WO2020213874A1 - Manipulateur de test de composant électronique - Google Patents

Manipulateur de test de composant électronique Download PDF

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Publication number
WO2020213874A1
WO2020213874A1 PCT/KR2020/004721 KR2020004721W WO2020213874A1 WO 2020213874 A1 WO2020213874 A1 WO 2020213874A1 KR 2020004721 W KR2020004721 W KR 2020004721W WO 2020213874 A1 WO2020213874 A1 WO 2020213874A1
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WO
WIPO (PCT)
Prior art keywords
test tray
test
tray
opening module
insert opening
Prior art date
Application number
PCT/KR2020/004721
Other languages
English (en)
Korean (ko)
Inventor
이택선
여동현
유일하
Original Assignee
주식회사 아테코
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Filing date
Publication date
Application filed by 주식회사 아테코 filed Critical 주식회사 아테코
Publication of WO2020213874A1 publication Critical patent/WO2020213874A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Definitions

  • the present invention relates to an electronic component test handler.
  • the electronic component test handler is a device that inspects a plurality of electronic components, for example, semiconductor devices, modules, and SSDs after being manufactured.
  • the electronic component test handler is configured to connect electronic components to a test device and artificially create various environments to inspect whether the electronic components operate normally, and to classify them into good, re-inspection, and defective products according to the inspection results.
  • distribution is performed by exchanging the user tray in which the device to be tested or the device that has been tested is loaded with the outside, and distribution with the outside must be performed at an appropriate cycle so that the inspection can be continuously performed.
  • Korean Patent Registration No. 1,734,397 (registered on May 02, 2017), filed and registered by the present applicant, is disclosed for such a test handler.
  • An object of the present invention is to provide a test tray capable of minimizing the downtime of the sorting operation due to replacement of the test tray during sorting by solving the above-described conventional problems.
  • the first test tray transfer unit provided in the inverter and configured to move the test tray loaded inside the inverter, and the second configured to transport the empty test tray discharged to the outside of the insert opening module to the loading site. It may include a test tray transfer unit.
  • the insert opening module is composed of a mask and a presizer that are formed to be spaced apart in the vertical direction, and the mask is formed with a plurality of openings so that one side of the hand can pass and pick up the device loaded on the test tray.
  • the presizer may include a plurality of support pins configured to be raised while supporting the lower surface of each insert.
  • the presizer may be configured to support the insert and the test tray while allowing the insert to be closely contacted inside the test tray.
  • test tray may be configured to accommodate a memory chip or a memory module.
  • the electronic component test handler divides a device into a divided area on a flat area from a test tray and transfers the test tray in a divided area unit, and performs classification, thus minimizing the waiting time for hand classification. Therefore, there is an effect that can maximize the efficiency of classification.
  • FIG. 1 is a conceptual diagram of an electronic component test handler according to the present invention divided into spaces according to functions.
  • FIG. 2 is a conceptual diagram of a test handler body of FIG. 1 divided according to functions on a plane.
  • FIG 3 is a conceptual diagram showing movement of a device and a test tray in a test handler body.
  • FIG. 4 is a partial perspective view of a stacker of an electronic component test handler according to the present invention.
  • FIG. 5 is an enlarged perspective view showing an enlarged portion of the configuration of FIG. 4.
  • 6A, 6B, 6C, 6D, and 6E are operational state diagrams showing the transfer of the user tray between the first loading unit and the second loading unit.
  • FIG. 7 is a conceptual diagram showing an operation concept of the stacker during distribution between the first loading unit and the outside.
  • FIG. 8 is a conceptual diagram showing the logistics inside the stacker.
  • FIG. 9 is a perspective view showing a part of an unloading site according to the present invention.
  • 10 is a perspective view of an inverter.
  • FIG. 11 is a perspective view of an insert opening module and a test tray.
  • 12A, 12B, 12C, 13A, 13B and 13C are operational state diagrams showing the movement of the test tray at the unloading site.
  • FIG. 14A and 14B are diagrams showing the operation of each component over time in the present invention.
  • the user tray refers to a tray in which a plurality of loading grooves configured to load semiconductor elements are arranged in a certain arrangement, and the loading groove of the user tray is configured such that the device is fixed inside the groove by gravity without a separate fixing function.
  • FIG. 1 is a perspective view of a test handler according to the present invention.
  • the test handler 1 is configured to carry in the device 20 from the outside, perform a test, and selectively take it out according to the grade.
