WO2014003285A1 - Pousseur de tranches - Google Patents

Pousseur de tranches Download PDF

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Publication number
WO2014003285A1
WO2014003285A1 PCT/KR2013/001411 KR2013001411W WO2014003285A1 WO 2014003285 A1 WO2014003285 A1 WO 2014003285A1 KR 2013001411 W KR2013001411 W KR 2013001411W WO 2014003285 A1 WO2014003285 A1 WO 2014003285A1
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WO
WIPO (PCT)
Prior art keywords
wafer
axis
frame
finger
axis frame
Prior art date
Application number
PCT/KR2013/001411
Other languages
English (en)
Korean (ko)
Inventor
송병호
Original Assignee
주식회사 엔제닉
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120069360A external-priority patent/KR20130140518A/ko
Application filed by 주식회사 엔제닉 filed Critical 주식회사 엔제닉
Publication of WO2014003285A1 publication Critical patent/WO2014003285A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Definitions

  • the present invention relates to a wafer pusher, and more particularly, an upper portion of a finger of a finger block for lifting a wafer is formed in a conical shape, and a cross section of the lower portion is made smaller than a torso, so that the wafer may be generated in a process of lifting a wafer from a cassette.
  • the present invention relates to a wafer pusher that can minimize breakage of a wafer, and can smoothly discharge chips generated from the wafer to the bottom.
  • a wafer made of pure silicon is manufactured as a chip, a semiconductor device, through a plurality of unit processes such as a photo process, an etching process, a thin film forming process, and an ion implantation process.
  • the wafer is mounted on a protection and moving means called a cassette, and is mounted in a lot unit, such as about 25 to 50 sheets, to move between unit processes.
  • the wafer is transferred to a mounting means movable in a unit process facility called a transfer module to process the wafers loaded in the cassette.
  • the wafer loaded on the carrier is mounted on the boat by using a wafer transfer means called a charger, and then processed by putting it in a process chamber or the like.
  • the charger is holding (held) a plurality of wafers loaded on the carrier at a time to transfer to the wafer boat.
  • the lower side of the carrier is provided with a pusher assembly for pushing a plurality of wafers loaded in the carrier from the lower side to the upper side at one time so that the charger can hold the plurality of wafers at once.
  • a plurality of slots are formed on the pusher assembly such that a plurality of wafers can be inserted all together.
  • the pusher assembly pushes a plurality of wafers from the bottom to the top of the carrier, so that a plurality of wafers loaded in the carrier are inserted into a plurality of slots formed in the pusher assembly and moved from the bottom of the carrier to the top.
  • the charger is to hold the plurality of wafers moved in this way to transfer to the boat.
  • the alignment state of the pusher assembly is not accurate due to the deformation of the equipment due to heat or poor manufacturing of the equipment.
  • the wafer is pushed up as it is in a fixed state, there is a problem of damaging the wafer such as scratching the wafer.
  • an object of the present invention is to produce a wafer in the cassette the upper portion of the finger of the finger block for lifting the wafer is made smaller than the cross section of the body to lift the wafer from the cassette In addition to minimizing wafer breakage that may occur in the process, it is possible to provide a wafer pusher in which chips generated in the wafer can be smoothly discharged to the bottom.
  • a wafer pusher includes: an X-axis frame installed adjacent to a wafer transfer device; an X-axis moving unit moved along the X-axis frame; and the X-axis moving unit A Y axis frame connected to the X axis frame, the Z axis frame moving along the Y axis frame, and installed on the Z axis frame and operated up and down, the cassette of the wafer transfer device. And a separating part inserted into a lower part to separate the wafer from the cassette.
  • the X-axis rail is formed along the longitudinal direction of the X-axis frame; and the X-axis moving bracket is inserted into the X-axis rail, and connected to the X-axis moving unit; characterized in that it further comprises.
  • the Y-axis rail is formed along the longitudinal direction of the Y-axis frame; and the Y-axis moving bracket which is inserted into the Y-axis rail and connected to the Z-axis frame to move the Z-axis frame; It is characterized by.
  • the Z-axis rail is formed along the longitudinal direction of the Z-axis frame; and the Z-axis moving bracket is inserted into the Z-axis rail; characterized in that it further comprises.
