WO2014003284A1 - Vertical-type wafer transfer conveyor - Google Patents

Vertical-type wafer transfer conveyor Download PDF

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Publication number
WO2014003284A1
WO2014003284A1 PCT/KR2013/001410 KR2013001410W WO2014003284A1 WO 2014003284 A1 WO2014003284 A1 WO 2014003284A1 KR 2013001410 W KR2013001410 W KR 2013001410W WO 2014003284 A1 WO2014003284 A1 WO 2014003284A1
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WO
WIPO (PCT)
Prior art keywords
wafer
axis
cassette
rail
frame
Prior art date
Application number
PCT/KR2013/001410
Other languages
French (fr)
Korean (ko)
Inventor
송병호
Original Assignee
주식회사 엔제닉
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120069359A external-priority patent/KR101407485B1/en
Application filed by 주식회사 엔제닉 filed Critical 주식회사 엔제닉
Publication of WO2014003284A1 publication Critical patent/WO2014003284A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/12—Storage devices mechanical with separate article supports or holders movable in a closed circuit to facilitate insertion or removal of articles the articles being books, documents, forms or the like
    • B65G1/127—Storage devices mechanical with separate article supports or holders movable in a closed circuit to facilitate insertion or removal of articles the articles being books, documents, forms or the like the circuit being confined in a vertical plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Definitions

  • the present invention relates to a vertical type wafer transfer conveyor, and more particularly, a plurality of cassettes in which wafers are stored can be moved along a predetermined trajectory, and the required type and number of wafers can be taken out from the cassette, and a conventional cassette is in a transverse direction. It relates to a vertical wafer transfer conveyor that can be rotated in the longitudinal direction to exhibit the maximum effect in a minimum space.
  • Semiconductor devices are fabricated by performing various unit processes on semiconductor wafers. Since the unit process for manufacturing the semiconductor device is mainly performed in series, the wafer transfer is frequently performed in the unit process.
  • a tweezer is used to manually move a single wafer
  • an automatic transfer cart is used to move a wafer filled in a cassette in a lot unit to a furnace.
  • the wafers loaded into the equipment are generally moved by a robot arm to the chamber where the process will proceed.
  • a method of moving the wafer by placing the wafer on a conveyor belt there is a method of moving the wafer by placing the wafer on a conveyor belt.
  • a predetermined section of a closed curved conveyor belt moving at a constant speed is defined as a moving section, the wafer is loaded at one end of the moving section, and the wafer is transferred by unloading the wafer at the other end of the moving section.
  • 20 is a schematic diagram for explaining a conventional conveyor belt drive equipment.
  • the conventional conveyor belt driving device 10 includes a motor part 20 for generating a driving force for driving the conveyor belt 11 and a belt driving roller for driving the conveyor belt 11.
  • a belt driving roller part 30 is included.
  • the motor unit 20 is composed of a motor 21 and the gear box 22.
  • a driving pulley 23 is disposed on one surface of the gearbox 22.
  • the drive pulley 23 rotates when the motor 21 operates.
  • the belt drive roller unit 30 is composed of a first belt drive roller 31 and a second belt drive roller 32.
  • On one surface of the first belt drive roller 31 is disposed a driving pulley 33 independently having the same central axis as the central axis of the first belt drive roller (31).
  • the central axes of the first and second belt drive rollers 31 and 32 are rotatably fixed to the roller support 34.
  • the drive pulley 23 of the motor unit 20 and the driven pulley 33 of the belt drive roller unit 30 are connected by a chain 40.
  • the first belt driving roller 31 receives the driving force generated in the motor unit 20 by the chain 40.
  • the conveyor belt 11 is interposed between the first belt drive roller 31 and the second belt drive roller 32. As a result, when the first belt drive roller 31 is rotated, the conveyor belt 11 is moved.
  • the conventional conveyor belt driving apparatus as described above occupies an unnecessary space by being installed in the frame frame constituting the wafer transfer module in a transverse direction, thereby causing an unnecessary size of the entire wafer transfer module.
  • the cassette moved to the conventional conveyor belt driving apparatus as described above can be mounted only one type of wafer as it is moved in the lateral direction, for example, in the case of a wafer transfer module that selectively uses two types of wafers, the conveyor belt driving equipment There was a hassle to install two or stop the process in progress and replace the wafer with a new one.
  • an object of the present invention is to move a plurality of cassettes in which the wafers are stored along a predetermined trajectory and to export the required number and number of wafers from the cassette, the conventional cassette is It is to provide a vertical wafer transfer conveyor that can move the transverse direction in the longitudinal direction to exhibit the maximum effect in the minimum space.
  • the vertical type wafer transfer conveyor includes a pulley which is rotated by a motor and arranged up and down connected via a timing belt, and is connected to the timing belt and moved.
  • the cassette is mounted; and installed on the outside of the timing belt, the rail for guiding the cassette;
  • the cassette the main body on which the wafer is mounted; and side plates connected to both sides of the main body; and the rotatable coupled to the side plate, one side is coupled to the timing belt via a clamp, the other side tracking plate It characterized in that it comprises; a transfer unit connected to the rail via a.
  • the tracking plate is connected via the rail and the ball bearing as a medium, and the separation prevention block so as to prevent the departure from the rail; characterized in that it comprises a.
  • the storage means detachable to the cassette, the storage means for storing information about the wafer; and the sensor unit for sensing the information stored in the storage means and the position of the cassette; characterized in that it further comprises.
  • the plurality of cassettes in which the wafers are stored can be moved along a predetermined trajectory, and then the required type and number of wafers can be taken out from the cassettes. It can be rotated to achieve the maximum effect with minimum space.
  • FIG. 1 is a schematic flowchart of a wafer transfer module according to a preferred embodiment of the present invention.
  • FIG 2 is a front view of a wafer transfer module according to a preferred embodiment of the present invention.
  • FIG 3 is a perspective view of a wafer transfer module according to a preferred embodiment of the present invention.
  • Figure 4 is a perspective view of a state in which a vertical wafer transfer conveyor of the wafer transfer module according to an embodiment of the present invention is omitted.
  • FIG. 5 is a perspective view and a partially enlarged view of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
  • FIG. 6 is a front view of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
  • FIG. 7 is a side view of a vertical type wafer transfer conveyor in accordance with a preferred embodiment of the present invention.
  • FIG. 8 is a perspective view of a cassette of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
  • FIG. 9 is a front view of the cassette of the vertical type wafer transfer conveyor according to the preferred embodiment of the present invention.
  • FIG. 10 is a perspective view and a partially enlarged view of the pusher according to the preferred embodiment of the present invention.
  • 11 and 12 are side views showing the removal of the wafer with a pusher according to a preferred embodiment of the present invention.
  • FIG. 13 is a perspective view and a partially enlarged view of a gripper according to a preferred embodiment of the present invention.
  • FIG. 14 is a front view of a boat transfer according to a preferred embodiment of the present invention.
  • 15 is a perspective view of an elevator according to a preferred embodiment of the present invention.
  • 16 to 19 are state diagrams showing the state of moving the wafer to the wafer transfer module according to an embodiment of the present invention.
  • 20 is a conceptual diagram of a wafer transfer conveyor according to the prior art.
  • FIG. 1 is a schematic flowchart of transferring a wafer to a wafer transfer module according to a preferred embodiment of the present invention.
  • the present invention which will be described later, performs a process as shown in FIG.
  • the wafer transfer module includes all of the first to third processes to be described later.
  • the wafer is mounted in a cassette provided in a vertical type wafer transfer conveyor to be described later, and the wafer transfer conveyor is driven and loaded.
  • the wafer is removed from the cassette by using a wafer pusher to move the wafer stored in the cassette loaded as described above to the furnace, and the wafer thus removed is caught by the wafer gripper and moved to the boat transfer.
  • the wafer is then transferred to the elevator by boat transfer, then mounted in the elevator and lifted to move the wafer to the furnace, which is then moved to the next process in the furnace.
  • FIGS. 2 to 4 are a perspective view and a front view of a wafer transfer module according to a preferred embodiment of the present invention, as shown in Figures 2 to 4, the present invention is a vertical type wafer transfer conveyor 100, wafer The first process portion (a) consisting of the pusher 200, the wafer gripper 300, the second process portion (b) consisting of the boat transfer 400 and the third process portion (composing the elevator 500) c), and the wafer is sequentially moved by the first process portion (a), the second process portion (b), and the third process portion (c).
  • FIG. 5 is a perspective view and a partially enlarged view of a vertical wafer transfer conveyor according to a preferred embodiment of the present invention
  • FIG. 6 is a front view of a vertical wafer transfer conveyor according to a preferred embodiment of the present invention
  • FIG. A side view of a vertical type wafer transfer conveyor according to an embodiment is shown.
  • Vertical type wafer transfer conveyor 100 includes a pulley 110, a cassette 120 and a rail 130.
  • two pairs of pulleys 110 are formed in a vertical direction, and two sets of pairs of pulleys 110 are provided such that the pulleys 110 are symmetrical with each other.
  • the upper or lower pulleys are connected to each other via the rotation shaft 111 so as to be rotatable at the same time by the motor (M).
  • the pulley 110 as described above is connected to each other via a timing belt 120 and rotated at the same time, the rotation of any one of the pulley motor of the pair of pulleys (110) paired in the vertical direction ( M) is installed, the rotation of the motor (M) is transmitted to the timing belt 120, the other one pulley is rotated.
  • the timing belt 120 as described above has grooves of equal intervals on the inner circumferential surface so as to be precisely engaged with the pulleys 110 having equally spaced grooves like gears, the timing belt 120 can accurately transmit rotation, but is preferably made of rubber When made of rubber material, the tension may be changed, so it may be made of metal chain.
  • timing belt 120 is connected to the cassette 140 via a clamp 141 to rotate the cassette 140 in a constant trajectory, as shown in a partially enlarged view of FIG. 5.
  • the clamp 141 is fixed to the groove formed in the inner peripheral surface of the timing belt 120.
  • the cassette 140 includes a main body 150 on which the wafer 1 is mounted and a transfer unit 160 provided on both sides of the main body 150.
  • the transfer unit 160 is connected to the timing belt 120 and the rail 130 on one side and the other side in a state in which the transfer unit 160 is rotatably installed on the main body 150 so that the warpage does not occur.
  • the main body 150 includes a pair of plates 151 and a plurality of connecting rods 152 connecting the plates 151 to each other, and the connecting rods 152 may include a plurality of wafers 1 to be inserted therein.
  • the insertion groove 153 is formed.
  • FIG. 8 shows that the connecting rods 152 are paired two by six, and the lower two connecting rods support the lower side of the wafer when the wafer 1 is inserted in the upright state.
  • Four connecting rods support the left and right sides of the wafer, respectively.
  • the lower two connecting rods are spaced apart from each other by a predetermined distance.
  • the reason for the separation is that the wafer pusher 200, which will be described later, enters between the lower two connecting rods to remove the wafer 1 stored in the cassette 140. To make it work.
  • the transfer unit 160 is a member connected to both the timing belt 120 and the rail 130, the transfer unit 160 is rotatably connected to the side plate 162, such a transfer unit 160
  • a clamp 141 is formed at one side and a tracking plate 163 is formed at the other side with respect to the rotation center of the center.
  • the clamp 141 is a timing belt 120.
  • the tracking plate 163 is connected to the rail 130, respectively.
  • the tracking plate 161 is moved along the rail 130, so the tracking plate 163 is a rail 130 and a ball bearing ( 162 is connected via a medium, it is preferable that the departure prevention block 164 is provided to prevent the departure from the rail (130).
  • the rail 130 is a member installed outside the timing belt 120 described above, and the rail 130 is generally made of a metal material.
  • the rail 130 is connected to the tracking plate 163 and serves to guide the cassette 140 moved by the timing belt 120.
  • the cassettes may be moved along the timing belt 120 and the rail 130 having different sized trajectories. 140) does not tilt or flip upside down.
  • Vertical type wafer transfer conveyor 100 according to a preferred embodiment of the present invention as described above can be installed in a narrow space because the cassette 140 is rotated in the vertical direction along the timing belt 120 and the rail 130. Therefore, space utilization can be improved.
  • FIGS. 11 and 12 are side views showing a state of removing a wafer with a wafer pusher according to a preferred embodiment of the present invention.
  • the wafer pusher 200 to be described later is installed adjacent to the vertical type wafer transfer conveyor 100 described above, the wafer pusher 200 is a wafer stored in the cassette 140 It serves to remove the wafer 1 from the cassette 140 by pushing (1) to the upper portion, and is not limited to the vertical type wafer transfer conveyor 100 because it can be used in various places.
