WO2017217771A1 - Module de déplacement sans fil et dispositif de manipulation d'élément comportant ledit module - Google Patents

Module de déplacement sans fil et dispositif de manipulation d'élément comportant ledit module Download PDF

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Publication number
WO2017217771A1
WO2017217771A1 PCT/KR2017/006215 KR2017006215W WO2017217771A1 WO 2017217771 A1 WO2017217771 A1 WO 2017217771A1 KR 2017006215 W KR2017006215 W KR 2017006215W WO 2017217771 A1 WO2017217771 A1 WO 2017217771A1
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Prior art keywords
module
wireless
unit
guide robot
movement
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PCT/KR2017/006215
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English (en)
Korean (ko)
Inventor
유홍준
이용식
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(주)제이티
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Publication of WO2017217771A1 publication Critical patent/WO2017217771A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the present invention relates to a wireless mobile module, and more particularly, to a wireless mobile module for guiding movement of a functional module that performs a predetermined function such as device pickup and image acquisition in detail, and a device handler in which the mobile device is installed.
  • Semiconductor devices such as SD RAM, flash lamp, LSI and LED (hereinafter referred to as 'devices') are generally shipped to the market after the sawing process and the packaging process after the semiconductor process.
  • the products of the good products are sorted and shipped to the market through the automatic inspection and classification according to the inspection result by the inspection device, the classification device, the inspection and the classification device.
  • the types of chips are diversified, such as terminal frames such as lead frames and BGAs, such as SD RAM, flash RAM, and LSI.
  • the device handler In particular, in semiconductor production, it is important for the device handler to unload the device at the wafer level and also to increase the processing speed of the equipment, and the performance of the mobile device for picking up and transferring the device is an important factor in the processing speed of the device handler.
  • the moving device includes one or more pickers, and the picker is generally provided with one or more pickers, and is a mechanism for adsorbing the device.
  • a suction passage through which a vacuum pressure is applied is formed, and the device is sucked at one end thereof.
  • a rod to which the adsorption part is coupled and a vertical driving part for moving the rod in the vertical direction are provided.
  • the conventional picker picks up a device by forming a vacuum pressure, that is, a negative pressure, at the pick-up position at the pick-up position and releases the vacuum pressure at the pick-up position by releasing the vacuum pressure.
  • conventional pickers generally form a positive pressure in the adsorption section for rapid loading of the element at the loading position.
  • the device when the size of the device becomes finer, such as an LED device, when a positive pressure is formed in the adsorption unit that adsorbs the device, the device may be scattered or may be prevented from being loaded in the correct position.
  • the positive pressure or the negative pressure in the picker's adsorption head is formed by a pneumatic delivery line.
  • the positive or negative pressure forming time through the pneumatic delivery line is determined by the length of the pneumatic delivery line, so to reduce the positive pressure or negative pressure forming time.
  • There is a limitation in minimizing the length of the line which in turn serves as a limitation of the processing speed of the device.
  • a picker for transporting devices as a picker performance also requires fast movement from a pickup position to a loading position, faster device pickup, and device loading. Doing.
  • Patent Document 1 KR10-2010-0081277 A
  • Patent Document 2 KR10-0580816 B
  • Patent Document 3 KR10-0443039 B
  • Patent Document 4 KR10-2004-0096409 A
  • Patent Document 5 KR10-2011-0051301 A
  • Patent Document 6 KR10-2012-0047879 A
  • Patent Document 7 KR10-2016-0048628 A
  • Patent Document 7 KR10-1134985 B
  • an object of the present invention is to provide a wireless moving module capable of supplying wireless power and controlling wirelessly to a function module that performs a preset function such as a picker and a camera, and a device handler having the same.
  • the present invention was created in order to achieve the object of the present invention as described above, the present invention, the function module 200 for performing a predetermined function; A guide robot 100 for guiding the movement of the function module 200; A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200; Disclosed is a wireless moving module comprising a moving driver 300 for moving the function module 200 along the guide robot 100.
  • the function module 200 may include an operation unit 400 including at least one of one or more pickers 410 and one or more cameras 533 to pick up the element 20 by vacuum pressure, and the operation unit 400. It may include a wireless control unit 220 for controlling the operation unit 400 by receiving a control signal for controlling the operation of the wireless control unit from the main control unit by wireless.
  • the wireless controller 220 may include at least one of a Zigbee communication module, a Bluetooth communication module, a Wifi communication module, a gigawi communication module, an infrared communication module, an LTE communication module, and a 2.5Ghz wireless communication module.
