WO2024049248A1 - Manipulateur de dispositif - Google Patents

Manipulateur de dispositif Download PDF

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Publication number
WO2024049248A1
WO2024049248A1 PCT/KR2023/013021 KR2023013021W WO2024049248A1 WO 2024049248 A1 WO2024049248 A1 WO 2024049248A1 KR 2023013021 W KR2023013021 W KR 2023013021W WO 2024049248 A1 WO2024049248 A1 WO 2024049248A1
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WO
WIPO (PCT)
Prior art keywords
unit
waffle pack
stage
unloading
loaded
Prior art date
Application number
PCT/KR2023/013021
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English (en)
Korean (ko)
Inventor
유홍준
Original Assignee
(주)제이티
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Publication date
Application filed by (주)제이티 filed Critical (주)제이티
Publication of WO2024049248A1 publication Critical patent/WO2024049248A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the present invention relates to a device handler, and more specifically, to a device handler that loads good quality devices among wafer-state devices into a waffle pack according to inspection results.
  • a device is an integrated circuit made of a semiconductor whose electrical conductivity is higher than that of an insulator and lower than that of a conductor such as metal.
  • a chip referred to a thin piece of plate, but is currently used to refer to a semiconductor circuit.
  • the device is made by integrating various devices such as transistors, resistance capacitors, etc. on a thin silicon wafer measuring about 1cm in length and width.
  • Elements are the basic components that make modern computers and are the core of performing arithmetic operations, information memory, and control of other chips, and support the electronics industry.
  • the above devices include CPU, SDRAM (memory semiconductor), flash RAM, etc., and recently, display drive ICs (DDI), such as COG (Chip On Glass) and COF (Chip On Film), etc. It is becoming more diverse.
  • DPI display drive ICs
  • the above-mentioned devices are inspected for appearance, etc. to increase reliability before shipping, and after selecting defective devices, only good devices are shipped.
  • the inspection process for devices can be performed several times during the device manufacturing process, and in particular, it can be performed after each device is cut in a wafer state, and can be displayed on the devices according to the results of each inspection.
  • the production speed of devices depends on the processing speed of the inspection device or classification device.
  • a conventional device handler that loads devices into a waffle pack must unload the filled waffle pack and load an empty waffle pack when the waffle pack is completely filled with devices during the loading process from the wafer to the waffle pack.
  • Patent Document 1 KR 10-1052726 B1
  • the purpose of the present invention is to provide a device handler that can quickly perform unloading and sorting operations of devices by additionally providing a temporary loading unit for temporarily loading devices from the wafer in order to solve the above problems. .
  • Another object of the present invention is to provide an element handler that can use multiple types of waffle packs based on plan size.
  • the present invention was created to achieve the object of the present invention as described above, and the present invention includes a wafer ring loading unit 100 on which a wafer ring 20 loaded with devices 10 is loaded; a wafer moving table 200 that receives the wafer ring 20 from the wafer ring loading unit 100 and moves the wafer ring 20 on which the device 10 is loaded; a transfer tool 300 that picks up the device 10 from the pickup position (P) of the wafer ring 20 of the wafer transfer table 200 and transfers the device 10 to the unloading position (U); a temporary loading unit 400 that positions the waffle pack 30 at the unloading position (U) in order to unload the element 10 delivered by the transfer tool 300; The waffle pack 30, which is installed adjacent to the temporary loading unit 400 and loaded with elements 10, is delivered by the waffle pack transfer unit 530 to classify and unload good and defective elements 10.
  • a device handler characterized by including an unloading unit 500 is presented.
  • the transfer tool 300 includes a plurality of pickers 310 that pick up the device 10 from the wafer ring 20 on the wafer moving table 200, and the plurality of pickers 310 are positioned at the pickup position ( a rotation drive unit that rotates in the horizontal direction to be sequentially positioned at P) and the unloading position (U); It may include a support arm portion 320 extending horizontally from the rotation drive portion to support each of the plurality of pickers 310.
  • the temporary loading unit 400 includes a stage unit 410 on which the waffle pack 30 is mounted; It may include a stage moving unit 420 that moves the stage unit 410 back and forth between the unloading position (U) and the waffle pack loading unit 630 on which the empty waffle packs 30 are loaded.
  • the stage moving unit 420 is a first reciprocating movement of the stage unit 410 in the Y-axis direction between the unloading position (U) and the waffle pack loading unit 630 on which the empty waffle pack 30 is loaded.
