WO2020213960A1 - Manipulateur de test de composant électronique - Google Patents

Manipulateur de test de composant électronique Download PDF

Info

Publication number
WO2020213960A1
WO2020213960A1 PCT/KR2020/005112 KR2020005112W WO2020213960A1 WO 2020213960 A1 WO2020213960 A1 WO 2020213960A1 KR 2020005112 W KR2020005112 W KR 2020005112W WO 2020213960 A1 WO2020213960 A1 WO 2020213960A1
Authority
WO
WIPO (PCT)
Prior art keywords
shaft
block
hole
test
electronic component
Prior art date
Application number
PCT/KR2020/005112
Other languages
English (en)
Korean (ko)
Inventor
이택선
여동현
유일하
Original Assignee
주식회사 아테코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아테코 filed Critical 주식회사 아테코
Publication of WO2020213960A1 publication Critical patent/WO2020213960A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Definitions

  • the present invention relates to an electronic component test handler, and more particularly, to an electronic component test handler for testing a plurality of electronic components in a high temperature and/or low temperature environment.
  • the electronic component test handler is a device that inspects a plurality of electronic components, for example, semiconductor devices, modules, and SSDs after being manufactured.
  • the electronic component test handler is configured to connect electronic components to a test device, artificially create various environments to check whether the electronic components are operating normally, and classify them into good, re-inspection, and defective products according to the inspection results.
  • distribution is performed by exchanging the user tray in which the device to be tested or the device that has been tested is loaded with the outside, and distribution with the outside must be performed at an appropriate cycle so that the inspection can be continuously performed.
  • Korean Patent Registration No. 1,734,397 (registered on May 02, 2017), filed and registered by the present applicant, is disclosed for such a test handler.
  • the problem to be solved by the present invention is to provide an electronic component test handler in which a test gas supply plate for supplying a test gas and a test tray in which the electronic components are accommodated are stably contacted.
  • An electronic component test handler for solving the above problem includes a push plate having at least one first through-hole through which a test gas is supplied, and elastically supported on one surface of the push plate, and the first A support block having a second through hole corresponding to the through hole, and a support block having a microscopic movement supported on the support block, and provided to correspond to the second through hole to form a discharge flow path for discharging the test gas to the outside Contains matching blocks.
  • the support block may be elastically supported so as to float on one surface of the push plate.
  • a thrust bearing may be interposed between the support block and the matching block so that the matching block can move finely in a plane on the support block.
  • the support block further includes a shaft protruding from one surface and a support pin including a shaft head that forms a step difference with the shaft and extends laterally, wherein the matching block is at least a portion of the shaft protruding from one surface of the support block And a shaft receiving hole for receiving at least a portion of the shaft head and a shaft receiving hole for receiving, so that the matching block can move finely on the support block, and the shaft receiving hole forms a gap with the shaft.
  • the shaft head receiving groove may be formed to form a gap with the shaft head.
  • a bearing is provided between the shaft head and the bottom of the shaft head receiving groove to support a vertical load and to move in a horizontal direction, so that the matching block may move finely in a horizontal direction on the support block.
  • the shaft receiving hole is formed to correspond to the second through hole, and the shaft and the shaft head include a shaft through hole that penetrates in a vertical direction so as to correspond to the first through hole, and the shaft through hole is the discharge Can communicate with the euro.
  • a centering groove formed to decrease in diameter downward is formed on one surface of the support block, and the matching block may include a centering ball that is elastically supported and pressed into the centering groove.
  • the matching block may include an insertion block protruding toward one surface, and the discharge passage may be formed through the insertion block.
  • the insertion block may be elastically supported by the matching block.
  • An insertion guide pin may protrude from one surface of the matching block.
  • test gas supply plate for supplying the test gas and the test tray in which the electronic components are accommodated are stably contacted.
  • FIG. 1 is a conceptual diagram illustrating an electronic component test handler according to an embodiment of the present invention divided into spaces according to functions.
  • FIG. 2 is a conceptual diagram of a test handler body of FIG. 1 divided according to functions on a plane.
