WO2011096611A1

WO2011096611A1 - System and method for printed circuit board or film transfer and blanking using robot

Info

Publication number: WO2011096611A1
Application number: PCT/KR2010/000826
Authority: WO
Inventors: 전익희; 장호길
Original assignee: Jeon Ik-Hee
Priority date: 2010-02-03
Filing date: 2010-02-10
Publication date: 2011-08-11
Also published as: KR20110090288A; KR101168491B1

Abstract

The present invention relates to a system and method for printed circuit board or film transfer and blanking using a robot. In particular, the robot is used in all processes, and loading and blanking processes are performed after a position correcting process is performed using a vision camera. Accordingly, a process can be quickly and accurately performed, and the probability of workplace accidents occurring can be significantly reduced. To this end, the printed circuit board or film transfer and blanking system includes a transfer device, a gripping unit, a press device, and the robot. The transfer device transfers a base material from a base material supplying device. The gripping unit approaches the transfer device such that the base material is loaded on the gripping unit. The press device produces a printed circuit board or a film through blanking from the base material loaded on the gripping unit. The robot includes a robot arm that is coupled to the gripping unit and that moves along a set trajectory to the transfer device and the press device to perform the loading process and a pressing process.

Description

Printed circuit board to film transfer and punching system and method using robot

The present invention relates to a printed circuit board to film transfer and punching, and more particularly, employing a robot in all the processes of transfer and punching, and after photographing the position information of the printed circuit board or film with a camera, correcting it quickly and without error. The present invention relates to a printed circuit board to a film transfer and punching system and a method using a robot in which precise punching is performed.

In general, a printed circuit board (PCB) is classified into a flexible printed circuit board (FPCB) and a rigid printed circuit board (RPCB), among which flexible printed circuit boards with electronic components mounted are used for mobile phones, digital cameras, DVD recorders, etc. It is an essential part of electronic equipment.

This is an electronic component developed by FPCB to cope with the trend of miniaturization and complexity of electronic products. It has good workability, excellent heat resistance, bending resistance, chemical resistance, small dimension change, and strong heat resistance. Because of this.

Such a flexible printed circuit board (FPCB) is discharged after being divided into a portion of the printed circuit board to be used as a product and a portion to be discarded (mainly scraps of the base material) after the press operation is performed by punching or the like through the press device.

However, when the operator directly injects the flexible printed circuit boards one by one into the press machine, the injection position is not precise, which may cause a punching error in the product passing through the press machine and cause inefficiency due to a long working time. have.

In addition, in addition to the press work, when the operator loads the base material for preparing the work or discharges or loads the printed circuit board or scraps, the work is difficult to perform quickly and the risk of safety accident is always concerned. There is this.

In particular, in the case of flexible printed circuit boards (FPCBs), if the punching operation is not carried out in a flat state, the printed circuit boards may sag during the punching operation, which makes it difficult to punch in the correct position. There is a problem.

The present invention has been made to solve the problems of the prior art as described above, first, by employing a robot in the entire process, such as loading, transfer, punching and ejection, and the position correction of the printed circuit board or film using a vision camera Fast and precise processes are performed, and the risk of safety accidents is significantly reduced. Second, the printed circuit board or film using a robot that reduces the defect rate by performing the punching operation while keeping the printed circuit board or film flat and level. The object is to provide a conveying and punching system and a method thereof.

Printed circuit board to film transfer and punching system using a robot of the present invention for achieving the above object is a transfer device for transferring the base material from the base material supply device; A gripping unit that approaches the conveying device and loads a base material; A press device for punching a printed circuit board or a film from a base material loaded on the gripping unit; And a robot that is coupled to the gripping unit and moves to the transfer device and the press device along a set trajectory to perform loading and pressing operations.

The apparatus may further include an unloading device for discharging the remaining scrap after the punching operation is completed in the press device, wherein the robot moves to the unloading device while the robot arm is coupled with the gripping unit to perform the unloading operation. It is characterized by performing.

And, the base material supply device is characterized in that it comprises a vision camera for photographing the position information of the base material to transmit to the robot.

In addition, the transfer device is characterized in that the plurality of support bars are connected to each other by a link mechanism, the width adjustment is made of a bellows type deformation of the link mechanism.

In addition, the gripping unit, a gripping bar disposed in a pair to face each other, the distance can be adjusted; And a gripping chuck provided at intervals along the gripping bar to clamp the sides of the base material.

