KR101637524B1

KR101637524B1 - Apparatus for holding and pressing semiconductor package

Info

Publication number: KR101637524B1
Application number: KR1020140190747A
Authority: KR
Inventors: 최상일; 김인호
Original assignee: 주식회사 티에프이
Priority date: 2014-12-26
Filing date: 2014-12-26
Publication date: 2016-07-07
Also published as: KR20160079420A

Abstract

The present invention provides a damper unit comprising: a damper unit; A centering unit connected to the damper unit and configured to be posture-aligned; An adsorption unit configured to adsorb a semiconductor package; And a heating unit connecting the centering unit and the adsorption unit to each other and having a plate-like heater arranged to face the adsorption unit.

Description

Technical Field [0001] The present invention relates to a semiconductor package adsorption pressurizing apparatus,

The present invention relates to an apparatus for adsorbing and pressing semiconductor packages.

In general, a semiconductor package completed by a semiconductor manufacturing process is checked if the operating characteristics are properly implemented through a test (inspection) process, and then shipped when it is classified as a good product.

In such an inspection process, the test may also be performed by connecting the semiconductor package to the socket to see if there is a problem with the electrical operation. To this end, the semiconductor package is handled by a device which adsorbs it and presses it into the socket.

At this time, the device for sucking and pressing the semiconductor package should give a minimal physical shock to the semiconductor package when it is sucked. In particular, since the thickness of the semiconductor package is becoming thinner, impact exceeding the setting level may damage the semiconductor package.

It is an object of the present invention to provide a semiconductor package adsorption / pressurizing device capable of minimizing damage to a semiconductor package in a process of sucking and pressing a semiconductor package.

It is another object of the present invention to provide a semiconductor package adsorption pressurizing apparatus capable of thermally uniformly heating a semiconductor package in a process of sucking and pressing the semiconductor package, thereby lowering the possibility of physical damage thereof.

According to an aspect of the present invention, there is provided a semiconductor package adsorption / pressurizing apparatus comprising: a damper unit; A centering unit connected to the damper unit and configured to be posture-aligned; An adsorption unit configured to adsorb a semiconductor package; And a heating unit connecting the centering unit and the adsorption unit to each other and having a plate-like heater disposed facing the adsorption unit.

Here, the heating unit may further include a heat insulating block disposed between the plate-like heater and the centering unit, the heat insulating block having a fastening groove, the suction unit including: an adsorption block; And a first fastening piece connected to the adsorption block and inserted in the fastening groove to fasten the adsorption block and the heat insulating block.

Here, the heat insulating block may include: a plate portion corresponding to the centering unit; And a fastening boss portion protruding from the plate portion and having the fastening groove formed therein.

The heating unit may further include a second fastening piece located outside the fastening boss and fastening the heat insulating block to the centering unit.

Here, the damper unit may include: a housing having an inner space; An operating plate disposed in the inner space and supported by a fluid flowing into the inner space; And a connection rod connected to the actuating plate and connected to the centering unit through the housing.

The damper unit may further include a sealing member which is provided at a portion of the housing through which the connection rod penetrates and seals a gap between the housing and the connection rod.

Here, the centering unit may include: a main block having an opening hole laterally opened; A third fastening piece inserted through the opening hole; And a plug block coupled to the main block and coupled to the connection rod by the third fastening piece.

Here, the plug block may include: a base portion corresponding to the damper unit and having a through hole through which the connection rod penetrates; And a connecting rod protruding from the base portion corresponding to the through hole and having a connection hole through which the third fastening piece is inserted and connected.

Here, the frame unit may further include a fluid passage coupled to the damper unit and communicating with the internal space.

According to the semiconductor package adsorption and pressurizing apparatus of the present invention, damage to the semiconductor package can be minimized in the process of adsorbing and pressing the semiconductor package.

Further, the semiconductor package is thermally and uniformly heated in the process of sucking and pressing the semiconductor package, so that the possibility of physical damage thereof may be further lowered.

