KR20170140963A - Wireless movement module, and device handler having the same - Google Patents

Wireless movement module, and device handler having the same Download PDF

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KR20170140963A
KR20170140963A KR1020160073776A KR20160073776A KR20170140963A KR 20170140963 A KR20170140963 A KR 20170140963A KR 1020160073776 A KR1020160073776 A KR 1020160073776A KR 20160073776 A KR20160073776 A KR 20160073776A KR 20170140963 A KR20170140963 A KR 20170140963A
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module
guide robot
movement
unit
communication module
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Korean (ko)
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유홍준
이용식
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(주)제이티
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Priority to KR1020160073776A priority Critical patent/KR20170140963A/en
Priority to PCT/KR2017/006215 priority patent/WO2017217771A1/en
Priority to TW106119877A priority patent/TWI652216B/en
Publication of KR20170140963A publication Critical patent/KR20170140963A/en
Priority to KR1020230188643A priority patent/KR20230175174A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)

Abstract

The present invention relates to a wireless mobile module, and more specifically, to a wireless mobile module and a device handler having the same installed therein configured to guide the movement of function modules. To this end, the wireless mobile module includes: a functional module (200) for performing a predetermined function; a guide robot (100) for guiding the movement of the functional module (200); a power supply portion (120) coupled to the guide robot (100) and supplying power to the functional module (200); and a movement driving portion (300) for moving the functional module (200) along the guide robot (100).

Description

무선이동모듈, 그가 설치된 소자핸들러 {Wireless movement module, and device handler having the same}A wireless movement module, and a device handler having the wireless communication module,

본 발명은 무선이동모듈에 관한 것으로서, 보다 상세하는 소자 픽업, 이미지 획득 등 미리 설정된 기능을 수행하는 기능모듈의 이동을 가이드하는 무선이동모듈 및 그가 설치된 소자핸들러에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wireless mobile module, and more particularly, to a wireless mobile module for guiding the movement of a function module performing a predetermined function such as element pickup and image acquisition, and a device handler equipped with the wireless mobile module.

SD 램, 프래쉬램, LSI, LED 등 반도체소자(이하 '소자'라 한다)는 반도체공정을 마친 후 소잉공정, 패키징공정 등을 마친 후 시장에 출하됨이 일반적이다.Semiconductor devices (hereinafter referred to as "devices") such as SD RAM, flash ram, LSI, and LED are generally shipped to the market after completion of the semiconductor process, the sowing process, and the packaging process.

그리고 시장에 출하된 제품에 대한 신뢰성을 확보하기 위하여 검사장치, 분류장치, 검사 및 분류장치 등에 의하여 자동검사 및 검사결과에 따른 분류를 통하여 양품의 제품들을 선별하여 시장에 출하하고 있다.In order to ensure the reliability of the products shipped to the market, the products of good products are selected and shipped to the market by sorting according to the automatic inspection and inspection result by inspection apparatus, sorting apparatus, inspection and sorting apparatus.

또한 소자는 SD 램, 프래쉬램, LSI 등 리드프레임, BGA 등 단자구조가 다양해지는 등 칩의 종류가 다양해지고 있다.In addition, chip types such as SDRAM, flash RAM, LSI, lead frame, BGA, etc., are becoming diverse.

최근에는 소자에 대한 소형화 및 고집적화 요구에 따라서 소자가 수지 등에 의한 몰딩공정을 거치지 않고 웨이퍼 레벨에서 최종 제품화되는 것이 확대되고 있는 추세이다.In recent years, there has been an increasing tendency that devices are made into final products at a wafer level without being subjected to a molding process using a resin or the like in accordance with the demand for miniaturization and high integration of devices.

한편 SD램, 모바일SD램, 모바일CPU와 같은 LSI와 같은 반도체 시장에서 경쟁이 격화되면서 소자제조비용의 절감될 필요가 있으며 궁극적으로 생산성을 높이는 것이 매우 절실하다.Meanwhile, as competition intensifies in semiconductor markets such as SDRAM, mobile SDRAM, and mobile CPU, it is necessary to reduce device manufacturing costs and ultimately increase productivity.

그리고 반도체 생산은 시설투자 비용이 높은 클린룸 내에서 공정이 수행되는것이 일반적이며, 각 공정을 수행하는 장비의 처리속도가 생산성에 직결되는바, 패키징 공정을 거치지 않거나 수행 전인 웨이퍼 수준에서의 소자를 언로딩하는 소자핸들러 또한 장비의 처리속도를 높이는 것이 중요하다.Semiconductor production is generally performed in a clean room where the investment cost of the facility is high. Since the processing speed of the equipment performing each process is directly related to the productivity, it is difficult to perform the process at the wafer level It is also important to increase the processing speed of the device by unloading the device handler.

특히 반도체 생산은 웨이퍼 수준에서 소자를 언로딩하는 소자핸들러 또한 장비의 처리속도를 높이는 것이 중요하며, 소자의 픽업 및 이송을 수행하는 이동장치의 성능이 소자핸들러의 처리속도의 중요한 요소이다.Particularly in semiconductor production, it is important to increase the processing speed of the device and also to improve the processing speed of the device handler.

또한 최근 핸들링 대상인 소자의 크기가 매우 작아짐에 따라, 극소형의 소자의 픽업 및 이송에 대한 이동장치의 정밀도가 크게 요구된다.In addition, since the size of a device to be handled recently becomes very small, a precision of a mobile device for picking up and transporting a very small device is greatly required.

한편 이동장치는 하나 이상의 픽커들을 구비하며, 픽커는, 일반적으로, 이송툴에 하나 이상으로 설치되어 소자를 흡착하는 기구로서, 내부에 진공압이 작용되는 흡입통로가 형성되고 일단에 소자가 흡착되는 흡착부가 결합되는 로드와, 로드를 상하방향으로 이동시키기 위한 상하구동부가 구비된다.On the other hand, the mobile device has at least one picker, and the picker is generally a mechanism for attracting the elements by being installed at one or more in the conveying tool, in which a suction passage in which vacuum pressure is applied is formed, A rod to which the suction unit is coupled, and a vertical drive unit for moving the rod in the vertical direction.

