KR20130099783A - Semiconductor device inspection apparatus - Google Patents

Abstract

PURPOSE: An element inspection device including a picker module combined with pickers is provided to effectively maintain a transmission tool. CONSTITUTION: An element inspection device comprises a loading unit (100), a test unit (300), an unloading unit (500), and transmission tools (810-840). The loading unit loads a plurality of elements on one or more trays. The test unit comprises a plurality of test sockets for testing each element transmitted from the loading unit. The unloading unit classifies the elements which are tested according to the test results of the test unit. The transmission tools transfers the elements in the loading unit, the test unit, and the unloading unit. The transmission tool includes a pair of third transmission tools transmitting the elements from the test unit to the unloading unit. The third transmission tools comprise one or more picket modules combined with the pickers.

Description

Semiconductor device inspection apparatus

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus for inspecting an electrical characteristic or the like for a element.

Semiconductor devices (hereinafter referred to as "devices") are subjected to various inspections such as electrical properties, heat or pressure reliability test by the semiconductor device inspection device after the packaging process.

The inspection of the device includes various tests such as non-memory devices such as memory devices, CPUs and GPUs, room temperature tests performed in a room temperature environment, and heating tests performed in a high temperature environment, depending on the type of devices such as LED devices and solar devices.

Meanwhile, as the variety of IT devices such as smart phones, smart pads, and smart TVs becomes more popular, the demand for non-memory devices such as CPUs, or LSIs, is increasing rapidly.

However, in the case of LSI, the types of tests are diversified according to the variety of types compared to memory devices, and thus the size of the LSIs cannot be uniformly performed.

In particular, the LSI has a problem that it is difficult to use expensive inspection equipment because the inspection quantity is small compared to the inspection device of a standardized memory device due to the characteristics of small quantities of various kinds.

It is an object of the present invention to provide a device inspection apparatus capable of inspecting various kinds of LSI devices while quickly performing the inspection of the LSI devices of a small quantity.

Another object of the present invention is to provide a device inspection apparatus that can easily reduce the production cost of the device by reducing the maintenance cost of the device by easily configuring the maintenance of the device.

Still another object of the present invention is to provide a device handler which can easily reduce the production cost of the device by reducing the maintenance cost of the device by easily configuring the maintenance of the device.

SUMMARY OF THE INVENTION The present invention has been made in order to achieve the above-mentioned object of the present invention, and it is an object of the present invention to provide a loading unit in which one or more trays loaded with a plurality of elements are loaded; A test unit including a plurality of test sockets for testing each device by receiving the devices from the loading unit; An unloading unit configured to classify and load the tested elements according to the test result of the test unit; And one or more transfer tools for transferring an element between the loading unit, the test unit, and the unloading unit, wherein the transfer tool transfers the elements from the loading unit to the test unit or from the test unit to the unloading unit. A pair of third transfer tools for delivering an element, said third transfer tools including a support that is movably installed and one or more picker modules detachably coupled to the support and to which one or more pickers are coupled; An element inspection apparatus is disclosed.

The picker module may include a heater, a temperature sensor, and one or more first connectors for power supply and signal transmission to the heater and the temperature sensor.

The first connector may be connected by insert coupling with the second connector installed on the support.

The first connector and the second connector may be coupled together when the support and the picker module are coupled.

The first connector and the second connector may be installed at portions in contact with each other when the support unit and the picker module are coupled to each other.

The device inspection apparatus may further include a cleaning unit installed on one side of the test unit to remove foreign substances from the test socket by injecting air in a state in which the test socket is covered by movement.

The cleaning unit may include a main body covering the test socket and forming a cleaning space on the test socket, and a driving unit for moving the main body between one side of the test unit and the upper part of the test socket.

The main body may be provided with an air passage connected to an air supply device so as to inject air into each test socket and one or more nozzles receiving air from the air passage and injecting air into the test socket.

The main body may be formed to maintain the cleaning space in a sealed state, and the main body may be connected to a discharge pipe so that foreign matter is discharged from the cleaning space to the outside together with the air injected through the nozzle.

The transfer tool includes a plurality of pickers each having a suction pad coupled to an end thereof, and at least one transfer tool of the transfer tool is capable of automatically replacing the suction pads respectively coupled to the pickers. It may further comprise a wealth.