1 is a perspective view showing a semiconductor package adsorption and pressurizing apparatus 100 according to an embodiment of the present invention.
2 is an exploded perspective view showing a part of the semiconductor package adsorption and pressurizing apparatus 100 of FIG.
3 is a longitudinal cross-sectional view of the semiconductor package adsorption and pressurization apparatus 100 of FIG.
4 is a perspective view for explaining a coupling relationship between the centering unit 150 and the damper unit 130 of the semiconductor package adsorption and pressurizing apparatus 100 of FIG.
5 is a partially exploded perspective view for explaining a decomposition method of the semiconductor package adsorption and pressurizing apparatus 100 of FIG.

Hereinafter, a semiconductor package adsorption and pressurizing apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present specification, the same or similar reference numerals are given to different embodiments in the same or similar configurations.

1 is a perspective view showing a semiconductor package adsorption and pressurizing apparatus 100 according to an embodiment of the present invention.

The semiconductor package adsorption and pressurizing apparatus 100 may have a frame unit 110, a damper unit 130, a centering unit 150, a heating unit 170, and an adsorption unit 190 .

The frame unit 110 includes a damper unit 130 and the like. The frame unit 110 may have the form of a generally flat block. The damper unit 130 and the like may be installed in a plurality of sets in one frame unit 110. In this drawing, four sets of damper units 130 and the like are arranged so as to form two rows.

The damper unit 130 is connected to the frame unit 110 and performs a damping function.

The centering unit 150 is connected to the damper unit 130, and performs a posture alignment function.

The heating unit 170 is disposed between the centering unit 150 and the adsorption unit 190 and functions to apply heat to the adsorption unit 190. [

The adsorption unit 190 is connected to the heating unit 170 and serves to adsorb the semiconductor package.

According to this configuration, the centering unit 150, the heating unit 170, and the absorption unit 190 are damped by the damper unit 130 with respect to the frame unit 110. Thereby, when the absorption unit 190 is brought into contact with the semiconductor package, it becomes possible to mitigate the impact that the absorption unit 190 applies to the semiconductor package.

According to the centering unit 150, the heating unit 170 and the suction unit 190 can be switched between the unaligned state and the aligned state with respect to the damper unit 130. [ 1, the aligned state is a state in which the damper unit 130 to the adsorption unit 190 are arranged in a substantially straight line and are arranged substantially horizontally relative to each other. Even if the semiconductor package is not accurately aligned with respect to the suction unit 190 by the centering unit 150, after the suction, the semiconductor packages can be aligned in parallel to the frame unit 110 or the like.

According to the heating unit 170, the absorption unit 190 is heated to thermally expand the semiconductor package. Thereby, when the adsorption unit 190 adsorbs the semiconductor package, it is possible to reduce the impact that the semiconductor package receives.

The semiconductor package adsorption and pressurizing apparatus 100 is constituted by one frame unit 110 and one damper unit 130, the centering unit 150, the heating unit 170, and the adsorption unit 190 Set.

A concrete configuration of the semiconductor package adsorption and pressurizing apparatus 100 will be described with reference to Figs. 2 and 3. Fig.

FIG. 2 is an exploded perspective view showing a part of the semiconductor package adsorption and pressurizing apparatus 100 of FIG. 1, and FIG. 3 is a longitudinal sectional view of the semiconductor package adsorption and pressurization apparatus 100 of FIG.

Referring to these figures, the frame unit 110 may have a body 111 and a fluid passage 115. The body 111 has a generally rectangular parallelepiped shape. The fluid passage 115 is formed to pass through the body 111 and communicates with the internal space S of the damper unit 130.

The damper unit 130 may have a housing 131, an operating plate 133, a connecting rod 135, and a sealing member 137.

The housing 131 is provided with an internal space S. The housing 131 may have an upper housing 131a and a lower housing 131b to be coupled to each other to form an inner space S. An intermediate passage 131a 'communicating with the fluid passage 115 may be formed in the upper housing 131a. The lower housing 131b may be formed with a groove forming an internal space S.

The operating plate 133 is disposed in the inner space S. The actuating plate 133 may be disposed substantially parallel to the frame unit 110. [ The actuating plate 133 may have a lower part 133a and an upper part 133b. The lower part 133a is coupled with the connection rod 135 and may be made of a metal. The upper part 133b is coupled to the lower part 133a and may be made of synthetic resin.

