WO2014148857A1 - Dispositif et procédé permettant de transférer un substrat et plateau de transfert de substrat - Google Patents

Dispositif et procédé permettant de transférer un substrat et plateau de transfert de substrat Download PDF

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Publication number
WO2014148857A1
WO2014148857A1 PCT/KR2014/002390 KR2014002390W WO2014148857A1 WO 2014148857 A1 WO2014148857 A1 WO 2014148857A1 KR 2014002390 W KR2014002390 W KR 2014002390W WO 2014148857 A1 WO2014148857 A1 WO 2014148857A1
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WO
WIPO (PCT)
Prior art keywords
tray
substrate
unit
loader
unloader
Prior art date
Application number
PCT/KR2014/002390
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English (en)
Korean (ko)
Inventor
이명우
김동일
한규용
최갑수
황현덕
유달현
박우철
이훈조
Original Assignee
(주)에스티아이
삼성전기주식회사
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Application filed by (주)에스티아이, 삼성전기주식회사 filed Critical (주)에스티아이
Publication of WO2014148857A1 publication Critical patent/WO2014148857A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • the present invention relates to a substrate and a tray conveying apparatus for conveying substrates and a conveying method, and more particularly, to enable continuous circulation conveyance of a substrate conveying tray in a high speed, high precision, and clean state, thereby enabling rapid and accurate processing of substrates.
  • the present invention relates to a substrate and a tray conveying apparatus for conveying a substrate, and a conveying method.
  • LCD liquid crystal display
  • PDP plasma display panel
  • ELD electro luminescent display
  • VFD vacuum fluorescent display
  • Such a flexible substrate is generally made of a plastic substrate or a thin glass substrate, and has a flexible and flexible property, so that the flexible substrate is stored in a tray in order to prevent the flexible substrate from being bent when entering the display device manufacturing process. In this state, a series of processes are performed.
  • Patent No. 10-0645647 shown in Figure 1 discloses a plasma cleaning apparatus and method as an example of a substrate manufacturing apparatus.
  • the plasma cleaning apparatus 70 is largely divided into a loading unit 70a, a cleaning unit 70b, and an unloading unit 70c, and the loading unit 70a is an atmosphere in which a plurality of ultra-thin flexible substrates are stored and waiting.
  • the unloading part 70c includes a second tilt area 74 configured to lay down the jig in the cleaned state horizontally again, and a separation area 75 for separating and storing the flexible substrate from the jig. .
  • each flexible substrate is introduced into the apparatus from the loading section 70a, and plasma cleaning is performed in the cleaning section 70b, and then discharges to the unloading section 70c.
  • Each jig includes a flexible substrate in which the flexible substrate is accommodated in the loading unit 70a, the separation of the flexible substrate in the unloading unit 70c via the cleaning unit 70b, and then returns to the loading unit 70a. A configuration having is disclosed.
  • the substrate manufacturing apparatus of Patent No. 10-0645647 has a configuration of a loading unit 70a in which a substrate is accommodated in a jig, a configuration in which the substrate is separated from the jig, and the jig is unloaded from the unloading unit 70c.
  • the configuration of returning to the loading section 70a is only schematically disclosed, and does not disclose a specific configuration for the cyclic transfer of the jig and the continuous processing of the substrate, and the jig is unloaded from the loading section 70a.
  • the substrate conveying apparatus In the substrate conveying apparatus disclosed in the Patent No. 10-0866508, after the jig on which the substrate is mounted performs a processing process, the substrate conveying apparatus separates the substrate from the jig and is carried out, and the jig return conveyor 58 removes the empty jig from which the substrate is separated.
  • the jig circulated conveyed to the exit jig assembly unit 50, the jig return conveyor 58 and the inlet jig assembly unit 50 is conveyed by a conveyor arranged in a horizontal state Since it takes up a large footprint for the installation of the jig return conveyor 58, it is difficult to realize miniaturization of the substrate conveying apparatus, and there is a limitation in the high speed conveying of the jig, thereby improving the yield of substrate fabrication. There is a problem with the limitation.
  • the present invention has been made in order to solve the above problems, the substrate to enable the continuous circulation conveyance of the substrate transport tray to be implemented in a high speed, high precision, clean state to perform a continuous processing of the substrate quickly and accurately and stably And a tray conveying apparatus for conveying substrates and a conveying method.
  • Another object of the present invention is to provide a substrate and a substrate which can improve the production yield by preventing the occurrence of failure and reducing the takt time of substrate processing by smoothly taking over the tray during continuous circulation conveyance of the tray.
  • the present invention provides a conveying tray conveying apparatus and a conveying method.
  • the substrate and the substrate conveyance tray conveying apparatus of the present invention for achieving the above object, the loader 200 to which the substrate conveyed by the substrate loading apparatus 100 and the tray 10 for storing the same is loaded. ;
  • Loader unit lifting unit including a loader unit lifter 330 for lifting up and down along the guide rail 310 provided on one side of the loader unit 200 to convey the tray 10 to the loader unit 200 ( 300);
  • the unloader part lifter 630 which is moved up and down along the guide rail 610 provided at one side of the unloader part 500 to move the tray 10 separated from the substrate to the upper part of the guide rail 610.
  • Unloader lifting unit 600 including; And a return conveying unit 700 which takes over the tray 10 from the unloading unit elevating unit 600 and conveys it to the loader unit elevating unit 300 side, including the return conveying unit 700 on both sides.
