WO2022215810A1 - Système de saisi et de placement comprenant un éjecteur hybride - Google Patents

Système de saisi et de placement comprenant un éjecteur hybride Download PDF

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Publication number
WO2022215810A1
WO2022215810A1 PCT/KR2021/010141 KR2021010141W WO2022215810A1 WO 2022215810 A1 WO2022215810 A1 WO 2022215810A1 KR 2021010141 W KR2021010141 W KR 2021010141W WO 2022215810 A1 WO2022215810 A1 WO 2022215810A1
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Prior art keywords
semiconductor chip
film
chip
unit
ring frame
Prior art date
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PCT/KR2021/010141
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English (en)
Korean (ko)
Inventor
양해춘
Original Assignee
㈜토니텍
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Publication of WO2022215810A1 publication Critical patent/WO2022215810A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04—Cleaning by suction, with or without auxiliary action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
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    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/6839—Separation by peeling using peeling wedge or knife or bar

Definitions

  • the present invention relates to a pick-and-place system having a hybrid ejector, and more particularly, to a hybrid ejector that enables easy suction picking by more efficiently separating a semiconductor chip from a PI film of a ring frame after a deposition process. It relates to an equipped pick and place system.
  • a thin metal plate (Cu, Au, AG) is deposited in a vacuum environment except for the surface on which the chip is mounted.
  • the semiconductor chips do not perform the deposition process in a dense state, and the ssoing process is performed to facilitate the deposition of the semiconductor package side. After individualizing the semiconductor chips through the The deposition frame in which the semiconductor chips are stacked at predetermined intervals is put into the deposition equipment, and deposition is performed.
  • the deposition frame may be composed of a ring frame through which the center is penetrated, and a PI (Polyimide) film that is fixed to cover the through center of the ring frame and that semiconductor chips are adhered to one surface at predetermined intervals.
  • PI Polyimide
  • the deposition process can be completed in a vacuum chamber by attaching a semiconductor chip to the surface of the PI film. ), a separation operation of removing the chip from the PI film is preceded in order to load it onto a tape reel (TAPE AND REEL). It was impossible to apply the ejection method because it was not supported.
  • the ejecting-type chip separation is not applied to the pick-and-place system in the post-deposition process in which the chips are loaded into a tray, tube or tape reel after the deposition process, but by sawing the integrated semiconductor chip loaded in the sawing frame for the deposition process. It is applied to the pick-and-place system in the deposition preparation process applied to separate and separate the individualized semiconductor chip from the UV film of the frame for sawing and sort the PI film of the frame for deposition at a predetermined interval. Since the adhesive layer is hardened and the adhesive strength is weakened, it is easily separated from the UV film while pushing the individualized chip with the ejector pin using a conventional ejector, so that picking of the semiconductor chip can be made easily.
  • Korean Patent Registration No. 10-1719168 discloses a wafer ring including a detaching picker module that enables detaching and picking of materials such as semiconductor packages using a detaching picker module mounted on a pick and place system.
  • a pick-and-place system for the frame method has been interposed.
  • the pick and place system disclosed in Patent Registration No. 10-1719168 strongly presses the film around the semiconductor chip using a press tool 30, and when the film and the chip become spaced apart, the picker 31 is used.
  • a press tool 30 serves to hold up when pressed from the upper part, so that the chips are spaced apart.
  • the present invention was devised to solve the conventional problems as described above, and is a pick-and-place system applied after the deposition process, so that the semiconductor chip is separated from the PI film of the ring frame more efficiently without damage to facilitate picking. It is an object to provide a pick and place system with an improved hybrid ejector.
  • the semiconductor chip is separated from the present PI film and picked, and the particle dust collecting unit is configured to collect foreign substances such as particles from the semiconductor chip during transport, and the dust collection efficiency is increased by brushing the semiconductor chip to increase the dust collection efficiency and higher quality semiconductor
  • Another object is to provide a pick and place system with an improved hybrid ejector for producing chips.
  • the object of the present invention is not limited thereto, and even if not explicitly mentioned, the object or effect that can be grasped from the solution or embodiment of the problem is also included therein.