  • the separating unit may include a pair of upper and lower posts connected to the Z-axis frame and moved up and down, a finger block connected to an upper portion of the pair of upper and lower posts, and installed on an upper portion of the finger block. And a plurality of finger members into which a plurality of wafers are inserted.
  • the finger member is a plurality of fingers are arranged in a line, the finger is a conical head portion; a rod-shaped body portion connected to the lower portion of the head portion, and connected to the lower portion of the body portion, the cross section of the body portion It is formed smaller and the chip of the wafer generated while being fitted to the finger is discharged to the lower side, characterized in that consisting of the lower end connected to the finger block.
  • the inclined surface provided in the finger block to move the chip of the wafer discharged from the lower end of the finger characterized in that it further comprises.
  • the upper portion of the finger of the finger block for lifting the wafer is made in a conical shape and the lower cross section is made smaller than the body portion of the wafer that can be generated in the process of lifting the wafer from the cassette In addition to minimizing damage, there is an advantage that the chip generated from the wafer can be smoothly discharged to the bottom.
  • FIG. 1 is a schematic flowchart of a wafer transfer module according to a preferred embodiment of the present invention.
  • FIG 2 is a front view of a wafer transfer module according to a preferred embodiment of the present invention.
  • FIG 3 is a perspective view of a wafer transfer module according to a preferred embodiment of the present invention.
  • Figure 4 is a perspective view of a state in which a vertical wafer transfer conveyor of the wafer transfer module according to an embodiment of the present invention is omitted.
  • FIG. 5 is a perspective view and a partially enlarged view of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
  • FIG. 6 is a front view of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
  • FIG. 7 is a side view of a vertical type wafer transfer conveyor in accordance with a preferred embodiment of the present invention.
  • FIG. 8 is a perspective view of a cassette of a vertical type wafer transfer conveyor according to a preferred embodiment of the present invention.
  • FIG. 9 is a front view of the cassette of the vertical type wafer transfer conveyor according to the preferred embodiment of the present invention.
  • FIG. 10 is a perspective view and a partially enlarged view of the pusher according to the preferred embodiment of the present invention.
  • 11 and 12 are side views showing the removal of the wafer with a pusher according to a preferred embodiment of the present invention.
  • FIG. 13 is a perspective view and a partially enlarged view of a gripper according to a preferred embodiment of the present invention.
  • FIG. 14 is a front view of a boat transfer according to a preferred embodiment of the present invention.
  • 15 is a perspective view of an elevator according to a preferred embodiment of the present invention.
  • 16 to 19 are state diagrams showing the state of moving the wafer to the wafer transfer module according to an embodiment of the present invention.
  • FIG. 1 is a schematic flowchart of transferring a wafer to a wafer transfer module according to a preferred embodiment of the present invention.
  • the present invention which will be described later, performs a process as shown in FIG.
  • the wafer transfer module includes all of the first to third processes to be described later.
  • the wafer is mounted in a cassette provided in a vertical type wafer transfer conveyor to be described later, and the wafer transfer conveyor is driven and loaded.
  • the wafer is removed from the cassette by using a wafer pusher to move the wafer stored in the cassette loaded as described above to the furnace, and the wafer thus removed is caught by the wafer gripper and moved to the boat transfer.
  • the wafer is then transferred to the elevator by boat transfer, then mounted in the elevator and lifted to move the wafer to the furnace, which is then moved to the next process in the furnace.
  • FIGS. 2 to 4 are a perspective view and a front view of a wafer transfer module according to a preferred embodiment of the present invention, as shown in Figures 2 to 4, the present invention is a vertical type wafer transfer conveyor 100, wafer The first process portion (a) consisting of the pusher 200, the wafer gripper 300, the second process portion (b) consisting of the boat transfer 400 and the third process portion (composing the elevator 500) c), and the wafer is sequentially moved by the first process portion (a), the second process portion (b), and the third process portion (c).
  • FIG. 5 is a perspective view and a partially enlarged view of a vertical wafer transfer conveyor according to a preferred embodiment of the present invention
  • FIG. 6 is a front view of a vertical wafer transfer conveyor according to a preferred embodiment of the present invention
  • FIG. A side view of a vertical type wafer transfer conveyor according to an embodiment is shown.
  • Vertical type wafer transfer conveyor 100 includes a pulley 110, a cassette 120 and a rail 130.