  • a moving unit 421 and a second transfer unit 422 that moves the stage unit 410 in the It can be included.
  • the stage moving unit 420 may further include a rotation moving unit that rotates the stage unit 410 using the Z axis, which is perpendicular to the X and Y axes, as a rotation axis.
  • the stage unit moving unit 420 may be installed as a pair so that the stage unit 410 is arranged vertically.
  • the waffle pack 30 has a rectangular planar shape, and the stage unit 410 has planar sizes ranging from the smallest to the largest to enable seating of multiple types of waffle packs 30 having different planar sizes.
  • a plurality of seating portions 411, 412, and 413 may be formed on the upper side in that order.
  • the stage unit 410 may be coupled with an alignment unit 440 for aligning the seating state of the waffle pack 30 mounted on the corresponding seating units 411, 412, and 413.
  • the stage unit 410 may have a through opening 419 formed in the center so that the mounted waffle pack 30 can be moved up and down.
  • the unloading unit 500 includes two or more units installed adjacent to the temporary loading unit 400 to receive the waffle pack 30 loaded with the element 10 and unload it into the waffle pack loading unit 610. It may include an unloading transfer unit (510, 520).
  • the unloading transfer units 510 and 520 include a first unloading transfer unit 510 that unloads the waffle pack 30 loaded with good quality elements 10 into the waffle pack loading unit 610, and It includes a second unloading transfer unit 520 for unloading the waffle pack 30 loaded with the elements 10 into the waffle pack loading unit 610, wherein the first unloading transfer unit 510 and the The second unloading transfer unit 520 receives the waffle pack 30 from the waffle pack transfer unit 530 and then removes the waffles from the first unloading transfer unit 510 by the element sorting tool 540.
  • the pack 30 may be sorted so that good elements 10 are loaded, and the waffle pack 30 of the second unloading transfer unit 520 may be loaded with defective elements 10.
  • the unloading transfer units 510 and 520 include stage units 511 and 521 on which the waffle pack 30 is mounted; It may include stage moving parts 512 and 522 that reciprocate the stage parts 511 and 521 between the position where the waffle pack 30 is delivered and the waffle pack loading part 610 where the waffle pack 30 is loaded. there is.
  • the waffle pack 30 has a rectangular planar shape, and the stage parts 511 and 521 are sized from the smallest to the largest to enable seating of multiple types of waffle packs 30 having different planar sizes.
  • a plurality of seating parts may be formed on the upper side in order of plane size.
  • the stage parts 511 and 521 may be coupled with an alignment part for aligning the seating state of the waffle pack 30 seated on the corresponding seating part.
  • the stage units 511 and 521 may have through openings 511a and 521a formed in the centers to allow the mounted waffle pack 30 to move up and down.
  • the device handler according to the present invention has the advantage of significantly increasing UPH (number processed per hour) by additionally providing a temporary loading unit to temporarily load devices from the wafer, thereby quickly performing unloading and sorting operations of devices.
  • the element handler according to the present invention uses a stage that can seat waffle packs of different specifications based on the plane size, allowing the use of multiple types of waffle packs, increasing the usability of the device by changing only the waffle pack according to the specifications. There is an advantage in reducing additional facility investment costs due to changes in waffle pack specifications.
  • FIG. 1 is a layout diagram showing the configuration of an element handler according to the present invention.
  • Figures 2a and 2b are a perspective view and a cross-sectional view, respectively, showing the structure of the wafer.
  • FIG 3 is a perspective view showing the waffle pack used in the element handler of Figure 1.
  • FIG. 4 is a front view of the element handler of FIG. 1 seen from the front.
  • FIG. 5A is a plan view showing a partial configuration of the temporary loading unit in the device handler of FIG. 1.
  • Fig. 5b is a front view of the temporary loading part of Fig. 5a as seen from the front.
  • FIG. 6A is a plan view showing the stage portion of the temporary loading unit of FIG. 5A.
  • Figure 6b is a plan view showing the operating state of the alignment part in the stage part of Figure 6a.
  • FIGS. 7A to 7C are cross-sectional views in the A-A direction, B-B direction, and C-C direction in FIG. 6B, respectively.
  • FIGS. 8A and 8B are conceptual diagrams showing the operation of the unloading unit in the device handler of FIG. 1.