The adsorption pad exchanger includes at least two adsorption pad accommodation portions in which a plurality of adsorption pad accommodation spaces into which the adsorption pads of the picker are inserted, and at least some of the adsorption pad accommodation portions are accommodated in the adsorption pad accommodation space. And a suction pad pick-up unit for picking up the suction pad, wherein at least some of the suction pad accommodating units provided with the suction pad pick-up unit are configured to separate and accommodate the suction pad by the pad pick-up unit from the pickers. In this case, at least some of the adsorption pad accommodation portions of the adsorption pad accommodation portions may be inserted with a suction pad to be replaced so that the adsorption pad may be coupled to the removed picker.

The adsorption pad accommodation portion includes an accommodation portion body in which the plurality of adsorption pad accommodation spaces are formed, and the adsorption pad pickup portion is installed in the accommodation portion body to allow the adsorption pad to be coupled to the picker. After insertion, the suction pad may be picked up.

The suction pad pick-up part includes a moving member installed to cover the upper surface of the accommodating unit body and to move in a direction parallel to the upper surface, wherein the moving member penetrates while the suction pad is coupled to the picker. A plurality of through parts formed to be movable to the adsorption pad accommodation space and connected to each of the through parts, and the adsorption pad when the adsorption pad is moved from the adsorption pad accommodation space in a state in which the adsorption pad is coupled to the picker; Is locked and may include a plurality of locking portions formed such that only the picker is movable.

The suction pad has a protrusion protruding more than the outer circumferential surface of the picker, and the locking portion is formed larger than the outer circumferential surface of the picker and smaller than the outer circumferential surface of the picker so that the suction pad may be caught when the picker moves upward.

The device inspecting apparatus includes a loading buffer unit for temporarily receiving elements from a tray of the loading unit through a first transfer tool; The apparatus may further include an unloading buffer unit which is installed at a position opposite to the loading buffer unit with respect to the test unit and receives the elements in which the test unit is completed.

The device inspecting apparatus may include a first shuttle unit and a first shuttle unit configured to receive elements from the loading buffer unit by the one or more transfer tools and to transfer the elements to the test unit or to receive elements from the test unit and to transfer the elements to the unloading buffer unit. It may include two shuttle parts.

The first shuttle part and the second shuttle part are installed to face each other with respect to the test part, and the first shuttle part and the second shuttle part are moved along the guide rail and the guide rail, respectively, to move the device from the loading buffer part. At least one shuttle plate may be alternately moved between a first device transfer location for receiving the device, a device exchange location with the test unit, and a second device delivery location for delivering devices to the unloading buffer unit.

The cleaning part may be installed between the first shuttle part and the second shuttle part.

The transfer tool transfers the elements loaded on the shuttle plate to the test unit while moving between the first shuttle unit and the test unit, and between the second shuttle unit and the test unit, respectively, or from the test unit to the shuttle plate. It may include a pair of transfer tools for delivering the device to the furnace.

The device inspection apparatus according to the present invention has an advantage of inspecting various types of LSI devices while quickly performing a small amount of various kinds of LSI devices.

In addition, the device inspection apparatus according to the present invention has the advantage that can be significantly reduced the production cost of the device by reducing the maintenance cost of the device by easily configuring the maintenance of the device.

In addition, the device inspection device or the device handler according to the present invention is a suction pad that can automatically replace the suction pad from the picker, compared to the prior art that the operation of the device is stopped for replacement of the suction pad and the device is restarted after manual replacement By providing an additional exchange part, there is an advantage that can greatly improve the productivity of the equipment.

In addition, the device inspection apparatus according to the present invention has a support part which is movably installed in the configuration of the transfer tool, and at least one picker module detachably coupled to the support portion and one or more pickers are coupled to maintain the maintenance of the transfer tool There is an easy advantage.

In addition, the device inspection apparatus according to the present invention is provided with at least one first connector for power supply and signal transmission to the heater and the temperature sensor is installed, the second connector is installed in the support portion when the support and the picker module constituting the transfer tool and It is automatically connected, so there is no need for a separate connection for power supply and signal transmission, and there is an advantage in that the device is easily manufactured and maintained.

In addition, the device inspection apparatus according to the present invention is installed on one side of the test unit by injecting air in a state in which the test socket is covered by the movement further includes a cleaning unit for removing the foreign matter from the test socket by the foreign matter in the test socket There is an advantage in that the performance of the device can be greatly improved by preventing the error of the test or making the test operation impossible.