  • the test handler 1 moves the stacker and device 20 for carrying in or carrying out a plurality of user trays 10 from the outside according to spatially functional functions from the user tray 10, performing a test, and then performing a test by grade. It may be classified into a test handler body 100, which is an area that is classified and loaded into the user tray 10.
  • the stacker 2 refers to an area in which the user tray 10 can be loaded in a large amount.
  • the stacker may be classified into a loading stacker, an unloading stacker, and an empty stacker according to the loaded device 20.
  • the loading stacker is configured to load the user tray 10 in which devices 20 that need to be tested and sorted are loaded.
  • the loading stacker is configured to have a size in which a plurality of user trays 10 carried from the outside can be stacked in units of 1 lot.
  • the unloading stacker is configured to load a plurality of user trays 10 loaded with a device 20 for carrying out to the outside among the devices 20 that have been tested and sorted before being taken out in units of one lot.
  • the empty stacker is configured so that a plurality of empty user trays 10 can be loaded, and the empty user tray 10 is transferred from the loading stacker after the transfer of the device 20 is completed, or the empty user tray 10 is transferred to the unloading stacker. It may be configured to be able to transport the user tray 10.
  • the loading stacker, the unloading stacker, and the empty stacker may be classified according to logistics to the outside, logistics and loading purpose inside the test handler 1, but their configurations may be the same or similar to each other.
  • Each stacker module 500 may be configured to stack and stack a plurality of user trays 10 in a vertical direction for efficient use of space.
  • each stacker module 500 is configured to be opened and closed by moving horizontally in the y direction of FIG. 1, and distribution with the outside is performed at a position carried out to the outside.
  • a plurality of user trays 10 may be transferred to a loading stacker from an automatic guided vehicle (AGV), or an unmanned vehicle may collect a plurality of user trays 10 from the unloading stacker.
  • AGV automatic guided vehicle
  • the stacker 2 may be configured such that each of the loading stacker, the unloading stacker, and the empty stacker may be set in plural, and internal logistics can be continuously performed even while any one is logistics with the outside.
  • test handler body 100 will be schematically described with reference to FIGS. 2 and 3.
  • FIG. 2 is a conceptual diagram showing the test handler body 100 of FIG. 1 divided according to functions on a plane
  • FIG. 3 is a conceptual diagram showing movement of the device 20 and the test tray 130 in the test handler body 100 .
  • the test handler body 100 tests a plurality of devices 20, classifies the devices 20 after the test, and transfers and loads the devices 20 before and after the test.
  • the test handler body 100 may be functionally classified, including a loading site (L), a test site (T), and an unloading site (UL).
  • the loading site L is configured to pick up a plurality of devices 20 from the user tray 10 and place them on the test tray 130.
  • the loading site L may be provided with a hand 110 for transferring the device 20 from the user tray 10 to the test tray 130, a loading shuttle 120, and a scanner (not shown) for inspection. .
  • the user trays 10 loaded in the loading stacker may be alternately supplied to the pickup position one by one, and the hand 110, which will be described later, removes only the plurality of devices 20 from the user tray 10 and transfers them.
  • the empty user tray 10 and the user tray 10 in which the devices are loaded are replaced and positioned so that the device 20 can be continuously supplied.
  • the pickup position a plurality of user trays 10 are provided so that the device 20 can be continuously supplied even when all the user trays 10 loaded in any one stacker module 500 have been consumed or a failure occurs. It can be exposed.
  • the other user tray 10 may be configured to wait in a standby state or be replaced with a new user tray 10.
  • the hand 110 is configured to pick up and transfer the plurality of devices 20 and then load them onto the test tray 130 or the loading shuttle 120.
  • the hand 110 may be configured to be in charge of logistics for each transport section.
  • the hand 110 may be installed on a rail capable of horizontal movement of the upper side, and is configured so that the attachment can be viewed toward the lower side, and a linear actuator (not shown) is provided to enable length adjustment in the vertical direction. I can.
  • the attachment may be configured such that a plurality of vacuum ports are provided to vacuum-adsorb the plurality of devices 20.
  • the attachment may be configured to be replaceable in consideration of the type, size, and shape of the device 20.
  • the test tray 130 is provided with an insert for each loading groove in consideration of thermal deformation when fixing the device 20 and performing a test, and the interval between the loading grooves may be different from that of the user tray 10.
  • the spacing between the loading grooves of the test tray 130 is configured to be larger than that of the user tray 10. Therefore, after picking up the plurality of devices 20 from the user tray 10 at the pickup position by using the hand 110, the space between the devices 20 is widened and then loaded onto the test tray 130.