  • the wafer pusher 200 includes an X-axis frame 210, an X-axis moving unit 220, a Y-axis frame 230, a Z-axis frame 240, and a separation unit 250. do.
  • the X-axis frame 210 is a member installed adjacent to the lower portion of the vertical type wafer transfer conveyor 100 described above, such an X-axis frame 210 is a skeleton of the wafer transfer module, as shown in FIG. It is connected to the frame frame forming a 10.
  • the X-axis frame 210 is formed with an X-axis rail 211 along the longitudinal direction, the X-axis rail 211 is connected to the X-axis moving unit 220, the X-axis moving unit 220 ) Includes an X-axis moving bracket 221 coupled to the X-axis rail 211 and moved in the X-axis direction.
  • the Y-axis frame 230 is a member that is connected to the X-axis moving unit 220 to move in the X-axis direction, the Y-axis frame 230 is installed perpendicular to the X-axis frame 210.
  • the Y-axis frame 230, the Y-axis rail 231 is formed along the longitudinal direction, the Y-axis rail 231 is coupled to the Y-axis moving bracket 232, such a Y-axis moving bracket 232 ) Is connected to the Z-axis frame 240 to move the Z-axis frame 240 in the Y-axis direction.
  • the Z-axis frame 240 is a member which is connected to the Y-axis moving bracket 232 coupled to the Y-axis rail 231 and moved along the Y-axis frame 230.
  • the Z-axis frame 240 is formed with a Z-axis rail 241 along the longitudinal direction, the Z-axis rail 241 is connected to the Z-axis moving bracket 242 to be moved in the Z-axis direction, this The separation unit 250 to be described later is connected to the Z-axis moving bracket 242.
  • the separating part 250 is a member that is connected to and moved up and down in accordance with the driving pattern of the Z-axis moving bracket 242 by connecting the Z-axis frame 240 and the Z-axis moving bracket 242 as described above. As shown in FIG. 10 to FIG. 12, the pair of upper and lower posts 251, the finger blocks 252, and the finger members 253 are included.
  • the pair of upper and lower posts 251 is connected to the Z-axis moving bracket 242, as shown in Figures 10 to 12, and extends to the upper side (Z-axis direction), such a pair of upper and lower posts (
  • the finger block 252 is connected to the upper portion of the 251, the finger member 253 is installed in the vertical direction (Z-axis direction) on the finger block 252.
  • the finger block 252 is fixed to the upper and lower posts 251, and fixed to the fixed block 254, and the finger member 253. It is composed of a removable block 255 is installed, accordingly, it is easy to replace with a new removable block 255 when the finger member 253 is worn or broken.
  • the finger blocks 252 may push the wafer 1 stored in the cassette 140 upward when the Z-axis movement bracket 242 rises after approaching the lower portion of the cassette 140 described above. It is preferable to have a separation distance less than the separation distance between the two connecting rods 152 on the lower side of the cassette 140.
  • the finger member 253 is a member in which a plurality of fingers 266 are arranged in a line along an upper surface of the finger block 252, and is inserted in the cassette 140 described above between the plurality of fingers 266.
  • the wafer 1 is fitted.
  • Finger 256 as described above is preferably made of a ceramic (Ceramic) or quartz (Quartz) material to prevent damage to the wafer, and is formed in the shape of a pencil, the head 257, the body (from the top) 258 and the lower end 259.
  • the head portion 257 is formed in a conical shape to facilitate the entry of the wafer 1, the body portion 258 is connected to the lower portion of the head portion 257 in a rod shape, the lower end 259 is rod-shaped Is formed, but is connected to the finger block 252 with a cross section smaller than the cross section of the body portion 258.
  • the chip generated while the wafer 1 is inserted into the finger 256 is lowered, more specifically, the lower end 259. It serves to discharge smoothly to the gap between, accordingly, the upper surface of the finger block 252 (upper surface of the removable block) inclined surface (chip) discharged from the lower end of the finger 256 to move smoothly ( 260 is preferably formed.
  • FIG. 13 is a perspective view and a partially enlarged view of a wafer gripper according to a preferred embodiment of the present invention.
  • the wafer gripper 300 to be described later is installed adjacent to the upper portion of the above-described wafer pusher 200, the wafer gripper 300 is a wafer (stored in the cassette 140) In the state in which 1) is lifted up to the wafer pusher 200, the wafer 1 is moved to the outside of the vertical type wafer transfer conveyor 100 and then moved to the boat transfer 400 to be described later.
  • the wafer gripper 300 as described above may not be limited to the vertical wafer pusher 200 since it may be used in various places.
  • the wafer gripper 300 includes an X axis frame 310, an X axis moving unit 320, a Z axis frame 330, a Y axis frame 340, and a towing unit 350. do.
  • the X-axis frame 310 is a member installed on the wafer pusher 200, the X-axis frame 310 as shown in Figure 4, the X-axis frame 210 of the above-described wafer pusher 200 It is connected to the frame (10) forming the skeleton of the wafer transfer module in the same way.
  • the X-axis frame 310 is formed with an X-axis rail 311 along the longitudinal direction, the X-axis rail 311 is connected to the X-axis moving unit 320, the X-axis moving unit 320 The X-axis moving bracket 321 coupled to the X-axis rail 311 is moved in the X-axis direction is included.
  • a Z-axis guide bracket 322 protrudes from the X-axis movement bracket 321 in the Y-axis direction, and the Z-axis guide bracket 322 is connected to the Z-axis frame 330 to move up and down.
  • the Z-axis rail 331 is provided on the Z-axis frame 330 so that movement in the vertical direction (Z-axis direction) is secured while the Z-axis frame 330 is connected to the Z-axis guide bracket 322. Is formed.
  • the Y-axis frame 340 is a member connected to the lower portion of the above-described Z-axis frame 330 perpendicular to the X-axis frame 310, the Y-axis frame 340 is a connecting bracket 341
  • the fixed frame 342 and the moving frame 343 are included, and the towing unit 350 includes a first grip part 360 and a second grip part 370.
  • the Y-axis frame 340 is a member that is moved in the Y-axis direction so that the traction unit 350 can hold the wafer, the traction unit 350 is the wafer 1 in the state that the Y-axis frame 340 is moved It is a member that plays a role.
  • the connecting bracket 341 is a member connected to the Z-axis frame 330, and a fixed frame 342 is connected to a lower portion of the connecting bracket 341.
  • a lower portion of the fixed frame 342 is connected to the moving frame 343 which is moved in the Y-axis direction, the fixed frame 342 and the moving frame 343 is connected via a separate moving unit 344 Accordingly, a rail (not shown) may be formed on the bottom surface of the fixed frame 342.
  • the first Y-axis rail 345 is formed along the longitudinal direction of the movable frame 343, and the Y-axis first unit 345 is connected to the Y-axis moving unit 346 to move from side to side.
  • the first grip part 360 of the traction part 350 is connected to the moving frame 343, and the first grip part 360 includes a movable plate 361 and a first holder 362. As shown in FIG. 13, the movable plate 361 extends in the Y-axis direction while being fixed to the lower surface of the movable frame 343, and a first holder 362 is disposed below the movable plate 361. Is formed.
  • a second grip part 370 is connected to the Y-axis moving unit 346, and the second grip part 370 may include the movable plate 3 so that interference does not occur when the movable plate 361 is driven in the Y-axis direction.
  • 361 is preferably connected via a separate plate 371 extending in the X-axis direction.
  • the second grip portion 370 is provided with a movable groove 372 to prevent the interference with the movable plate 361 and to move the movable plate 361 is inserted, the second holder 373 in the lower portion ) Is moved in the Y-axis direction according to the movement pattern of the Y-axis movement unit 346.
  • the first grip part 360 as described above is the second grip part 370 of the Y-axis moving unit when the moving frame 343 is moved to the upper part of the separation part 250 of the wafer pusher 200.
  • the wafer 1 is held while approaching the grip 360.
  • first holder 362 and the second holder 373 are extended blocks 380 provided in the first holder 362 and the second holder 373, respectively, as shown in a partially enlarged view of FIG. 13.
  • a finger member 381 which is installed to face each other on one side of the extension block 380, wherein the fingers 382 are arranged in a line along the length direction.
  • the finger 382 is a member that presses and grips the side surface while the wafer 1 is upright, two or more lines are provided to prevent the wafer from being rotated to one side while the wafer 1 is fitted to the finger 382. desirable.
  • the first entry portion into which the wafer 1 enters to fit the wafer 3 smoothly into the finger 382 may be manufactured in a conical shape.
  • the support surface 383 is formed below the finger member 381 so as to support the lower surface of the standing wafer 1.
  • the finger 382 is made of the same ceramic or quartz material as the finger 256 of the wafer pusher 200 described above, and the finger member 381 may be easily replaced when the finger 382 is worn or damaged. Is preferably detached from the extension block 380.
  • a pressure spring 384 may be installed between the finger member 381 and the extension block 380, as shown in the partially enlarged view of FIG.
  • the pressure spring 384 as described above may be provided with an elastic force when pressing the wafer 1 that is erected using the first holder 362 and the second holder 373, thereby more firmly fixing the wafer 1. .
  • both sides of the wafer 1 lifted by the wafer pusher 200 are held by the fingers 382, and at the same time, the lower side of the wafer 1 is supported by the support surface 383. It can be characterized by holding the wafer 1 stably at three points except the upper side of the wafer by supporting it.
  • the pressing force of the pressure spring 384 can hold the wafer 1 more firmly.
  • the boat transfer 400 receives the wafer 1 moved by the wafer pusher 200 and the wafer gripper 300 described above to the elevator 500 to be described later. It serves to convey.
  • the boat transfer 400 as described above includes a boat 410 on which a wafer is seated, a transfer unit 420 for moving the boat 410 to the elevator 500, and the transfer unit 420 to the elevator 500. It is composed of a horizontal frame 430 that serves as a moving rail, the boat 410, as shown in Figure 21, the wafer 1 in turn by the wafer gripper 300, the boat 410 in turn from one side Is loaded on.
  • the transfer unit 420 may be lifted along the horizontal frame 430. It will be moved to 500.
  • the elevator 500 serves to receive the boat 410 of the boat transfer 400 described above and deliver it to the furnace.
  • Elevator 500 as described above is installed in the frame frame 10 of the wafer transfer module in the vertical direction, a pair of Z-axis frame 510 is provided with a Z-axis rail 511, the Z-axis frame 510 Z-axis moving unit 520 connected to each other, a fixed frame 530 connected to the Z-axis moving unit 520 in the Y-axis direction, and connected to the fixed frame 530 to move in the Y-axis direction Y-axis frame 540 is provided.
  • a Y-axis rail 541 is formed in the Y-axis frame 540, the Y-axis rail 541 is connected to the fixed frame 540 so that the Y-axis frame 540 is moved in the Y-axis direction
  • the Y axis moving unit 550 is formed.
  • the Y-axis frame 540 and the Z-axis moving unit 510 coupled with the boat 410 are each preferably driven by a power source (eg, a servo motor).
  • the elevator 500 according to the preferred embodiment allows the synchronous control when moving the Z-axis, the left, right horizontal and tilt control of the boat 410 when moving the Y-axis.
  • the operator puts the wafer 1 upright in the cassette 140.
  • the worker attaches a storage means (not shown) to the cassette 140, the storage means may be stored the history of the type of wafer 1, the production site, the production company, the production date.
  • the storage means as described above may be made of a bar code printed sticker, it may be made of an RFID card, such storage means is a sensor unit (S) provided in the vertical type wafer transfer conveyor 100 shown in FIG. It can be detected by, and the detected information of the storage means may be transmitted to a controller (not shown).
  • S sensor unit
  • control unit serves to move the plurality of cassettes 140 that are moved along the timing belt 120 and the rail 130, and the wafer pusher 200 holds the wafer 1 stored in the cassette 140.
  • the process of raising, the process of holding the wafer 1 lifted by the wafer pusher 200 with the wafer gripper 300, and the wafer 1 caught with the wafer gripper 300 are moved to the boat transfer 400 to the elevator 500.
  • the process of moving and the process of moving the wafer 1 moved to the elevator 500 to a furnace may be performed.
  • the amount, type, etc. of the wafer required for the furnace can be determined based on the information of the wafer 1 stored in the controller.
  • the cassette 140 moved along the rail 130 is detached from the wafer 1 stored in the cassette 140 by the wafer pusher 200 at a predetermined position.
  • Figures 11 to 12 and 16 show how the stored wafer is removed.
  • the procedure for detaching and removing the wafer 1 stored in the cassette 140 by the wafer pusher 200 is as follows.