  • FIG 3 is a conceptual diagram showing movement of a device and a test tray in a test handler body.
  • FIG. 4 is a front view showing a test gas supply plate according to an embodiment of the present invention.
  • FIG. 5 is a side view showing a test gas supply plate according to an embodiment of the present invention.
  • FIGS. 4 and 5 are perspective views illustrating the matching unit of FIGS. 4 and 5.
  • FIG. 7 is a cross-sectional view illustrating the matching unit of FIG. 6.
  • FIG. 8 is a plan view showing a test tray.
  • 9 and 10 are views for explaining a process in which a test gas supply plate and a test tray are coupled.
  • the user tray and the test tray are trays in which a plurality of loading grooves configured to load semiconductor elements are arranged in a certain arrangement, and the loading grooves of the user tray are placed inside the grooves by gravity without a separate fixing function. It may be configured to be seated in, and the loading groove of the test tray may include a separate fixing member (eg, an insert, etc.) so that the device is not easily separated by gravity or external impact.
  • a separate fixing member eg, an insert, etc.
  • FIG. 1 is a conceptual diagram illustrating an electronic component test handler according to an embodiment of the present invention divided into spaces according to functions.
  • the test handler 1 is configured to carry in the device 20 from the outside, perform a test, and selectively carry out the device 20 for each grade.
  • the test handler 1 moves the stacker and device 20 for carrying in or carrying out a plurality of user trays 10 from the outside according to spatially functional functions from the user tray 10, performing a test, and then performing a test by grade. It may be classified into a test handler body 100, which is an area that is classified and loaded into the user tray 10.
  • the stacker 2 refers to an area in which the user tray 10 can be loaded in a large amount.
  • the stacker may be classified into a loading stacker, an unloading stacker, and an empty stacker according to the loaded device 20.
  • the loading stacker is configured to load the user tray 10 in which devices 20 that need to be tested and sorted are loaded.
  • the loading stacker has a size capable of being loaded in units of one lot in which a plurality of user trays 10 carried from the outside are stacked.
  • the unloading stacker is configured to load a plurality of user trays 10 loaded with a device 20 for carrying out to the outside among the devices 20 that have been tested and sorted before being taken out in units of one lot.
  • the empty stacker is configured so that a plurality of empty user trays 10 can be loaded, and the empty user tray 10 is transferred from the loading stacker after the transfer of the device 20 is completed, or the empty user tray 10 is transferred to the unloading stacker. It may be configured to be able to transport the user tray 10.
  • the loading stacker, the unloading stacker, and the empty stacker may be classified according to logistics to the outside, logistics and loading purposes inside the test handler 1, but their configurations may be the same or similar to each other. .
  • Each stacker module 500 may be configured to stack and stack a plurality of user trays 10 in a vertical direction for efficient use of space.
  • each of the stacker modules 500 is configured to be horizontally moved in the y direction of FIG. 1 to be opened and closed, and distribution with the outside is performed at a position carried out to the outside.
  • a plurality of user trays 10 may be transferred to a loading stacker from an automatic guided vehicle (AGV), or an unmanned transportation vehicle may collect a plurality of user trays 10 from the unloading stacker.
  • AGV automatic guided vehicle
  • the stacker 2 may be configured such that each of the loading stacker, the unloading stacker, and the empty stacker may be set in plural, and internal logistics can be continuously performed even while any one is logistics with the outside.
  • test handler body 100 will be schematically described with reference to FIGS. 2 and 3.
  • FIG. 2 is a conceptual diagram of a test handler body of FIG. 1 divided according to functions on a plane
  • FIG. 3 is a conceptual diagram illustrating movement of a device and a test tray in the test handler body.
  • the test handler body 100 tests a plurality of devices 20, classifies the devices 20 after the test, and transfers and loads the devices 20 before and after the test.
  • the test handler body 100 may be functionally classified, including a loading site (L), a test site (T), and an unloading site (UL).
  • the loading site L is configured to pick up a plurality of devices 20 from the user tray 10 and place them on the test tray 130.
  • the loading site L may be provided with a hand 110 for transferring the device 20 from the user tray 10 to the test tray 130, a loading shuttle 120, and a scanner (not shown) for inspection. .
  • the user trays 10 loaded in the loading stacker may be alternately supplied to the pickup position one by one, and the hand 110, which will be described later, removes only the plurality of devices 20 from the user tray 10 and transfers them.