  • two interval adjustments may be performed to increase the interval in two directions of xy, and for this purpose, a loading shuttle 120 is provided between the pickup position and the test tray 130, and a loading shuttle from the user tray 10
  • the distance in one direction can be adjusted while being transferred to 120, and the distance in the other direction can be adjusted while transferring from the loading shuttle 120 to the test tray 130.
  • the loading shuttle 120 is provided between the user tray 10 and the test tray 130, and the space between the loading grooves is the user tray 10 so that the plurality of devices 20 can be loaded in a state that is primarily aligned. It may be configured in an array that is widened in one direction. In addition, the loading shuttle 120 may be positioned in consideration of the positions of the user tray 10, the test tray 130, and the hand 110 for efficiency of distribution.
  • a scanner (not shown) is provided to identify barcodes if they are present on the device 20 to be transferred.
  • the scanner (not shown) may be configured to recognize a barcode on a path through which the hand 110 picks up and transfers the device 20.
  • the scanner may be provided in various positions to facilitate the recognition of barcodes according to the shape, size and type of the device 20.
  • test tray 130 In the place position, an empty test tray 130 is supplied, and the device 20 is transferred and stacked.
  • the test tray 130 is transferred to the test site T afterwards, and a new empty test tray 130 is supplied.
  • a mask and a preciser configured to prevent separation of the device 20 after the device 20 is seated on the test tray 130 may be provided at the place position.
  • the test tray 130 is provided with an insert for each loading groove, and each insert is provided with a locking portion capable of preventing the device 20 from being separated.
  • the basic position of each of the locking portions is set to a position that prevents the device 20 from being separated.
  • the loading of the device 20 in the test tray 130 is performed by expanding the engaging portion of the insert with a mask while pressing the insert with a presizer, and the hand 110 transferring the device 20 to the loading groove.
  • the mask is configured in a shape corresponding to the test tray 130, and a plurality of protrusions 312 are provided to expand the locking portions of each insert when in close contact with the test tray 130.
  • the presizer is configured to temporarily fix the insert provided in the test tray 130 in a somewhat spaced state.
  • the presizer is provided with a plurality of pressing pins corresponding to the position of each insert, and the presizer is in close contact with the test tray 130 to press the insert to temporarily fix it with the test tray 130. Therefore, it is possible to minimize the position error when the device 20 is seated on the insert.
  • an elevating unit for independently elevating the mask and the presizer may be additionally provided.
  • the test site T is configured to perform a test on a plurality of devices 20 loaded on the test tray 130 in units of the test tray 130 and transmit the test results.
  • a thermal load test may be performed in which the device 20 is changed to a temperature of -40°C to 130°C to check the function.
  • a test chamber 160 and a buffer chamber 150 provided before and after the test chamber 160 may be provided at the test site T.
  • the buffer chamber 150 may be configured to be loaded with a plurality of test trays 130, and may be configured to perform preheating or post-heat treatment before and after performing a heat load test.
  • the test tray 130 may be configured to be transported and tested while the test tray 130 is upright, so that the overall size of the equipment may be reduced. Meanwhile, although the configuration is not shown in detail, an inverter 140 may be provided before and after the buffer chamber 150 to change the posture of the test tray 130 to an upright state.
  • the unloading site UL is configured to sort, transport, and load the device 20 according to the test result from the test tray 130 transferred from the test site T.
  • the unloading site UL may be provided with elements similar to the configuration of the loading site L, and may be performed in an order opposite to the transfer of the device 20 at the loading site L.
  • a plurality of sorting shuttles 170 may be provided to temporarily collect from the test tray 130 according to grades. In order to improve the efficiency of distribution, when a predetermined number of devices 20 of the same grade are loaded in the sorting shuttle 170, a plurality of devices may be simultaneously picked up and transferred to the user tray 10.
  • a control unit for controlling driving of the above-described components may be separately provided.
  • FIG. 4 is a partial perspective view of a stacker of the electronic component test handler 1 according to the present invention
  • FIG. 5 is an enlarged perspective view showing a partial configuration of FIG. 4.
  • the stacker may be configured to continuously supply or retrieve the device 20 from the lower side of the base 101 of the test handler body 100.
  • the stacker may include a stacker module 500 and a buffer stacker 300.
  • the stacker module 500 may be configured in plural, each independently opened and closed to exchange the user tray 10 with the outside.