1 is a plan view showing an example of a device inspection apparatus according to the present invention.
FIG. 2 is a plan view illustrating an example of a plate member of a loading buffer unit and an unloading buffer unit of the device inspection apparatus of FIG. 1.
3A is a conceptual view showing a first shuttle unit and a second shuttle unit of the device inspection apparatus of FIG.
4A and 4B are conceptual views illustrating a configuration of a cleaning unit.
5A and 5B are conceptual views illustrating the operation of the third transfer tool.
6 is a conceptual diagram showing a configuration for vertical driving of the third transfer tool.
7 and 8 are conceptual diagrams showing an example of the third transfer tool.
9A is a perspective view showing a portion of a picker and a suction pad.
Figure 9b is a conceptual diagram showing the configuration of the adsorption pad exchanger for the automatic effect of the adsorption pad in the picker of Figure 9a.
10A and 10B are partial cross-sectional views of the adsorption pad exchanger showing a process of exchanging the adsorption pads from the pickers, respectively.
11A and 11B are partial plan views of the adsorption pad exchanger, respectively, illustrating a process of exchanging the adsorption pads from the picker, respectively.

Hereinafter, a device inspection apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

The device inspection apparatus according to the present invention, as shown in Figure 1, the loading unit 100 is loaded with one or more trays 2 are loaded with a plurality of devices (1); A test unit 300 including a test socket 310 for testing each device 1 by receiving the devices 1 from the loading unit 100; The unloading unit 500 classifies and loads the devices 1 through the second transfer tool 820 according to the test result of the test unit 300.

Here, the transfer of the device 1 between the loading unit 100, the test unit 300 and the unloading unit 500 may be implemented by various methods, one or more third transfer tool, for example, It may be implemented by a pair of third transfer tools (830, 840).

The loading unit 100 and the unloading unit 500 are configured such that one or more trays 2 loaded with a plurality of devices 1 are loaded and may have various configurations according to design and design, 2) may be stacked on a tray mounting portion (not shown).

For example, as shown in FIG. 1, the loading unit 100 includes a plurality of trays 2 that are appropriately disposed so that the first transfer tool 810 may pick up and transfer the device 1 without interruption. The tray 2 in which the elements 1 are emptied can be configured to be replaced with the tray 2 in which the elements 1 are filled. Here, the tray 2 is automatically transferred to a position where the first transfer tool 810 can withdraw the element 1 from the tray loading part after the trays 2 are automatically loaded into the tray loading part or automatically. Can be.

At this time, the empty tray 2 from which the devices 1 are taken out can be transferred to the unloading unit 500 by a tray transferring unit (not shown), and the tray 2 can be transferred to the unloading unit 500, (Not shown) so as to remove the element 1 that has not been drawn out of the tray.

Meanwhile, the unloading unit 500 is configured similarly to the loading unit 100, and as shown in FIG. 1, the second transfer tool 820 classifies and loads the elements 1 according to a test result without interruption. A plurality of empty trays 2 are suitably arranged according to the classification class, and the tray 2 filled with the elements 1 may be configured to be replaced with the empty tray 2.

Further, a tray buffer unit (not shown) may be additionally installed between the loading unit 100 and the unloading unit 500 so that the empty tray 2 can be temporarily loaded.

The tray 2 may have a variety of configurations, for example, the receiving grooves 2a are formed according to a predetermined standard such as 8 × 16 so that a plurality of devices 1 can be stacked.

The device 1 to be inspected may be a non-memory device such as a memory semiconductor, a CPU, a GPU, and a system LSI. Particularly, it is preferable that the object to be inspected be a non-memory element, particularly a device having ball-shaped contact terminals formed on the bottom face thereof.

On the other hand, the configuration of the loading unit 100 and the unloading unit 500 is installed inside the device, such as the device inspection apparatus shown in Figure 1, although not shown, the loading buffer 100 and the unloading buffer to be described later It may be installed below the portion 500.

On the other hand, the device inspection apparatus according to the present invention, in order to increase the feed rate for the device (1) (or sufficient heating is performed for the test of the device 1), from the tray 2 of the loading section 100 A loading buffer unit 200 that receives the elements 1 through the first transfer tool 810 and temporarily loads the elements 1; It may further include an unloading buffer unit 400 which is installed at a position opposite to the loading buffer unit 200 with respect to the test unit 300 and receives the elements 1 that have been tested by the test unit 300. Can be.

The loading buffer unit 200 receives the element 1 from the loading unit 100 and temporarily loads the element 1 to the testing unit 300. The unloading buffer unit 400 receives the element 1 from the testing unit 300, 1 to the unloading unit 500, and various configurations are possible.