  • the pick-and-place system having the hybrid ejector of the present invention for achieving the above object is applied after the deposition process, and the deposition-completed ring frame is supplied, and the semiconductor chip is separated from the PI film of the ring frame, picked, and then loaded onto the tray
  • a pick-and-place system a PI film attached to the edge and a ring frame comprising a semiconductor chip attached to the PI film are fixedly mounted, and the semiconductor chip is separated from the PI film while the ring frame is fixedly mounted.
  • a work table that provides a work space to be used; a frame supply unit for loading the ring frame on the work table and collecting the ring frame to be collected after the work is completed on the work table; A hybrid ejector disposed under the work table and pulling the PI film down by forming a vacuum pressure in a state in close contact with the lower surface of the PI film so that the PI film is separated from the periphery except for the central portion of the semiconductor chip. wealth; a chip transfer unit having a suction picker that picks and transfers the semiconductor chip having a reduced contact area by the hybrid ejector unit; and an off-loader unit having a tray on which semiconductor chips are transferred and loaded through the chip transfer unit.
  • the hybrid ejector part is formed with an edge-adhering part that is in close contact with the lower surface of the PI film on the upper periphery, and a vacuum chamber is formed inside the edge-adhering part to transform the PI film into a downwardly drawn shape by vacuum pressure.
  • An air suction hole for sucking air in the vacuum chamber to form a vacuum pressure in the vacuum chamber is configured at the bottom of the hole chamber, and the center of the vacuum chamber is in contact with the PI film and the upper surface of the PI film
  • a chip support pin supporting only the central portion of the semiconductor chip attached to the chip may be configured to protrude.
  • the hybrid ejector part is lowered so that the PI film is spaced apart from the rest except for the central part of the semiconductor chip by the vacuum pressure formed in the vacuum chamber in a state in which the edge adhesion part and the chip support pin are in close contact with the PI film. It may be configured to reduce the contact area of the PI film in contact with the lower surface of the semiconductor chip by causing the bending shape deformation.
  • an ejector lifting pin configured to be drawn in or drawn out according to a lifting operation, and further reducing a contact area between the semiconductor chip and the PI film while raising the semiconductor chip during withdrawal, may be further configured.
  • the semiconductor chip transferred by the transfer unit may be configured to further include a particle dust collecting unit that brushes and separates particles from the semiconductor chip, and collects and removes the particles.
  • the particle dust collecting unit includes a chip accommodating hole in which a semiconductor chip is inserted and accommodated, a brush brush is configured to implant a brush brush into an inner circumferential surface of the chip accommodating hole, and a brush unit that performs a brushing operation to separate particles from the semiconductor chip by performing vertical vibration. ; a chip fixing unit closely fixed to a lower portion of the semiconductor chip and fixing the semiconductor chip during a brushing operation by the brush unit; It may be configured to include a; a suction hood configured to surround the periphery of the brush unit to suction and dust the particles separated from the semiconductor chip.
  • It may be configured to further include a chip recovery unit that sucks and collects the semiconductor chips falling on the work table.
  • the present invention causes a deformation of pulling the PI film downward through vacuum pressure using a hybrid ejector unit to separate the PI film from the remaining peripheral parts except for only the central part of the semiconductor chip. Also, since the semiconductor chip can be picked more easily and stably, an effective chip separation operation can be performed without any damage to the semiconductor chip.
  • the present invention can further reduce the adhesion area between the semiconductor chip and the PI film by pulling up the ejector lifting pin from the chip support pin if necessary according to the adhesive force of the PI film and pushing up the semiconductor chip.
  • the chip separation operation may proceed.
  • the present invention stops momentarily, separates particles from the semiconductor chip through a brushing operation, and further comprises a particle dust collecting unit that sucks the separated particles and collects the dust. It has the effect of enabling chip mass production and significantly reducing the defect rate.
  • 1 is a view showing the operating state of the ejector module of the conventional pick and place system
  • FIG. 2 is a view showing a conventional gang picker
  • FIG. 3 is a conceptual diagram illustrating a pick and place system having a hybrid ejector according to an embodiment of the present invention
  • FIG. 4 is a perspective view showing a partial configuration of the pick and place system of the present invention.