한편 종래의 픽커는, 픽업 위치에서 소자 픽업시 흡착부에 진공압, 즉 부압을 형성하여 소자를 픽업하며, 흡착부에 진공압을 해제함으로써 적재 위치에서 소자를 적재한다.On the other hand, a conventional picker picks up a device by forming a vacuum pressure, that is, a negative pressure in a suction part when picking up a device at a pickup position, and loads the device at the loading position by releasing vacuum pressure to the suction part.

특히 종래의 픽커는, 적재 위치에서 소자의 신속한 적재를 위하여 흡착부에 정압을 형성함이 일반적이다.Particularly, the conventional picker generally forms a static pressure on the adsorption part for rapid loading of the element at the loading position.

그런데, 엘이디소자와 같이 소자의 크기가 미세화되면서 종래의 픽커에 있어서 소자를 흡착하는 흡착부에 정압을 형성하는 경우 소자가 비산되거나, 적재 위치에 올바른 상태로 적재되는 것이 방해되는 문제점이 있다.However, when the static pressure is formed in the adsorbing portion for adsorbing the element in the conventional picker, the element is scattered or the load is not properly loaded at the loading position.

또한, 픽커의 흡착헤드까지 정압이 전달되는데 일정 시간이 소요되는데 신속한 소자처리가 요구되는 추세에 대응하지 못하여 장치의 처리속도를 향상시키는데 제한을 주는 문제점이 있다.Further, it takes a certain period of time to transmit the positive pressure to the picking head of the picker, but it can not cope with a tendency to require rapid processing of the elements, thereby limiting the improvement of the processing speed of the apparatus.

구체적으로 픽커의 흡착헤드에 정압 또는 부압은, 공압전달선에 의하여 형성되는데 공압전달선을 통한 정압 또는 부압형성시간은 공압전달선의 길이에 의하여 결정되는바 정압 또는 부압형성시간을 단축시키기 위하여 공압전달선의 길이를 최소화하는데 한계가 있으며, 결국 장치의 처리속도의 제한으로서 작용하는 문제점이 있다.Specifically, the positive or negative pressure on the adsorption head of the picker is formed by a pneumatic transmission line. The formation time of the positive pressure or the negative pressure through the pneumatic conveyance line is determined by the length of the pneumatic conveyance line. In order to shorten the formation time of the positive pressure or the negative pressure, There is a limit in minimizing the length of the line, which ultimately has a problem of acting as a limitation of the processing speed of the apparatus.

한편 이송 대상인 소자의 크기가 미세화되면서, 소자 이송을 위한 픽커의 크기가 작아지면서 착탈의 편의, 유지보수의 편의, 내구성의 증대 등 다양한 이슈가 제기되고 있다.On the other hand, as the size of a device to be transported becomes finer, the size of a picker for transporting a device becomes smaller, and various issues such as convenience of attachment and detachment, convenience of maintenance and increase of durability have been raised.

또한 소자 생산성 증대를 위하여, 종래에 비하여 보다 빠른 소자처리의 요구에 부응하여, 픽커의 성능으로서 소자의 이송을 위한 픽커 또한 픽업위치에서 적재위치로의 빠른 이동, 보다 신속한 소자픽업 및 소자적재를 요구하고 있다.Also, in order to increase the device productivity, the picker for transporting the device as the performance of the picker needs to move quickly from the pick-up position to the loading position, more quickly pick up the device and load the device, .

(특허문헌 1) KR10-2010-0081277 A (Patent Document 1) KR10-2010-0081277 A

(특허문헌 2) KR10-0580816 B(Patent Document 2) KR10-0580816 B

(특허문헌 3) KR10-0443039 B(Patent Document 3) KR10-0443039 B

(특허문헌 4) KR10-2004-0096409 A(Patent Document 4) KR10-2004-0096409 A

(특허문헌 5) KR10-2011-0051301 A(Patent Document 5) KR10-2011-0051301 A

(특허문헌 6) KR10-2012-0047879 A(Patent Document 6) KR10-2012-0047879A

(특허문헌 7) KR10-2016-0048628 A(Patent Document 7) KR10-2016-0048628 A

(특허문헌 7) KR10-1134985 B(Patent Document 7) KR10-1134985 B

본 발명의 목적을 상기와 같은 문제점을 해결하기 위하여, 픽커, 카메라 등 미리 설정된 기능을 수행하는 기능모듈에 대하여 무선전원공급 및 무선제어가 가능한 무선이동모듈 및 그를 가지는 소자핸들러를 제공하는데 있다.In order to solve the above-described problems, the present invention provides a wireless mobile module capable of wireless power supply and wireless control of a function module performing a predetermined function such as a picker and a camera, and a device handler having the wireless mobile module.

본 발명은 상기와 같은 본 발명의 목적을 달성하기 위하여 창출된 것으로서, 본 발명은, 미리 설정된 기능을 수행하는 기능모듈(200)과; 상기 기능모듈(200)의 이동을 가이드하는 가이드로봇(100)과; 상기 가이드로봇(100)에 결합되어 상기 기능모듈(200)에 대하여 전원을 공급하는 전원공급부(120)와; 상기 가이드로봇(100)을 따라서 상기 기능모듈(200)을 이동시키는 이동구동부(300)를 포함하는 것을 특징으로 하는 무선이동모듈을 개시한다.The present invention has been made in order to accomplish the above-mentioned object of the present invention, and it is an object of the present invention to provide an information processing apparatus, A guide robot 100 for guiding the movement of the functional module 200; A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200; And a movement driver (300) for moving the functional module (200) along the guide robot (100).