  • the plurality of stacker modules 500 may be provided in a number corresponding to 1:1 with the second loading unit 310 inside the buffer stacker 300 to be described later.
  • the stacker module 500 may be configured to be opened while moving in a horizontal direction.
  • the stacker module 500 includes a frame 200, a first loading part 510, a first loading part lifting part 520, a slider 530, a linear actuator 550, a guide 610, and a sensor part 620. And it may be configured to include a door 540.
  • the frame 200 may be configured to constitute an overall skeleton.
  • the first loading unit 510 refers to a space in which a plurality of user trays 10 can be stacked and loaded.
  • the first loading unit 510 may be loaded with an external user tray 10 transfer means, for example, 1 lot, which is a unit that is exchanged with a robot at a time.
  • 1 lot which is a unit that is exchanged with a robot at a time.
  • the space of the first loading unit 510 may be formed corresponding to the shape and size of the user tray 10.
  • the first loading part lifting part 520 is configured to lift the plurality of user trays 10 in the vertical direction.
  • the first loading part lifting part 520 may include a support plate 521, a support part 522, and a lifting drive part 523.
  • the support plate 521 is configured to support the user tray 10 loaded on the first loading part 510 to the upper surface.
  • the support plate 521 is of a size that does not cause interference due to the protrusion 312 when moving between the first loading part 510 and the second loading part 310 even when the protrusion 312 of the holder 311 is closed. Can be configured.
  • the support part 522 is provided on the frame side, and may be configured to support a lower surface of the support plate 521 when the stacker module 500 is closed.
  • the elevating driving part 523 is connected to the support part 522 to move the support support part 522 in the vertical direction.
  • the elevating driver 523 may be configured to enable height adjustment of the support portion 522 from the lower side of the first loading portion 510 to the lower side of the second loading portion 310.
  • the slider 530 may be provided under the stacker module 500 and may be configured such that the stacker module 500 is slid to move relative to the frame 200.
  • the slider 530 may be configured to stably support the stacker module 500 by being configured in plural, and may also constrain the stacker module 500 to be moved to a predetermined reciprocating position.
  • the linear actuator 550 is configured to move the stacker module 500 in the horizontal direction.
  • One side of the linear actuator 550 may be connected to the frame 200 and the other side may be connected to one side of the stacker module 500 to open and close the stacker module 500 according to an input.
  • the linear actuator 550 has been described as an example, but may be modified and applied in various configurations for reciprocating movement of the stacker module 500.
  • the guide 610 is configured to prevent the user tray 10 from being separated from the first loading unit 510 in a state in which the plurality of user trays 10 are stacked.
  • the guide 610 is formed to extend in a vertical direction at a plurality of points along the circumference of the first loading portion 510.
  • two guides 610 adjacent to each corner of the user tray 10 may be provided, and a total of eight guides 610 may be provided.
  • the length of the guide 610 may be formed to extend to a length such that it does not deviate laterally when the second loading part 310 and the user tray 10 are exchanged. That is, a separation distance between the upper end of the guide 610 of the first loading portion 510 and the second loading portion 310 of the upper side may be formed to be shorter than the thickness of the user tray 10.
  • the sensor unit 620 may be configured to determine the presence or absence of the user tray 10 in the first loading unit 510 and whether loading is complete.
  • the sensor unit 620 may be configured to determine the presence or absence of the user tray 10 positioned at the uppermost side and the lowermost side when the user tray 10 is loaded on the first loading unit 510.
  • the uppermost sensor detects that the user tray 10 is present, it is determined that the loading of the user tray 10 in the first loading unit 510 is completed, and subsequent operations may be controlled.
  • the first loading unit 510 is empty, and an operation thereafter may be controlled.
  • the above-described sensor unit 620 may be applied in various configurations capable of determining the presence or absence of the user tray 10 at a spaced point such as a laser sensor, an infrared sensor, and an ultrasonic sensor.
  • the door 540 is configured to shield the outside when the stacker module 500 is moved to the inside of the stacker and is inserted.
  • the buffer stacker 300 is provided above the stacker module 500.
  • the buffer stacker 300 is configured so that even if each of the stacker modules 500 performs distribution of the user tray 10 to the outside, distribution of the user tray 10 can be continuously performed from the inside.
  • the buffer stacker 300 may include a second loading unit 310, a guide 610, a sensor unit 620, a holder 311, a transfer 410, and a set plate 320.
  • the second loading part 310 may be defined as a space in which the user tray 10 can be loaded.
  • the second loading part 310 is configured to exchange the first loading part 510 and the user tray 10 downward.
