side of the second magazine supply conveyor to receive a magazine in which the semiconductor package lead frame is not loaded. It consists of lifts that are lifted in the vertical direction by the interval of the layered semiconductor frame to load the semiconductor package lead frame in the magazine.
제2 매거진 공급용 컨베이어는 폭 조절 수단을 구비하여 반도체 패키지 리드 프레임이 적재되지 아니한 상태의 매거진을 반도체 패키지 리드 프레임을 수납하기 위한 위치로 이송시킨다.The second magazine supply conveyor is provided with a width adjusting means to transfer the magazine in a state where the semiconductor package lead frame is not loaded to a position for accommodating the semiconductor package lead frame.
상기 폭 조절 수단은 제1 매거진 공급용 컨베이어와 같이 어느 한편의 벨트 프레임이 컨베이어의 진행방향에 대하여 직각 방향으로 설치되는 가이드 레일에 안내되어 이동 가능하게 설치되면서, 상기 가이드 레일과 나란한 방향, 즉 컨베이어의 진행방향에 대하여 직각 방향으로 설치되고 서보모터에 의하여 회전하는 리드 스크루가 나사 결합되어 리드 스크루가 회전함에 따라 가이드 레일에 안내되어 이동할 수 있게 됨으로써 다양한 규격의 매거진을 공급할 수 있게 된다.The width adjusting means is installed such that the belt frame is guided to the guide rail is installed in a direction perpendicular to the traveling direction of the conveyor, such as the first magazine supply conveyor, and is installed to be movable, parallel to the guide rail, that is, the conveyor The lead screw rotated by the servo motor is installed at right angles to the traveling direction of the screw and is guided to the guide rail as the lead screw rotates, thereby providing magazines of various specifications.
제2 매거진 회수용 컨베이어는 상기 제2 매거진 공급용 컨베이어와 같은 폭 조절 수단이 구비되어 제2 매거진 공급용 컨베이어와 함께 컨베이어의 폭을 조절할 수 있게 되면서, 제2 매거진 공급용 컨베이어의 상부에 설치되는 제2 배출 수단에 의하여 반도체 패키지 리드 프레임이 적재된 매거진을 배출시킨다.The second magazine recovery conveyor is provided with the same width adjusting means as the second magazine supply conveyor to adjust the width of the conveyor together with the second magazine supply conveyor, and is installed on the upper side of the second magazine supply conveyor. The magazine on which the semiconductor package lead frame is loaded is discharged by the second discharge means.
제2 배출 수단은 폭 조절 수단을 구비하고, 액추에이터에 의하여 반도체 패키지 리드 프레임이 배출된 매거진을 클램핑하여 승강 및 수평 이동시켜서 제2 매거진 회수용 컨베이어에 안착시키는 한 쌍의 핑거로 구성된다.The second discharge means has a width adjusting means, and is composed of a pair of fingers that clamp, lift and horizontally move the magazine discharged from the semiconductor package lead frame by the actuator to be seated on the second magazine recovery conveyor.
본 발명은 도금용 체인 벨트가 고속으로 연속 구동하면서 이송 기구 사이에 작동거리를 최소화시켜서 설치 공간이 작고 소음을 방지하며, 다양한 규격과 유형으로 기존에 시설된 도금 라인에 최적화된 자동화 설비를 추가로 설치하는 것이 가능하게 된다.The present invention is to minimize the operating distance between the transfer mechanism while the chain belt for plating continuously running at high speed to reduce the installation space and to prevent noise, and to add an automated equipment optimized for the existing installation line in various standards and types It becomes possible to install.
도 1은 본 발명 시스템의 평면도1 is a plan view of the system of the present invention
도 2는 본 발명 시스템의 정면도2 is a front view of the system of the present invention;
도 3은 본 발명의 자동 공급 및 자동 회수 장치의 정면도Figure 3 is a front view of the automatic supply and automatic recovery device of the present invention
도 4는 본 발명의 자동 공급 및 자동 회수 장치의 측면도Figure 4 is a side view of the automatic supply and automatic recovery device of the present invention
도 5는 본 발명의 제1 매거진 공급용 컨베이어의 평면도5 is a plan view of a conveyor for supplying a first magazine of the present invention;
도 6은 본 발명의 제1 매거진 공급용 컨베이어의 측면도Figure 6 is a side view of the first magazine feed conveyor of the present invention
도 7은 본 발명의 하부 리프터의 평면도7 is a plan view of the lower lifter of the present invention;
도 8은 본 발명의 하부 리프터의 정면도8 is a front view of the lower lifter of the present invention;
도 9는 본 발명의 하부 리프터의 측면도9 is a side view of the lower lifter of the present invention;
도 10은 본 발명의 상부 리프터의 평면도10 is a plan view of the upper lifter of the present invention;
도 11은 본 발명의 상부 리프터의 정면도11 is a front view of the upper lifter of the present invention;
도 12는 본 발명의 상부 리프터의 측면도12 is a side view of the upper lifter of the present invention;
도 13은 본 발명의 이젝터의 평면도Figure 13 is a plan view of the ejector of the present invention
도 14는 본 발명의 이젝터의 정면도14 is a front view of the ejector of the present invention
도 15는 본 발명의 이젝터의 측면도Figure 15 is a side view of the ejector of the present invention
도 16은 본 발명의 이송 로울러 기구의 평면도16 is a plan view of the transfer roller mechanism of the present invention.
도 17은 본 발명의 이송 로울러 기구의 정면도17 is a front view of the transfer roller mechanism of the present invention.
도 18은 본 발명의 이송 로울러 기구의 측면도18 is a side view of the transfer roller mechanism of the present invention.
도 19는 본 발명의 제1 매거진 회수용 컨베이어의 평면도19 is a plan view of the first magazine recovery conveyor of the present invention;
도 20은 본 발명의 제1 매거진 회수용 컨베이어의 정면도20 is a front view of the first magazine collecting conveyor of the present invention.
도 21은 본 발명의 본 발명의 제1 매거진 회수용 컨베이어의 측면도21 is a side view of the first magazine collecting conveyor of the present invention.
도 22는 본 발명의 정렬 수단의 평면도Figure 22 is a plan view of the alignment means of the present invention
도 23은 본 발명의 정렬 수단의 정면도Figure 23 is a front view of the alignment means of the present invention
도 24는 본 발명의 정렬 수단의 전체 평면도24 is an overall plan view of the alignment means of the present invention.
도 25는 본 발명의 정렬 수단의 전체 정면도25 is an overall front view of the alignment means of the present invention.
도 26은 본 발명의 정렬 수단의 전체 측면도Figure 26 is an overall side view of the alignment means of the present invention.
도 27은 본 발명의 회전 이송 수단의 전체 정면도27 is an overall front view of the rotation conveying means of the present invention;
도 28은 본 발명의 회전 이송 수단의 평면도Figure 28 is a plan view of the rotational conveying means of the present invention
도 29는 본 발명의 회전 이송 수단의 정면도29 is a front view of the rotation conveying means of the present invention;
도 30은 본 발명의 회전 이송 수단의 측면도30 is a side view of the rotational conveying means of the present invention
도 31은 본 발명의 푸셔의 정면도Figure 31 is a front view of the pusher of the present invention
도 32는 본 발명의 푸셔의 측면도32 is a side view of the pusher of the present invention
본 발명의 특징과 장점은 첨부된 도면에 의하여 설명되는 실시예에 의하여 더욱 명확하게 이해될 수 있을 것이다.Features and advantages of the invention will be more clearly understood by the embodiments described by the accompanying drawings.
다음에서 본 발명의 실시예를 설명한다.Next, an embodiment of the present invention will be described.
다음의 설명에서 각 구간에 설치되는 센서의 위치와 부호는 생략한다.In the following description, the positions and symbols of the sensors installed in each section are omitted.
본 발명의 장치는 세척, 전처리, 도금, 후처리, 건조 공정을 실시하는 통상적인 도금 라인에 설치되는 체인 벨트 시스템(CVS)과, 반도체 패키지 리드 프레임(LF)을 도금 라인에 공급하기 위하여 상기 체인 벨트 시스템(CVS)의 우측 전면에 설치되는 자동 공급 장치(A) 및 도금 라인을 통과한 반도체 패키지 리드 프레임(LF)을 회수하기 위하여 체인 벨트 시스템(CVS)의 좌측 전면에 설치되는 자동 회수 장치(B)로 구성된다.The apparatus of the present invention is a chain belt system (CVS) installed in a conventional plating line that performs washing, pretreatment, plating, post-treatment and drying processes, and the chain for supplying a semiconductor package lead frame (LF) to the plating line. Automatic recovery device A installed on the right front side of the belt system CVS and automatic recovery device installed on the left front side of the chain belt system CVS to recover the semiconductor package lead frame LF passing through the plating line ( B) consists of.