Particularly, the loading buffer unit 200 and the unloading buffer unit 400 can transfer a relatively large number of devices 1 to the test unit 300 in the tray 2 on which the relatively small number of the devices 1 are loaded. It is preferable that the tray 1 is configured to load a larger number of elements 1 than the number of elements 1 that the tray 1 can load.

1 and 2, the loading buffer unit 200 and the unloading buffer unit 400 have a plurality of loading grooves 211 and 411 formed on the upper surface thereof so that the devices 1 can be loaded thereon. And plate members 210 and 410 in the form of plates.

Here, the loading buffer part 200 and the plate members 210 and 410 of the unloading buffer part 400 may be configured to be substantially the same, but according to the conditions required before the test such as heating (preheating) required for the test. There may be differences such as the addition of a device for imparting the condition, such as a heater.

In addition, the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 may be disposed at intervals between the test sockets 310 of the test unit 300. It may be arranged in accordance with the interval corresponding to the interval of the receiving groove (2a) of the tray (2).

In addition, the loading grooves 211 and 411 of the plate members 210 and 410 may be disposed at intervals between the pickers 831 and 641 of the third transfer tool 830 and 840 to facilitate device exchange with the test unit 300. 1 / n, for example 1/2. Where n is a natural number greater than or equal to 2.

The intervals between the receiving grooves 2a of the tray 2 and the spacing between the loading grooves 211 and 411 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 The intervals of the test receptacles 310 of the test portion 300 may be formed to be n times, for example, twice as long as the intervals of the receiving grooves 2a of the tray 2. [

In particular, the loading grooves 211 and 411 of the plate members 210 and 410 of the unloading buffer unit 400 are disposed at 16 × 8, and the test sockets 310 of the test unit 300 are disposed at 8 × 4. In this case, the third transfer tools 830 and 840 which will be described later may include pickers 831 and 641 arranged at 8 × 4 at intervals corresponding to the test sockets 310 of the test unit 300, thereby allowing 8 × 4 at a time. It is possible to transfer the elements (1) of.

In particular, the third transfer tool (830, 840) is the element 1 in the loading grooves (211, 411) of the plate member 210, 410 of the loading buffer portion 200 and the unloading buffer portion 400 By skipping the cells one by one or by stacking them, it is unnecessary to adjust the spacing between the pickers 831 and 641, thereby speeding up device transfer.

Meanwhile, the plate members 210 and 410 may be variously configured, such as being installed in a fixed state or movably installed as a device for temporarily replacing devices 1 and exchanging elements with the test unit 300. .

The test unit 300 is configured to receive the element 1 from the loading buffer unit 200 and to transfer the element 1 to the unloading buffer unit 400 in order to classify the element according to the test result after the test. As shown in FIG. 1, a plurality of test sockets 310 are installed.

The test socket 310 may be arranged in various ways, such as 8 × 2, 8 × 4, a configuration for connecting the terminal of the device 1 for the test of the device 1, various configurations are possible, As described, it may be installed to be replaced according to the type of device, test type, and the like.

Meanwhile, the test unit 300 can be configured as a PCB board having a test socket 310, which is a simple structure according to the configuration, and can be independently configured as a modularized structure.

Particularly, when the test unit 300 is implemented as a PCB board having the test socket 310, it is possible to significantly reduce the configuration cost of the test unit 300, which is relatively expensive.

On the other hand, the test unit 300 can be variously tested, and more preferably, can be configured to be capable of only testing at room temperature.

On the other hand, the test unit 300 may include a chamber member surrounding a portion including the test socket 310 in order to minimize the change in temperature in the case of a test related to temperature such as a high temperature test.

On the other hand, the element exchange between the test unit 300, the loading buffer unit 200 or the unloading buffer unit 400 is not made directly from the loading buffer unit 200 by the third transfer tool (830, 840) The first shuttle unit 610 which receives the elements 1 and transmits the element 1 to the test unit 300 or receives the element 1 from the test unit 300 and delivers the element 1 to the unloading buffer unit 400. And the second shuttle unit 620.

The first shuttle part 610 and the second shuttle part 620 may be configured in various ways as a device for exchanging an element between the test part 300 and the loading buffer part 200 or the unloading buffer part 400. Do.

For example, the first shuttle unit 610 and the second shuttle unit 620 are guide rails 611 and 621 which are installed to face each other with respect to the test unit 300 as shown in FIG. 1. The device is moved along the guide rails 611 and 621 to transfer the device to the first device transfer position for receiving the device from the loading buffer unit 200, the device exchange position with the test unit 300, and the unloading buffer unit 400. It may include one or more shuttle plates (612, 622) which are alternately moved to the second element transfer position for delivery.

