WO2017217771A1 - Wireless movement module, and element handler having same installed therein - Google Patents

Wireless movement module, and element handler having same installed therein Download PDF

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Publication number
WO2017217771A1
WO2017217771A1 PCT/KR2017/006215 KR2017006215W WO2017217771A1 WO 2017217771 A1 WO2017217771 A1 WO 2017217771A1 KR 2017006215 W KR2017006215 W KR 2017006215W WO 2017217771 A1 WO2017217771 A1 WO 2017217771A1
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WIPO (PCT)
Prior art keywords
module
wireless
unit
guide robot
movement
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PCT/KR2017/006215
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French (fr)
Korean (ko)
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유홍준
이용식
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(주)제이티
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Publication of WO2017217771A1 publication Critical patent/WO2017217771A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the present invention relates to a wireless mobile module, and more particularly, to a wireless mobile module for guiding movement of a functional module that performs a predetermined function such as device pickup and image acquisition in detail, and a device handler in which the mobile device is installed.
  • Semiconductor devices such as SD RAM, flash lamp, LSI and LED (hereinafter referred to as 'devices') are generally shipped to the market after the sawing process and the packaging process after the semiconductor process.
  • the products of the good products are sorted and shipped to the market through the automatic inspection and classification according to the inspection result by the inspection device, the classification device, the inspection and the classification device.
  • the types of chips are diversified, such as terminal frames such as lead frames and BGAs, such as SD RAM, flash RAM, and LSI.
  • the device handler In particular, in semiconductor production, it is important for the device handler to unload the device at the wafer level and also to increase the processing speed of the equipment, and the performance of the mobile device for picking up and transferring the device is an important factor in the processing speed of the device handler.
  • the moving device includes one or more pickers, and the picker is generally provided with one or more pickers, and is a mechanism for adsorbing the device.
  • a suction passage through which a vacuum pressure is applied is formed, and the device is sucked at one end thereof.
  • a rod to which the adsorption part is coupled and a vertical driving part for moving the rod in the vertical direction are provided.
  • the conventional picker picks up a device by forming a vacuum pressure, that is, a negative pressure, at the pick-up position at the pick-up position and releases the vacuum pressure at the pick-up position by releasing the vacuum pressure.
  • conventional pickers generally form a positive pressure in the adsorption section for rapid loading of the element at the loading position.
  • the device when the size of the device becomes finer, such as an LED device, when a positive pressure is formed in the adsorption unit that adsorbs the device, the device may be scattered or may be prevented from being loaded in the correct position.
  • the positive pressure or the negative pressure in the picker's adsorption head is formed by a pneumatic delivery line.
  • the positive or negative pressure forming time through the pneumatic delivery line is determined by the length of the pneumatic delivery line, so to reduce the positive pressure or negative pressure forming time.
  • There is a limitation in minimizing the length of the line which in turn serves as a limitation of the processing speed of the device.
  • a picker for transporting devices as a picker performance also requires fast movement from a pickup position to a loading position, faster device pickup, and device loading. Doing.
  • Patent Document 1 KR10-2010-0081277 A
  • Patent Document 2 KR10-0580816 B
  • Patent Document 3 KR10-0443039 B
  • Patent Document 4 KR10-2004-0096409 A
  • Patent Document 5 KR10-2011-0051301 A
  • Patent Document 6 KR10-2012-0047879 A
  • Patent Document 7 KR10-2016-0048628 A
  • Patent Document 7 KR10-1134985 B
  • an object of the present invention is to provide a wireless moving module capable of supplying wireless power and controlling wirelessly to a function module that performs a preset function such as a picker and a camera, and a device handler having the same.
  • the present invention was created in order to achieve the object of the present invention as described above, the present invention, the function module 200 for performing a predetermined function; A guide robot 100 for guiding the movement of the function module 200; A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200; Disclosed is a wireless moving module comprising a moving driver 300 for moving the function module 200 along the guide robot 100.
  • the function module 200 may include an operation unit 400 including at least one of one or more pickers 410 and one or more cameras 533 to pick up the element 20 by vacuum pressure, and the operation unit 400. It may include a wireless control unit 220 for controlling the operation unit 400 by receiving a control signal for controlling the operation of the wireless control unit from the main control unit by wireless.
  • the wireless controller 220 may include at least one of a Zigbee communication module, a Bluetooth communication module, a Wifi communication module, a gigawi communication module, an infrared communication module, an LTE communication module, and a 2.5Ghz wireless communication module.
  • the guide robot 100 may have a transport path of at least one of a straight line, a curved line, and a closed curve shape with respect to the function module 200.
  • an X-Y guide robot or an X-Y- ⁇ robot for the function module 200 may be used as the guide robot 100.
  • the function module such as a picker, a camera is coupled and the function module is controlled by wireless power supply and wireless communication to remove the power supply line, signal transmission line for control, etc.
  • the wireless mobile module and the element handler according to the present invention according to the present invention is simple to manufacture by minimizing the connection to the outside in the operation and control of a plurality of functional modules, such as a plurality of pickers, cameras, By minimizing the number of means for connecting to and has the advantage of minimizing maintenance due to wear and damage of parts.
  • FIG. 1 is a block diagram showing the configuration of a wireless mobile module according to the present invention.
  • FIG. 2 is a perspective view showing an embodiment of the wireless mobile module of FIG. 1.
  • FIG. 3 is a partial side view showing an embodiment of the wireless mobile module of FIG. 2.
  • FIG. 4 is a side cross-sectional view in the II-II direction in FIG. 3.
  • 5A and 5 are plan views illustrating examples of the shape of the wireless mobile module of FIG. 3.
  • FIG. 6 is a plan view illustrating an embodiment of a device handler to which FIG. 5A is applied.
  • the present invention is characterized in that the wireless power supply and wireless control of the functional module 200, such as a device handler picker, camera, etc. in the device is possible.
  • the application field of the present invention is not limited as a wireless mobile module if the device handler for performing the classification, inspection, etc. of the device, as well as a wireless power supply and wireless control for a function module that performs a predetermined function. to be.
  • the wireless moving module according to the present invention, as shown in Figures 1 and 2, the function module 200 for performing a predetermined function; A guide robot 100 for guiding the movement of the function module 200; A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200; It includes a movement driving unit 300 for moving the function module 200 along the guide robot (100).
  • the function module 200 is configured to perform a preset function, and in the case of an element handler, performs a preset function such as a pickup tool for performing an element pickup by a vacuum pressure, an image acquisition unit for acquiring an image for an element, etc. It can be a module.
  • the guide robot 100 may be configured to guide the movement of the function module 200 as long as the guide robot 100 is configured to guide the movement of the function module 200.
  • the guide robot 100 may have a transport path of various structures, such as a transport path of at least one of a straight line, a curve, and a closed curve shape with respect to the function module 200.
  • the guide robot 100 is a linear movement robot for guiding linear movements of the function module 200 in the X-axis direction, the Y-axis direction, the Z-axis direction, and the like.
  • Various configurations are possible according to the movement method such as XY mobile robot to guide, XYZ mobile robot to guide linear movement in XYZ direction, XY- ⁇ mobile robot to guide XY- ⁇ movement.
  • the power supply unit 120 is coupled to the guide robot 100 to supply power to the function module 200 in a state in which the function module 200 is movable on a transport path installed in the guide robot 100. Any configuration can be used as long as it can supply power to the function module 200.
  • the power supply unit 120 is composed of a power supply line (not shown) installed along a transport path installed in the guide robot 100, wherein the function module 200 is in contact with the power supply line to receive power
  • the receiving terminal can be installed.
  • the power supply unit 120 may wirelessly supply power to the functional module 200 by various methods such as wireless power transmission, that is, magnetic induction or magnetic resonance.
  • the power supply unit 120 may supply power to the function module 200 by a combination of power transfer by contact and power transfer by non-contact (electromagnetic induction, etc.).
  • the vehicle may be transferred to the functional module 200 from the X-axis guide member 101 to the functional module 200 in a non-contact manner such as a magnetic induction method or a magnetic resonance method. .
  • the power supply unit 120 may include a rechargeable battery coupled to the function module 200 to supply power in addition to power transmission in real time.
  • the movement driving part 300 is configured to move the function module 200 along the guide robot 100, and various configurations are possible.
  • the movement driving unit 300 may be configured in various ways according to the movement of the functional module 200, such as linear movement module, such as screw jack, linear module.
  • the movable driving unit 300 may be configured in various ways, such as having a non-contact driving structure by magnetic force in addition to the mechanical driving structure by the coupling structure.
  • a wireless moving module applied to an element handler includes: a function module 200 for performing a preset function, as shown in FIGS.
  • a guide robot 100 for guiding the movement of the function module 200;
  • a power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200;
  • It includes a movement driving unit 300 for moving the function module 200 along the guide robot (100).
  • the device handler in which the device handler moving device according to the present invention is used is a device for performing post-processing of semiconductor devices such as inspection and classification of semiconductor devices 10 and classification of semiconductor devices that have been inspected in advance. It can be various devices such as a device.
  • a semiconductor device is a device that has been packaged after a semiconductor process and a chip that is installed on a substrate after a semiconductor process such as a WLCSP made of chips at a wafer level and performs a specific function according to a predesigned specification. You can be a target.
  • the guide robot 100 as a configuration for guiding the movement of the function module 200, constitutes a path for the transfer of the wireless mobile module on the device handler, it is possible to various configurations depending on the transfer path of the wireless mobile module.
  • the guide robot 100 may have a straight line shape, or may have various shapes such as a curved line and a closed curve shape in addition to the straight line shape.
  • the guide robot 100 is provided with alternating movement guide parts 111 alternately moving between a pair of guide robots 100 arranged in parallel to each other and parallel to both ends. Can be.
  • the guide robot 100 is coupled to the guide coupling unit 240 installed in the function module 200 to be described later, and can be configured in a pair as a configuration for guiding the movement of the function module 200.
