KR20170074121A - Flip chip mounting appratus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip mounting apparatus, and more particularly, to a flip chip mounting apparatus for mounting an element picked up on a wafer onto a substrate after flip. The present invention includes a loading member table (200) for moving the loading member (60) in a horizontal direction; The flip module 400 picks up the element 1 loaded on the loading member 60 at the pickup position 1 and flips the picked up element 1 to move to the transfer position 2 located at one side of the loading member table 200, and; A mounting portion 500 spaced from the transfer position 2 and on which the substrate 2 to be mounted with the device 1 transferred from the flip module 400 located at the transfer position 2 is located; A flux dipping portion 700 provided between the transfer position and the mounting portion 500 and containing a flux to which the bottom surface of the element 1 is dipped before being mounted on the substrate 2 located in the mounting portion 500; The flux dipping unit 700 and the mounting unit 500 are sequentially moved to the transfer position 2, the flux dipping unit 700 and the mounting unit 500, And a pair of element transferring tools 600 for performing flux dipping of the element 1 in the mounting portion 500 and mounting of the element 1 in the mounting portion 500, Position 2, the flux dipping unit 700, and the mounting unit 500, and then moved back to the transfer position 2 sequentially.

Description

Flip chip mounting appratus < RTI ID = 0.0 >

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a flip chip mounting apparatus, and more particularly, to a flip chip mounting apparatus for mounting an element picked up on a wafer onto a substrate after flipping.

In semiconductor devices, as microprocesses such as nano processes are developed, the overall size thereof is remarkably smaller than that of conventional semiconductor devices.

In addition, according to the development of the smartphone and the trend of the thinning of the smartphone, when it is used in a smart phone, a smart watch, etc., it is required to minimize the thickness of the device as well as the size thereof.

In response to such trends and demands, the semiconductor device is manufactured by a bonder after the sowing process, a technique of performing the packaging process from the wafer level to the packaging process by the molding process instead of the packaging process, A wafer level chip scale pacque (CSP) is used as in Patent No. 10-1088205.

On the other hand, when the device is small in forming a WL-CSP device, there is a problem that the device manufacturing process is difficult because there are many restrictions on forming a ball terminal at a wafer level.

Thus, a so-called fan-out WLP process has been proposed in which a sowing process is performed on a semiconductor device, and an individual device is molded and terminals are formed.

Meanwhile, a device that has undergone the WL-CSP device or the fan-out WLP process is mounted on a substrate immediately after the sowing process, thereby reducing productivity and manufacturing cost.

Here, in a device that has undergone a WL-CSP device or a fan-out WLP process, a connection terminal, which is connected to a terminal on a substrate in a wafer state, is generally formed as a bump on a top surface through a bumping process.

The substrate may be a WL-CSP device in which the thickness and size are minimized, or a device that has been subjected to a fan-out WLP process is mounted using flux. If the substrate is a substrate on which thin elements such as a lead frame and a strip member can be mounted, Substrates are also possible.

On the other hand, the devices having the connection terminals formed on the upper surface as described above are separated from the wafer into individual devices through the sowing process. In order to mount the devices on the substrate, the device is picked up on the wafer ring separated by individual devices by the soaking process, A flux dipping process, and a mounting apparatus for performing a process of mounting an element on a substrate.

However, if the bottleneck occurs in some process due to the difference in processing speed per device in each process, the processing speed of the device, that is, the rate of UPH (unit per hour), is determined.

Therefore, in order to improve the processing speed of the mounting apparatus, it is necessary to adjust the speeds appropriately for the structures that perform each step.

It is an object of the present invention to provide a flip chip mounting apparatus capable of maximizing the processing speed of an apparatus by optimizing the handling of elements in each region for performing a specific process by recognizing the trend and necessity as described above.