자동 공급 장치(A)는 제1 매거진 공급용 컨베이어(1), 제1 직선 이송 수단(2), 제1 매거진 회수용 컨베이어(3), 제1 정렬 수단(4), 제1 회전 이송 수단(5)로 구성되고, 자동 회수 장치(B)는 제2 회전 이송 수단(5), 제2 정렬 수단(7), 제2 직선 이송 수단(8), 제2 매거진 공급용 컨베이어(9), 제2 매거진 회수용 컨베이어(10)로 구성된다.The automatic feeding device (A) is the first magazine feed conveyor (1), the first linear feed means (2), the first magazine collecting conveyor (3), the first alignment means (4), the first rotary feed means ( 5), the automatic recovery device (B) comprises a second rotary feed means (5), a second alignment means (7), a second linear feed means (8), a second magazine feed conveyor (9), and a first Consists of two magazine recovery conveyor (10).
먼저 자동 공급 장치(A)를 살펴본다.First, look at the automatic supply (A).
제1 매거진 공급용 컨베이어(1)는 체인 벨트 시스템(CVS)의 우측 전방에서 양쪽에 설치되는 벨트 프레임(10,10a,10b)이 전후에 고정되는 휘일 샤프트(11,11a)에 휘일(12,12a,12b,12c)이 고정되어 상기 한 쌍의 휘일(12,12a)와 휘일(12b,12c)에 설치되는 각각의 벨트(13,13a)가 구동모터(14)의 동력으로 구동하게 되는데, 한쪽편의 휘일(12b,12c) 및 벨트(13a)가 설치되는 벨트 프레임(10a)은 컨베이어의 진행방향에 대하여 직각 방향으로 설치되는 가이드 레일(15,15a)에 안내되어 휘일 샤프트(11,11a)의 축 방향으로 슬라이딩 이동 가능하게 설치된다.The first magazine supply conveyor 1 is provided with a wheel 12, on the wheel shafts 11, 11a on which belt frames 10, 10a, 10b, which are installed at both sides of the right side of the chain belt system CVS, are fixed before and after. 12a, 12b, and 12c are fixed so that the pair of wheels 12 and 12a and the belts 13 and 13a installed on the wheels 12b and 12c are driven by the power of the driving motor 14, The belt frame 10a on which the one wheel 12b, 12c and the belt 13a are installed is guided by the guide rails 15, 15a installed in a direction perpendicular to the traveling direction of the conveyor, and the wheel shafts 11, 11a. It is installed to be movable in the axial direction of the.
가이드 레일(15,15a)을 따라 이동 가능하게 설치되는 벨트 프레임(10a)은 양쪽의 벨트 프레임(10,10b)사이에서 벨트 프레임(10,10b)에 베어링 설치되는 리드 스크루(16,16a)에 체결되어 리드 스크루(16,16a)가 회전함에 따라 양쪽 방향으로 이동할 수 있게 되어 매거진(M)의 규격에 따라 벨트 12,12a와 12b,12c 사이의 폭을 조절할 수 있게 된다.The belt frame 10a, which is movably installed along the guide rails 15, 15a, is attached to the lead screws 16, 16a, which are bearing-installed on the belt frames 10, 10b between the belt frames 10, 10b on both sides. As the lead screws 16 and 16a are fastened to move in both directions, the width between the belts 12, 12a and 12b, 12c can be adjusted according to the size of the magazine (M).
한 쌍의 리드 스크루(16,16a)는 벨트 프레임(10)의 바깥쪽으로 노출되는 한쪽 단부에 고정되는 휘일(12d,12e)에 벨트(13b)가 설치됨으로써 연동하여 동일한 방향으로 회전하게 된다. The pair of lead screws 16 and 16a rotate in the same direction by interlocking with the belts 13b installed on the wheels 12d and 12e fixed to one end exposed to the outside of the belt frame 10.
한편에 고정되는 벨트 프레임(10b)에는 휘일 샤프트(11,11a)와 리드 스크루(16,16a)의 한족 단부가 베어링 설치되면서 전방에는 구동모터(17)가 설치되고 후방에는 스텝모터(18)가 설치되어 있다.On the other hand, the belt frame 10b fixed to the wheel shafts 11 and 11a and the Han Chinese ends of the lead screws 16 and 16a are bearing-mounted, and a drive motor 17 is installed at the front and a step motor 18 at the rear. It is installed.
구동모터(17)의 구동축은 휘일 샤프트(11)와 연결되어 벨트(13,13a)를 구동시킴으로서 벨트(13,13a)위에 올려 놓여지는 매거진(M)을 제1 직선 이송 수단(2)으로 이송시킨다. The drive shaft of the drive motor 17 is connected to the wheel shaft 11 to drive the belts 13 and 13a so as to transfer the magazine M placed on the belts 13 and 13a to the first linear transfer means 2. Let's do it.
스텝모터(18)의 구동축은 리드 스크루(16a)와 연결되어 벨트(13b)를 구동시킴으로써 리드 스크루(16)와 함께 또 하나의 리드 스크루(16a)를 연동시켜서 벨트 12,12a와 12b,12c 사이의 폭을 조절하는 동력을 제공한다.The drive shaft of the step motor 18 is connected to the lead screw 16a to drive the belt 13b so as to interlock another lead screw 16a with the lead screw 16 and thus between the belts 12, 12a, 12b, 12c. Provides power to adjust the width of the
매거진(M)은 양쪽 수직면의 내측면에 대향하여 형성되는 다수개의 슬롯에 의하여 반도체 패키지 리드 프레임(LF)이 개별적으로 수용되는 공간이 층상으로 형성되고, 전면과 배면에는 반도체 패키지 리드 프레임(LF)이 삽입/배출될 수 있도록 개방된 공간이 형성되어 다수개의 반도체 패키지 리드 프레임이 층상으로 적재되는 공지된 구성으로 형성된다.In the magazine M, a space in which the semiconductor package lead frame LF is individually accommodated is formed in a layered manner by a plurality of slots formed opposite to the inner surfaces of both vertical surfaces, and the semiconductor package lead frame LF is disposed on the front and back surfaces thereof. An open space is formed so that this insertion / ejection can be made in a known configuration in which a plurality of semiconductor package lead frames are stacked in layers.
제1 직선 이송 수단(2)은 수직 이송 수단(20)과 수평 이송 수단(25)으로 구성된다.The first linear conveying means 2 consists of a vertical conveying means 20 and a horizontal conveying means 25.
수직 이송 수단(20)은 하부 리프트(200)와 상부 리프트(220)로 구성된다.The vertical conveying means 20 consists of a lower lift 200 and an upper lift 220.
하부 리프트(200)는 수직 프레임(201)의 전면 양쪽에 수직 방향으로 고정되는 수직 가이드 레일(202,202a)에 사이의 중앙에 리드 스크루(203)가 수직으로 설치되고, 배면에는 리프트용 스텝모터(204)가 고정되어 리드 스크루(203)와 벨트 풀리(205)로 연결되어 있다.The lower lift 200 has a lead screw 203 installed vertically at the center between vertical guide rails 202 and 202a fixed to both front surfaces of the vertical frame 201 in the vertical direction, and a stepping motor for lifting the rear surface thereof. The 204 is fixed and connected to the lead screw 203 and the belt pulley 205.
상기 수직 가이드 레일(202,202a)의 전면에는 매거진 받침대(206)의 바디(207)가 슬라이딩 이동 가능하게 고정되면서, 바디(207)의 중앙에 리드 스크루(203)가 체결되어 리프트용 스텝 모터(204)의 동력으로 정위치에서 회전하는 리드 스크루(203)에 의하여 매거진 받침대(206)가 가이드 레일(202,202a)을 따라 승강이동할 수 있게 된다.The lead screw 203 is fastened to the center of the body 207 while the body 207 of the magazine support 206 is fixed to the front of the vertical guide rails 202 and 202a so as to be slidably movable. The magazine pedestal 206 can be moved up and down along the guide rails 202 and 202a by the lead screw 203 which rotates in the correct position by the power of the "
매거진 받침대(206)가 고정되는 바디(207)의 전면에는 한 쌍의 핑거(208,208a)가 나란하게 설치되어 공급된 매거진(M)을 클램핑할 수 있게 된다.A pair of fingers 208 and 208a are installed side by side on the front surface of the body 207 to which the magazine pedestal 206 is fixed, so that the supplied magazine M can be clamped.
바디(207)는 매거진(M)의 규격에 따라 핑거(208,208a) 사이의 폭을 조절할 수 있도록 바디(207)의 전면에 수평 방향으로 가이드 레일(209,209a)과 리드 스크루(210)가 설치되어 한편의 핑거(208)는 바디(207)에 고정되고, 다른 한편의 핑거(208a)는 가이드 레일(209,209a)에 슬라이딩 이동 가능하게 설치되면서 리드 스크루(210)에 체결되어 있다.The body 207 is provided with guide rails 209 and 209a and lead screws 210 in the horizontal direction on the front of the body 207 so that the width between the fingers 208 and 208a can be adjusted according to the magazine M size. One finger 208 is fixed to the body 207, the other finger 208a is fastened to the lead screw 210 while being installed to be slidably movable on the guide rails 209 and 209a.