  • the power supply unit 120 is installed in parallel with the transport path of the guide robot 100, a variety of configurations for supplying power to the member that requires power supply, such as the operation unit 400 installed in the functional module 200 to be described later Configuration is possible.
  • the power supply unit 120 is configured to supply power by contact or wirelessly to the power receiver 210 installed in the mobile body 103, which will be described later.
  • the power supply unit 120 may supply power to the power receiver 210 wirelessly by various methods such as a magnetic induction method, a magnetic resonance method.
  • the power receiver 210 may be configured to supply power to a member that requires power supply without a charging function, or may include various configurations such as a charging battery capable of electric charging.
  • the power supply unit 120 does not need to be installed when the power receiver 210 includes a charging battery and is discharged in a manner of replacing the charging battery by manual labor or when moved to a specific position. to be.
  • the power supply unit 120 in addition to the wireless supply method, the power supply line is installed along the guide robot 100 can of course supply power by contact.
  • the movement driving unit 300 is a configuration in which the moving body 103 is moved along the guide robot 100 is possible in a variety of configurations.
  • the movement driving part 300 may be configured in various ways according to the movement driving method of the moving body 103 along the guide robot 100.
  • the moving unit 300 may be installed by applying a moving system including a permanent magnet and a coil, for example, a linear moving system disclosed in Korean Patent No. 10-0977471 and US Patent No. 8686669. Can be.
  • a moving system including a permanent magnet and a coil for example, a linear moving system disclosed in Korean Patent No. 10-0977471 and US Patent No. 8686669. Can be.
  • the function module 200, the power receiving unit 210 that is supplied by the power or wirelessly from the power supply unit 120 and the guide coupling unit 240 to be movable along the guide robot 100 is coupled Various configurations are possible as the configuration to be installed.
  • the guide coupling part 240 is configured to couple the function module 200 along the guide robot 100 so as to be movable, and various configurations are possible according to the coupling method.
  • the power receiver 210 is configured to receive power from the power supply unit 120 by contact or wirelessly.
  • the power receiver 210 may be configured to supply power to members installed in the function module 200 and requiring electricity supply.
  • the power receiving unit 210 may include a charging battery for sufficient power supply, stable power supply, and the like.
  • the function module 200 may include at least one of one or more pickers 410 and one or more cameras 533 that pick up the element 20 by vacuum pressure, in addition to the power receiver 210 and the guide coupler 240. It includes an operating unit 400 and a wireless control unit 220 for controlling the operation unit 400 by receiving a control signal for controlling the operation of the operation unit 400 from the main control unit 10 by wireless. Can be.
  • the function module 200 may have any configuration as long as it is a moving object that requires movement during operation in the device handler such as the picker 410 and the camera 533.
  • the operation unit 400 is installed in the function module 200 and performs a function required while moving, such as device pickup and image acquisition, and various configurations are possible according to functions.
  • the operation unit 400 may include one or more pickers 410 that pick up the device 20 by vacuum pressure.
  • the at least one picker 410 is configured to pick up the element 20 by vacuum pressure, and a pickup head for picking up the element 20 by vacuum pressure, and a pneumatic connection line connected to the vacuum pressure transmission device 500 ( 510 and 520 may be configured in a variety of configurations, including a rod receiving vacuum pressure.
  • the pneumatic connection lines 510 and 520 are configured to transfer the vacuum pressure from the vacuum pressure transmission device 500 to the rod of the picker 410 and are branched from the main connection line 510 and the main connection line 510 to each picker ( Various configurations are possible, including a branch line 520 connected to a rod of the 410.
  • a valve for rapid vacuum pressure release and release from the pick-up head is preferably installed at a position closest to the pick-up head.
  • valve for vacuum pressure formation and release at the pickup head may be driven by an actuator 531.
  • the actuator 531 performs vacuum pressure formation and release at the pickup head, and is operated by power supply from the power receiver 210 described above and control of the wireless controller 220 described later.
  • the operation unit 400 may include one or more driving motors 532 for moving the picker 410 such as shanghai (Z-axis), horizontal movement (X-axis, Y-axis, XY-axis), rotation, and the like. ) May be included.
  • driving motors 532 for moving the picker 410 such as shanghai (Z-axis), horizontal movement (X-axis, Y-axis, XY-axis), rotation, and the like. ) May be included.
  • the picker 410 in the state coupled to the functional module 200, various movement methods such as Shanghai East (Z axis direction), horizontal movement (X axis direction, Y axis direction, XY axis direction), rotation Can be moved by.
  • the driving motor 532 is operated by the power supply from the power receiver 210 described above and the control of the wireless control unit 220 to be described later.
  • the actuator 400 may include one or more cameras 533 with or without one or more pickers 410.
  • the camera 533 is coupled to the function module 200 and is also a device for acquiring an image such as a device, and can be configured in various ways such as a scanner and a digital camera.
  • the camera 533 is operated by the power supply from the power receiver 210 and the control of the wireless controller 220 to be described later.
  • the operation unit 400 may be additionally or separately coupled to a module capable of performing a function required in the device handler while being moved in addition to the picker 410 and the camera 533.
  • the wireless control target of the functional module 200 may be any target as long as the wireless control target such as an actuator, a motor, a camera, and the like.
  • the wireless controller 220 may be configured to receive a control signal for controlling the operation of the operator 400 from the main controller 10 by wireless to control the operator 400.
  • the wireless controller 220 may include a communication module including at least one of a Zigbee communication module, a Bluetooth communication module, a Wifi communication module, an infrared communication module, an LTE communication module, and a 2.5Ghz wireless communication module.
  • a communication module including at least one of a Zigbee communication module, a Bluetooth communication module, a Wifi communication module, an infrared communication module, an LTE communication module, and a 2.5Ghz wireless communication module.
  • the wireless controller 220 may be installed in one or more according to the number of the function module 200 and the operation unit 400 coupled thereto, and the plurality of function modules 200 and the operation unit according to the control method. 400 can be controlled.
  • the wireless control unit 220 may be configured as one and control the plurality of function modules 200 and the operation unit 400.
  • the wireless controller 220 includes a function module 200 and an operation unit 400 coupled thereto in a single module unit to control modules corresponding to each module unit (# 1 to #n; n). Are each composed of two or more natural numbers) and can be individually controlled.
  • the wireless controller 220 wirelessly receives a control signal from the main controller 10 by one communication module, and control modules # 1 to #n corresponding to each module unit are n 2 or more natural numbers) can be individually controlled by a wired connection.
  • the wireless transfer module according to the present invention is a transfer module that picks up and transfers the element 10, and has a loading member 50 in which a plurality of elements 10 are loaded, such as a wafer.
  • the element 10 may be applied to an element handler that picks up the element 10 from and loads the element 10 into the unloading members 40 and 20.
  • the element handler to which the wireless transfer module according to the present invention is applied is a sorter for classifying and loading the inspected element 10, and picking up the element 10 from the loading member 50 to perform a preset inspection.
  • a sorter for classifying and loading the inspected element 10, and picking up the element 10 from the loading member 50 to perform a preset inspection.
  • Various configurations are possible depending on the type of inspection such as an element handler loaded and unloaded on the loading members 40 and 20, an inspection method, a classification method, and an unloading member.
  • the element handler to which the wireless transfer module according to the present invention is applied includes a loading member table and a loading member table for moving a loading member 50 loaded with a plurality of elements 10 to a pickup position of the element 10.
  • An unloading unit in which one or more unloading members 40 and 20 are placed and spaced apart from each other and loaded with the element 10 from the loading member 50, and the element 10 from the loading member 50. After picking up and may be configured to include a wireless transfer module for loading in one or more unloading members (40, 20) by linear movement.
  • the loading member table is configured to move the loading member 50 loaded with a plurality of elements 10 to a pickup position of the element 10, and thus various configurations may be made according to the type and the moving method of the loading member 50. .
  • the loading member table may be configured as an X-Y- ⁇ table.
  • a needle pin may be installed below the X-Y- ⁇ table to correspond to the pickup position for picking up the device 10 by the picker 410 constituting the wireless transfer module.
  • the unloading unit is a configuration in which one or more unloading members 40 and 20 are disposed at a position spaced apart from the loading member table to receive and load the element 10 from the loading member 50. , 20)
  • a variety of configurations are possible depending on the number and type.
  • the unloading members 40 and 20 may be carrier tapes sealed by cupper tapes after device loading, trays having a plurality of loading grooves on which the devices 10 are loaded.
  • the unloading unit may be configured to move through a loading position so that the elements 10 may be sequentially loaded on the unloading members 40 and 20.
  • the conveying direction of the unloading members 40 and 20 may be an arrangement direction between the loading member table and the unloading portion, that is, a direction perpendicular to the X-axis direction, that is, the Y-axis direction.
  • the wireless transfer module may have a configuration as described above as a configuration for picking up the element 10 from the loading member 50 and then loading it into one or more unloading members 40 and 20 by linear movement.
  • the transport path of the guide robot 100 constituting the wireless transfer module as shown in Figure 6, the arrangement direction between the loading member table and the unloading portion, that is, a linear portion parallel to the X-axis direction is set This is preferred.
  • the transfer path of the guide robot 100 constituting the wireless transfer module a pair of linear portions parallel to the X-axis direction, both ends of the connection connecting the two ends of the pair of linear portions to form an endless track It can consist of people.
  • the transfer path of the guide robot 100 constituting the wireless transfer module as described above is set in a linear direction parallel to an arrangement direction, that is, an X axis direction, between the loading member table and the unloading part.
  • functional modules for additional functions may be sequentially arranged in the device handler, such as an electrical test unit 850 that performs a simple electrical test on the device 10.
  • the under vision unit 810 may be configured to calculate and align a horizontal error (rotational error) of the device when the device is unloaded on the unloading member on the transport path.
