WO2014175586A1 - Appareil de sciage de bandes à semi-conducteurs - Google Patents

Appareil de sciage de bandes à semi-conducteurs Download PDF

Info

Publication number
WO2014175586A1
WO2014175586A1 PCT/KR2014/003170 KR2014003170W WO2014175586A1 WO 2014175586 A1 WO2014175586 A1 WO 2014175586A1 KR 2014003170 W KR2014003170 W KR 2014003170W WO 2014175586 A1 WO2014175586 A1 WO 2014175586A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor package
semiconductor
alignment table
picker
adsorption
Prior art date
Application number
PCT/KR2014/003170
Other languages
English (en)
Korean (ko)
Inventor
임재영
봉순기
Original Assignee
한미반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한미반도체 주식회사 filed Critical 한미반도체 주식회사
Priority to JP2016508858A priority Critical patent/JP6121619B2/ja
Priority to CN201480021259.2A priority patent/CN105144348B/zh
Priority to SG11201508562YA priority patent/SG11201508562YA/en
Publication of WO2014175586A1 publication Critical patent/WO2014175586A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Definitions

  • the present invention relates to a semiconductor strip cutting device. More specifically, the present invention can be applied to the drying device of the semiconductor strip cutting device uniformly and efficiently to perform both the ball-up and ball-down process, the semiconductor strip cutting device that can be operated in a variety of requirements It is about.
  • the semiconductor strip cutting device refers to a device for cutting a packaged semiconductor strip into a plurality of semiconductor packages.
  • the semiconductor strip cutting apparatus performs cutting, cleaning, and drying processes, and then inspects the top and bottom of each semiconductor package by inspecting the quality of the semiconductor strip, and according to the inspection result, It is possible to provide a function of processing a series of processes for classifying defective semiconductors and taking them out to an export tray.
  • the semiconductor strip cutting device may be classified into a ball down type or a ball up type according to a loading type of a semiconductor package that is inspected and taken out.
  • Such a semiconductor strip cutting device may require a flipping process to flip the semiconductor package cut during the process according to the user's request or strip type.
  • the flipping process is carried out whether the semiconductor strip to be supplied to the semiconductor strip cutting device is supplied so that the lead frame or the ball of the lower surface is directed upward or downward, and the semiconductor package that has been inspected is carried out. Whether the shape is necessary depends on whether the lead frame or the ball of the lower surface of the semiconductor package is carried out to face upward or downward.
  • the combination of the supply method of the semiconductor strip and the export method of the semiconductor package may vary. Accordingly, separately manufacturing or designing the semiconductor strip cutting device may reduce the utility of the semiconductor strip cutting device, It can cause an increase in costs.
  • Korean Laid-Open Patent Publication No. 2012-0026745 a semiconductor strip cutting device which can be applied to both a ball down type and a ball up type has been introduced.
  • a flipper or a flipper is lifted. It has been confirmed that there is a problem that the device needs to be removed, and when the semiconductor strip cutting device is operated in a ball-down manner, there are many processes of transporting the semiconductor strip or the semiconductor package, causing various errors.
  • a pneumatic pressure is uniformly and efficiently applied to an adsorption plate of a semiconductor strip cutting device, and thus a semiconductor strip cutting device capable of performing both a ball-up method and a ball-down method and performing a process under various requirements is provided.
  • the task is to solve the problem.
  • the present invention provides an on-loader unit provided with a semiconductor strip inserted in the magazine; A pusher or drawer for discharging the semiconductor strip from the magazine to the outside of the onloader; An inlet rail on which the semiconductor strip drawn by the pusher or drawer is seated; A strip picker for vacuum-sucking the semiconductor strip seated on the inlet rail and transferring the semiconductor strip to the chuck table with the mold surface of the semiconductor strip facing downward; A cutting device receiving a semiconductor strip by the strip picker, cutting a plurality of semiconductor packages on the chuck table, and washing the upper surfaces of the plurality of cut semiconductor packages with washing water; A unit picker which vacuum-adsorbs all of the plurality of semiconductor packages cut by the cutting device and the surface of the upper surface is cleaned at a time, and transfers the vacuum-adsorbed semiconductor packages to a drying apparatus through a cleaning apparatus; A cleaning device for cleaning a lower surface of the semiconductor package in a state of being vacuum-adsorbed by the unit picker; And
  • a drying device rotatable on an axis basis as needed;
  • a first vision unit disposed in a suction plate moving path of the drying apparatus and inspecting the semiconductor package while moving in a vertical direction in an XY plane with respect to the moving direction of the suction plate;
  • a loading groove for loading the semiconductor package adsorbed on the adsorption plate, and a non-loading portion in which the semiconductor package is not loaded are alternately formed along the X-axis and Y-axis directions, and the semiconductor package adsorbed on the adsorption plate is loaded.
  • a first alignment table and a second alignment table capable of being transferred to the groove and loaded therein, and then independently transportable along the Y-axis direction;
  • a second vision unit inspecting a semiconductor package loaded in the loading grooves of the first alignment table and the second alignment table;
  • a sorting apparatus for transferring the semiconductor package in the X-axis direction according to the inspection results of the semiconductor package and classifying and storing the semiconductor package in the X-axis direction.
  • the adsorption plate of the drying apparatus is rotated by 180 ° with respect to the Y axis on the XY plane to be adsorbed on the adsorption plate, so that the dried semiconductor package is completed by the first alignment table or the second alignment through relative motion with respect to the Z axis direction.
  • the upper and lower surfaces of the semiconductor package may be reversed by being transferred into the mounting groove of the table.
  • the suction plate may further include: a base member having a first pneumatic line and a second pneumatic line for selectively applying pneumatic pressure to upper and lower surfaces of the suction plate; A first distribution member in communication with the upper surface of the suction plate and having a distribution passage communicating with the first pneumatic line of the base member to distribute the air pressure; And a second distribution member communicating with a lower surface of the suction plate and having a distribution passage communicating with the second pneumatic line of the base member to distribute the pneumatic pressure.
  • upper and lower surfaces of the adsorption plate are provided with a first adsorption part and a second adsorption part each having an intake port through which the semiconductor package is adsorbed and a nonadsorption part through which the semiconductor package is not adsorbed, which are formed in the X and Y axis directions.
  • the first distribution member may be in communication with a suction port formed in the first adsorption part
  • the second distribution member may be in communication with a suction port formed in the second adsorption part.
  • the unit picker includes: first suction ports and second suction ports that are alternately arranged; A first pneumatic line in communication with the first suction ports; A second pneumatic line communicating with the second suction ports and separated from the first pneumatic line; And vacuum means for selectively applying a vacuum pressure to the first pneumatic line and the second pneumatic line.
  • a lower blower installed toward the first adsorption part; And an upper blower installed toward the second adsorption unit side.
  • the ball or lead surface of the semiconductor package adsorbed to the adsorption plate is inspected using the first vision unit.
  • the mold surface of the semiconductor package loaded on the first alignment table or the second alignment table may be inspected by the second vision unit by transferring the completed semiconductor package into the loading groove of the first alignment table or the second alignment table.
  • the alignment table picker which is provided to be movable along the X-axis or Y-axis direction, and picks up the semiconductor package adsorbed on the adsorption plate of the drying apparatus to be loaded into the loading groove of the first alignment table or the second alignment table
  • the alignment table picker may further include picking up the entire semiconductor package adsorbed on the adsorption plate at once or two times, and sequentially loading the first and second alignment tables twice in the first alignment table and the second alignment table. I can let you.
  • the alignment table picker or the suction plate may include first and second suction ports disposed alternately with each other; A first pneumatic line in communication with the first suction ports; A second pneumatic line communicating with the second suction ports and separated from the first pneumatic line; And vacuum means for selectively applying a vacuum pressure to the first pneumatic line and the second pneumatic line.
  • the mold surface of the semiconductor package is inspected by the first vision unit in a state of being picked up by the alignment table picker, and the inspected semiconductor package is transferred into a loading groove of the first alignment table or the second alignment table.
  • the second vision unit By using the second vision unit, the ball surface or the lead surface of the semiconductor package loaded on the first alignment table or the second alignment table may be inspected.
  • the adsorption plate of the drying apparatus is rotated by 180 ° about the Y axis on the XY plane using the first vision unit to inspect the ball surface or the lead surface of the semiconductor package adsorbed on the adsorption plate, the adsorption After the plate is rotated by 180 ° with respect to the Y axis on the XY plane, the inspected semiconductor package is picked up by the alignment table picker, and the mold surface of the semiconductor package is inspected by the first vision unit. Can be.
  • the alignment table picker includes: a guide frame installed along one direction axis; And alignment table picker drive means detachably coupled to the guide frame to move the alignment table picker; One side of the drying apparatus is connected to the first conveying rail fastened to the lower portion of the guide frame, the other side of the drying apparatus is connected to the second conveying rail between the driving means of the alignment table picker and the driving means of the drying apparatus. Interference or collision may not occur.
  • the upper surface of the adsorption plate is provided with a first adsorption portion in which the suction port to which the semiconductor package is adsorbed is arranged in a matrix form along the X-axis and the Y-axis direction, the lower surface of the adsorption plate is the second pneumatic line or the second Vacuum shielding means for shielding the distribution member may be provided.
  • the first suction unit may include first suction ports and second suction ports that are alternately disposed; And vacuum means for selectively applying a vacuum pressure in communication with the first suction ports and the second suction ports, respectively, wherein the vacuum means is configured to apply a vacuum pressure to the first distribution member through the first pneumatic line.
  • vacuum means for selectively applying a vacuum pressure in communication with the first suction ports and the second suction ports, respectively, wherein the vacuum means is configured to apply a vacuum pressure to the first distribution member through the first pneumatic line.