Here, the first element transfer position, the element exchange position, and the second element transfer position may be variously arranged according to the configuration of the apparatus, and may be sequentially arranged in a straight line.

Meanwhile, the guide rails 611 and 621 may be configured to guide the movement of the shuttle plates 612 and 622.

One or more shuttle plates 612 and 622 may be installed to seat the device 1 on which the device 1 is seated for device replacement between the test unit 300 and the loading buffer 200 or the unloading buffer 400. Grooves are formed.

The shuttle plates 612 and 622 may have a configuration similar to that of the loading plate (see FIG. 3A) described above.

On the other hand, when the type of the device 1 to be inspected, in particular, the size of the device 1 is changed, the shuttle plates 612 and 622 on which the device is mounted also need to be replaced.

Accordingly, as shown in FIGS. 1, 3A, and 3B, the first shuttle part 610 and the second shuttle part 620 may include the shuttle plates 612 and 622 by the plate detachable parts 614 and 624. It may further include a plate fixing portion (613, 623) detachably coupled and installed to move along the guide rails (611, 621).

The plate fixing parts 613 and 623 are provided for the convenience of replacement of the shuttle plates 612 and 622, and various configurations are possible, and a heater for heating the element 1 may be installed.

Meanwhile, the plate detachable parts 614 and 624 may be configured in various ways as a configuration for detaching the shuttle plates 612 and 622 from the plate fixing parts 613 and 623, and the shuttle plate may be formed by a simple manual operation as shown in FIG. 612 and 622 may be configured to be detachable.

On the other hand, the test unit 300 may generate a situation in which the test is impossible, such as foreign matters flowing into the test socket 310. In this case, the trouble of having to restart the device after removing the foreign matters by stopping the operation of the device by manual operation. there was.

The present invention is installed on one side of the test unit 300 is added to the cleaning unit 700 for removing foreign matters from the test socket 310 by injecting air in a state in which the test socket 310 is covered by the movement. It can be included as.

The cleaning unit 700 may be configured in various ways. As shown in FIGS. 4A and 4B, the cleaning unit 700 covers the test socket 310 and forms a cleaning space on the test socket 310. The driving unit 720 may move the main body 710 between one side of the test unit 300 and an upper portion of the test socket 310.

The main body 710 may be configured to cover the test socket 310 and to form a cleaning space on the test socket 310, and may have various shapes, and may have various shapes such as a bowl shape to form a closed cleaning space. In addition, the air is injected from the air passage 711 and the air passage 711 connected to the air supply device (not shown) to inject air into each test socket 310 to inject air to the test socket 310 One or more nozzles 712 may be installed.

In addition, the main body 710 may be connected to the discharge pipe 713 so that the foreign matter is discharged to the outside from the cleaning space with the air injected through the nozzle 712.

The driving unit 720 is configured to move the main body 710 between one side of the test unit 300 and the test socket 310 may be configured in a variety of configurations, such as a hydraulic cylinder, pneumatic cylinder.

Here, when the first shuttle unit 610 and the second shuttle unit 620 including the guide rails 611 and 621 described later are installed, the cleaning unit 700 may include the first shuttle unit 610 and the second shuttle unit. The driving unit 720 installed in the 620 may be configured to linearly move the main body 710 in a direction parallel to the guide rails 611 and 621.

The first conveying tool 810 and the second conveying tool 820 are respectively loaded from the loading part 100 to the loading buffer part 200 and the unloading buffer part 400 to the unloading part 500. ), A configuration including a plurality of pickers for picking up the element (1) and a driving device for driving the movement of the plurality of pickers in the vertical direction (Z direction) and the horizontal direction (XY direction), etc. Can be.

The picker is a component for picking up the element 1 and transporting it to a predetermined position, which can be configured in various ways. Can be configured.

The pickers are mounted on the tray 2 of the loading unit 100 and the unloading unit 500 and the loading grooves 211 of the plate members 210 and 410 of the loading buffer unit 200 and the unloading buffer unit 400 And 411 may be arranged to be adjustable in consideration of the case where the intervals of the semiconductor elements 10 are different from each other. However, in order to allow a greater number of semiconductor elements 10 to be transferred, have.