  • the second buffer portion 711 is disposed at a spaced position and the first buffer portion 711, the second buffer portion 712, and the tray 10 positioned on the first buffer portion 711 are gripped on the second buffer portion 711.
  • the loader robot arm 900 which takes over the tray 10 from the second buffer unit 712 and transfers the tray 10 to the loader unit lifter 330 is provided.
  • the substrate and the substrate conveyance tray conveyance method of the present invention comprises the steps of putting the tray 10, the substrate is accommodated in the loader unit 200; Combining the substrate by loading the tray 10 into the loader unit 200; Performing a substrate processing process by conveying the tray 10 to which the substrate is coupled to pass through a substrate processing unit 400; Separating and transporting the substrate from the tray 10 to which the substrate conveyed to the unloader unit 500 through the treatment process is coupled; Elevating the tray (10) separated from the substrate to an upper portion of the unloader lifting unit (600) by using an unloader lifter (630); By using the unloader robot arm 800 that moves the tray 10 moved to the upper portion of the unloader lifting unit 600 along the liner 810 provided on the bottom surface of the return carrier 700.
  • the tray conveying apparatus and the conveying method for substrates according to the present invention the substrate stored in the tray is continuously carried out while passing the substrate processing unit, and the unloaded unit is lifted off the tray from which the processed substrate is separated out. Since the series of reloading into the loader through the steel part, the return conveyance part, and the loader lifting / lowering part is performed smoothly and seamlessly, the continuous processing of the substrate can be performed quickly and accurately.
  • a plurality of buffer units are additionally provided between the first buffer unit and the second buffer unit provided in the return conveying unit, and a tray requiring maintenance due to failure or deformation among a plurality of trays continuously conveyed is generated.
  • a tray having a problem is placed in the plurality of buffer units to perform maintenance, and at the same time, a normal tray is continuously transferred to perform a substrate processing process, thereby preventing an operation of the apparatus and efficiently operating the apparatus.
  • FIG. 1 is a view showing a substrate manufacturing apparatus disclosed in Patent No. 10-0645647,
  • FIG. 2 is a view showing a substrate transfer apparatus disclosed in Patent No. 10-0866508,
  • FIG. 3 is a perspective view of a substrate and a tray transport apparatus for transporting a substrate according to the present invention
  • FIG. 4 is a front view of FIG. 3;
  • FIG. 5 is a perspective view of the substrate loading apparatus 100
  • FIG. 6 is a plan view of FIG. 5;
  • FIG. 7 is a side view of FIG. 5;
  • FIG. 10 is a perspective view showing the tray 10 is seated on the (a) loader 200, (b) the substrate (S) is coupled to the tray 10 seated on the loader 200.
  • FIG. 11 is a plan view illustrating an operation in which the substrate S is coupled to the tray 10;
  • FIG. 12 is a (a), (b) perspective view, (c) right side view and (d) front view of the loader lifter 330 of the loader lift unit 300;
  • FIG. 13 is a perspective view of the unloader unit 500 and the unloader unit elevating unit 600
  • FIG. 14 is a plan view illustrating an operation of separating the substrate S from the tray 10;
  • 16 is a front view of the return conveyance unit 700
  • 17 is a front view showing (a) a perspective view, (b) a front view, (c) a right side view, and (d) a moved state of the unloader robot arm 800,
  • 19 is a front view showing (a) a perspective view, (b) a front view, (c) a left side view, and (d) a moved state of the loader robot arm 900,
  • 20 is a flow chart of a substrate and a tray transfer method for substrate transfer according to the present invention.
  • 21 is a view illustrating a step of inserting the tray 10 into the loader unit 200
  • FIG. 22 is a view illustrating a step in which the substrate S is coupled to the tray 10 seated on the loader 200.
  • FIG. 23 is a view illustrating a process in which a tray 10 containing a substrate S passes through a substrate processing unit 400 and a processing process is performed;
  • FIG. 24 is a view illustrating a step in which a tray 10 containing a substrate subjected to a processing process is seated on the unloader unit 500;
  • 25 is a view illustrating a step in which the substrate S is separated and taken out from the tray 10 seated on the unloader unit 500;
  • FIG. 26 is a view illustrating an unloader lifter 630 lifting and lowering the tray 10;
  • FIG. 27 is a view illustrating a step in which the unloader robot arm 800 takes the tray 10 from the unloader robot lifter 630 and conveys the tray 10 to the first buffer part 711.
  • 28 is a view illustrating a step in which the transfer unit 730 conveys the tray 10 from the first buffer portion 711 to the second buffer portion 712.
  • 29 is a view showing a step in which the loader robot arm 900 takes the tray 10 from the transfer unit 730 and transports it to the loader loader 330 side,
  • FIG. 30 is a view illustrating a step in which the loader part lifter 330 descends to the loader part 200 while holding the tray 10.
  • Substrate 1 First Frame
  • substrate loading apparatus 100 substrate unloading apparatus
  • first grip portion 120 second grip portion
  • base frame 220 lifting table
  • step motor 230 motor
  • first grip part 360 second grip part
  • first alignment unit 380 second alignment unit
  • buffer part 720 conveyance rail
  • transfer unit 740 housing
  • second alignment portion 800 the unloader robot arm
  • FIG. 3 is a perspective view of a substrate and a tray transport apparatus for transporting a substrate according to the present invention
  • FIG. 4 is a front view of FIG. 3.
  • substrate conveyance tray conveying apparatus which concerns on this invention are the board
  • the loader 10 to which the tray 10 is stored is lifted up and down along the guide rail 310 provided on one side of the loader 200 to convey the tray 10 to the loader 200.