SUMMARY OF THE INVENTION The present invention has been made in order to achieve the above-mentioned object of the present invention, and it is an object of the present invention to provide a loading unit cassette unit 100 in which a plurality of loading members 60, A loading member table (200) receiving the member (60) and moving the loading member (60) in a horizontal direction; The flip module (1) picks up the element (1) loaded on the loading member (60) at the pickup position (1) and flips the picked up element (1) to move to the transfer position (2) located on one side of the loading member table 400); A mounting part 500 spaced from the transfer position 2 and on which a substrate 2 to be mounted with the device 1 transferred from the flip module 400 located at the transfer position 2 is located; A flux dipping unit 700 disposed between the transfer position and the mounting unit 500 and containing a flux to which the bottom surface of the device 1 is dipped before being mounted on the substrate 2 placed in the mounting unit 500; ; The flux dipping unit 700 and the mounting unit 500 and then moved to the transfer position 2, and at the transfer position 2, the at least one device 1 is picked up, And a pair of element transfer tools 600 for performing flux dipping of the element 1 in the flux dipping unit 700 and mounting of the element 1 in the mounting unit 500, Wherein the transfer tool (600) is sequentially moved to the transfer position (2), the flux dipping section (700) and the mounting section (500), and then moved to the transfer position Thereby starting the mounting apparatus.

One of the pair of element transferring tools 600 is moved on the flux dipping portion 700 and the mounting portion 500 after the element is picked up and the other one is transferred to the element 1 And may be installed to move from the mounting portion 500 to the transfer position (2) so as not to interfere with the movement of the picked-up element transfer tool (600).

The mounting portion 500 may be configured such that the substrate 2 is linearly movable in a direction perpendicular to the transport direction of the pair of element transfer tools 600.

The transfer position 2, the flux dipping unit 700, the mounting unit 500, the flip module 400, and the pair of element transferring tools 600 are disposed on the loading member table 200, They can be installed in pairs as opposed to each other.

Between the flux dipping portion 700 and the mounting portion 500 there is provided a plurality of elements 1 that are picked up by the element transfer tool 600 for vision inspection and alignment of the elements 1 on the substrate 2. [ An under vision unit 800 for acquiring an image of the bottom surface may be installed.

One of the pair of element transferring tools 600 moves on the transfer position 2, the flux dipping portion 700 and the mounting portion 500 after element pick-up, So as not to interfere with the movement of the element transfer tool 600 picked up by the transfer unit 500 and to be transferred from the mounting unit 500 to the transfer position 2.

Between the flux dipping portion 700 and the mounting portion 500 there is provided a plurality of elements 1 that are picked up by the element transfer tool 600 for vision inspection and alignment of the elements 1 on the substrate 2. [ An under vision unit 800 for acquiring an image of the bottom surface may be installed.

The flip chip mounting apparatus according to the present invention performs pick-up and flip of a device by a flip module in a loading member such as a wafer ring and performs pick-up and transfer of a device from the flip module to a mounting unit in which a substrate to be mounted is placed By constructing a pair of element transferring tools, there is an advantage that the processing speed of the apparatus can be maximized by optimizing the processing speed of the flip module and the element handling speed between the element transferring tools.

Particularly, in consideration of the fact that the processing speed of the element transfer tool is relatively low in comparison with the processing speed of the flip module, element pick-up and flip on the wafer ring are performed for one flip module, By performing the transfer by a pair of element transfer tools, there is an advantage that the processing speed of the apparatus can be maximized by optimizing the deviation of the processing speed of the flip module and the processing speed of the element transfer tool.

1 is a layout diagram showing an example of a flip chip mounting apparatus according to the present invention.
2 is a conceptual diagram showing a process of transferring a device by a device transfer tool in the flip chip mounting apparatus of FIG.
Fig. 3 is a partially enlarged view of a portion from the delivery position to the mounting portion of the flip-chip mounting apparatus of Fig. 1; Fig.
4A is a conceptual diagram showing a state in which the flip module picks up a device at a pick-up position, and FIG. 4B is a conceptual diagram showing a state after the device is picked up and inverted by the flip module.
5A and 5B are a perspective view and a cross-sectional view showing an example of a loading member used in the flip chip mounting apparatus of FIG. 1, respectively.
Fig. 6 is a perspective view showing another example of a loading member used in the element handler of Fig. 1; Fig.