  • two pairs of pulleys 110 are formed in a vertical direction, and two sets of pairs of pulleys 110 are provided such that the pulleys 110 are symmetrical with each other.
  • the upper or lower pulleys are connected to each other via the rotation shaft 111 so as to be rotatable at the same time by the motor (M).
  • the pulley 110 as described above is connected to each other via a timing belt 120 and rotated at the same time, the rotation of any one of the pulley motor of the pair of pulleys (110) paired in the vertical direction ( M) is installed, the rotation of the motor (M) is transmitted to the timing belt 120, the other one pulley is rotated.
  • the timing belt 120 can accurately transmit rotation, but is preferably made of rubber. When made of rubber material, the tension may be changed, so it may be made of metal chain.
  • timing belt 120 is connected to the cassette 140 via a clamp 141 to rotate the cassette 140 in a constant trajectory, as shown in a partially enlarged view of FIG. 5.
  • the clamp 141 is fixed to the groove formed in the inner peripheral surface of the timing belt 120.
  • the cassette 140 includes a main body 150 on which the wafer 1 is mounted and a transfer unit 160 provided on both sides of the main body 150.
  • the transfer unit 160 is connected to the timing belt 120 and the rail 130 on one side and the other side in a state in which the transfer unit 160 is rotatably installed on the main body 150 so that the warpage does not occur.
  • the main body 150 includes a pair of plates 151 and a plurality of connecting rods 152 connecting the plates 151 to each other, and the connecting rods 152 may include a plurality of wafers 1 to be inserted therein.
  • the insertion groove 153 is formed.
  • FIG. 8 shows that the connecting rods 152 are paired two by six, and the lower two connecting rods support the lower side of the wafer when the wafer 1 is inserted in the upright state.
  • Four connecting rods support the left and right sides of the wafer, respectively.
  • the lower two connecting rods are spaced apart from each other by a predetermined distance.
  • the reason for the separation is that the wafer pusher 200, which will be described later, enters between the lower two connecting rods to remove the wafer 1 stored in the cassette 140. To make it work.
  • the transfer unit 160 is a member connected to both the timing belt 120 and the rail 130, the transfer unit 160 is rotatably connected to the side plate 162, such a transfer unit 160
  • a clamp 141 is formed at one side and a tracking plate 163 is formed at the other side with respect to the rotation center of the center.
  • the clamp 141 is a timing belt 120.
  • the tracking plate 163 is connected to the rail 130, respectively.
  • the tracking plate 161 is moved along the rail 130, so the tracking plate 163 is a rail 130 and a ball bearing ( 162 is connected via a medium, it is preferable that the departure prevention block 164 is provided to prevent the departure from the rail (130).
  • the rail 130 is a member installed outside the timing belt 120 described above, and the rail 130 is generally made of a metal material.
  • the rail 130 is connected to the tracking plate 163 and serves to guide the cassette 140 moved by the timing belt 120.
  • the cassettes may be moved along the timing belt 120 and the rail 130 having different sized trajectories. 140) does not tilt or flip upside down.
  • Vertical type wafer transfer conveyor 100 according to a preferred embodiment of the present invention as described above can be installed in a narrow space because the cassette 140 is rotated in the vertical direction along the timing belt 120 and the rail 130. Therefore, space utilization can be improved.
  • FIGS. 11 and 12 are side views showing a state of removing a wafer with a wafer pusher according to a preferred embodiment of the present invention.
  • the wafer pusher 200 to be described later is installed adjacent to the vertical type wafer transfer conveyor 100 described above, the wafer pusher 200 is a wafer stored in the cassette 140 It serves to remove the wafer 1 from the cassette 140 by pushing (1) to the upper portion, and is not limited to the vertical type wafer transfer conveyor 100 because it can be used in various places.
  • the wafer pusher 200 includes an X-axis frame 210, an X-axis moving unit 220, a Y-axis frame 230, a Z-axis frame 240, and a separation unit 250. do.
  • the X-axis frame 210 is a member installed adjacent to the lower portion of the vertical type wafer transfer conveyor 100 described above, such an X-axis frame 210 is a skeleton of the wafer transfer module, as shown in FIG. It is connected to the frame frame forming a 10.