  • the unloader lifting part 600 which includes an unloader lifter 630 which moves up and down along the guide rail 610 to move the tray 10 separated from the substrate to an upper portion of the guide rail 610, the unloading part lifting part 600. And a return conveying unit 700 which takes over the tray 10 from the loader lifting unit 600 and conveys it to the loader lifting unit 300.
  • the first buffer unit 711, the second buffer unit 712, and the first buffer unit 711 which are disposed at positions spaced apart from both sides and on which the tray 10 is seated, are located.
  • the transfer unit 730 holding the tray 10 and conveying it to the second buffer unit 712 and the unloading unit lifter 630 take over the tray 10 and transfer it to the first buffer unit 711.
  • the loader robot arm 800 and the loader 10 robot arm 900 which takes over the tray 10 from the second buffer unit 712 and takes over the loader loader 330 is provided.
  • the first frame 1 having the loader 200 and the loader lifting unit 300 is disposed at the inlet side of the substrate processor 400 based on the substrate processor 400.
  • a second frame 2 including an unloader 500 and an unloader 600 is provided, and an upper portion and a second portion of the first frame 1 above the substrate processor 400.
  • the 3rd frame 3 provided with the return conveyance part 700 is arrange
  • the substrate (S) carried into the loader unit 200 by the substrate loading apparatus 100 is a tray (waiting in the loader unit 200)
  • the tray 10 combined with the substrate 10 and the substrate S is accommodated is passed to the unloader unit 500 after passing through the substrate processing unit 400 and undergoing a series of processing steps on the surface of the substrate S.
  • FIG. When the tray 10 containing the substrate S is loaded into the unloader 500, the substrate S stored in the tray 10 is separated by the substrate unloading apparatus 100 ′ and then taken out to the outside.
  • substrate S is conveyed to the upper part of the unloader part raising / lowering part 600 by the unloader part lifter 630.
  • the tray 10 conveyed to the upper portion of the unloader lifting unit 600 is conveyed to the first buffer unit 711 by the unloader robot arm 800 and seated on the first buffer unit 711.
  • the tray 10 is conveyed to the second buffer portion 712 by the transfer unit 730.
  • the tray 10 seated on the second buffer part 712 is turned over to the loader part lifter 330 by the loader part robot arm 900, and the tray 10 is loaded while the loader part lifter 330 descends.
  • the substrate treating process is carried out after the substrate S is coupled to the tray 10 placed in the loader 200, and the substrate treating process is performed by repeating the above processes. .
  • a predetermined width, length and thin flexible substrate can be applied, in this case to prevent sagging or deformation of the substrate during the process
  • the substrate S is processed in a state where it is mounted on the tray 10.
  • FIG. 5 is a perspective view of the substrate loading apparatus 100
  • FIG. 6 is a plan view of FIG. 5
  • FIG. 7 is a side view of FIG.
  • the substrate loading apparatus 100 may be seated on the tray 10 while maintaining the flat state without sagging in the process of transporting the substrate S to the tray 10 located in the loader 200. It serves to convey the substrate (S) to be able to.
  • the substrate loading apparatus 100 is provided to be able to move back and forth by the substrate loading apparatus transfer unit 100a provided on one side of the loader 200.
  • the substrate loading apparatus 100 is moved forward to the inside of the loader unit 200 while holding the substrate S, takes over the substrate to the tray 10 waiting for the loader unit 200, and then moves backward.
  • the substrate S to be processed is returned to the standby state for carrying in the loader 200.
  • the substrate loading apparatus 100 may include a first grip part 110, a second grip part 120, and the first grip part 110 and a second grip part 120, respectively, which grip the opposite edges of the substrate S, respectively.
  • the tension driving unit 130 may move any one or both to add a predetermined tension to the substrate S held by the first grip part 110 and the second grip part 120.
  • Each of the first grip part 110 and the second grip part 120 may move along a plurality of guides 115 and 125 arranged side by side in the horizontal direction on the base plate 101.
  • Plates 117 and 127 coupled to the upper portions of the moving blocks 116 and 126, a plurality of cylinders 111 and 121 coupled to the plates 117 and 127, and movable grippers 113 and 123 driven up and down by the cylinders 111 and 121, respectively.
  • the upper part is fixed to the plates 117 and 127, and the lower part includes fixing grippers 114 and 124 paired with the moving grippers 113 and 123 to hold the substrate S.
  • the movable gripper 113 and the fixed gripper 114 of the first grip part 110 are disposed through the first through hole 102 formed at a predetermined interval on one side of the base plate 101 and the second grip part 120.
  • the movement gripper 123 and the fixed gripper 124 are disposed through the second through hole 102 formed at a predetermined interval on the other side of the base plate 101.
  • the tension control unit 130 by moving the second grip portion 120 in a straight line to give a tension to the substrate (S) that is gripped on both sides of the first grip portion 110 and the second grip portion 120 to prevent sagging. It can be written.
  • the tension guide 132 and the plate 127 and the tension moving unit 134 and the tension moving to guide the movement of the tension moving unit 134 linearly reciprocating according to the rotation of the screw 133. It may be configured to include a guide 135.
  • the rotational movement of the rotation driving unit 136 is converted into a linear movement of the tension moving unit 134, the second grip portion 120 coupled to the tension moving unit 134 is a linear movement.