  • the under vision unit 810 is installed at a lower side of a path through which the element 10 picked up by the picker 410 is transported to photograph the bottom surface of the element 10 picked up by the picker 410. It can be configured as a camera.
  • the image obtained by the camera may be used to calculate a rotational error of the element 10 picked up by the picker 410 or as data for checking a state of the bottom surface of the element 10.
  • the alignment unit 820 is a configuration for aligning the horizontal error calculated by the under vision unit 810 and aligns the horizontal error of the element 10 picked up by the picker 410. Various configurations are possible depending on the method.
  • the 5D inspection unit 830 is configured to inspect four side surfaces and a bottom surface of the rectangular element 10, and various configurations are possible according to the 5D inspection method.
  • the 5D inspection unit 830 may be composed of a vision inspection module disclosed in Korean Patent Laid-Open No. 10-2017-0024808.
  • the electrical test unit 850 is a configuration for performing a simple electrical test on the reject unit 840 for the element recovery, the device 10 in case of failure according to the inspection result, various configurations are possible according to the inspection method. .
  • the electrical test unit 850 may perform electrical tests such as electrical contact with the terminals formed on the bottom surface of the device 10 picked up by the picker 410, electrical application, or the like. Configuration is possible.

Abstract

The present invention relates to a wireless movement module, more specifically to a wireless movement module for guiding the movement of a functional module for carrying out a previously configured function, such as element pickup and image acquisition, and an element handler having the wireless movement module installed therein. Disclosed is a wireless movement module comprising: a functional module (200) for executing a previously configured function; a guide robot (100) for guiding the movement of the functional module (200); a power supply unit (120), coupled to the guide robot (100), for supplying power to the functional module (200); and a movement driving unit (300) for moving the functional module (200) in accordance with the guide robot (100).

Description

무선이동모듈, 그가 설치된 소자핸들러Wireless mobile module, element handler installed
본 발명은 무선이동모듈에 관한 것으로서, 보다 상세하는 소자 픽업, 이미지 획득 등 미리 설정된 기능을 수행하는 기능모듈의 이동을 가이드하는 무선이동모듈 및 그가 설치된 소자핸들러에 관한 것이다.The present invention relates to a wireless mobile module, and more particularly, to a wireless mobile module for guiding movement of a functional module that performs a predetermined function such as device pickup and image acquisition in detail, and a device handler in which the mobile device is installed.
SD 램, 프래쉬램, LSI, LED 등 반도체소자(이하 '소자'라 한다)는 반도체공정을 마친 후 소잉공정, 패키징공정 등을 마친 후 시장에 출하됨이 일반적이다.Semiconductor devices such as SD RAM, flash lamp, LSI and LED (hereinafter referred to as 'devices') are generally shipped to the market after the sawing process and the packaging process after the semiconductor process.
그리고 시장에 출하된 제품에 대한 신뢰성을 확보하기 위하여 검사장치, 분류장치, 검사 및 분류장치 등에 의하여 자동검사 및 검사결과에 따른 분류를 통하여 양품의 제품들을 선별하여 시장에 출하하고 있다.In order to secure the reliability of the products shipped to the market, the products of the good products are sorted and shipped to the market through the automatic inspection and classification according to the inspection result by the inspection device, the classification device, the inspection and the classification device.
또한 소자는 SD 램, 프래쉬램, LSI 등 리드프레임, BGA 등 단자구조가 다양해지는 등 칩의 종류가 다양해지고 있다.In addition, the types of chips are diversified, such as terminal frames such as lead frames and BGAs, such as SD RAM, flash RAM, and LSI.
최근에는 소자에 대한 소형화 및 고집적화 요구에 따라서 소자가 수지 등에 의한 몰딩공정을 거치지 않고 웨이퍼 레벨에서 최종 제품화되는 것이 확대되고 있는 추세이다.In recent years, according to the demand for miniaturization and high integration of devices, it is a trend that the final products are manufactured at the wafer level without going through a molding process using a resin or the like.
한편 SD램, 모바일SD램, 모바일CPU와 같은 LSI와 같은 반도체 시장에서 경쟁이 격화되면서 소자제조비용의 절감될 필요가 있으며 궁극적으로 생산성을 높이는 것이 매우 절실하다.Meanwhile, as the competition in the semiconductor market, such as SD RAM, mobile SD RAM, and LSI such as mobile CPU, intensifies, it is necessary to reduce device manufacturing costs and ultimately increase productivity.
그리고 반도체 생산은 시설투자 비용이 높은 클린룸 내에서 공정이 수행되는것이 일반적이며, 각 공정을 수행하는 장비의 처리속도가 생산성에 직결되는바, 패키징 공정을 거치지 않거나 수행 전인 웨이퍼 수준에서의 소자를 언로딩하는 소자핸들러 또한 장비의 처리속도를 높이는 것이 중요하다.In general, semiconductor production is usually carried out in a clean room with high facility investment costs, and the processing speed of equipment that performs each process is directly related to productivity. Unloading device handlers are also important to speed up the machine.
특히 반도체 생산은 웨이퍼 수준에서 소자를 언로딩하는 소자핸들러 또한 장비의 처리속도를 높이는 것이 중요하며, 소자의 픽업 및 이송을 수행하는 이동장치의 성능이 소자핸들러의 처리속도의 중요한 요소이다.In particular, in semiconductor production, it is important for the device handler to unload the device at the wafer level and also to increase the processing speed of the equipment, and the performance of the mobile device for picking up and transferring the device is an important factor in the processing speed of the device handler.
또한 최근 핸들링 대상인 소자의 크기가 매우 작아짐에 따라, 극소형의 소자의 픽업 및 이송에 대한 이동장치의 정밀도가 크게 요구된다.In addition, as the size of the device to be handled has become very small in recent years, the precision of the moving device for pick-up and transfer of the very small element is greatly required.
한편 이동장치는 하나 이상의 픽커들을 구비하며, 픽커는, 일반적으로, 이송툴에 하나 이상으로 설치되어 소자를 흡착하는 기구로서, 내부에 진공압이 작용되는 흡입통로가 형성되고 일단에 소자가 흡착되는 흡착부가 결합되는 로드와, 로드를 상하방향으로 이동시키기 위한 상하구동부가 구비된다.On the other hand, the moving device includes one or more pickers, and the picker is generally provided with one or more pickers, and is a mechanism for adsorbing the device. A suction passage through which a vacuum pressure is applied is formed, and the device is sucked at one end thereof. A rod to which the adsorption part is coupled and a vertical driving part for moving the rod in the vertical direction are provided.
한편 종래의 픽커는, 픽업 위치에서 소자 픽업시 흡착부에 진공압, 즉 부압을 형성하여 소자를 픽업하며, 흡착부에 진공압을 해제함으로써 적재 위치에서 소자를 적재한다.On the other hand, the conventional picker picks up a device by forming a vacuum pressure, that is, a negative pressure, at the pick-up position at the pick-up position and releases the vacuum pressure at the pick-up position by releasing the vacuum pressure.
특히 종래의 픽커는, 적재 위치에서 소자의 신속한 적재를 위하여 흡착부에 정압을 형성함이 일반적이다.In particular, conventional pickers generally form a positive pressure in the adsorption section for rapid loading of the element at the loading position.
그런데, 엘이디소자와 같이 소자의 크기가 미세화되면서 종래의 픽커에 있어서 소자를 흡착하는 흡착부에 정압을 형성하는 경우 소자가 비산되거나, 적재 위치에 올바른 상태로 적재되는 것이 방해되는 문제점이 있다.By the way, when the size of the device becomes finer, such as an LED device, when a positive pressure is formed in the adsorption unit that adsorbs the device, the device may be scattered or may be prevented from being loaded in the correct position.
또한, 픽커의 흡착헤드까지 정압이 전달되는데 일정 시간이 소요되는데 신속한 소자처리가 요구되는 추세에 대응하지 못하여 장치의 처리속도를 향상시키는데 제한을 주는 문제점이 있다.In addition, it takes a certain time to deliver the static pressure to the adsorption head of the picker, there is a problem that does not correspond to the trend that the rapid device processing is required to improve the processing speed of the device.
구체적으로 픽커의 흡착헤드에 정압 또는 부압은, 공압전달선에 의하여 형성되는데 공압전달선을 통한 정압 또는 부압형성시간은 공압전달선의 길이에 의하여 결정되는바 정압 또는 부압형성시간을 단축시키기 위하여 공압전달선의 길이를 최소화하는데 한계가 있으며, 결국 장치의 처리속도의 제한으로서 작용하는 문제점이 있다.Specifically, the positive pressure or the negative pressure in the picker's adsorption head is formed by a pneumatic delivery line. The positive or negative pressure forming time through the pneumatic delivery line is determined by the length of the pneumatic delivery line, so to reduce the positive pressure or negative pressure forming time. There is a limitation in minimizing the length of the line, which in turn serves as a limitation of the processing speed of the device.
한편 이송 대상인 소자의 크기가 미세화되면서, 소자 이송을 위한 픽커의 크기가 작아지면서 착탈의 편의, 유지보수의 편의, 내구성의 증대 등 다양한 이슈가 제기되고 있다.On the other hand, as the size of the device to be transported becomes smaller, the size of the picker for device transport becomes smaller, and various issues such as convenience of detachment, convenience of maintenance, and increase of durability have been raised.
또한 소자 생산성 증대를 위하여, 종래에 비하여 보다 빠른 소자처리의 요구에 부응하여, 픽커의 성능으로서 소자의 이송을 위한 픽커 또한 픽업위치에서 적재위치로의 빠른 이동, 보다 신속한 소자픽업 및 소자적재를 요구하고 있다.In addition, in order to increase device productivity, in order to meet the demand for faster device processing than in the related art, a picker for transporting devices as a picker performance also requires fast movement from a pickup position to a loading position, faster device pickup, and device loading. Doing.