  • the guide robot 100 may have a transport path of at least one of a straight line, a curved line, and a closed curve shape with respect to the function module 200.
  • an X-Y guide robot or an X-Y- ⁇ robot for the function module 200 may be used as the guide robot 100.
  • the function module such as a picker, a camera is coupled and the function module is controlled by wireless power supply and wireless communication to remove the power supply line, signal transmission line for control, etc.
  • the wireless mobile module and the element handler according to the present invention according to the present invention is simple to manufacture by minimizing the connection to the outside in the operation and control of a plurality of functional modules, such as a plurality of pickers, cameras, By minimizing the number of means for connecting to and has the advantage of minimizing maintenance due to wear and damage of parts.
  • FIG. 1 is a block diagram showing the configuration of a wireless mobile module according to the present invention.
  • FIG. 2 is a perspective view showing an embodiment of the wireless mobile module of FIG. 1.
  • FIG. 3 is a partial side view showing an embodiment of the wireless mobile module of FIG. 2.
  • FIG. 4 is a side cross-sectional view in the II-II direction in FIG. 3.
  • 5A and 5 are plan views illustrating examples of the shape of the wireless mobile module of FIG. 3.
  • FIG. 6 is a plan view illustrating an embodiment of a device handler to which FIG. 5A is applied.
  • the present invention is characterized in that the wireless power supply and wireless control of the functional module 200, such as a device handler picker, camera, etc. in the device is possible.
  • the application field of the present invention is not limited as a wireless mobile module if the device handler for performing the classification, inspection, etc. of the device, as well as a wireless power supply and wireless control for a function module that performs a predetermined function. to be.
  • the wireless moving module according to the present invention, as shown in Figures 1 and 2, the function module 200 for performing a predetermined function; A guide robot 100 for guiding the movement of the function module 200; A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200; It includes a movement driving unit 300 for moving the function module 200 along the guide robot (100).
  • the function module 200 is configured to perform a preset function, and in the case of an element handler, performs a preset function such as a pickup tool for performing an element pickup by a vacuum pressure, an image acquisition unit for acquiring an image for an element, etc. It can be a module.
  • the guide robot 100 may be configured to guide the movement of the function module 200 as long as the guide robot 100 is configured to guide the movement of the function module 200.
  • the guide robot 100 may have a transport path of various structures, such as a transport path of at least one of a straight line, a curve, and a closed curve shape with respect to the function module 200.
  • the guide robot 100 is a linear movement robot for guiding linear movements of the function module 200 in the X-axis direction, the Y-axis direction, the Z-axis direction, and the like.
  • Various configurations are possible according to the movement method such as XY mobile robot to guide, XYZ mobile robot to guide linear movement in XYZ direction, XY- ⁇ mobile robot to guide XY- ⁇ movement.
  • the power supply unit 120 is coupled to the guide robot 100 to supply power to the function module 200 in a state in which the function module 200 is movable on a transport path installed in the guide robot 100. Any configuration can be used as long as it can supply power to the function module 200.
  • the power supply unit 120 is composed of a power supply line (not shown) installed along a transport path installed in the guide robot 100, wherein the function module 200 is in contact with the power supply line to receive power
  • the receiving terminal can be installed.
  • the power supply unit 120 may wirelessly supply power to the functional module 200 by various methods such as wireless power transmission, that is, magnetic induction or magnetic resonance.
  • the power supply unit 120 may supply power to the function module 200 by a combination of power transfer by contact and power transfer by non-contact (electromagnetic induction, etc.).
  • the vehicle may be transferred to the functional module 200 from the X-axis guide member 101 to the functional module 200 in a non-contact manner such as a magnetic induction method or a magnetic resonance method. .
  • the power supply unit 120 may include a rechargeable battery coupled to the function module 200 to supply power in addition to power transmission in real time.
  • the movement driving part 300 is configured to move the function module 200 along the guide robot 100, and various configurations are possible.
  • the movement driving unit 300 may be configured in various ways according to the movement of the functional module 200, such as linear movement module, such as screw jack, linear module.
  • the movable driving unit 300 may be configured in various ways, such as having a non-contact driving structure by magnetic force in addition to the mechanical driving structure by the coupling structure.
  • a wireless moving module applied to an element handler includes: a function module 200 for performing a preset function, as shown in FIGS.
  • a guide robot 100 for guiding the movement of the function module 200;
  • a power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200;
  • It includes a movement driving unit 300 for moving the function module 200 along the guide robot (100).
  • the device handler in which the device handler moving device according to the present invention is used is a device for performing post-processing of semiconductor devices such as inspection and classification of semiconductor devices 10 and classification of semiconductor devices that have been inspected in advance. It can be various devices such as a device.