In particular, the pickers of the first transfer tool 810 may be pickers of the third transfer tools 830 and 840 when the pickers of the first transfer tool 810 are arranged in 8 × 4 (8 × 2) to enable the transfer of a larger number of semiconductor devices 10. 831 and 841 may be arranged in 8 × 4 (8 × 2). Here, the second transfer tool 820 may be configured to be the same as or similar to the configuration of the first transfer tool 810.

The driving device may be configured in various ways according to the driving mode of the pickers, and may include a vertical movement device for moving the pickers up and down and a horizontal movement device for moving in the horizontal direction.

The up-and-down moving device may be configured to move the entire pickers up and down at a time, or may be connected to each of the pickers such that each of the pickers is independently moved up and down.

The horizontal direction moving device can be configured in various ways according to the moving mode of the pickers, and can be configured to move in a single direction in the X direction or the Y direction, or in the X-Y direction.

The third transfer tool 830, 840 is a component for transferring the device 1 between the test unit 300, the first shuttle part 610, and the second shuttle part 620. Various configurations are possible according to the transport mode of the).

For example, as illustrated in FIGS. 5A and 5B, the third transfer tools 830 and 840 are installed in pairs and move between the first shuttle part 610 and the test part 300. 830, a transfer tool 840 moving between the second shuttle 620 and the unloading buffer 400.

The third transfer tool 830 and 840 may have a structure similar to the first transfer tool 810 and the second transfer tool 820.

As illustrated in FIGS. 5A and 5B, the third transfer tools 830 and 840 may be moved in cooperation with each other for the convenience of device replacement.

Meanwhile, in the case of the transfer tool located on the test unit 300 among the pair of third transfer tools 830 and 840, the device 1 is secured on the device 1 and the test socket 310. The test socket 310 needs to be pressurized with a constant force.

Accordingly, as shown in FIG. 6, the third transfer tools 830 and 840 may be vertically driven by the cam member 890 in the vertical driving part.

The cam member 890 is restrained and coupled to the guide member 891 installed at the upper end of the third transfer tool 830, 840 so that the third transfer tool 830, 840 is vertically driven by the rotation of the cam member 890. Cam groove 892 may be formed to be so.

As shown in FIG. 6, the cam groove 892 is formed to include a first radius section and a second radius section having a constant radius, and a variable section connecting the first radius section and the second radius section.

When the cam groove 892 is configured as described above, when the guide member 891 is in the first radius section having a small radius, the guide member 891 is positioned at an upper side, and is moved upwards or downwards when it is in a variable section. In the second radius section having a radius larger than the first radius section maintains the state located below.

In this case, when the guide member 891 is positioned in the second radius section, the third transfer tool 830 or 840 is in a constant radius regardless of the change in the voltage applied to the driving motor for the rotation of the cam member 890. It is possible to press the test socket 310 constantly without changing the pressing state of the device (1).

Meanwhile, since the test unit 300 needs to perform a test under a constant temperature, it is preferable that the third transfer tools 830 and 840 that pick up the device 1 on the test unit 300 also heat the device 1. .

Accordingly, the third transfer tools 830 and 840 may be provided with a heater (not shown) as shown in FIGS. 7 and 8.

In this case, the third transfer tools 830 and 840 need to replace the pickers 831 and 841 according to the type and size of the device 1.

Accordingly, the third transfer tool 830, 840 is detachably coupled to the support parts 833 and 843, which are movably installed in the apparatus, and the support parts 833 and 843, and one or more pickers 831 and 841 are coupled thereto. It may include one or more picker modules 834, 844.

The support units 883 and 843 may have any structure as long as the support units 883 and 843 can support the picker modules 834 and 844.

The picker modules 834 and 844 include a main body to which one or more pickers 831 and 841 are coupled and coupled to the support parts 833 and 843 by screws, brackets, and the like, wherein the main body includes a heater (not shown) and a temperature sensor. Etc. may be installed.

In this case, the picker modules 834 and 844 may be installed with the support parts 833 and 843 and the heat insulating members 835 and 845 for thermal insulation in consideration of the installation of a heater and a temperature sensor, and supplying power to the heater and the temperature sensor. And one or more first connectors 836 and 846 for signal transmission.

The first connectors 836 and 846 include a first terminal provided with terminals, and a second terminal electrically connected to the first terminal by insertion, and the like. Various configurations are possible, such as combined with each other.

Meanwhile, as shown, the support parts 883 and 843 are coupled to the first connectors 836 and 846 when combined with the picker modules 834 and 844 to supply power and signal to the heater and the temperature sensor. The connector is installed.