(특허문헌 1) KR10-2010-0081277 A (Patent Document 1) KR10-2010-0081277 A
(특허문헌 2) KR10-0580816 B(Patent Document 2) KR10-0580816 B
(특허문헌 3) KR10-0443039 B(Patent Document 3) KR10-0443039 B
(특허문헌 4) KR10-2004-0096409 A(Patent Document 4) KR10-2004-0096409 A
(특허문헌 5) KR10-2011-0051301 A(Patent Document 5) KR10-2011-0051301 A
(특허문헌 6) KR10-2012-0047879 A(Patent Document 6) KR10-2012-0047879 A
(특허문헌 7) KR10-2016-0048628 A(Patent Document 7) KR10-2016-0048628 A
(특허문헌 7) KR10-1134985 B(Patent Document 7) KR10-1134985 B
본 발명의 목적을 상기와 같은 문제점을 해결하기 위하여, 픽커, 카메라 등 미리 설정된 기능을 수행하는 기능모듈에 대하여 무선전원공급 및 무선제어가 가능한 무선이동모듈 및 그를 가지는 소자핸들러를 제공하는데 있다.SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to provide a wireless moving module capable of supplying wireless power and controlling wirelessly to a function module that performs a preset function such as a picker and a camera, and a device handler having the same.
본 발명은 상기와 같은 본 발명의 목적을 달성하기 위하여 창출된 것으로서, 본 발명은, 미리 설정된 기능을 수행하는 기능모듈(200)과; 상기 기능모듈(200)의 이동을 가이드하는 가이드로봇(100)과; 상기 가이드로봇(100)에 결합되어 상기 기능모듈(200)에 대하여 전원을 공급하는 전원공급부(120)와; 상기 가이드로봇(100)을 따라서 상기 기능모듈(200)을 이동시키는 이동구동부(300)를 포함하는 것을 특징으로 하는 무선이동모듈을 개시한다.The present invention was created in order to achieve the object of the present invention as described above, the present invention, the function module 200 for performing a predetermined function; A guide robot 100 for guiding the movement of the function module 200; A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200; Disclosed is a wireless moving module comprising a moving driver 300 for moving the function module 200 along the guide robot 100.
상기 기능모듈(200)은, 진공압에 의하여 소자(20)를 픽업하는 하나 이상의 픽커(410) 및 하나 이상의 카메라(533) 중 적어도 하나를 포함하는 작동부(400)와, 상기 작동부(400)의 작동제어를 위한 제어신호를 무선에 의하여 메인제어부로부터 수신하여 상기 작동부(400)를 제어하는 무선제어부(220)를 포함할 수 있다.The function module 200 may include an operation unit 400 including at least one of one or more pickers 410 and one or more cameras 533 to pick up the element 20 by vacuum pressure, and the operation unit 400. It may include a wireless control unit 220 for controlling the operation unit 400 by receiving a control signal for controlling the operation of the wireless control unit from the main control unit by wireless.
상기 무선제어부(220)는, 지그비통신모듈, 블루투스통신모듈, Wifi통신모듈, 기가와이파이통신모듈, 적외선통신모듈, LTE통신모듈 및 2.5Ghz무선통신모듈 중 적어도 하나를 포함할 수 있다.The wireless controller 220 may include at least one of a Zigbee communication module, a Bluetooth communication module, a Wifi communication module, a gigawi communication module, an infrared communication module, an LTE communication module, and a 2.5Ghz wireless communication module.
상기 가이드로봇(100)은, 상기 기능모듈(200)에 대한 직선, 곡선 및 폐곡선 형상 중 적어도 하나의 이송경로를 가질 수 있다.The guide robot 100 may have a transport path of at least one of a straight line, a curved line, and a closed curve shape with respect to the function module 200.
상기 가이드로봇(100)은, 상기 기능모듈(200)에 대한 X-Y가이드로봇 또는 X-Y-θ로봇이 사용될 수 있다.As the guide robot 100, an X-Y guide robot or an X-Y-θ robot for the function module 200 may be used.
본 발명에 따른 무선이동모듈 및 그가 설치된 소자핸들러는, 픽커, 카메라 등 기능모듈이 결합되고 기능모듈이 무선전원공급 및 무선통신에 의하여 제어됨으로써 전원공급선, 제어를 위한 신호전달선 등을 제거하여 장치의 구조를 간소화하여 조립 및 동작제어가 용이하며 각 부품의 노후화에 따른 유지보수비용을 현저하게 절감할 수 있는 이점이 있다.Wireless moving module according to the present invention and the device handler installed therein, the function module, such as a picker, a camera is coupled and the function module is controlled by wireless power supply and wireless communication to remove the power supply line, signal transmission line for control, etc. By simplifying the structure of the assembly and operation control is easy and there is an advantage that can significantly reduce the maintenance cost due to the aging of each component.
또한 본 발명에 따른 본 발명에 따른 무선이동모듈 및 그가 설치된 소자핸들러는, 복수의 픽커들, 카메라와 같이 복수의 기능모듈의 작동 및 제어에 있어 외부와의 연결을 최소화함으로써 제조가 간단하며, 외부와의 연결수단의 수를 최소화하여 부품의 마모, 손상 등으로 인한 유지보수를 최소화할 수 있는 이점이 있다.In addition, the wireless mobile module and the element handler according to the present invention according to the present invention is simple to manufacture by minimizing the connection to the outside in the operation and control of a plurality of functional modules, such as a plurality of pickers, cameras, By minimizing the number of means for connecting to and has the advantage of minimizing maintenance due to wear and damage of parts.
도 1은, 본 발명에 따른 무선이동모듈의 구성을 보여주는 블록도이다.1 is a block diagram showing the configuration of a wireless mobile module according to the present invention.
도 2는, 도 1의 무선이동모듈의 일 실시예를 보여주는 사시도이다.2 is a perspective view showing an embodiment of the wireless mobile module of FIG. 1.
도 3은, 도 2의 무선이동모듈의 일 실시예를 보여주는 일부측면도이다.3 is a partial side view showing an embodiment of the wireless mobile module of FIG. 2.
도 4는, 도 3에서 Ⅱ-Ⅱ 방향의 측단면도이다.4 is a side cross-sectional view in the II-II direction in FIG. 3.
도 5a 및 도 5는, 도 3의 무선이동모듈의 형상의 예들을 보여주는 평면도이다.5A and 5 are plan views illustrating examples of the shape of the wireless mobile module of FIG. 3.
도 6은, 도 5a가 적용된 소자핸들러의 일 실시예를 보여주는 평면도이다.FIG. 6 is a plan view illustrating an embodiment of a device handler to which FIG. 5A is applied.
이하 본 발명에 따른 무선이동모듈 및 그가 설치된 소자핸들러에 관하여 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, with reference to the accompanying drawings, a wireless mobile module and a device handler installed according to the present invention will be described.
본 발명은, 장치 내에서 소자핸들러용 픽커, 카메라 등의 기능모듈(200)에 대한 무선전원공급 및 무선제어가 가능한 것을 특징으로 하다.The present invention is characterized in that the wireless power supply and wireless control of the functional module 200, such as a device handler picker, camera, etc. in the device is possible.
그리고 본 발명의 적용 분야는 소자의 분류, 검사 등을 수행하는 소자핸들러는, 물론 미리 설정된 기능을 수행하는 기능모듈에 대한 무선전원공급 및 무선제어가 가능한 구성이면 무선이동모듈로서 제한이 없음은 물론이다.In addition, the application field of the present invention is not limited as a wireless mobile module if the device handler for performing the classification, inspection, etc. of the device, as well as a wireless power supply and wireless control for a function module that performs a predetermined function. to be.
한편 본 발명에 따른 무선이동모듈은, 도 1 및 도 2에 도시된 바와 같이, 미리 설정된 기능을 수행하는 기능모듈(200)과; 기능모듈(200)의 이동을 가이드하는 가이드로봇(100)과; 가이드로봇(100)에 결합되어 기능모듈(200)에 대하여 전원을 공급하는 전원공급부(120)와; 가이드로봇(100)을 따라서 기능모듈(200)을 이동시키는 이동구동부(300)를 포함한다.On the other hand, the wireless moving module according to the present invention, as shown in Figures 1 and 2, the function module 200 for performing a predetermined function; A guide robot 100 for guiding the movement of the function module 200; A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200; It includes a movement driving unit 300 for moving the function module 200 along the guide robot (100).
상기 기능모듈(200)은, 미리 설정된 기능을 수행하는 구성으로서, 소자핸들러의 경우 진공압에 의한 소자픽업을 수행하는 픽업툴, 소자 등에 대한 이미지를 획득하는 이미지획득부 등 미리 설정된 기능을 수행하는 모듈이 될 수 있다.The function module 200 is configured to perform a preset function, and in the case of an element handler, performs a preset function such as a pickup tool for performing an element pickup by a vacuum pressure, an image acquisition unit for acquiring an image for an element, etc. It can be a module.
상기 가이드로봇(100)은, 기능모듈(200)의 이동을 가이드하는 구성으로서 기능모듈(200)의 이동을 가이드 할 수 있는 구성이면 어떠한 구성도 가능하다.The guide robot 100 may be configured to guide the movement of the function module 200 as long as the guide robot 100 is configured to guide the movement of the function module 200.
상기 가이드로봇(100)은, 기능모듈(200)에 대한 직선, 곡선 및 폐곡선 형상 중 적어도 하나의 이송경로 등 다양한 구조의 이송경로를 가질 수 있다.The guide robot 100 may have a transport path of various structures, such as a transport path of at least one of a straight line, a curve, and a closed curve shape with respect to the function module 200.