  • the tension generated by the tension control unit 130 is transmitted to the substrate (S), and if the tension is excessively acted on, the substrate (S) may be damaged, so as to prevent this, the tension moving unit 134
  • the pressure sensing unit 140 may be provided between the second grip part 120 and the second grip part 120 to detect a change in pressure caused by the movement of the tension moving part 134.
  • the controller (not shown) controls the rotation of the rotation driving unit 136 to be stopped.
  • the position adjusting unit 150 for adjusting and fixing the position of the first grip portion 110 may be provided on the first grip portion 110 side.
  • the position adjusting unit 150 may be composed of a cylinder connected to one side of the plate 117 of the first grip unit 110, the moving block coupled to the plate 117 by adjusting the length of the position adjusting unit 150 116 is moved forward and backward on the guide 115, wherein the through-hole 102 formed in the base plate 101 is formed long in the same direction as the driving direction of the position adjusting unit 150 to penetrate the moving gripper 113 ) And the fixed gripper 114 does not interfere with the movement.
  • the tension of the substrate S is adjusted by moving the second grip part 120 while the first grip part 110 is fixed is described as an example.
  • the second grip part 120 may be moved to control the tension of the substrate S.
  • FIG. 8 is a perspective view of the loader part 200
  • FIG. 9 is a left side view of the loader part 200
  • FIG. 10 is a perspective view showing a state in which the tray 10 is seated on the loader part 200
  • (b) A perspective view showing a state in which the substrate S is coupled to the tray 10 seated on the loader 200
  • FIG. 11 is a plan view illustrating an operation in which the substrate S is coupled to the tray 10.
  • the loader unit 200 serves to transport the substrate S to the substrate processing unit 400 by coupling the substrate S to the loaded tray 10, and the base frame 210 and the center portion thereof are provided to be lifted and lowered.
  • the elevating table 220 is coupled to the outer circumferential surface of both sides of the rotation shaft 241 supported at both upper ends of the base frame 210 by being spaced apart at predetermined intervals along the conveying direction of the substrate S and connected to the motor 230. And a conveyance roller 240 which is driven to rotate.
  • the elevating table 220 is moved up and down by driving the table elevating cylinder 221 which is fixed to the base frame 210 and supports the bottom surface, and is moved up and down when the tray 10 is turned over, and the tray ( After the substrate S is coupled to 10, both ends of the tray 10 are seated on the conveying roller 240 and lowered to be conveyed to the substrate processing unit 400.
  • the bottom of one side of the base frame 210 is connected to the inclination adjustment cylinder 260 is driven up and down, the other bottom of the base frame 210 of the base frame 210 when the inclination adjustment cylinder 260 is driven
  • the hinge part 211 which becomes a turning center is formed. Therefore, in the case where the processing of the substrate S is to be performed in a horizontal state, the tray 10 containing the substrate S is conveyed in a horizontal state, and the processing of the substrate S can be performed in an inclined state.
  • the inclination adjustment cylinder 260 may be extended to convey the tray 10 containing the substrate S in an inclined state.
  • the side guide roller 250 for supporting the side surface of the tray 10 inclined to one side by the extension of the inclination adjustment cylinder 260 between the conveying roller 240 of the side on which the hinge portion 211 is formed is provided.
  • the structure of the tray 10 is exposed so that the surface of the substrate (S) to the outside so that the treatment process can be performed on the surface of the substrate (S)
  • the center part has a rectangular frame shape penetrating up and down.
  • the first flange portion 10a protruding inward and the second flange portion 10b protruding upward are formed at four edge portions of the tray 10 so that the substrate S may be seated and accommodated. have.
  • the third flange portion 10c is formed to protrude outward.
  • the inside of the second flange portion 10b of the tray 10 is horizontally moved from the upper surface of the first flange portion 10a to be accommodated.
  • the pressing rod 13 is inserted into the ring 12 to press and fix the upper surface of the pressing plate 11 toward the second flange portion 10b.
  • the inner surface of the pressing plate 11 is formed at a predetermined height so as to be in surface contact with the side surface of the substrate S, and the pressing plate 11 has an outer surface of the pressing plate 11 at the second flange portion 10b of the tray 10. Supported by an elastic means (not shown) to receive a force in a close contact, the pressing plate 11 is moved to the outside by the elastic force in the state that the external force is not applied to the structure that the fixed state of the substrate (S) is automatically released Consists of
  • the push rod 13 has a plurality of tapered portions (not shown) having a tapered shape at an interval corresponding to the interval at which the ring 12 is formed, and the tapered portion of the push rod 13 has a ring 12.
  • the pressing plate 11 is pressed downwards to fix the pressing plate 11, the tapered portion of the pressing rod 13 ring (
  • the pressurized state by the tapered portion is released, and the pressing plate 11 is pulled outward by the elastic force so that the side surface of the substrate S and the inner surface of the pressing plate 11 are separated from each other.
  • the fixed state is released.
  • the lifting table 220 has a link 226 for pressing the push rod 13 so that the push rod 13 is horizontally moved, and a step motor 227 for driving rotation and horizontal movement of the link 226.
  • the rotation angle and the horizontal moving length of the link 226 may be set in a range capable of driving the push bar 13 while avoiding interference with the tray 10.
  • 10 (a) shows the state before the push bar 13 is moved to the inside of the ring 12
  • Figure 10 (b) is the push bar 13 is the link 226 and the step motor 227 It shows the state moved to the inside of the ring 12 by the driving of.