  • FIG. 5 is a perspective view showing the configuration of FIG. 4 as viewed from another direction;
  • FIG. 6 is a perspective view schematically showing a hybrid ejector part of the present invention.
  • FIG. 9 is a view schematically showing a chip recovery unit of the present invention.
  • a component when referred to as being on another component, it may be directly formed on the other component or a third component may be interposed therebetween.
  • a third component may be interposed therebetween.
  • the thickness of the components is exaggerated for effective description of technical content.
  • Embodiments described herein will be described with reference to cross-sectional and/or plan views, which are ideal illustrative views of the present invention.
  • thicknesses of films and regions are exaggerated for effective description of technical content. Accordingly, the shape of the illustrative drawing may be modified due to manufacturing technology and/or tolerance. Therefore, embodiments of the present invention are not limited to the specific form shown, but also include changes in the form generated according to the manufacturing process.
  • the etched region shown at a right angle may be rounded or have a predetermined curvature.
  • the regions illustrated in the drawings have properties, and the shapes of the illustrated regions in the drawings are intended to illustrate specific shapes of regions of the device and not to limit the scope of the invention.
  • terms such as first, second, etc. are used to describe various components, but these components should not be limited by these terms. These terms are only used to distinguish one component from another.
  • the embodiments described and illustrated herein also include complementary embodiments thereof.
  • the pick-and-place system of the present invention separates and transports the deposited semiconductor chip (c) attached to the PI film (T) from the PI film (t) installed in the deposition ring frame (p) after the deposition process is completed. to be loaded onto the tray.
  • the pick-and-place system having a hybrid ejector of the present invention includes a work table 100 for fixing a ring frame p, a frame supply unit 200 for loading the ring frame p on the work table 100, PI Hybrid ejector part ( 300), a chip transfer unit 400 having a suction picker that picks and transfers the semiconductor chip c having a reduced contact area by the hybrid ejector unit 300, and a semiconductor transferred through the chip transfer unit 400 It is configured to include an off-loader unit 500 for loading the chip (c) on the tray (510).
  • the work table 100 is configured to be moved by the transfer rail 110 , and specifically, it moves to one side of the transfer rail 110 and the ring frame p is loaded from the frame supply unit 200 .
  • the semiconductor chip (c) is separated from the PI film (t) by the hybrid ejector part 300 disposed on the lower part and the suction picker 412 disposed on the upper part by moving to the other side of the transfer rail 110 and the position, and It is configured to be displaced to a separation and picking position to allow picking to take place.
  • the frame supply unit 200 supplies and fixes the ring frame p to which the semiconductor chip c is attached to the PI film t on the work table 100 while the work table 100 is waiting at the loading position. configured to be mounted.
  • the frame supply unit 200 is configured to include a loader 210 , a mounting rail 220 , a pull-out grip unit 225 , a first link picker 230 , and a second link picker 240 .
  • the loader 210 is equipped with a cassette 212 in which the ring frame p is stacked in a stacked form, and is configured such that the elevating operation of the cassette 212 is made, and the cassette ( 212) is configured to take-out of the loaded ring frame (p).
  • the mounting rail 220 is configured as a pair so that the ring frame p is raised and mounted. It is configured to enable an operation in which the gap is narrowed to enable the mounting of the ring frame (p) or the ring frame (p).
  • the spacing adjusting means 222 is a moving guide rail 222a on which a pair of mounting rails 222 are slidably moved, and a pair of pulleys 222b installed on both sides of the moving guide rail 222a. It is configured to rotate with the rotation of the pair of pulleys 222b, and the side ends of the pair of mounting rails 220 are each fixed, so that the distance between the pair of mounting rails 220 is widened or narrowed depending on the rotational direction.
  • the driving belt 222c which is wound around the both side pulleys 222b and rotates has a form in which two rows of belts are arranged side by side.
  • the fixing is made, and the side of the other mounting rail 220 is fixed so as to be engaged with the other belt among the two rows of belts. Accordingly, when the fixing belt 222c rotates in one direction, the pair of mounting rails 220 ) becomes narrower, and when it rotates in the other direction, the distance between the pair of mounting rails 220 may be widened to move away from each other.