Preferably, the gripping bar is characterized in that the arbitrary distance adjustment while moving along the LM guide by the servo motor and the ball screw.

More preferably, the press apparatus is characterized in that it comprises a vision camera for repeatedly photographing the position information of the printed circuit board or film every time the press operation to transmit to the robot.

On the other hand, the press device, the press frame; A punching unit for lifting up and down by a servo motor to punch a printed circuit board or a film; A discharge unit for dropping the adsorbed printed circuit board or film after adsorbing the punching unit; And a transfer unit coupled to one end of the take-out loader, which is coupled to the lifting and lowering servo motor spindle, and transfers the printed circuit board or the film from the punching unit to the discharge unit after adsorbing the printed circuit board or film. .

Printed circuit board to film transfer and punching method using a robot of the present invention comprises the steps of photographing the position information of the base material and transmitting to the robot; The robot accessing and clamping a base metal using the position information; Transferring the base material clamped by the robot to a press device; Correcting the position by photographing the position information of the printed circuit board or the film from the transferred base material to a robot; And punching out the position-corrected printed circuit board or film.

Preferably, the step of correcting the position by photographing the position information of the printed circuit board or the film to the robot, characterized in that it is repeated every time the punching operation.

And, after the step of punching the position-corrected printed circuit board to the film, characterized in that it further comprises the step of transporting the discharged printed circuit board to the film taken out of the loader.

In addition, after the step of punching the position-corrected printed circuit board or film, characterized in that it further comprises the step of discharging the unloaded by transporting the remaining scrap scraped robot.

The printed circuit board to the film transfer and punching system and the method using the robot of the present invention configured as described above have the following useful effects.

First, the present invention employs a robot in the entire process of the punching operation, so that the transfer, punching, discharge, etc. can be made, the work process is quick and precise, and the risk of safety accident in the workplace can be significantly reduced.

Second, the present invention can be significantly reduced the defective rate of the finished product because it is possible to work more precisely by the robot by repeating the position correction by the vision camera during loading and punching of the base material.

Third, in the present invention, since the punching and the like is performed in a state where the printed circuit board or the film is stretched taut in the punching operation, the defective rate of the finished product can be significantly lowered.

Fourthly, the present invention performs a precise punching by installing a square ram in the servo press during the punching operation to reduce the circumferential shaking error, and the ejection loader rotates while drawing the arc in the shape of a fan when the punched printed circuit board or the film is transported to the printed circuit. The substrate to the film can be discharged more quickly.

1 is a plan view showing a printed circuit board to a film transfer and punching system using a robot according to the present invention;

2 is a front view of FIG. 1;

3 is a right side view of FIG. 1;

4 is a plan view showing a base material supply device and a transfer device of the system according to the present invention;

5 is a front view of FIG. 4;

6 is a right side view of FIG. 4;

7 is a plan view of a gripping unit of a system according to the invention;

8 is a front view of FIG. 7;

9 is a left side view of FIG. 7;

10 is a plan view showing a press apparatus of the system according to the present invention;

11 is a front view of FIG. 10;

12 is a left side view of FIG. 10;

Figure 13 is a flow chart showing an embodiment of a printed circuit board to film transfer and punching method using a robot according to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of this embodiment, the same name and the same reference numerals are used for the same configuration and additional description thereof will be omitted.

1 is a plan view illustrating a printed circuit board to a film transfer and punching system using a robot according to the present invention, FIG. 2 is a front view of FIG. 1, and FIG. 3 is a right side view of FIG. 1.

As shown in Figures 1 to 3, the printed circuit board to film transfer and punching system using the robot of the present invention is a base material supply device 100, transfer device 200, gripping unit 300, press device ( 400 and the robot 500.

4 is a plan view showing a base material supply apparatus and a transfer apparatus of the system according to the present invention, FIG. 5 is a front view of FIG. 4, and FIG. 6 is a right side view of FIG. 4.

As shown in FIGS. 4 to 6, the base material supply device 100 is stacked on the base material table unit 110 and the base material table 110 in which a plurality of printed circuit boards are stacked. It is comprised including the base material adsorption unit 120 which adsorbs and drops a base material.

When the base material is transferred by the elevating motor unit 111 provided at the bottom, the base material table unit 110 rises by one pitch so that the base material stacked on the top of the base material table unit 110 is positioned at a constant height. To control.