  • the drying apparatus the movable frame is installed to be movable along one axis, the suction plate is rotatably coupled;
  • a heater installed in the adsorption plate and applying heat to the semiconductor package adsorbed to the adsorption plate to dry the heater;
  • a blower which blows gas into the semiconductor package adsorbed on the adsorption plate to remove water present on the upper surface or the side surface of the adsorption plate or the semiconductor package.
  • the vacuum shielding means may be a fastening member or a shield member in the form of a plate.
  • the first vision unit is an upper vision unit that inspects one of the upper and lower surfaces of the semiconductor package, and is provided below the semiconductor package loaded on the alignment table to inspect upwards.
  • the unit may be a downward vision unit that inspects the other surface of the upper and lower surfaces of the semiconductor package and is provided on the upper portion of the semiconductor package loaded on the alignment table to inspect downward.
  • At least one sorting picker for individually picking up the semiconductor package loaded on the first alignment table or the second alignment table to sort and transfer according to the inspection results; And a plurality of loading grooves for sorting and accommodating the semiconductor package picked up by the picking picker according to the inspection results, and may include a tray capable of transferring in one direction.
  • the semiconductor package loaded on the first alignment table and the second alignment table is picked up by the sorting picker, and one surface of the semiconductor package is inspected by the first vision unit. It can be sorted and stored.
  • the first vision is loaded in at least two of the loading grooves of the tray in the semiconductor package or the inspection jig, and the picking picker picks up each of the semiconductor package or the inspection jig.
  • the picking picker picks up each of the semiconductor package or the inspection jig.
  • the sorting apparatus may further include: a tray having a plurality of loading grooves for sorting and accommodating the semiconductor package according to inspection results of the semiconductor package; And a tray picker for picking up and unloading the tray, wherein the driving means of the tray picker and the driving means of the alignment table picker may be installed on the same guide frame.
  • the present invention is a cutting device for supplying a semiconductor strip to cut into a plurality of semiconductor packages on the chuck table, washing the upper surface of the plurality of the cut semiconductor packages using the washing water;
  • a unit picker which vacuum-adsorbs all of the plurality of semiconductor packages cut by the cutting device and the surface of the upper surface is cleaned at once, and transfers the vacuum-adsorbed semiconductor packages to a drying apparatus through a cleaning apparatus;
  • a cleaning device for cleaning a lower surface of the semiconductor package in a state of being vacuum-adsorbed by the unit picker;
  • an adsorption plate for adsorbing the semiconductor package delivered by the unit picker after being washed in the washing apparatus, wherein the adsorption plate moves along the X axis direction or the Y axis direction on the XY plane, and the Y on the XY plane.
  • a drying device rotatable about an axis;
  • a first vision unit disposed in a suction plate moving path of the drying apparatus and inspecting the semiconductor package while moving in a vertical direction in an XY plane with respect to the moving direction of the suction plate;
  • An alignment table picker configured to pick up the semiconductor package adsorbed on the adsorption plate and move in an X or Y axis direction;
  • a loading groove for loading the semiconductor package adsorbed on the adsorption plate, and a non-loading portion in which the semiconductor package is not loaded is formed symmetrically with the first loading portion and the first loading portion formed to cross along the X-axis and Y-axis directions;
  • An alignment table having a second stacking portion and movable along the Y-axis direction;
  • a second vision unit inspecting a semiconductor package loaded in a stacking groove of the alignment table;
  • a sorting apparatus for transferring the semiconductor package in the X-axis direction according to the inspection results of the semiconductor package, and class
  • the adsorption plate of the drying apparatus is adsorbed on the adsorption plate in a state that rotated 180 ° with respect to the Y axis on the XY plane, the drying is completed
  • the semiconductor package is loaded into the loading groove of the alignment table through relative movement in the Z-axis direction, and the rotation function of the drying apparatus is not performed, the semiconductor package is adsorbed on the adsorption plate and the drying is completed.
  • the picker may be picked up by a table picker and placed in a loading groove of the alignment table.
  • the drying apparatus may be used for simple drying, or may be rotated as necessary, and thus may be used for vision inspection and flipping.
  • the process of the ball-up method and the ball-down method can be performed by a simple change of the component, so that one device can be operated by converting the semiconductor strip into various types or operating as needed. It has an effect.
  • the structure may be partially changed so that the air pressure applied by the pneumatic line is uniformly and efficiently concentrated, and may be used on the upper and lower surfaces of the adsorption plate of the drying apparatus.
  • the flipping function may be performed by rotating the drying apparatus while the semiconductor package is adsorbed to transfer the semiconductor package into the loading groove of the alignment table, thereby inverting and loading the upper and lower surfaces of the semiconductor package.
  • the semiconductor strip cutting device by simply mounting the alignment table picker in the ball-down strip cutting device is supplied with the ball-up semiconductor strip and the ball-down semiconductor package is carried out You can switch from ball down type to ball up type.
  • the mounting position of the drive means of the suction plate capable of rotational and linear transfer is configured to be different from the mounting position of the drive means of the alignment table picker and the drive means of the tray picker. Interference between means can be prevented.
  • the drying apparatus is provided to be movable, since the semiconductor package is dried during the movement, a separate time for the drying operation is unnecessary, so that the process time can be shortened.
  • the dried semiconductor package can be loaded on the alignment table by inverting the upper and lower surfaces by the rotation operation of the adsorption plate, an additional process for inverting the upper and lower surfaces of the semiconductor package is unnecessary, and the semiconductor package can be controlled to rotate while being moved. The time taken to invert the top and bottom of the package can be shortened.
  • the mold surface, the ball surface or the lead surface inspection of the semiconductor package, or the alignment inspection of the tray may be performed with the first vision unit, various inspections may be performed with one vision unit.
  • the first vision unit can be inspected while moving in the vertical direction, inspection can be performed by selectively moving the vision position in accordance with the specification change of the semiconductor strip or package, thereby improving the overall package processing speed per unit time of the equipment. It can be effected.
  • FIG. 1 shows a plan view of one embodiment of a semiconductor strip cutting device according to the invention.
  • FIG. 2 illustrates a process of assembling a drying apparatus of a semiconductor strip cutting apparatus according to the present invention to a semiconductor package inspection unit.
  • FIG. 3 shows a state in which the drying apparatus of the semiconductor strip cutting apparatus according to the present invention is mounted and operated in the semiconductor package inspection unit.
  • Figure 4 shows a plan view of another embodiment of a semiconductor strip cutting device according to the present invention.
  • FIG. 5 illustrates a drying apparatus and an alignment table picker provided in the semiconductor package inspection unit of the semiconductor strip cutting device according to the present invention.
  • Figure 6 shows a plan view of another embodiment of a semiconductor strip cutting device in accordance with the present invention.
  • FIG. 7 shows an example of an adsorption plate of the semiconductor strip cutting device according to the present invention.
  • FIG. 8 shows another example of an adsorption plate of the semiconductor strip cutting device according to the present invention.
  • the semiconductor strip cutting apparatus 1000 may be generally classified into a ball down type or a ball up type according to a form in which a semiconductor package, which is inspected and taken out, is loaded on a tray. As a result, there may be a difference in a later process or strip storage, and thus, the semiconductor package may be loaded in a ball-up state or a ball-down state in a tray. In addition, although there may be a difference between whether the supplied semiconductor strip is supplied in the ball-up state or the ball-down state, the following description will be made on the assumption that the semiconductor strip to be cut is supplied in the ball-up state.
  • the semiconductor strip cutting apparatus 1000 includes an onloader unit 100 provided with a semiconductor strip inserted into a magazine, and the semiconductor strip S from the magazine M to the onloader unit 100.
  • a strip picker 230 which vacuum-adsorbs the semiconductor strip S seated on the back plate and transfers it to the chuck table with the mold surface of the semiconductor strip facing downward, and the semiconductor strip supplied by the strip picker 230.
  • the unit picker 270 and the unit picker 270 which vacuum-adsorb all of the plurality of semiconductor packages of which the chuck has been completed at one time and transfer the vacuum-adsorbed semiconductor package to the drying apparatus through the cleaning apparatus 280.
  • the cleaning device 280 for cleaning the lower surface of the semiconductor package in the adsorbed state, the adsorption plate 310 for adsorbing the semiconductor package delivered by the unit picker 270 after being washed in the cleaning device 280 It includes, the adsorption plate 310 is movable in the X-axis direction or the Y-axis direction on the XY plane, the drying apparatus 300 that can be rotated as needed or storage method of the semiconductor package based on the Y axis on the XY plane ), The adsorption plate 310 of the drying apparatus 300 is disposed in the movement path, and moves in the vertical direction in the XY plane with respect to the movement direction of the adsorption plate 310.
  • the first vision unit 410 for inspecting the semiconductor package, the loading grooves 431a and 431b for loading the semiconductor package, and the non-loading portion in which the semiconductor package is not stacked are alternately formed along the X-axis and Y-axis directions.
  • the first and second alignment tables 430a and 430a may be independently transferred to each other along the Y-axis direction after the semiconductor packages adsorbed on the adsorption plate 310 are transferred to and loaded in the loading grooves 431a and 431b.
  • the semiconductor package may include a sorting apparatus 500 that transfers and sorts the semiconductor package in the X-axis direction.
  • the cutting target semiconductor strip may be supplied from the onloader unit 100.
  • the cutting target semiconductor strip s may be a long rectangular material in which a plurality of semiconductor packages are arranged in a matrix form along the X-axis and Y-axis directions, and the cutting device 200 may have a length direction and an X-axis direction parallel to each other. Can be supplied.
  • a plurality of cutting target semiconductor strips may be mounted and supplied to the on-loader unit 100, and the pusher 110 of the on-loader unit 100 sequentially cuts the semiconductor strips into the cutting device ( Propelled toward the side 200, the semiconductor strip propulsed in the X-axis direction enters into the inlet rail 210 of the cutting device 200 provided to guide the semiconductor strip, and pulls the entered semiconductor strip in the X-axis direction.