리드 스크루(210)는 한쪽편의 단부가 바디(207)에 베어링으로 지지되고, 다른 한쪽의 단부는 핑거(208a)와 체결되어 바디(207)의 한편에 설치되는 폭 조절용 스텝 모터(213)의 동력으로 구동한다. One end of the lead screw 210 is supported by a bearing on the body 207, and the other end is fastened to the finger 208a to be installed on one side of the body 207 to adjust the power of the step motor 213. To drive.
핑거(208a)의 바깥쪽에는 공압실린더(211)가 수평방향으로 고정되고, 핑거(208a)의 안쪽으로 관통되는 공압실린더(211)의 피스톤 로드 선단에는 푸셔(212)가 설치되어 매거진(M)을 협지할 수 있게 된다. The pneumatic cylinder 211 is fixed to the outside of the finger 208a in the horizontal direction, and the pusher 212 is installed at the tip of the piston rod of the pneumatic cylinder 211 penetrating inward of the finger 208a, the magazine (M) It can be intercepted.
상부 리프트(220)는 수직 프레임(221)의 전면 양쪽에 수직 방향으로 고정되는 가이드 레일(222,222a)에 사이의 중앙에 리드 스크루(223)가 수직으로 설치되고, 배면에는 리프트용 스텝 모터(224)가 고정되어 리드 스크루(223)와 벨트 풀리(224)로 연결되어 있다.The upper lift 220 has a lead screw 223 vertically installed at the center between guide rails 222 and 222a fixed to both front surfaces of the vertical frame 221 in the vertical direction, and a stepping motor 224 for the rear surface of the upper lift 220. ) Is fixed and connected to the lead screw 223 and the belt pulley 224.
상기 수직 가이드 레일(222,222a)의 앞쪽에는 수직 이동대(226)의 수직부(227)가 슬라이딩 이동 가능하게 고정되면서, 수직부(227)의 배면으로 돌출된 중앙에 리드 스크루(223)가 체결되어 리프트용 스텝 모터(224)의 동력으로 정위치에서 회전하는 리드 스크루(223)에 의하여 수직 이동대(226)가 가이드 레일(222,222a)을 따라 승강이동할 수 있게 된다.The lead screw 223 is fastened to the center of the vertical guide rails 222 and 222a so that the vertical portion 227 of the vertical movable table 226 is slidably movable in front of the vertical guide rails 222 and 222a. The vertical moving table 226 can be moved up and down along the guide rails 222 and 222a by the lead screw 223 rotating at the correct position by the power of the lift step motor 224.
리드 스크루(223)는 상단부가 수직 프레임(221)에 베어링으로 지지되고, 하단부는 수직 이동대(226)의 수직부(227)에 체결되어, 수직 프레임(221) 배면에 설치되는 리프트용 스텝 모터(224)의 동력으로 구동한다. The lead screw 223 is supported by the bearing on the vertical frame 221, the lower end is fastened to the vertical portion 227 of the vertical movable table 226, the stepping motor for the lift is installed on the back of the vertical frame 221 Drive by the power of (224).
수직 이동대(226)의 상부에는 하나의 공압실린더(228)가 컨베이어의 진행 방향으로 고정되고, 저면에는 또한 컨베이어의 진행 방향으로 나란한 한 쌍의 가이드 레일(229,229a)이 고정되어 있다.One pneumatic cylinder 228 is fixed to the upper portion of the vertical movable table 226 in the traveling direction of the conveyor, and a pair of guide rails 229 and 229a parallel to the traveling direction of the conveyor are fixed to the bottom surface.
가이드 레일(229,229a)의 양쪽에는 대향하는 상부 수평 이동대(230,230a)와 핑거(232,232a)가 설치되어 공급된 매거진(M)을 클램핑할 수 있게 되고, 상부 수평 이동대(230,230a)의 선단부는 공압실린더(228)의 피스톤 로드와 연결 고정되어 공압실린더(228)가 구동하면 가이드 레일(229,229a)을 따라 왕복이동하여 클램핑된 매거진(M)을 이송할 수 있게 되어 있다.On both sides of the guide rails 229 and 229a, opposing upper horizontal slides 230 and 230a and fingers 232 and 232a may be installed to clamp the supplied magazine M, and the upper horizontal slides 230 and 230a may be clamped. The front end is connected and fixed to the piston rod of the pneumatic cylinder 228 so that when the pneumatic cylinder 228 is driven to reciprocate along the guide rails 229 and 229a to transfer the clamped magazine M.
핑거(232a)의 바깥쪽에는 공압실린더(234)가 수평방향으로 고정되고, 핑거(232a)의 안쪽으로 관통되는 공압실린더(234)의 피스톤 로드 선단에는 푸셔(235)가 설치되어 매거진(M)을 협지할 수 있게 된다. The pneumatic cylinder 234 is fixed to the outside of the finger 232a in the horizontal direction, the pusher 235 is installed at the tip of the piston rod of the pneumatic cylinder 234 penetrating inward of the finger 232a, the magazine (M) It can be intercepted.
이러한 핑거(232,232a)는 폭 조절 수단에 의하여 매거진(M)의 규격에 따라 대향 설치되는 폭을 조절할 수 있게 된다. The fingers 232 and 232a may adjust widths that are opposed to each other according to the size of the magazine M by the width adjusting means.
폭 조절 수단은 상부 수평 이동대(230,230a)의 하부에는 상기 가이드 레일(229,229a)과 교차하는 방향으로 설치되는 한 쌍의 가이드 레일(231,231a)과, 한쪽 단부는 하부 수평 이동대(233)에 베어링으로 지지되고 다른 한쪽의 단부는 핑거에 체결되는 리드 스크루(236)와, 하부 수평 이동대(233a)에 고정되어 리드 스크루(236)를 구동시키는 폭 조절용 스텝모터(237)로 구성되어 핑거(232a)가 고정된 하부 수평 이동대(233a)가 가이드 레일(231,231a)을 따라 슬라이딩 이동하여 폭을 조절할 수 있게 된다.The width adjusting means includes a pair of guide rails 231 and 231a installed at a lower portion of the upper horizontal slides 230 and 230a in a direction crossing the guide rails 229 and 229a, and one end of the lower horizontal slides 233. The lead screw 236 is supported by a bearing and the other end is fastened to the finger, and the width adjustment step motor 237 fixed to the lower horizontal moving table 233a to drive the lead screw 236 is a finger The lower horizontal movable table 233a having the fixed portion 232a sliding along the guide rails 231 and 231a may adjust the width.
수평 이송 수단(25)은 이젝터(250)와 이송 로울러 기구(255)로 구성된다.The horizontal conveying means 25 is composed of an ejector 250 and a conveying roller mechanism 255.
이젝터(250)는 지지대(251) 상부면에 추출용 공압 실린더(252)의 고정편(253)이 고정구(254)로 체결된다.The ejector 250 is fastened to the fixing piece 253 of the extraction pneumatic cylinder 252 on the upper surface of the support 251.
추출용 공압 실린더(252)는 하부 리프트(200) 또는 상부 리프트(220)에 의하여 단계적으로 상승하는 매거진(M)의 개방된 공간을 향하여 설치되어 매거진(M)에 적재된 반도체 패키지 리드 프레임(LF)을 매거진(M)으로부터 추출하여 이송 로울러가 협지할 수 위치까지 수평 방향으로 이송시킨다.The extraction pneumatic cylinder 252 is installed toward the open space of the magazine M, which is gradually stepped up by the lower lift 200 or the upper lift 220, and the semiconductor package lead frame LF loaded in the magazine M. ) Is extracted from the magazine (M) and transported horizontally to a position where the feed roller can be pinched.
고정구(253)가 결합되는 고정편(253)은 장공으로 형성되어 매거진(M)의 규격에 따라 고정되는 위치를 변경시킬 수 있게 되어 매거진(M)으로부터 반도체 패키지 리드 프레임(LF)을 정확하게 추출시킬 수 있다.The fixing piece 253 to which the fixing tool 253 is coupled may be formed in a long hole to change the fixed position according to the specification of the magazine M, thereby accurately extracting the semiconductor package lead frame LF from the magazine M. Can be.
이송 로울러 기구(255)는 이젝터(250)에 의하여 추출되는 반도체 패키지 리드 프레임(LF)을 안내하는 가이드(256)와, 상기 가이드(256)를 통하여 유입되는 반도체 패키지 리드 프레임(LF)을 압착하여 이송시키는 한 쌍의 이송 로울러(257,257a)와, 상기 이송 로울러(257,257a)가 서로 근접하고 이격될 수 있도록 승강이동 가능하게 되어 푸셔와,The transfer roller mechanism 255 compresses the guide 256 for guiding the semiconductor package lead frame LF extracted by the ejector 250 and the semiconductor package lead frame LF introduced through the guide 256. A pair of conveying rollers 257 and 257a for conveying, and the conveying rollers 257 and 257a are capable of lifting and lowering so as to be close to and spaced apart from each other,
상기 이송 로울러(257)를 구동시키는 구동모터(258)로 구성된다.It consists of a drive motor 258 for driving the transfer roller 257.