  • a semiconductor device is a device that has been packaged after a semiconductor process and a chip that is installed on a substrate after a semiconductor process such as a WLCSP made of chips at a wafer level and performs a specific function according to a predesigned specification. You can be a target.
  • the guide robot 100 as a configuration for guiding the movement of the function module 200, constitutes a path for the transfer of the wireless mobile module on the device handler, it is possible to various configurations depending on the transfer path of the wireless mobile module.
  • the guide robot 100 may have a straight line shape, or may have various shapes such as a curved line and a closed curve shape in addition to the straight line shape.
  • the guide robot 100 is provided with alternating movement guide parts 111 alternately moving between a pair of guide robots 100 arranged in parallel to each other and parallel to both ends. Can be.
  • the guide robot 100 is coupled to the guide coupling unit 240 installed in the function module 200 to be described later, and can be configured in a pair as a configuration for guiding the movement of the function module 200.
  • the power supply unit 120 is installed in parallel with the transport path of the guide robot 100, a variety of configurations for supplying power to the member that requires power supply, such as the operation unit 400 installed in the functional module 200 to be described later Configuration is possible.
  • the power supply unit 120 is configured to supply power by contact or wirelessly to the power receiver 210 installed in the mobile body 103, which will be described later.
  • the power supply unit 120 may supply power to the power receiver 210 wirelessly by various methods such as a magnetic induction method, a magnetic resonance method.
  • the power receiver 210 may be configured to supply power to a member that requires power supply without a charging function, or may include various configurations such as a charging battery capable of electric charging.
  • the power supply unit 120 does not need to be installed when the power receiver 210 includes a charging battery and is discharged in a manner of replacing the charging battery by manual labor or when moved to a specific position. to be.
  • the power supply unit 120 in addition to the wireless supply method, the power supply line is installed along the guide robot 100 can of course supply power by contact.
  • the movement driving unit 300 is a configuration in which the moving body 103 is moved along the guide robot 100 is possible in a variety of configurations.
  • the movement driving part 300 may be configured in various ways according to the movement driving method of the moving body 103 along the guide robot 100.
  • the moving unit 300 may be installed by applying a moving system including a permanent magnet and a coil, for example, a linear moving system disclosed in Korean Patent No. 10-0977471 and US Patent No. 8686669. Can be.
  • a moving system including a permanent magnet and a coil for example, a linear moving system disclosed in Korean Patent No. 10-0977471 and US Patent No. 8686669. Can be.
  • the function module 200, the power receiving unit 210 that is supplied by the power or wirelessly from the power supply unit 120 and the guide coupling unit 240 to be movable along the guide robot 100 is coupled Various configurations are possible as the configuration to be installed.
  • the guide coupling part 240 is configured to couple the function module 200 along the guide robot 100 so as to be movable, and various configurations are possible according to the coupling method.
  • the power receiver 210 is configured to receive power from the power supply unit 120 by contact or wirelessly.
  • the power receiver 210 may be configured to supply power to members installed in the function module 200 and requiring electricity supply.
  • the power receiving unit 210 may include a charging battery for sufficient power supply, stable power supply, and the like.
  • the function module 200 may include at least one of one or more pickers 410 and one or more cameras 533 that pick up the element 20 by vacuum pressure, in addition to the power receiver 210 and the guide coupler 240. It includes an operating unit 400 and a wireless control unit 220 for controlling the operation unit 400 by receiving a control signal for controlling the operation of the operation unit 400 from the main control unit 10 by wireless. Can be.
  • the function module 200 may have any configuration as long as it is a moving object that requires movement during operation in the device handler such as the picker 410 and the camera 533.
  • the operation unit 400 is installed in the function module 200 and performs a function required while moving, such as device pickup and image acquisition, and various configurations are possible according to functions.
  • the operation unit 400 may include one or more pickers 410 that pick up the device 20 by vacuum pressure.
  • the at least one picker 410 is configured to pick up the element 20 by vacuum pressure, and a pickup head for picking up the element 20 by vacuum pressure, and a pneumatic connection line connected to the vacuum pressure transmission device 500 ( 510 and 520 may be configured in a variety of configurations, including a rod receiving vacuum pressure.
  • the pneumatic connection lines 510 and 520 are configured to transfer the vacuum pressure from the vacuum pressure transmission device 500 to the rod of the picker 410 and are branched from the main connection line 510 and the main connection line 510 to each picker ( Various configurations are possible, including a branch line 520 connected to a rod of the 410.