  • the position (XY, Z coordinate) of the cassette 140 is sensed, and the X-axis moving unit 221 is moved along the X-axis rail 211, and then the Y-axis moving unit (down to the lower side of the cassette 140)
  • the Z-axis frame 240 is moved along the 231.
  • the Z-axis moving unit 242 is raised in the state in which the Z-axis frame 240 is moved.
  • the finger member 253 enters the lower portion of the cassette 140 to move the wafer 1 to the cassette 140.
  • the wafer 1 detached from the cassette 140 by the wafer pusher 200 receives the towing unit 350 of the wafer gripper 300, and the towing unit 350 is transferred to the wafer 1.
  • a brief description will be given of the order in which the wafer 1 is received.
  • the position (X, Y, Z coordinate) of the wafer 1 is removed by the finger member 253 of the wafer pusher 200, and the X-axis moving unit 321 is the X-axis rail 311 Next, the moving frame 343 is moved in the Y-axis direction.
  • first grip part 360 and the second grip part 370 may be moved in a state in which the first grip part 360 and the second grip part 370 do not collide with the wafer 1.
  • the Z axis frame 330 is lowered along the Z axis guide bracket 322.
  • the Y-axis moving unit 340 is driven to press both sides of the wafer 1 stored in the wafer pusher 200.
  • the wafer pusher 200 is moved to an initial position and exits the outside of the vertical type wafer transfer conveyor 100, and the wafer gripper 300 is moved in the Y-axis direction to the outside of the vertical type wafer transfer conveyor 100.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

According to the present invention as described above, the required type and number of wafers can be discharged from multiple cassettes while the cassettes in which the wafers are stored are moved along a fixed trajectory, and the cassettes, which are moved in the horizontal direction in the related art, are rotated in a longitudinal direction so that maximum effects can be achieved with minimum space.

Description

버티컬 타입 웨이퍼 이송 컨베이어Vertical type wafer transfer conveyor
본 발명은 버티컬 타입 웨이퍼 이송 컨베이어에 관한 것으로서, 더 상세하게는 웨이퍼가 보관된 다수의 카세트가 정해진 궤적을 따라 이동되다가 필요한 종류와 갯수의 웨이퍼를 카세트로부터 반출할 수 있으며, 종래의 카세트가 횡방향으로 이동하는 것을 종방향으로 회전되도록 하여 최소한의 공간으로 최대의 효과를 발휘할 수 있는 버티컬 타입 웨이퍼 이송 컨베이어에 관한 것이다.The present invention relates to a vertical type wafer transfer conveyor, and more particularly, a plurality of cassettes in which wafers are stored can be moved along a predetermined trajectory, and the required type and number of wafers can be taken out from the cassette, and a conventional cassette is in a transverse direction. It relates to a vertical wafer transfer conveyor that can be rotated in the longitudinal direction to exhibit the maximum effect in a minimum space.
본 발명은 2012년 06월 27일 출원된 한국특허출원 제10-2012-0069359호의 출원일의 이익을 주장하며, 그 내용 전부는 본 명세서에 포함된다.The present invention claims the benefit of the filing date of Korean Patent Application No. 10-2012-0069359, filed June 27, 2012, the entire contents of which are incorporated herein.
반도체 소자는 반도체 웨이퍼를 다양한 단위공정을 수행함으로써 제조되어 진다. 상기한 반도체 소자의 제조를 위한 단위공정은 주로 일련적으로 이루어지기 때문에 상기 단위공정의 수행에서는 웨이퍼의 이송이 빈번하게 이루어진다.Semiconductor devices are fabricated by performing various unit processes on semiconductor wafers. Since the unit process for manufacturing the semiconductor device is mainly performed in series, the wafer transfer is frequently performed in the unit process.
상기와 같은 웨이퍼를 이동하는 방법은 여러가지가 있다. 통상적으로, 낱장의 웨이퍼를 작업자가 수동으로 이동시킬 때는 트위저(Tweezer)를 사용하고, 롯트(lot) 단위로 카셋트에 채워진 웨이퍼를 퍼니스로 이동할 때에는 자동 반송 대차를 이용한다.There are many ways to move such wafers. In general, a tweezer is used to manually move a single wafer, and an automatic transfer cart is used to move a wafer filled in a cassette in a lot unit to a furnace.
장비로 로딩된 웨이퍼들은 일반적으로, 로봇 암(robot arm)에 의해 공정이 진행될 챔버로 이동하게 된다.The wafers loaded into the equipment are generally moved by a robot arm to the chamber where the process will proceed.
한편, 웨이퍼를 컨베이어 벨트(conveyer belt) 위에 둠으로써 웨이퍼를 이동시키는 방법이 있다. 이 방법은 일정한 속도로 이동하고 있는 폐곡선형 컨베이어 벨트의 소정 구간을 이동구간으로 정의하고, 상기 이동구간의 일단에 웨이퍼를 로딩하고, 상기 이동구간의 타단으로 웨이퍼를 언로딩 함으로써 웨이퍼를 이송한다.On the other hand, there is a method of moving the wafer by placing the wafer on a conveyor belt. In this method, a predetermined section of a closed curved conveyor belt moving at a constant speed is defined as a moving section, the wafer is loaded at one end of the moving section, and the wafer is transferred by unloading the wafer at the other end of the moving section.
도 20은 종래의 컨베이어 벨트 구동 장비를 설명하기 위한 개략도이다.20 is a schematic diagram for explaining a conventional conveyor belt drive equipment.
도 20을 참조하면, 종래의 컨베이어 벨트 구동 장비(10)는 컨베이어 벨트(11)를 구동하는 구동력을 발생시키는 모터부(Motor part)(20) 및 상기 컨베이어 벨트(11)를 구동하는 벨트 구동 롤러부(belt driving roller part)(30)를 포함한다.Referring to FIG. 20, the conventional conveyor belt driving device 10 includes a motor part 20 for generating a driving force for driving the conveyor belt 11 and a belt driving roller for driving the conveyor belt 11. A belt driving roller part 30 is included.
상기 모터부(20)는 모터(21)와 기어박스(22)로 구성된다. 상기 기어박스(22)의 일면에는 구동 도르래(driving pulley)(23)가 배치된다. 상기 구동 도르레(23)는 상기 모터(21)가 작동하면 회전한다. 상기 벨트 구동 롤러부(30)는 제1벨트 구동 롤러(31) 및 제2벨트 구동 롤러(32)로 구성된다. 상기 제1벨트 구동 롤러(31)의 일면에는 상기 제1벨트 구동 롤러(31)의 중심축과 같은 중심축을 갖는 종동 도르래(dependently driving pulley)(33)가 배치된다. 상기 제1 및 제2벨트 구동 롤러(31,32)들의 중심축은 롤러 지지대(34)에 회전할 수 있게 고정된다.The motor unit 20 is composed of a motor 21 and the gear box 22. A driving pulley 23 is disposed on one surface of the gearbox 22. The drive pulley 23 rotates when the motor 21 operates. The belt drive roller unit 30 is composed of a first belt drive roller 31 and a second belt drive roller 32. On one surface of the first belt drive roller 31 is disposed a driving pulley 33 independently having the same central axis as the central axis of the first belt drive roller (31). The central axes of the first and second belt drive rollers 31 and 32 are rotatably fixed to the roller support 34.
상기 모터부(20)부의 구동 도르래(23)와 상기 벨트 구동 롤러부(30)의 종동 도르래(33)는 체인(chain)(40)에 의해 연결된다. 상기 체인(40)에 의해 상기 모터부(20)에서 발생하는 구동력을 상기 제1 벨트 구동 롤러(31)가 전달 받게 된다. 상기 제1 벨트 구동 롤러(31)와 상기 제2 벨트 구동 롤러(32) 사이에 상기 컨베이어 벨트(11)가 개재된다. 그 결과, 상기 제1 벨트 구동 롤러(31)가 회전하게 되면, 상기 컨베이어 벨트(11)는 이동하게 된다.The drive pulley 23 of the motor unit 20 and the driven pulley 33 of the belt drive roller unit 30 are connected by a chain 40. The first belt driving roller 31 receives the driving force generated in the motor unit 20 by the chain 40. The conveyor belt 11 is interposed between the first belt drive roller 31 and the second belt drive roller 32. As a result, when the first belt drive roller 31 is rotated, the conveyor belt 11 is moved.
그러나, 상기와 같은 종래의 컨베이어 벨트 구동 장비는 웨이퍼 이송모듈을 이루는 골조프레임의 내부에 횡방향으로 설치됨으로 인하여 불필요한 공간을 차지하므로 웨이퍼 이송모듈 전체의 크기가 불필요하게 커지는 문제점이 있었다.However, the conventional conveyor belt driving apparatus as described above occupies an unnecessary space by being installed in the frame frame constituting the wafer transfer module in a transverse direction, thereby causing an unnecessary size of the entire wafer transfer module.
또한, 상기와 같은 종래의 컨베이어 벨트 구동장비로 이동되는 카세트는 횡방향으로 이동됨에 따라 1종류의 웨이퍼만 탑재가 가능하므로 예컨대 2종류의 웨이퍼를 선택적으로 사용하는 웨이퍼 이송모듈의 경우 컨베이어 벨트 구동 장비를 2개 설치하거나, 진행중인 공정을 멈추고 웨이퍼를 새로운 것으로 교체해야 하는 번거로움이 있었다.In addition, since the cassette moved to the conventional conveyor belt driving apparatus as described above can be mounted only one type of wafer as it is moved in the lateral direction, for example, in the case of a wafer transfer module that selectively uses two types of wafers, the conveyor belt driving equipment There was a hassle to install two or stop the process in progress and replace the wafer with a new one.
본 발명은 상술한 문제점을 해결하고자 안출된 것으로서, 본 발명의 목적은 웨이퍼가 보관된 다수의 카세트가 정해진 궤적을 따라 이동되다가 필요한 종류와 갯수의 웨이퍼를 카세트로부터 반출할 수 있으며, 종래의 카세트가 횡방향으로 이동하는 것을 종방향으로 회전되도록 하여 최소한의 공간으로 최대의 효과를 발휘할 수 있는 버티컬 타입 웨이퍼 이송 컨베이어를 제공하는 것이다.The present invention has been made to solve the above-described problems, an object of the present invention is to move a plurality of cassettes in which the wafers are stored along a predetermined trajectory and to export the required number and number of wafers from the cassette, the conventional cassette is It is to provide a vertical wafer transfer conveyor that can move the transverse direction in the longitudinal direction to exhibit the maximum effect in the minimum space.
또한, 카세트에 보관되는 웨이퍼의 이력이 담긴 저장수단을 카세트에 부착하고, 이를 감지하는 센서부가 구비됨으로 인하여 카세트에 서로 다른 종류의 웨이퍼를 보관할 수 있으므로 1개의 장비로 2개 이상의 장비가 설치된 효과를 얻을 수 있는 버티컬 타입 웨이퍼 이송 컨베이어를 제공하는 것이다.In addition, by attaching a storage means containing the history of the wafers stored in the cassette to the cassette, and the sensor unit for detecting this can be stored in different cassettes in the cassette, so one or more equipment is installed with one device. It is to provide a vertical wafer transfer conveyor that can be obtained.
또한, 웨이퍼 또는 카세트의 오작동시 같은 종류의 웨이퍼가 보관된 카세트를 로딩하여 대체함으로서 문제를 해결하므로 웨이퍼를 퍼니스로 이송하는 효율을 꾸준히 유지할 수 있는 버티컬 타입 웨이퍼 이송 컨베이어를 제공하는 것이다.In addition, in order to solve the problem by loading and replacing the cassette of the same kind of wafer is stored in the case of malfunction of the wafer or cassette to provide a vertical type wafer transfer conveyor that can maintain the efficiency of transferring the wafer to the furnace.
상기와 같은 문제점을 해결하기 위해 본 발명에 따른 버티컬 타입 웨이퍼 이송 컨베이어는, 모터에 의해 회전되며, 타이밍벨트를 매개로 연결되는 상하로 배치되는 풀리;와, 상기 타이밍벨트에 연결되어 이동되며, 웨이퍼가 장착되는 카세트;와, 상기 타이밍벨트의 외측에 설치되며, 상기 카세트를 가이드 하는 레일;이 포함되는 것을 특징으로 한다.In order to solve the above problems, the vertical type wafer transfer conveyor according to the present invention includes a pulley which is rotated by a motor and arranged up and down connected via a timing belt, and is connected to the timing belt and moved. The cassette is mounted; and installed on the outside of the timing belt, the rail for guiding the cassette;
또한, 상기 카세트는, 웨이퍼가 장착되는 본체;와, 상기 본체의 양측에 연결되는 측판;과, 상기 측판에 회전되도록 결합되되, 일측은 클램프를 매개로 상기 타이밍벨트와 결합되며, 타측은 트랙킹 플레이트를 매개로 상기 레일과 연결되는 이송유닛;이 포함되는 것을 특징으로 한다.In addition, the cassette, the main body on which the wafer is mounted; and side plates connected to both sides of the main body; and the rotatable coupled to the side plate, one side is coupled to the timing belt via a clamp, the other side tracking plate It characterized in that it comprises; a transfer unit connected to the rail via a.