  • the X-axis frame 210 is formed with an X-axis rail 211 along the longitudinal direction, the X-axis rail 211 is connected to the X-axis moving unit 220, the X-axis moving unit 220 ) Includes an X-axis moving bracket 221 coupled to the X-axis rail 211 and moved in the X-axis direction.
  • the Y-axis frame 230 is a member that is connected to the X-axis moving unit 220 to move in the X-axis direction, the Y-axis frame 230 is installed perpendicular to the X-axis frame 210.
  • the Y-axis frame 230, the Y-axis rail 231 is formed along the longitudinal direction, the Y-axis rail 231 is coupled to the Y-axis moving bracket 232, such a Y-axis moving bracket 232 ) Is connected to the Z-axis frame 240 to move the Z-axis frame 240 in the Y-axis direction.
  • the Z-axis frame 240 is a member which is connected to the Y-axis moving bracket 232 coupled to the Y-axis rail 231 and moved along the Y-axis frame 230.
  • the Z-axis frame 240 is formed with a Z-axis rail 241 along the longitudinal direction, the Z-axis rail 241 is connected to the Z-axis moving bracket 242 to be moved in the Z-axis direction, this The separation unit 250 to be described later is connected to the Z-axis moving bracket 242.
  • the separating part 250 is a member that is connected to and moved up and down in accordance with the driving pattern of the Z-axis moving bracket 242 by connecting the Z-axis frame 240 and the Z-axis moving bracket 242 as described above. As shown in FIG. 10 to FIG. 12, the pair of upper and lower posts 251, the finger blocks 252, and the finger members 253 are included.
  • the pair of upper and lower posts 251 is connected to the Z-axis moving bracket 242, as shown in Figures 10 to 12, and extends to the upper side (Z-axis direction), such a pair of upper and lower posts (
  • the finger block 252 is connected to the upper portion of the 251, the finger member 253 is installed in the vertical direction (Z-axis direction) on the finger block 252.
  • the finger block 252 is fixed to the upper and lower posts 251, and fixed to the fixed block 254, and the finger member 253. It is composed of a removable block 255 is installed, accordingly, it is easy to replace with a new removable block 255 when the finger member 253 is worn or broken.
  • the finger blocks 252 may push the wafer 1 stored in the cassette 140 upward when the Z-axis movement bracket 242 rises after approaching the lower portion of the cassette 140 described above. It is preferable to have a separation distance less than the separation distance between the two connecting rods 152 on the lower side of the cassette 140.
  • the finger member 253 is a member in which a plurality of fingers 266 are arranged in a line along an upper surface of the finger block 252, and is inserted in the cassette 140 described above between the plurality of fingers 266.
  • the wafer 1 is fitted.
  • Finger 256 as described above is preferably made of a ceramic (Ceramic) or quartz (Quartz) material to prevent damage to the wafer, and is formed in the shape of a pencil, the head 257, the body (from the top) 258 and the lower end 259.
  • the head portion 257 is formed in a conical shape to facilitate the entry of the wafer 1, the body portion 258 is connected to the lower portion of the head portion 257 in a rod shape, the lower end 259 is rod-shaped Is formed, but is connected to the finger block 252 with a cross section smaller than the cross section of the body portion 258.
  • the chip generated while the wafer 1 is inserted into the finger 256 is lowered, more specifically, the lower end 259. It serves to discharge smoothly to the gap between, accordingly, the upper surface of the finger block 252 (upper surface of the removable block) inclined surface (chip) discharged from the lower end of the finger 256 to move smoothly ( 260 is preferably formed.
  • FIG. 13 is a perspective view and a partially enlarged view of a wafer gripper according to a preferred embodiment of the present invention.
  • the wafer gripper 300 to be described later is installed adjacent to the upper portion of the above-described wafer pusher 200, the wafer gripper 300 is a wafer (stored in the cassette 140) In the state in which 1) is lifted up to the wafer pusher 200, the wafer 1 is moved to the outside of the vertical type wafer transfer conveyor 100 and then moved to the boat transfer 400 to be described later.
  • the wafer gripper 300 as described above may not be limited to the vertical wafer pusher 200 since it may be used in various places.
  • the wafer gripper 300 includes an X axis frame 310, an X axis moving unit 320, a Z axis frame 330, a Y axis frame 340, and a towing unit 350. do.