Power supply to the heater and the temperature sensor by the combination of the picker module 834, 844 and the support portion 883, 843 without a separate connection work by the configuration of the first connector 836, 846 and the second connector as described above And signal transmission becomes possible.

That is, the first and second connectors 836 and 846 and the second connector are installed at the parts in contact with each other when the picker modules 834 and 844 and the support parts 883 and 843 are coupled to each other, so that the picker modules 834 and 844 and the support part ( 883, 843 are automatically connected upon mutual coupling.

Meanwhile, the pickers 891 of the first to third transfer tools 810, 820, 830, and 840 for transferring the device 1 may be easily absorbed by the device 1 as illustrated in FIGS. 9A and 9B. At the end thereof, a suction pad 892 having a material such as rubber is provided. When there is a change in the element 1, when there is a failure in adsorption due to abrasion, the suction pad 892 is replaced in case of maintenance or the like. Must be replaced.

However, the replacement of the adsorption pad 892 is made by hand in the conventional case, and there is a very inconvenient problem such as separating the pickers 891 and replacing them one by one.

In the present invention, at least one of the first to third transfer tools 810, 820, 830, and 840 may automatically replace the suction pads 892 respectively coupled to the pickers 891. Adsorption pad exchanger 900 may be further included.

The suction pad exchanger 900 may be positioned at an appropriate position in consideration of the copper lines of the first to third transfer tools 810, 820, 830, and 840, in particular, the first transfer tool 810 and the second transfer tool 820. 9A to 11B, adsorption pad accommodation portions 910 and suction pad accommodation portions 910 having a plurality of suction pad accommodation spaces 911 into which the suction pads 892 of the picker 891 are inserted, are provided; It may include an adsorption pad pickup unit 920 installed at at least some of the accommodation units 911 and picking up the adsorption pads accommodated in the adsorption pad accommodation space 911.

Here, at least some of the adsorption pad accommodation units 910 in which the adsorption pad pickup unit 920 is installed are adsorbed to separate and accommodate the adsorption pad 892 by the pad pickup unit 920 from the pickers 891. The pad receiving space 911 is empty, and the suction pad receiving portion 910 of at least some of the suction pad pickup portions 920 may be replaced by a new suction pad 892 to be superseded by the picker 891 from which the suction pad 892 has been removed. ) Is inserted.

The suction pad accommodating part 910 is formed by a plurality of suction pads 892, so that the suction pads 892 are separated from the pickers 891 by the pad pick-up part 920, or the suction pads 892 are provided. Various configurations are possible as a configuration in which a new suction pad 892 to be replaced is inserted into the removed picker 891.

As an example, the suction pad accommodating part 910 may include a receiving part body 912 in which a plurality of suction pad accommodating spaces 911 are formed.

The accommodation unit body 912 is a configuration in which the adsorption pad accommodation spaces 911 are formed, and various configurations are possible.

The adsorption pad accommodation space 911 accommodates the adsorption pad 892 separated from the picker 891, or the adsorption pad 892 is configured to accommodate a new adsorption pad 892 to be coupled to the separated picker 891. As the suction pad 892 can be accommodated, various configurations such as grooves are possible.

The suction pad pickup unit 920 is configured to separate the suction pad 892 from the pickers 891 by the pad pick-up unit 920. Various configurations are possible, such as being configured to pick up the adsorption pad 892 after being inserted into the adsorption pad accommodation space 911 in a state coupled to the picker 891.

For example, the suction pad pickup unit 920 can be configured in various ways according to the pick-up method such as pick-up / pick-up release through engagement and release, clamping using a ring type clamper, Do.

As another example, the adsorption pad pick-up unit 920 includes a moving member 921 which covers the upper surface of the accommodating body 912 and is movable in a direction parallel to the upper surface, that is, in a horizontal direction. can do.

In this case, the movable member 921 may be configured in various ways as a configuration for picking up / un-picking up through locking and releasing by horizontal movement. For example, as illustrated in FIGS. 10A to 10C, the suction pad 892 may be used. ) Is coupled to the picker 891 and the plurality of penetrating portions 922 are formed so as to be movable to the suction pad accommodation space 911 and are connected to each of the penetrating portions 922 and the suction pad 892. ) Includes a plurality of locking portions 923 formed so that the adsorption pad 892 is engaged and only the picker 891 is movable when it is moved from the adsorption pad accommodation space 911 in a state coupled to the picker 891. Can be.