  • a valve for rapid vacuum pressure release and release from the pick-up head is preferably installed at a position closest to the pick-up head.
  • valve for vacuum pressure formation and release at the pickup head may be driven by an actuator 531.
  • the actuator 531 performs vacuum pressure formation and release at the pickup head, and is operated by power supply from the power receiver 210 described above and control of the wireless controller 220 described later.
  • the operation unit 400 may include one or more driving motors 532 for moving the picker 410 such as shanghai (Z-axis), horizontal movement (X-axis, Y-axis, XY-axis), rotation, and the like. ) May be included.
  • driving motors 532 for moving the picker 410 such as shanghai (Z-axis), horizontal movement (X-axis, Y-axis, XY-axis), rotation, and the like. ) May be included.
  • the picker 410 in the state coupled to the functional module 200, various movement methods such as Shanghai East (Z axis direction), horizontal movement (X axis direction, Y axis direction, XY axis direction), rotation Can be moved by.
  • the driving motor 532 is operated by the power supply from the power receiver 210 described above and the control of the wireless control unit 220 to be described later.
  • the actuator 400 may include one or more cameras 533 with or without one or more pickers 410.
  • the camera 533 is coupled to the function module 200 and is also a device for acquiring an image such as a device, and can be configured in various ways such as a scanner and a digital camera.
  • the camera 533 is operated by the power supply from the power receiver 210 and the control of the wireless controller 220 to be described later.
  • the operation unit 400 may be additionally or separately coupled to a module capable of performing a function required in the device handler while being moved in addition to the picker 410 and the camera 533.
  • the wireless control target of the functional module 200 may be any target as long as the wireless control target such as an actuator, a motor, a camera, and the like.
  • the wireless controller 220 may be configured to receive a control signal for controlling the operation of the operator 400 from the main controller 10 by wireless to control the operator 400.
  • the wireless controller 220 may include a communication module including at least one of a Zigbee communication module, a Bluetooth communication module, a Wifi communication module, an infrared communication module, an LTE communication module, and a 2.5Ghz wireless communication module.
  • a communication module including at least one of a Zigbee communication module, a Bluetooth communication module, a Wifi communication module, an infrared communication module, an LTE communication module, and a 2.5Ghz wireless communication module.
  • the wireless controller 220 may be installed in one or more according to the number of the function module 200 and the operation unit 400 coupled thereto, and the plurality of function modules 200 and the operation unit according to the control method. 400 can be controlled.
  • the wireless control unit 220 may be configured as one and control the plurality of function modules 200 and the operation unit 400.
  • the wireless controller 220 includes a function module 200 and an operation unit 400 coupled thereto in a single module unit to control modules corresponding to each module unit (# 1 to #n; n). Are each composed of two or more natural numbers) and can be individually controlled.
  • the wireless controller 220 wirelessly receives a control signal from the main controller 10 by one communication module, and control modules # 1 to #n corresponding to each module unit are n 2 or more natural numbers) can be individually controlled by a wired connection.
  • the wireless transfer module according to the present invention is a transfer module that picks up and transfers the element 10, and has a loading member 50 in which a plurality of elements 10 are loaded, such as a wafer.
  • the element 10 may be applied to an element handler that picks up the element 10 from and loads the element 10 into the unloading members 40 and 20.
  • the element handler to which the wireless transfer module according to the present invention is applied is a sorter for classifying and loading the inspected element 10, and picking up the element 10 from the loading member 50 to perform a preset inspection.
  • a sorter for classifying and loading the inspected element 10, and picking up the element 10 from the loading member 50 to perform a preset inspection.
  • Various configurations are possible depending on the type of inspection such as an element handler loaded and unloaded on the loading members 40 and 20, an inspection method, a classification method, and an unloading member.
  • the element handler to which the wireless transfer module according to the present invention is applied includes a loading member table and a loading member table for moving a loading member 50 loaded with a plurality of elements 10 to a pickup position of the element 10.
  • An unloading unit in which one or more unloading members 40 and 20 are placed and spaced apart from each other and loaded with the element 10 from the loading member 50, and the element 10 from the loading member 50. After picking up and may be configured to include a wireless transfer module for loading in one or more unloading members (40, 20) by linear movement.
  • the loading member table is configured to move the loading member 50 loaded with a plurality of elements 10 to a pickup position of the element 10, and thus various configurations may be made according to the type and the moving method of the loading member 50. .
  • the loading member table may be configured as an X-Y- ⁇ table.
  • a needle pin may be installed below the X-Y- ⁇ table to correspond to the pickup position for picking up the device 10 by the picker 410 constituting the wireless transfer module.