  • the X-axis frame 310 is a member installed on the wafer pusher 200, the X-axis frame 310 as shown in Figure 4, the X-axis frame 210 of the above-described wafer pusher 200 It is connected to the frame (10) forming the skeleton of the wafer transfer module in the same way.
  • the X-axis frame 310 is formed with an X-axis rail 311 along the longitudinal direction, the X-axis rail 311 is connected to the X-axis moving unit 320, the X-axis moving unit 320 The X-axis moving bracket 321 coupled to the X-axis rail 311 is moved in the X-axis direction is included.
  • a Z-axis guide bracket 322 protrudes from the X-axis movement bracket 321 in the Y-axis direction, and the Z-axis guide bracket 322 is connected to the Z-axis frame 330 to move up and down.
  • the Z-axis rail 331 is provided on the Z-axis frame 330 so that movement in the vertical direction (Z-axis direction) is secured while the Z-axis frame 330 is connected to the Z-axis guide bracket 322. Is formed.
  • the Y-axis frame 340 is a member connected to the lower portion of the above-described Z-axis frame 330 perpendicular to the X-axis frame 310, the Y-axis frame 340 is a connecting bracket 341
  • the fixed frame 342 and the moving frame 343 are included, and the towing unit 350 includes a first grip part 360 and a second grip part 370.
  • the Y-axis frame 340 is a member that is moved in the Y-axis direction so that the traction unit 350 can hold the wafer, the traction unit 350 is the wafer 1 in the state that the Y-axis frame 340 is moved It is a member that plays a role.
  • the connecting bracket 341 is a member connected to the Z-axis frame 330, and a fixed frame 342 is connected to a lower portion of the connecting bracket 341.
  • a lower portion of the fixed frame 342 is connected to the moving frame 343 which is moved in the Y-axis direction, the fixed frame 342 and the moving frame 343 is connected via a separate moving unit 344 Accordingly, a rail (not shown) may be formed on the bottom surface of the fixed frame 342.
  • the first Y-axis rail 345 is formed along the longitudinal direction of the movable frame 343, and the Y-axis first unit 345 is connected to the Y-axis moving unit 346 to move from side to side.
  • the first grip part 360 of the traction part 350 is connected to the moving frame 343, and the first grip part 360 includes a movable plate 361 and a first holder 362. As shown in FIG. 13, the movable plate 361 extends in the Y-axis direction while being fixed to the lower surface of the movable frame 343, and a first holder 362 is disposed below the movable plate 361. Is formed.
  • a second grip part 370 is connected to the Y-axis moving unit 346, and the second grip part 370 may include the movable plate 3 so that interference does not occur when the movable plate 361 is driven in the Y-axis direction.
  • 361 is preferably connected via a separate plate 371 extending in the X-axis direction.
  • the second grip portion 370 is provided with a movable groove 372 to prevent the interference with the movable plate 361 and to move the movable plate 361 is inserted, the second holder 373 in the lower portion ) Is moved in the Y-axis direction according to the movement pattern of the Y-axis movement unit 346.
  • the first grip part 360 as described above is the second grip part 370 of the Y-axis moving unit when the moving frame 343 is moved to the upper part of the separation part 250 of the wafer pusher 200.
  • the wafer 1 is held while approaching the grip 360.
  • first holder 362 and the second holder 373 are extended blocks 380 provided in the first holder 362 and the second holder 373, respectively, as shown in a partially enlarged view of FIG. 13.
  • a finger member 381 which is installed to face each other on one side of the extension block 380, wherein the fingers 382 are arranged in a line along the length direction.
  • the finger 382 is a member that presses and grips the side surface while the wafer 1 is upright, two or more lines are provided to prevent the wafer from being rotated to one side while the wafer 1 is fitted to the finger 382. desirable.
  • the first entry portion into which the wafer 1 enters to fit the wafer 3 smoothly into the finger 382 may be manufactured in a conical shape.
  • the support surface 383 is formed below the finger member 381 so as to support the lower surface of the standing wafer 1.
  • the finger 382 is made of the same ceramic or quartz material as the finger 256 of the wafer pusher 200 described above, and the finger member 381 may be easily replaced when the finger 382 is worn or damaged. Is preferably detached from the extension block 380.
  • a pressure spring 384 may be installed between the finger member 381 and the extension block 380, as shown in the partially enlarged view of FIG.