상기 기능모듈(200)은, 진공압에 의하여 소자(20)를 픽업하는 하나 이상의 픽커(410) 및 하나 이상의 카메라(533) 중 적어도 하나를 포함하는 작동부(400)와, 상기 작동부(400)의 작동제어를 위한 제어신호를 무선에 의하여 메인제어부로부터 수신하여 상기 작동부(400)를 제어하는 무선제어부(220)를 포함할 수 있다.The functional module 200 includes an actuating part 400 including at least one of at least one picker 410 and at least one camera 533 for picking up the element 20 by vacuum pressure, And a radio control unit 220 for receiving the control signal for controlling the operation of the operation unit 400 from the main control unit by radio and controlling the operation unit 400.

상기 무선제어부(220)는, 지그비통신모듈, 블루투스통신모듈, Wifi통신모듈, 기가와이파이통신모듈, 적외선통신모듈, LTE통신모듈 및 2.5Ghz무선통신모듈 중 적어도 하나를 포함할 수 있다.The wireless controller 220 may include at least one of a Zigbee communication module, a Bluetooth communication module, a Wifi communication module, a Gigabit WiFi communication module, an infrared communication module, an LTE communication module, and a 2.5 GHz wireless communication module.

상기 가이드로봇(100)은, 상기 기능모듈(200)에 대한 직선, 곡선 및 폐곡선 형상 중 적어도 하나의 이송경로를 가질 수 있다.The guide robot 100 may have at least one of a straight line, a curved line, and a closed curve shape with respect to the functional module 200.

상기 가이드로봇(100)은, 상기 기능모듈(200)에 대한 X-Y가이드로봇 또는 X-Y-θ로봇이 사용될 수 있다.The guide robot 100 may be an X-Y guide robot or an X-Y-? Robot for the function module 200.

본 발명에 따른 무선이동모듈 및 그가 설치된 소자핸들러는, 픽커, 카메라 등 기능모듈이 결합되고 기능모듈이 무선전원공급 및 무선통신에 의하여 제어됨으로써 전원공급선, 제어를 위한 신호전달선 등을 제거하여 장치의 구조를 간소화하여 조립 및 동작제어가 용이하며 각 부품의 노후화에 따른 유지보수비용을 현저하게 절감할 수 있는 이점이 있다.A wireless mobile module and a device handler equipped with the wireless mobile module according to the present invention are characterized in that function modules such as a picker and a camera are combined and a function module is controlled by wireless power supply and wireless communication to remove a power supply line and a signal transmission line for control, So that the assembly and operation control are easy and the maintenance cost due to the deterioration of each component can be remarkably reduced.

또한 본 발명에 따른 본 발명에 따른 무선이동모듈 및 그가 설치된 소자핸들러는, 복수의 픽커들, 카메라와 같이 복수의 기능모듈의 작동 및 제어에 있어 외부와의 연결을 최소화함으로써 제조가 간단하며, 외부와의 연결수단의 수를 최소화하여 부품의 마모, 손상 등으로 인한 유지보수를 최소화할 수 있는 이점이 있다.The wireless mobile module according to the present invention and the device handler equipped with the same according to the present invention can be easily manufactured by minimizing the connection with the outside in the operation and control of a plurality of function modules such as a plurality of pickers and a camera, So that the maintenance and repair due to the wear and damage of the parts can be minimized.

도 1은, 본 발명에 따른 무선이동모듈의 구성을 보여주는 블록도이다.
도 2는, 도 1의 무선이동모듈의 일 실시예를 보여주는 사시도이다.
도 3은, 도 2의 무선이동모듈의 일 실시예를 보여주는 일부측면도이다.
도 4는, 도 3에서 Ⅱ-Ⅱ 방향의 측단면도이다.
도 5a 및 도 5는, 도 3의 무선이동모듈의 형상의 예들을 보여주는 평면도이다.1 is a block diagram illustrating a configuration of a wireless movement module according to the present invention.
2 is a perspective view illustrating an embodiment of the wireless movement module of FIG.
3 is a partial side view illustrating an embodiment of the wireless movement module of FIG.
Fig. 4 is a side sectional view in the II-II direction in Fig. 3; Fig.
5A and 5 are plan views showing examples of the shape of the wireless movement module of FIG.

이하 본 발명에 따른 무선이동모듈 및 그가 설치된 소자핸들러에 관하여 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, a wireless mobile module and a device handler equipped with the wireless mobile module according to the present invention will be described with reference to the accompanying drawings.

본 발명은, 장치 내에서 소자핸들러용 픽커, 카메라 등의 기능모듈(200)에 대한 무선전원공급 및 무선제어가 가능한 것을 특징으로 하다.The present invention is characterized by being capable of wireless power supply and wireless control of a function module (200) such as a picker for a device handler, a camera, and the like in the device.

그리고 본 발명의 적용 분야는 소자의 분류, 검사 등을 수행하는 소자핸들러는, 물론 미리 설정된 기능을 수행하는 기능모듈에 대한 무선전원공급 및 무선제어가 가능한 구성이면 무선이동모듈로서 제한이 없음은 물론이다.The application field of the present invention is not limited to the wireless mobile module as long as the device handler for performing classification, inspection and the like of the device is capable of wireless power supply and radio control for a function module performing a preset function, to be.

한편 본 발명에 따른 무선이동모듈은, 도 1 및 도 2에 도시된 바와 같이, 미리 설정된 기능을 수행하는 기능모듈(200)과; 기능모듈(200)의 이동을 가이드하는 가이드로봇(100)과; 가이드로봇(100)에 결합되어 기능모듈(200)에 대하여 전원을 공급하는 전원공급부(120)와; 가이드로봇(100)을 따라서 기능모듈(200)을 이동시키는 이동구동부(300)를 포함한다.1 and 2, the wireless mobile module according to the present invention includes a function module 200 performing a predetermined function; A guide robot 100 for guiding the movement of the function module 200; A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200; And a movement driver 300 for moving the function module 200 along the guide robot 100.