이러한 다양한 이송경로의 구현을 위하여, 가이드로봇(100)은, 기능모듈(200)의 X축방향, Y축방향, Z축방향 등의 선형이동을 가이드하는 선형이동로봇, X-Y방향의 선형이동을 가이드하는 X-Y이동로봇, X-Y-Z방향의 선형이동을 가이드하는 X-Y-Z이동로봇, X-Y-θ이동을 가이드하는 X-Y-θ이동로봇 등 그 이동방식에 따라서 다양한 구성이 가능하다.In order to implement these various transfer paths, the guide robot 100 is a linear movement robot for guiding linear movements of the function module 200 in the X-axis direction, the Y-axis direction, the Z-axis direction, and the like. Various configurations are possible according to the movement method such as XY mobile robot to guide, XYZ mobile robot to guide linear movement in XYZ direction, XY-θ mobile robot to guide XY-θ movement.
상기 전원공급부(120)는, 가이드로봇(100)에 결합되어 기능모듈(200)에 대하여 전원을 공급하는 구성으로서 기능모듈(200)이 가이드로봇(100)에 설치된 이송경로 상에서 이동이 가능한 상태에서 기능모듈(200)에 대하여 전원을 공급할 수 있는 구성이면 어떠한 구성도 가능하다.The power supply unit 120 is coupled to the guide robot 100 to supply power to the function module 200 in a state in which the function module 200 is movable on a transport path installed in the guide robot 100. Any configuration can be used as long as it can supply power to the function module 200.
예로서, 상기 전원공급부(120)는, 가이드로봇(100)에 설치된 이송경로를 따라서 설치된 급전라인(미도시)으로 구성되고, 이때 기능모듈(200)에는 급전라인과 접촉되어 전원을 공급받는 전원수신단자가 설치될 수 있다.For example, the power supply unit 120 is composed of a power supply line (not shown) installed along a transport path installed in the guide robot 100, wherein the function module 200 is in contact with the power supply line to receive power The receiving terminal can be installed.
또 다른 예로서, 상기 전원공급부(120)는, 무선에 의한 전력전달, 즉 자기유도방식, 자기공진방식 등 다양한 방식에 의하여 무선으로 기능모듈(200)에 전원을 공급할 수 있다.As another example, the power supply unit 120 may wirelessly supply power to the functional module 200 by various methods such as wireless power transmission, that is, magnetic induction or magnetic resonance.
또한 상기 전원공급부(120)는, 접촉에 의한 전력전달 및 비접촉(전자기 유도 등)에 의한 전력전달의 조합에 의하여 기능모듈(200)로 전원을 공급할 수 있다.In addition, the power supply unit 120 may supply power to the function module 200 by a combination of power transfer by contact and power transfer by non-contact (electromagnetic induction, etc.).
구체적인 예로서, 도 2에 도시된 바와 같이, 가이드로봇(100)이 X-Y로봇으로 구성된 경우, Y축 가이드부재(102)로부터 X축 가이드부재(101)로는 접촉에 의한 전력전달 방식으로 전력을 1차로 전달하고, X축 가이드부재(101)로부터 기능모듈(200)로는 비접촉방식, 예를 들면 자기유도방식, 자기공진방식 등 비접촉에 의한 전력잔달방식으로 기능모듈(200)에 전력을 전달할 수 있다.As a specific example, as shown in Figure 2, when the guide robot 100 is composed of XY robot, the power from the Y-axis guide member 102 to the X-axis guide member 101 by the power transmission method by contacting 1 The vehicle may be transferred to the functional module 200 from the X-axis guide member 101 to the functional module 200 in a non-contact manner such as a magnetic induction method or a magnetic resonance method. .
한편 상기 전원공급부(120)는, 실시간에 의한 전력전달 이외에 기능모듈(200)에 결합되어 전원을 공급하는 충전 배터리를 포함할 수 있다.The power supply unit 120 may include a rechargeable battery coupled to the function module 200 to supply power in addition to power transmission in real time.
상기 이동구동부(300)는, 가이드로봇(100)을 따라서 기능모듈(200)을 이동시키는 구성으로서 다양한 구성이 가능하다.The movement driving part 300 is configured to move the function module 200 along the guide robot 100, and various configurations are possible.
상기 이동구동부(300)는, 스크류잭, 리니어모듈 등 선형이동모듈 등 기능모듈(200)의 이동방식에 따라서 다양한 구성이 가능하다.The movement driving unit 300 may be configured in various ways according to the movement of the functional module 200, such as linear movement module, such as screw jack, linear module.
특히 상기 이동구동부(300)는, 결합구조에 의한 기계식 구동구조 이외에 자력에 의한 비접촉 구동구조를 가지는 등 다양한 구성이 가능하다.In particular, the movable driving unit 300 may be configured in various ways, such as having a non-contact driving structure by magnetic force in addition to the mechanical driving structure by the coupling structure.
이하 본 발명에 따른 무선이동모듈이 소자핸들러에 적용된 예로서, 도 3 내지 도 5를 참조하여 설명한다.Hereinafter, an example in which the wireless mobile module according to the present invention is applied to an element handler will be described with reference to FIGS. 3 to 5.
본 발명에 따른 무선이동모듈로서, 소자핸들러에 적용된 무선이동모듈은, 도 3 내지 도 5b에 도시된 바와 같이, 미리 설정된 기능을 수행하는 기능모듈(200)과; 기능모듈(200)의 이동을 가이드하는 가이드로봇(100)과; 가이드로봇(100)에 결합되어 기능모듈(200)에 대하여 전원을 공급하는 전원공급부(120)와; 가이드로봇(100)을 따라서 기능모듈(200)을 이동시키는 이동구동부(300)를 포함한다.As a wireless moving module according to the present invention, a wireless moving module applied to an element handler includes: a function module 200 for performing a preset function, as shown in FIGS. A guide robot 100 for guiding the movement of the function module 200; A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200; It includes a movement driving unit 300 for moving the function module 200 along the guide robot (100).
여기서 본 발명에 따른 소자핸들러 이동장치가 사용되는 소자핸들러는, 반도체소자(10)의 검사 및 분류, 미리 검사된 반도체소자의 분류 등 반도체소자의 후공정을 수행하는 장치로서, 소자소터, 소자검사장치 등 다양한 장치가 될 수 있다.The device handler in which the device handler moving device according to the present invention is used is a device for performing post-processing of semiconductor devices such as inspection and classification of semiconductor devices 10 and classification of semiconductor devices that have been inspected in advance. It can be various devices such as a device.
그리고, 반도체소자는, 반도체공정을 마친 후 패키징 공정을 마친 소자, 웨이퍼 수준에서 칩으로 이루어진 WLCSP 등 반도체 공정을 마친 후 기판 등에 설치되어 미리 설계된 사양에 따라 특정 기능을 수행하는 칩으로서 다양한 소자가 그 대상이 될 수 있다.A semiconductor device is a device that has been packaged after a semiconductor process and a chip that is installed on a substrate after a semiconductor process such as a WLCSP made of chips at a wafer level and performs a specific function according to a predesigned specification. You can be a target.
상기 가이드로봇(100)은, 기능모듈(200)의 이동을 가이드하는 구성으로서, 소자핸들러 상에서 무선이동모듈의 이송을 위한 경로를 구성하며, 무선이동모듈의 이송경로에 따라서 다양한 구성이 가능하다.The guide robot 100, as a configuration for guiding the movement of the function module 200, constitutes a path for the transfer of the wireless mobile module on the device handler, it is possible to various configurations depending on the transfer path of the wireless mobile module.
예로서, 상기 가이드로봇(100)은, 도 3에 도시된 바와 같이, 직선 형상을 가지거나, 직선 형상 이외에 곡선, 폐곡선 형상 등 다양한 형상을 가질 수 있다.For example, as illustrated in FIG. 3, the guide robot 100 may have a straight line shape, or may have various shapes such as a curved line and a closed curve shape in addition to the straight line shape.
그리고 상기 가이드로봇(100)은, 폐곡선 형상을 가지는 경우 다각형, 원형, 타원형, 도 5a에 도시된 바와 같이, 직사각형의 양단에 반원형상이 결합된 형상, 도 5b에 도시된 바와 같이, 직사각형 형상 등 다양한 형상을 가질 수 있다.And when the guide robot 100 has a closed curve shape, polygonal, circular, oval, as shown in Figure 5a, a semicircular shape is coupled to both ends of the rectangle, as shown in Figure 5b, a variety of rectangular shape, such as It may have a shape.
도 3b에서 상기 가이드로봇(100)은, 직선 구간을 이루는 부분은 서로 평행을 이루어 배치되고 양단에 평행한 한 쌍의 가이드로봇(100) 사이를 번갈아 가면서 이동되는 교번이동가이드부(111)가 설치될 수 있다.In FIG. 3B, the guide robot 100 is provided with alternating movement guide parts 111 alternately moving between a pair of guide robots 100 arranged in parallel to each other and parallel to both ends. Can be.
상기 가이드로봇(100)은, 후술하는 기능모듈(200)에 설치된 가이드결합부(240)와 결합됨으로써 기능모듈(200)의 이동을 가이드하는 구성으로서 한 쌍으로 구성되는 등 다양한 구성이 가능하다.The guide robot 100 is coupled to the guide coupling unit 240 installed in the function module 200 to be described later, and can be configured in a pair as a configuration for guiding the movement of the function module 200.
상기 전원공급부(120)는, 가이드로봇(100)의 이송경로와 평행하게 설치되어 후술하는 기능모듈(200)에 설치된 작동부(400) 등 전원공급을 요하는 부재에 전원을 공급하는 구성으로서 다양한 구성이 가능하다.The power supply unit 120 is installed in parallel with the transport path of the guide robot 100, a variety of configurations for supplying power to the member that requires power supply, such as the operation unit 400 installed in the functional module 200 to be described later Configuration is possible.
예로서, 상기 전원공급부(120)는, 후술하는 이동본체(103)에 설치된 전원수신부(210)에 접촉에 의하여 또는 무선으로 전원을 공급하는 구성으로서 전원공급방식에 따라서 다양한 구성이 가능하다.For example, the power supply unit 120 is configured to supply power by contact or wirelessly to the power receiver 210 installed in the mobile body 103, which will be described later.