또한, 상기 트랙킹 플레이트는 상기 레일과 볼베어링을 매개로 연결되고, 상기 레일에서 이탈이 방지되도록 이탈방지블럭;이 포함되는 것을 특징으로 한다.In addition, the tracking plate is connected via the rail and the ball bearing as a medium, and the separation prevention block so as to prevent the departure from the rail; characterized in that it comprises a.
또한, 상기 카세트에 탈착되며, 웨이퍼에 대한 정보가 보관되는 저장수단;과, 상기 저장수단에 보관된 정보와 상기 카세트의 위치를 감지하는 센서부;가 더 포함되는 것을 특징으로 한다.In addition, the storage means detachable to the cassette, the storage means for storing information about the wafer; and the sensor unit for sensing the information stored in the storage means and the position of the cassette; characterized in that it further comprises.
이상 상술한 바와 같은 본 발명에 의하면, 웨이퍼가 보관된 다수의 카세트가 정해진 궤적을 따라 이동되다가 필요한 종류와 갯수의 웨이퍼를 카세트로부터 반출할 수 있으며, 종래의 카세트가 횡방향으로 이동하는 것을 종방향으로 회전되도록 하여 최소한의 공간으로 최대의 효과가 있다.According to the present invention as described above, the plurality of cassettes in which the wafers are stored can be moved along a predetermined trajectory, and then the required type and number of wafers can be taken out from the cassettes. It can be rotated to achieve the maximum effect with minimum space.
또한, 카세트에 보관되는 웨이퍼의 이력이 담긴 저장수단을 카세트에 부착하고, 이를 감지하는 센서부가 구비됨으로 인하여 카세트에 서로 다른 종류의 웨이퍼를 보관할 수 있으므로 1개의 장비로 2개 이상의 장비가 설치된 효과를 얻을 수 있는 장점이 있다.In addition, by attaching a storage means containing the history of the wafers stored in the cassette to the cassette, and the sensor unit for detecting this can be stored in different cassettes in the cassette, so one or more equipment is installed with one device. There is an advantage that can be obtained.
또한, 웨이퍼 또는 카세트의 오작동시 같은 종류의 웨이퍼가 보관된 카세트를 로딩하여 대체함으로서 문제를 해결하므로 웨이퍼를 퍼니스로 이송하는 효율을 꾸준히 유지할 수 있는 장점이 있다.In addition, there is an advantage in that the efficiency of transporting the wafer to the furnace can be maintained since the problem is solved by loading and replacing a cassette in which the same kind of wafer is stored when the wafer or the cassette malfunctions.
도 1은 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈의 개략적인 플로우챠트이다.1 is a schematic flowchart of a wafer transfer module according to a preferred embodiment of the present invention.
도 2는 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈의 정면도이다.2 is a front view of a wafer transfer module according to a preferred embodiment of the present invention.
도 3은 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈의 사시도이다.3 is a perspective view of a wafer transfer module according to a preferred embodiment of the present invention.
도 4는 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈 중 버티컬 타입 웨이퍼 이송 컨베이어가 생략된 상태의 사시도이다.Figure 4 is a perspective view of a state in which a vertical wafer transfer conveyor of the wafer transfer module according to an embodiment of the present invention is omitted.
도 5는 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 사시도 및 부분확대도이다.5 is a perspective view and a partially enlarged view of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
도 6은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 정면도이다.6 is a front view of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
도 7은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 측면도이다.7 is a side view of a vertical type wafer transfer conveyor in accordance with a preferred embodiment of the present invention.
도 8은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 카세트의 사시도이다.8 is a perspective view of a cassette of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
도 9는 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 카세트의 정면도이다.9 is a front view of the cassette of the vertical type wafer transfer conveyor according to the preferred embodiment of the present invention.
도 10은 본 발명의 바람직한 실시예에 따른 푸셔의 사시도 및 부분확대도이다.10 is a perspective view and a partially enlarged view of the pusher according to the preferred embodiment of the present invention.
도 11와 도 12는 본 발명의 바람직한 실시예에 따른 푸셔로 웨이퍼를 탈거하는 모습을 보인 측면도이다.11 and 12 are side views showing the removal of the wafer with a pusher according to a preferred embodiment of the present invention.
도 13은 본 발명의 바람직한 실시예에 따른 그립퍼의 사시도 및 부분확대도이다.13 is a perspective view and a partially enlarged view of a gripper according to a preferred embodiment of the present invention.
도 14는 본 발명의 바람직한 실시예에 따른 보트 트랜스퍼의 정면도이다.14 is a front view of a boat transfer according to a preferred embodiment of the present invention.
도 15는 본 발명의 바람직한 실시예에 따른 엘리베이터의 사시도이다.15 is a perspective view of an elevator according to a preferred embodiment of the present invention.
도 16 내지 도 19는 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈로 웨이퍼를 이동하는 모습을 보인 상태도이다.16 to 19 are state diagrams showing the state of moving the wafer to the wafer transfer module according to an embodiment of the present invention.
도 20은 종래기술에 따른 웨이퍼 이송 컨베이어의 개념도이다.20 is a conceptual diagram of a wafer transfer conveyor according to the prior art.
이하, 첨부된 도면을 참조하여, 본 발명의 실시예들을 설명하기로 한다. 각 도면에 제시된 동일한 부호는 동일한 부재를 나타낸다. 본 발명을 설명함에 있어, 관련된 공지 기능 혹은 구성에 관한 구체적인 설명은 본 발명의 요지를 모호하지 않게 하기 위하여 생략한다.Hereinafter, with reference to the accompanying drawings, it will be described embodiments of the present invention. Like reference numerals in the drawings denote like elements. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the subject matter of the present invention.
도 1은 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈로 웨이퍼를 이송하는 개략적인 플로우차트로서, 후술할 본 발명은 도 1에 도시된 바와 같은 순서의 공정을 수행한다.FIG. 1 is a schematic flowchart of transferring a wafer to a wafer transfer module according to a preferred embodiment of the present invention. The present invention, which will be described later, performs a process as shown in FIG.
여기서, 웨이퍼 이송모듈은 후술할 제1공정 내지 제3공정을 모두 포함하는 것이다.Here, the wafer transfer module includes all of the first to third processes to be described later.
먼저, 웨이퍼를 후술할 버티컬 타입 웨이퍼 이송 컨베이어에 구비된 카세트에 장착하고, 웨이퍼 이송 컨베이어를 구동시켜 로딩을 한다.First, the wafer is mounted in a cassette provided in a vertical type wafer transfer conveyor to be described later, and the wafer transfer conveyor is driven and loaded.
이후, 상기와 같이 로딩되는 카세트에 보관된 웨이퍼를 퍼니스로 이동시키기 위해 웨이퍼 푸셔를 이용하여 웨이퍼를 카세트로부터 탈거하고, 이렇게 탈거된 웨이퍼를 웨이퍼 그립퍼로 잡아서 보트 트랜스퍼로 이동시킨다.Then, the wafer is removed from the cassette by using a wafer pusher to move the wafer stored in the cassette loaded as described above to the furnace, and the wafer thus removed is caught by the wafer gripper and moved to the boat transfer.
이후, 보트 트랜스퍼로 웨이퍼를 엘리베이터까지 이동시킨 다음, 엘리베이터에 탑재하고 상승시켜 웨이퍼를 퍼니스로 이동시키며, 이렇게 이동된 웨이퍼는 퍼니스에서 다음 공정으로 진행된다.The wafer is then transferred to the elevator by boat transfer, then mounted in the elevator and lifted to move the wafer to the furnace, which is then moved to the next process in the furnace.
도 2 내지 도 4에는 본 발명의 바람직한 실시예에 따른 웨이퍼 이송모듈의 사시도와 정면도가 도시되어 있는데, 도 2 내지 도 4에 도시된 바와 같이, 본 발명은 버티컬 타입 웨이퍼 이송 컨베이어(100), 웨이퍼 푸셔(200), 웨이퍼 그립퍼(300)로 구성되는 제1공정부(a)와, 보트 트랜스퍼(400)로 구성되는 제2공정부(b) 및 엘리베이터(500)로 구성되는 제3공정부(c)를 포함하며, 웨이퍼는 제1공정부(a), 제2공정부(b) 및 제3공정부(c)에 의해 순차적으로 이동된다.2 to 4 are a perspective view and a front view of a wafer transfer module according to a preferred embodiment of the present invention, as shown in Figures 2 to 4, the present invention is a vertical type wafer transfer conveyor 100, wafer The first process portion (a) consisting of the pusher 200, the wafer gripper 300, the second process portion (b) consisting of the boat transfer 400 and the third process portion (composing the elevator 500) c), and the wafer is sequentially moved by the first process portion (a), the second process portion (b), and the third process portion (c).
먼저, 제1공정부(a)의 버티컬 타입 웨이퍼 이송 컨베이어에 대해 설명한다.First, the vertical type wafer transfer conveyor of the 1st process part (a) is demonstrated.
도 5는 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 사시도 및 부분확대도, 도 6은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 정면도, 도 7은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어의 측면도가 도시되어 있다.5 is a perspective view and a partially enlarged view of a vertical wafer transfer conveyor according to a preferred embodiment of the present invention, FIG. 6 is a front view of a vertical wafer transfer conveyor according to a preferred embodiment of the present invention, and FIG. A side view of a vertical type wafer transfer conveyor according to an embodiment is shown.
본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어(100)는 풀리(110)와 카세트(120) 및 레일(130)이 포함된다.Vertical type wafer transfer conveyor 100 according to a preferred embodiment of the present invention includes a pulley 110, a cassette 120 and a rail 130.
상기 풀리(110)는 도 5 내지 도 7에 도시된 바와 같이, 상하 방향으로 2개가 한 쌍을 이루며, 이러한 항쌍의 풀리(110)가 좌우에 서로 대칭되도록 2세트가 설치된다. 상기와 같은 풀리(110)는 모터(M)에 의해 동시에 회전가능하도록 상측 또는 하측의 풀리들은 서로 회전축(111)을 매개로 연결된다.As shown in FIGS. 5 to 7, two pairs of pulleys 110 are formed in a vertical direction, and two sets of pairs of pulleys 110 are provided such that the pulleys 110 are symmetrical with each other. As the pulley 110 as described above, the upper or lower pulleys are connected to each other via the rotation shaft 111 so as to be rotatable at the same time by the motor (M).
또한, 상기와 같은 풀리(110)는 타이밍벨트(120)를 매개로 서로 연결되어 동시에 회전되는데, 이러한 회전은 상기 상하방향으로 짝을 이루는 한 쌍의 풀리(110) 중 어느 하나의 풀리에 모터(M)가 설치되고, 모터(M)의 회전이 타이밍벨트(120)로 전달되어 나머지 하나의 풀리가 회전된다.In addition, the pulley 110 as described above is connected to each other via a timing belt 120 and rotated at the same time, the rotation of any one of the pulley motor of the pair of pulleys (110) paired in the vertical direction ( M) is installed, the rotation of the motor (M) is transmitted to the timing belt 120, the other one pulley is rotated.
상기와 같은 타이밍벨트(120)는 기어처럼 등 간격의 홈을 가진 풀리(110)에 정확히 맞물리도록 내주면에 같은 간격의 홈을 가지므로 회전을 정확하게 전달할 수가 있으며, 고무재질로 제작되는 것이 바람직하지만, 고무재질로 제작될 경우 장력이 변동될 수 있으므로 금속재질의 체인으로 제작될 수도 있다.Since the timing belt 120 as described above has grooves of equal intervals on the inner circumferential surface so as to be precisely engaged with the pulleys 110 having equally spaced grooves like gears, the timing belt 120 can accurately transmit rotation, but is preferably made of rubber When made of rubber material, the tension may be changed, so it may be made of metal chain.