상기 기능모듈(200)은, 미리 설정된 기능을 수행하는 구성으로서, 소자핸들러의 경우 진공압에 의한 소자픽업을 수행하는 픽업툴, 소자 등에 대한 이미지를 획득하는 이미지획득부 등 미리 설정된 기능을 수행하는 모듈이 될 수 있다.The function module 200 performs a preset function such as a pick-up tool for performing element pickup by vacuum pressure in case of a device handler, an image obtaining unit for obtaining an image of a device, etc. Module.

상기 가이드로봇(100)은, 기능모듈(200)의 이동을 가이드하는 구성으로서 기능모듈(200)의 이동을 가이드 할 수 있는 구성이면 어떠한 구성도 가능하다.The guide robot 100 may be configured to guide the movement of the function module 200 as long as the guide robot 100 can guide the movement of the function module 200.

상기 가이드로봇(100)은, 기능모듈(200)에 대한 직선, 곡선 및 폐곡선 형상 중 적어도 하나의 이송경로 등 다양한 구조의 이송경로를 가질 수 있다.The guide robot 100 may have a transfer path having various structures such as at least one of a straight line, a curved line, and a closed curve shape with respect to the functional module 200.

이러한 다양한 이송경로의 구현을 위하여, 가이드로봇(100)은, 기능모듈(200)의 X축방향, Y축방향, Z축방향 등의 선형이동을 가이드하는 선형이동로봇, X-Y방향의 선형이동을 가이드하는 X-Y이동로봇, X-Y-Z방향의 선형이동을 가이드하는 X-Y-Z이동로봇, X-Y-θ이동을 가이드하는 X-Y-θ이동로봇 등 그 이동방식에 따라서 다양한 구성이 가능하다.In order to realize such various transport paths, the guide robot 100 is a linear moving robot for guiding the linear movement of the functional module 200 in the X-axis direction, the Y-axis direction, the Z-axis direction, etc., The XY-mobile robot for guiding, the XYZ mobile robot for guiding the linear movement in the XYZ direction, and the XY-theta mobile robot for guiding the movement of the XY-theta can be configured in various ways according to the movement mode.

상기 전원공급부(120)는, 가이드로봇(100)에 결합되어 기능모듈(200)에 대하여 전원을 공급하는 구성으로서 기능모듈(200)이 가이드로봇(100)에 설치된 이송경로 상에서 이동이 가능한 상태에서 기능모듈(200)에 대하여 전원을 공급할 수 있는 구성이면 어떠한 구성도 가능하다.The power supply unit 120 is connected to the guide robot 100 and supplies power to the function module 200. The power supply unit 120 is configured such that the function module 200 can be moved on a conveyance path provided on the guide robot 100 Any configuration is possible as long as it can supply power to the function module 200.

예로서, 상기 전원공급부(120)는, 가이드로봇(100)에 설치된 이송경로를 따라서 설치된 급전라인(미도시)으로 구성되고, 이때 기능모듈(200)에는 급전라인과 접촉되어 전원을 공급받는 전원수신단자가 설치될 수 있다.For example, the power supply unit 120 may include a feeder line (not shown) provided along a feed path provided in the guide robot 100. At this time, the function module 200 is connected to a power supply line A receiving terminal may be installed.

또 다른 예로서, 상기 전원공급부(120)는, 무선에 의한 전력전달, 즉 자기유도방식, 자기공진방식 등 다양한 방식에 의하여 무선으로 기능모듈(200)에 전원을 공급할 수 있다.As another example, the power supply unit 120 may supply power to the function module 200 wirelessly by various methods such as wireless power transmission, that is, a magnetic induction method or a self-resonance method.

또한 상기 전원공급부(120)는, 접촉에 의한 전력전달 및 비접촉(전자기 유도 등)에 의한 전력전달의 조합에 의하여 기능모듈(200)로 전원을 공급할 수 있다.Also, the power supply unit 120 may supply power to the function module 200 by a combination of power transmission by contact and power transmission by non-contact (electromagnetic induction, etc.).

구체적인 예로서, 도 2에 도시된 바와 같이, 가이드로봇(100)이 X-Y로봇으로 구성된 경우, Y축 가이드부재(102)로부터 X축 가이드부재(101)로는 접촉에 의한 전력전달 방식으로 전력을 1차로 전달하고, X축 가이드부재(101)로부터 기능모듈(200)로는 비접촉방식, 예를 들면 자기유도방식, 자기공진방식 등 비접촉에 의한 전력잔달방식으로 기능모듈(200)에 전력을 전달할 수 있다.2, when the guide robot 100 is constituted by an XY robot, electric power is transmitted from the Y-axis guide member 102 to the X-axis guide member 101 in a power transmission manner by 1 And the electric power can be transmitted from the X-axis guide member 101 to the function module 200 in a non-contact manner, for example, a magnetic induction system, a magnetic resonance system, .

한편 상기 전원공급부(120)는, 실시간에 의한 전력전달 이외에 기능모듈(200)에 결합되어 전원을 공급하는 충전 배터리를 포함할 수 있다.Meanwhile, the power supply unit 120 may include a rechargeable battery coupled to the functional module 200 to supply power in addition to real-time power transfer.

상기 이동구동부(300)는, 가이드로봇(100)을 따라서 기능모듈(200)을 이동시키는 구성으로서 다양한 구성이 가능하다.The movement driving unit 300 may be configured in various manners as a configuration for moving the function module 200 along the guide robot 100.

상기 이동구동부(300)는, 스크류잭, 리니어모듈 등 선형이동모듈 등 기능모듈(200)의 이동방식에 따라서 다양한 구성이 가능하다.The movement driving unit 300 may have various configurations according to the movement mode of the function module 200, such as a linear movement module such as a screw jack and a linear module.