  • the pull-out grip part 225 is configured to be connected to one side of the first link picker 230, is configured to move in association with the position control of the second link picker 230, and is a ring inserted into the cassette 212. By gripping the frame (p) and moving it backward, the ring frame (p) is drawn out from the cassette 212, and the gripping is released on the pair of mounting rails 220 to remove the ring frame (p) as a pair of It is configured to be placed on the mounting rail 220 .
  • the first link picker 230 is configured to load and load the ring frame p mounted on the pair of mounting rails 220 by suction picking and loading it on the work table 100 , the first link picker 230 . is configured to be vertically movable up and down by the first ring transport robot 232 so as to be moved in the vertical direction.
  • the second ring picker 240 moves by suction-picking the ring frame (p) mounted on the pair of mounting rails (220) or the ring frame ( It is configured to move the position by suction picking p).
  • the second ring picker 240 includes a pull-out grip part 225 at the front end, and is connected to the second ring transfer robots 242 and 244 to be movable, so that the second ring picker 240 and the pull-out grip part 225 are movable. ) are interlocked at the same time to enable position control.
  • the second ring transfer robots 242 and 244 move the second link picker 240 in the x and z-axis directions, as shown in FIG. 3, to move the second link picker 240 toward the mounting rail 220. It may be configured to include a forward and backward transfer unit 242 that moves forward and backward in the x-axis direction, and a vertical transfer unit 244 that vertically moves up and down in the z-axis direction.
  • the frame supply unit 200 may grip the ring frame (p) from the cassette 212 of the loader 210 of the pull-out grip unit 225 to draw it out, and place it on the mounting rail 220, 1
  • the ring picker 230 sucks and picks the ring frame (p) on the mounting rail 220 and moves to the upper part to stand by.
  • the separation operation of the semiconductor chip (c) is completed, and in a state moved to the lower part of the ring frame (p) of the work table (110), collection mounted on the work table (110) is required.
  • the second ring picker 240 descends and picks the ring frame p by suction, and then retreats from the mounting rail 220 and waits as shown in FIG. 3 .
  • the first ring picker 230 descends toward the work table 110 and puts the picked ring frame p on the empty work table 110, thereby placing the PI film t of the ring frame p. ) so that the supply of the ring frame (p) is made so that the separation operation of the semiconductor chip (c) is made, and the second ring picker 240 carries the ring frame (p) to be picked up to be collected by a pair of mounting rails.
  • the ring frame (p) to be collected is placed on the 220, and the pull-out grip part 225 is mounted on the mounting rail 220 to be drawn into the cassette 212 to be collected.
  • the first link picker 230 and the second link picker 240 load and supply the ring frame p for the separation operation of the semiconductor chip c on the work table 110 .
  • the operation of collecting the ring frame (p) to be collected on the work table (110) is sequentially performed so that the supply and collection of the ring frame (p) is made more efficiently.
  • the hybrid ejector unit 300 has a ring frame (p) mounted on the work table (110) in a state in which the ring frame (p) is fixedly mounted on the work table (110) and positioned at the upper position, that is, the separation and picking position (P). ) of the PI film (t) in close contact with the lower surface of the PI film (t) by forming a vacuum pressure to pull the PI film (t) to be bent downward to separate a part of the PI film (t) from the lower surface of the semiconductor chip (c), the contact area It is configured to perform a film separation operation to reduce the , so that picking by the chip picker 412 is easier and more stable.
  • the hybrid ejector unit 300 is configured to be movable up and down by an elevating robot, and the upper end may be configured to be in close contact with the lower surface of the PI film (t) when elevating.
  • the hybrid ejector unit 300 has an edge contact part 310 that is in close contact with the lower surface of the PI film t on the upper periphery, and moves to the inside of the edge contact part 310 .
  • the vacuum chamber 312 is configured to be formed, and a suction motor (vacuum source) is connected to the bottom surface of the vacuum chamber 312 to suck the air in the vacuum chamber 312 to make the inside of the vacuum chamber 312 in a vacuum state.
  • An air intake hole 314 is configured to become At this time, the edge adhesion portion 310 is configured to have a size larger than the size of the semiconductor chip c, and is configured to be in close contact with the lower surface of the PI film t in the region outside the semiconductor chip c.