한쪽편의 이송 로울러(257,257a)는 조정구(259)로 회전하는 리드 스크루(260)에 의하여 가이드 레일()에 안내되어 반도체 패키지 리드 프레임(LF)의 크기에 따라 폭을 조절할 수 있게 되어 있다.The conveying rollers 257 and 257a on one side are guided to the guide rails 260 by a lead screw 260 rotating by the adjusting tool 259 to adjust the width according to the size of the semiconductor package lead frame LF.
제1 매거진 회수용 컨베이어(3)는 상기 매거진 공급용 컨베이어와 같은 폭 조절 수단이 구비되어 매거진 공급용 컨베이어와 함께 컨베이어의 폭을 조절할 수 있게 되어, 매거진 공급용 컨베이어(1)의 상부에 설치되는 이젝터(250)에 의하여 반도체 패키지 리드 프레임(LF)이 추출된 매거진(M)을 이송시키는 상부 리프트(220)에 의하여 수납된 매거진(M)을 배출시킨다.The first magazine recovery conveyor 3 is provided with a width adjusting means such as the magazine supply conveyor to adjust the width of the conveyor together with the magazine supply conveyor, which is installed at the upper part of the magazine supply conveyor 1. The magazine M accommodated by the upper lift 220 which transfers the magazine M from which the semiconductor package lead frame LF is extracted by the ejector 250 is discharged.
제1 정렬 수단(4)은 수납대(40), 푸셔(41) 및 위치 조정 수단으로 구성되어 이송 로울러(257,257a)에 의하여 이송된 반도체 패키지 리드 프레임(LF)을 정렬한 다음 제1 회전 이송 수단(5)에 의하여 도금라인으로 이송될 수 있게 한다. The first alignment means 4 is composed of a receiving table 40, a pusher 41 and a position adjusting means to align the semiconductor package lead frame LF conveyed by the conveying rollers 257, 257a and then the first rotational conveyance. By means of means 5 it can be transferred to the plating line.
수납대(40)는 이송 로울러(257,257a)에 의하여 이송되는 반도체 패키지 리드 프레임(LF)을 수납하여 정지된 상태에서 머무르게 한다.The storage table 40 accommodates the semiconductor package lead frame LF transported by the transfer rollers 257 and 257a to stay in the stopped state.
푸셔(41)는 수평상으로 고정되는 공압 실린더(42)의 피스톤 로드에 설치되어 수납대(40)를 향하여 수평상으로 설치된다.The pusher 41 is installed on the piston rod of the pneumatic cylinder 42 fixed horizontally, and is installed horizontally toward the storage table 40.
위치 조정 수단은 고정대(43)상부에 고정되는 가이드 레일(44,44a)에 공압실린더(42)가 고정된 고정대(44)가 이동 가능하게 설치되고, 한쪽의 단부는 고정대(44)에 베어링으로 지지되면서 다른 한쪽의 단부는 상기 공압실린더(42)가 고정된 고정대(44)에 개방홈(45)이 형성된 지지단부(46)에 회전 가능하게 지지되어 조정 노브(47)로 회전하는 리드 스크루(48)로 구성되고, 상기 리드 스크루(46)를 고정시키기 위하여 상기 지지단부(46)에 체결되어 개방홈(45)을 조여주는 고정구(49)로 구성된다. The position adjusting means is provided with a movable base 44 in which a pneumatic cylinder 42 is fixed to guide rails 44 and 44a fixed to the upper base 43 so as to be movable, and one end thereof as a bearing on the base 44. While being supported, the other end of the lead screw rotatably supported by the support end portion 46 having the opening groove 45 formed on the fixing member 44 on which the pneumatic cylinder 42 is fixed is rotated by the adjustment knob 47 ( 48, and a fastener 49 fastened to the support end 46 to fasten the lead screw 46 to tighten the opening groove 45.
제1 회전 이송 수단(5)은 공압실린더(50), 캐리어 핑거(51,51a), 상기 캐리어 핑거(51,51a)의 위치 조정 수단으로 구성된다.The first rotary feed means 5 is composed of a pneumatic cylinder 50, carrier fingers 51 and 51a, and position adjusting means of the carrier fingers 51 and 51a.
공압실린더(50)는 상기 제1 정렬 수단(4)의 수납대(40) 상부에 회전 가능하게 설치되고 서보모터(52)로 회전 가능하게 설치된다. The pneumatic cylinder 50 is rotatably installed on the receiving table 40 of the first alignment means 4 and rotatably installed by the servomotor 52.
캐리어 핑거(51,51a)는 상기 공압실린더(50)의 피스톤 로드에 설치되어 직선 왕복 이동하는 또 하나의 공압실린더(51)가 구동하여 상기 정렬 수단에 의하여 정렬된 반도체 패키지 리드 프레임(LF)을 클램핑하여 도금용 체인 벨트(CV)에 부착시킨다. Carrier fingers 51 and 51a are mounted on the piston rod of the pneumatic cylinder 50 to drive another pneumatic cylinder 51 which linearly reciprocates to align the semiconductor package lead frame LF aligned by the alignment means. It is clamped and attached to the plating chain belt (CV).
캐리어 핑거(51,51a)의 위치 조정 수단은 공압실린더(50)의 피스톤 로드에 고정된 고정대(53) 상부에 고정되는 가이드 레일(54,54a)에 슬라이딩 이동 가능하게 설치되는 이동대(55)에 캐리어 핑거(51,52a)가 설치되고, 상기 이동대(55)가 고정대(53) 상부에 고정된 가이드 레일(55,55a)에 슬라이딩 이동 가능하게 설치되고, 한쪽 단부는 고정대(53)에 베어링으로 지지되고, 다른 한쪽의 단부는 이동대(55)에 체결되는 리드 스크루(56)로 구성된다. Positioning means of the carrier fingers (51, 51a) is a movable table (55) which is slidably installed on the guide rails (54, 54a) fixed to the upper portion of the fixing table (53) fixed to the piston rod of the pneumatic cylinder (50) Carrier fingers 51 and 52a are installed on the guide rails, and the movable table 55 is slidably installed on the guide rails 55 and 55a fixed to the upper part of the fixing table 53, and one end thereof is attached to the fixing table 53. Supported by a bearing, the other end is composed of a lead screw 56 fastened to the movable table 55.
자동 회수 장치(B)는 제2 회전 이송 수단(5), 제2 정렬 수단(7), 제2 직선 이송 수단(8), 제2 매거진 공급용 컨베이어(9), 제2 매거진 회수용 컨베이어(10)로 구성된다.The automatic recovery device B includes a second rotary feed means 5, a second alignment means 7, a second linear feed means 8, a second magazine supply conveyor 9, and a second magazine recovery conveyor ( 10).
제2 회전 이송 수단(6)은 상기 제1 회전 이송 수단(2)과 동일한 구성으로 이루어져서 도금공정을 마친 반도체 패키지 리드 프레임을 도금용 체인 벨트로부터 이탈시켜서 회수할 수 있게 한다.The second rotational conveying means 6 has the same configuration as the first rotational conveying means 2, so that the semiconductor package lead frame, which has completed the plating process, can be recovered from the chain belt for plating.
제2 정렬 수단(7)은 상기 제1 정렬 수단(4)과 동일한 구성으로 이루어지면서, 수납대(40)의 반도체 패키지 리드 프레임(LF)을 이송 로울러(257,257A)로 공급하기 위한 푸셔(70)가 더 구비되어 도금 공정을 마친 반도체 패키지 리드 프레임을 회수용 매거진으로 정확하게 이송될 수 있도록 정렬시킨다.The second alignment means 7 has the same configuration as the first alignment means 4, and the pusher 70 for supplying the semiconductor package lead frame LF of the holder 40 to the transfer rollers 257, 257A. ) Is further provided to align the semiconductor package lead frame after the plating process so as to be accurately transferred to the recovery magazine.
상기 푸셔(70)는 고정대(70)에 수평상으로 설치되는 공압실린더(71)와, 상기 공압실린더(71)에 고정되는 브라켓(72)에 수직으로 고정되는 공압실린더(73)와, 상기 공압실린더(73)의 피스톤 로드 선단에 고정되어 반도체 패키지 리드 프레임(LF)을 밀어내는 푸시 로드(74)로 구성되어 수납대(40)에 근접한 위치에 설치된다.The pusher 70 is a pneumatic cylinder 71 is installed horizontally on the holder 70, a pneumatic cylinder 73 is fixed perpendicular to the bracket 72 is fixed to the pneumatic cylinder 71, and the pneumatic It is composed of a push rod 74 that is fixed to the piston rod tip of the cylinder 73 and pushes the semiconductor package lead frame LF, and is installed at a position close to the storage table 40.
제2 직선 이송 수단(8)은 상기 제1 직선 이송 수단(2)과 동일한 구성으로 이루어져서, 반도체 패키지 리드 프레임이 장전되지 아니한 상태로 공급되는 매거진에 반도체 패키지 리드 프레임을 적재시키게 된다.The second linear transfer means 8 has the same configuration as the first linear transfer means 2, thereby loading the semiconductor package lead frame into a magazine supplied without the semiconductor package lead frame loaded.