The base material adsorption unit 120 is equipped with a plurality of adsorption means 121, such as an adsorption nozzle, toward the base material table unit 110 at intervals, and the adsorption means 121 is adjusted to any distance according to the size of the base material. Becomes In addition, the base material is lowered by the elevating cylinder unit 122 provided on the upper side and sequentially adsorbs the base material stacked on the top of the base material table unit 110.

The base material adsorption unit 120 is provided in pairs at intervals such that the vision cameras 123 for photographing the position information of the base material and transmitting them to the robot 500 to be described later face each other.

The transfer device 200 is a device that receives the base material from the base material supply device 100, and a plurality of pieces of table 210 are provided as a table on which the base material is dropped from the base material adsorption unit 120.

The plurality of pieces of table 210 are connected to each other by a link mechanism 220 (shown as a four-section link structure in one embodiment in the drawing) so that the adjustment of the overall width according to the size of the base material deformation of the link mechanism 220 And the position of the pieces of the table 210 is adjusted by the LM guide 341 to be a combined table, and when the width adjustment is complete is provided with a fixing clamp 211 for fixing the position of the individual pieces of the table 210. desirable.

The combined piece table 210 and the link mechanism 220 are provided with a base material while reciprocating in and out of the base material supply device 100 by the reciprocating cylinder unit 230 provided in the lower portion of the transfer device 200. .

That is, when the base material adsorption unit 120 absorbs the base material from the base material table unit 110 and ascends, the combined piece table 210 and the link mechanism 220 are connected to the base material adsorption unit 120 by the reciprocating cylinder unit 230. ) And the base material table unit 110, and the adsorption means 121 of the base material adsorption unit 120 drops the base material onto the combined piece table 210.

At this time, it is preferable that a suction means for adsorbing the base material is provided on the separate piece table 210 so that the position of the base material dropped on the combined piece table 210 upper surface is not changed, and on the piece table 210. When the base material is seated, the vision camera 123 photographs the position information of the base material and transmits it to the robot 500.

7 is a plan view showing a gripping unit of the system according to the invention, FIG. 8 is a front view of FIG. 7, and FIG. 9 is a left side view of FIG. 7.

As shown in Figure 7 to 9, the gripping unit 300 is to load the base material to approach the transfer device 200, the robot arm coupling portion which is a portion to which the arm 510 of the robot to be described later is coupled 310, a gripping bar 320, a gripping chuck 330, and a transfer mechanism.

The gripping bars 320 are arranged in pairs to face each other to adjust the distance, and the gripping chuck 330 is an air chuck and is provided with a plurality of spaced intervals along the gripping bars 320. Both sides of the base material positioned on the substrate 200 are clamped to each other so that the base material is kept in a stretched state and is horizontally held.

The transfer mechanism is for adjusting the distance between the gripping bar 320, the LM guide 341 for guiding the movement of the gripping bar 320, the ball screw for transferring the gripping bar 320 while rotating 342, a servomotor 343 for applying rotational force, and a power transmission unit 344 such as a belt for transmitting power. In addition, the gripping bar 320 is attached to the sensor for detecting the presence and deflection of the base material.

Accordingly, after the robot 500, which will be described below, receives the position (size) of the base material positioned on the transfer device 200 from the vision camera 123, the gripping bar 320 may be positioned according to the position (size) of the base material. After adjusting the interval of the gripping chuck 330 to accurately grip both sides of the base material (base material loading).

10 is a plan view showing a press apparatus of the system according to the present invention, FIG. 11 is a front view of FIG. 10, and FIG. 12 is a left side view of FIG. 10.

The press apparatus 400 is for punching the printed circuit board from the base material transferred by the arm 510 of the robot, which will be described later, coupled to the gripping unit 300, as shown in FIGS. In the example shown as a C-type press), the press frame constituting the entire skeleton of the press apparatus, the punching unit 410, the discharge unit 420 and the transfer unit 430 is configured to include.

The punching unit 410 is for lifting and lowering a printed circuit board from a base material. The lifting unit 410 is a lifting screw unit including a servo motor 411, a ball screw housing 412, a plate bearing 413, a square ram 414, and the like. And a punching part 415 mounted below the lifting screw unit to punch the printed circuit board from the base material while descending.

Here, the square ram 414 is interposed between the rectangular ram in the rectangular housing 412 and the plate-shaped bearing 413, the square ram 414 reduces the circumferential shaking error caused by the rotation of the ball screw to the printed circuit board It is possible to further improve the accuracy of the punch by correcting the mold position of.