  • the ejector unit 300 is shown to be formed in the form of a circular column, but is not limited thereto.
  • the edge contact portion 310 may also be formed in the shape of a square edge. In addition, of course, it may be formed in various polygonal shapes in addition to the rectangular pillars.
  • the hybrid ejector unit 300 is formed to protrude upward from the center of the vacuum chamber 312 to support the semiconductor chip c attached to the upper surface of the PI film t while in contact with the upper end of the PI film t.
  • a chip support pin 320 is formed to protrude. At this time, the chip support pin 320 is configured to support only the central portion of the semiconductor chip (c).
  • the hybrid ejector unit 300 sucks air in the vacuum chamber 312 through the air suction hole 314 in a state in which the edge contact portion 310 and the chip support pin 320 are in close contact with the lower surface of the PI film t.
  • the vacuum pressure is formed in the vacuum chamber 312 by taking it out, and the PI film t attached to the remaining peripheral portions except for the central portion of the semiconductor chip c as shown in FIG. 7 by the vacuum pressure formed in the vacuum chamber 312 is below.
  • the PI film (t) is separated from the remaining part except for the central part of the semiconductor chip (C).
  • the adhesion area where the lower surface of the semiconductor chip (c) is adhered to the PI film (t) is reduced, and the semiconductor chip (c) is suction-picked by the suction picker (412) from the PI film (t) to the semiconductor chip ( c) can be more easily completely separated.
  • the edge contact portion 310 and the chip support pin 320 are in close contact with the lower surface of the PI film t, and a vacuum pressure is formed in the vacuum chamber 312, thereby forming the PI film.
  • (t) is spaced apart from all other peripheral parts except for the central part of the lower surface of the semiconductor chip (c) so that separation is made.
  • the semiconductor chip (c) attached to t) can be separated from the PI film (t) more stably and easily.
  • the chip support pin 320 is formed on the upper outer peripheral surface of the PI film t by the vacuum pressure of the vacuum chamber 312 when it is pulled into the vacuum chamber 312 and bent when the shape deformation occurs.
  • the PI film (t) that is curved downward can be stably adhered to and a close contact inclined surface 322 that prevents damage such as tearing of the PI film (t) can be configured.
  • the present invention is configured to further include an ejector lifting pin 330 in which a pin lifting hole 324 is formed through the center of the chip support pin 320, and the lifting operation is performed through the pin lifting hole 324.
  • the ejector lifting pin 330 may be configured to be lifted by a driving member such as a cylinder, and is drawn out from the pin lift hole 324 and protrude upward from the chip support pin 320 or the pin lift hole 324 ) may be configured to be drawn into the interior.
  • a driving member such as a cylinder
  • the ejector lifting pin 330 When the ejector lifting pin 330 is withdrawn and protrudes upward than the chip support pin 320 , the ejector lifting pin 330 lifts the semiconductor chip c while the semiconductor chip c and the PI film t are removed. The contact area can be further reduced.
  • the ejector lifting pin 330 protrudes to the top of the chip support pin 320 while being drawn into the chip support pin 320 , the ejector lifting and lowering having a smaller diameter than the chip support pin 320 .
  • the adhesion area is additionally greater than the adhesion area where the central part of the semiconductor chip c is adhered to the PI film t before the ejector lifting pins 330 are pulled out. can be reduced, and thereby the semiconductor chip c can be more easily separated by the suction picker 412 .
  • the upper end of the ejector lifting pin 330 is formed in a cone shape above the lower light in order to minimize the area where the semiconductor chip c is adhered to the PI film t.
  • the ejector unit 300 greatly reduces the adhesion area between the semiconductor chip (c) and the PI film (T) by vacuum pressure, and separation is performed by the suction picker 412 in this state. , a more efficient and easy chip separation operation can be made.
  • the chip transfer unit 400 is configured to pick and transport the semiconductor chip c having a reduced contact area by the high-lead ejector unit 300 and load it on the tray 510 of the off-loader unit 500 .