  • the drawer 220 may grip the tip of the semiconductor strip to transfer the strip picker 230 to a position where the cutting target semiconductor strip may be picked up.
  • the strip picker 230 may be mounted on a guide frame 240 installed in the X-axis direction provided with a driving means to transfer the strip in the X-axis direction.
  • the strip picker 230 picking up the semiconductor strip to be cut carries the semiconductor strip to the chuck table 250.
  • the chuck table 250 may be configured to be movable to any position on the XY plane and to be rotatable about a Z axis, and the semiconductor strip adsorbed to the chuck table 250 may include at least one cutter 260. Can be cut into individual semiconductor packages. In the embodiment shown in FIG. 1, the cutter 260 shows an example in which two cutting blades are provided. In addition, although the chuck table 250 is illustrated as one in FIG. 1 and the embodiment of the present invention, two or more chuck tables 250 may be provided to improve work unit per hour (UPH).
  • UHP work unit per hour
  • the semiconductor strip adsorbed to the chuck table 250 may be cut into individual semiconductor packages while the cutter 260 is relatively displaced from the chuck table 250, and the plurality of semiconductor packages that have been cut may be a unit picker ( 270 may be picked up and transported at a time.
  • the unit picker 270 may vacuum pick up a plurality of semiconductor packages at once and transfer them to the washing apparatus 280 and the drying apparatus 300 to be described later, and perform the washing process and the drying process.
  • the washing apparatus 280 may be provided with a plurality of injection holes 281 for spraying the washing liquid or compressed air.
  • the injection holes 281 may be provided in plural in the width direction of the unit picker 270.
  • the plurality of semiconductor packages picked up by the unit picker 270 and washed by the washing apparatus 280 may be adsorbed onto the drying apparatus 300 constituting the semiconductor package inspecting unit 400.
  • a ball down type (defined as 'a ball or lead face facing downward, a mold face facing upward') or a ball up Type ('ball or lead face facing upward, mold face facing downward'), and the semiconductor strip to be cut may be supplied in a ball up state or a ball down state.
  • 1 and 5 assume that the cutting target semiconductor strip is supplied in a ball-up state for convenience of description.
  • the semiconductor strips supplied in the ball-up state are cut, cleaned, dried and inspected and taken out
  • the semiconductor strips are cut, cleaned, dried, inspected and taken out in order to be taken out in the ball-down state. This means that the package must be flipped (rotated) at least once 180 °.
  • FIG. 1 specifically illustrates a semiconductor strip cutting apparatus 1000 for carrying out a semiconductor package to a ball down state after receiving a semiconductor strip in a ball up state.
  • the semiconductor strip cutting apparatus 1000 according to the present invention shown in FIG. 1 does not have a separate flipper, and flips the semiconductor package using a drying apparatus 300 for drying the cleaned semiconductor package.
  • the adsorption plate 310 constituting the drying apparatus 300 is rotated by 180 ° based on the Y axis on the XY plane, the adsorption plate 310 is adsorbed on the adsorption plate 310 to complete the drying of the semiconductor package with respect to the Z axis direction.
  • the upper and lower surfaces of the semiconductor package may be inverted by being transferred to the loading groove of the first or second alignment table through relative motion.
  • the drying apparatus 300 may perform a drying process by embedding a hot wire, and the semiconductor strip cutting apparatus 1000 according to the present invention may further include a flipping function and a transfer function in the drying apparatus 300. .
  • the semiconductor package inspecting unit 400 includes a drying apparatus 300 having a heater (not shown) for drying the cleaned semiconductor package, and the semiconductor package cut by the cutting apparatus 200 may include the unit picker ( 270 is transferred to the drying apparatus 300.
  • the semiconductor package transferred to the drying apparatus 300 may be dried by an electrothermal heater or the like provided in the drying apparatus 300.
  • the semiconductor package inspecting unit 400 may perform semiconductor package inspection by capturing an upper surface (mold surface) and a lower surface (ball surface or lead surface) of the cut and cleaned semiconductor package.
  • the semiconductor package upper surface inspection for inspecting the upper surface of the semiconductor package may be a marking inspection on the semiconductor package molding material, and the lower surface inspection of the semiconductor package may be an inspection for determining defects such as gaps or shorts of balls or leads of the semiconductor package. .
  • the cut, cleaned and dried semiconductor packages may be inspected from an upper surface and a lower surface through an image captured by the vision unit, respectively.
  • the semiconductor package inspection unit 400 constituting the semiconductor strip cutting apparatus 1000 according to the present invention, wherein the upper and lower surfaces of the semiconductor package are photographed and inspected to inspect the semiconductor package in which the cutting process, the cleaning process, and the drying process are completed.
  • the first vision unit 410 is provided to be transportable in the Y-axis direction from the semiconductor package inspecting unit 400, and the second vision unit 420 is the semiconductor package inspecting unit. 400 may be provided to be transportable in the X-axis direction.
  • Each vision unit may be mounted to a vision driving means disposed in the X-axis or Y-axis direction, respectively, so that a specific vision unit can be transported in the X-axis or Y-axis direction.
  • the semiconductor package adsorbed on the drying apparatus 300 or the like is disposed on the XY plane, when the first and second vision units are provided to be transportable in the Y-axis (X-axis) direction, the semiconductor package to be picked up is picked up or Drying apparatus 300 or the alignment table to be adsorbed may be provided to be transported in the X-axis (Y-axis) direction.
  • the semiconductor package inspection unit 400 of the semiconductor strip cutting apparatus 1000 according to the present invention may be provided with at least one alignment table that can be transferred in parallel in the Y-axis direction and can be rotated about the Z-axis.
  • the semiconductor package absorbed by the drying apparatus 300 and the image pickup upward is completed is transferred to the alignment table and loaded, and the second vision unit 420 is loaded on the alignment table. Can be imaged downward.
  • the semiconductor package is not subjected to the flipping (rotation) process during cutting, cleaning, drying, and imaging, it is not possible to change the stacking method (ball-up stacking method or ball-down stacking method) of the cut semiconductor package.
  • the embodiment shown in FIG. 1 is transferred by the unit picker 270 and the semiconductor package adsorbed on the adsorption part of the drying apparatus 300 is flipped and rotated in the X-axis direction by the rotation of the drying apparatus. Loading into the sorting table can be used.
  • the first and second adsorption parts for adsorbing the semiconductor package are respectively provided on the upper and lower surfaces of the adsorption plate 310 constituting the drying apparatus 300, and the semiconductor package transferred by the unit picker 270 is
  • the first adsorption unit and the second adsorption unit may be sequentially distributed and adsorbed.
  • the unit picker 270 includes first and second suction ports alternately disposed with each other, a first pneumatic line communicating with the first suction ports, And a second pneumatic line communicating with the second suction ports and separated from the first pneumatic line, and vacuum means for selectively applying a vacuum pressure (suction pressure or negative pressure) to the first pneumatic line and the second pneumatic line. can do.
  • a vacuum pressure suction pressure or negative pressure
  • the unit picker may specifically have the structure of the adsorption plate shown in FIG. 8 (d). The description of the unit picker is deferred later.
  • Some of the semiconductor packages picked up by the unit picker 270 are adsorbed to the first adsorption unit disposed upward of the drying apparatus 300, and the other of the semiconductor packages picked up by the unit picker 270 is dried. After the device 300 is rotated, it may be adsorbed onto the second adsorption unit disposed upward.
  • the drying apparatus 300 is installed to be movable along one direction axis, the moving frame 320 is rotatably coupled to the suction plate 310, the suction plate 310 is installed in the suction port of the suction plate Heat is applied to the semiconductor package adsorbed on the substrate and blows a gas to the semiconductor package adsorbed on the adsorption plate and to the upper surface or the side surface of the adsorption plate 310 or the semiconductor package. It may include a blower (not shown) to remove the water present.
  • a blower (not shown) for removing the moisture of the semiconductor package adsorbed on the upper and lower surfaces of the adsorption plate 310 to minimize the drying time It may be provided on the top and / or bottom of 300).
  • the blower may be provided at any one or both of the upper and lower portions of the drying apparatus 300, but the drying apparatus is not rotated. If the blower, the blower may be provided only on the surface (upper portion) on which the semiconductor package is adsorbed.
  • a method of sequentially distributing a plurality of semiconductor packages transferred by the unit picker 270 by distributing the first and second adsorption units of the adsorption plate 310 will be described later.
  • the semiconductor package is mounted on the drying apparatus 300 and is then flipped so that one surface of the upper and lower surfaces is captured by the first vision unit 410, and the second vision unit 420 is mounted on the alignment table. As a result, the other surface of the upper and lower surfaces can be imaged.
  • the first vision unit 410 captures the ball surface or the lead surface of the semiconductor package.
  • the ball surface is sucked downward so that it is loaded in the ball-down state. Therefore, the mold surface of the semiconductor package can be inspected by the second vision unit 420 in the state of being loaded on the alignment table.
  • the embodiment shown in Figure 1 is provided with the semiconductor strip supplied from the on-loader unit 100 in the ball-up state, the alignment table in the ball-down state by the drying apparatus 300 of the semiconductor package inspection unit 400 Since it is loaded on the loading tray to be described later may be a ball-down state.
  • the semiconductor strip cutting apparatus 1000 illustrated in FIG. 1 may be referred to as a ball down type semiconductor strip cutting apparatus 1000 which cuts a semiconductor strip in a ball-up form and takes it out in a ball-down form.
  • the semiconductor package inspection unit 400 of the semiconductor strip cutting apparatus 1000 according to the present invention illustrated in FIG. 1 includes a first alignment table 430a and a second alignment table 430b, respectively.
  • the second stacking area even after the semiconductor package is loaded in the first stacking area. Since the subsequent processes (inspection by the second vision unit, loading into the tray) cannot be performed until the remaining semiconductor packages are loaded in the tray, two alignment tables are provided to improve the unit per hour (UPH) of the equipment. Each can be driven independently.
  • the upper and lower surfaces of the adsorption plate 310 of the drying apparatus 300 is provided with an adsorption unit (first adsorption unit, the second adsorption unit formed to face each other), the unit picker