제2 매거진 공급용 컨베이어(9)는 상기 제1 매거진 공급용 컨베이어(1)와 동일한 구성으로 이루어져서 반도체 패키지 리드 프레임이 적재되지 아니한 상태의 매거진을 반도체 패키지 리드 프레임을 수납하기 위한 위치로 이송시킨다.The second magazine supply conveyor 9 has the same configuration as the first magazine supply conveyor 1 to transfer the magazine in a state where the semiconductor package lead frame is not loaded to a position for accommodating the semiconductor package lead frame.
제2 매거진 회수용 컨베이어(10)는 상기 제1 매거진 회수용 컨베이어(3)와 동일한 구성으로 이루어져서 반도체 패키지 리드 프레임이 적재된 매거진을 배출시킨다.The second magazine recovery conveyor 10 has the same configuration as the first magazine recovery conveyor 3 to discharge the magazine loaded with the semiconductor package lead frame.
본 발명에 적용되는 체인 벨트 시스템(CVS)은 도금용 체인 벨트(CV)가 한 쌍의 벨트 풀리(300,300a)에 설치되고, 도금용 체인 벨트(CV)에 반도체 패키지 리드 프레임(LF)을 분리 가능하게 고정시키는 공지된 구조의 클리퍼(400)로 구성된다.In the chain belt system CVS applied to the present invention, a plating chain belt CV is installed on a pair of belt pulleys 300 and 300a, and the semiconductor package lead frame LF is separated from the plating chain belt CV. It consists of a clipper 400 of known construction that possibly secures.
이와 같이 구성되는 본 발명에 의하여 반도체 패키지 리드 프레임(LF)이 도금 라인에 자동적으로 공급되고 회수되는 과정을 살펴보면 다음과 같다.Looking at the process of the semiconductor package lead frame (LF) is automatically supplied to the plating line and recovered by the present invention configured as described above are as follows.
다음의 설명에서 각 구간에서 동작되는 센서의 위치와 부호는 생략한다.In the following description, the position and sign of the sensor operated in each section are omitted.
본 발명의 장치는 다수개의 매거진(M)과 반도체 패키지 리드 프레임(LF)이 순차적이고, 동시 다발적으로 공급 및 회수되는데, 다음의 설명에서는 하나의 매거진(M)과 반도체 패키지 리드 프레임(LF)이 이송되는 상태를 설명하게 될 것이며, 또한 각 구간에서 동작되는 센서의 위치와 부호가 생략되었다.In the apparatus of the present invention, a plurality of magazines M and a semiconductor package lead frame LF are sequentially and simultaneously supplied and recovered. In the following description, one magazine M and a semiconductor package lead frame LF are provided. This conveying state will be described, and the position and sign of the sensor operated in each section are omitted.
자동 공급 장치(A)와 자동 회수 장치(B)는 매거진(M)과 반도체 패키지 리드 프레임(LF)의 크기에 따라 폭 조절 수단 및 위치 조절 수단을 이용하여 최적의 위치가 선정되어 있다.The optimum position is selected for the automatic supply device A and the automatic recovery device B using the width adjusting means and the position adjusting means according to the size of the magazine M and the semiconductor package lead frame LF.
자동 공급 장치(A)는 다수개의 반도체 패키지 리드 프레임(LF)이 층상으로 적재된 매거진(M)으로부터 공급되는 반도체 패키지 리드 프레임(LF)을 무한궤도상의 도금용 체인 벨트(CV)에 부착시켜서 도금 라인으로 이송시킨다.The automatic supply device A attaches a semiconductor package lead frame LF supplied from a magazine M in which a plurality of semiconductor package lead frames LF are stacked in a layer to a chain belt CV for an infinitely orbital plating. Transfer to the line.
먼저, 제1 매거진 공급용 컨베이어(1)의 최적 위치 선정은 스텝 모터(18)가 정역방향으로 구동하여 리드 스크루(16,16a)가 연동함에 따라 한편의 벨트(13a)가 대향 설치된 벨트(13)사이의 거리가 조절된다. 이후 반도체 패키지 리드 프레임(LF)이 적재된 다수개의 매거진(M)이 제1 매거진 공급용 컨베이어(1)에 투입되고 구동모터(17)가 구동하여 매거진(M)이 벨트(13,13a)의 후단부에 도달하게 될 때에 센서에 감지되어 구동모터(17)가 정지하게 된다.First, the optimum position selection of the first magazine supply conveyor 1 is performed by driving the step motor 18 in the forward and reverse directions so that the lead belts 16 and 16a interlock with each other, and the belt 13a on which the belt 13a is disposed to face each other. The distance between) is adjusted. Thereafter, a plurality of magazines M on which the semiconductor package lead frame LF is loaded is introduced into the first magazine supply conveyor 1, and the driving motor 17 is driven so that the magazines M of the belts 13 and 13a are loaded. When the rear end is reached, the sensor is sensed and the driving motor 17 is stopped.
구동모터(17)가 정지하면 수직 이송 수단(20)의 하부 리프트(200)에 설치되어 있는 리프트용 스텝 모터(204)가 구동하여 벨트 풀리(205)로 전달되는 동력으로 리드 스크루(203)가 회전하여 매거진 받침대(206)가 반도체 패키지 리드 프레임(LF)이 적재된 간격만큼 단계적으로 상승하게 된다.When the driving motor 17 stops, the lead screw 203 is driven by the power transmitted to the belt pulley 205 by the lift step motor 204 installed on the lower lift 200 of the vertical transfer means 20. As the magazine pedestal 206 is rotated, the magazine pedestal 206 is stepped up by the interval in which the semiconductor package lead frame LF is loaded.
매거진 받침대(206)가 1단계 상승을 완료하면 이젝터(250)를 구성하는 추출용 공압실린더(252)가 진퇴 작동을 하여 푸시로드(255)가 하나의 반도체 패키지 리드 프레임(LF)을 이송 로울러(257,257a)쪽으로 밀어내고, 매거진 받침대(206)는 2단계 상승 작동을 하게 된다.When the magazine pedestal 206 completes the first step, the extraction pneumatic cylinder 252 constituting the ejector 250 moves forward and backward, and the push rod 255 transfers one semiconductor package lead frame LF to the transfer roller ( 257, 257a), the magazine pedestal 206 is subjected to a two-step lift operation.
매거진(M)으로부터 반도체 패키지 리드 프레임(LF)이 인출된 것이 감지되면 이송 로울러(257,257a)가 반도체 패키지 리드 프레임(LF)을 압착하고 구동모터(258)의 동력이 이송 로울러(257a)에 도달하게 됨에 따라 반도체 패키지 리드 프레임(LF) 정렬수단(4) 및 회전 이송수단(5)을 향하여 수평 이동을 하게 된다.When the semiconductor package lead frame LF is detected from the magazine M, the transfer rollers 257 and 257a compress the semiconductor package lead frame LF and the power of the driving motor 258 reaches the transfer roller 257a. As a result, the semiconductor package lead frame LF moves horizontally toward the alignment means 4 and the rotation transfer means 5.
이때, 이송 로울러(257,257a)을 빠져나온 반도체 패키지 리드 프레임(LF)의 선단부가 정렬수단(4)의 수납대(40)까지 충분히 도달하지 못하게 되는데, 공압실린더에 의하여 하강, 직선이동 상승 및 직선이동하여 복귀하는 푸셔가 반도체 패키지 리드 프레임(LF)을 수납대(40)까지 완전히 밀어서 안착시켜주게 된다. At this time, the tip portion of the semiconductor package lead frame LF exiting the transfer rollers 257, 257a does not reach the storage table 40 of the alignment means 4 sufficiently. The pneumatic cylinder lowers, moves linearly, and rises linearly. The pusher moving and returning completely pushes the semiconductor package lead frame LF to the storage table 40.
이송 로울러(257,257a)의 최적 위치 설정은 조정구(259)를 정역방향으로 회전시킴에 따라 연동하는 리드 스크루(260)에 체결된 한쪽편의 이송 로울러(257,257a)가 가이드 레일에 안내되어 이동하게 됨에 따라 결정된다. The optimum positioning of the feed rollers 257, 257a is because the feed rollers 257, 257a of one side, which are fastened to the lead screw 260, which are interlocked by rotating the adjusting tool 259 in the forward and reverse directions, are guided and moved on the guide rails. Is determined accordingly.