The connecting rod 135 is arranged to pass through the lower housing 131b. The free end side of the connecting rod 135 is connected to the centering unit 150. At this time, the connection rod 135 may be arranged along the direction from the frame unit 110 toward the absorption unit 190.

The sealing member 137 is installed at the opened portion of the lower housing 131b to seal a gap between the lower housing 131b and the connecting rod 135. [

The centering unit 150 may have a main block 151, a centering mechanism 152, a plug block 153, and a third fastening piece 159.

The main block 151 is a block having an insertion hole 151a at the center thereof. The insertion hole 151a has a shape in which an end side toward the damper unit 130 is opened. The main block 151 may also have an opening 151b that opens sideways. And the opening hole 151b can communicate with the insertion hole 151a.

The centering mechanism 152 is configured to connect the main block 151 and the plug block 153. The centering mechanism 152 may have a plate 152a, a ball 152b, and a spring 152c. The plate 152a may be installed in the main block 151 and the plug block 153, respectively, in the form of surrounding the balls 152b. The balls 152b are arranged to be wrapped by the upper and lower dishes 152a. The spring 152c is arranged to support the lower dish 152a in the main block 151. [

The plug block 153 is disposed on the upper side of the main block 151. The plug block 153 is engaged with the connection rod 135.

The third fastening piece 159 is inserted through the opening hole 151b to fasten the plug block 153 and the connecting rod 135. The third fastening piece 159 may be, for example, a bolt.

The heating unit 170 may have a plate-like heater 171, a heat insulating block 173, and a second fastening piece 179.

The plate-like heater 171 is a plate-shaped heater as a whole. The plate-like heater 171 is arranged to face the upper surface of the adsorption block 191 of the adsorption unit 190.

The heat insulating block 173 is an insulating body disposed between the plate-like heater 171 and the centering unit 150. The insulating block 173 may be formed of PEEK material, for example.

The heat insulating block 173 may have a plate portion 174 and a fastening boss portion 175. The plate portion 174 is generally in the form of a flat plate, and is arranged to face the plate-like heater 171. The fastening boss portion 175 is a portion protruding from the plate portion 174 toward the plate-like heater 171 side. The plate-like heater 171 may be formed with a hole into which the fastening boss portion 175 is inserted. The fastening boss portion 175 may be provided with a fastening groove 176 which is open toward the suction unit 190 side.

The second fastening piece 179 is configured to fasten the heat insulating block 173 to the centering unit 150. Specifically, the second fastening piece 179 passes through the heat insulating block 173 and can be inserted into the fastening groove of the centering unit 150. At this time, the second fastening piece 179 may be located outside the fastening boss portion 175.

The adsorption unit 190 may have an adsorption block 191, a first fastening piece 193, a suction rubber 195, and a suction port 196. The adsorption unit 190 is a hexahedral block in its entirety. The first fastening piece 193 is a structure for fastening the adsorption block 191 to the heat insulating block 173. Specifically, the first fastening piece 193 can be inserted into the fastening groove 176 of the fastening boss portion 175 of the heat insulating block 173 through the suction block 191. The absorbent rubber 195 is a portion which comes into contact with the semiconductor package. The suction port 196 communicates with the suction rubber 195 through the fluid passage 191a in the suction block 191 and is connected to the suction pipe.

According to this configuration, the actuating plate 133 of the damper unit 130 can be supported by the fluid injected into the internal space S. The fluid is injected into the inner space S through the fluid passage 115 of the frame unit 110 and the through hole 131a 'of the upper housing 131a.

In the centering unit 150, centering is performed on the plug block 153 with respect to the main block 151. This is accomplished by a centering mechanism 152 that connects them. Specifically, the ball 152b of the centering mechanism 152 is resiliently supported by the spring 152c and tends to be positioned in the dish 152a. Thus, even if the main block 151 moves out of position, it returns to the state aligned with the plug block 153 by the action of the plate 152a, the ball 152b, and the spring 152c.