  • Figure 9 is a cross-sectional view showing a state in which waffle packs of different specifications are loaded on the stage shown in Figure 6a.
  • the device handler includes a wafer ring loading unit 100 on which a wafer ring 20 loaded with devices 10 is loaded; a wafer moving table 200 that receives the wafer ring 20 from the wafer ring loading unit 100 and moves the wafer ring 20 on which the device 10 is loaded; a transfer tool 300 that picks up the device 10 from the pickup position (P) of the wafer ring 20 of the wafer transfer table 200 and transfers the device 10 to the unloading position (U); a temporary loading unit 400 that positions the waffle pack 30 at the unloading position (U) in order to unload the element 10 delivered by the transfer tool 300;
  • the waffle pack 30, which is installed adjacent to the temporary loading unit 400 and loaded with elements 10, is delivered by the waffle pack transfer unit 530 to classify and unload good and defective elements 10. Includes an unloading unit 500.
  • the device 10 is a device that forms IC chips such as DDI (Display Drive IC), which are display drive chips such as COG (Chip On Glass) and COF (Chip On Film), LED devices, etc., and the wafer is used in the so-called semiconductor process and This is a device that has completed the cutting process (as well as the testing process and classification process). And, as shown in FIGS. 2A and 2B, the device 10 is transferred while being loaded on the wafer ring 20 after the cutting process.
  • DDI Display Drive IC
  • COG Chip On Glass
  • COF Chip On Film
  • the wafer ring 20 is a structure for loading and transporting the elements 10, and can have various configurations. As shown in FIGS. 2A and 2B, each element 10 is attached to the surface so that it is attached to the upper surface.
  • the wafer ring 20 may be composed of an adhesive tape having adhesiveness on the surface and a single coupling ring in which the adhesive tape is combined so that each element is attached to the upper surface.
  • the wafer ring 20 may have various shapes, such as circular or square, and may of course be composed of a single coupling ring in addition to a double coupling ring.
  • the waffle pack 30 is formed with a plurality of seating grooves 31 so that the element 10 can be seated, and may have various shapes such as rectangular.
  • the seating groove 31 is preferably formed deeper than the height of the element 10 to prevent damage when the waffle pack 30 is stacked vertically.
  • the wafer ring loading unit 100 includes a cassette loading unit 110 into which a wafer ring cassette loaded with a plurality of wafer rings 20 loaded with devices 10 is loaded;
  • the wafer ring 20 is used to exchange the first wafer ring 20 from which the element 10 is to be extracted and the second wafer ring 20 on which the element extraction is completed between the wafer ring cassette and the wafer ring moving table 200.
  • It may be configured to include a wafer ring movement tool 120 that moves the.
  • the wafer ring cassette is configured to stack a plurality of wafer rings 20 loaded with devices 10, and may be configured to stack the wafer rings 20, and the stacked wafer rings 20 may be sequentially extracted. It can be installed so that it can move up and down.
  • the wafer ring loading unit 100 operates on a wafer ring moving table ( After receiving the second wafer ring 20 from 200, in which the withdrawal of the device 10 is completed, and completing the transfer of the first wafer ring 20 to the wafer ring moving table 200, the second wafer ring 20 ) may additionally include a wafer ring buffer unit 130 that temporarily stores the second wafer ring 20 to transfer it to an empty space in the wafer ring cassette.
  • the wafer ring buffer unit 130 is a configuration for temporarily storing the wafer ring 20, and can have any configuration as long as it can support the wafer ring 20.
  • the wafer ring moving tool 120 is a configuration for transferring the wafer ring 20 between the wafer ring cassette and the wafer ring moving table 200, and can have various configurations, such as the same configuration as in Patent Document 1.
  • the wafer ring moving table 200 is configured to move the wafer ring 20 pulled out from the wafer ring cassette to the pull-out position (P) from which the transfer tool 300 can pull out the device 10, and has various configurations. This is possible, and as shown in FIG. 1, it can be configured to enable X-Y movement or X-Y- ⁇ movement.
  • X-Y refers to the Cartesian coordinate axis based on the horizontal plane of the wafer ring 20
  • ⁇ refers to rotation around the Z axis.
  • the wafer ring moving table 200 moves the wafer ring 20 to the extraction position (P)
  • the lower side of the extraction position (P) moves upward to facilitate pickup of the element 10, as shown in Patent Document 1.