In addition, the punching unit 410 is provided with a vision camera 416 for repeatedly photographing the position information of the printed circuit board to transmit to the robot 500 to be described later every press operation in order to reduce the product failure rate.

The discharge unit 420 is for dropping after the printed circuit board is sucked from the punching unit 410, the vacuum suction pad 422 is provided at the lower end of the lifting and lowering servo square ram unit 421. In the lower portion of the vacuum suction pad 422, a conveyor belt 423 is disposed to transfer the printed circuit board to be dropped.

The transfer unit 430 transfers the printed circuit board from the punching unit 410 to the discharge unit 420 while absorbing the printed circuit board. The transfer unit 430 rotates and lifts the servomotor at the lower end of the lifting cylinder unit 431. One end of the plate-shaped take-out loader 433 is coupled to the servomotor spindle 432 installed to be lowered.

Accordingly, the take-out loader 433 is rotated by drawing a circular arc on the basis of the servo motor spindle 432 and the punching operation is completed to suck the lower portion of the printed circuit board attached to the punching unit 415 The arc is rotated in the reverse direction again and rotates in the direction of the discharge unit 420 together with the printed circuit board to transfer the printed circuit board to the vacuum suction pad 422.

The robot 500 performs a work by moving along a trajectory set by the movement of the robot arm 510. The robot arm 510 is fastened to the robot arm coupling part 310 of the gripping unit 300. In the state, the gripping unit 300 is moved between the transfer device 200 and the press device 400 to perform loading, transfer and punching (press) operations of the printed circuit board.

The robot 500 may be employed as a scalar robot as shown in the case where cost reduction or high precision of a product is required, and a six-axis robot is used when a wider working radius is required. The robot could be applied.

On the other hand, the present invention may further comprise a conveyor belt type unloading device 600 for discharging scrap left after the punching operation is completed in the press device 400, the robot 500 is a robot arm 510 is directly coupled to the unloading device 600 in the state coupled with the gripping unit 300 to drop the scrap to the conveyor belt to perform the discharge operation.

Referring to the printed circuit board to the film transfer and punching method using the system of the present invention configured as described above, as shown in FIG. 13, first, the substrate (FPCB) from the base material supply device 100 on the transfer device 200 After loading in (S100), the vision camera 123 of the base material supply apparatus 100 photographs the position information of the base material after the waiting for shooting and transmits it to the robot 500 (S200).

When the transfer device 200 moves outside the base material supply device 100, the robot 500 approaches the base material located on the transfer device 200 by using the position information and clamps the gripping unit 300. Clamping) (S300), the base material clamped by the robot 500 is picked up (pick up) and transported to the press device 400 (S400), the press device 400, the punching unit 415 is lowered to the base material After punching the printed circuit board (S500) and rises again (S600).

Next, the ejected loader 433 of the transfer unit 430 is adsorbed and transferred to the punched-out printed circuit board and discharged (the ejection loader 433 rotates toward the punching part 415 to enter the press device 400. Next, ascending and adsorbing the printed circuit board (S700), descending and rotating again to exit the press device 400 (S800)).

At the same time, the robot 500 changes (moves) the position of the left and left base metals (S700 '), and the vision camera 416 provided to the press device 400 receives the position information of the printed circuit board from the transferred base material. Correctly photographed and sent to the robot 500 to correct the position again (S800 ').

That is, the step (S700 ', S800') by the vision camera 416 to take the position information of the printed circuit board and transmit it to the robot 500 (S700 ', S800') to be made repeatedly every time the punching operation is carried out at the correct position This can significantly lower the defective rate of the product.

The above steps are repeated until the printed circuit board on the base material is completely blown out, and separately discharged when defects or scraps are generated during vision shooting or intermediate processes (S250), and finally, when the printed circuit board is completely blown, the robot ( 500 transfers the scrap remaining in the punching process to the unloading device 600 and discharges it (S900, S1000).

Printed circuit board to film transfer and punching system using the robot of the present invention and the method are summarized in detail according to the working order as follows.

First, when a base material on which a plurality of printed circuit boards are arranged is stacked on the base material table unit 110 of the base material supply device 100, the base material is lifted upward by one pitch by the lifting motor unit 111, and the base material adsorption unit 120 is disposed. The adsorption means 121 descends by the elevating cylinder unit 122 to adsorb and ascend the base metal stacked on the top of the base material table unit 110.