  • the semiconductor package picked up by 270 is distributed and adsorbed to the first adsorption unit and the second adsorption unit, and the adsorption plate 310 is rotated so that the semiconductor package adsorbed to the first adsorption unit is rotated by the first alignment table 430a.
  • the semiconductor package loaded on the alignment table of any one of the second alignment table 430b and adsorbed to the second adsorption unit to the other alignment table of the first alignment table 430a and the second alignment table 430b. Can be loaded.
  • the plurality of semiconductor packages picked up by the unit picker 270 after cutting according to the above configuration, respectively, have the first adsorption part and the second adsorption part of the adsorption plate 310 constituting the drying apparatus 300 upward. Distributing the semiconductor package when in position, and supplying the semiconductor package onto the first alignment table 430a and the second alignment table 430b, respectively, with the first and second adsorption portions rotated downward, respectively. do.
  • the transport trajectory may have a constant height difference, and the Z-axis direction may be changed in the process of transferring the semiconductor package.
  • a method in which the alignment table is lifted and the semiconductor package is transferred may be used.
  • the first vision unit 410 is each adsorption in a state in which the first and second adsorption portions of the adsorption plate 310 constituting the drying apparatus 300 are rotated downward, respectively.
  • One surface of an upper surface and a lower surface of the semiconductor package adsorbed to the unit may be photographed.
  • the first vision unit 410 since the semiconductor package is supplied in a ball-up state, the first vision unit 410 may include the first adsorption unit and the first unit.
  • suction part can be imaged.
  • the semiconductor package inspecting unit 400 may move the first alignment table 430a and the second alignment table 430b that may be moved in parallel in the Y-axis direction and that may be rotated about the Z-axis. Equipped.
  • Each of the first alignment table 430a and the second alignment table 430b is connected to the first alignment table driving means 610 and the second alignment table driving means 620 installed in the Y-axis direction so as to enable the Y-axis transfer. Can be mounted.
  • the first alignment table driving means 610 and the second alignment table driving means 620 mounted on the first alignment table 430a and the second alignment table 430b capable of independent transfer in the Y-axis direction.
  • the upper surface (mold surface) of the semiconductor package may be captured by the second vision unit 420 mounted on the vision driving means 425 disposed in the X-axis direction.
  • the semiconductor package inspecting unit 400 of the semiconductor strip cutting apparatus 1000 illustrated in FIG. 1 is one in which the semiconductor package that has been cleaned is picked up through the adsorption plate 310 having the first adsorption unit and the second adsorption unit facing each other. After the semiconductor package is sequentially supplied to the adsorption unit rotated upward from the unit picker 270 to be mounted and adsorbed, the adsorption plate 310 is rotated and the adsorption unit rotates downward, so that the first vision unit ( After the lower surface (a ball surface or the lead surface) of the semiconductor package is imaged by the 410, the upper surface (mold surface) of the semiconductor package is imaged by the second vision unit 420 and mounted on the alignment table, thereby drying the semiconductor package. The process and inspection process can be completed.
  • the semiconductor packages loaded on the first alignment table 430a and the second alignment table 430b captured by the second vision unit 420 may be provided to be transported in the X-axis direction according to the result of the inspection result. It may be picked up by a pair of sorting picker (560, 580) to be taken out to the export tray (510 or 530) constituting the sorting device (500).
  • the sorting apparatus 500 individually picks up the semiconductor packages loaded on the first sorting table 430a or the second sorting table 430b, and sorts and transfers them in sequence according to the test results.
  • a picker and the semiconductor package picked up by the sorting picker may include a plurality of loading grooves for sorting and accommodating the semiconductor package according to the test results, and may include a transport tray that can be transported in one direction.
  • the semiconductor packages loaded on the first alignment table 430a and the second alignment table 430b are picked up by the sorting picker, and one surface of the semiconductor package is inspected by the first vision unit. According to the export tray.
  • the semiconductor package or inspection jig is loaded in at least two of the loading grooves of the tray, and the first pick-up unit (eg, the picking picker picks up each of the semiconductor packages or the inspection jig).
  • the first pick-up unit eg, the picking picker picks up each of the semiconductor packages or the inspection jig.
  • the 3-point inspection is more efficient to determine the alignment of the tray by placing the semiconductor package or inspection jig in three loading grooves of four corners of the tray and picking them up with the picking picker. .
  • the exact position value of the tray can be obtained through the information of the know tray, the number of the grooves, and the pitch information.
  • Each of the picking pickers 560 and 580 may be provided with a plurality of pickup units 561 and 581 side by side in the X-axis direction so that a plurality of semiconductor packages may be picked up together.
  • the plurality of pickup units 561 and 581 may be configured to enable independent driving, respectively.
  • first sorting pickers 560 and a second sorting picker 580 may be provided to be transported in parallel.
  • Each of the first sorting picker 560 and the second sorting picker 580 may be mounted to the first sorting picker driving means 650 and the second sorting picker driving means 660 so as to be transportable in the X-axis direction, respectively. .
  • the length direction of the alignment tables 430a and 430b is in the Y-axis direction. Since each picking picker is provided with a plurality of pick-up units side by side in the X-axis direction, the sorting table (before the pick-up of the semiconductor packages mounted on the sorting tables 430a and 430b by the sorting pickers 560 and 580). 430a and 430b may be rotated such that the longitudinal direction is in the X-axis direction. In this manner, the area occupied by the semiconductor strip cutting apparatus 1000 may be minimized.
  • the semiconductor strip cutting apparatus 1000 illustrated in FIG. 1 may take out a semiconductor strip supplied in a ball-up state into a semiconductor package in a ball-down state after cutting, washing, drying, imaging, and inspecting.
  • the sorting apparatus 500 may be provided with a first carrying out tray 510 and a second carrying out tray 530 for accommodating good and bad semiconductors, respectively.
  • the first export tray 510 and the second export tray 530 may be provided for loading and unloading the good semiconductor and the defective semiconductor, respectively.
  • a tray picker 570 for supplying a tray may be provided.
  • FIG. 2 illustrates a process of assembling the drying apparatus 300 of the semiconductor strip cutting apparatus 1000 according to the present invention to the semiconductor package inspection unit 400
  • FIG. 3 illustrates a semiconductor strip cutting apparatus 1000 according to the present invention.
  • the drying apparatus 300 is mounted on the semiconductor package inspection unit 400 and operates.
  • the sorting apparatus 500 of the semiconductor strip cutting apparatus 1000 according to the present invention shown in FIG. 1 may include a tray picker 570 for transporting a tray on which a good semiconductor is loaded or a tray on which a defective semiconductor is loaded.
  • the tray picker 570 may be transferred in the X-axis direction by the tray picker driving means 575 provided on the guide frame.
  • the tray picker 570 and the drying apparatus 300 are both transferred in the X-axis direction, but each is independently driven.
  • each driving means is preferably provided at different positions and different heights.
  • the drying apparatus 300 may have a rotation function and a transfer function of the adsorption plate 310.
  • the adsorption plate 310 has a structure capable of reciprocating movement in the X-axis direction by the plate driving means 330 provided on one side of the drying apparatus 300.
  • the plate driving means 330 may include a motor (not shown), a ball screw 331, a ball screw nut 333, and the like, but the driving means is not limited thereto.
  • one side of the drying apparatus 300 is provided with a first conveying rail 360
  • the plate driving means 330 provided on the other side of the drying apparatus 300 is accommodated in the second conveying rail 340 It can guide the driving and conveying process.
  • the first conveyance rail 360 may be mounted on the lower portion of the guide frame 670 via a mounting member 370 or the like.
  • the reason why the first transfer rail 360 is mounted below the guide frame 670 is that the guide frame 670 has a tray picker driving means 575 for driving the tray picker 570 as described above. Since it is mounted and configured to guide the transfer of the tray picker 570, the alignment table picker 460 (see Fig. 4) that can be added in the semiconductor strip cutting device 1000 of the ball-up type to be described later to minimize the possibility of interference between parts and This is to prevent interference with the driving means. This will be described in detail later.
  • the drying apparatus 300 is capable of reciprocating in the X-axis direction by the plate driving means 330, it is provided with a rotary drive unit 350 can be rotated during the movement.
  • the drying apparatus 300 may include a moving frame 320 rotatably supporting the adsorption plate 310, and the rotation driving unit 350 may be provided at one side of the moving frame 320 to perform the drying.
  • the adsorption plate 310 may be rotated independently of the X-axis transfer process of the apparatus 300.
  • the adsorption plate 310 may be rotated in the process of transferring the semiconductor package to each alignment table while being transferred in the X-axis direction.
  • FIG 4 is a plan view of another embodiment of a semiconductor strip cutting device 1000 according to the present invention
  • Figure 5 is a drying device constituting a semiconductor package inspection unit 400 of the semiconductor strip cutting device 1000 shown in FIG.
  • a perspective view of 300 and alignment table picker 460 are shown. Descriptions duplicated with those described with reference to FIGS. 1 through 3 will be omitted.
  • FIG. 1 illustrates a semiconductor strip cutting apparatus 1000 in which a semiconductor package in a ball-up state is supplied, cut, washed, dried, and image-checked, and then the semiconductor package is taken out in a ball-down state.
  • the process may be performed in a manner that the semiconductor strip is cut at least once after being cut into individual semiconductor packages.
  • the embodiment shown in FIG. 4 shows a semiconductor strip cutting device 1000 in a manner in which no flipping is performed. Therefore, the semiconductor package in the ball up state (or ball down state) may be supplied and the semiconductor package in the ball up state (or ball down state) may be carried out after the cutting process is performed.
  • the drying apparatus 300 of the semiconductor strip cutting apparatus 1000 illustrated in FIG. 4 does not need a flipping function, the semiconductor package transferred by the unit picker 270 may have an adsorption plate ( Adsorption to 310 may be carried out a drying process.
  • the top and bottom inspections of the dried semiconductor package should be performed.
  • the semiconductor strip cutting apparatus 1000 illustrated in FIG. 4 may be provided with a separate alignment table picker 460 for transferring the semiconductor package to the alignment tables 430a and 430b.