또한, 상기 타이밍벨트(120)는 도 5의 부분확대도에 도시된 바와 같이, 클램프(141)를 매개로 카세트(140)에 연결되어 카세트(140)를 일정한 궤적으로 회전시키는 역할을 하는데, 상기 클램프(141)는 타이밍벨트(120)의 내주면에 형성된 홈에 맞물려 고정된다.In addition, the timing belt 120 is connected to the cassette 140 via a clamp 141 to rotate the cassette 140 in a constant trajectory, as shown in a partially enlarged view of FIG. 5. The clamp 141 is fixed to the groove formed in the inner peripheral surface of the timing belt 120.
상기 카세트(140)는 도 8 내지 도 9에 도시된 바와 같이, 웨이퍼(1)가 장착되는 본체(150)와, 이 본체(150)의 양측에 구비되는 이송유닛(160)으로 구성되며, 카세트(140)의 이동시 뒤틀림이 발생되지 않도록 상기 이송유닛(160)은 본체(150)에 회전가능하게 설치된 상태에서 일측과 타측이 각각 타이밍벨트(120)와 레일(130)에 연결된다.8 to 9, the cassette 140 includes a main body 150 on which the wafer 1 is mounted and a transfer unit 160 provided on both sides of the main body 150. The transfer unit 160 is connected to the timing belt 120 and the rail 130 on one side and the other side in a state in which the transfer unit 160 is rotatably installed on the main body 150 so that the warpage does not occur.
상기 본체(150)는 한 쌍의 플레이트(151)와, 이 플레이트(151)를 서로 연결하는 다수의 연결봉(152)으로 구성되는데, 상기 연결봉(152)에는 웨이퍼(1)가 삽입될 수 있도록 다수의 삽입홈(153)이 형성된다.The main body 150 includes a pair of plates 151 and a plurality of connecting rods 152 connecting the plates 151 to each other, and the connecting rods 152 may include a plurality of wafers 1 to be inserted therein. The insertion groove 153 is formed.
도 8에는 상기 연결봉(152)이 2개씩 짝을 이루어 총 6개 구비되는 것이 도시되어 있는데, 하측 2개의 연결봉은 웨이퍼(1)가 세워진 상태로 삽입되어 있을 때 웨이퍼의 하측을 지지하며, 나머지 4개의 연결봉은 웨이퍼의 좌,우측을 각각 지지한다.FIG. 8 shows that the connecting rods 152 are paired two by six, and the lower two connecting rods support the lower side of the wafer when the wafer 1 is inserted in the upright state. Four connecting rods support the left and right sides of the wafer, respectively.
또한, 상기 하측 2개의 연결봉은 서로 일정거리 이격되는데, 이렇게 이격되는 이유는 후술할 웨이퍼 푸셔(200)가 하측 2개의 연결봉들 사이로 진입되어 카세트(140)에 보관된 웨이퍼(1)를 탈거 할 수 있도록 하기 위함이다.In addition, the lower two connecting rods are spaced apart from each other by a predetermined distance. The reason for the separation is that the wafer pusher 200, which will be described later, enters between the lower two connecting rods to remove the wafer 1 stored in the cassette 140. To make it work.
한편, 상기 본체(150)의 양측에는 도 8 내지 도 9에 도시된 바와 같이, 대체로 "ㄴ"자 형상으로 절곡된 측판(161)이 연결되며, 이 측판(161)에는 도 5의 부분확대도와 도 8 내지 도 9에 도시된 바와 같은 이송유닛(160)이 연결된다Meanwhile, as shown in FIGS. 8 to 9, side plates 161 that are bent in a "b" shape are connected to both sides of the main body 150, and the side plates 161 are partially enlarged views of FIG. 5. Transfer unit 160 as shown in Figures 8 to 9 is connected
상기와 같은 이송유닛(160)은 타이밍벨트(120)와 레일(130) 모두에 연결되는 부재로서, 이러한 이송유닛(160)은 상기 측판(162)에 회전가능하게 연결되며, 이러한 이송유닛(160)의 회전중심을 기준으로 일측에는 클램프(141)가, 타측에는 트랙킹 플레이트(163)가 각각 형성되는데, 도 5의 부분확대도에 도시된 바와 같이, 상기 클램프(141)는 타이밍벨트(120)와, 상기 트랙킹 플레이트(163)는 레일(130)과 각각 연결된다.The transfer unit 160 is a member connected to both the timing belt 120 and the rail 130, the transfer unit 160 is rotatably connected to the side plate 162, such a transfer unit 160 A clamp 141 is formed at one side and a tracking plate 163 is formed at the other side with respect to the rotation center of the center. As shown in a partially enlarged view of FIG. 5, the clamp 141 is a timing belt 120. And, the tracking plate 163 is connected to the rail 130, respectively.
상기 클램프(141)는 타이밍벨트(120)에 고정된 상태로 이동되는 것임에 반해, 상기 트랙킹 플레이트(161)는 레일(130)을 따라 이동되므로 트랙킹 플레이트(163)는 레일(130)과 볼베어링(162)을 매개로 연결되며, 레일(130)에서 이탈이 방지되도록 이탈방지블럭(164)이 구비되는 것이 바람직하다.Whereas the clamp 141 is fixed to the timing belt 120, the tracking plate 161 is moved along the rail 130, so the tracking plate 163 is a rail 130 and a ball bearing ( 162 is connected via a medium, it is preferable that the departure prevention block 164 is provided to prevent the departure from the rail (130).
상기 레일(130)은 상술한 타이밍벨트(120)의 외측에 설치되는 부재로서, 이러한 레일(130)은 금속재질로 제작되는 것이 일반적이다. 또한, 상기 레일(130)은 상기 트랙킹 플레이트(163)와 연결되어 타이밍벨트(120)에 의해 이동되는 카세트(140)를 가이드하는 역할을 한다.The rail 130 is a member installed outside the timing belt 120 described above, and the rail 130 is generally made of a metal material. In addition, the rail 130 is connected to the tracking plate 163 and serves to guide the cassette 140 moved by the timing belt 120.
상기와 같이 레일(130)을 따라 이동되는 트랙킹 플레이트(163)는 본체(150)와 회전가능하도록 설치되므로 서로 다른 크기의 궤적을 갖는 타이밍벨트(120)와 레일(130)을 따라 이동되어도 카세트(140)가 기울어지거나 상하반전되지 아니한다.Since the tracking plate 163 moved along the rail 130 as described above is rotatably installed with the main body 150, the cassettes may be moved along the timing belt 120 and the rail 130 having different sized trajectories. 140) does not tilt or flip upside down.
상술한 바와 같은 본 발명의 바람직한 실시예에 따른 버티컬 타입 웨이퍼 이송 컨베이어(100)는 카세트(140)가 타이밍벨트(120)와 레일(130)을 따라 상하방향으로 회전됨으로 인하여 좁은 공간에도 설치가 가능하므로 공간활용도가 증진될 수 있다.Vertical type wafer transfer conveyor 100 according to a preferred embodiment of the present invention as described above can be installed in a narrow space because the cassette 140 is rotated in the vertical direction along the timing belt 120 and the rail 130. Therefore, space utilization can be improved.
다음으로, 제1공정부(a)의 웨이퍼 푸셔에 대해 설명한다.Next, the wafer pusher of the 1st process part (a) is demonstrated.
도 10은 본 발명의 바람직한 실시예에 따른 웨이퍼 푸셔의 사시도 및 부분확대도, 도 11과 도 12는 본 발명의 바람직한 실시예에 따른 웨이퍼 푸셔로 웨이퍼를 탈거하는 모습을 보인 측면도이다.10 is a perspective view and a partially enlarged view of a wafer pusher according to a preferred embodiment of the present invention, and FIGS. 11 and 12 are side views showing a state of removing a wafer with a wafer pusher according to a preferred embodiment of the present invention.
후술할 웨이퍼 푸셔(200)는 도 3 내지 도 4에 도시된 바와 같이, 상술한 버티컬 타입 웨이퍼 이송 컨베이어(100)에 인접하여 설치되는데, 이러한 웨이퍼 푸셔(200)는 카세트(140)에 보관된 웨이퍼(1)를 상부로 밀어올려 카세트(140)로부터 웨이퍼(1)를 탈거하는 역할을 하며, 상술한 버티컬 타입 웨이퍼 이송 컨베이어(100)가 아니라도 다양한 곳에 사용될 수 있으므로 이에 한정되지 아니한다.3 to 4, the wafer pusher 200 to be described later is installed adjacent to the vertical type wafer transfer conveyor 100 described above, the wafer pusher 200 is a wafer stored in the cassette 140 It serves to remove the wafer 1 from the cassette 140 by pushing (1) to the upper portion, and is not limited to the vertical type wafer transfer conveyor 100 because it can be used in various places.
본 발명의 바람직한 실시예에 따른 웨이퍼 푸셔(200)는 X축 프레임(210), X축 이동유닛(220), Y축 프레임(230), Z축 프레임(240) 및 분리부(250)가 포함된다.The wafer pusher 200 according to the preferred embodiment of the present invention includes an X-axis frame 210, an X-axis moving unit 220, a Y-axis frame 230, a Z-axis frame 240, and a separation unit 250. do.
상기 X축 프레임(210)은 상술한 버티컬 타입 웨이퍼 이송 컨베이어(100)의 하부에 에 인접하여 설치되는 부재로서, 이러한 X축 프레임(210)은 도 4에 도시된 바와 같이, 웨이퍼 이송모듈의 골격을 이루는 골조프레임(10)에 연결된다.The X-axis frame 210 is a member installed adjacent to the lower portion of the vertical type wafer transfer conveyor 100 described above, such an X-axis frame 210 is a skeleton of the wafer transfer module, as shown in FIG. It is connected to the frame frame forming a 10.
또한, 상기 X축 프레임(210)에는 길이방향을 따라 X축 레일(211)이 형성되며, 이러한 X축 레일(211)에는 X축 이동유닛(220)이 연결되는데, 상기 X축 이동유닛(220)에는 X축 레일(211)에 결합되어 X축 방향으로 이동되는 X축 이동브라켓(221)이 포함된다.In addition, the X-axis frame 210 is formed with an X-axis rail 211 along the longitudinal direction, the X-axis rail 211 is connected to the X-axis moving unit 220, the X-axis moving unit 220 ) Includes an X-axis moving bracket 221 coupled to the X-axis rail 211 and moved in the X-axis direction.
상기 Y축 프레임(230)은 X축 이동유닛(220)에 연결되어 X축 방향으로 이동되는 부재로서, 이러한 Y축 프레임(230)은 상기 X축 프레임(210)에 수직하게 설치된다.The Y-axis frame 230 is a member that is connected to the X-axis moving unit 220 to move in the X-axis direction, the Y-axis frame 230 is installed perpendicular to the X-axis frame 210.
또한, 상기 Y축 프레임(230)에는 길이방향을 따라 Y축 레일(231)이 형성되며, 이러한 Y축 레일(231)에는 Y축 이동브라켓(232)이 결합되는데, 이러한 Y축 이동브라켓(232)은 Z축 프레임(240)과 연결되어 Z축 프레임(240)을 Y축 방향으로 이동시킨다.In addition, the Y-axis frame 230, the Y-axis rail 231 is formed along the longitudinal direction, the Y-axis rail 231 is coupled to the Y-axis moving bracket 232, such a Y-axis moving bracket 232 ) Is connected to the Z-axis frame 240 to move the Z-axis frame 240 in the Y-axis direction.
상기 Z축 프레임(240)은 상술한 바와 같이, Y축 레일(231)에 결합된 Y축 이동브라켓(232)에 연결되어 Y축 프레임(230)을 따라 이동되는 부재이다.As described above, the Z-axis frame 240 is a member which is connected to the Y-axis moving bracket 232 coupled to the Y-axis rail 231 and moved along the Y-axis frame 230.
또한, 상기 Z축 프레임(240)에는 길이방향을 따라 Z축 레일(241)이 형성되는데, 이러한 Z축 레일(241)에는 Z축 방향으로 이동되는 Z축 이동브라켓(242)이 연결되며, 이 Z축 이동브라켓(242)에는 후술할 분리부(250)가 연결된다.In addition, the Z-axis frame 240 is formed with a Z-axis rail 241 along the longitudinal direction, the Z-axis rail 241 is connected to the Z-axis moving bracket 242 to be moved in the Z-axis direction, this The separation unit 250 to be described later is connected to the Z-axis moving bracket 242.