보다 구체적으로, 상기 전원공급부(120)는, 자기유도방식, 자기공진방식 등 다양한 방식에 의하여 무선으로 전원수신부(210)에 전원을 공급할 수 있다.More specifically, the power supply unit 120 may supply power to the power receiver 210 wirelessly by various methods such as a magnetic induction method, a magnetic resonance method.
이때 상기 전원수신부(210)는, 충전기능이 없이 전원공급을 요하는 부재에 전원을 공급하도록 구성되거나, 전기충전이 가능한 충전밧데리를 포함하는 등 다양한 구성이 가능하다.In this case, the power receiver 210 may be configured to supply power to a member that requires power supply without a charging function, or may include various configurations such as a charging battery capable of electric charging.
한편 상기 전원공급부(120)는, 전원수신부(210)가 충전밧데리를 포함하고 방전된 경우 수작업 등에 의하여 충전밧데리를 교체하는 방식 또는 특정 위치에 이동되어 충전되는 경우 필수로 설치될 필요가 없음은 물론이다.Meanwhile, the power supply unit 120 does not need to be installed when the power receiver 210 includes a charging battery and is discharged in a manner of replacing the charging battery by manual labor or when moved to a specific position. to be.
또한 상기 전원공급부(120)는, 무선 공급 방식 이외에, 전원공급선이 가이드로봇(100)을 따라서 설치되어 접촉에 의하여 전원을 공급할 수 있음은 물론이다.In addition, the power supply unit 120, in addition to the wireless supply method, the power supply line is installed along the guide robot 100 can of course supply power by contact.
상기 이동구동부(300)는, 이동본체(103)가 가이드로봇(100)을 따라서 이동시키는 구성으로서 다양한 구성이 가능하다.The movement driving unit 300 is a configuration in which the moving body 103 is moved along the guide robot 100 is possible in a variety of configurations.
상기 이동구동부(300)는, 가이드로봇(100)을 따른 이동본체(103)의 이동 구동방식에 따라서 다양한 구성이 가능하다.The movement driving part 300 may be configured in various ways according to the movement driving method of the moving body 103 along the guide robot 100.
예로서, 상기 이동구동부(300)는, 영구자석 및 코일을 포함하는 이동시스템, 예를 들면, 한국 등록특허 제10-0977471호, 미국 등록특허 제8686669호에 개시된 선형이동시스템이 응용되어 설치될 수 있다.For example, the moving unit 300 may be installed by applying a moving system including a permanent magnet and a coil, for example, a linear moving system disclosed in Korean Patent No. 10-0977471 and US Patent No. 8686669. Can be.
상기 기능모듈(200)은, 전원공급부(120)로부터 접촉에 의하여 또는 무선으로 전원을 공급받는 전원수신부(210)와, 가이드로봇(100)을 따라서 이동가능하게 결합시키는 가이드결합부(240)가 설치되는 구성으로서 다양한 구성이 가능하다.The function module 200, the power receiving unit 210 that is supplied by the power or wirelessly from the power supply unit 120 and the guide coupling unit 240 to be movable along the guide robot 100 is coupled Various configurations are possible as the configuration to be installed.
상기 가이드결합부(240)는, 기능모듈(200)를 가이드로봇(100)을 따라서 이동가능하게 결합시키는 구성으로서 그 결합방식에 따라서 다양한 구성이 가능하다.The guide coupling part 240 is configured to couple the function module 200 along the guide robot 100 so as to be movable, and various configurations are possible according to the coupling method.
상기 전원수신부(210)는, 접촉에 의하여 또는 무선으로 전원공급부(120)로부터 전원을 공급받는 구성으로서 다양한 구성이 가능하다.The power receiver 210 is configured to receive power from the power supply unit 120 by contact or wirelessly.
예로서, 상기 전원수신부(210)는, 기능모듈(200)에 설치되어 전기공급을 요하는 부재들에 전원을 공급하도록 구성될 수 있다.For example, the power receiver 210 may be configured to supply power to members installed in the function module 200 and requiring electricity supply.
또한 상기 전원수신부(210)는, 충분한 전원공급, 안정적 전원공급 등을 위하여 충전밧데리를 포함할 수 있다.In addition, the power receiving unit 210 may include a charging battery for sufficient power supply, stable power supply, and the like.
한편 상기 기능모듈(200)은, 전원수신부(210), 가이드결합부(240) 이외에, 진공압에 의하여 소자(20)를 픽업하는 하나 이상의 픽커(410) 및 하나 이상의 카메라(533) 중 적어도 하나를 포함하는 작동부(400)와, 작동부(400)의 작동제어를 위한 제어신호를 무선에 의하여 메인제어부(10)로부터 수신하여 작동부(400)를 제어하는 무선제어부(220)를 포함할 수 있다. 여기서 상기 기능모듈(200)은, 픽커(410), 카메라(533) 등 소자핸들러 내에서 작동시 이동을 요하는 이동대상이면 어떠한 구성도 가능하다.The function module 200 may include at least one of one or more pickers 410 and one or more cameras 533 that pick up the element 20 by vacuum pressure, in addition to the power receiver 210 and the guide coupler 240. It includes an operating unit 400 and a wireless control unit 220 for controlling the operation unit 400 by receiving a control signal for controlling the operation of the operation unit 400 from the main control unit 10 by wireless. Can be. The function module 200 may have any configuration as long as it is a moving object that requires movement during operation in the device handler such as the picker 410 and the camera 533.
상기 작동부(400)는, 기능모듈(200)에 설치되어 소자픽업, 이미지획득 등 이동하면서 요구되는 기능을 수행하는 구성으로서, 기능에 따라서 다양한 구성이 가능하다.The operation unit 400 is installed in the function module 200 and performs a function required while moving, such as device pickup and image acquisition, and various configurations are possible according to functions.
예로서, 상기 작동부(400)는, 진공압에 의하여 소자(20)를 픽업하는 하나 이상의 픽커(410)를 구비할 수 있다.For example, the operation unit 400 may include one or more pickers 410 that pick up the device 20 by vacuum pressure.
여기서 상기 하나 이상의 픽커(410)는, 진공압에 의하여 소자(20)를 픽업하는 구성으로서 진공압에 의하여 소자(20)를 픽업하는 픽업헤드와, 진공압전달장치(500)에 연결된 공압연결선(510, 520)에 의하여 진공압을 전달받는 로드로 구성되는 등 다양한 구성이 가능하다.Here, the at least one picker 410 is configured to pick up the element 20 by vacuum pressure, and a pickup head for picking up the element 20 by vacuum pressure, and a pneumatic connection line connected to the vacuum pressure transmission device 500 ( 510 and 520 may be configured in a variety of configurations, including a rod receiving vacuum pressure.
상기 공압연결선(510, 520)은, 진공압전달장치(500)로부터 진공압을 픽커(410)의 로드로 전달하는 구성으로서, 메인연결선(510) 및 메인연결선(510)으로부터 분기되어 각 픽커(410)의 로드와 연결되는 분기선(520)으로 구성되는 등 다양한 구성이 가능하다.The pneumatic connection lines 510 and 520 are configured to transfer the vacuum pressure from the vacuum pressure transmission device 500 to the rod of the picker 410 and are branched from the main connection line 510 and the main connection line 510 to each picker ( Various configurations are possible, including a branch line 520 connected to a rod of the 410.
그리고 상기 작동부(400)는, 픽커(410)를 구비하는 경우 픽업헤드에서의 신속한 진공압형성 및 해제를 위한 밸브가 픽업헤드에 가장 가까운 위치에 설치됨이 바람직하다.In addition, when the picker 410 includes the picker 410, a valve for rapid vacuum pressure release and release from the pick-up head is preferably installed at a position closest to the pick-up head.
이에, 상기 픽업헤드에서의 진공압형성 및 해제를 위한 밸브는, 액츄에이터(531)에 의하여 구동될 수 있다.Accordingly, the valve for vacuum pressure formation and release at the pickup head may be driven by an actuator 531.
여기서 액츄에이터(531)는, 픽업헤드에서의 진공압형성 및 해제를 수행하며, 앞서 설명한 전원수신부(210)로부터 전원공급 및 후술하는 무선제어부(220)의 제어에 의하여 작동된다.Here, the actuator 531 performs vacuum pressure formation and release at the pickup head, and is operated by power supply from the power receiver 210 described above and control of the wireless controller 220 described later.
한편 상기 작동부(400)는, 픽커(410)의 상하이동(Z축방향), 수평이동(X축방향, Y축방향, X-Y축방향), 회전 등 그 이동을 위한 하나 이상의 구동모터(532)를 포함할 수 있다.Meanwhile, the operation unit 400 may include one or more driving motors 532 for moving the picker 410 such as shanghai (Z-axis), horizontal movement (X-axis, Y-axis, XY-axis), rotation, and the like. ) May be included.
구체적으로, 상기 픽커(410)는, 기능모듈(200)에 결합된 상태에서, 상하이동(Z축방향), 수평이동(X축방향, Y축방향, X-Y축방향), 회전 등 다양한 이동방식에 의하여 이동될 수 있다.Specifically, the picker 410, in the state coupled to the functional module 200, various movement methods such as Shanghai East (Z axis direction), horizontal movement (X axis direction, Y axis direction, XY axis direction), rotation Can be moved by.
한편 상기 구동모터(532)는, 앞서 설명한 전원수신부(210)로부터 전원공급 및 후술하는 무선제어부(220)의 제어에 의하여 작동된다.On the other hand, the driving motor 532 is operated by the power supply from the power receiver 210 described above and the control of the wireless control unit 220 to be described later.