한편, 하부 리프트(200)가 단계적 상승을 완료하여 매거진(M)에 반도체 패키지 리드 프레임(LF)이 모두 추출되면, 빈 매거진(M)은 상부 리프트(220)에 의하여 제1 매거진 회수용 컨베이어(3)로 이송되어 배출된다. 즉, 리프트용 스텝 모터(224)가 구동하면 벨트 풀리(225)로 전달되는 동력이 리드 스크루(223)를 회전시켜서 수직부(227)가 가이드 레일(222,222a)에 안내되어 매거진(M)을 클램핑할 수 있는 위치까지 핑거(232,232a)가 하강하게 되고, 공압 실린더(234)가 구동하여 전진하는 푸셔(235)에 의하여 양쪽의 핑거(232,232a)가 매거진(M)을 협지하게 된다.On the other hand, when the lower lift 200 completes the step-up and the semiconductor package lead frame LF is extracted to the magazine (M), the empty magazine (M) by the upper lift 220, the first magazine recovery conveyor ( 3) is transported and discharged. That is, when the lift step motor 224 is driven, the power transmitted to the belt pulley 225 rotates the lead screw 223 so that the vertical portion 227 is guided to the guide rails 222 and 222a to open the magazine M. Fingers 232 and 232a are lowered to a clamping position, and both fingers 232 and 232a pinch the magazine M by the pusher 235 which the pneumatic cylinder 234 drives and moves forward.
이렇게 핑거(232,232a)가 매거진(M)을 협지하면 리프트용 스텝 모터(224)가 역방향으로 구동하여 매거진(M)의 하단부가 제1 매거진 회수용 컨베이어(3)의 벨트 보다 높은 위치에 도달할 때까지 핑거(232,232a)가 상승한 다음, 공압 실린더(228)가 구동하여 핑거(232,232a)가 설치된 상부 수평 이동대(230,230a)가 가이드 레일(229,2292a)에 안내되어 수평 이동하여 제1 매거진 회수용 컨베이어(3) 상에 도달한다.When the fingers 232 and 232a pinch the magazine M, the lift step motor 224 is driven in the reverse direction so that the lower end of the magazine M reaches a position higher than the belt of the first magazine collecting conveyor 3. The fingers 232 and 232a are raised until the upper side, and the pneumatic cylinder 228 is driven so that the upper horizontal movable plates 230 and 230a having the fingers 232 and 232a installed are guided to the guide rails 229 and 2292a to move horizontally. Reach on the magazine recovery conveyor 3.
그러면 이번에는 리프트용 스텝 모터(224)가 다시 역방향으로 구동하여 핑거(232,23a)가 하강하여 매거진(M)을 제1 매거진 회수용 컨베이어(3)에 내려놓은 다음 원위치로 복귀한다. Then, the lift step motor 224 is driven in the reverse direction again, and the fingers 232 and 23a are lowered to lower the magazine M on the first magazine recovery conveyor 3 and then return to the original position.
상부 리프트(220)의 최적 위치 설정은 폭 조절용 스텝 모터(237)가 구동하여 한편의 핑거(232a)가 고정된 하부 수평 이동대(233a)가 가이드 레일(231,31a)을 따라 이동함에 따라 결정된다. The optimal positioning of the upper lift 220 is determined by the step motor 237 for width adjustment and the lower horizontal moving table 233a having the one finger 232a fixed along the guide rails 231 and 31a. do.
상기에서 로울러()를 통하여 제1 정렬 수단(4)의 수납대(40)에 도달한 반도체 패키지 리드 프레임(LF)은 공압 실린더(42)에 의하여 수평 방향으로 전진 이동하는 푸셔(41)에 의하여 직선상의 진향 방향을 정렬하게 된다.The semiconductor package lead frame LF, which has reached the storage table 40 of the first alignment means 4 through the rollers 에서 above, is pushed forward by the pusher 41 in the horizontal direction by the pneumatic cylinder 42. The direction of the straight line is aligned.
푸셔(41)의 최적 위치 설정은 고정구(49)의 조임력을 풀고, 조정 노브(27)를 정역방향으로 회전시킬 때 회전하는 리드 스크루(48)에 의하여 푸셔(41)를 포함한 공압실린더(42)의 위치를 조절함으로써 수행된다.The optimal positioning of the pusher 41 is to release the tightening force of the fastener 49, and the pneumatic cylinder 42 including the pusher 41 by the lead screw 48 that rotates when the adjustment knob 27 is rotated in the forward and reverse directions. This is done by adjusting the position of.
반도체 리프 프레임()의 정렬을 마치면 공압 실리더(50)가 하강하여 캐리어 핑거(51,51a)가 반도체 패키지 리드 프레임(LF)의 측단부에 도달하면 공압실린더(51,51a)가 작동하여 캐리어 핑거(51,51a)가 반도체 패키지 리드 프레임(LF)의 측단부를 클림핑하게 된다.When the alignment of the semiconductor leaf frame is completed, the pneumatic cylinder 50 descends, and when the carrier fingers 51 and 51a reach the side ends of the semiconductor package lead frame LF, the pneumatic cylinders 51 and 51a are operated. Fingers 51 and 51a crimp the side ends of the semiconductor package lead frame LF.
이렇게 캐리어 핑거(51,51a)가 반도체 패키지 리드 프레임(LF)을 클램핑한 것이 감지되면 서보모터(520가 구동하여 캐리어 핑거(51,51a)와 함께 공압 실린더(50)가 도금용 체인 벨트(CV)를 향하여 약90° 각도로 회전하여, 반도체 패키지 리드 프레임(LF)의 도금용 체인 벨트(CV)에 전달한 다음 클램핑을 풀고, 원위치로 복귀하게 된다.When it is detected that the carrier fingers 51 and 51a clamp the semiconductor package lead frame LF, the servomotor 520 is driven so that the pneumatic cylinder 50 together with the carrier fingers 51 and 51a is plated with a chain belt CV. Rotate at an angle of about 90 ° to the plate, to the plating chain belt CV of the semiconductor package lead frame LF, and then release the clamping and return to the original position.
캐리어 핑거(51,51a)의 최적 위치 설정은 리드 스크루(56)를 회전시킴에 따라 이동대(55)가 가이드 레일(55,55a)에 안내되어 이동되면서 캐리어 핑거(51,51a)가 반도체 패키지 리드 프레임(0의 측단면과 이루는 거리를 조절함으로써 수행된다.The optimal positioning of the carrier fingers 51 and 51a is performed by rotating the lead screw 56 so that the carrier 55 is guided and moved to the guide rails 55 and 55a, thereby moving the carrier fingers 51 and 51a into the semiconductor package. This is performed by adjusting the distance between the lead frame 0 and the side cross section.
도금용 체인 벨트(CV)는 공지된 방법과 같이 클리퍼(400)에 의하여 일시적으로 정지된 상태에서 반도체 패키지 리드 프레임(LF)을 전달받아서 정하여진 순서에 따라 도금을 수행할 수 있게 한다. The plating chain belt CV receives the semiconductor package lead frame LF in a state in which it is temporarily stopped by the clipper 400 as in a known method so that plating can be performed in a predetermined order.
이상의 설명에서는 반도체 패키지 리드 프레임(LF)의 추출을 위한 리프트 작동이 하부 리프트(200)의 단계적 상승 작동과 매거진(M)을 배출하는 상부 리프트(220)에 의하여 진행되는 것으로 설명하였으나, 하부 리프트(200)가 없이 상부 리프트(220)가 매거진(M)의 단계적 상승 및 배출 작동을 동시에 수행하게 할 수도 있다.In the above description, the lift operation for extracting the semiconductor package lead frame LF is performed by the step-up operation of the lower lift 200 and the upper lift 220 which discharges the magazine M, but the lower lift ( It is also possible to have the upper lift 220 perform the step-up and discharge operations of the magazine M simultaneously without the 200.
자동 회수 장치(B)는 제2 회전 이송 수단(5), 제2 정렬 수단(7), 제2 직선 이송 수단(8), 제2 매거진 공급용 컨베이어(9), 제2 매거진 회수용 컨베이어(10)로 구성되어 도금용 체인 벨트(CV)에 매달려서 도금 라인을 통과한 반도체 패키지 리드 프레임(LF)을 도금용 체인 벨트(CV)로부터 이탈시켜서 반도체 패키지 리드 프레임(LF)이 적재되지 아니한 매거진(M)에 적재하여 회수한다.The automatic recovery device B includes a second rotary feed means 5, a second alignment means 7, a second linear feed means 8, a second magazine supply conveyor 9, and a second magazine recovery conveyor ( 10) is a magazine in which the semiconductor package lead frame LF is not loaded by detaching the semiconductor package lead frame LF that has passed through the plating line by hanging on the chain belt CV for plating. Collect it in M) and collect it.
이러한 자동 회수 장치(B)는 상기 제2 회전 이송 수단(5), 제2 정렬 수단(7), 제2 직선 이송 수단(8), 제2 매거진 공급용 컨베이어(9), 제2 매거진 회수용 컨베이어(10)는 앞서 설명한 자동 공급 장치(A)의 구성과 같으며, 다만 수납대(40)로부터 이송 로울러()로 반도체 패키지 리드 프레임(LF)을 공급하는 푸셔(70)가 더 설치되고, 이송 로울러()에서 수납대(40)로 반도체 패키지 리드 프레임(LF)을 이송시키는 푸셔가 생략되는 구성으로 된다.This automatic recovery device (B) is for the second rotary transfer means 5, the second alignment means (7), the second linear transfer means (8), the second magazine supply conveyor (9), the second magazine recovery Conveyor 10 is the same as the configuration of the automatic supply device (A) described above, but is further provided with a pusher 70 for supplying the semiconductor package lead frame (LF) from the storage table 40 to the transfer roller (), The pusher for transferring the semiconductor package lead frame LF from the transfer roller to the storage table 40 is omitted.