상기 분리부(250)는 상술한 Z축 프레임(240)과 Z축 이동브라켓(242)을 매개로 연결되어 Z축 이동브라켓(242)의 구동패턴에 따라 승하강되는 부재로서, 이러한 분리부(250)는 도 10 내지 도 12에 도시된 바와 같이, 한 쌍의 상하포스트(251), 핑거블럭(252), 핑거부재(253)로 구성된다.The separating part 250 is a member that is connected to and moved up and down in accordance with the driving pattern of the Z-axis moving bracket 242 by connecting the Z-axis frame 240 and the Z-axis moving bracket 242 as described above. As shown in FIG. 10 to FIG. 12, the pair of upper and lower posts 251, the finger blocks 252, and the finger members 253 are included.
상기 한 쌍의 상하포스트(251)는 도 10 내지 도 12에 도시된 바와 같이, Z축 이동브라켓(242)에 연결되되, 상측(Z축 방향)으로 연장형성되며, 이러한 한 쌍의 상하포스트(251)의 상부에는 핑거블럭(252)이 연결되고, 상기 핑거블럭(252)에는 핑거부재(253)가 상하방향(Z축 방향)으로 설치된다.The pair of upper and lower posts 251 is connected to the Z-axis moving bracket 242, as shown in Figures 10 to 12, and extends to the upper side (Z-axis direction), such a pair of upper and lower posts ( The finger block 252 is connected to the upper portion of the 251, the finger member 253 is installed in the vertical direction (Z-axis direction) on the finger block 252.
상기 핑거블럭(252)은 도 10의 부분확대도에 도시된 바와 같이, 상하포스트(251)와 연결되는 고정블럭(254)과, 이 고정블럭(254)에 탈착되며, 상기 핑거부재(253)가 설치되는 탈착블럭(255)으로 구성되는데, 이에 따라, 핑거부재(253)의 마모 또는 파손시 새로운 탈착블럭(255)으로 교체가 용이하다.As shown in the partial enlarged view of FIG. 10, the finger block 252 is fixed to the upper and lower posts 251, and fixed to the fixed block 254, and the finger member 253. It is composed of a removable block 255 is installed, accordingly, it is easy to replace with a new removable block 255 when the finger member 253 is worn or broken.
또한, 상기 핑거블럭(252)들은 상술한 카세트(140)의 하부로 접근된 후 Z축 이동브라켓(242)의 상승시 상술한 카세트(140)에 보관된 웨이퍼(1)를 상측으로 밀어올릴 수 있도록 상기 카세트(140)의 하측 2개의 연결봉(152)들 사이의 이격거리 보다 적은 이격거리를 갖는 것이 바람직하다.In addition, the finger blocks 252 may push the wafer 1 stored in the cassette 140 upward when the Z-axis movement bracket 242 rises after approaching the lower portion of the cassette 140 described above. It is preferable to have a separation distance less than the separation distance between the two connecting rods 152 on the lower side of the cassette 140.
상기 핑거부재(253)는 핑거블럭(252)의 상면을 따라 다수의 핑거(266)가 일렬로 배치되는 부재로서, 이러한 다수의 핑거(266)들 사이에는 상술한 카세트(140)에 삽입되어 있는 웨이퍼(1)가 끼워진다.The finger member 253 is a member in which a plurality of fingers 266 are arranged in a line along an upper surface of the finger block 252, and is inserted in the cassette 140 described above between the plurality of fingers 266. The wafer 1 is fitted.
상기와 같은 핑거(256)는 웨이퍼의 손상이 방지되도록 세라믹(Ceramic) 또는 석영(Quartz) 재질로 제작되는 것이 바람직하며, 대체로 연필의 형상으로 형성되되, 상측부터 머리부(257), 몸통부(258) 및 하단부(259)로 구성된다. Finger 256 as described above is preferably made of a ceramic (Ceramic) or quartz (Quartz) material to prevent damage to the wafer, and is formed in the shape of a pencil, the head 257, the body (from the top) 258 and the lower end 259.
상기 머리부(257)는 웨이퍼(1)의 진입이 용이하도록 원뿔형으로 형성되며, 몸통부(258)는 상기 머리부(257)의 하부에 봉형상으로 연결되고, 하단부(259)는 봉형상으로 형성되되, 상기 몸통부(258)의 횡단면보다 작은 횡단면을 갖은 상태로 핑거블럭(252)에 연결된다.The head portion 257 is formed in a conical shape to facilitate the entry of the wafer 1, the body portion 258 is connected to the lower portion of the head portion 257 in a rod shape, the lower end 259 is rod-shaped Is formed, but is connected to the finger block 252 with a cross section smaller than the cross section of the body portion 258.
상기와 같이 핑거(256)의 하단부(259)가 몸통부(258)보다 작게 형성되면, 웨이퍼(1)가 핑거(256)에 끼워지면서 발생되는 칩이 하부로, 좀 더 구체적으로 하단부(259) 사이의 틈으로 원활하게 배출되도록 하는 역할을 하며, 이에 따라, 상기 핑거블럭(252)의 상면(탈착블럭의 상면)에는 상기 핑거(256)의 하단부에서 배출되는 칩이 원활하게 하향이동되도록 경사면(260)이 형성되는 것이 바람직하다.As described above, when the lower end 259 of the finger 256 is formed smaller than the body 258, the chip generated while the wafer 1 is inserted into the finger 256 is lowered, more specifically, the lower end 259. It serves to discharge smoothly to the gap between, accordingly, the upper surface of the finger block 252 (upper surface of the removable block) inclined surface (chip) discharged from the lower end of the finger 256 to move smoothly ( 260 is preferably formed.
다음으로, 제1공정부(a)의 웨이퍼 그립퍼에 대해 설명한다.Next, the wafer gripper of the 1st process part (a) is demonstrated.
도 13은 본 발명의 바람직한 실시한 실시예에 따른 웨이퍼 그립퍼의 사시도 및 부분확대도이다.13 is a perspective view and a partially enlarged view of a wafer gripper according to a preferred embodiment of the present invention.
후술할 웨이퍼 그립퍼(300)는 도 3 내지 도 4에 도시된 바와 같이, 상술한 웨이퍼 푸셔(200)의 상부에 인접하여 설치되는데, 이러한 웨이퍼 그립퍼(300)는 카세트(140)에 보관된 웨이퍼(1)를 웨이퍼 푸셔(200)로 들어올린 상태에서 웨이퍼(1)를 잡아 버티컬 타입 웨이퍼 이송 컨베이어(100)의 외부로 이동시킨 다음, 후술할 보트 트랜스퍼(400)로 이동시키는 역할을 한다.3 to 4, the wafer gripper 300 to be described later is installed adjacent to the upper portion of the above-described wafer pusher 200, the wafer gripper 300 is a wafer (stored in the cassette 140) In the state in which 1) is lifted up to the wafer pusher 200, the wafer 1 is moved to the outside of the vertical type wafer transfer conveyor 100 and then moved to the boat transfer 400 to be described later.
상기와 같은 웨이퍼 그립퍼(300)는 상술한 버티컬 웨이퍼 푸셔(200)가 아니라도 다양한 곳에 사용될 수 있으므로 이에 한정되지 아니한다.The wafer gripper 300 as described above may not be limited to the vertical wafer pusher 200 since it may be used in various places.
본 발명의 바람직한 실시예에 따른 웨이퍼 그립퍼(300)는 X축 프레임(310), X축 이동유닛(320), Z축 프레임(330), Y축 프레임(340) 및 견인부(350)가 포함된다.The wafer gripper 300 according to the preferred embodiment of the present invention includes an X axis frame 310, an X axis moving unit 320, a Z axis frame 330, a Y axis frame 340, and a towing unit 350. do.
상기 X축 프레임(310)은 웨이퍼 푸셔(200)의 상부에 설치되는 부재로서, 이러한 X축 프레임(310)은 도 4에 도시된 바와 같이, 상술한 웨이퍼 푸셔(200)의 X축 프레임(210)과 동일하게 웨이퍼 이송모듈의 골격을 이루는 골조프레임(10)에 연결된다.The X-axis frame 310 is a member installed on the wafer pusher 200, the X-axis frame 310 as shown in Figure 4, the X-axis frame 210 of the above-described wafer pusher 200 It is connected to the frame (10) forming the skeleton of the wafer transfer module in the same way.
상기 X축 프레임(310)에는 길이방향을 따라 X축 레일(311)이 형성되며, 이러한 X축 레일(311)에는 X축 이동유닛(320)이 연결되는데, 상기 X축 이동유닛(320)에는 X축 레일(311)에 결합되어 X축 방향으로 이동되는 X축 이동브라켓(321)이 포함된다.The X-axis frame 310 is formed with an X-axis rail 311 along the longitudinal direction, the X-axis rail 311 is connected to the X-axis moving unit 320, the X-axis moving unit 320 The X-axis moving bracket 321 coupled to the X-axis rail 311 is moved in the X-axis direction is included.
또한, 상기 X축 이동브라켓(321)에는 Y축 방향으로 Z축 가이드브라켓(322)이 돌출형성되는데, 이러한 Z축 가이드브라켓(322)에는 Z축 프레임(330)이 연결되어 상하로 이동된다.In addition, a Z-axis guide bracket 322 protrudes from the X-axis movement bracket 321 in the Y-axis direction, and the Z-axis guide bracket 322 is connected to the Z-axis frame 330 to move up and down.
이에 따라, 상기 Z축 프레임(330)이 Z축 가이드브라켓(322)에 연결된 상태로 상하방향(Z축 방향)으로의 이동이 확보되도록 상기 Z축 프레임(330)에는 Z축 레일(331)이 형성된다.Accordingly, the Z-axis rail 331 is provided on the Z-axis frame 330 so that movement in the vertical direction (Z-axis direction) is secured while the Z-axis frame 330 is connected to the Z-axis guide bracket 322. Is formed.
상기 Y축 프레임(340)은 상술한 Z축 프레임(330)의 하부에 X축 프레임(310)과 수직하게 배치된 상태로 연결되는 부재로서, 이러한 Y축 프레임(340)은 연결브라켓(341), 고정프레임(342), 이동프레임(343)이 포함되며, 상기 견인부(350)는 제1그립부(360)와 제2그립부(370)가 포함된다.The Y-axis frame 340 is a member connected to the lower portion of the above-described Z-axis frame 330 perpendicular to the X-axis frame 310, the Y-axis frame 340 is a connecting bracket 341 The fixed frame 342 and the moving frame 343 are included, and the towing unit 350 includes a first grip part 360 and a second grip part 370.
상기 Y축 프레임(340)은 견인부(350)가 웨이퍼를 잡을 수 있도록 Y축 방향으로 이동되는 부재이며, 상기 견인부(350)는 Y축 프레임(340)이 이동된 상태에서 웨이퍼(1)를 잡는 역할을 하는 부재이다.The Y-axis frame 340 is a member that is moved in the Y-axis direction so that the traction unit 350 can hold the wafer, the traction unit 350 is the wafer 1 in the state that the Y-axis frame 340 is moved It is a member that plays a role.
상기 연결브라켓(341)은 Z축 프레임(330)과 연결되는 부재로서, 이러한 연결브라켓(341)의 하부에는 고정프레임(342)이 연결된다.The connecting bracket 341 is a member connected to the Z-axis frame 330, and a fixed frame 342 is connected to a lower portion of the connecting bracket 341.
또한, 상기 고정프레임(342)의 하부에는 Y축 방향으로 이동되는 이동프레임(343)이 연결되는데, 상기 고정프레임(342)과 이동프레임(343)은 별도의 이동유닛(344)을 매개로 연결되며, 이에 따라 상기 고정프레임(342)의 하면에는 도시되지 않은 레일이 형성될 수 있다.In addition, a lower portion of the fixed frame 342 is connected to the moving frame 343 which is moved in the Y-axis direction, the fixed frame 342 and the moving frame 343 is connected via a separate moving unit 344 Accordingly, a rail (not shown) may be formed on the bottom surface of the fixed frame 342.
상기와 같은 이동프레임(343)에는 Y축 제1레일(345)이 길이방향을 따라 형성되며, 이 Y축 제1레일(345)에는 Y축 이동유닛(346)이 연결되어 좌우로 이동된다.The first Y-axis rail 345 is formed along the longitudinal direction of the movable frame 343, and the Y-axis first unit 345 is connected to the Y-axis moving unit 346 to move from side to side.
한편, 상기 이동프레임(343)에는 상기 견인부(350)의 제1그립부(360)가 연결되는데, 이러한 제1그립부(360)는 가동플레이트(361)와 제1홀더(362)가 포함되며, 상기 가동플레이트(361)는 도 13에 도시된 바와 같이, 이동프레임(343)의 하면에 고정된 상태로 Y축 방향으로 연장형성되며, 가동플레이트(361)의 하부에는 제1홀더(362)가 형성된다.Meanwhile, the first grip part 360 of the traction part 350 is connected to the moving frame 343, and the first grip part 360 includes a movable plate 361 and a first holder 362. As shown in FIG. 13, the movable plate 361 extends in the Y-axis direction while being fixed to the lower surface of the movable frame 343, and a first holder 362 is disposed below the movable plate 361. Is formed.