  • one or more pressure pins (not shown) that pressurize the adhesive tape 21 of the wafer ring 20 may be additionally installed.
  • the number of press pins varies depending on the size of the element 10.
  • the pressure pin is configured to move according to the withdrawal position (P) of the element 10, a device for movement is added, which increases the manufacturing cost of the device, so it is preferable to be fixed, and therefore the withdrawal position (P) of the element 10 P) is preferably fixed.
  • the wafer ring 20 of the device 10 is placed in a state in which the wafer ring 20 can be seated in the seating groove 31 of the waffle pack 30.
  • a first image acquisition unit such as a camera may be installed to obtain an image of the wafer ring 20 and inspect the seating state of the device 10.
  • the first image acquisition unit may perform at least one of a vision inspection of the seated state and the upper surface of the device 10.
  • the transfer tool 300 is configured to pick up the element 10 at the pickup position (P) of the wafer ring 20 of the wafer moving table 200 and transfer the element 10 to the unloading position (U). As such, various configurations are possible.
  • the transfer tool 300 includes a plurality of pickers 310 that pick up the device 10 from the wafer ring 20 on the wafer movement table 200, as shown in FIGS. 1 and 4. and a rotation drive unit that rotates the plurality of pickers 310 in the horizontal direction to be sequentially positioned at the pickup position (P) and the unloading position (U); It may include a support arm portion 320 extending horizontally from the rotation drive portion to support each of the plurality of pickers 310.
  • the picker 310 can have various configurations depending on the pickup method, and includes an adsorption head (not shown) that adsorbs and picks up the element 10 by generating vacuum pressure while moving up and down (moving in the Z direction). Various configurations are possible.
  • the rotation drive unit is configured to rotate the plurality of pickers 310 in the horizontal direction so that they are sequentially positioned at the pickup position (P) and the unloading position (U), and is configured to rotate the plurality of pickers 310 according to the rotation method. Therefore, various configurations are possible.
  • the pickup position (P) is defined as the pickup position of the element 10 on the wafer ring 20 placed on the wafer ring moving table 200 by the transfer tool 300
  • the unloading position (U) is defined as the position at which the element 10 is loaded on the waffle pack 30 of the temporary loading unit 400, which will be described later.
  • the pickup position (P) is fixed to a specific position within the device considering that the position of the pressure pin, that is, the needle pin, is fixed.
  • the unloading position (U) is fixed to a specific position within the device in consideration of the rotation of the picker 310 of the transfer tool 300.
  • a second image acquisition unit such as a camera that acquires an image of the waffle pack 30 is installed on the upper side of the unloading position (U) so that the empty seating groove 31 of the waffle pack 30 is located at the correct position ( (not shown) may be installed.
  • the second image acquisition unit acquires an image of the waffle pack 30 to ensure that the empty seating groove 31 of the waffle pack 30 is located at the correct position, and various configurations such as a camera are possible.
  • the second image acquisition unit can also photograph the surface of the device 10 loaded on the waffle pack 30, and the acquired image can be used for vision inspection such as 2D inspection.
  • the plurality of pickers 310 are arranged in two, three, four, etc. pieces at equal intervals along the circumferential direction when viewed from above, and one is located at the pick-up position (P) on the wafering table 200.
  • another picker 310 is preferably positioned at the unloading position (U) and is preferably installed in an even number.
  • an under-vision unit 910 for checking the pickup state ( ⁇ rotation state) of the element 10 picked up at the pickup position (U) is installed in the plurality of It is installed on the movement path of the pickers 310.
  • the undervision unit 910 photographs the device 10 picked up by the picker 310 before the picker 310 that picks up the device 10 reaches the unloading position (U), and captures the device 10.
  • a component for checking the pickup status it may be composed of a camera or the like.
  • the support arm unit 320 extends in the horizontal direction from the rotation drive unit to support each of the plurality of pickers 310, and is installed in numbers corresponding to the number of pickers 310.
  • the temporary loading unit 400 is a component that positions the waffle pack 30 at the unloading position (U) in order to unload the element 10 delivered by the transfer tool 300, and has various configurations. possible.
  • the temporary loading unit 400 includes a stage unit 410 on which the waffle pack 30 is mounted; It may include a stage moving unit 420 that moves the stage unit 410 back and forth between the unloading position (U) and the waffle pack loading unit 630 on which empty waffle packs 30 are loaded.
  • the stage unit 410 is a configuration on which the waffle pack 30 is seated and can have various configurations.