특히 상기 이동구동부(300)는, 결합구조에 의한 기계식 구동구조 이외에 자력에 의한 비접촉 구동구조를 가지는 등 다양한 구성이 가능하다.In particular, the movement driving unit 300 may have various structures including a non-contact driving structure by a magnetic force in addition to a mechanical driving structure by a coupling structure.

이하 본 발명에 따른 무선이동모듈이 소자핸들러에 적용된 예로서, 도 3 내지 도 5를 참조하여 설명한다.Hereinafter, an example in which the wireless mobile module according to the present invention is applied to a device handler will be described with reference to FIGS. 3 to 5. FIG.

본 발명에 따른 무선이동모듈로서, 소자핸들러에 적용된 무선이동모듈은, 도 3 내지 도 5b에 도시된 바와 같이, 미리 설정된 기능을 수행하는 기능모듈(200)과; 기능모듈(200)의 이동을 가이드하는 가이드로봇(100)과; 가이드로봇(100)에 결합되어 기능모듈(200)에 대하여 전원을 공급하는 전원공급부(120)와; 가이드로봇(100)을 따라서 기능모듈(200)을 이동시키는 이동구동부(300)를 포함한다.As a wireless mobile module according to the present invention, a wireless mobile module applied to a device handler includes a function module 200 performing a preset function, as shown in FIGS. 3 through 5B; A guide robot 100 for guiding the movement of the function module 200; A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200; And a movement driver 300 for moving the function module 200 along the guide robot 100.

여기서 본 발명에 따른 소자핸들러 이동장치가 사용되는 소자핸들러는, 반도체소자(10)의 검사 및 분류, 미리 검사된 반도체소자의 분류 등 반도체소자의 후공정을 수행하는 장치로서, 소자소터, 소자검사장치 등 다양한 장치가 될 수 있다.The device handler in which the device handler moving apparatus according to the present invention is used is an apparatus for performing a post-process of a semiconductor element such as inspection and classification of a semiconductor element 10 and classification of a semiconductor element inspected in advance, Devices, and the like.

그리고, 반도체소자는, 반도체공정을 마친 후 패키징 공정을 마친 소자, 웨이퍼 수준에서 칩으로 이루어진 WLCSP 등 반도체 공정을 마친 후 기판 등에 설치되어 미리 설계된 사양에 따라 특정 기능을 수행하는 칩으로서 다양한 소자가 그 대상이 될 수 있다.A semiconductor device is a chip that performs a specific function according to a pre-designed specification which is installed on a substrate after a semiconductor process such as WLCSP, which is a wafer-level chip, is completed after a semiconductor process is completed, It can be a target.

상기 가이드로봇(100)은, 기능모듈(200)의 이동을 가이드하는 구성으로서, 소자핸들러 상에서 무선이동모듈의 이송을 위한 경로를 구성하며, 무선이동모듈의 이송경로에 따라서 다양한 구성이 가능하다.The guide robot 100 guides the movement of the function module 200 and constitutes a path for transferring the wireless movement module on the element handler. The guide robot 100 can have various configurations according to the transport path of the wireless movement module.

예로서, 상기 가이드로봇(100)은, 도 3에 도시된 바와 같이, 직선 형상을 가지거나, 직선 형상 이외에 곡선, 폐곡선 형상 등 다양한 형상을 가질 수 있다.For example, as shown in FIG. 3, the guide robot 100 may have a linear shape, or may have various shapes such as a curved line, a closed curve, and the like.

그리고 상기 가이드로봇(100)은, 폐곡선 형상을 가지는 경우 다각형, 원형, 타원형, 도 5a에 도시된 바와 같이, 직사각형의 양단에 반원형상이 결합된 형상, 도 5b에 도시된 바와 같이, 직사각형 형상 등 다양한 형상을 가질 수 있다.As shown in FIG. 5A, the guide robot 100 may have a shape in which a semicircular shape is coupled to both ends of a rectangle, a rectangular shape in a rectangular shape as shown in FIG. 5B, Shape.

도 3b에서 상기 가이드로봇(100)은, 직선 구간을 이루는 부분은 서로 평행을 이루어 배치되고 양단에 평행한 한 쌍의 가이드로봇(100) 사이를 번갈아 가면서 이동되는 교번이동가이드부(111)가 설치될 수 있다.3B, the guide robot 100 includes an alternate movement guide unit 111, which is disposed in parallel with each other and forms a straight line section, and is alternately moved between a pair of guide robots 100 parallel to both ends .

상기 가이드로봇(100)은, 후술하는 기능모듈(200)에 설치된 가이드결합부(240)와 결합됨으로써 기능모듈(200)의 이동을 가이드하는 구성으로서 한 쌍으로 구성되는 등 다양한 구성이 가능하다.The guide robot 100 may have a variety of configurations such as a pair of a guide for guiding the movement of the functional module 200 by being coupled with a guide coupling part 240 provided in the functional module 200 to be described later.

상기 전원공급부(120)는, 가이드로봇(100)의 이송경로와 평행하게 설치되어 후술하는 기능모듈(200)에 설치된 작동부(400) 등 전원공급을 요하는 부재에 전원을 공급하는 구성으로서 다양한 구성이 가능하다.The power supply unit 120 is configured to supply electric power to a member requiring power supply, such as an operation unit 400 installed parallel to the conveying path of the guide robot 100 and installed in a functional module 200 Configuration is possible.

예로서, 상기 전원공급부(120)는, 후술하는 이동본체(103)에 설치된 전원수신부(210)에 접촉에 의하여 또는 무선으로 전원을 공급하는 구성으로서 전원공급방식에 따라서 다양한 구성이 가능하다.For example, the power supply unit 120 may be configured to supply power to the power receiving unit 210 provided in the moving body 103, which will be described later.