  • the alignment table picker 460 is provided to be movable along the X-axis direction, and picks up the semiconductor package adsorbed on the adsorption plate 310 of the drying apparatus to the first alignment table 430a or the second alignment table ( The alignment table picker 460 picks up the entire semiconductor package adsorbed on the adsorption plate 310 at one time or two times, respectively, in the stacking grooves 431a and 431b of 430b.
  • the first alignment table 430a and the second alignment table 430b may be configured to be sequentially loaded two times.
  • the alignment table picker 460 or the suction plate 310 may include first and second suction ports disposed alternately with each other, a first communication line communicating with the first suction ports, and the second suction ports. It may include a second communication line in communication with the first communication line and the vacuum means for selectively applying a vacuum pressure to the first communication line and the second communication line.
  • each communication line may be understood to mean a flow path connecting the respective suction ports in the distribution flow path (see 314 in FIG. 8) of the distribution member (see 313 in FIG. 8).
  • the semiconductor packages are adsorbed only on one surface (for example, the upper surface) of the adsorption plate 310, the other surface (for example, the lower surface) of the adsorption plate 310 is minimized to minimize pneumatic loss.
  • a fastening member 317 ' such as a shielding member 317 or a bolt as shown in, such that the pneumatic pressure applied from both pneumatic flow path may be applied only to the distribution flow path side of the upper side of the adsorption member.
  • the vacuum means provided to apply air pressure to each inlet side applies a vacuum pressure through the first pneumatic line, and the pneumatic pressure distributed from the first dispensing member causes the first communication line communicating with the inlet to be evacuated.
  • a vacuum pressure may be selectively applied to the first inlets or the second inlets as needed.
  • the alignment table picker 460 or the adsorption plate 310 may have a structure of the adsorption plate specifically illustrated in FIG. 8 (d).
  • the semiconductor package inspection unit 400 of the semiconductor strip cutting apparatus 1000 according to the present invention illustrated in FIG. 4 includes at least one alignment table provided to be transportable in the Y-axis direction and the semiconductor package dried by the drying apparatus 300. And an alignment table picker 460 for picking up and transferring the pick-up to the alignment table, wherein the semiconductor package picked up by the alignment table picker 460 is formed on the top or bottom surface of the semiconductor package by the first vision unit 410. After the image is captured, it may be loaded onto the alignment table 430a or 430b.
  • the dried semiconductor package is transferred in order to perform both top and bottom inspections of the semiconductor package.
  • An inspection of the top or bottom surface of the semiconductor package may be performed by the first vision unit 410.
  • the semiconductor package absorbed in the ball-up state by the drying apparatus 300 is picked up by the alignment table picker 460.
  • the mold surface of the package is inspected by the first vision unit 410, and the inspected semiconductor package is transferred into a loading groove of the first alignment table 430a or the second alignment table 430b to provide the second vision.
  • the unit 420 may inspect the ball surface or the lead surface of the semiconductor package loaded on the first alignment table 430a or the second alignment table 430b.
  • the semiconductor adsorbed to the adsorption plate 310 using the first vision unit 410 in a state where the adsorption plate 310 of the drying apparatus 300 is rotated 180 ° about the Y axis on the XY plane. Inspect the ball or lead surface of the package, rotate the adsorption plate 310 by 180 ° about the Y axis on the XY plane, and then pick up the inspected semiconductor package to the alignment table picker 460 and pick it up. In this state, the mold surface of the semiconductor package may be inspected with the first vision unit.
  • the drying apparatus since the drying apparatus performs only the drying function without flipping the semiconductor package, the semiconductor package is loaded in the final tray in the ball-up state.
  • a separate alignment table picker 460 is provided.
  • the alignment table picker 460 may be provided to be movable in the X-axis direction to transfer the semiconductor package to the first alignment table 430a and the second alignment table 430b, respectively.
  • the alignment table picker 460 is detachably coupled to the guide frame 670 installed along one direction axis and the guide frame 670 to align the table picker driving means 465 for moving the alignment table picker 460.
  • One side of the drying apparatus is connected to the first conveying rail 360 fastened to the lower portion of the guide frame 670, the other side of the drying apparatus 300 to the second conveying rail (340) It is connected to the alignment table picker driving means 465 and the plate driving means 330 may not cause interference or collision.
  • the alignment table picker driving means 465 for driving the alignment table picker 460 in the X-axis direction is mounted on a guide frame 670 on which the tray picker driving means 575 for driving the tray picker 570 is mounted. Can be mounted.
  • a method of mounting a ball screw and a motor on the guide frame 670 may be used.
  • the alignment table picker 460 transfers the semiconductor package from the adsorption plate 310 to the first alignment table 430a and the second alignment table 430b, so that the transfer range is equal to the transfer range of the tray picker 570. Since the alignment table picker driving means 465 and the tray picker driving means 575 are mounted on one guide frame 670 for each section, the alignment table picker 460 and the tray picker 570 may be driven independently. Can be.
  • the semiconductor strip cutting apparatus 1000 for supplying the semiconductor strip in the ball-up state and transporting the semiconductor package in the ball-down state is supplied with the semiconductor strip in the ball-up state and the semiconductor package in the ball-up state.
  • the alignment table picker 460 (and its driving means) is mounted on the guide frame 670, and the drying device 300 is for simple drying. Can be used as
  • the alignment table picker 460 may be detached or separated. If not, the semiconductor strip cutting apparatus 1000 may be used as a ball-down type in which a semiconductor strip in a ball-up state is cut into individual semiconductor packages and then discharged in a ball-down state.
  • the plate driving means 330 which is a driving means of the drying apparatus, is disposed at the front end of the equipment, and the alignment table picker driving means 465 is provided in the guide frame 670 to dry the drying apparatus 300.
  • the alignment table picker 460 Does not cause interference between the alignment table picker 460 and the type of semiconductor strip cutting device, there is no need to go through a cumbersome replacement operation such as detachment or detachment of a specific part.
  • the driving means of the alignment table picker 460 is not provided on the guide frame 670, but may be provided on the upper or upper side of the equipment.
  • the drying apparatus 300 may be disposed at the lower end of the alignment table picker 460 so that the drying apparatus 300 and the alignment table picker 460 may be driven without interfering with each other.
  • FIG. 6 shows a top view of another embodiment of a semiconductor strip cutting device 1000 according to the present invention. Descriptions duplicated with those described with reference to FIGS. 1 through 5 will be omitted.
  • An upper surface or a lower surface of the semiconductor package mounted on one of the first adsorption unit and the second adsorption unit of the drying apparatus 300 is rotated so that the adsorption unit faces downward. 410 may be imaged and inspected.
  • the plurality of semiconductor packages picked up and cleaned by the unit picker 270 may include a first adsorption unit and a first adsorption unit of the adsorption plate 310. 2 is distributed and mounted to the adsorption unit, and the upper and lower surfaces of the semiconductor package are inspected by the first vision unit 410 together with the drying process in the adsorption plate 310, and then the alignment table picker 460
  • the semiconductor packages mounted on the first adsorption part and the second adsorption part of the adsorption plate 310 are transferred to the first alignment table 430a and the second alignment table 430b, respectively, and the first sorting picker 560 and the first sorting picker 560 2
  • the semiconductor package mounted on the first alignment table 430a and the second alignment table 430b is picked up by the sorting picker 580 and then the first vision unit 410 is used to pick up the semiconductor package. Bottom of semiconductor package picked up by Alternatively, the upper surface can be picked up and
  • the mold surface is adsorbed and placed in the ball-up state after being cut in the ball-up state.
  • a sufficient drying time is ensured, and flipping again, the ball surface inspection of the remaining semiconductor package is performed.
  • the unit picker 270 mounts a part of the semiconductor package on the first adsorption part of the adsorption plate 310, and mounts the remaining semiconductor package on the second adsorption part of the flipped adsorption plate 310.
  • the semiconductor package mounted on the first adsorption part is capable of imaging the ball surface with the first vision unit 410 while ensuring sufficient drying time
  • the second package is flipped again. While photographing the ball surface with the first vision unit 410 with respect to the remaining semiconductor package mounted on the adsorption unit, the remaining semiconductor package may be dried. While imaging the ball surface of the semiconductor package adsorbed on the second adsorption unit, the semiconductor packages adsorbed on the first adsorption unit are picked up by the alignment table picker 460 to the first alignment table 430a or the second alignment table 430b. Can be transferred.
  • the first vision unit 410 which is provided to be transported in the Y-axis direction is provided to be transported to the working area of the picking picker (560, 580) to inspect the bottom surface of the semiconductor package picked up by the picking picker (ball Inspection or lead inspection), the upper surface inspection (molding inspection or marking inspection) or the three-point alignment inspection of the tray by the sorting picker may be performed through the first vision unit 410.
  • the three-point alignment inspection of the tray by the picking picker loads a package-shaped jig (or package) at least three points in the stacking groove (preferably the corner) of the tray, and then the picking picker picks up the jig.
  • the first vision unit 410 is moved to where the image is taken.
  • the three point alignment inspection of the tray is not necessarily limited to three points, and the inspection area is not limited to the corner point.
  • the moving range of the driving means 415 provided to move the first vision unit 410 in the Y-axis direction is the moving range of the X-axis direction of the sorting picker 560 or 580 or the alignment table picker 460. It is desirable to secure enough to cross.
  • the Y-axis movement range of the first vision unit 410 should have an intersection point on the X-axis movement range of the sorting picker 560 and 580 or the alignment table picker 460 on the XY plane. It means that the effect can be obtained.
  • the Y-axis movement range of the first vision unit 410 is shown in FIGS.
  • the semiconductor strip cutting device according to the present invention shown in 6 it is preferable to set the moving range so that a plurality of crossing points on the X-axis movement range and a plurality of intersection points exist on the XY plane, respectively.
  • the inspection of the first vision unit 410 in the state of picking up the package is performed not only by the sorting picker 560 and 580 in the process of loading the semiconductor package into the tray, but also the alignment table picker 460. ) May be all performed in the process of being transferred to load the semiconductor package into the alignment table.