또한, 상기 Y축 이동유닛(346)에는 제2그립부(370)가 연결되는데, 이러한 제2그립부(370)는 상기 가동플레이트(361)가 Y축 방향으로 구동시 간섭이 발생되지 않도록 가동플레이트(361)의 상부에 X축 방향으로 연장형성된 별도의 플레이트(371)를 매개로 연결되는 것이 바람직하다.In addition, a second grip part 370 is connected to the Y-axis moving unit 346, and the second grip part 370 may include the movable plate 3 so that interference does not occur when the movable plate 361 is driven in the Y-axis direction. 361 is preferably connected via a separate plate 371 extending in the X-axis direction.
상기와 같은 제2그립부(370)에는 상기 가동플레이트(361)와 간섭을 방지함과 동시에 가동플레이트(361)가 끼워져 이동될 수 있도록 가동홈(372)이 형성되며, 하부에는 제2홀더(373)가 구비되어 상기 Y축 이동유닛(346)의 이동패턴에 따라 Y축 방향으로 이동된다.The second grip portion 370 is provided with a movable groove 372 to prevent the interference with the movable plate 361 and to move the movable plate 361 is inserted, the second holder 373 in the lower portion ) Is moved in the Y-axis direction according to the movement pattern of the Y-axis movement unit 346.
즉, 상기와 같은 제1그립부(360)는 웨이퍼 푸셔(200)의 분리부(250)의 상부까지 이동프레임(343)이 이동된 상태에서 Y축 이동유닛의 제2그립부(370)가 제1그립부(360)로 접근하면서 웨이퍼(1)를 잡는 것이다.That is, the first grip part 360 as described above is the second grip part 370 of the Y-axis moving unit when the moving frame 343 is moved to the upper part of the separation part 250 of the wafer pusher 200. The wafer 1 is held while approaching the grip 360.
한편, 상기 제1홀더(362)와 제2홀더(373)는 도 13의 부분확대도에 도시된 바와 같이, 제1홀더(362)와 제2홀더(373)에 각각 구비되는 연장블럭(380)과, 이 연장블럭(380)의 일측에 서로 마주보도록 설치되는 핑거부재(381)로 구성되는데, 상기 핑거부재(380)에는 핑거(382)가 길이방향을 따라 일렬로 배치된다.Meanwhile, the first holder 362 and the second holder 373 are extended blocks 380 provided in the first holder 362 and the second holder 373, respectively, as shown in a partially enlarged view of FIG. 13. ) And a finger member 381 which is installed to face each other on one side of the extension block 380, wherein the fingers 382 are arranged in a line along the length direction.
상기와 같은 핑거(382)는 웨이퍼(1)가 세워진 상태에서 측면을 가압하여 잡는 부재이므로 웨이퍼(1)가 핑거(382)에 끼워진 상태에서 웨이퍼가 일측으로 회전이 방지되도록 2줄 이상 구비되는 것이 바람직하다.Since the finger 382 is a member that presses and grips the side surface while the wafer 1 is upright, two or more lines are provided to prevent the wafer from being rotated to one side while the wafer 1 is fitted to the finger 382. desirable.
또한, 도 13의 부분확대도에 도시된 바와 같이, 핑거(382)에 웨이퍼(1)가 원활하게 끼워지도록 웨이퍼(1)가 진입되는 초입부분은 원뿔형상으로 제작되는 것이 좋을 것이다.In addition, as shown in a partially enlarged view of FIG. 13, the first entry portion into which the wafer 1 enters to fit the wafer 3 smoothly into the finger 382 may be manufactured in a conical shape.
한편, 상기 핑거부재(381)의 하부에는 세워진 웨이퍼(1)의 하면을 지지하도록 지지면(383)이 형성되는 것이 바람직하다.On the other hand, it is preferable that the support surface 383 is formed below the finger member 381 so as to support the lower surface of the standing wafer 1.
또한, 상기 핑거(382)는 상술한 웨이퍼 푸셔(200)의 핑거(256)와 동일한 세라믹 또는 석영 재질로 제작되며, 이러한 핑거(382)의 마모 또는 파손시 교체가 용이하도록 상기 핑거부재(381)는 연장블럭(380)과 탈착되는 것이 바람직하다. 상기 핑거부재(381)와 연장블럭(380)의 사이에는 도 13의 부분확대도에 도시된 바와 같이, 가압스프링(384)이 설치되는 것도 좋을 것이다.In addition, the finger 382 is made of the same ceramic or quartz material as the finger 256 of the wafer pusher 200 described above, and the finger member 381 may be easily replaced when the finger 382 is worn or damaged. Is preferably detached from the extension block 380. A pressure spring 384 may be installed between the finger member 381 and the extension block 380, as shown in the partially enlarged view of FIG.
상기와 같은 가압스프링(384)은 상기 제1홀더(362)와 제2홀더(373)를 이용하여 세워진 웨이퍼(1)의 가압시 탄성력이 제공되어 웨이퍼(1)를 더욱 견고히 고정시킬 수 있을 것이다.The pressure spring 384 as described above may be provided with an elastic force when pressing the wafer 1 that is erected using the first holder 362 and the second holder 373, thereby more firmly fixing the wafer 1. .
즉, 본 발명의 바람직한 실시예에 따른 웨이퍼 그립퍼는 웨이퍼 푸셔(200)로 들어올려진 웨이퍼(1)의 양측을 핑거(382)로 잡고, 이와 동시에 웨이퍼(1)의 하측을 지지면(383)으로 지지하여 웨이퍼의 상측을 제외한 3점에서 웨이퍼(1)를 안정적으로 잡는 것이 특징이라 할 수 있다.That is, in the wafer gripper according to the preferred embodiment of the present invention, both sides of the wafer 1 lifted by the wafer pusher 200 are held by the fingers 382, and at the same time, the lower side of the wafer 1 is supported by the support surface 383. It can be characterized by holding the wafer 1 stably at three points except the upper side of the wafer by supporting it.
또한, 웨이퍼(1)의 양측을 잡을 때, 가압스프링(384)의 가압력에 의해 웨이퍼(1)를 더욱 견고하게 잡을 수 있다.In addition, when holding both sides of the wafer 1, the pressing force of the pressure spring 384 can hold the wafer 1 more firmly.
다음으로, 보트 트랜스퍼로 구성되는 제2공정부(b)에 대해 설명한다.Next, the 2nd process part b comprised by boat transfer is demonstrated.
도 14에는 보트 트랜스퍼의 정면도가 도시되어 있는데, 이러한 보트 트랜스퍼(400)는 상술한 웨이퍼 푸셔(200)와 웨이퍼 그립퍼(300)에 의해 이동되는 웨이퍼(1)를 전달받아 후술할 엘리베이터(500)로 전달하는 역할을 한다.14 shows a front view of the boat transfer, the boat transfer 400 receives the wafer 1 moved by the wafer pusher 200 and the wafer gripper 300 described above to the elevator 500 to be described later. It serves to convey.
상기와 같은 보트 트랜스퍼(400)는 웨이퍼가 안착되는 보트(410)와, 이 보트(410)를 엘리베이터(500)까지 이동시키는 트랜스퍼유닛(420)과 이 트랜스퍼유닛(420)을 엘리베이터(500)까지 이동시키는 레일의 역할을 하는 수평프레임(430)으로 구성되며, 상기 보트(410)에는 도 21에 도시된 바와 같이, 웨이퍼(1)가 웨이퍼 그립퍼(300)에 의해 일측부터 차례차례 보트(410)에 적재된다.The boat transfer 400 as described above includes a boat 410 on which a wafer is seated, a transfer unit 420 for moving the boat 410 to the elevator 500, and the transfer unit 420 to the elevator 500. It is composed of a horizontal frame 430 that serves as a moving rail, the boat 410, as shown in Figure 21, the wafer 1 in turn by the wafer gripper 300, the boat 410 in turn from one side Is loaded on.
즉, 제2공정부(b)의 보트 트랜스퍼(400)는 보트(410)에 기설정된 갯수의 웨이퍼(예:300장)가 안착되면, 트랜스퍼유닛(420)이 수평프레임(430)을 따라 엘리베이터(500)까지 이동되는 것이다.That is, in the boat transfer 400 of the second process unit (b), when the predetermined number of wafers (eg, 300 sheets) are seated on the boat 410, the transfer unit 420 may be lifted along the horizontal frame 430. It will be moved to 500.
다음으로, 엘리베이터로 구성되는 제3공정부(c)에 대해 설명한다.Next, the 3rd process part c comprised by elevator is demonstrated.
도 15에는 엘리베이터의 사시도가 도시되어 있는데, 이러한 엘리베이터(500)는 상술한 보트 트랜스퍼(400)의 보트(410)를 전달받아 퍼니스로 전달하는 역할을 한다.15 is a perspective view of the elevator. The elevator 500 serves to receive the boat 410 of the boat transfer 400 described above and deliver it to the furnace.
상기와 같은 엘리베이터(500)는 웨이퍼 이송모듈의 골조프레임(10)에 상하방향으로 설치되며, Z축 레일(511)이 구비되는 한 쌍의 Z축 프레임(510)과, 이 Z축 프레임(510)에 각각 연결되는 Z축 이동유닛(520)과, 이 Z축 이동유닛(520)에 Y축 방향으로 연결되는 고정프레임(530)과, 이 고정프레임(530)에 연결되어 Y축 방향으로 이동되는 Y축 프레임(540)이 구비된다. Elevator 500 as described above is installed in the frame frame 10 of the wafer transfer module in the vertical direction, a pair of Z-axis frame 510 is provided with a Z-axis rail 511, the Z-axis frame 510 Z-axis moving unit 520 connected to each other, a fixed frame 530 connected to the Z-axis moving unit 520 in the Y-axis direction, and connected to the fixed frame 530 to move in the Y-axis direction Y-axis frame 540 is provided.
또한, 상기 Y축 프레임(540)에는 Y축 레일(541)이 형성되고, 이 Y축 레일(541)에는 상기 고정프레임(540)과 연결되어 Y축 프레임(540)이 Y축 방향으로 이동되도록 Y축 이동유닛(550)이 형성된다.In addition, a Y-axis rail 541 is formed in the Y-axis frame 540, the Y-axis rail 541 is connected to the fixed frame 540 so that the Y-axis frame 540 is moved in the Y-axis direction The Y axis moving unit 550 is formed.
한편, 도 18에 도시된 바와 같이, 상기 각각의 Y축 프레임(540)의 단부는 보트(410)의 양측과 결합되며, 이렇게 엘리베이터(500)로 이동되는 보트(410)에는 웨이퍼(1)가 수용된 상태이다.On the other hand, as shown in Figure 18, the end of each of the Y-axis frame 540 is coupled to both sides of the boat 410, the wafer 410 is moved to the elevator 500 in this way the wafer 1 The state of acceptance.
또한, 상기와 같이 보트(410)와 결합된 Y축 프레임(540)과 Z축 이동유닛(510)은 모두 각각 동력원(예:서보모터)에 의해 구동되는 것이 바람직한데, 이에 따라, 본 발명의 바람직한 실시예에 따른 엘리베이터(500)는 Z축 이동시에는 동기제어 하고, Y축 이동시에는 보트(410)의 좌,우 수평 및 기울기의 제어가 가능하도록 한다.In addition, as described above, the Y-axis frame 540 and the Z-axis moving unit 510 coupled with the boat 410 are each preferably driven by a power source (eg, a servo motor). The elevator 500 according to the preferred embodiment allows the synchronous control when moving the Z-axis, the left, right horizontal and tilt control of the boat 410 when moving the Y-axis.
한편, 상기와 같은 엘리베이터와 보트의 결합은 도 15의 부분홧대도에 도시된 바와 같이, 보트의 길이방향 양측 끝단에 형성된 결합브라켓(411)과 이동브라켓의 단부에 구비된 결합봉(560)의 결합에 의해 이루어질 수 있다.On the other hand, the combination of the elevator and the boat as shown in Fig. 15, the coupling of the coupling bracket 411 and the end of the movable bracket 560 formed on both ends in the longitudinal direction of the boat By coupling.