보다 구체적으로, 상기 전원공급부(120)는, 자기유도방식, 자기공진방식 등 다양한 방식에 의하여 무선으로 전원수신부(210)에 전원을 공급할 수 있다.More specifically, the power supply unit 120 may supply power to the power receiving unit 210 wirelessly by various methods such as a magnetic induction method, a magnetic resonance method, and the like.

이때 상기 전원수신부(210)는, 충전기능이 없이 전원공급을 요하는 부재에 전원을 공급하도록 구성되거나, 전기충전이 가능한 충전밧데리를 포함하는 등 다양한 구성이 가능하다.At this time, the power receiving unit 210 may be configured to supply power to a member requiring power supply without a charging function, or may include a charging battery that can be electrically charged.

한편 상기 전원공급부(120)는, 전원수신부(210)가 충전밧데리를 포함하고 방전된 경우 수작업 등에 의하여 충전밧데리를 교체하는 방식 또는 특정 위치에 이동되어 충전되는 경우 필수로 설치될 필요가 없음은 물론이다.Meanwhile, the power supply unit 120 does not need to be installed when the power receiving unit 210 includes a rechargeable battery and is discharged when the rechargeable battery is replaced by manual operation or when it is moved to a specific location and charged. to be.

또한 상기 전원공급부(120)는, 무선 공급 방식 이외에, 전원공급선이 가이드로봇(100)을 따라서 설치되어 접촉에 의하여 전원을 공급할 수 있음은 물론이다.In addition, the power supply unit 120 may be provided with a power supply line along the guide robot 100 in addition to the wireless supply method, and may supply power by contact.

상기 이동구동부(300)는, 이동본체(103)가 가이드로봇(100)을 따라서 이동시키는 구성으로서 다양한 구성이 가능하다.The movement driving unit 300 may be configured in various manners as a configuration in which the moving body 103 moves along the guide robot 100.

상기 이동구동부(300)는, 가이드로봇(100)을 따른 이동본체(103)의 이동 구동방식에 따라서 다양한 구성이 가능하다.The movement driving unit 300 can be configured in various ways according to a movement driving method of the moving body 103 along the guide robot 100.

예로서, 상기 이동구동부(300)는, 영구자석 및 코일을 포함하는 이동시스템, 예를 들면, 한국 등록특허 제10-0977471호, 미국 등록특허 제8686669호에 개시된 선형이동시스템이 응용되어 설치될 수 있다.For example, the movement driving unit 300 may include a moving system including a permanent magnet and a coil, for example, a linear moving system disclosed in Korean Patent No. 10-0977471 and U.S. Patent No. 8686669 .

상기 기능모듈(200)은, 전원공급부(120)로부터 접촉에 의하여 또는 무선으로 전원을 공급받는 전원수신부(210)와, 가이드로봇(100)을 따라서 이동가능하게 결합시키는 가이드결합부(240)가 설치되는 구성으로서 다양한 구성이 가능하다.The functional module 200 includes a power receiving unit 210 receiving power from the power supply unit 120 by contact or by radio and a guide coupling unit 240 for movably coupling the guide robot 100 along the guide robot 100 Various configurations are possible as a configuration to be installed.

상기 가이드결합부(240)는, 기능모듈(200)를 가이드로봇(100)을 따라서 이동가능하게 결합시키는 구성으로서 그 결합방식에 따라서 다양한 구성이 가능하다.The guide coupling part 240 is configured to movably couple the functional module 200 along the guide robot 100, and various configurations are possible according to the coupling method.

상기 전원수신부(210)는, 접촉에 의하여 또는 무선으로 전원공급부(120)로부터 전원을 공급받는 구성으로서 다양한 구성이 가능하다.The power receiving unit 210 may be configured to receive power from the power supply unit 120 by contact or wirelessly.

예로서, 상기 전원수신부(210)는, 기능모듈(200)에 설치되어 전기공급을 요하는 부재들에 전원을 공급하도록 구성될 수 있다.For example, the power receiving unit 210 may be configured to supply power to members that are installed in the function module 200 and require electricity supply.

또한 상기 전원수신부(210)는, 충분한 전원공급, 안정적 전원공급 등을 위하여 충전밧데리를 포함할 수 있다.Also, the power receiving unit 210 may include a rechargeable battery for sufficient power supply, stable power supply, and the like.

한편 상기 기능모듈(200)은, 전원수신부(210), 가이드결합부(240) 이외에, 진공압에 의하여 소자(20)를 픽업하는 하나 이상의 픽커(410) 및 하나 이상의 카메라(533) 중 적어도 하나를 포함하는 작동부(400)와, 작동부(400)의 작동제어를 위한 제어신호를 무선에 의하여 메인제어부(10)로부터 수신하여 작동부(400)를 제어하는 무선제어부(220)를 포함할 수 있다. 여기서 상기 기능모듈(200)은, 픽커(410), 카메라(533) 등 소자핸들러 내에서 작동시 이동을 요하는 이동대상이면 어떠한 구성도 가능하다.The functional module 200 may include at least one of the one or more pickers 410 and one or more cameras 533 that pick up the element 20 by the vacuum pressure in addition to the power receiving unit 210 and the guide coupling unit 240 And a radio control unit 220 for receiving a control signal for controlling operation of the operation unit 400 from the main control unit 10 by radio and controlling the operation unit 400 . Here, the function module 200 may be any object as long as it is a moving object requiring movement in operation within the element handlers such as the picker 410 and the camera 533. [

상기 작동부(400)는, 기능모듈(200)에 설치되어 소자픽업, 이미지획득 등 이동하면서 요구되는 기능을 수행하는 구성으로서, 기능에 따라서 다양한 구성이 가능하다.The operation unit 400 is provided in the function module 200 and performs a required function while moving the device pickup, image acquisition, and the like, and can have various configurations according to functions.