  • the empty user tray 10 and the user tray 10 in which the devices 20 are loaded are replaced and positioned so that the device 20 can be continuously supplied.
  • the pickup position a plurality of user trays 10 are provided so that the device 20 can be continuously supplied even when all the user trays 10 loaded in any one stacker module 500 have been consumed or a failure occurs. It can be exposed.
  • the other user tray 10 may be configured to wait in a standby state or be replaced with a new user tray 10.
  • the hand 110 is configured to pick up and transfer the plurality of devices 20 and then load them onto the test tray 130 or the loading shuttle 120.
  • the hand 110 may be configured to be in charge of logistics for each transport section.
  • the hand 110 may be installed on the rail to enable horizontal movement of the upper side, and is configured so that the attachment can be viewed toward the lower side, and a linear actuator (not shown) is provided to enable length adjustment in the vertical direction. Can be.
  • the attachment may be provided with a plurality of vacuum ports and may be configured to vacuum-adsorb the plurality of devices 20.
  • the attachment may be configured to be replaceable in consideration of the type, size, and shape of the device 20.
  • the test tray 130 is provided with an insert for each loading groove in consideration of thermal deformation when fixing the device 20 and performing a test, and the interval between the loading grooves may be different from that of the user tray 10.
  • the spacing between the loading grooves of the test tray 130 is configured to be larger than that of the user tray 10. Therefore, after picking up the plurality of devices 20 from the user tray 10 at the pickup position by using the hand 110, the space between the devices 20 is widened and then loaded onto the test tray 130.
  • two interval adjustments may be performed to increase the interval in two directions of xy, and for this purpose, a loading shuttle 120 is provided between the pickup position and the test tray 130, and a loading shuttle from the user tray 10
  • the distance in one direction can be adjusted while being transferred to 120, and the distance in the other direction can be adjusted while transferring from the loading shuttle 120 to the test tray 130.
  • the loading shuttle 120 is provided between the user tray 10 and the test tray 130, and the space between the loading grooves is the user tray 10 so that the plurality of devices 20 can be loaded in a state that is primarily aligned. It may be configured in an array that is widened in one direction. In addition, the loading shuttle 120 may be positioned in consideration of the locations of the user tray 10, the test tray 130, and the hand 110 for efficient logistics.
  • a scanner (not shown) is provided to identify barcodes if they are present on the device 20 to be transferred.
  • the scanner (not shown) may be configured to recognize a barcode on a path through which the hand 110 picks up and transfers the device 20.
  • the scanner may be provided in various positions to facilitate the recognition of barcodes according to the shape, size and type of the device 20.
  • test tray 130 In the place position, an empty test tray 130 is supplied, and the device 20 is transferred and stacked.
  • the test tray 130 is transferred to the test site T afterwards, and a new empty test tray 130 is supplied.
  • a mask and a preciser configured to prevent separation of the device 20 after the device 20 is seated on the test tray 130 may be provided at the place position.
  • the test tray 130 is provided with an insert for each loading groove, and each insert is provided with a locking portion capable of preventing the device 20 from being separated.
  • the basic position of each of the locking portions is set to a position that prevents the device 20 from being separated.
  • the loading of the device 20 in the test tray 130 is performed by expanding the engaging portion of the insert with a mask while pressing the insert with a presizer, and the hand 110 transferring the device 20 to the loading groove.
  • the mask is configured in a shape corresponding to the test tray 130, and a plurality of protrusions are provided so as to expand the locking portions of each insert when in close contact with the test tray 130.
  • the presizer is configured to temporarily fix the insert provided in the test tray 130 in a somewhat spaced state.
  • the presizer is provided with a plurality of pressing pins corresponding to the position of each insert, and the presizer is in close contact with the test tray 130 to press the insert to temporarily fix it with the test tray 130. Therefore, it is possible to minimize the position error when the device 20 is seated on the insert.
  • an elevating unit for independently elevating the mask and the presizer may be additionally provided.
  • the test site T is configured to perform a test on a plurality of devices 20 loaded on the test tray 130 in units of the test tray 130 and transmit the test results.
  • a thermal load test may be performed in which the device 20 is changed to a temperature of -40°C to 130°C to check the function.