Then, the conveying device 200 is the width of the engraving table 210 is adjusted by the link mechanism 220 according to the size of the base material in the bellows method, the width is fixed by the fixing clamp 211, the reciprocating cylinder unit ( Driven by the 230, it is introduced into the base material supply device 100 (space between the base material table unit 110 and the base material adsorption unit 120).

Next, after the base material adsorption unit 120 drops the base material adsorbed by the adsorption means 121 on the upper surface of the engraving table 210 of the transfer device 200, the base material is absorbed by the adsorption device installed on the engraving table 210. Is seated, the vision camera 123 provided in the upper base material adsorption unit 120 photographs the position information of the base material and transmits it to the robot 500, and the transfer device 200 again exits the base material supply device 100. (Home).

At this time, the gripping unit 300 coupled to the robot arm 510 is operated by the transfer mechanism 340 according to the position information of the base material transmitted from the vision camera 123, the gripping bar 320 is LM guide ( Moving along the 341 is adjusted to the distance so that the gripping chuck 330 accurately grips (clamps) both sides of the base material.

Therefore, the distance of the gripping bar 320 is adjusted according to the position information of the base material transmitted from the vision camera 123, and the gripping chuck 330 clamps both sides of the base material placed on the transfer device 200. In the servo motor by the gripping bar 320 to extend the base material to be able to maintain the base material horizontal.

Next, the base material gripped by the robot 500 moves together with the robot arm 510 along a predetermined trajectory and is supplied to the punching unit 410 lower part (the lower punching part 415) of the press apparatus 400. In addition, the punching unit 410, the lifting servo square ram unit 421 is lowered, the punching unit 415 accurately punches the printed circuit board from the base material.

Here, the elevating servo square ram unit 421 interposes the non-circular rectangular ram 414 in the rectangular housing 412 and the plate-shaped bearing 413, thereby minimizing the circumferential shaking error during the punching operation of the printed circuit board. Positioning and punching work can be performed more precisely.

In addition, the printed circuit board punched between the upper and lower molds and attached to the punching unit 415 is coupled to the take-out loader 433 (the servo motor spindle 432 of the transfer unit 430) to rotate and lift in an arc shape. It is conveyed to the lower part of the discharge unit 420 in the state adsorbed by the cylinder mechanism 431 to the upper surface of elevating).

At this time, the take-out loader 433 rotates in a fan shape on the basis of the servo motor spindle 432 and takes out the printed circuit board from the punching unit 415 and simultaneously supplies the printed circuit board to the discharge unit 420, thereby taking out and pulling in a linear reciprocating motion. The speed of work is greatly improved as compared with the transfer.

Then, the printed circuit board attached to the upper surface of the ejection loader 433 is adsorbed on the lower surface of the vacuum adsorption pad 422 of the discharge unit 420 and then lifted when the ejection loader 433 is rotated to the press punching part 415. It is lowered by the servo square ram unit 421, is released from the lower surface of the vacuum suction pad 422, dropped on the conveyor belt 423, and then discharged for loading.

At the same time, once the printed circuit board is hit once, the robot 500 transfers the base material while being gripped by the gripping unit 300 and transfers the base material to the vision camera 416 provided in the punching unit 410 to the base material. The location information of the remaining printed circuit board is photographed and transmitted back to the robot 500.

The robot 500 continuously transfers the base material to the press device 400 (position correction) according to the position information of the printed circuit board transmitted from the vision camera 416 to continuously perform the punching operation, and repeats the above method every time. When the printed circuit board is completely punched out from the base material and only scrap remains, the gripping unit 300 is transferred to the unloading device 600 to discharge the scrap.

Therefore, each press is photographed with a vision camera 416 each time a press operation is performed on the printed circuit board to correct the position of the printed circuit board again, and the posture change and gripping are particularly easy by the robot 500 and the gripping means 300. Thus, a quick and accurate punching operation can be performed.

Although the present invention has been described as an example of a printed circuit board that is transported and punched by a robot through the detailed description, it will be apparent to those skilled in the art that the present invention can be applied to a material similar to a printed circuit board such as a film.

As described above, a preferred embodiment according to the present invention has been described, and the fact that the present invention can be embodied in other specific forms in addition to the above-described embodiments without departing from the spirit or scope thereof is known to those skilled in the art. It is obvious to those who have it.