예로서, 상기 작동부(400)는, 진공압에 의하여 소자(20)를 픽업하는 하나 이상의 픽커(410)를 구비할 수 있다.For example, the actuating part 400 may include at least one picker 410 for picking up the element 20 by vacuum pressure.

여기서 상기 하나 이상의 픽커(410)는, 진공압에 의하여 소자(20)를 픽업하는 구성으로서 진공압에 의하여 소자(20)를 픽업하는 픽업헤드와, 진공압전달장치(500)에 연결된 공압연결선(510, 520)에 의하여 진공압을 전달받는 로드로 구성되는 등 다양한 구성이 가능하다.The at least one picker 410 includes a pick-up head for picking up the element 20 by vacuum pressure and a pick-up head for picking up the element 20 by the vacuum pressure, and a pneumatic connection line 510, and 520, respectively.

상기 공압연결선(510, 520)은, 진공압전달장치(500)로부터 진공압을 픽커(410)의 로드로 전달하는 구성으로서, 메인연결선(510) 및 메인연결선(510)으로부터 분기되어 각 픽커(410)의 로드와 연결되는 분기선(520)으로 구성되는 등 다양한 구성이 가능하다.The pneumatic connection lines 510 and 520 are configured to transmit the vacuum pressure from the vacuum pump 500 to the rod of the picker 410. The vacuum pump 500 is branched from the main connection line 510 and the main connection line 510, And a branching line 520 connected to the load of the first and second electrodes 410 and 410.

그리고 상기 작동부(400)는, 픽커(410)를 구비하는 경우 픽업헤드에서의 신속한 진공압형성 및 해제를 위한 밸브가 픽업헤드에 가장 가까운 위치에 설치됨이 바람직하다.When the picker 410 is provided, the actuating part 400 is preferably provided at a position nearest to the pick-up head for rapid vacuum pressure build-up and release in the pick-up head.

이에, 상기 픽업헤드에서의 진공압형성 및 해제를 위한 밸브는, 액츄에이터(531)에 의하여 구동될 수 있다.Thus, the valve for forming and releasing the vacuum pressure in the pick-up head can be driven by the actuator 531.

여기서 액츄에이터(531)는, 픽업헤드에서의 진공압형성 및 해제를 수행하며, 앞서 설명한 전원수신부(210)로부터 전원공급 및 후술하는 무선제어부(220)의 제어에 의하여 작동된다.Here, the actuator 531 performs vacuum pressure formation and release in the pickup head, and is operated by power supply from the power receiving unit 210 and control of the radio control unit 220, which will be described later.

한편 상기 작동부(400)는, 픽커(410)의 상하이동(Z축방향), 수평이동(X축방향, Y축방향, X-Y축방향), 회전 등 그 이동을 위한 하나 이상의 구동모터(532)를 포함할 수 있다.The operation unit 400 includes at least one drive motor 532 for moving the picker 410 up and down (Z-axis direction), horizontal movement (X axis direction, Y axis direction, XY axis direction) ).

구체적으로, 상기 픽커(410)는, 기능모듈(200)에 결합된 상태에서, 상하이동(Z축방향), 수평이동(X축방향, Y축방향, X-Y축방향), 회전 등 다양한 이동방식에 의하여 이동될 수 있다.Specifically, the picker 410 is movable in a vertical movement (Z-axis direction), horizontal movement (X-axis direction, Y-axis direction, XY-axis direction) Lt; / RTI >

한편 상기 구동모터(532)는, 앞서 설명한 전원수신부(210)로부터 전원공급 및 후술하는 무선제어부(220)의 제어에 의하여 작동된다.Meanwhile, the driving motor 532 is operated by power supply from the power receiving unit 210 and control of the radio control unit 220, which will be described later.

또 다른 예로서, 상기 작동부(400)는, 하나 이상의 픽커(410)와 함께 또는 하나 이상의 픽커(410) 없이 하나 이상의 카메라(533)를 포함할 수 있다.As another example, the actuating part 400 may include one or more cameras 533 with or without one or more pickers 410. [

상기 카메라(533)는, 기능모듈(200)에 결합되어 이동됨과 아울러 소자 등 이미지를 획득하는 장치로서 스캐너, 디지털카메라 등 다양한 구성이 가능하다.The camera 533 is coupled to the function module 200 and is moved and acquires an image of an element or the like. The camera 533 may have various configurations such as a scanner and a digital camera.

한편 상기 카메라(533)는, 전원수신부(210)로부터 전원공급 및 후술하는 무선제어부(220)의 제어에 의하여 작동된다.On the other hand, the camera 533 is operated by power supply from the power receiving unit 210 and control by a radio control unit 220, which will be described later.

그리고 상기 작동부(400)는, 픽커(410) 및 카메라(533) 이외에 이동되면서 소자핸들러 내에 요구되는 기능을 수행할 수 있는 모듈이 추가로 또는 별도로 결합될 수 있음은 물론이다.Of course, the operation unit 400 may be additionally or separately combined with a module capable of performing a required function in the device handler while being moved in addition to the picker 410 and the camera 533.

정리하면 상기 기능모듈(200) 중 무선제어 대상은, 액츄에이터, 모터, 카메라 등 무선제어가 가능한 대상이면 어떠한 대상도 가능하다.In short, the radio control target among the functional modules 200 can be any object as long as it can be controlled wirelessly, such as an actuator, a motor, and a camera.

상기 무선제어부(220)는, 작동부(400)의 작동제어를 위한 제어신호를 무선에 의하여 메인제어부(10)로부터 수신하여 작동부(400)를 제어하는 구성으로서 다양한 구성이 가능하다.The radio control unit 220 may be configured to receive a control signal for controlling the operation of the operation unit 400 from the main control unit 10 by radio and to control the operation unit 400.