  • the second loading part 310 may be formed in the same number as the number of the stacker modules 500 described above and may be provided in parallel on the upper side of the stacker module 500.
  • the guide 610 and the sensor unit 620 may be provided on the second loading portion 310 in the same manner as the configuration of the first loading portion 510 described above.
  • the guide 610 may be provided with a length similar to the height in which one lot is loaded.
  • the transfer 410 is configured to grip and transfer the user tray 10 inside the buffer stacker 300.
  • the transfer 410 may be configured in plural, and may include at least one transfer 410 involved in loading and one or more transfer 410 involved in unloading.
  • the transfer 410 may be provided with a plurality of actuators (not shown) to enable horizontal movement and vertical movement.
  • the transfer 410 may be controlled such that the transfer of the user tray 10 is performed between any one of the second loading units 310 and any one of the set plate 320. In addition, it may be controlled to perform the distribution of the user tray 10 between the second loading unit 310.
  • the transfer 410 may be controlled to withdraw the user trays 10 one by one from the upper side of the second loading unit 310 or stack them one by one to the lower side.
  • the set plate 320 is configured to expose the transferred user tray 10 to the test handler body 100.
  • the set plate 320 is configured to be raised and lowered while the user tray 10 is loaded, and when it is raised, the hand 110 of the test handler body 100 is moved to a position where it can pick up the device 20 When descending, the transfer unit 410 may be moved to a position where the user tray 10 can be replaced.
  • the set plate 320 may be provided in plural at the loading site L and the unloading site UL.
  • the holder 311 may be configured to selectively pass or support the user tray 10 between the second loading part 310 and the first loading part 510.
  • the holders 311 may be provided in a pair on each of the second loading portions 310, and each holder 311 may include a protrusion 312.
  • the protrusion 312 may be configured asymmetrically along the rotation direction so as to selectively interfere with the movement path of the user tray 10 when the holder 311 is rotated.
  • the protrusion 312 may be configured to substantially support the lower surface of the user tray 10.
  • the frame 200 is opened at the lower side of the second loading unit 310 so that the user tray 10 can enter and exit, and when the holder 311 is opened, the user tray 10 is configured to pass.
  • the holder 311 may include a protrusion 312 protruding over a moving path of the user tray 10 between the first loading portion 510 and the second loading portion 310 when closed. When the holder 311 is opened, the protrusion 312 may be rotated so that interference does not occur on the moving path of the user tray 10.
  • 6A, 6B, 6C, 6D, and 6E are operational state diagrams showing the transfer of the user tray 10 between the first loading part 510 and the second loading part 310. As shown, in the case of transferring the user tray 10 from the first loading portion 510 to the second loading portion 310, the upper side while supporting the stacked user trays 10 from the first loading portion 510 side Will be transferred.
  • the elevation height of the first loading part lifting part 520 may be determined as a position in which the height of the bottom of the lowermost user tray 10 is higher than the support height of the holder 311. Thereafter, referring to FIG. 6D, the holder 311 is closed to prevent the user tray 10 from being returned to the first loading unit 510 again. Thereafter, referring to FIG. 6E, when the first loading part lifting part 520 is lowered, the bottom surface of the lowermost user tray 10 which was loaded is supported by the holder 311, and thus the entire user tray 10 is increased. The second loading portion 310 is loaded, and the first loading portion elevating portion 520 is in its original position and is ready to load a new user tray 10 from the outside. At this time, the difference between the height of the upper surface of the first loading part lifting part 520 and the support height of the holder 311 may be minimized, thereby minimizing impact when handing over the user tray 10.
  • the control is performed in the opposite of the above-described order, and the plurality of user trays 10 are transferred from the second loading unit 310. It can be transferred to the first loading unit 510.
  • FIG. 7 is a conceptual diagram showing an operation concept of the stacker during distribution between the first loading unit 510 and the outside.
  • the first loading part 510 when the first loading part 510 is empty, the user tray 10 can be supplied from the outside. At this time, even if the stacker module 500 is opened, the user tray 10 remains in the second loading unit 310 inside the buffer stacker 300, so that the user tray 10 can be continuously supplied to the set plate 320 from this. There will be.
  • the first loading section 510 and the second loading section 310 for supply are arranged in two or more rows so that the user tray 10 is When all of them are exhausted, the user tray 10 loaded in another row can be used.
  • a plurality of stacker modules 500 may be simultaneously loaded.