  • the push rods 13 located at the front and the rear of the tray 10 are driven by a link 226 penetrating upward from the lower side of the elevating table 220, and on the left and right sides of the tray 10. While the push bar 13 is positioned to show an embodiment driven by the link 226 located above the tray 10, the position where the link 226 is disposed may be variously modified.
  • the elevating table 220, the moving pin 223 for pressing the outer surface of the pressing plate 11 inward so that the substrate (S) is seated on the tray 10 and the moving pin, A connecting member 224 coupled to the outer end of the 223 and a cylinder 225 for driving the horizontal movement of the connecting member 224 are provided.
  • the moving pins 223 may be formed at both sides of the connection member 224 one by one, and may be located through the second flange portion 10b of the tray 10.
  • the moving pin 223 may be formed at a height at which an inner end thereof contacts the outer surface of the pressing plate 11.
  • the inner end of the moving pin 223 is formed to be in contact with over the outer surface of the pressing plate 11 and a portion of the upper surface connected to the pressing plate 11 in a state in which the upward movement of the pressing plate 11 is limited. It may be configured to move horizontally.
  • both sides of the elevating table 220 may be provided with a pair of guide members 222 for guiding the tray 10 to be seated in place on the elevating table 220.
  • the guide member 222 has an upper surface of which is inclined downward from the outer end toward the inner end so that the left and right lower ends of the tray 10 are lowered in the process of lowering the tray 10 onto the elevating table 222. While contacting the inclined surface of the guide member 222 is to be seated in the correct position on the elevating table 220 without distorting in the left and right directions.
  • FIG. 11A is provided. As shown, the pressing plate 11 is in close contact with the inner surface of the second flange portion 10b by the elastic force, the moving pin 223 is spaced apart from the pressing plate 11 in a non-contact state.
  • the connecting member 224 and the moving pin coupled thereto are driven by driving the cylinder 225.
  • the moving pin 223 presses the outer surface of the pressing plate 11 in the inward direction.
  • the link 226 connected thereto is driven by the rotation of the step motor 227 and the linear driving. Move the 13 to one side and the pressing rod 13 is inserted into the inner ring 12, the pressing rod 13 presses the pressing plate 11 downward so that the pressing plate 11 fixes the substrate S. State is maintained.
  • the link 226 and the moving pins 223 are driven outwardly of the tray 10 by driving in the opposite direction between the step motor 226 and the cylinder 225.
  • the elevating table 220 is lowered and the third flange portion 10c formed in front and rear of the tray 10 is seated on the conveying roller 240, and the substrate is rotated by the conveying roller 240.
  • the tray 10 in which S is housed is conveyed to the substrate processing unit 400.
  • the tray 10 is first loaded into the loader 200, the tray 10 is manually loaded on the lifting table 220 of the loader 220, but a plurality of trays 10 are loaded.
  • the substrate processing process is continuously performed, the substrate S is separated from the unloader unit 500, and the tray 10 in which the substrate S is not stored is returned to the unloader unit elevating unit 600.
  • the return path is re-loaded into the loader 200 through the carrier 700 and the loader lift / lower 300.
  • 12 is a (a) and (b) perspective view, (c) right side view, and (d) front view of the lifter 330 of the loader lifting unit 300.
  • the lifter 330 may face the first grip part 350, the second grip part 350, and the tray 10 that hold the third flange part 10c, which is the front and rear edge portions of the tray 10, respectively. It includes a first alignment portion 370 and a second alignment portion 380 for supporting the edge portion and aligning the position in the left and right directions of the tray 10.
  • FIG. 12 (a) omits the side surface and the upper surface of the housing 340 having a hexahedral shape of the lifter 330, the first grip portion 350, the second grip portion 350 and the first alignment portion ( 370 and the second alignment unit 380 are disposed, and FIG. 12 (b) also omits the bottom surface of the housing 340.
  • Each of the first grip part 350 and the second grip part 360 is fixed to the bottom surface of the housing 340 and is driven back and forth by the cylinders 351 and 361, and the plates 352 and 362 coupled to the upper portions of the cylinders 351 and 361. Up and down by the cylinder (353,363), and the cylinder (353,363), which are spaced apart from both sides on the bottom of the plate (352,362) and located through the through hole (341) formed on the bottom surface of the housing 340 and is driven up and down
  • the upper part is fixed to the lower surfaces of the movable grippers 354 and 364 and the plates 352 and 362 to be driven, and the lower part penetrates the bottom surface of the housing 340 to mate with the movable grippers 354 and 364 to grip the tray 10. It is configured to include a fixed gripper (355,365).
  • the first grip part 350 and the second grip part 360 are moved back and forth by driving the cylinders 351 and 361 fixed to the housing 340, and the through hole 341 formed in the housing 340 is moved forward and backward. It is formed long so as not to cause interference in the front and rear movement of the moving gripper (354,364) and the fixed gripper (355,365).
  • Each of the first alignment unit 370 and the second alignment unit 380 is fixed to the bottom surface of the housing 340, and the cylinders 371 and 381 are driven to the left and right, and the plates coupled to the upper portions of the cylinders 371 and 381 ( 372 and 382, cylinders 373 and 383 which are spaced apart on both sides of the bottoms of the plates 372 and 382 and penetrated through the through holes 342 formed on the bottom surface of the housing 340, and are driven up and down, by the cylinders 373 and 383. It is configured to include a roller (374, 384) for driving up and down and supporting the side of the tray (10).
  • the first aligning portion 370 and the second aligning portion 380 are moved in left and right directions by the cylinders 371 and 381 fixed to the housing 340, and at this time, the through hole 342 formed in the housing 340 is It is formed long in the left and right directions and does not interfere with the left and right movement of the cylinders 373 and 383 and the rollers 374 and 384.