  • the pressure spring 384 as described above may be provided with an elastic force when pressing the wafer 1 that is erected using the first holder 362 and the second holder 373, thereby more firmly fixing the wafer 1. .
  • both sides of the wafer 1 lifted by the wafer pusher 200 are held by the fingers 382, and at the same time, the lower side of the wafer 1 is supported by the support surface 383. It can be characterized by holding the wafer 1 stably at three points except the upper side of the wafer by supporting it.
  • the pressing force of the pressure spring 384 can hold the wafer 1 more firmly.
  • the boat transfer 400 receives the wafer 1 moved by the wafer pusher 200 and the wafer gripper 300 described above to the elevator 500 to be described later. It serves to convey.
  • the boat transfer 400 as described above includes a boat 410 on which a wafer is seated, a transfer unit 420 for moving the boat 410 to the elevator 500, and the transfer unit 420 to the elevator 500. It is composed of a horizontal frame 430 that serves as a moving rail, the boat 410, as shown in Figure 21, the wafer 1 in turn by the wafer gripper 300, the boat 410 in turn from one side Is loaded on.
  • the transfer unit 420 may be lifted along the horizontal frame 430. It will be moved to 500.
  • the elevator 500 serves to receive the boat 410 of the boat transfer 400 described above and deliver it to the furnace.
  • Elevator 500 as described above is installed in the frame frame 10 of the wafer transfer module in the vertical direction, a pair of Z-axis frame 510 is provided with a Z-axis rail 511, the Z-axis frame 510 Z-axis moving unit 520 connected to each other, a fixed frame 530 connected to the Z-axis moving unit 520 in the Y-axis direction, and connected to the fixed frame 530 to move in the Y-axis direction Y-axis frame 540 is provided.
  • a Y-axis rail 541 is formed in the Y-axis frame 540, the Y-axis rail 541 is connected to the fixed frame 540 so that the Y-axis frame 540 is moved in the Y-axis direction
  • the Y axis moving unit 550 is formed.
  • the Y-axis frame 540 and the Z-axis moving unit 510 coupled with the boat 410 are each preferably driven by a power source (eg, a servo motor).
  • the elevator 500 according to the preferred embodiment allows the synchronous control when moving the Z-axis, the left, right horizontal and tilt control of the boat 410 when moving the Y-axis.
  • the operator puts the wafer 1 upright in the cassette 140.
  • the worker attaches a storage means (not shown) to the cassette 140, the storage means may be stored the history of the type of wafer 1, the production site, the production company, the production date.
  • the storage means as described above may be made of a bar code printed sticker, it may be made of an RFID card, such storage means is a sensor unit (S) provided in the vertical type wafer transfer conveyor 100 shown in FIG. It can be detected by, and the detected information of the storage means may be transmitted to a controller (not shown).
  • S sensor unit
  • control unit serves to move the plurality of cassettes 140 that are moved along the timing belt 120 and the rail 130, and the wafer pusher 200 holds the wafer 1 stored in the cassette 140.
  • the process of raising, the process of holding the wafer 1 lifted by the wafer pusher 200 with the wafer gripper 300, and the wafer 1 caught with the wafer gripper 300 are moved to the boat transfer 400 to the elevator 500.
  • the process of moving and the process of moving the wafer 1 moved to the elevator 500 to a furnace may be performed.
  • the amount, type, etc. of the wafer required for the furnace can be determined based on the information of the wafer 1 stored in the controller.
  • the cassette 140 moved along the rail 130 is detached from the wafer 1 stored in the cassette 140 by the wafer pusher 200 at a predetermined position.
  • Figures 11 to 12 and 16 show how the stored wafer is removed.
  • the procedure for detaching and removing the wafer 1 stored in the cassette 140 by the wafer pusher 200 is as follows.
  • the position (XY, Z coordinate) of the cassette 140 is sensed, and the X-axis moving unit 221 is moved along the X-axis rail 211, and then the Y-axis moving unit (down to the lower side of the cassette 140)
  • the Z-axis frame 240 is moved along the 231.
  • the Z-axis moving unit 242 is raised in the state in which the Z-axis frame 240 is moved.
  • the finger member 253 enters the lower portion of the cassette 140 to move the wafer 1 to the cassette 140.