Claims (9)

  1. 다수개의 반도체 패키지 리드 프레임이 층상으로 적재되는 매거진으로부터 공급되는 반도체 리드프레임을 무한궤도상의 도금용 체인 벨트에 부착시켜서 도금 라인으로 이동시키는 반도체 패키지 리드 프레임 도금 장치에 있어서,A semiconductor package lead frame plating apparatus for attaching a semiconductor lead frame supplied from a magazine in which a plurality of semiconductor package lead frames are stacked in a layer to a chain belt for plating on an orbit and moving to a plating line,
    매거진에 적재된 반도체 패키지 리드 프레임을 인출시킬 수 있도록 인출 위치로 이송시키는 제1 매거진 공급용 컨베이어;A first magazine supply conveyor configured to transfer the semiconductor package lead frame loaded in the magazine to a withdrawal position so as to be withdrawn;
    상기 매거진 공급용 컨베이어에 의하여 이송된 매거진으로부터 반도체 패키지 리드 프레임을 순차적으로 인출시켜서 공급하는 제1 직선 이송 수단;First linear transport means for sequentially drawing and supplying a semiconductor package lead frame from a magazine transported by the magazine supply conveyor;
    상기 제1 직선 이송 수단에 의하여 반도체 패키지 리드 프레임이 인출된 매거진을 회수하는 제1 매거진 회수용 컨베이어; A first magazine recovery conveyor for recovering a magazine from which the semiconductor package lead frame is drawn out by the first linear transport means;
    상기 제1 직선 이송 수단에 의하여 이송된 반도체 패키지 리드 프레임을 정렬하는 제1 정렬 수단;First alignment means for aligning the semiconductor package lead frame transferred by the first linear transfer means;
    상기 제1 정렬 수단에 의하여 정렬된 반도체 패키지 리드 프레임을 도금용 체인 벨트에 부착시키는 제1 회전 이송 수단;First rotating transport means for attaching the semiconductor package lead frame aligned by the first alignment means to a chain belt for plating;
    상기 제1 회전 이송 수단에 의하여 도금용 체인 벨트에 부착되어 도금 공정을 마친 반도체 패키지 리드 프레임을 회수하기 위하여 도금용 체인 벨트로부터 반도체 패키지 리드 프레임을 인출시키는 제2 회전 이송 수단;Second rotating conveying means attached to the chain belt for plating by the first rotating conveying means and withdrawing the semiconductor package lead frame from the plating chain belt in order to recover the semiconductor package lead frame after the plating process;
    상기 제2 회전 이송 수단에 의하여 벨트로부터 인출된 반도체 패키지 리드 프레임을 정렬하는 제2 정렬 수단;Second alignment means for aligning the semiconductor package lead frame drawn out from the belt by the second rotational transfer means;
    상기 정렬 수단에 의하여 정렬된 반도체 패키지 리드 프레임을 매거진에 적재시키기 위한 제2 직선 이송 수단;Second linear transfer means for loading the semiconductor package lead frame aligned by the alignment means into a magazine;
    상기 제2 직선 이송 수단에 의하여 공급되는 반도체 패키지 리드 프레임을 회수하기 위하여 반도체 패키지 리드 프레임이 적재되지 아니한 매거진을 수납 위치로 투입시키는 제2 매거진 공급용 컨베이어;A second magazine supply conveyor which feeds a magazine in which the semiconductor package lead frame is not loaded into a storage position to recover the semiconductor package lead frame supplied by the second linear transfer means;
    상기 제2 매거진 공급용 컨베이어에 의하여 투입되어 상기 제2 직선 이송 수단에 의하여 반도체 패키지 리드 프레임이 수납된 매거진을 회수하는 제2 매거진 회수용 컨베이어; 를 포함하는 것을 특징으로 하는 반도체 패키지 리드 프레임 매거진의 자동 공급 및 회수 장치.A second magazine recovery conveyor which is fed by the second magazine supply conveyor and recovers a magazine in which the semiconductor package lead frame is accommodated by the second linear transfer means; Automatic supply and recovery of semiconductor package lead frame magazine comprising a.
  2. 청구항 1에 있어서, 제1,제2 매거진 공급용 컨베이어의 진행방향에 대하여 직각 방향으로 설치되는 가이드 레일에 어느 한편의 컨베이어가 안내되어 이동 가능하게 설치되면서, 상기 이동 가능하게 설치되는 컨베이어가 서보모터에 의하여 회전하는 리드 스크루가 나사 결합되어 리드 스크루가 회전함에 따라 가이드 레일에 안내되어 이동할 수 있게 되어 다양한 규격의 매거진을 공급할 수 있게 되는 것을 특징으로 하는 반도체 패키지 리드 프레임을 도금하기 위한 반도체 패키지 리드 프레임 매거진의 자동 공급 및 회수 장치.The servo motor of claim 1, wherein one of the conveyors is guided and movable in a guide rail installed at a right angle with respect to a traveling direction of the first and second magazine supply conveyors. The lead screw that is rotated by the screw is screwed and guided to the guide rail as the lead screw rotates to move the semiconductor package lead frame for plating a semiconductor package lead frame, characterized in that to supply a magazine of various specifications Automatic supply and recovery of magazines.
  3. 청구항 1에 있어서, 제1 직선 이송 수단은 상기 제1 매거진 공급용 컨베이어의 한편, 즉 매거진이 진행되는 안쪽에서 스텝 모터로 구동하는 리드 스크루에 나사 결합되어, 반도체 패키지 리드 프레임이 장전되어 공급되는 매거진을 받아서 층상으로 설치된 반도체 프레임의 간격만큼 수직 방향으로 올려주는 리프트와; 수평으로 설치되어 매거진에 장전된 반도체 패키지 리드 프레임을 인출시키는 푸셔와; 상부의 로울러가 하부의 로울러에 근접하고 이격될 수 있도록 승강이동 가능하게 되어 푸셔에 의하여 인출되는 반도체 패키지 리드 프레임을 압착하여 수평 진행 방향으로 이송시키는 한 쌍의 이송 로울러와; 상기 이송 로울러에 의하여 이송된 반도체 패키지 리드 프레임의 후단부를 제1 회전 이송 수단까지 이송시킬 수 있도록 공압실린더에 의하여 상하 및 수평 이동하는 푸셔로 구성되어 상기 매거진 공급용 컨베이어에 의하여 이송된 매거진으로부터 반도체 패키지 리드 프레임을 순차적으로 인출시키게 되는 것을 포함하는 반도체 패키지 리드 프레임 매거진의 자동 공급 및 회수 장치.The magazine according to claim 1, wherein the first linear conveying means is screwed to one of the first magazine supply conveyors, that is, a lead screw driven by a step motor from the inside where the magazine proceeds, so that the semiconductor package lead frame is loaded and supplied. A lift which receives the lift and lifts it vertically by the interval of the semiconductor frames arranged in layers; A pusher installed horizontally to pull out the semiconductor package lead frame loaded in the magazine; A pair of transfer rollers capable of lifting and lowering so that the upper roller is close to and spaced apart from the lower roller, and compresses the semiconductor package lead frame drawn by the pusher to move in the horizontal direction; The semiconductor package from the magazine transported by the magazine supply conveyor, which consists of a pusher which is moved up and down and horizontally by a pneumatic cylinder so as to transport the rear end portion of the semiconductor package lead frame transferred by the transport roller to the first rotational transport means. An apparatus for automatically supplying and retrieving a semiconductor package lead frame magazine, the method including drawing out lead frames sequentially.
  4. 청구항 1에 있어서, 제1,제2 매거진 회수용 컨베이어는 상기 매거진 공급용 컨베이어와 같은 폭 조절 수단이 구비되어 매거진 공급용 컨베이어와 함께 컨베이어의 폭을 조절할 수 있게 되면서, 매거진 공급용 컨베이어의 상부에 설치되는 이젝터에 의하여 반도체 패키지 리드 프레임이 추출된 매거진을 배출시키고, 상기 이젝터는 위치 조절 수단을 구비하고, 액추에이터에 의하여 반도체 패키지 리드 프레임이 배출된 매거진을 클램핑하여 승강 및 수평 이동시켜서 제1 매거진 회수용 컨베이어에 안착시키는 한 쌍의 핑거로 구성되는 것을 특징으로 하는 반도체 패키지 리드 프레임 매거진의 자동 공급 및 회수 장치.The method of claim 1, wherein the first and second magazine recovery conveyor is provided with a width adjusting means such as the magazine supply conveyor to adjust the width of the conveyor together with the magazine supply conveyor, the upper part of the magazine supply conveyor The magazine ejected from the semiconductor package lead frame is discharged by an ejector installed, and the ejector includes a position adjusting means, and clamps the magazine from which the semiconductor package lead frame is discharged by an actuator to lift and horizontally move the first magazine. A device for automatically supplying and retrieving a semiconductor package lead frame magazine, comprising a pair of fingers seated on a receiving conveyor.