  • stage unit 410 may be configured to enable the loading of multiple types of waffle packs 30 with different specifications based on the plane size.
  • the stage unit 410 has a plurality of types having different planar sizes.
  • a plurality of seating portions 411, 412, and 413 may be formed upward in order of planar size from the smallest to the largest.
  • the element handler can handle changes in the specifications of the waffle pack 30 used, thereby reducing device installation costs such as introducing additional devices. There is an advantage.
  • stage unit 410 is coupled with an alignment unit 440 for aligning the seating state of the waffle pack 30 seated on the corresponding seating units 411, 412, and 413. You can.
  • the alignment unit 440 is coupled to the stage unit 410 and is configured to align the seating state of the waffle pack 30 seated on the corresponding seating units 411, 412, and 413 in order to align the seating state, Various configurations are possible depending on the sorting method.
  • the alignment unit 440 is installed at one of the vertices of the corresponding seating units 411, 412, and 413 of the stage unit 410 by linear movement. It may be composed of a pressing member that presses the vertex of the waffle pack 30.
  • stage unit 410 may have a through opening 419 formed in the center so that the mounted waffle pack 30 can be moved up and down.
  • the through opening 419 is an opening formed in the center of the stage unit 410 so that the seated waffle pack 30 can be moved up and down, and can have various shapes.
  • a vacuum suction member (not shown) may be installed in the through opening 419 to stably fix the waffle pack 30 located at the unloading position (U).
  • stage unit 30 may be provided with a separate grip member (not shown) instead of the vacuum suction member to secure the waffle pack 30.
  • stage unit 410 as described above can also be used in the unloading unit 500, which will be described later, according to changes in the specifications of the waffle pack 30.
  • the stage moving unit 420 is a component that moves the stage unit 410 back and forth between the unloading position (U) and the waffle pack loading unit 630 on which empty waffle packs 30 are loaded.
  • Various configurations are possible depending on the moving sun and method of movement of (420).
  • the stage moving unit 420 reciprocates the stage unit 410 in the Y-axis direction between the unloading position (U) and the waffle pack loading unit 630 on which the empty waffle pack 30 is loaded.
  • a first moving part 421 that moves the stage part 410 in the 422) may be included.
  • the first moving unit 421 reciprocates the stage unit 410 in the Y-axis direction between the unloading position (U) and the waffle pack loading unit 630 on which the empty waffle pack 30 is loaded.
  • U unloading position
  • U waffle pack loading unit 630 on which the empty waffle pack 30 is loaded.
  • the first moving part 421 is a linear moving module and can be configured in various ways, such as a screw jack or a belt pulley type.
  • the waffle pack loading unit 630 may have the same or similar configuration as the waffle pack loading unit 610 of the unloading unit 500, which will be described later, and considering the structure of the stage unit 410, FIG. It may have the structure shown in Figures 8a and 8b.
  • the waffle pack loading unit 630 may be positioned below the stage unit 410, and may include one or more guide members 611 that guide the up and down movement of the waffle packs 30 in a stacked state, and the most It may include a bottom support portion 612 that supports the waffle rack 30 located on the lower side.
  • the bottom support portion 612 may be configured to be linearly movable in the horizontal direction so that the waffle pack 30 can fall onto the stage portion 410.
  • the bottom support portion 612 retreats so that the lifting member 613 can move downward and one After the waffle pack 30 is seated on the stage unit 410, it can be moved to the original position to support the remaining waffle packs 30, as shown in FIG. 6A.
  • the second moving unit 422 is a component that moves the stage unit 410 in the Configuration is possible.
  • the Y-axis movement of the first moving unit 421 is performed.
  • the seating groove 31 of the waffle pack 30 mounted on the stage part 410 is positioned at the unloading position (U).
  • the X-Y linear movement of the waffle pack 30 may not be enough, and the stage moving unit 420 moves perpendicular to the It may further include a rotational movement unit that rotates the stage unit 410 using the Z-axis forming the rotation axis.
  • the rotational movement unit rotates the stage unit 410 using the Z-axis, which is perpendicular to the X-axis and the Y-axis, as a rotation axis, and various configurations are possible.
  • the rotation movement unit may be composed of a rotation motor installed on the lower side of the stage unit 410.
  • the rotational movement unit may be composed of a pair of linear movement units that move each of a pair of side sides parallel to the X-axis among the side sides of the stage unit 410 to the X-axis.