  • the user tray 10 can be independently stacked on the second loading unit 310 even while opening and closing the stacker module 500 even when the user tray 10 needs to be taken out. do.
  • one stacking portion and the second stacking portion 310 are configured in one row, and may include a plurality of rows of stacking portions.
  • the first loading portion 510 and the second loading portion 310 are configured to exchange the user tray 10 (1) and also from the second loading portion 310 to the set plate 320.
  • the user tray 10 can be transferred (2), and conversely, the user tray 10 can be transferred from the set plate 320 to the second loading unit 310 (3). Also, if necessary, the user tray 10 may be transferred between the second loading units 310 (4).
  • the first loading unit 510 is able to perform distribution with the outside as the stacker module 500 is individually opened and closed even if the user tray 10 of various paths is transferred inside the buffer stacker 300 described above.
  • each of the loading units provided in the stacker module 500 and the buffer stacker 300 may be set to perform the functions of loading, unloading, and empty freely according to a user's input.
  • the stacker module can independently perform logistics between the external and user trays even while exchanging user trays with the outside, and it is possible to operate stably by preventing the interruption of the test handler operation due to exhaustion of the user tray. There is an effect.
  • FIG. 9 is a perspective view showing a part of the unloading site according to the present invention
  • FIG. 10 is a perspective view of the inverter 140
  • FIG. 11 is a perspective view of the insert opening module 190.
  • the frame of the main body and some of the hand 110 are omitted.
  • the unloading site UL is configured to individually classify each device according to the test result from the test tray 130 that has been tested.
  • a plurality of test trays 130 that have been tested may be stacked side by side while being erected in a vertical direction.
  • the test tray 130 is transferred in a first-in, first-out manner in which the test tray 130, which has first entered the buffer chamber from the test chamber, is first drawn out.
  • the test tray 130 rises upward from one side of the buffer chamber 150 and exits to the outside.
  • the inverter 140 converts the posture to receive the test tray 130 in the vertical direction, and then receives the test tray 130.
  • the first test tray 130 and the transfer unit support one side of the test tray 130 and rise together, so that the test tray 130 may be completely accommodated into the inverter 140.
  • the unloading site may include components including an inverter 140, an insert opening module 190, a second test tray 130, a transfer unit, a sorting shuttle, and a hand 110.
  • the inverter 140 is configured to change the direction of the test tray 130 received from the buffer chamber.
  • the inverter 140 may include a shaft 144, an inverter frame 141, and a first test tray transfer unit 180.
  • Both sides of the shaft 144 are fixed to the test handler body frame, and the inverter 140 is configured to rotate around the shaft 144.
  • the inverter frame 141 constitutes the overall appearance of the inverter 140 and is configured such that the test tray 130 can be temporarily accommodated.
  • the inverter 140 is loaded with a frame and a test tray 130 configured in a flat shape as a whole, and a space is provided so that it can be moved in a linear direction in the loaded state, and a half configured to prevent departure in other directions. It may be configured to include an electric guide 142.
  • the inverter 140 is provided with a pair of shaft connection portions 143 provided on both edges, and may be configured to be rotatable by being connected to the shaft 144 described above.
  • the inverter 140 is configured to be rotatable about the shaft 144.
  • a rotation driving unit of the inverter 140 may be provided in the connection portion to generate power to rotate the inverter 140.
  • the first test tray transfer unit 145 is configured to selectively support the test tray 130 on the inverter frame 141 and perform linear motion.
  • the first test tray transfer unit 145 may include a first driving unit 146, a second driving unit 148 and a traction pin 149.
  • the first driving unit 146 provides a driving force through which the test tray 130 can be transferred in a direction parallel to the inverter frame 141.
  • the first driving unit 146 may be connected to the belt to transmit driving force.
  • the second driving unit 148 and the traction pin 149 to be described later are linearly moved together.
  • the second driving unit 148 provides a driving force for adjusting the position of the traction pin 149 so that the traction pin 149 to be described later can selectively support the test tray 130.
  • One side of the second driving unit 148 is connected to the first driving unit belt 147, and the other side is connected to a traction pin 149.
  • the position of the traction pin 149 may be relatively adjusted with the first driving unit belt 147.
  • the traction pin 149 is configured to be inserted into a traction groove formed in the test tray 130 to support the test tray 130.
  • the first test tray transfer unit 145 is moved while supporting the test tray 130 raised to a predetermined length by an elevating unit (not shown) of the buffer chamber 150, so that it is moved to a proper position inside the inverter 140. Drive so that it can be placed.