  • the sorting pickers 560 and 580 are illustrated as being provided with two, but the number may be increased or decreased.
  • the embodiment shown in FIG. 6 may perform both top and bottom inspections of the semiconductor package without using the second vision unit 420.
  • the top or bottom surface of the semiconductor package may be inspected using the first vision unit 410 to minimize waste of process time. Since the plurality of pickup units provided in the sorting pickers 560 and 580 may be driven independently, the first vision unit 410 may be used again in the picked-up state by the sorting pickers 560 and 580. The lower or upper surface of the semiconductor package may be inspected, and the semiconductor packages may be classified and loaded into the export trays 510 and 530 immediately according to the inspection result.
  • FIG. 7 illustrates a suction plate 310 provided in the semiconductor package inspection unit 400 of the semiconductor strip cutting apparatus 1000 according to the present invention.
  • FIG. 7 (a) shows a cross-sectional view of the adsorption plate 310 of the semiconductor strip cutting device 1000 shown in FIG. 1 or 6, and
  • FIG. 7 (b) shows the adsorption shown in FIG. 7 (a).
  • a plan view of one adsorption member 311a constituting the plate 310 is shown
  • FIG. 7C shows another adsorption member 311b constituting the adsorption plate 310 illustrated in FIG. 7A.
  • a top view of the is shown.
  • the suction plate 310 illustrated in FIG. 7 has a base member 315 at a central portion thereof, a distribution member for distributing air pressure outside the base member 315, and air pressure distributed by the distribution member outside the distribution member. And it may be configured to include a suction member (311a, 311b) having a plurality of suction ports.
  • the adsorption plate 310 of the embodiment illustrated in FIG. 1 or 6 supplies a portion of the plurality of semiconductor packages that have been picked up by the unit picker 270 and cleaned to the first adsorption unit 311as, which is an adsorption surface of the semiconductor package. Then, the adsorption plate 310 is rotated to supply the remaining semiconductor package to the second adsorption part 311bs, which is an adsorption surface of the semiconductor package.
  • the suction plate 310 is a base member having a first pneumatic line (3153a) and a second pneumatic line (3153b) for selectively applying the air pressure to the upper and lower surfaces of the suction plate 310 ( 315a, a first distribution member 313a in communication with the upper surface of the suction plate 310 and having a distribution passage 314a in communication with the first pneumatic line 3315a of the base member 315 for distributing pneumatic pressure. And a second distribution member 313b communicating with a lower surface of the suction plate 310 and having a distribution passage 314b communicating with the second pneumatic line 3153b of the base member to distribute the pneumatic pressure. Can be.
  • the semiconductor package mounted on each of the adsorption parts 311as and 311bs may be sucked and fixed by the suction pressure applied from the suction ports 312a and 312b formed in the respective adsorption parts 311as and 311bs.
  • the adsorption plate 310 may have a structure in which adsorption members 311a and 311b having adsorption parts 311as and 311bs are provided on parallel sides facing each other.
  • a base member 315 is provided at the center of the suction plate 310, and the base member 315 is provided with a shaft hole 3151 into which a rotation shaft for rotation by the rotation driving unit (see FIG. 2) is inserted.
  • a pair of pneumatic lines 3153a and 3153b parallel to the shaft hole 3151 may be provided at positions symmetrical with respect to the shaft hole 3151.
  • Each of the pneumatic lines 3153a and 3153b communicates with the distribution passages 314a and 314b of the distribution members 313a and 313b for distributing pneumatic pressure, and the distribution passages 314a and 314b communicate with the suction ports 312a and 314b of the respective adsorption members. 312b).
  • the base member 315 may be provided with communication passages 3154 and 3155 communicating with the distribution passages 314a and 314b of the distribution members 313a and 313b.
  • the communication passages 3154 and 3155 branched from each of the pneumatic lines 3153a and 3153b are provided on both sides of the adsorption portion or the adsorption member of the adsorption plate 310, respectively, on the respective distribution members 313a and 313b. Can be in communication with the distribution channels (314a, 314b).
  • the communication passages 3154 and 3155 may be configured to be symmetric in each pneumatic line, but the base member 315 of the suction plate 310 shown in FIG. In the line 3153b, communication passages 3154b and 3155b are formed on the side of the two adsorption portions 311as and 311bs.
  • first pneumatic line 3315a is provided with a communication flow path 3155a only toward the first suction member 311a, but the second pneumatic line 3315b has the first suction member 311a and the second suction member 311b.
  • Communication passages 3154b and 3155b are provided at both sides.
  • the communication passage (3155b) formed in the direction of the first suction member (311a) of the two communication passages (3154b, 3155b) branched from the second pneumatic line (3153b) is the first distribution It can be seen that it is shielded by the member 313a and does not apply the pneumatic pressure provided in the pneumatic line 3153b.
  • First and second suction portions 312 and 312b on which the semiconductor package is adsorbed, and a non-adsorption portion on which the semiconductor package is not adsorbed are formed along the X and Y axes, respectively.
  • the semiconductor packages picked up by the unit picker 270 are arranged in a lattice state adjacent to each other in the vertical direction and the left and right directions while the semiconductor package is cut.
  • the adsorption plate 310 divides and distributes the semiconductor packages picked up by the unit picker 270 into the first adsorption part 311as and the second adsorption part 311bs as the adsorption plate 310 is rotated.
  • suction ports provided in the second suction members 311a and 311b may be different positions.
  • the suction members 311a and 311b illustrated in FIGS. 7B and 7C may be provided with a plurality of suction ports, respectively.
  • Each of the plurality of suction ports is formed in a lattice shape, but the suction holes may have a shape or a checkered pattern that is continuously formed only in a diagonal direction instead of adjacent in the vertical direction or the left and right directions.
  • the suction pressure applied to the suction port of each suction member may be distributed and applied through the distribution channel of the distribution member interposed between the base member 315 and the suction member.
  • FIG 8 illustrates another embodiment of the suction plate 310 provided in the semiconductor package inspection unit 400 of the semiconductor strip cutting apparatus 1000 according to the present invention.
  • FIG. 8 (a) shows a plan view of the adsorption member 311 constituting the adsorption plate 310 of the semiconductor strip cutting device 1000
  • FIG. 8 (b) shows the adsorption plate (of the semiconductor strip cutting device 1000).
  • FIG. 8 (c) shows a plan view of another adsorption member 311 constituting 310
  • FIG. 8 (c) shows an adsorption plate 310 mounted only on one side of the adsorption member 311 shown in FIG. 8 (d) shows a cross-sectional view of the adsorption plate 310 in which the adsorption member 311 shown in FIG. 8 (b) is mounted only on one side.
  • an adsorption part 311s having a suction port through which the semiconductor package is adsorbed is arranged in a matrix along the X and Y axis directions.
  • the lower surface of the suction plate 310 may be provided with a vacuum shielding means for shielding the second pneumatic line (3153b) or the second distribution member (313b).
  • the reason why the communication flow path connecting the pneumatic line and the distribution flow path of any one of the symmetrical pneumatic lines of the base member 315 constituting the adsorption plate 310 is asymmetric is illustrated in FIG. 4.
  • the adsorption plate 310 like the adsorption plate 310 does not flip-drive and provides only a drying function
  • the adsorption member 311 may be mounted only on one side of the adsorption plate 310 to form an adsorption part. This is to allow the pneumatic pressure applied from both pneumatic lines to be concentrated in the distribution channel under the one adsorptive member 311.
  • This concentration of pneumatic pressure in the case of the adsorption plate of the semiconductor strip cutting device shown in Figure 4 is because the dense lattice cut semiconductor package supplied from the unit picker must be adsorbed in the adsorption plate 310 at one time to maintain the adsorption state This can minimize the loss of pneumatic pressure.
  • each of the pneumatic flow paths is connected to the upper part of the distribution flow path connected with more communication flow paths.
  • the suction member is mounted and the opposite suction member installation surface is shielded by the shielding member 317 or the like as shown in FIG. 8 (c), so that more pneumatic pressure applied from both pneumatic flow paths is applied to the distribution channel side of the lower suction member. Or may be applied more uniformly.
  • the adsorption plate 310 of the semiconductor strip cutting apparatus 1000 shown in FIG. 1 transfers the semiconductor package to each alignment table using the first adsorption unit and the second adsorption unit, but the adsorption plate 310 is the sole adsorption.
  • the respective alignment tables 430a, 430b The loading grooves formed in the c) are not dense seamless lattice shapes, but are formed in a grid shape or a checkered shape (gull pneumatic flow path) adjacent only in a diagonal direction, as shown in FIGS. 1, 4, 6 and 7.
  • the suction plate 310 In order to load the semiconductor package into each stacking groove of the alignment table, the suction plate 310 is inverted and then diagonally corresponding to the position of the stacking groove of each alignment table. It should be possible to load the semiconductor package from the suction plate into the designated loading groove of the alignment table by removing the suction pressure of the suction port arranged in the grid or checkered (gull pneumatic flow path) adjacent only in the direction.
  • the adsorption member is mounted in a direction in which more communication paths are provided in each pneumatic flow path, and adsorption on the opposite side
  • the mounting surface of the member or distribution member may be shielded by a vacuum shielding means such as the shielding member 317 shown in FIG. 8 (c) or the fastening member 317 'shown in FIG. 8 (d).
  • the inlet pressure can be selectively applied or released to the inlet, which is connected to each of the pneumatic lines and is distributed in a grid or checkered pattern that is only diagonally adjacent to the suction member.
  • the semiconductor package adsorbed may be selectively loaded on the alignment table 430.
  • the adsorption member 311 includes first suction ports and second suction ports which are alternately arranged with each other. 2 a plurality of separate zig-zag or chevron distribution passages 314, each in communication with the inlets, and allowing each of the adjacent distribution passages 314 to communicate with different pneumatic lines,
  • the semiconductor package may be loaded first on the first alignment table, and the remaining semiconductor packages may be loaded on the second alignment table.
  • the adsorption unit or the adsorption member 311 of the adsorption plate 310 of the semiconductor strip cutting device according to the present invention includes first and second suction ports alternately arranged, the first suction ports and And vacuum means in communication with the second suction ports, wherein the vacuum means may allow a vacuum pressure to be applied by the first distribution member through the first pneumatic line.
  • Such a structure can be provided with a function for selectively loading semiconductor packages on each alignment table or the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