  • the tray 10 is first driven by driving the first alignment part 370 and the second alignment part 380. ), The tray 10 is gripped by driving the first grip part 350 and the second grip part 360.
  • the tray 10 coupled to the substrate S in the loader 200 is conveyed to the substrate processing unit 400 by the rotation of the conveying roller 240.
  • the substrate processing unit 400 performs a series of treatment processes on the surface of the substrate S, and in one embodiment, an etching and cleaning and drying processes may be performed on the surface of the substrate S.
  • the tray 10 in which the substrate S passed through the substrate processing unit 400 is accommodated is conveyed to the unloader 500, and the unloader 500 separates the substrate S from the tray 10. It will be taken out.
  • FIG. 13 is a perspective view of the unloader unit 500 and the unloader unit elevating unit 600
  • FIG. 14 is a plan view illustrating an operation of separating the substrate S from the tray 10.
  • the unloader 500 has the same configuration as the loader 200 described above, and the conveying roller 530 and side guides coupled to both sides of the base frame 510, the elevating table 520, and the rotating shaft 531.
  • Including a roller 540, one side of the bottom surface of the base frame 510 is provided with an inclination adjustment cylinder (not shown).
  • the unloader unit 500 includes a configuration for separating the substrate S accommodated in the tray 10, which fixes the substrate S to the tray 10 in the above-described loader unit 200. It is composed of the structure opposite to the structure.
  • FIG. 14A is a plan view of a state in which the tray 10 in which the substrate S is accommodated is carried in the unloader unit 500
  • FIG. 14B is a state in which the substrate S is separated from the tray 10. Referring to FIG. It is shown.
  • the side surface of the substrate S is pressed and fixed by the pressing plate 11. Will be in.
  • the linker 226 is driven by the rotation and horizontal movement of the step motor 227 to taper the push rod 13.
  • the push rod 13 is horizontally moved in the direction of exiting the additional ring 12. Accordingly, the pressing plate 11 presses the pressing plate 11 toward the first flange 10a side of the tray 10 while the pressing plate 11 is released, so that the pressing plate 11 has a second flange of the tray 10 by an elastic force. It moves in the outward direction toward 10b. Then, the board
  • the tray 10 from which the substrate S is separated from the unloader 500 is conveyed to the upper portion of the unloader lift unit 600 by the unloader lifter 630.
  • the unloader lifting unit 600 is a sliding member 621 which is moved up and down along the guide rail 610 by the driving of the motor 611, and one of the sliding members 621.
  • a lifter grip arm 620 fixed to the side and coupled to the unloader part lifter 630 is included. Since the unloader part lifter 630 is configured in the same structure as the above-described loader part lifter 330, redundant description thereof will be omitted.
  • the tray 10 conveyed to the upper part of the unloader unit elevating unit 600 is conveyed to the return conveying unit 700.
  • 15 is a perspective view of the return carrier 700
  • FIG. 16 is a front view of the return carrier 700.
  • the first buffer unit 711, the second buffer unit 712, and the first buffer unit 711 which are disposed at positions spaced apart from both sides, on which the tray 10 is seated.
  • the transfer unit 730 holding the located tray 10 and conveying it to the second buffer unit 712 and the unloader unit lifter 630 take over the tray 10 to the first buffer unit 711.
  • the unloader robot arm 800 to convey and the loader robot arm 900 which take over the tray 10 from the said 2nd buffer part 712, and convey to the said loader part lifter 330 are provided.
  • a plurality of buffer parts 713, 714, 715 on which the tray 10 transported by the transfer unit 730 is seated between the first buffer part 711 and the second buffer part 712 are spaced apart from each other by a predetermined interval.
  • the first buffer unit 711, the second buffer unit 712 and the plurality of buffer units (713, 714, 715) is provided with a sensing means (not shown) for detecting the position of the tray 10. .
  • the sensing means may be configured in various forms known in the art as long as the sensing means detects the presence or absence of a test subject and transmits a signal.
  • the plurality of buffers 713, 714, and 715 provided between the first buffer part 711 and the second buffer part 712 require tray maintenance without interruption of equipment operation when maintenance of the tray 10 is continuously carried. (10) serves to check. That is, when it is required to inspect the tray 10 conveyed to the first buffer portion 711 by the unloader robot arm 800, the first buffer is not immediately conveyed to the second buffer portion 712.
  • the substrate is transferred to the second buffer unit 712 to perform a substrate processing process, and the sensing unit provided in each buffer unit 710 detects the presence of the tray 10 and based on the detection signal By doing so, the driving state of the transfer unit 730 is controlled.
  • the structure of the unloader robot arm 800, the transfer unit 730, and the loader robot arm 900 with which the return conveyance part 700 is equipped is demonstrated one by one.
  • FIG 17 is a front view showing (a) a perspective view, (b) a front view, (c) a right side view, and (d) a moved state of the unloader robot arm 800.
  • the unloader robot arm 800 is reciprocated by the driving of the motor 811 along the liner 810 disposed in the horizontal direction on the bottom surface of the third frame 3 of the return carrier 700.
  • the moving block 830 is coupled to the upper portion of the sliding member 820
  • the cylinder 840 is coupled to both sides of the moving block 830 to be driven up and down
  • the rod of the cylinder 840 841 is configured to include a support plate 850 which is moved up and down by a protruding length change and a seating portion 860 coupled to the support plate 850 to seat the tray 10.