이하, 상기와 같은 구성을 갖는 웨이퍼 이송모듈로 퍼니스에 웨이퍼를 이송하는 동작을 순서대로 설명한다. 설명에 앞서 후술할 모든 부재들의 이동은 별도의 동력원(예:서보모터)에 의해 이루어질 수 있다.Hereinafter, the operation of transferring the wafer to the furnace with the wafer transfer module having the above configuration will be described in order. The movement of all members to be described below before the description may be made by a separate power source (eg, a servo motor).
먼저, 작업자는 카세트(140)에 웨이퍼(1)를 세워서 끼워넣는다. 이때, 작업자는 카세트(140)에 도시되지 않은 저장수단을 부착하는데, 이러한 저장수단은 웨이퍼(1)의 종류, 생산지, 생산기업, 생산날짜 등의 이력이 저장될 수 있다.First, the operator puts the wafer 1 upright in the cassette 140. At this time, the worker attaches a storage means (not shown) to the cassette 140, the storage means may be stored the history of the type of wafer 1, the production site, the production company, the production date.
상기와 같은 저장수단은 바코드가 인쇄된 스티커로 제작될 수도 있으나, RFID 카드로 제작될 수도 있는데, 이러한 저장수단은 도 5에 도시된 버티컬 타입 웨이퍼 이송 컨베이어(100)에 구비된 센서부(S)에 의해 감지될 수 있으며, 이렇게 감지된 저장수단의 정보는 도시되지 않은 제어부로 전송될 수 있을 것이다.The storage means as described above may be made of a bar code printed sticker, it may be made of an RFID card, such storage means is a sensor unit (S) provided in the vertical type wafer transfer conveyor 100 shown in FIG. It can be detected by, and the detected information of the storage means may be transmitted to a controller (not shown).
또한, 상기 제어부는 타이밍벨트(120)와 레일(130)을 따라 이동되는 다수의 카세트(140)를 이동시키는 역할과, 웨이퍼 푸셔(200)로 카세트(140)에 보관된 웨이퍼(1)를 들어올리는 공정, 웨이퍼 푸셔(200)로 들어올려진 웨이퍼(1)를 웨이퍼 그립퍼(300)로 잡는 공정, 웨이퍼 그립퍼(300)로 잡은 웨이퍼(1)를 보트 트랜스퍼(400)로 이동시켜 엘리베이터(500)로 이동시키는 공정, 엘리베이터(500)로 이동된 웨이퍼(1)를 퍼니스로 이동시키는 공정을 수행할 수 있다.In addition, the control unit serves to move the plurality of cassettes 140 that are moved along the timing belt 120 and the rail 130, and the wafer pusher 200 holds the wafer 1 stored in the cassette 140. The process of raising, the process of holding the wafer 1 lifted by the wafer pusher 200 with the wafer gripper 300, and the wafer 1 caught with the wafer gripper 300 are moved to the boat transfer 400 to the elevator 500. The process of moving and the process of moving the wafer 1 moved to the elevator 500 to a furnace may be performed.
이에 따라, 상기 제어부에 보관된 웨이퍼(1)의 정보에 의해 퍼니스에 필요한 웨이퍼의 양, 종류 등을 판단할 수 있다.Accordingly, the amount, type, etc. of the wafer required for the furnace can be determined based on the information of the wafer 1 stored in the controller.
또한, 상기와 같이 레일(130)을 따라 이동되는 카세트(140)는 정해진 위치에서 웨이퍼 푸셔(200)에 의해 카세트(140)에 보관된 웨이퍼(1)가 탈착되는데, 이렇게 웨이퍼 푸셔에 의해 카세트에 보관된 웨이퍼가 탈거되는 모습이 도 11 내지 도 12 및 도 16에 도시되어 있다.In addition, as described above, the cassette 140 moved along the rail 130 is detached from the wafer 1 stored in the cassette 140 by the wafer pusher 200 at a predetermined position. Figures 11 to 12 and 16 show how the stored wafer is removed.
상기와 같이 웨이퍼 푸셔(200)로 카세트(140)에 보관된 웨이퍼(1)를 탈착하는 순서에 대해 간략하게 설명하면 다음과 같다.As described above, the procedure for detaching and removing the wafer 1 stored in the cassette 140 by the wafer pusher 200 is as follows.
먼저, 카세트(140)의 위치(X.Y,Z 좌표)를 감지하고, X축 이동유닛(221)이 X축 레일(211)을 따라 이동된 다음, 카세트(140)의 하측까지 Y축 이동유닛(231)을 따라 Z축 프레임(240)이 이동된다.First, the position (XY, Z coordinate) of the cassette 140 is sensed, and the X-axis moving unit 221 is moved along the X-axis rail 211, and then the Y-axis moving unit (down to the lower side of the cassette 140) The Z-axis frame 240 is moved along the 231.
상기와 같이 Z축 프레임(240)이 이동된 상태에서 Z축 이동유닛(242)이 상승하며, 이에 따라 카세트(140)의 하부로 핑거부재(253)가 진입하면서 웨이퍼(1)를 카세트(140)로부터 탈거한다.As described above, the Z-axis moving unit 242 is raised in the state in which the Z-axis frame 240 is moved. As a result, the finger member 253 enters the lower portion of the cassette 140 to move the wafer 1 to the cassette 140. Remove from
상기와 같이 웨이퍼 푸셔(200)에 의해 카세트(140)로부터 탈거된 웨이퍼(1)는 도 17에 도시된 바와 같이, 웨이퍼 그립퍼(300)의 견인부(350)가 전달받는데, 견인부(350)로 웨이퍼(1)를 전달받는 순서에 대해 간략하게 설명하면 다음과 같다.As shown in FIG. 17, the wafer 1 detached from the cassette 140 by the wafer pusher 200 receives the towing unit 350 of the wafer gripper 300, and the towing unit 350 is transferred to the wafer 1. A brief description will be given of the order in which the wafer 1 is received.
먼저, 상기 웨이퍼 푸셔(200)의 핑거부재(253)에 의해 웨이퍼(1)가 탈거된 위치(X,Y,Z 좌표)를 감지하고, X축 이동유닛(321)이 X축 레일(311)을 따라 이동된 다음 이동프레임(343)이 Y축 방향으로 이동된다.First, the position (X, Y, Z coordinate) of the wafer 1 is removed by the finger member 253 of the wafer pusher 200, and the X-axis moving unit 321 is the X-axis rail 311 Next, the moving frame 343 is moved in the Y-axis direction.
이때, 제1그립부(360)와 제2그립부(370)가 웨이퍼(1)와 충돌되지 않는 폭을 가진 상태로 이동되는 것이 바람직할 것이다.In this case, the first grip part 360 and the second grip part 370 may be moved in a state in which the first grip part 360 and the second grip part 370 do not collide with the wafer 1.
상기와 같이 제1그립부(360)와 제2그립부(370)가 웨이퍼 푸셔(200)의 상부로 이동이 된 후, Z축 프레임(330)이 Z축 가이드브라켓(322)을 따라 하강한 다음, Y축 이동유닛(340)을 구동시켜 웨이퍼 푸셔(200)에 보관된 웨이퍼(1)의 양측을 가압한다.After the first grip part 360 and the second grip part 370 are moved to the upper portion of the wafer pusher 200 as described above, the Z axis frame 330 is lowered along the Z axis guide bracket 322. The Y-axis moving unit 340 is driven to press both sides of the wafer 1 stored in the wafer pusher 200.
이후, 웨이퍼 푸셔(200)는 초기위치로 이동되어 버티컬 타입 웨이퍼 이송 컨베이어(100)의 외부로 빠져나오며, 상기 웨이퍼 그립퍼(300)는 Y축 방향으로 이동되어 버티컬 타입 웨이퍼 이송 컨베이어(100)의 외부로 빠져나온다.Thereafter, the wafer pusher 200 is moved to an initial position and exits the outside of the vertical type wafer transfer conveyor 100, and the wafer gripper 300 is moved in the Y-axis direction to the outside of the vertical type wafer transfer conveyor 100. Exits.
이후, 웨이퍼 그립퍼(300)는 도 18에 도시된 바와 같이, 보트 트랜스퍼(400)로 이동되어 웨이퍼(1)를 탑재하고, 보트 트랜스퍼(400)에 기설정된 갯수의 웨이퍼(1)가 이동되면, 도 18에 도시된 바와 같이, 보트(410)를 엘리베이터(500)에 탑재하기 위해 X축 방향으로 이동한다.Subsequently, as shown in FIG. 18, when the wafer gripper 300 is moved to the boat transfer 400 to mount the wafer 1, and the predetermined number of wafers 1 are moved to the boat transfer 400, As shown in FIG. 18, the boat 410 is moved in the X-axis direction for mounting the elevator 500.
이후, 도 19에 도시된 바와 같이, 엘리베리터(500)를 이용하여 웨이퍼(1)가 탑재된 보트(410)를 상승시켜 퍼니스로 이동하면 웨이퍼 이송모듈의 이송과정이 완료된다.Subsequently, as shown in FIG. 19, when the boat 410 on which the wafer 1 is mounted is raised using the elevator 500 and moved to the furnace, the transfer process of the wafer transfer module is completed.
도면과 명세서에서 최적의 실시예들이 개시되었다. 여기서, 특정한 용어들이 사용되었으나, 이는 단지 본 발명을 설명하기 위한 목적에서 사용된 것이지 의미한정이나 특허청구범위에 기재된 본 발명의 범위를 제한하기 위하여 사용된 것은 아니다. 그러므로, 본 기술 분야의 통상의 지식을 가진자라면, 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 따라서, 본 발명의 진정한 기술적 보호범위는 첨부된 특허청구범위의 기술적 사상에 의해 정해져야 할 것이다.The best embodiments have been disclosed in the drawings and specification. Herein, specific terms have been used, but they are used only for the purpose of describing the present invention and are not used to limit the scope of the present invention as defined in the meaning or claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (4)

  1. 모터에 의해 회전되며, 타이밍벨트를 매개로 연결되는 상하로 배치되는 풀리;와A pulley rotated by a motor and disposed up and down connected via a timing belt;
    상기 타이밍벨트에 연결되어 이동되며, 웨이퍼가 장착되는 카세트;와A cassette connected to the timing belt, the cassette being moved; and
    상기 타이밍벨트의 외측에 설치되며, 상기 카세트를 가이드 하는 레일;이 포함되는 것을 특징으로 하는 버티컬 타입 웨이퍼 이송 컨베이어.Vertical type wafer transfer conveyor, characterized in that it is installed on the outside of the timing belt, the rail for guiding the cassette.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 카세트는,The cassette,
    웨이퍼가 장착되는 본체;와A main body on which the wafer is mounted; and
    상기 본체의 양측에 연결되는 측판;과Side plates connected to both sides of the main body; and
    상기 측판에 회전되도록 결합되되, 일측은 클램프를 매개로 상기 타이밍벨트와 결합되며, 타측은 트랙킹 플레이트를 매개로 상기 레일과 연결되는 이송유닛;이 포함되는 것을 특징으로 하는 버티컬 타입 웨이퍼 이송 컨베이어.Vertically coupled to the side plate, one side is coupled to the timing belt via a clamp, the other side is a transfer unit connected to the rail via a tracking plate; Vertical type wafer transfer conveyor comprising a.
  3. 청구항 2에 있어서,The method according to claim 2,
    상기 트랙킹 플레이트는 상기 레일과 볼베어링을 매개로 연결되고, 상기 레일에서 이탈이 방지되도록 이탈방지블럭;이 포함되는 것을 특징으로 하는 버티컬 타입 웨이퍼 이송컨베이어.The tracking plate is connected via the rail and the ball bearing as a medium, the separation prevention block so as to prevent the departure from the rail; Vertical type wafer transfer conveyor comprising a.
  4. 청구항 1에 있어서,The method according to claim 1,
    상기 카세트에 탈착되며, 웨이퍼에 대한 정보가 보관되는 저장수단;과Storage means detached from the cassette and storing information about the wafer; and
    상기 저장수단에 보관된 정보와 상기 카세트의 위치를 감지하는 센서부;가 더 포함되는 것을 특징으로 하는 버티컬 타입 웨이퍼 이송컨베이어.And a sensor unit for sensing the information stored in the storage means and the position of the cassette.
PCT/KR2013/001410 2012-06-27 2013-02-22 Vertical-type wafer transfer conveyor WO2014003284A1 (en)

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KR1020120069359A KR101407485B1 (en) 2012-06-14 2012-06-27 A Vertical-type wafer transfer conveyor
KR10-2012-0069359 2012-06-27

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CN110540001A (en) * 2018-05-29 2019-12-06 郝荣华 Medicine taking mechanism

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CN110540001A (en) * 2018-05-29 2019-12-06 郝荣华 Medicine taking mechanism

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