Therefore, the above-described embodiments should be regarded as illustrative rather than restrictive, and thus, the present invention is not limited to the above description but may be modified within the scope of the appended claims and their equivalents.

Printed circuit board to film transfer and punching system and method using the robot of the present invention configured as described above has the following industrial advantages.

First, the present invention has an industrial advantage that the transfer process, the punching, the discharge can be made by employing the robot in the entire process of the punching operation, the work process is quick and precise and the risk of safety accidents in the workplace is significantly reduced.

Second, the present invention has an industrial advantage that the defect rate of the finished product is significantly reduced because more precise work by the robot can be performed by repeating the position correction by the vision camera during loading and punching of the base material.

Third, the present invention has an industrial advantage that the defective rate of the finished product is significantly lowered because punching or the like is performed in a state in which the printed circuit board or the film is stretched and stretched during the punching operation.

Fourthly, the present invention performs a precise punching by installing a square ram in the servo press during the punching operation to reduce the circumferential shaking error, and the ejection loader rotates while drawing the arc in the shape of a fan when the punched printed circuit board or the film is transported to the printed circuit. There is an industrial advantage that the substrate to the film is discharged more quickly.

Claims

A transfer device for transferring the base material from the base material supply device;

A gripping unit that approaches the conveying device and loads a base material;

A press device for punching a printed circuit board or a film from a base material loaded on the gripping unit; And

The robot arm coupled to the gripping unit moves to the transfer device and the press device along a set trajectory, and includes a robot configured to perform loading and pressing operations. Punching system.
The method of claim 1,

And a unloading device for discharging the remaining scrap after the punching operation is completed in the press device, wherein the robot moves to the unloading device to perform an unloading operation while the robot arm is coupled with the gripping unit. Printed circuit board to film transfer and punching system using a robot.
The method according to claim 1 or 2,

The base material supply apparatus is a printed circuit board to film transfer and punching system using a robot, characterized in that it comprises a vision camera for recording the position information of the base material to send to the robot.
The method according to claim 1 or 2,

The transfer device is a printed circuit board to film transfer and punching system using a robot, characterized in that the plurality of pieces of table is connected to each other by a link mechanism, the width adjustment is made of bellows type deformation of the link mechanism.
The gripping unit according to claim 1 or 2,

A gripping bar disposed in a pair so as to face each other and having an adjustable distance;

Printed circuit board to the film transfer and punching system using a robot, characterized in that it comprises a gripping chuck for gripping the sides of the base material provided at intervals along the gripping bar.
The method of claim 5,

The gripping bar is a printed circuit board or film transfer and punching system using a robot, characterized in that the distance is adjusted while moving along the LM guide by a servo motor and a ball screw.
The method according to claim 1 or 2,

The press apparatus is a printed circuit board to film transfer and punching system using a robot, characterized in that it comprises a vision camera for repeatedly photographing the position information of the printed circuit board to the film at each press operation to transmit to the robot.
The press device according to claim 1 or 2,

Press frame; A punching unit for lifting up and down by a servo motor and a square ram to punch a printed circuit board or a film;

A discharge unit for dropping the adsorbed printed circuit board or film after adsorbing the punching unit; And

One end of the take-out loader is coupled to the ascending and descending servo motor spindle while rotating the robot comprising a transfer unit for adsorbing the printed circuit board or film from the punching unit, and then transfers the film to the discharge unit Printed circuit board to film transfer and punching system using.
Photographing the position information of the base material and transmitting it to the robot;

The robot accessing and clamping a base metal using the position information;

Transferring the base material clamped by the robot to a press device;

Photographing the position information of the printed circuit board or the film and transmitting the same to the robot to correct the position;

Printed circuit board to film transfer and punching method using a robot, characterized in that comprising the step of punching the position-corrected printed circuit board to the film.
10. The method of claim 9, wherein the step of correcting the position by photographing the position information of the printed circuit board or the film to the robot,

Printed circuit board to film transfer and punching method using a robot, characterized in that repeatedly made every time the punching operation.
The method of claim 9, wherein after punching the repositioned printed circuit board or film,

The printed circuit board to the film transfer and punching method using a robot, characterized in that it further comprises the step of transporting the discharged printed circuit board to the film take out.
The method of claim 9, wherein after punching the repositioned printed circuit board or film,

Printed circuit board to film transfer and punching method using a robot, characterized in that further comprising the step of unloading the robot to transfer the remaining scraps.