  • the chip transfer unit 410 is positioned by the chip picker transfer robot 420 so as to pick and transport the semiconductor chip c separated from the PI film t and load it on the tray 510 of the off-loader unit 500 . It is configured to include the chip pickers 410 and 440 that are moved.
  • the chip picker 410 is configured such that a plurality of suction pickers 412 are each configured to pick and transfer a plurality of semiconductor chips c.
  • the chip transfer unit 400 of the present invention includes a plurality of temporary semiconductor chips c between the work table 100 and the offloader 500 so that the semiconductor chips c can be efficiently transferred and loaded.
  • a pocket table 430 having a loading groove 432 is constituted, and the chip pickers 410 and 440 adsorb and pick the semiconductor chip c separated from the PI film t, and transport it to the pocket table 430 temporarily. It includes a first chip picker 410 for loading, and a second chip picker 440 for suction-picking and transporting the semiconductor chips (c) loaded on the pocket table 430 and loading them on the tray 510 . can be configured to do so.
  • the first chip picker 410 may include an alignment vision camera 414 for position control on the side thereof.
  • the off-loader unit 500 packs the semiconductor chip (c) in which the semiconductor chip (c) is separated from the PI film (t) of the ring frame (p) by the ejector unit (300) and the chip transfer unit (400). It is a configuration for loading on the tray 510 to provide to the process.
  • the off-loader unit 500 includes a tray 510 on which the semiconductor chip c transferred by the chip transfer unit 400 is loaded, a magazine unit 520 into which the tray 510 is inserted and stacked and stored, and a defective chip. It is configured to include a collection container 530 to be collected.
  • the off-loader unit 500 performs a vision inspection through the vision inspection unit 600 in the process of being transported by the chip transfer unit 400 and loads the chip transfer unit 400 on which the vision inspection has been performed on the tray 510 .
  • the vision inspection unit 600 is configured to include a top vision unit 610 for vision inspection of the upper surface of the semiconductor chip (c) and a bottom vision unit 620 for inspecting the lower surface of the semiconductor chip (c).
  • the top vision unit 610 is disposed on the top of the pocket table 430, and the loading groove 432 of the pocket table 430 is configured to perform a vision inspection of the upper surface of the semiconductor chip c temporarily loaded, and the bottom vision unit
  • the semiconductor chip (c) 620 is disposed below the second chip picker 440 that moves between the pocket table 430 and the off-loader unit 500 and is sucked and picked by the second chip picker 440 . It is configured to perform a vision inspection of the lower surface of the
  • the second chip picker 440 transfers the semiconductor chip c to the tray 510 .
  • the second chip picker 440 collects the semiconductor chip (c) into the collection container 530 ) and can be configured to be collected through unpicking.
  • particles are picked up from the semiconductor chip c arranged between the work table 100 and the pocket table 430 and picked and transported by the first chip picker 410 .
  • a particle dust collecting unit 700 to remove may be further configured.
  • the chip transfer unit 400 is configured such that the first chip picker 410 picks the semiconductor chip c from the PI film t on the work table 100 and makes an instantaneous stop on the particle dust collecting unit 700 during the transfer process.
  • the particle collecting unit 700 is attached to the semiconductor chip (c) in a state in which the first chip picker 410 for picking the semiconductor chip (c) is stopped on the particle collecting unit 700.
  • Particles, etc. It may be configured to suction and remove foreign substances of
  • the particle dust collecting unit 700 can be configured to be movable up and down by a lifting and lowering robot, and in a state where the first chip picker 410 with the semiconductor chip (c) picked up is stopped on the particle dust collecting unit 700, The particle dust collecting unit 700 may be configured to rise toward the first chip picker 410 to perform a dust collecting operation.
  • the particle dust collecting unit 700 is provided with a plurality of chip accommodating holes 711 in which the semiconductor chip c is inserted and accommodated, and a brush brush 712 is provided on the inner peripheral surface of the chip accommodating hole 711,
  • the semiconductor chip (c) accommodated in the chip accommodating hole 711 through up-and-down reciprocating motion is brushed by the brush brush 712 and the brush unit 710 for separating dust such as particles, and the semiconductor chip (c)
  • a chip fixing part 720 for preventing the semiconductor chip c from being separated from the first chip picker 410 during the brushing operation of the brush part 710 by having a chip support bar 722 that closely fixes the It is installed to surround the circumference of the part 710 and is configured to include a suction hood 730 that sucks and collects particles separated from the semiconductor chip c by the operation of the brushing part 710 .