  • the inverter 140 is driven when the test tray 130 is converted to the horizontal direction and transferred to the insert opening module 190 to be described later.
  • the stroke is configured to be equal to or longer than the length of the test tray 130, so that the position before and after the inverter 140 and the transfer of the test tray 130 are made smoothly. I can.
  • the test tray 130 may be configured to include a sensor capable of determining whether or not the test tray 130 is fully loaded on the inverter 140, and the test tray 130 If it is not placed in the position, it may be controlled to re-perform the exact position transfer operation of the test tray 130.
  • the insert opening module 190 is configured to selectively open a plurality of inserts provided in the test tray 130.
  • the insert opening module 190 may be configured to have a size corresponding to one divided area Ad when dividing the test tray 130 into a plurality of divided areas Ad on a plane.
  • the divided area Ad is divided into two along the traveling direction of the test tray 130, and therefore, the insert opening module 190 may have a half size of the test tray 130.
  • the insert opening module 190 first opens the insert so that the device can be withdrawn from the first half of the test tray 130, and when all devices are withdrawn from the first half, the test tray 130 is moved to open the insert of the second half. , The device placed in the second half is withdrawn.
  • each of the elements may be connected to the driving unit so that such an operation may be performed, and driving may be performed by receiving a driving signal from the control unit.
  • the insert opening module 190 may include a mask 191 and a presizer 192.
  • the mask 191 and the presizer 192 are arranged in a vertical direction, and a test tray 130 may be positioned therebetween.
  • the mask 191 is composed of about half the size of the test tray 130, and a plurality of openings on the mask 191 correspond to the size and arrangement of the loading grooves formed in the divided area Ad of the test tray 130. Can be formed.
  • the insert may be opened by pressing an open link (not shown) provided in the insert (not shown) downward. In this state, the hand 110 enters from the opening side of the mask 191 to the lower side to pick up the device disposed in the loading groove of the test tray 130.
  • the presizer 192 is configured to be in close contact while adjusting the inserts that are coupled with clearance on the test tray 130 to an accurate position.
  • the presizer 192 is provided with a plurality of insert support pins 193 corresponding to the plurality of inserts.
  • the presizer 192 may be configured to be elevated by being connected to the elevating unit 194 at the lower side.
  • the presizer 192 descends to a predetermined height, and after the test tray 130 moves, it rises again to open the test tray 130 to the insert opening module 190 ).
  • test tray 130 is inserted between the mask 191 and the presizer 192.
  • the mask 191 and the presizer 192 are It can be applied after being transformed into a configuration that is arranged both on the lower side or on the upper side.
  • the second test tray 130 transfer unit is configured to transfer the empty test tray 130 passing through the insert opening module 190 to the loading site.
  • the second test tray 130 transfer unit is provided with a traction pin 149 extending a predetermined length upward, similar to the transfer unit of the first test tray 130, and is drawn out from the insert opening module 190 It may be configured to perform an operation in the y direction for performing and an operation in the x direction for transferring from the unloading site to the loading site.
  • the second test tray 130 transfer unit may be configured to move along the linear guide 181 formed while crossing the loading site and the unloading site.
  • the sorting shuttle is provided in a position adjacent to the insert opening module 190, and is provided to be loaded for a while according to the grade according to the inspection result. Specifically, when sorting shuttles are picked up one by one for each class and transferred to the user tray, they have a very inefficient movement line, so when a certain amount of devices of the same class are sorted and loaded, the device transfer of the hand 110 before transferring to the user tray at once. It is structured to be collected in units. When a certain amount is loaded, the sorting shuttle is moved to the user tray to shorten the pickup and place movement of the hand 110.
  • the sorting shuttle 170 may be configured in such a manner that a plurality of sorting shuttles 170 may be configured to classify and load devices classified by several classes.
  • Each sorting shear may be provided with a plurality of loading grooves so that a plurality of devices can be loaded. Meanwhile, each sorting shuttle may have a different loading position depending on the overall loading condition of the sorting shuttle. For example, when one sorting shuttle is moved to the user tray, it can be loaded onto another sorting shuttle without stopping the operation. Therefore, classification is performed while appropriately changing the loading position for each class without waiting for the return of the sorting shuttle, so that classification can be continuously performed without stopping the operation of the hand 110.
  • the hand 110 is configured to be able to pick up and transport the device and load it on a tray or shuttle as described above.
  • 12a, 12b, 12c, 13a, 13b and 13c are operational state diagrams showing the movement of the test tray 130 at the unloading site.