La présente invention concerne une plaque d'absorption et un appareil de sciage de bandes à semi-conducteurs doté de ladite plaque. Une pression pneumatique est appliquée de manière uniforme et efficace à la plaque d'absorption de l'appareil de sciage de bandes à semi-conducteurs, la plaque d'adsorption étant apte à mettre en œuvre des procédés dans le cadre de diverses exigences.
PCT/KR2014/003170 2013-04-22 2014-04-14 Appareil de sciage de bandes à semi-conducteurs WO2014175586A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016508858A JP6121619B2 (ja) 2013-04-22 2014-04-14 半導体ストリップの切断装置
CN201480021259.2A CN105144348B (zh) 2013-04-22 2014-04-14 半导体条带锯切设备
SG11201508562YA SG11201508562YA (en) 2013-04-22 2014-04-14 Semiconductor strip sawing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0044489 2013-04-22
KR1020130044489A KR101414690B1 (ko) 2013-04-22 2013-04-22 반도체 스트립 절단장치

Publications (1)

Publication Number Publication Date
WO2014175586A1 true WO2014175586A1 (fr) 2014-10-30

Family

ID=51741016

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2014/003170 WO2014175586A1 (fr) 2013-04-22 2014-04-14 Appareil de sciage de bandes à semi-conducteurs