  • a test chamber 160 and buffer chambers 150 and 170 provided before and after the test chamber 160 may be provided at the test site T.
  • Each of the buffer chambers 150 and 170 may be configured to be loaded with a plurality of test trays 130, and may be configured to perform preheating or post-heat treatment before and after performing the thermal load test.
  • the test tray 130 may be configured to be transported and tested while the test tray 130 is upright, so that the overall size of the equipment may be reduced. Meanwhile, although the configuration is not shown in detail, an inverter 140 may be provided before and after the buffer chambers 150 and 170 to change the posture of the test tray 130 to an upright state.
  • the unloading site UL is configured to sort, transport, and load the device 20 according to the test result from the test tray 130 transferred from the test site T.
  • the unloading site UL may be provided with elements similar to the configuration of the loading site L, and may be performed in the reverse order of the transfer of the device 20 at the loading site L.
  • a plurality of sorting shuttles 170 may be provided to temporarily collect from the test tray 130 according to grades.
  • a predetermined number of devices 20 of the same grade are loaded in a sorting shuttle (not shown)
  • a plurality of devices may be simultaneously picked up and transferred to the user tray 10.
  • a control unit for controlling driving of the above-described components may be separately provided.
  • test gas supply plate for performing a heat load test on the plurality of devices 20 loaded on the test tray 130 at the test site T will be described.
  • FIG. 4 is a front view showing a test gas supply plate according to an embodiment of the present invention
  • Figure 5 is a side view showing a test gas supply plate according to an embodiment of the present invention.
  • the test gas supply plate 30 is provided in the test chamber 160, and after being in close contact with the test tray 130 transferred from the first buffer chamber 150, a plurality of devices 20 loaded on the test tray 130 ) To provide a test gas for performing the thermal load test.
  • the test gas supply plate 30 includes a push plate 310 and a plurality of matching units 320 installed on one surface of the push plate 310.
  • the push plate 310 may be formed in an area approximately corresponding to the test tray 130, and the matching unit 320 may correspond to each matching block 360 one-to-one with the device 20 accommodated in the test tray 130. Can be installed.
  • FIG. 6 is a perspective view illustrating the matching unit of FIGS. 4 and 5
  • FIG. 7 is a cross-sectional view illustrating the matching unit of FIG. 6.
  • a plurality of first through holes 311 through which a test gas is supplied are formed in the push plate 310.
  • the first through hole 311 may be formed to correspond to the device 20 accommodated in the test tray 130 on a one-to-one basis, and a flow path for transferring the test gas supplied to the back surface of the push plate 310 to the support block 330 Functions as
  • the matching unit 320 includes a support block 330 and a matching block 360.
  • the support block 330 includes a support piece 331 protruding to approximately both sides.
  • An elastic member 332 is installed between the support piece 331 and the push plate 310 so that the support block 330 is elastically supported on the push plate 310.
  • the support piece 331 is installed to maintain a floating state on one surface of the push plate 310 so as not to contact one surface of the push plate 310.
  • the bolt 333 coupled with the push plate 310 through the support piece 331 guides the support piece 331 to move up and down along the bolt 333 and at the same time, the support block 330 of the elastic member 332 It prevents separation by elastic force.
  • a second through hole 334 corresponding to the first through hole 311 is formed in the support block 330.
  • the second through hole 334 is formed through the support block 330 to connect one surface and the rear surface of the support block 330.
  • the support block 330 includes one through hole or three or more The through hole may be formed to correspond to the first through hole 311.
  • a thread for installing a support pin 335 to be described later may be formed on an inner wall of one side of the second through hole 334.
  • the other side of the second through hole 334 may be formed to protrude from the rear surface of the support block 330 toward the first through hole 311, and a second through hole 334 is provided at one side of the first through hole 311.
  • the gap between the support block 330 and the push plate 310 is narrowed, and the other end of the second through hole 334 is received into the expansion part 311a, and the test provided through the first through hole 311 Gas leakage can be minimized.
  • the support block 330 includes a support pin 335.
  • the support pin 335 includes a shaft 335a and a shaft head 335b.
  • the shaft head 335b may be integrally formed at one end of the shaft 335a.
  • the shaft head 335b forms a step difference with the shaft 335a and is formed to extend toward the side of the shaft 335a.