Hereinafter, a flip chip mounting apparatus according to the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 1, the flip chip mounting apparatus according to the present invention includes a loading member table 200; A flip module 400; A mounting portion 500; A flux dipping unit 700; Includes a pair of element transfer tool (600).

The loading member 60, which is horizontally moved by the loading member table 200, may be a wafer ring having a wafer after the soaking process, in which a plurality of devices 1 are attached.

In addition, the loading member 60 may be a wafer ring with a wafer after the so-called fan-out WLP process and sowing process for performing the molding and terminal formation of the individual devices after the semiconductor process and the device process.

5A and 5B, the loading member 60 includes a tape 61 and a tape 61 to which the element 1 is attached, in which the element 1 after the sowing process is loaded, And a frame member 62 for fixing the frame member 62.

The tape 61 can be any member as long as the elements 1 can be attached thereto, and a so-called adhesive tape can be used.

The frame member 62 is configured to fix the tape 61 to which the elements 1 are attached, as shown in Figs. 5A and 5B. The frame member 62 has a circular ring, a square ring as shown in Fig. 6, This is possible.

The loading member table 200 is configured to receive a plurality of loading members 60 attached with a plurality of elements 1 from the loading member cassette unit 100 and to move the loading member 60 in the horizontal direction Configuration is possible.

For example, the loading member table 200 receives the loading member 60 from the loading member cassette unit 100 by a wafer ring loading unit (not shown) so that the flip module 400 can move from the pick- The XY table, the XY-theta table, and the like can be used as the configuration for moving the loading member 60 in the horizontal direction so that the loading member 60 can be picked up.

Further, the loading member table 200 may be moved in the vertical direction, i.e., the Z-axis direction.

The loading member cassette unit 100 can have any configuration as long as the loading members 60 can be stacked up and down as a configuration for loading a plurality of loading members 60. [

The flip module 400 picks up the element 1 loaded on the loading member 60 at the pickup position 1 and flips the picked up element 1 to transfer the element 1 to the transfer position 2 located at one side of the loading member table 200 So that various configurations are possible.

By way of example, the flip module 400 may include a plurality of pickers 410 for picking up the element 1, as shown in Figs. 1 to 4B, particularly Figs. 4A and 4B, A linear moving part that moves the pickers 410 picked up from the pickup position 1 to the transfer position 2 and an inversion part that inverts the pickers 410 picking up the device 1 upward.

The picker 410 may be configured to pick up the element 1 from the loading member 60 by vacuum pressure.

As one example, the picker 410 includes a pneumatic connection unit that receives air pressure from the outside, and a pick-up head that is installed at an end and picks up the device 1 by a pneumatic pressure transmitted by the pneumatic connection unit or releases the pick- .

The pickup position 1 is set on the loading member table 200 and defined as a position where the picker 410 of the flip module 400 is picked up together with the needle pin assembly 490.

The needle pin assembly 490 is configured to press the bottom surface of the loading member 60, for example the tape 61 of the loading member 60, when the flip module 400 picks up the element 1 at the pick- So that the tape 61 to which the element 1 is attached is pushed up toward the flip module 400. In this case,

On the other hand, when the flip module 400 picks up the element 1 at the pick-up position 1, a loading member (not shown) is mounted directly above the pickup position 1 to confirm the position and alignment of the element 1 on the loading member 60 An image acquiring unit for acquiring an image of all or a part of the image is acquired.

The image acquiring section is constituted by a camera or the like for acquiring an image of all or a part of the loading member 60 immediately above the pickup position 1, The position and alignment state of the display device.

Here, the control unit may be configured in a circuit configuration rather than a physical configuration in order to control the operation of the flip device handler as well as the image obtaining unit.

The transfer position 2 is connected to the flip module 400 and the element transfer tool 700 as a set position for transferring the element 1 picked up and flipped by the flip module 400 to the stacking tool 500 Therefore, various settings can be made.