  • the stage part 410 can be rotated using the Z-axis as the rotation axis by adjusting the moving direction and moving distance of at least one of the pair of side sides.
  • the pair of linear moving parts can be configured by merging with the second moving part 422 described above.
  • stage unit movable unit 420 allows the unloading of the element 10 at the unloading position (U) to be performed continuously
  • temporary loading unit 400 allows the stage unit 410 to perform continuous unloading. They can be installed as a pair to be placed vertically.
  • the temporary loading unit 400 can continuously unload the elements 10 at the unloading position (U).
  • the stage moving part 420 moves the stage part 410 to the waffle pack moving line to form a waffle, which will be described later. It can be transferred to the unloading unit 500 by the pack transfer unit 530.
  • the waffle pack transfer unit 530 is installed to be movable along the waffle pack movement line and picks up the waffle pack 30 from the stage unit 410 of the temporary jab 400 and unloads the unloading unit 500.
  • As a configuration for seating on the stage portion of the transfer units 510 and 520 various configurations are possible depending on the movement mode and grip structure of the waffle pack.
  • a third image acquisition unit may be additionally installed, and the image acquired by the third image acquisition unit is, It can be used to check the size and position of the waffle pack 30 mounted on the unit 410.
  • the third image acquisition unit is installed separately from the waffle pack transfer unit 530, or is combined with the waffle pack transfer unit 530 and moves together to determine the size, position, etc. of the waffle pack 30 mounted on the stage unit 410. can confirm.
  • the stage portion 410 may be formed with a cut portion 418 cut in the grip direction.
  • the unloading unit 500 is installed adjacent to the temporary loading unit 400 and receives the waffle pack 30 loaded with the elements 10 by the waffle pack transfer unit 530 to remove good and defective elements.
  • a configuration for classifying and unloading (10) various configurations are possible.
  • the unloading unit 500 is installed adjacent to the temporary loading unit 400 to receive the waffle pack 30 loaded with the element 10 and unload it into the waffle pack loading unit 610. It may include two or more unloading transfer units (510, 520).
  • the waffle pack loading unit 610 is configured so that the waffle packs 30 loaded with the elements 10 are stacked up and down, and various configurations are possible.
  • the waffle pack loading unit 610 may have a stage unit positioned below, and may include one or more devices that guide the up and down movement of the waffle packs 30 in a stacked state. It may include a guide member 611 and a bottom support portion 612 that supports the waffle rack 30 located at the lowermost side.
  • the bottom support part 612 may be configured to be linearly movable in the horizontal direction so that the waffle pack 30 can be introduced from the stage part 410.
  • the bottom support portion 612 retracts so that the waffle pack 30 rises while supported by the elevating member 613 and is introduced into the guide member 611, and FIG. 6B As shown, after the waffle pack 30 is delivered from the stage unit 410, it can be moved to the original position to support the waffle packs 30.
  • the lifting member 613 is a component that lifts and lowers the waffle pack 30 while supporting it so that it can be transferred from the stage unit to the guide member 611, and various configurations are possible.
  • the unloading transfer units 510 and 520 are installed adjacent to the temporary loading unit 400 to receive the waffle pack 30 loaded with the element 10 and unload it into the waffle pack loading unit 610.
  • a loading configuration various configurations are possible.
  • the unloading transfer units 510 and 520 have a stage unit having the same or similar configuration as the stage unit 410 of the temporary loading unit 400 described above, and the stage unit transfers the waffle pack 30. It may be composed of a linear movement unit that moves linearly from the receiving waffle pack movement line to the waffle pack loading unit 610, for example, in the Y-axis direction.
  • the waffle pack 30 be classified according to a classification grade such as a good grade or a defective grade according to a pre-inspection result.
  • the inspection of the device 10 is either an inspection performed by other inspection equipment before the introduction of the wafer ring 10, or an inspection performed by the undervision unit 910, the first image acquisition unit, the second image acquisition unit, etc. described above. This may be an inspection performed using an image.
  • the unloading transfer units 510 and 520 unload the waffle pack 30 loaded with good quality elements 10 into the waffle pack loading unit 610. It may include a first unloading transfer unit 510, which unloads the waffle pack 30 loaded with defective elements 10 into the waffle pack loading unit 610, and a second unloading transfer unit 520. You can.