  • the transfer unit 730 is a cylinder reciprocating between the first buffer portion 711 and the second buffer portion 712 along the conveyance rail 720 by the driving of the motor 721. Coupled to the lower portion of the 750, and driven up and down by the cylinder 750, the tray 10 located in the first buffer portion 711, the second buffer portion 712 or a plurality of buffer portions (713, 714, 715) Or the tray 10 located in the plurality of buffer parts 713, 714, 715 to the second buffer part 712.
  • the transfer unit 730 is slidably moved along the conveyance rail 720 by the driving of the motor 721, and the driving is controlled based on the signal of the sensing means provided in each buffer unit 710, thereby providing a tray. 10 can be conveyed in a high speed, high precision, and a clean state.
  • the transfer unit 730 may face the first grip portion 760, the second grip portion 770, and the tray 10, respectively, which grip the front and rear edge portions of the tray 10. It includes a first aligning portion 780 and a second aligning portion 790 for supporting the left and right edge portion and aligning the position in the left and right direction of the tray 10.
  • Each of the first grip part 760 and the second grip part 770 is fixed to the bottom surface of the housing 740 and is driven back and forth by the cylinders 761 and 771, and the plates 762 and 772 coupled to the upper portions of the cylinders 761 and 771.
  • the cylinders 763 and 773 are spaced apart on both sides of the bottom surfaces of the plates 762 and 772 and penetrate the bottom surface of the housing 740, and are driven up and down by the cylinders 763 and 773.
  • the upper surface is fixed to the bottom of the plates 762 and 772, and the lower portion penetrates the bottom surface of the housing 740 to mate with the mobile grippers 764 and 774 and grips the tray 10. It is configured to include).
  • Each of the first and second alignment units 780 and 790 is fixed to a bottom surface of the housing 740 and is driven to the left and right cylinders 781 and 791, and a plate coupled to an upper portion of the cylinders 781 and 791.
  • rollers 784 and 794 supporting the side surfaces of 10.
  • the tray 10 In the process of holding the tray 10 positioned on the first buffer unit 711, first, the tray 10 is aligned in left and right directions by driving of the first alignment unit 780 and the second alignment unit 790. After this, the tray 10 is gripped by driving the first grip part 760 and the second grip part 770.
  • FIG 19 is a front view showing (a) a perspective view, (b) a front view, (c) a left side view, and (d) a moved state of the loader robot arm 900.
  • the loader robot arm 900 has a symmetrical structure with the aforementioned unloader robot arm 800.
  • the sliding member 920 reciprocated by the driving of the motor 911 along the liner 910 disposed in the horizontal direction on the bottom surface of the third frame 3 of the return carrier 700, the sliding member
  • the moving block 930 coupled to the upper portion of the 920, the cylinder 940 coupled to both sides of the moving block 930 to be driven up and down, the rod 941 of the cylinder 940 to the protruding length change
  • It is configured to include a support plate 950 that is moved up and down by the mounting plate 960 is coupled to the support plate 950, the tray 10 is seated.
  • the tray 10 located in the second buffer portion 712 is lifted by the unloader portion lifter 630 which is lifted from the lower side of the second buffer portion 712 while the unloader portion lifter 630 is lifted. It is supported by the seating portion 960 of the, and after taking over the tray 10 to the above-mentioned unloader portion lifter 330, it is lowered and moved horizontally to be located below the second buffer portion 712.
  • 20 is a flow chart of a substrate and a tray conveyance method for transporting a substrate according to the present invention.
  • the tray 10 in which the substrate is to be accommodated is loaded into the loader unit 200, and the substrate is loaded into the tray 10 inserted into the loader unit 200.
  • 21-30 show the board
  • the substrate loading device transfer unit 100a is reciprocated with the substrate loading device 100,
  • FIG. 21 illustrates a step in which the tray 10 is inserted into the loader part 200.
  • the loader part lifter 330 is lowered along the guide rail 310 to grip the tray 10. It conveys onto the raising / lowering table 220 of the.
  • FIG. 22 illustrates a step in which the substrate S is coupled to the tray 10 seated on the loader 200.
  • the substrate loading apparatus 100 is shown. Is moved to the inside of the loader 200 to load the substrate S on the elevating table 220 inside the tray 10, and the substrate S is trayed by the process described with reference to FIGS. 10 to 11. To (10).
  • FIG. 23 is a view illustrating a process in which a tray 10 in which a substrate S is stored passes through the substrate processing unit 400 and a processing process is performed.
  • the substrate S is coupled to the tray 10 in the loader 200.
  • a series of substrate processing processes are performed.
  • FIG. 24 is a step in which the tray 10 containing the substrate subjected to the processing process is seated in the unloader unit 500
  • Figure 25 is the substrate (S) is separated from the tray 10 seated on the unloader unit 500
  • the tray 10 which has passed through the substrate processing unit 400 and received the substrate S having completed the processing, is unloaded from the unloading unit 500. It is conveyed onto the elevating table 520 (FIG. 24), and the substrate S is separated from the tray 10 located on the elevating table 520 by the process described in FIG. 25).
  • FIG. 26 illustrates a step in which the unloader part lifter 630 lifts and lifts the tray 10, and the tray 10 separated from the substrate S is gripped by the unloader part lifter 630. It is conveyed to the upper part of the unloader part raising / lowering part 600 along 610. In this case, the first grip part 350 and the second grip part 360 are gripped in a state aligned by the first aligning part 370 and the second aligning part 380 included in the unloader part lifter 630. After going up and down.