  • the other side of the shaft 335a is formed with a thread corresponding to the thread formed in the inner wall of one side of the second through hole 334.
  • one end of the shaft 335a and the shaft head 335b protrude to one surface of the support block 330 while the shaft 335a is screwed to one side of the second through hole 334 .
  • the shaft 335a is composed of a hollow shaft in which a shaft through hole 335c communicating with the other side of the second through hole 334 is formed, and the shaft through hole 335c extends through the shaft head 335b.
  • One surface of the support block 330 is formed with a tapered centering groove 336 whose diameter is narrowed downward (in the direction of the rear surface of the support block 330 ).
  • the centering groove 336 supports a centering ball 343 to be described later to align the position of the matching block 360. Details on this will be described later.
  • the matching block 360 includes a first matching block 340 and a second matching block 350.
  • the first matching block 340 is formed so that its back surface matches one surface of the support block 330 and is mounted on one surface of the support block 330.
  • the first matching block 340 is not coupled to the support block 330 using a separate fixing member.
  • a shaft receiving hole 341 and a shaft head receiving groove 342 are formed in the first matching block 340.
  • the shaft head receiving groove 342 is recessed from one surface of the first matching block 340, and the shaft receiving hole 341 is recessed from the back surface of the first matching block 340, and the shaft receiving hole 341 and The shaft head receiving grooves 342 are connected to each other and formed to pass through the first matching block 340.
  • the shaft receiving hole 341 may be formed to correspond to the second through hole 334.
  • the shaft receiving hole 341 is formed to receive a portion of the shaft 335a of the support pin 335 that protrudes from one surface of the support block 330.
  • the shaft receiving hole 341 is formed to form a gap with the shaft 335a in the radial direction. That is, the inner diameter of the shaft receiving hole 341 is formed larger than the outer diameter of the shaft (335a).
  • the shaft head receiving groove 342 is formed to receive at least a portion of the shaft head 335b.
  • the shaft head receiving groove 342 is formed to form a gap with the shaft head 335b in the radial direction. That is, the inner diameter of the shaft head receiving groove 342 is formed larger than the outer diameter of the shaft head (335b).
  • the shaft head receiving groove 342 is formed to accommodate one side of the shaft 335a so that a gap is formed between the bottom surface of the shaft head receiving groove 342 and the shaft head 335b.
  • a plurality of bearings 370 are interposed between the bottom surface of the shaft head receiving groove 342 and the shaft head 335b.
  • the plurality of bearings 370 may be radially arranged around the shaft 335a.
  • the diameter of the bearing 370 may be provided substantially equal to the distance between the bottom surface of the shaft head receiving groove 342 and the shaft head 335b.
  • the first matching block within the gap 340 is capable of fine movement in the horizontal direction with respect to the support block 330 based on FIG. 7.
  • FIG. 7 illustrates an example in which a ball-shaped bearing 370 is interposed between the bottom surface of the shaft head receiving groove 342 and the shaft head 335b, but according to the embodiment, the first matching block 340 and the support block The same function may be implemented by installing a thrust bearing between 330.
  • a method of assembling the bearing 370 and the first matching block 340 to the support block 330 may be as follows.
  • the first matching block 340 is mounted on the support block 330.
  • bearings 370 are arranged in a substantially circular shape around the shaft receiving hole 341 on the bottom surface of the shaft head receiving groove 342, and then the shaft 335a of the support pin 335 is inserted into the shaft receiving hole (
  • the support pin 335 is installed on the support block 330 by inserting and rotating it in 341).
  • the support pin 335 is rotated until the shaft head 335b and the bearing 370 abut, so that the vertical direction of the first matching block 340 is limited based on FIG. 7.
  • an accommodation space 345 for accommodating the centering ball 343 and the elastic member 344 is formed on the rear surface of the first matching block 340.
  • the centering ball 343 is configured to protrude from the receiving space 345 to the rear surface of the first matching block 340, and the elastic member 344 is configured to elastically support the centering ball 343.
  • the centering ball 343 is seated on the centering groove 336 of the support block 330, and the elastic member 344 elastically supports the centering ball 343 so that the centering ball 343 presses the centering groove 336. do.
  • the first matching block 340 moves finely in the horizontal direction based on FIG. 7, and then, when the external force is removed, centering