On the other hand, at the upper portion of the transfer position (2), an image acquiring unit may be provided for images of the devices (1) picked up and flipped by the flip module (400).

The image obtaining unit analyzes the obtained image and analyzes the obtained image to detect the surface state, the alignment state, etc. of the element 1 before the element 1 is transferred from the flip module 400 to the element transfer tool 500, 400 and a camera or the like as a configuration for acquiring an image of the element 1 inverted toward the upper side.

Here, the image obtaining unit transmits the image of the device 1 picked up by the flip module 400 and inverted upward, to the control unit, and the control unit controls the surface state, the alignment state, etc. of the device 1 can confirm.

The mounting portion 500 is configured such that the substrate 2 on which the element 1 transferred from the flip module 400 located at the transfer position 2 is mounted is disposed at an interval from the transfer position 2, It is possible.

1, the mounting portion 500 may be configured such that the substrate 2 is moved in a linear direction in a direction perpendicular to the transport direction of the pair of device transporting tools 600, which will be described later, And various configurations are possible.

The substrate 2 is a configuration in which the element 1 is mounted after the bottom surface of the element 1 is dipped in the flux and includes a wafer ring to which a plurality of elements 1 are attached in order to perform a Fan- Any substrate can be used as long as the semiconductor device 1 can be mounted, such as a lead frame, a strip, and a PCB substrate on which the WLCSP chip is mounted.

Here, the flux to which the bottom surface of the element 1 is dipped is used as a material for mounting the element 1, such as removal of the oxide film to be mounted on the element 1, reduction of the solder interface tension, Various materials can be used depending on the type and mounting method.

The flux dipping unit 700 includes a flux dipping unit 700 disposed between the transfer position and the mounting unit 500 and containing the flux dipping the bottom surface of the element 1 before being mounted on the substrate 2 placed in the mounting unit 500 Various configurations are possible as the configuration.

Here, the dipping of the element 1 in the flux dipping unit 700 is performed for a relatively long period of time compared with other configurations, and the dipping is performed in a state that the element transfer tool 600 is picked up.

The pair of element transfer tools 600 are sequentially moved to the transfer position 2, the flux dipping portion 700 and the mounting portion 500, that is, the mounting position 3, and then moved to the transfer position 2, Various configurations are possible as a configuration for picking up at least one element 1 at a position 2, flux dipping of the element 1 at the flux dipping section 700, and mounting the element 1 at the mounting section 500.

Particularly, it is preferable that the pair of element transfer tools 600 are sequentially moved to the transfer position 2, the flux dipping portion 700, and the mounting portion 500, and then moved to the transfer position 2 sequentially.

One of the pair of element transferring tools 600 sequentially moves to the transfer position 2, the flux dipping portion 700 and the mounting portion 500 after element pickup, Can be installed so as to be detoured from the mounting portion 500 to the transfer position 2 so as not to interfere with the movement of the picked-up element transfer tool 600.

On the other hand, the mounting position 3 can be variously set depending on the type of the element 1, the type of the substrate, the size, etc., as the position where the element 1 is mounted on the mounting portion 500 by the element transfer tool 600 have.

An image acquisition unit (not shown) for acquiring images of all or a part of the substrate 2 may be installed on the mounting position 3 in the mounting unit 500.

The image acquiring unit is configured to acquire an image of all or a part of the substrate 2 at an upper portion of the mounting position ③ and is constituted by a camera or the like and the acquired image is displayed on the surface state of the element 1 on the substrate 2 , The attachment state, and so on.

Between the flux dipping portion 700 and the mounting portion 500 is formed a bottom surface of at least one element 1 picked up by the element transfer tool 600 for vision inspection and alignment of the element 1 on the substrate 2 An under vision unit 800 may be installed to acquire an image of the image.

The under vision unit 800 acquires an image of the bottom surface of at least one element 1 picked up by the element transfer tool 600 and transmits the acquired image to a control unit Lt; / RTI > 2).