  • FIG. 27 illustrates a step in which the unloader part robot arm 800 takes the tray 10 from the unloader part lifter 630 and conveys it to the first buffer part 711.
  • the unloader part robot arm 800 is horizontally moved downward of the unloader part lifter 630 and then lifted up and held by the unloader part lifter 630.
  • the tray 10 is taken over, and the tray 10 is seated on the first buffer part 711 while descending after horizontally moving upward of the first buffer part 711.
  • FIG. 28 illustrates a step in which the transfer unit 730 conveys the tray 10 from the first buffer portion 711 to the second buffer portion 712.
  • the tray 10 is placed on the first buffer portion 711.
  • the transfer unit 730 is moved to the upper side of the first buffer unit 711 and then lowered to grasp the tray 10 and lifted up again to convey the tray 10 to the second buffer unit 712 side. .
  • the buffer 10 provided between the first buffer part 711 and the second buffer part 712 may be disposed in the tray 10 located in the first buffer part 711. 713, 714, 715 is returned to either.
  • the tray 10 is aligned with the first aligner 780 and the second aligner 790 provided in the transfer unit 730. Later, the first grip part 760 and the second grip part 770 are gripped.
  • FIG. 29 illustrates a step in which the loader robot arm 900 takes the tray 10 from the transfer unit 730 and transports the tray 10 to the loader loader 330.
  • the tray 10 is mounted on the second buffer unit 712. )
  • the loader robot arm 900 waiting at the lower side of the second buffer unit 712 is lifted and the tray 10 is taken over and the loader unit waiting at the upper portion of the loader unit elevating unit 300. It is horizontally moved to the lifter 330 side to take over the tray 10 to the loader lifter 330, and after moving horizontally to be positioned below the second buffer unit 712, and waits.
  • FIG. 30 illustrates a step in which the loader part lifter 330 holds the tray 10 and descends to the loader part 200 side.
  • the tray 10 Is the first grip part 350 and the second grip part in a state where the position of the tray 10 is aligned by the first alignment part 370 and the second alignment part 380 provided in the loader part lifter 330.
  • the loader part lifter 330 gripped by the 360 and the tray 10 is lowered to bring the tray 10 into the loader part 200. Then, the above-described process is repeated to perform continuous processing of the substrate and circular conveyance of the tray 10.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un dispositif permettant de transférer un substrat et un plateau de transfert de substrat. Ladite invention comprend : une partie chargeuse permettant de transporter, dans son sein, un substrat transféré par un dispositif de chargement de substrat et un plateau permettant de recevoir le substrat ; une partie d'élévation de partie chargeuse comprenant un élévateur de partie chargeuse permettant de transférer le plateau vers la partie chargeuse en étant élevée le long d'un rail de guidage situé sur un côté de la partie chargeuse ; une partie de traitement de substrat permettant de transférer, vers celle-ci, le plateau sur lequel le substrat est reçu, et de réaliser une étape de traitement de substrat ; une partie déchargeuse permettant de retirer le substrat en permettant que le substrat soit séparé du plateau dans lequel le substrat qui est passé par la partie de traitement de substrat est reçu ; une partie d'élévation de partie déchargeuse comprenant un élévateur de partie déchargeuse permettant de déplacer le plateau séparé du substrat vers la partie supérieure du rail de guidage en étant élevée le long d'un rail de guidage situé sur le côté de la partie déchargeuse ; et une partie transfert de retour permettant de recevoir le plateau depuis la partie d'élévation de partie déchargeuse et de transférer le plateau vers la partie d'élévation de partie chargeuse.
PCT/KR2014/002390 2013-03-22 2014-03-21 Dispositif et procédé permettant de transférer un substrat et plateau de transfert de substrat WO2014148857A1 (fr)

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KR1020130030914A KR101433516B1 (ko) 2013-03-22 2013-03-22 기판과 기판 반송용 트레이 반송장치 및 반송방법
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KR102316618B1 (ko) * 2014-12-30 2021-10-22 세메스 주식회사 버퍼 유닛 및 이를 포함하는 기판 처리 장치
KR102014116B1 (ko) * 2018-03-15 2019-08-26 주식회사 신성에프에이 트레이 반송 장치
KR102027116B1 (ko) * 2018-04-04 2019-10-01 주식회사 필옵틱스 플렉시블 소재용 비접촉 흡착 장치
KR102469667B1 (ko) * 2018-04-13 2022-11-22 세메스 주식회사 비히클 설정 장치 및 이를 이용한 비히클 설정 방법
KR102054714B1 (ko) * 2018-05-09 2019-12-12 주식회사 글로벌시스템즈 트레이순환형 비접촉 정밀 처리 시스템
KR200496677Y1 (ko) * 2018-06-19 2023-04-05 주식회사 디엠에스 기판 이송용 팔레트 및 이를 이용한 기판처리장치
KR20200065175A (ko) * 2018-11-29 2020-06-09 삼성디스플레이 주식회사 기판 이송 시스템 및 기판 이송 방법
KR102638343B1 (ko) * 2019-04-19 2024-02-21 한국알박(주) 트레이 운반 장치 및 이를 포함하는 진공 성막 장치
KR102488021B1 (ko) * 2022-06-07 2023-01-13 주식회사 에이투비 버킷을 이용한 폐기물 이송시스템
CN115108244B (zh) * 2022-06-22 2024-01-26 四川金域医学检验中心有限公司 一种适用于病理玻片晾片和保存的设备
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