예로서, 상기 무선제어부(220)는, 지그비통신모듈, 블루투스통신모듈, Wifi통신모듈, 적외선통신모듈, LTE통신모듈 및 2.5Ghz무선통신모듈 중 적어도 하나를 포함하는 통신모듈을 포함할 수 있다.For example, the wireless control unit 220 may include a communication module including at least one of a Zigbee communication module, a Bluetooth communication module, a Wifi communication module, an infrared communication module, an LTE communication module, and a 2.5 Ghz wireless communication module.

한편 상기 무선제어부(220)는, 기능모듈(200) 및 그에 결합되는 작동부(400)의 수에 따라서 하나 이상으로 설치될 수 있으며, 그 제어방식에 따라서 복수의 기능모듈(200) 및 작동부(400)를 제어할 수 있다.The radio control unit 220 may be installed in one or more of the functional modules 200 and the operation units 400 coupled to the functional modules 200. Depending on the control mode, (400).

일예로서, 상기 무선제어부(220)는, 하나로 구성되고 복수의 기능모듈(200) 및 작동부(400)를 제어할 수 있다.For example, the radio control unit 220 may be configured as a single unit and may control a plurality of the function modules 200 and the operation unit 400.

다른 예로서, 상기 무선제어부(220)는, 기능모듈(200) 및 그에 결합되는 작동부(400)를 하나의 모듈단위로 구성되어 각 모듈단위에 대응되는 제어모듈(#1~#n; n은 2 이상의 자연수)로 구성됨으로써 각각 개별제어될 수 있다.As another example, the radio control unit 220 may include a function module 200 and an operation unit 400 coupled to the function module 200. The radio control unit 220 includes control modules # 1 to #n, n Are natural numbers of 2 or more).

또 다른 예로서, 상기 무선제어부(220)는, 하나의 통신모듈에 의하여 메인제어부(10)로부터 무선으로 제어신호를 수신하고, 각 모듈단위에 대응되는 제어모듈(#1~#n; n은 2 이상의 자연수)와는 유선으로 연결되어 각각 개별제어될 수 있다.As another example, the radio control unit 220 wirelessly receives control signals from the main control unit 10 by one communication module, and control modules # 1 to #n (n = n, Two or more natural numbers) can be connected to each other by a wire to be individually controlled.

이상은 본 발명에 의해 구현될 수 있는 바람직한 실시예의 일부에 관하여 설명한 것에 불과하므로, 주지된 바와 같이 본 발명의 범위는 위의 실시예에 한정되어 해석되어서는 안 될 것이며, 위에서 설명된 본 발명의 기술적 사상과 그 근본을 함께 하는 기술적 사상은 모두 본 발명의 범위에 포함된다고 할 것이다.It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

100 : 이동가이드부 110 : 가이드로봇
120 : 전원공급부 200 : 이동본체
220 ; 무선제어부 300 : 이동구동부
400 : 작동부 100: movement guide portion 110: guide robot
120: power supply unit 200: moving body
220; Radio control unit 300:
400:

Claims (5)

미리 설정된 기능을 수행하는 기능모듈(200)과;
상기 기능모듈(200)의 이동을 가이드하는 가이드로봇(100)과;
상기 가이드로봇(100)에 결합되어 상기 기능모듈(200)에 대하여 전원을 공급하는 전원공급부(120)와;
상기 가이드로봇(100)을 따라서 상기 기능모듈(200)을 이동시키는 이동구동부(300)를 포함하는 것을 특징으로 하는 무선이동모듈.A function module 200 for performing a preset function;
A guide robot 100 for guiding the movement of the functional module 200;
A power supply unit 120 coupled to the guide robot 100 to supply power to the function module 200;
And a movement driver (300) for moving the functional module (200) along the guide robot (100). 청구항 1에 있어서,
상기 기능모듈(200)은,
진공압에 의하여 소자(20)를 픽업하는 하나 이상의 픽커(410) 및 하나 이상의 카메라(533) 중 적어도 하나를 포함하는 작동부(400)와,
상기 작동부(400)의 작동제어를 위한 제어신호를 무선에 의하여 메인제어부로부터 수신하여 상기 작동부(400)를 제어하는 무선제어부(220)를 포함하는 것을 특징으로 하는 무선이동모듈.The method according to claim 1,
The functional module (200)
An actuating part (400) including at least one of at least one picker (410) and at least one camera (533) picking up the element (20) by vacuum pressure,
And a radio control unit (220) for receiving a control signal for controlling operation of the operation unit (400) from a main control unit by radio and controlling the operation unit (400). 청구항 2에 있어서,
상기 무선제어부(220)는,
지그비통신모듈, 블루투스통신모듈, Wifi통신모듈, 적외선통신모듈, LTE통신모듈 및 2.5Ghz무선통신모듈 중 적어도 하나를 포함하는 것을 특징으로 하는 것을 특징으로 하는 무선이동모듈.The method of claim 2,
The radio control unit 220,
A wireless communication module, a Zigbee communication module, a Bluetooth communication module, a Wifi communication module, an infrared communication module, an LTE communication module, and a 2.5 Ghz wireless communication module. 청구항 1에 있어서,
상기 가이드로봇(100)은, 상기 기능모듈(200)에 대한 직선, 곡선 및 폐곡선 형상 중 적어도 하나의 이송경로를 가지는 것을 특징으로 하는 무선이동모듈.The method according to claim 1,
Wherein the guide robot (100) has at least one of a straight line, a curved line, and a closed curve shape with respect to the functional module (200). 청구항 1에 있어서,
상기 가이드로봇(100)은,
상기 기능모듈(200)에 대한 X-Y가이드로봇 또는 X-Y-θ로봇인 것을 특징으로 하는 무선이동모듈.The method according to claim 1,
The guide robot (100)
Is an XY guide robot or an XY-? Robot for the functional module (200).
KR1020160073776A 2016-06-14 2016-06-14 Wireless movement module, and device handler having the same KR20170140963A (en)

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