  5. 청구항 1에 있어서 제1,제2 정렬 수단이 각각의 제1,제2 직선 이송 수단에 의하여 인출된 반도체 패키지 리드 프레임을 수납하는 수납대와, 가이드 레일에 슬라이딩 가능하게 놓여져서 스크류 샤프트에 의하여 이동하는 이동대에 설치되는 공압실린더에 의하여 진퇴 작동하는 푸셔로 구성되는 것을 특징으로 하는 반도체 패키지 리드 프레임 매거진의 자동 공급 및 회수 장치.The storage device of claim 1, wherein the first and second alignment means are slidably placed on the guide rail for receiving the semiconductor package lead frame drawn by the respective first and second linear transfer means, and are moved by a screw shaft. An automatic supply and retrieval apparatus for a semiconductor package lead frame magazine, comprising: a pusher that moves forward and backward by a pneumatic cylinder installed on a moving table.
  6. 청구항 1에 있어서, 제1,제2 회전 이송 수단이 상기 제1,제2 정렬 수단의 수납대 상부에 회전 가능하게 설치되고 서보모터로 회전 가능하게 설치되는 공압실린더와, 상기 공압실린더의 피스톤 로드에 설치되어 직선 왕복 이동하는 또 하나의 공압실린더에 의하여 반도체 패키지 리드 프레임을 클램핑하는 캐리어 핑거로 구성되는 것을 특징으로 하는 반도체 패키지 리드 프레임을 도금하기 위한 반도체 패키지 리드 프레임 매거진의 로딩 및 언로딩 장치.The pneumatic cylinder of claim 1, wherein the first and second rotational transfer means are rotatably installed on the upper sides of the first and second alignment means, and rotatably installed by a servo motor, and the piston rod of the pneumatic cylinder. Apparatus for loading and unloading a semiconductor package lead frame magazine for plating a semiconductor package lead frame, characterized in that it comprises a carrier finger clamping the semiconductor package lead frame by another pneumatic cylinder installed in the linear reciprocating movement.
  7. 청구항 1에 있어서, 제2 직선 이송 수단은 상기 제2정렬 수단에 의하여 정렬된 반도체 패키지 리드 프레임을 매거진에 적재시키기 위하여 수납대에 놓여진 반도체 패키지 리드 프레임을 밀어낼 수 있도록 공압실린더의 피스톤 로드에 설치되는 푸셔와, 상기 푸셔에 의하여 이송된 반도체 패키지 리드 프레임을 매거진에 근접시키기 위하여 상부의 로울러가 하부의 로울러에 근접하고 이격될 수 있도록 승강이동 가능하게 되어 푸셔에 의하여 인출되는 반도체 패키지 리드 프레임을 압착하여 수평 진행 방향으로 이송시키는 한 쌍의 이송 로울러와, 상기 이송 로울러로 이송된 반도체 패키지 리드 프레임이 매거진에 도달할 수 있도록 수평방향과 수직방향으로 설치되는 공압실린더에 의하여 수평이동 및 승강작동하여 반도체 패키지 리드 프레임의 후단부를 밀어서 이송시키는 푸셔와; 상기 푸셔에 의하여 공급되는 반도체 패키지 리드 프레임을 수납하기 위하여 상기 제2 매거진 공급용 컨베이어의 한편에서 스텝 모터로 구동하는 리드 스크루에 나사 결합되어 반도체 패키지 리드 프레임이 장전되지 아니한 상태로 공급되는 매거진을 받아서 층상으로 설치된 반도체 프레임의 간격만큼 수직 방향으로 올려주는 리프트로 구성되어 반도체 패키지 리드 프레임을 매거진에 적재시키게 되는 것을 특징으로 하는 반도체 패키지 리드 프레임을 도금하기 위한 반도체 패키지 리드 프레임 매거진의 자동 공급 및 회수 장치.The method according to claim 1, wherein the second linear transfer means is installed on the piston rod of the pneumatic cylinder to push the semiconductor package lead frame placed in the holder for loading the semiconductor package lead frame aligned by the second alignment means in the magazine. The pusher and the semiconductor package lead frame conveyed by the pusher to move up and down so that the upper roller is close to and spaced apart from the lower roller to press the semiconductor package lead frame drawn by the pusher. By a pair of transfer rollers for transporting in a horizontally advancing direction and a pneumatic cylinder installed in a horizontal direction and a vertical direction so that the semiconductor package lead frame transferred to the transport rollers reaches a magazine. Rear end of package leadframe And a pusher for pushing the transfer; In order to receive the semiconductor package lead frame supplied by the pusher, a screw is coupled to a lead screw driven by a step motor on one side of the second magazine supply conveyor to receive a magazine in which the semiconductor package lead frame is not loaded. A device for automatically supplying and retrieving a semiconductor package lead frame magazine for plating a semiconductor package lead frame, comprising: a lift configured to lift in a vertical direction by the interval of a layered semiconductor frame; .
  8. 청구항 3에 있어서, 리프트가 폭 조절 수단을 구비하며, 제1 매거진 공급용 컨베이어의 안쪽에 설치되어 이송된 매거진을 수납하여 반도체 패키지 리드 프레임이 순차적으로 이젝트될 수 있도록 반도체 패키지 리드 프레임이 적층된 간격만큼 주기적으로 상승하게 되는데, 제1 매거진 공급용 컨베이어와 제1 매거진 배출용 컨베이어 사이에서 수직으로 왕복이동하며 이젝트 단계별로 매거진을 주기적으로 상승시키고, 이젝트가 완료된 매거진을 제1 매거진 배출용 컨베이어에 운반하는 것을 특징으로 하는 반도체 패키지 리드 프레임 매거진의 자동 공급 및 회수 장치.The method according to claim 3, wherein the lift is provided with a width adjusting means, the semiconductor package lead frame is stacked so that the semiconductor package lead frame can be sequentially ejected by storing the conveyed magazine installed inside the first magazine supply conveyor Ascends periodically, the vertical reciprocating between the first magazine feed conveyor and the first magazine discharge conveyor, and periodically raise the magazine in the eject stage, and conveys the ejected magazine to the first magazine discharge conveyor Automatic supply and recovery of semiconductor package lead frame magazine, characterized in that.
  9. 청구항 3에 있어서, 리프트가 폭 조절 수단을 구비하며, 제1 매거진 공급용 컨베이어의 안쪽에서 매거진을 수납하여 이젝트 단계별로 상승하는 하부 리프트와, 반도체 패키지 리드 프레임이 완전히 이젝트된 매거진을 클램핑하여 제1 매거진 회수용 컨베이어에 이송시키는 상부 리프트를 포함하는 것을 특징으로 하는 반도체 패키지 리드 프레임 매거진의 자동 공급 및 회수 장치.The method of claim 3, wherein the lift is provided with a width adjusting means, the lower lift that rises in the ejecting step by receiving the magazine from the inside of the first magazine supply conveyor, and the semiconductor package lead frame is clamped to the first magazine by completely ejected Automatic supply and recovery of semiconductor package lead frame magazine, characterized in that it comprises a top lift for conveying to the magazine recovery conveyor.
PCT/KR2010/001508 2010-03-10 2010-03-10 Automatic loading and unloading apparatus for semiconductor package lead frame magazine WO2011111886A1 (en)

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CN107123587A (en) * 2016-09-23 2017-09-01 深圳市复德科技有限公司 Plasma cleaner
CN109727891A (en) * 2017-10-30 2019-05-07 三星电子株式会社 Semiconductor package part separator
CN111508860A (en) * 2019-09-12 2020-08-07 大连佳峰自动化股份有限公司 Compound loading attachment of semiconductor package chip mounter
CN112756282A (en) * 2020-12-25 2021-05-07 铜陵蓝盾丰山微电子有限公司 Automatic material receiving device for lead frame and working method thereof
CN114121736A (en) * 2022-01-28 2022-03-01 新恒汇电子股份有限公司 Double-sided film uncovering system of lead frame
CN116153847A (en) * 2023-04-14 2023-05-23 山东泰芯电子科技有限公司 Chip packaging clamping device

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Publication number Priority date Publication date Assignee Title
CN107123587A (en) * 2016-09-23 2017-09-01 深圳市复德科技有限公司 Plasma cleaner
CN109727891A (en) * 2017-10-30 2019-05-07 三星电子株式会社 Semiconductor package part separator
CN109727891B (en) * 2017-10-30 2023-05-05 三星电子株式会社 Semiconductor package separating device
CN111508860A (en) * 2019-09-12 2020-08-07 大连佳峰自动化股份有限公司 Compound loading attachment of semiconductor package chip mounter
CN112756282A (en) * 2020-12-25 2021-05-07 铜陵蓝盾丰山微电子有限公司 Automatic material receiving device for lead frame and working method thereof
CN114121736A (en) * 2022-01-28 2022-03-01 新恒汇电子股份有限公司 Double-sided film uncovering system of lead frame
CN116153847A (en) * 2023-04-14 2023-05-23 山东泰芯电子科技有限公司 Chip packaging clamping device

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