  • the second half of the first test tray 131 is positioned in the insert opening unit to complete unloading.
  • the second test tray 132 in which the device is loaded is loaded in the inverter 140.
  • the second test tray 132 is moved while the transfer unit of the first test tray 131 moves to the right from the inversion part.
  • the first test tray 131 is supported by the second test tray 132 and is pushed out of the insert opening module 190.
  • the transfer unit of the first test tray 131 preferentially moves only half of the length of the second test tray 132.
  • the first half of the divided area Ad of the second test tray 132 is positioned in the insert opening module 190 and the second half is positioned in the inverter 140.
  • the first half of the second test tray 132 is positioned on the insert opening module 190 and the insert opening module 190 is operated to open a plurality of inserts positioned on the first half.
  • the hand 110 picks up and classifies the device.
  • the first test tray 131 may be moved to the loading site side by the transfer unit of the second test tray 132 (not shown).
  • the first test tray transfer unit 145 is operated, and the insert opening module 190 is operated at the second half of the second test tray 130. ). Even at this time, the insert opening module 190 is operated so that the insert can be opened.
  • the next test tray 130 is prepared in the inverter 140.
  • the inverter 140 is inverted in a vertical direction and supports the third test tray 133 rising from the buffer chamber with a pull pin 149.
  • the first test tray transfer unit 145 is driven to completely load the third test tray 133 into the inverter 140.
  • the device may still be classified in the second test tray 132.
  • FIG. 13C by rotating the inverter 140 counterclockwise by 90 degrees, the third test tray 133 is placed in a ready state.
  • the next test tray 130 can be sufficiently supplied to the insert opening module 190 continuously. Thereafter, the operation may be repeatedly performed from FIGS. 12A to 13C.
  • FIG. 14A and 14B are diagrams showing the operation of each component over time in the present invention.
  • FIG. 14A it is a diagram of an operation in an existing device performed in units of the test tray 130.
  • the empty test tray 130 is discharged to the outside of the insert opening module 190, and a new test tray 130 is opened. It flows into the inside of the module 190.
  • the time required for replacement with the new test tray 130 is much larger than the time for the hand 110 to pick up the last device 20, sort it, and return to the standby state. That is, a time loss occurs in the classification by this time difference.
  • the waiting time of the hand 110 can be minimized.
  • the insert opening module 190 descends, and the test tray 130 moves.
  • the hand 110 sorts and doubles the devices that have been picked up and waits in a pickup ready state.
  • the test tray 130 moves half by half from the first half to the second half and from the second half to the first half of the next test tray 130, and then the insert opening module 190 operates to open the insert. Therefore, it is possible to minimize the waiting time of the hand 110 that occurs during the movement of the test tray 130.
  • the hand 110 when moving all the test trays 130 at once as shown in FIG. 14A, the hand 110 can perform the sorting operation of the last device only once, and there is an inefficient aspect of waiting until the next tray is supplied. .
  • the present invention moves twice by half until all sorting of one test tray 130 is completed, and when moving twice, the hand 110 can perform two operations, thereby minimizing time loss I can make it.
  • the present invention divides the test tray 130 into divided areas (Ad) when classifying in the test tray 130, transfers the test tray 130 in units of divided areas (Ad), and performs classification, so that the hand 110's classification waiting time Can be minimized. Therefore, there is an effect that can maximize the efficiency of classification.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Robotics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente invention concerne un manipulateur de test de composant électronique comprenant : un plateau de test pourvu d'une pluralité d'inserts configurés pour fixer de manière sélective un dispositif; un module d'ouverture d'insert configuré pour ouvrir la pluralité d'inserts disposés dans une région de séparation du plateau de test; une main configurée pour saisir un dispositif à partir de la pluralité d'inserts et procéder au tri; et une unité de commande pour commander le module d'ouverture d'insert et la main de façon à ouvrir la pluralité d'inserts disposés dans différentes régions de partition lorsque la classification du dispositif a été achevée dans la région de partition. Lorsqu'un dispositif est classifié, un manipulateur de test de composant électronique selon la présente invention divise une région plane dans un plateau de test en une région de partition, transfère le plateau de test à chaque région de partition, et effectue une classification, ce qui permet de réduire au minimum le temps d'attente pour la classification d'une main. Par conséquent, l'efficacité de classification peut être maximisée.
PCT/KR2020/004721 2019-04-15 2020-04-08 Manipulateur de test de composant électronique WO2020213874A1 (fr)

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