  • the ball 343 is moved to the center of the centering groove 336 by the elastic force of the elastic member 344, and as the centering ball 343 moves, the first matching block 340 and the second matching block 350 Will move with this.
  • the first matching block 340 and the second matching block 350 automatically return to a predetermined home position when the external force is removed by the centering ball 343.
  • the second matching block 350 is mounted on one surface of the first matching block 340 and coupled to the first matching block 380. As shown in FIG. 6, the first matching block 340 and the second matching block 350 may be combined by a bolt 380 to be integrated.
  • At least one insertion block 351 is protruded on one surface of the second matching block 350.
  • the number of insertion blocks 351 formed in the second matching block 350 is It may be one or three or more.
  • the insertion block 351 may be formed to correspond one-to-one with the device 20 accommodated in the test tray 130 to be described later.
  • the second matching block 350 includes a first discharge passage 352 communicating with the second through hole 334 and the shaft through hole 335c, and branching from the first discharge passage 352.
  • a second discharge passage 353 is formed.
  • the first discharge passage 352 extends from the rear surface of the second matching block 350 to the interior of the insertion block 351 and is recessed. As shown in FIG. 7, a portion of the first discharge passage 352 exposed to the rear surface of the second matching block 350 may be formed to have a larger inner diameter than the shaft head 335b. This is to prevent the first discharge passage 352 from being blocked by the shaft head 335b when the push plate 310 is pressed toward the support block 330.
  • the second discharge passage 353 may be formed to be branched from the first discharge passage 352 and open through an edge of one surface of the insertion block 351 as shown in FIGS. 6 and 7.
  • 6 illustrates an example in which the second discharge passage 353 is opened at the centers of the four sides of the insertion block 351, but is not limited thereto, and the second discharge passage 353 includes four corners of the insertion block 351
  • the second discharge passage 353 may not be divided into four, and may be divided into three or less or five or more.
  • a gas diffusion groove 354 connected to an end of the second discharge passage 353 may be formed on one surface of the insertion block 351.
  • One surface of the insertion block 351 may come into contact with the device 20 accommodated in the test tray 130. Even in a state where the one surface of the insertion block 351 and the device 20 contact each other, the test gas is transferred to the second discharge passage 353. It is possible to be discharged through the end of ), and through the gas diffusion groove 354, it is possible to diffuse the test gas to the front surface of the device (20).
  • the insertion block 351 is integrally formed with the second matching block 350, but according to the embodiment, the insertion block 351 is elastically supported by the second matching block 350 and is floated. It can also be configured. In this case, when there is no external force, the insertion block 351 is floated from the second matching block 350 by the elastic force of an elastic member (not shown), and the insertion block 351 is in contact with the device 20 Even if it is additionally pressed toward the device 20, the device 20 is not damaged, the gap between the insertion block 351 and the second matching block 350 is narrowed, and the state in contact with the device 20 can be maintained.
  • an insertion guide pin 355 protrudes on one surface of the second matching block 350.
  • the insertion guide pin 355 is mounted on the test tray 130 and disposed to correspond to the guide hole 131b formed in the insert 131 for fixing the device 20, so that the test gas supply plate 30 130), the insertion guide pin 355 is inserted into the guide hole 131b, and the relative position of the second matching block 350 is aligned so that the insertion block 351 is stably inserted into the insert 131. do.
  • One end of the insertion guide pin 355 is formed to have a wider diameter toward the rear end so that the insertion guide pin 355 is naturally guided into the guide hole 131b.
  • test gas supply plate 30 in the test chamber 160 will be described based on the above-described configuration.
  • FIGS. 9 and 10 are views for explaining a process in which a test gas supply plate and a test tray are combined.
  • the test tray 130 is equipped with a plurality of inserts 131.
  • a device receiving hole 131a for accommodating the device 20 is formed in a central portion, and a guide hole 131b is formed around the device receiving hole 131a.
  • the plurality of inserts 131 are configured to be detachable from the test tray 130, and other inserts 131 may be mounted on the test tray 130 according to the type of the device 20 to be tested. Although not shown, each insert 131 may be provided with a configuration capable of fixing/releasing the device 20.
  • the plurality of devices 20 transferred through the user tray 10 and the loading shuttle 120 are inserted and fixed into the insert 131 mounted on the test tray 130.