또 다른 예로서, 상기 작동부(400)는, 하나 이상의 픽커(410)와 함께 또는 하나 이상의 픽커(410) 없이 하나 이상의 카메라(533)를 포함할 수 있다.As another example, the actuator 400 may include one or more cameras 533 with or without one or more pickers 410.
상기 카메라(533)는, 기능모듈(200)에 결합되어 이동됨과 아울러 소자 등 이미지를 획득하는 장치로서 스캐너, 디지털카메라 등 다양한 구성이 가능하다.The camera 533 is coupled to the function module 200 and is also a device for acquiring an image such as a device, and can be configured in various ways such as a scanner and a digital camera.
한편 상기 카메라(533)는, 전원수신부(210)로부터 전원공급 및 후술하는 무선제어부(220)의 제어에 의하여 작동된다.On the other hand, the camera 533 is operated by the power supply from the power receiver 210 and the control of the wireless controller 220 to be described later.
그리고 상기 작동부(400)는, 픽커(410) 및 카메라(533) 이외에 이동되면서 소자핸들러 내에 요구되는 기능을 수행할 수 있는 모듈이 추가로 또는 별도로 결합될 수 있음은 물론이다.In addition, the operation unit 400 may be additionally or separately coupled to a module capable of performing a function required in the device handler while being moved in addition to the picker 410 and the camera 533.
정리하면 상기 기능모듈(200) 중 무선제어 대상은, 액츄에이터, 모터, 카메라 등 무선제어가 가능한 대상이면 어떠한 대상도 가능하다.In summary, the wireless control target of the functional module 200 may be any target as long as the wireless control target such as an actuator, a motor, a camera, and the like.
상기 무선제어부(220)는, 작동부(400)의 작동제어를 위한 제어신호를 무선에 의하여 메인제어부(10)로부터 수신하여 작동부(400)를 제어하는 구성으로서 다양한 구성이 가능하다.The wireless controller 220 may be configured to receive a control signal for controlling the operation of the operator 400 from the main controller 10 by wireless to control the operator 400.
예로서, 상기 무선제어부(220)는, 지그비통신모듈, 블루투스통신모듈, Wifi통신모듈, 적외선통신모듈, LTE통신모듈 및 2.5Ghz무선통신모듈 중 적어도 하나를 포함하는 통신모듈을 포함할 수 있다.For example, the wireless controller 220 may include a communication module including at least one of a Zigbee communication module, a Bluetooth communication module, a Wifi communication module, an infrared communication module, an LTE communication module, and a 2.5Ghz wireless communication module.
한편 상기 무선제어부(220)는, 기능모듈(200) 및 그에 결합되는 작동부(400)의 수에 따라서 하나 이상으로 설치될 수 있으며, 그 제어방식에 따라서 복수의 기능모듈(200) 및 작동부(400)를 제어할 수 있다.Meanwhile, the wireless controller 220 may be installed in one or more according to the number of the function module 200 and the operation unit 400 coupled thereto, and the plurality of function modules 200 and the operation unit according to the control method. 400 can be controlled.
일예로서, 상기 무선제어부(220)는, 하나로 구성되고 복수의 기능모듈(200) 및 작동부(400)를 제어할 수 있다.As an example, the wireless control unit 220 may be configured as one and control the plurality of function modules 200 and the operation unit 400.
다른 예로서, 상기 무선제어부(220)는, 기능모듈(200) 및 그에 결합되는 작동부(400)를 하나의 모듈단위로 구성되어 각 모듈단위에 대응되는 제어모듈(#1~#n; n은 2 이상의 자연수)로 구성됨으로써 각각 개별제어될 수 있다.As another example, the wireless controller 220 includes a function module 200 and an operation unit 400 coupled thereto in a single module unit to control modules corresponding to each module unit (# 1 to #n; n). Are each composed of two or more natural numbers) and can be individually controlled.
또 다른 예로서, 상기 무선제어부(220)는, 하나의 통신모듈에 의하여 메인제어부(10)로부터 무선으로 제어신호를 수신하고, 각 모듈단위에 대응되는 제어모듈(#1~#n; n은 2 이상의 자연수)와는 유선으로 연결되어 각각 개별제어될 수 있다.As another example, the wireless controller 220 wirelessly receives a control signal from the main controller 10 by one communication module, and control modules # 1 to #n corresponding to each module unit are n 2 or more natural numbers) can be individually controlled by a wired connection.
한편 도 1 내지 도 5b에 도시된 바와 같은, 본 발명에 따른 무선이송모듈은, 소자(10)를 픽업하여 이송하는 이송모듈로서, 웨이퍼와 같이 다수의 소자(10)들이 적재된 로딩부재(50)로부터 소자(10)를 픽업하여 언로딩부재(40, 20)로 적재하는 소자핸들러에 적용될 수 있다.Meanwhile, as shown in FIGS. 1 to 5B, the wireless transfer module according to the present invention is a transfer module that picks up and transfers the element 10, and has a loading member 50 in which a plurality of elements 10 are loaded, such as a wafer. The element 10 may be applied to an element handler that picks up the element 10 from and loads the element 10 into the unloading members 40 and 20.
특히 본 발명에 따른 무선이송모듈이 적용되는 소자핸들러는, 미리 검사된 소자(10)를 분류하여 적재하는 소터, 로딩부재(50)로부터 소자(10)를 픽업하여 미리 설정된 검사를 수행한 후 언로딩부재(40, 20)에 적재하여 언로딩하는 소자핸들러 등 검사여부, 검사방식, 분류방식, 언로딩부재 등의 종류에 따라서 다양한 구성이 가능하다.In particular, the element handler to which the wireless transfer module according to the present invention is applied is a sorter for classifying and loading the inspected element 10, and picking up the element 10 from the loading member 50 to perform a preset inspection. Various configurations are possible depending on the type of inspection such as an element handler loaded and unloaded on the loading members 40 and 20, an inspection method, a classification method, and an unloading member.
예로서, 본 발명에 따른 무선이송모듈이 적용되는 소자핸들러는, 다수의 소자(10)들이 적재된 로딩부재(50)를 소자(10)의 픽업위치로 이동시키는 로딩부재테이블과, 로딩부재테이블과 이격된 위치에 위치되어 로딩부재(50)로부터 소자(10)를 전달받아 적재되는 하나 이상의 언로딩부재(40, 20)가 배치된 언로딩부와, 로딩부재(50)로부터 소자(10)를 픽업한 후 선형이동에 의하여 하나 이상의 언로딩부재(40, 20)에 적재하는 무선이송모듈을 포함하여 구성될 수 있다.For example, the element handler to which the wireless transfer module according to the present invention is applied includes a loading member table and a loading member table for moving a loading member 50 loaded with a plurality of elements 10 to a pickup position of the element 10. An unloading unit in which one or more unloading members 40 and 20 are placed and spaced apart from each other and loaded with the element 10 from the loading member 50, and the element 10 from the loading member 50. After picking up and may be configured to include a wireless transfer module for loading in one or more unloading members (40, 20) by linear movement.
상기 로딩부재테이블은, 다수의 소자(10)들이 적재된 로딩부재(50)를 소자(10)의 픽업위치로 이동시키는 구성으로서 로딩부재(50)의 종류, 이동방식에 따라서 다양한 구성이 가능하다.The loading member table is configured to move the loading member 50 loaded with a plurality of elements 10 to a pickup position of the element 10, and thus various configurations may be made according to the type and the moving method of the loading member 50. .
예로서, 상기 로딩부재(50)가 다수의 소자(10)들이 적재된 웨이퍼링인 경우, 로딩부재테이블은, X-Y-θ테이블로 구성될 수 있다.For example, when the loading member 50 is a wafer ring in which a plurality of elements 10 are loaded, the loading member table may be configured as an X-Y-θ table.
여기서 상기 X-Y-θ테이블의 하측에는, 무선이송모듈을 구성하는 픽커(410)에 의하여 소자(10)를 픽업하기 위한 픽업위치에 대응되어 소자픽업을 보조하기 위한 니들핀이 설치될 수 있다.Here, a needle pin may be installed below the X-Y-θ table to correspond to the pickup position for picking up the device 10 by the picker 410 constituting the wireless transfer module.
상기 언로딩부는, 로딩부재테이블과 이격된 위치에 위치되어 로딩부재(50)로부터 소자(10)를 전달받아 적재되는 하나 이상의 언로딩부재(40, 20)가 배치되는 구성으로서 언로딩부재(40, 20)의 수, 종류에 따라서 다양한 구성이 가능하다.The unloading unit is a configuration in which one or more unloading members 40 and 20 are disposed at a position spaced apart from the loading member table to receive and load the element 10 from the loading member 50. , 20) A variety of configurations are possible depending on the number and type.
여기서 상기 언로딩부재(40, 20)는, 소자적재 후 커퍼테이프에 의하여 밀봉되는 캐리어테이프, 소자(10)가 적재되는 다수의 적재홈들이 형성된 트레이 등이 될 수 있다.Here, the unloading members 40 and 20 may be carrier tapes sealed by cupper tapes after device loading, trays having a plurality of loading grooves on which the devices 10 are loaded.
그리고 상기 언로딩부는, 언로딩부재(40, 20)에 소자(10)가 순차적으로 적재될 수 있도록 적재위치를 거쳐 이동되도록 구성될 수 있다.The unloading unit may be configured to move through a loading position so that the elements 10 may be sequentially loaded on the unloading members 40 and 20.
이때 상기 언로딩부재(40, 20)의 이송방향은, 로딩부재테이블 및 언로딩부 사이의 배치방향, 즉 X축방향과 수직인 방향, 즉 Y축방향이 될 수 있다.In this case, the conveying direction of the unloading members 40 and 20 may be an arrangement direction between the loading member table and the unloading portion, that is, a direction perpendicular to the X-axis direction, that is, the Y-axis direction.