  • the wafer 1 detached from the cassette 140 by the wafer pusher 200 receives the towing unit 350 of the wafer gripper 300, and the towing unit 350 is transferred to the wafer 1.
  • a brief description will be given of the order in which the wafer 1 is received.
  • the position (X, Y, Z coordinate) of the wafer 1 is removed by the finger member 253 of the wafer pusher 200, and the X-axis moving unit 321 is the X-axis rail 311 Next, the moving frame 343 is moved in the Y-axis direction.
  • first grip part 360 and the second grip part 370 may be moved in a state in which the first grip part 360 and the second grip part 370 do not collide with the wafer 1.
  • the Z axis frame 330 is lowered along the Z axis guide bracket 322.
  • the Y-axis moving unit 340 is driven to press both sides of the wafer 1 stored in the wafer pusher 200.
  • the wafer pusher 200 is moved to an initial position and exits the outside of the vertical type wafer transfer conveyor 100, and the wafer gripper 300 is moved in the Y-axis direction to the outside of the vertical type wafer transfer conveyor 100.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Selon la présente invention, comme décrit ci-dessus, la partie supérieure du doigt d'un bloc de doigt soulevant une tranche a une forme conique, et la section transversale de la partie inférieure est formée de façon à avoir une taille inférieure à celle d'une unité de corps, de telle sorte que des détériorations qui pourraient être subies par la tranche pendant le soulèvement de la tranche à partir d'une cassette peuvent être rendues minimales et que des copeaux générés dans la tranche peuvent être déchargés de manière régulière vers la partie inférieure.
PCT/KR2013/001411 2012-06-27 2013-02-22 Pousseur de tranches WO2014003285A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120069360A KR20130140518A (ko) 2012-06-14 2012-06-27 웨이퍼 푸셔
KR10-2012-0069360 2012-06-27

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110150217A (zh) * 2019-05-21 2019-08-23 湖州福瑞生态农业有限公司 一种低碳高效循环流水生态养殖系统
WO2020000780A1 (fr) * 2018-06-27 2020-01-02 君泰创新（北京）科技有限公司 Dispositif de transplantation et système de transplantation
CN110937218A (zh) * 2019-10-29 2020-03-31 西南医科大学附属医院 一种临床医学菌种资源库系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000012303U (ko) * 1998-12-16 2000-07-05 김규현 웨이퍼 이송장치
KR20030060373A (ko) * 2002-01-08 2003-07-16 삼성전자주식회사 반도체 설비의 웨이퍼 운반장치
KR20040064588A (ko) * 2003-01-10 2004-07-19 한미반도체 주식회사 반도체 처리장치
KR100666239B1 (ko) * 2005-11-16 2007-01-09 윤재호 웨이퍼 얼라인 장치
KR20110023026A (ko) * 2009-08-28 2011-03-08 (유)에스엔티 태양전지용 웨이퍼의 카세트 이송장치 및 이를 이용한 태양전지용 웨이퍼의 텍스처 처리장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000012303U (ko) * 1998-12-16 2000-07-05 김규현 웨이퍼 이송장치
KR20030060373A (ko) * 2002-01-08 2003-07-16 삼성전자주식회사 반도체 설비의 웨이퍼 운반장치
KR20040064588A (ko) * 2003-01-10 2004-07-19 한미반도체 주식회사 반도체 처리장치
KR100666239B1 (ko) * 2005-11-16 2007-01-09 윤재호 웨이퍼 얼라인 장치
KR20110023026A (ko) * 2009-08-28 2011-03-08 (유)에스엔티 태양전지용 웨이퍼의 카세트 이송장치 및 이를 이용한 태양전지용 웨이퍼의 텍스처 처리장치

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020000780A1 (fr) * 2018-06-27 2020-01-02 君泰创新（北京）科技有限公司 Dispositif de transplantation et système de transplantation
CN110150217A (zh) * 2019-05-21 2019-08-23 湖州福瑞生态农业有限公司 一种低碳高效循环流水生态养殖系统
CN110150217B (zh) * 2019-05-21 2021-07-02 湖州福瑞生态农业有限公司 一种低碳高效循环流水生态养殖系统
CN110937218A (zh) * 2019-10-29 2020-03-31 西南医科大学附属医院 一种临床医学菌种资源库系统

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