  • the test tray 130 is transferred to the test chamber 160 through the first buffer chamber 150.
  • the first buffer chamber 150 may preheat or precool the test tray 130 and the device 20 in an intermediate temperature atmosphere between room temperature and a test temperature to be performed in the test chamber 160.
  • the test gas supply plate 30 is provided in the test chamber 160, and as shown in FIG. 9, the test tray 130 transferred from the first buffer chamber 150 into the test chamber 160 is a test gas. It faces the supply plate 30. More specifically, the test tray 130 faces the test gas supply plate 30 so that the insertion blocks 351 are aligned with the device 20.
  • test tray 130 faces the test gas supply plate 30, and although not shown, the rear surface of the test tray 130 contacts each device 20 to receive an electrical signal from each device 20.
  • the member may support the test tray 130.
  • the push plate 310 is advanced toward the test tray 130 by a separate pressing unit (not shown) provided in the test chamber 160, and as shown in FIG. 10, the insertion blocks 351 are each insert It is inserted into the device receiving hole 131a of 131.
  • the insertion guide pin 355 is inserted into the guide hole 131b of the insert 131 and guides the insertion block 351 and the device 20 to align with each other.
  • the push plate 310 is pressed so that one surface of the second matching block 350 comes into contact with one surface of the test tray 130 and one surface of the insert 131. At this time, one surface of the insertion block 351 may be in contact with or adjacent to the device 20.
  • the flatness of the push plate 310 and the test tray 130 is not ideal, and due to load, thermal expansion and contraction, one surface of the plurality of second matching blocks 350 and the test tray 130 The faces that one faces contact with may not exist on one perfect plane.
  • one surface of the plurality of second matching blocks 350 and one surface of the test tray 130 due to manufacturing errors and tolerances occurring in each of the plurality of matching units 320 assembled on the push plate 310 This mating surface may not exist on one perfect plane.
  • the surface where one surface of the plurality of second matching blocks 350 and the one surface of the test tray 130 abuts is a perfect one. It may not exist on the plane.
  • the devices 20 may not exist on one perfect plane.
  • test gas supply plate 30 Since the test gas supply plate 30 according to the present embodiment is elastically supported in a state in which the support block 330 is floating on the push plate 310, the above-described manufacturing error, tolerance, load, thermal expansion and contraction, etc. Despite the deformation, the second matching block 350 is brought into contact with one surface of the test tray 130 and one surface of the insert 131 stably and reliably.
  • the insertion block ( 351 is stably inserted into the device receiving hole 131a.
  • the insertion block 351 is elastically supported by the second matching block 350 and is configured to float, the insertion block 351 is provided even though the depths of the devices 20 supported by the insert 131 are different. The state in contact with one surface of the device 20 can be maintained.
  • test gas is supplied to the test gas supply plate 30 through the first through hole 311.
  • the test gas supplied through the first through hole 311 is transferred from the support block 330 to the second matching block 350 through the second through hole 334 and the shaft through hole 335c, and then the second It is discharged to the device 20 in contact with or adjacent to one surface of the insertion block 351 through the discharge flow paths 352 and 353 of the matching block 350.
  • a gas having a temperature of below zero or 100° C. or higher may be used depending on the environment in which the device 20 is tested.
  • a member (not shown) that is electrically connected to the device 20 on the back side of the test tray 130 supplies power to the device 20 and measures the electrical signal output from the device 20 at the same time. Checks whether is working normally in the test environment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Un mode de réalisation de la présente invention concerne un manipulateur de test de composant électronique comprenant : une plaque de poussée possédant au moins un premier trou traversant formé à l'intérieur de cette dernière à travers lequel un gaz de test est fourni ; un bloc de maintien maintenu élastiquement sur une surface de la plaque de poussée et possédant un second trou traversant formé à l'intérieur de ce dernier qui correspond au premier trou traversant ; et un bloc d'adaptation maintenu sur le bloc de maintien de façon à être mobile de façon précise, et possédant un trajet d'écoulement de décharge formé à l'intérieur de ce dernier, correspondant au second trou traversant afin de permettre au gaz de test d'être évacué vers l'extérieur.
PCT/KR2020/005112 2019-04-15 2020-04-16 Manipulateur de test de composant électronique WO2020213960A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190043950A KR102239739B1 (ko) 2019-04-15 2019-04-15 전자부품 테스트 핸들러
KR10-2019-0043950 2019-04-15