  • the unloading unit is a configuration in which one or more unloading members 40 and 20 are disposed at a position spaced apart from the loading member table to receive and load the element 10 from the loading member 50. , 20)
  • a variety of configurations are possible depending on the number and type.
  • the unloading members 40 and 20 may be carrier tapes sealed by cupper tapes after device loading, trays having a plurality of loading grooves on which the devices 10 are loaded.
  • the unloading unit may be configured to move through a loading position so that the elements 10 may be sequentially loaded on the unloading members 40 and 20.
  • the conveying direction of the unloading members 40 and 20 may be an arrangement direction between the loading member table and the unloading portion, that is, a direction perpendicular to the X-axis direction, that is, the Y-axis direction.
  • the wireless transfer module may have a configuration as described above as a configuration for picking up the element 10 from the loading member 50 and then loading it into one or more unloading members 40 and 20 by linear movement.
  • the transport path of the guide robot 100 constituting the wireless transfer module as shown in Figure 6, the arrangement direction between the loading member table and the unloading portion, that is, a linear portion parallel to the X-axis direction is set This is preferred.
  • the transfer path of the guide robot 100 constituting the wireless transfer module a pair of linear portions parallel to the X-axis direction, both ends of the connection connecting the two ends of the pair of linear portions to form an endless track It can consist of people.
  • the transfer path of the guide robot 100 constituting the wireless transfer module as described above is set in a linear direction parallel to an arrangement direction, that is, an X axis direction, between the loading member table and the unloading part.
  • functional modules for additional functions may be sequentially arranged in the device handler, such as an electrical test unit 850 that performs a simple electrical test on the device 10.
  • the under vision unit 810 may be configured to calculate and align a horizontal error (rotational error) of the device when the device is unloaded on the unloading member on the transport path.
  • the under vision unit 810 is installed at a lower side of a path through which the element 10 picked up by the picker 410 is transported to photograph the bottom surface of the element 10 picked up by the picker 410. It can be configured as a camera.
  • the image obtained by the camera may be used to calculate a rotational error of the element 10 picked up by the picker 410 or as data for checking a state of the bottom surface of the element 10.
  • the alignment unit 820 is a configuration for aligning the horizontal error calculated by the under vision unit 810 and aligns the horizontal error of the element 10 picked up by the picker 410. Various configurations are possible depending on the method.
  • the 5D inspection unit 830 is configured to inspect four side surfaces and a bottom surface of the rectangular element 10, and various configurations are possible according to the 5D inspection method.
  • the 5D inspection unit 830 may be composed of a vision inspection module disclosed in Korean Patent Laid-Open No. 10-2017-0024808.
  • the electrical test unit 850 is a configuration for performing a simple electrical test on the reject unit 840 for the element recovery, the device 10 in case of failure according to the inspection result, various configurations are possible according to the inspection method. .
  • the electrical test unit 850 may perform electrical tests such as electrical contact with the terminals formed on the bottom surface of the device 10 picked up by the picker 410, electrical application, or the like. Configuration is possible.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manipulator (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention porte sur un module de déplacement sans fil, plus spécifiquement sur un module de déplacement sans fil permettant de guider le déplacement d'un module fonctionnel de manière à exécuter une fonction préalablement configurée, telles que la capture d'un élément et l'acquisition d'une image, et sur un dispositif de manipulation d'élément intérieurement équipé dudit module de déplacement sans fil. Le module de déplacement sans fil comprend : un module fonctionnel (200) servant à exécuter une fonction préalablement configurée ; un robot de guidage (100) servant à guider le déplacement du module fonctionnel (200) ; une unité d'alimentation (120), couplée au robot de guidage (100), servant à alimenter en énergie le module fonctionnel (200) ; et une unité d'entraînement de déplacement (300) servant à déplacer le module fonctionnel (200) en fonction du robot de guidage (100).
PCT/KR2017/006215 2016-06-14 2017-06-14 Module de déplacement sans fil et dispositif de manipulation d'élément comportant ledit module WO2017217771A1 (fr)

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KR1020160073776A KR20170140963A (ko) 2016-06-14 2016-06-14 무선이동모듈, 그가 설치된 소자핸들러
KR10-2016-0073776 2016-06-14

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WO2017217771A1 true WO2017217771A1 (fr) 2017-12-21

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TW (1) TWI652216B (fr)
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Cited By (1)

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CN111559645A (zh) * 2020-05-22 2020-08-21 苏州天准科技股份有限公司 纳米晶材料搬运设备及纳米晶材料检测系统

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