  • the first unloading transfer unit 510 and the second unloading transfer unit 520 use the element sorting tool 540 after receiving the waffle pack 30 by the waffle pack transfer unit 530. Accordingly, good elements 10 are placed in the waffle pack 30 of the first unloading transfer unit 510, and defective elements 10 are placed in the waffle pack 30 of the second unloading transfer unit 520. They can be sorted so that they are loaded.
  • the element sorting tool 540 is installed to be movable along a sorting line, so that good quality elements 10 are placed in the waffle pack 30 of the first unloading transfer unit 510, and the second unloading transfer unit 510 is provided with a movable element sorting tool 540.
  • the waffle pack 30 of (520) is configured to transport defective elements 10 so that they are loaded, and a pair of pickers are provided in consideration of loading the element 10 into the empty seating groove 31 after picking up the element 10. It can be composed of:
  • the unloading transfer units 510 and 520 include stage units 511 and 521 on which the waffle pack 30 is mounted; It may include stage moving parts 512 and 522 that reciprocate the stage parts 511 and 521 between the position where the waffle pack 30 is delivered and the waffle pack loading part 610 where the waffle pack 30 is loaded. there is.
  • the waffle pack 30 has a rectangular planar shape, and the stage parts 511 and 521 have different planar sizes.
  • a plurality of seating portions may be formed upward in order of planar size from the smallest to the largest.
  • stage parts 511 and 521 may be coupled with an alignment part for aligning the seating state of the waffle pack 30 seated on the corresponding seating part.
  • stage portions 511 and 521 may have through openings 511a and 521a formed in the centers to allow the mounted waffle pack 30 to move up and down.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un manipulateur de dispositif et, plus spécifiquement, un manipulateur de dispositif qui charge des bons dispositifs parmi des dispositifs de type tranche sur un paquet de tranches selon des résultats d'inspection. La présente invention concerne un manipulateur de dispositif comprenant : une unité de chargement d'anneau de tranche (100) sur laquelle un anneau de tranche (20) chargé de dispositifs (10) est chargé ; une table de déplacement de tranche (200) qui reçoit l'anneau de tranche (20) de l'unité de chargement d'anneau de tranche (100) et déplace l'anneau de tranche (20) chargé avec les dispositifs (10) ; un outil de transfert (300) qui saisit les dispositifs (10) à partir d'une position de saisie (P) de l'anneau de tranche (20) de la table de déplacement de tranche (200) et transfère les dispositifs (10) vers une position de déchargement (U) ; une unité de chargement temporaire (400) qui positionne un paquet de tranches (30) à la position de déchargement (U) afin de décharger les dispositifs (10) transférés au moyen de l'outil de transfert (300) ; et une unité de déchargement (500) installée à proximité à l'unité de chargement temporaire (400) pour recevoir le paquet de tranches (30) chargé avec les dispositifs (10) et classer et décharger les dispositifs (10) en bons et mauvais produits.
PCT/KR2023/013021 2022-08-31 2023-08-31 Manipulateur de dispositif WO2024049248A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2022-0110380 2022-08-31
KR1020220110380A KR20240030836A (ko) 2022-08-31 2022-08-31 소자핸들러

Publications (1)

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WO2024049248A1 true WO2024049248A1 (fr) 2024-03-07

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KR (1) KR20240030836A (fr)
WO (1) WO2024049248A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101052726B1 (ko) * 2009-12-24 2011-08-01 (주)제이티 소자핸들러
KR20140119604A (ko) * 2013-03-27 2014-10-10 세메스 주식회사 테스트 핸들러
KR20180089325A (ko) * 2017-01-31 2018-08-08 (주)제이티 소자소팅장치
KR20180099390A (ko) * 2017-02-28 2018-09-05 (주)제이티 소자검사시스템
KR20190000477A (ko) * 2017-06-23 2019-01-03 (주)제이티 소자핸들러

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101052726B1 (ko) * 2009-12-24 2011-08-01 (주)제이티 소자핸들러
KR20140119604A (ko) * 2013-03-27 2014-10-10 세메스 주식회사 테스트 핸들러
KR20180089325A (ko) * 2017-01-31 2018-08-08 (주)제이티 소자소팅장치
KR20180099390A (ko) * 2017-02-28 2018-09-05 (주)제이티 소자검사시스템
KR20190000477A (ko) * 2017-06-23 2019-01-03 (주)제이티 소자핸들러

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