Publications (1)

Publication Number Publication Date
WO2020213960A1 true WO2020213960A1 (fr) 2020-10-22

Family

ID=72837490

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2020/005112 WO2020213960A1 (fr) 2019-04-15 2020-04-16 Manipulateur de test de composant électronique

Country Status (2)

Country Link
KR (1) KR102239739B1 (fr)
WO (1) WO2020213960A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080002841U (ko) * 2007-01-22 2008-07-25 (주)테크윙 테스트핸들러의 매치플레이트용 푸셔블록
KR20100124544A (ko) * 2009-05-19 2010-11-29 미래산업 주식회사 테스트 핸들러용 소자 접속장치 및 이를 이용한 테스트 핸들러
KR101086934B1 (ko) * 2007-10-05 2011-11-29 물티테스트 엘렉트로니쉐 지스테메 게엠베하 전자 소자의 고정 및 이동을 위한 플런저
KR101272630B1 (ko) * 2011-08-29 2013-06-10 주식회사 티에프이 테스트 핸들러용 자동 정렬 접촉연결유닛
KR20150014357A (ko) * 2013-07-26 2015-02-06 (주)테크윙 테스트핸들러의 매치플레이트용 푸셔조립체

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080002841U (ko) * 2007-01-22 2008-07-25 (주)테크윙 테스트핸들러의 매치플레이트용 푸셔블록
KR101086934B1 (ko) * 2007-10-05 2011-11-29 물티테스트 엘렉트로니쉐 지스테메 게엠베하 전자 소자의 고정 및 이동을 위한 플런저
KR20100124544A (ko) * 2009-05-19 2010-11-29 미래산업 주식회사 테스트 핸들러용 소자 접속장치 및 이를 이용한 테스트 핸들러
KR101272630B1 (ko) * 2011-08-29 2013-06-10 주식회사 티에프이 테스트 핸들러용 자동 정렬 접촉연결유닛
KR20150014357A (ko) * 2013-07-26 2015-02-06 (주)테크윙 테스트핸들러의 매치플레이트용 푸셔조립체

Also Published As

Publication number Publication date
KR102239739B1 (ko) 2021-04-13
KR20200121194A (ko) 2020-10-23

Similar Documents

Publication Publication Date Title
EP2772768B1 (fr) Testeur d'électronique muni d'une carte de distribution de signaux et d'un support de tranche ayant différents coefficients de dilatation thermique
WO2020213874A1 (fr) Manipulateur de test de composant électronique
US7400161B2 (en) Electronic device test system
JPH10232262A (ja) 半導体デバイスのテスト用搬送装置
WO2016182352A1 (fr) Manipulateur d'élément
JP2021141143A (ja) 検査装置
WO2020213961A1 (fr) Appareil de transfert de plateau
WO2020213960A1 (fr) Manipulateur de test de composant électronique
WO2018012783A1 (fr) Plaque de mandrin pour post-traitement de semi-conducteurs, structure de mandrin comportant ladite plaque de mandrin et appareil de séparation de puces comportant ladite structure de mandrin
WO2020213873A1 (fr) Manipulateur de test de composant électronique comprenant une fonction balayage en survol
WO2019203544A1 (fr) Manipulateur de dispositif
WO2016085206A1 (fr) Gestionnaire de test
WO2020213878A1 (fr) Empileur de manipulateur de test de composant électronique et manipulateur de test de composant électronique le comprenant
WO2023074947A1 (fr) Appareil de verrouillage de cartouche pour multi-sondeur
WO2020213880A1 (fr) Empileur de manipulateurs de test de composant électronique, et manipulateurs de test de composant électronique le comprenant
WO2020050645A1 (fr) Carte sonde pour vérification électrique, et tête de sonde de carte sonde
WO2021006627A1 (fr) Appareil d'inspection d'element
WO2022050453A1 (fr) Appareil d'alignement de cartouche pour sondeur multiple
WO2014003238A1 (fr) Ensemble insert et appareil d'installation de composant électronique
US20080048158A1 (en) Pressing Member and Electronic Device Handling Apparatus
WO2019245354A1 (fr) Appareil de tri de dispositifs
WO2019172660A1 (fr) Manipulateur de dispositif
WO2021215786A1 (fr) Carte sonde
WO2020213876A1 (fr) Manipulateur de test de composant électronique ayant une fonction d'inspection de plateau de test par procédé visionique
WO2019066256A1 (fr) Cartouche de test de substrats et procédé de fabrication associé

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20791142

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20791142

Country of ref document: EP

Kind code of ref document: A1