상기 무선이송모듈은, 로딩부재(50)로부터 소자(10)를 픽업한 후 선형이동에 의하여 하나 이상의 언로딩부재(40, 20)에 적재하는 구성으로서 앞서 설명한 바와 같은 구성을 가질 수 있다.The wireless transfer module may have a configuration as described above as a configuration for picking up the element 10 from the loading member 50 and then loading it into one or more unloading members 40 and 20 by linear movement.
여기서 상기 무선이송모듈을 구성하는 가이드로봇(100)의 이송경로는, 도 6에 도시된 바와 같이, 로딩부재테이블 및 언로딩부 사이의 배치방향, 즉 X축방향과 평행한 선형부분이 설정됨이 바람직하다.Here, the transport path of the guide robot 100 constituting the wireless transfer module, as shown in Figure 6, the arrangement direction between the loading member table and the unloading portion, that is, a linear portion parallel to the X-axis direction is set This is preferred.
즉, 상기 무선이송모듈을 구성하는 가이드로봇(100)의 이송경로는, X축방향과 평행한 한 쌍의 선형부분들과, 한 쌍의 선형부분들의 양단을 연결하여 무한궤도를 형성하는 양단연결부분들로 이루어질 수 있다.That is, the transfer path of the guide robot 100 constituting the wireless transfer module, a pair of linear portions parallel to the X-axis direction, both ends of the connection connecting the two ends of the pair of linear portions to form an endless track It can consist of people.
상기와 같이 상기 무선이송모듈을 구성하는 가이드로봇(100)의 이송경로가 도 6에 도시된 바와 같이, 로딩부재테이블 및 언로딩부 사이의 배치방향, 즉 X축방향과 평행한 선형부분이 설정되면, 이송경로 상에, 언로딩부재 상에 소자 언로딩시 소자의 수평오차(회전오차)를 계산하여 얼라인하기 위한 언더비전부(810), 언더비전부(810)에 의하여 계산된 수평오차를 얼라인하기 위한 얼라인부(820), 직사각형 소자(10)의 4개의 측면 및 저면에 대한 검사를 수행하는 5D검사부(830), 검사결과에 따라 불량인 경우 소자회수를 위한 리젝부(840), 소자(10)에 대한 간단한 전기적 테스트를 수행하는 전기테스트부(850) 등 소자핸들러에 추가 기능을 위한 기능모듈들이 순차적으로 배치될 수 있다.As shown in FIG. 6, the transfer path of the guide robot 100 constituting the wireless transfer module as described above is set in a linear direction parallel to an arrangement direction, that is, an X axis direction, between the loading member table and the unloading part. The horizontal error calculated by the under vision unit 810 and the under vision unit 810 for calculating and aligning a horizontal error (rotational error) of the device when the device is unloaded on the unloading member on the transport path. Aligning unit 820 for aligning, 5D inspection unit 830 for inspecting the four sides and the bottom of the rectangular element 10, if the defective according to the inspection result reject unit 840 for element recovery In addition, functional modules for additional functions may be sequentially arranged in the device handler, such as an electrical test unit 850 that performs a simple electrical test on the device 10.
상기 언더비전부(810)는, 이송경로 상에, 언로딩부재 상에 소자 언로딩시 소자의 수평오차(회전오차)를 계산하여 얼라인하기 위한 구성으로서 다양한 구성이 가능하다.The under vision unit 810 may be configured to calculate and align a horizontal error (rotational error) of the device when the device is unloaded on the unloading member on the transport path.
예로서, 상기 언더비전부(810)는, 픽커(410)에 의하여 픽업된 소자(10)가 이송되는 경로의 하측에 설치되어 픽커(410)에 의하여 픽업된 소자(10)의 저면을 촬영하는 카메라로 구성될 수 있다.For example, the under vision unit 810 is installed at a lower side of a path through which the element 10 picked up by the picker 410 is transported to photograph the bottom surface of the element 10 picked up by the picker 410. It can be configured as a camera.
그리고 상기 카메라에 의하여 획득된 이미지는, 픽커(410)에 픽업된 소자(10)의 회전오차를 계산하는데 활용되거나, 소자(10)에 대한 저면의 상태를 검사하는 데이터로 활용될 수 있다.The image obtained by the camera may be used to calculate a rotational error of the element 10 picked up by the picker 410 or as data for checking a state of the bottom surface of the element 10.
상기 얼라인부(820)는, 언더비전부(810)에 의하여 계산된 수평오차를 얼라인하기 위한 구성으로서, 픽커(410)에 픽업된 소자(10)를 수평오차를 얼라인하는 구성으로 얼라인방식에 따라서 다양한 구성이 가능하다.The alignment unit 820 is a configuration for aligning the horizontal error calculated by the under vision unit 810 and aligns the horizontal error of the element 10 picked up by the picker 410. Various configurations are possible depending on the method.
상기 5D검사부(830)는, 직사각형 소자(10)의 4개의 측면 및 저면에 대한 검사를 수행하는 구성으로서 5D검사방식에 따라서 다양한 구성이 가능하다.The 5D inspection unit 830 is configured to inspect four side surfaces and a bottom surface of the rectangular element 10, and various configurations are possible according to the 5D inspection method.
예로서, 상기 5D검사부(830)는, 한국 공개특허 제10-2017-0024808호에 개시된 비전검사모듈로 구성될 수 있다.For example, the 5D inspection unit 830 may be composed of a vision inspection module disclosed in Korean Patent Laid-Open No. 10-2017-0024808.
상기 전기테스트부(850)는, 검사결과에 따라 불량인 경우 소자회수를 위한 리젝부(840), 소자(10)에 대한 간단한 전기적 테스트를 수행하는 구성으로서, 검사방식에 따라서 다양한 구성이 가능하다.The electrical test unit 850 is a configuration for performing a simple electrical test on the reject unit 840 for the element recovery, the device 10 in case of failure according to the inspection result, various configurations are possible according to the inspection method. .
예로서, 상기 전기테스트부(850)는, 픽커(410)에 의하여 픽업된 소자(10)의 저면에 형성된 단자와의 전기적 접촉 및 전기 인가 등에 의하여 전기적 테스트를 수행하는 등 그 테스트 방식에 따라서 다양한 구성이 가능하다.For example, the electrical test unit 850 may perform electrical tests such as electrical contact with the terminals formed on the bottom surface of the device 10 picked up by the picker 410, electrical application, or the like. Configuration is possible.
이상은 본 발명에 의해 구현될 수 있는 바람직한 실시예의 일부에 관하여 설명한 것에 불과하므로, 주지된 바와 같이 본 발명의 범위는 위의 실시예에 한정되어 해석되어서는 안 될 것이며, 위에서 설명된 본 발명의 기술적 사상과 그 근본을 함께 하는 기술적 사상은 모두 본 발명의 범위에 포함된다고 할 것이다.Since the above has been described only with respect to some of the preferred embodiments that can be implemented by the present invention, the scope of the present invention, as is well known, should not be construed as limited to the above embodiments, the present invention described above It will be said that both the technical idea and the technical idea which together with the base are included in the scope of the present invention.

Claims (5)

  1. 미리 설정된 기능을 수행하는 기능모듈(200)과;A function module 200 for performing a preset function;
    상기 기능모듈(200)의 이동을 가이드하는 가이드로봇(100)과;A guide robot 100 for guiding the movement of the function module 200;
    상기 가이드로봇(100)에 결합되어 상기 기능모듈(200)에 대하여 전원을 공급하는 전원공급부(120)와;A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200;
    상기 가이드로봇(100)을 따라서 상기 기능모듈(200)을 이동시키는 이동구동부(300)를 포함하는 것을 특징으로 하는 무선이동모듈.Wireless moving module comprising a movement driving unit 300 for moving the function module 200 along the guide robot (100).
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 기능모듈(200)은, The function module 200,
    진공압에 의하여 소자(20)를 픽업하는 하나 이상의 픽커(410) 및 하나 이상의 카메라(533) 중 적어도 하나를 포함하는 작동부(400)와,An operation unit 400 including at least one of one or more pickers 410 and one or more cameras 533 to pick up the element 20 by vacuum pressure,
    상기 작동부(400)의 작동제어를 위한 제어신호를 무선에 의하여 메인제어부로부터 수신하여 상기 작동부(400)를 제어하는 무선제어부(220)를 포함하는 것을 특징으로 하는 무선이동모듈.And a wireless control unit (220) for controlling the operation unit (400) by receiving a control signal for controlling the operation of the operation unit (400) by wireless.
  3. 청구항 2에 있어서,The method according to claim 2,
    상기 무선제어부(220)는, The wireless control unit 220,
    지그비통신모듈, 블루투스통신모듈, Wifi통신모듈, 적외선통신모듈, LTE통신모듈 및 2.5Ghz무선통신모듈 중 적어도 하나를 포함하는 것을 특징으로 하는 것을 특징으로 하는 무선이동모듈.ZigBee communication module, Bluetooth communication module, Wifi communication module, wireless communication module, characterized in that it comprises at least one of the infrared communication module, LTE communication module and 2.5Ghz wireless communication module.
  4. 청구항 1에 있어서,The method according to claim 1,
    상기 가이드로봇(100)은, 상기 기능모듈(200)에 대한 직선, 곡선 및 폐곡선 형상 중 적어도 하나의 이송경로를 가지는 것을 특징으로 하는 무선이동모듈.The guide robot (100), the mobile module, characterized in that it has at least one transport path of the straight, curved and closed curve shape for the function module (200).
  5. 청구항 1에 있어서,The method according to claim 1,
    상기 가이드로봇(100)은, The guide robot 100,
    상기 기능모듈(200)에 대한 X-Y가이드로봇 또는 X-Y-θ로봇인 것을 특징으로 하는 무선이동모듈.Wireless moving module, characterized in that the X-Y guide robot or X-Y-θ robot for the functional module (200).
PCT/KR2017/006215 2016-06-14 2017-06-14 Wireless movement module, and element handler having same installed therein WO2017217771A1 (en)

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