Country Status (6)

Country Link
JP (1) JP6121619B2 (fr)
KR (1) KR101414690B1 (fr)
CN (1) CN105144348B (fr)
SG (1) SG11201508562YA (fr)
TW (1) TWI503879B (fr)
WO (1) WO2014175586A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109841567A (zh) * 2017-11-24 2019-06-04 韩美半导体有限公司 半导体材料切割装置
CN111584403A (zh) * 2020-05-22 2020-08-25 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 半导体材料加工设备及半导体材料加工方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102041957B1 (ko) * 2015-08-27 2019-11-08 한미반도체 주식회사 반도체 스트립 절단 및 정렬장치와 그 방법
KR102075179B1 (ko) * 2015-12-03 2020-02-07 한미반도체 주식회사 반도체 패키지 적재장치
KR101831256B1 (ko) * 2016-07-01 2018-02-22 한미반도체 주식회사 반도체 스트립 정렬장치 및 반도체 스트립 정렬방법
KR102008515B1 (ko) * 2017-03-13 2019-10-22 한미반도체 주식회사 반도체 제조장치 및 이의 제어방법
KR102070957B1 (ko) * 2019-01-22 2020-01-29 제너셈(주) 패키지 싱귤레이션 시스템
KR102274543B1 (ko) * 2020-03-20 2021-07-07 ㈜토니텍 쏘 앤 플레이스먼트 시스템
KR102609787B1 (ko) * 2020-11-19 2023-12-05 세메스 주식회사 반도체 스트립 절단 및 분류 설비에서 패키지 건조 장치
KR102617780B1 (ko) * 2020-11-19 2023-12-26 세메스 주식회사 반도체 스트립 절단 및 분류 설비에서 공기 분사 장치
KR20240020521A (ko) 2022-08-08 2024-02-15 한미반도체 주식회사 바형 자재 절단장치 및 이의 정렬방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020049954A (ko) * 2000-12-20 2002-06-26 곽 노 권 반도체 패키지장치 절단용 핸들러 시스템
KR20040087524A (ko) * 2003-04-08 2004-10-14 한미반도체 주식회사 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치
KR20070074401A (ko) * 2006-01-09 2007-07-12 한미반도체 주식회사 반도체 제조공정용 절단 및 처리장치
KR20080077540A (ko) * 2007-02-20 2008-08-25 한미반도체 주식회사 반도체 패키지 제조용 절단 및 핸들링 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2370411B (en) * 2000-12-20 2003-08-13 Hanmi Co Ltd Handler system for cutting a semiconductor package device
KR100814448B1 (ko) * 2003-12-12 2008-03-17 한미반도체 주식회사 반도체 패키지 건조시스템
JP2007536727A (ja) * 2004-05-07 2007-12-13 ハンミ セミコンダクター カンパニー リミテッド 半導体パッケージ製造工程用切断及びハンドラシステム
WO2006025622A1 (fr) * 2004-08-31 2006-03-09 Hanmi Semiconductor Co., Ltd. Appareil de sciage et procede de commande pour processus de fabrication de boitier semi-conducteur
KR100604098B1 (ko) * 2005-04-20 2006-07-24 한미반도체 주식회사 반도체 패키지 픽업장치
KR100645897B1 (ko) 2005-07-22 2006-11-14 세크론 주식회사 비지에이 패키지의 소잉소터시스템 및 방법
KR100814284B1 (ko) * 2007-02-06 2008-03-18 한미반도체 주식회사 쏘잉 앤 플레이스먼트 장비의 비전 시스템
KR20090024408A (ko) * 2007-09-04 2009-03-09 삼성전자주식회사 스크라이브 래인 내의 금속 버를 제거하는 노즐을 갖는웨이퍼 소잉 장치, 웨이퍼 소잉 방법 및 이를 이용하여제작된 반도체 패키지
KR101594965B1 (ko) * 2010-09-10 2016-02-18 한미반도체 주식회사 반도체 패키지 싱귤레이션 장치
JP5762189B2 (ja) * 2011-07-14 2015-08-12 株式会社ディスコ 切削装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020049954A (ko) * 2000-12-20 2002-06-26 곽 노 권 반도체 패키지장치 절단용 핸들러 시스템
KR20040087524A (ko) * 2003-04-08 2004-10-14 한미반도체 주식회사 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치
KR20070074401A (ko) * 2006-01-09 2007-07-12 한미반도체 주식회사 반도체 제조공정용 절단 및 처리장치
KR20080077540A (ko) * 2007-02-20 2008-08-25 한미반도체 주식회사 반도체 패키지 제조용 절단 및 핸들링 장치

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109841567A (zh) * 2017-11-24 2019-06-04 韩美半导体有限公司 半导体材料切割装置
CN109841567B (zh) * 2017-11-24 2023-10-20 韩美半导体有限公司 半导体材料切割装置
CN111584403A (zh) * 2020-05-22 2020-08-25 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 半导体材料加工设备及半导体材料加工方法
CN111584403B (zh) * 2020-05-22 2023-11-21 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 半导体材料加工方法

Also Published As

Publication number Publication date
KR101414690B1 (ko) 2014-07-08
TW201448008A (zh) 2014-12-16
CN105144348A (zh) 2015-12-09
SG11201508562YA (en) 2015-11-27
JP2016515769A (ja) 2016-05-30
JP6121619B2 (ja) 2017-04-26
TWI503879B (zh) 2015-10-11
CN105144348B (zh) 2017-07-28

Similar Documents

Publication Publication Date Title
WO2014175586A1 (fr) Appareil de sciage de bandes à semi-conducteurs
KR100596505B1 (ko) 소잉/소팅 시스템
WO2017073845A1 (fr) Appareil de dressage et appareil de polissage de tranche le comprenant
KR102041957B1 (ko) 반도체 스트립 절단 및 정렬장치와 그 방법
US20060272987A1 (en) Transfer mechanism and transfer method of semiconductor package
WO2018143668A1 (fr) Dispositif de tri d'éléments
WO2019156286A1 (fr) Appareil pour examiner l'extérieur d'un dispositif à semi-conducteurs
US8167524B2 (en) Handling system for inspecting and sorting electronic components
KR101391704B1 (ko) 반도체 패키지 핸들러 및 그 운용방법
WO2011055960A2 (fr) Appareil et procédé de polissage et de lavage d'une plaquette de semi-conducteur
KR20170065162A (ko) 반도체 패키지 적재장치
JP4309084B2 (ja) ダイシング装置
WO2016204424A1 (fr) Système de traitement de substrat hybride pour procédé par voie sèche et par voie humide et son procédé de traitement de substrat
WO2021071340A1 (fr) Module de mise sous pression et manipulateur de dispositif comprenant ce dernier
WO2018131921A1 (fr) Manipulateur de dispositif
WO2017119786A1 (fr) Module outil de transfert et manipulateur de dispositif le comportant
KR101339169B1 (ko) 반도체 절단 장비용 컨베이어 로더
WO2019172689A1 (fr) Module d'inspection par vision, système d'inspection de dispositif le comprenant, et procédé d'inspection de dispositif l'utilisant
WO2018199363A1 (fr) Procédé et appareil d'inspection d'article
WO2022045428A1 (fr) Dispositif et système d'inspection par rayons x
WO2020256251A1 (fr) Procédé pour fournir un objet
WO2017052090A1 (fr) Manipulateur d'élément
WO2020251287A1 (fr) Dispositif de manutention de modules électroniques
JP2023012425A (ja) 半導体資材の切断方法
WO2021187735A1 (fr) Scie et système de placement

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201480021259.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14788156

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2016508858

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14788156

Country of ref document: EP

Kind code of ref document: A1