The flip module 400 picks up a plurality of devices 1 by a plurality of pickers 410 arranged in one or more rows. At this time, And may include a plurality of pickers 710 corresponding to positions of the plurality of elements 1 picked up by the plurality of pickers 410.

The plurality of pickers 710 are configured to pick up and place (attach) the element 1, and can be configured to pick up the element 1 by various methods such as vacuum pressure.

On the other hand, in order to improve the processing speed of the mounting process of the element 1, the transfer position 2, the flux dipping portion 700, the mounting portion 500, the flip module 400 and the pair of element transferring tools 600, As shown in FIG. 1, the loading member table 200 may be installed in pairs so as to be opposed to each other.

As described above, the transfer position 2, the flux dipping section 700, the mounting section 500, the flip module 400, and the pair of element transferring tools 600 are opposed to each other with respect to the loading member table 200 Pickup of the element 1 from the loading member 60 on the loading member table 200 is continuously performed so that the processing speed of the mounting process of the element 1 can be greatly improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

100: loading member cassette part 200: loading member table
400: flip module 500: mounting part
600 flux dipping unit 700 device transfer tool

Claims (7)

A loading member 60 is loaded from a loading member cassette unit 100 loaded with a plurality of loading members 60 to which a plurality of devices 1 are attached and a loading member table 60 for moving the loading member 60 in a horizontal direction (200);
The flip module (1) picks up the element (1) loaded on the loading member (60) at the pickup position (1) and flips the picked up element (1) to move to the transfer position (2) located on one side of the loading member table 400);
A mounting part 500 spaced from the transfer position 2 and on which a substrate 2 to be mounted with the device 1 transferred from the flip module 400 located at the transfer position 2 is located;
A flux dipping unit 700 disposed between the transfer position and the mounting unit 500 and containing a flux to which the bottom surface of the device 1 is dipped before being mounted on the substrate 2 placed in the mounting unit 500; ;
The flux dipping unit 700 and the mounting unit 500 and then moved to the transfer position 2, and at the transfer position 2, the at least one device 1 is picked up, And a pair of element transferring tools 600 for performing flux dipping of the element 1 in the flux dipping unit 700 and mounting of the element 1 in the mounting unit 500,
The pair of element transfer tools 600 are sequentially moved to the transfer position 2, the flux dipping portion 700 and the mounting portion 500, and then moved to the transfer position 2 sequentially with each other A flip chip mounting apparatus characterized by: The method according to claim 1,
One of the pair of element transferring tools 600 moves on the flux dipping portion 700 and the mounting portion 500 after the element is picked up,
And the other is installed so as to be detoured from the mounting portion (500) to the transfer position (2) so as not to interfere with the movement of the element transfer tool (600) picking up the element (1). The method according to claim 1,
Wherein the mounting portion (500) is configured so that the substrate (2) is linearly movable in a direction perpendicular to the conveying direction of the pair of element transfer tools (600). The method according to any one of claims 1 to 3,
The transfer position 2, the flux dipping unit 700, the mounting unit 500, the flip module 400, and the pair of element transferring tools 600 are disposed on the loading member table 200, The flip chip mounting device being mounted in a pair. The method of claim 4,
Between the flux dipping portion 700 and the mounting portion 500,
Characterized in that an under vision portion (800) is provided for acquiring an image of the bottom surface of at least one element (1) picked up by the element transfer tool (600) for vision inspection and alignment of the element (1) The flip chip mounting apparatus comprising: The method of claim 5,
One of the pair of element transferring tools 600 moves on the transfer position 2, the flux dipping portion 700 and the mounting portion 500 after element pick-up,
And the other is installed so as to be detoured from the mounting portion (500) to the transfer position (2) so as not to interfere with the movement of the element transfer tool (600) picking up the element (1). The method according to claim 1,
Between the flux dipping portion 700 and the mounting portion 500,
Characterized in that an under vision portion (800) is provided for acquiring an image of the bottom surface of at least one element (1) picked up by the element transfer tool (600) for vision inspection and alignment of the element (1) The flip chip mounting apparatus comprising:

Images