In the heating unit 170, the plate-like heater 171 applies heat to the adsorption block 191 over the entire area. Thereby, the semiconductor package adsorbed by the adsorbing rubber 195 is uniformly heated by the plate-like heater 171. [

At this time, the absorption unit 190 is connected to the heat insulating block 173 by the first fastening piece 193 and the heat insulating block 173 is connected to the centering unit 150 by the second fastening piece 179 The heat of the plate-like heater 171 is not transmitted to the centering unit 150 beyond the heat insulating block 173. [

The coupling relationship between the plug block 153 of the centering unit 150 and the connecting rod 135 of the damper unit 130 will be described with reference to FIGS. 4 and 5. FIG.

4 is a perspective view for explaining the coupling relationship between the centering unit 150 and the damper unit 130 of the semiconductor package adsorption and pressurizing apparatus 100 of Fig. 1, Fig. 5 is a perspective view of the semiconductor package adsorption and pressurization apparatus 100 of Fig. And FIG.

Referring to these figures, the plug block 153 may have a base portion 154 and a connecting portion 157.

The base portion 154 is a generally plate-shaped plate, and may have a through hole 155 at the center thereof. The through hole 155 is formed to have a size through which the connection rod 135 passes.

The connecting rod 157 is formed so as to protrude from the base portion 154 in correspondence with the through hole 155. The connecting rod 157 may be a pair of protrusions protruding from both sides of the through hole 155 as shown in Fig. A connection hole 158 is formed in the connection block 157.

According to this configuration, the third fastening piece 159 is inserted into the connecting hole 158 of the connecting rod 157 in a state where the connecting rod 135 is inserted into the through hole 155 and disposed between the pair of connecting rods 157 And is inserted and fastened to the connecting rod 135.

At this time, the third fastening piece 159 can be inserted into the connection hole 158 from the side of the main block 151 through the opening hole 151b of the main block 151. This makes it possible to easily engage / disengage between the plug block 153 and the connecting rod 135, and further, to engage / disengage the damper unit 130 and the centering unit 150.

The above-described semiconductor package adsorption / pressurizing device is not limited to the construction and the operation manner of the embodiments described above. The embodiments may be configured so that all or some of the embodiments may be selectively combined so that various modifications may be made.

100: semiconductor package adsorption and pressurizing device 110: frame unit
130: damper unit 131: housing
133: actuating plate 135: connecting rod
137: sealing member 150: centering unit
151: main block 153: plug block
159: third fastening piece 170: heating unit
171: Plate type heater 173: Heat insulating block
190: absorption unit

Claims

A damper unit;
A centering unit connected to the damper unit and configured to be posture-aligned;
An adsorption unit configured to adsorb a semiconductor package; And
And a heating unit including a plate-like heater which connects them between the centering unit and the adsorption unit and is arranged opposite to the adsorption unit, and a heat-insulating block which is disposed between the plate-like heater and the centering unit and has a fastening groove ,
The adsorption unit includes: an adsorption block; And a first fastening piece connected to the adsorption block and inserted in the fastening groove to fasten the adsorption block and the heat insulating block.

delete

The method according to claim 1,
In the heat insulating block,
A plate portion corresponding to the centering unit; And
And a fastening boss portion protruding from the plate portion and having the fastening groove formed therein.

The method of claim 3,
The heating unit includes:
And a second fastening piece located outside the fastening boss portion and fastening the heat insulating block to the centering unit.

The method according to claim 1,
The damper unit includes:
A housing having an inner space;
An operating plate disposed in the inner space and supported by a fluid flowing into the inner space; And
And a connection rod connected to the actuation plate and penetrating the housing and connected to the centering unit.

6. The method of claim 5,
The damper unit includes:
Further comprising a sealing member that is provided at a portion of the housing through which the connection rod penetrates and seals a gap between the housing and the connection rod.

6. The method of claim 5,
The centering unit,
A main block having an opening hole laterally opened;
A third fastening piece inserted through the opening hole; And
And a plug block coupled to the main block and coupled to the connection rod by the third fastening piece.

8. The method of claim 7,
The plug block includes:
A base portion corresponding to the damper unit and including a through hole through which the connection rod penetrates; And
And a connection block protruding from the base portion in correspondence with the through hole and having a connection hole through which the third fastening piece is inserted and connected.

6. The method of claim 5,
Further comprising a frame unit having the damper unit coupled thereto and having a fluid passage communicating with the internal space.