WO2021071340A1 - Module de mise sous pression et manipulateur de dispositif comprenant ce dernier - Google Patents

Module de mise sous pression et manipulateur de dispositif comprenant ce dernier Download PDF

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Publication number
WO2021071340A1
WO2021071340A1 PCT/KR2020/013876 KR2020013876W WO2021071340A1 WO 2021071340 A1 WO2021071340 A1 WO 2021071340A1 KR 2020013876 W KR2020013876 W KR 2020013876W WO 2021071340 A1 WO2021071340 A1 WO 2021071340A1
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WO
WIPO (PCT)
Prior art keywords
unit
exchange position
tray
test
pressing
Prior art date
Application number
PCT/KR2020/013876
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English (en)
Korean (ko)
Inventor
유홍준
Original Assignee
(주)제이티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)제이티 filed Critical (주)제이티
Publication of WO2021071340A1 publication Critical patent/WO2021071340A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente invention se rapporte à un module de mise sous pression et à un manipulateur de dispositif comprenant ce dernier et plus particulièrement à un module de mise sous pression permettant de tester les caractéristiques électriques d'un dispositif, et à un manipulateur de dispositif comprenant ce dernier. L'invention concerne un manipulateur de dispositif comprenant : une unité de chargement (100) sur laquelle des plateaux (2) présentant une pluralité de dispositifs (1) chargés sur ces derniers sont chargés ; une unité de test (300) qui teste la pluralité de dispositifs (1) transférés en provenance de l'unité de chargement (100) ; une unité de déchargement (500) qui reçoit les dispositifs (1) en provenance de l'unité de test (300) et charge les dispositifs (1) sur des plateaux (2) ; une unité tampon (200) qui déplace au moins un plateau tampon (210) entre une première position d'échange de dispositif (P1) permettant d'échanger les dispositifs (1) avec l'unité de chargement (100) et/ou l'unité de déchargement (500), et une seconde position d'échange de dispositif (P2) permettant d'échanger les dispositifs (1) avec l'unité de test (300) ; un module de transfert de test (800) comprenant une paire d'unités de mise sous pression de dispositif (820) qui transfère les dispositifs entre la seconde position d'échange de dispositif (P2) et l'unité de test (300) et met sous pression les dispositifs pour un test de dispositif dans l'unité de test (300), et une unité de déplacement de module (870) qui positionne alternativement, au moyen d'une rotation horizontale, la paire d'unités de mise sous pression de dispositif (820) de façon à être placés au niveau de la seconde position d'échange de dispositif (P2) et l'unité de test (300) ; et au moins un outil de transfert (400) qui transfère les dispositifs (1) entre la première position d'échange de dispositif (P1) et les plateaux (2) de l'unité de chargement (100) et de l'unité de déchargement (500).
PCT/KR2020/013876 2019-10-10 2020-10-12 Module de mise sous pression et manipulateur de dispositif comprenant ce dernier WO2021071340A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20190125529 2019-10-10
KR10-2019-0125529 2019-10-10

Publications (1)

Publication Number Publication Date
WO2021071340A1 true WO2021071340A1 (fr) 2021-04-15

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ID=75436765

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2020/013876 WO2021071340A1 (fr) 2019-10-10 2020-10-12 Module de mise sous pression et manipulateur de dispositif comprenant ce dernier

Country Status (3)

Country Link
KR (1) KR20210042842A (fr)
TW (1) TW202137363A (fr)
WO (1) WO2021071340A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200225314A1 (en) * 2020-03-27 2020-07-16 Arnaud Lucres Amadjikpe Apparatus and system of surface wave mitigation for multiple-input-multiple-output (mimo) radar antenna
TWI827515B (zh) * 2023-06-01 2023-12-21 鴻勁精密股份有限公司 壓接機構、測試裝置及作業機

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102549629B1 (ko) * 2022-10-27 2023-06-30 (주)성우 이차전지용 캡조립체 검사장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070118376A (ko) * 2006-06-12 2007-12-17 삼성전자주식회사 수평 회전 구동형 반도체 자재 핸들링 장치와 그를포함하는 테스트 장치
KR20090120943A (ko) * 2008-05-21 2009-11-25 주식회사 아이피에스 진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및진공처리시스템의 트레이 이송방법
KR20120047879A (ko) * 2012-02-27 2012-05-14 (주)제이티 소자검사장치
KR101417772B1 (ko) * 2012-02-29 2014-07-15 (주)제이티 소자검사장치
KR20190000477A (ko) * 2017-06-23 2019-01-03 (주)제이티 소자핸들러

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070118376A (ko) * 2006-06-12 2007-12-17 삼성전자주식회사 수평 회전 구동형 반도체 자재 핸들링 장치와 그를포함하는 테스트 장치
KR20090120943A (ko) * 2008-05-21 2009-11-25 주식회사 아이피에스 진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및진공처리시스템의 트레이 이송방법
KR20120047879A (ko) * 2012-02-27 2012-05-14 (주)제이티 소자검사장치
KR101417772B1 (ko) * 2012-02-29 2014-07-15 (주)제이티 소자검사장치
KR20190000477A (ko) * 2017-06-23 2019-01-03 (주)제이티 소자핸들러

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200225314A1 (en) * 2020-03-27 2020-07-16 Arnaud Lucres Amadjikpe Apparatus and system of surface wave mitigation for multiple-input-multiple-output (mimo) radar antenna
US11598842B2 (en) * 2020-03-27 2023-03-07 Intel Corporation Apparatus and system of surface wave mitigation for multiple-input-multiple-output (MIMO) radar antenna
TWI827515B (zh) * 2023-06-01 2023-12-21 鴻勁精密股份有限公司 壓接機構、測試裝置及作業機

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Publication number Publication date
TW202137363A (zh) 2021-10-01
KR20210042842A (ko) 2021-04-20

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