  • the brush unit 710 is configured to be connected to an eccentric vibration motor to perform a vertical vibration operation, and thus the brush unit 710 may be configured to vibrate at high and high speeds according to the driving of the eccentric vibration motor.
  • the brush unit 710 such as an ultrasonic vibrator as well as an eccentric vibration motor may be configured to vibrate through various vibration generating means.
  • the suction hood 730 is configured to be connected to the suction motor (suction source) of the cleaner or dust collector, so that the particles separated from the semiconductor chip c are sucked by the brush unit 710 to collect the dust.
  • a dust collector in which particles are collected may be configured on the downstream side of the suction hood 730 .
  • the particle dust collecting unit 700 is provided with a brush unit 710, a chip fixing unit 720, and a suction hood 730, and a body casing forming the outer shape of the particle dust collecting unit 700 may be further configured,
  • the vertical position driving of the particle dust collecting unit 700 may be performed by an elevating actuator such as a cylinder means for elevating the main casing.
  • the first chip picker When the first chip picker 410 misses the semiconductor chip c due to a malfunction of the 410 , and the semiconductor chip c falls onto the work table 100 , the semiconductor chip c falls on the work table 100 . ), it may take a lot of time to restart the process if it is not quickly recovered.
  • a suction nozzle 810 is installed on the side of the work table 100 , and the suction nozzle 810 is connected to the suction motor 830 as a flow path, and the chip is formed on the connection flow path.
  • the collection container 820 in which the collection is made is configured to further include a chip recovery unit 800 configured.
  • the chip recovery unit 800 is operated intermittently, or after the separation and picking of the semiconductor chip c from one ring frame p are all completed, the suction chip recovery operation is performed through the chip recovery unit 800 .
  • the process efficiency can be greatly improved by minimizing the process interruption time through the rapid recovery of the semiconductor chip c falling on the work table 100 .
  • the present invention as described above can be widely used in the field of semiconductor manufacturing industry.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un système de saisi et de placement comportant un éjecteur hybride. Le système de saisi et de placement décrit ayant un éjecteur hybride est un système de saisi et de placement, qui est appliqué après un processus de dépôt pour recevoir un cadre annulaire terminé par dépôt, et sépare une puce à semi-conducteur d'un film PI du cadre annulaire, saisi la puce à semi-conducteur séparée, puis charge la puce à semi-conducteur saisie sur un plateau, et comprend : une table de travail, qui maintient de manière fixe un cadre annulaire comprenant un film PI fixé à un bord de celui-ci et des puces à semi-conducteurs fixées au film PI, et fournit un espace de travail permettant à la puce à semi-conducteur d'être séparée du film PI tandis que le cadre annulaire est maintenu fixe ; une unité d'alimentation en cadre pour charger le cadre annulaire sur la table de travail et collecter le cadre annulaire à collecter après l'achèvement du travail sur la table de travail ; une unité d'éjecteur hybride qui est disposée sous la table de travail et qui forme une pression de vide tout en étant en contact étroit avec la surface inférieure du Film PI pour tirer le film PI vers le bas de telle sorte que le film PI est séparé d'une partie adjacente qui exclut la partie centrale de la puce à semi-conducteur ; une unité de transfert de puce ayant un dispositif de saisie d'adsorption pour adsorber, saisir et transférer la puce à semi-conducteur ayant une zone de contact réduite au moyen de l'unité d'éjecteur hybride ; et une unité de déchargement ayant un plateau sur lequel la puce à semi-conducteur est chargée en étant transférée à travers l'unité de transfert de puce.
PCT/KR2021/010141 2021-04-09 2021-08-03 Système de saisi et de placement comprenant un éjecteur hybride WO2022215810A1 (fr)

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KR10-2021-0046363 2021-04-09
KR1020210046363A KR102488826B1 (ko) 2021-04-09 2021-04-09 하이브리드 이젝터를 구비한 픽 앤 플레이스 시스템

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