In particular, in order to increase the locking effect by the movable member 921, the suction pad 892 may have a protrusion 892a which protrudes more than the outer circumferential surface of the picker 891, and the locking part 923 is a picker ( The suction pad 892 may be larger than the outer circumferential surface of the 891 and smaller than the outer circumferential surface of the protrusion 892a so that the adsorption pad 892 may be caught when the picker 891 moves upward.

That is, the moving member 921 of the suction pad pick-up unit 920 has a radius of a picker 891 to which the suction pad 892 and the suction pad 892 are coupled, so that the suction pad 892 is different. When the adsorption pad 892 is inserted into the adsorption pad accommodation space 911 by providing a through portion 922 larger than the maximum radius of the hook portion and a locking portion 923 having a small radius at least in part of the adsorption pad 892. The penetrating portion 922 may be positioned on the suction pad accommodation space 911 and the locking portion 923 may be positioned when the suction pad 892 is separated from the picker 891.

Meanwhile, the moving member 921 of the suction pad pick-up unit 920 is moved to the engaging and releasing position of the suction pad 892. The movement can be driven by this.

Meanwhile, the transfer tools 810, 820, 830, and 840, in particular, the first transfer tool 810 and the second transfer tool 820, may replace the suction pad 892 in the picker 891. Position of the unit 900, first move to the adsorption pad receiving unit 910 to which the adsorption pad pick-up unit 920 is coupled to separate the adsorption pad 892 (Figs. 10A to 10C), and then a new adsorption pad 892. ) Is moved to the adsorption pad accommodating part 910 accommodated and a new adsorption pad 892 is coupled (Figs. 10B and 10C), and after the replacement of the adsorption pad 892, the device 1 is transferred.

On the other hand, the configuration of the transfer tool (810, 820, 830, 840) for the transfer of the device 1 as described above, in addition to the device inspection apparatus, performs a classification process for performing the classification of the device in accordance with the inspection results performed in advance, An element handler that inspects an element and performs an inspection and classification process for classifying the element according to the inspection, which can be applied to an element handler that loads and loads elements in a tray and transfers a plurality of elements by one or more transfer tools. Of course.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

100: loading section 200: loading buffer section
300: Test section 400: Unloading buffer section
500: Unloading section

Claims (18)

A loading unit for loading one or more trays on which a plurality of elements are loaded;
A test unit including a plurality of test sockets for testing each device by receiving the devices from the loading unit;
An unloading unit configured to classify and load the tested elements according to the test result of the test unit;
At least one transfer tool for transferring the device between the loading unit, the test unit and the unloading unit,
The transfer tool includes a pair of third transfer tools to transfer the elements from the loading unit to the test unit, or transfer the elements from the test unit to the unloading unit,
The third transfer tools are device inspection apparatus comprising a support that is movably installed, and at least one picker module detachably coupled to the support and coupled to one or more pickers. The method according to claim 1,
The picker module includes a heater, a temperature sensor, and at least one first connector for power supply and signal transmission to the heater and the temperature sensor is installed. The method according to claim 2,
And the first connector is connected to the second connector installed in the support part by insertion coupling. Claim 3
And the first connector and the second connector are coupled together when the support and the picker module are coupled to each other. The method of claim 4,
And the first connector and the second connector are installed at portions in contact with each other when the support unit and the picker module are coupled to each other. The method according to any one of claims 1 to 5,
The device inspection apparatus is installed on one side of the test unit further comprises a cleaning unit for removing the foreign matter from the test socket by injecting air in a state in which the test socket is covered by the movement. The method of claim 6,
The cleaning unit
And a driving unit for moving the main body between one side of the test unit and an upper side of the test socket, the main body covering the test socket and forming a cleaning space on the upper part of the test socket. The method of claim 7,
The body
And an air passage connected to an air supply device so as to inject air into each of the test sockets, and at least one nozzle receiving air from the air passages and injecting air into the test sockets. The method according to claim 8,
Wherein the main body is formed to maintain the closed state of the cleaning space,
The main body is a device inspection device, characterized in that connected to the discharge pipe so that the foreign matter is discharged to the outside from the cleaning space with the air injected through the nozzle. The method according to any one of claims 1 to 5,
The transfer tool includes a plurality of pickers each coupled to the suction pad at the end,
At least one of the transfer tool of the transfer tool device inspection apparatus, characterized in that further comprises a suction pad exchange unit that can automatically replace the suction pads respectively coupled to the pickers. The method of claim 10,
The adsorption pad exchanger
Two or more adsorption pad accommodation portions having a plurality of adsorption pad accommodation spaces into which the adsorption pads of the picker are inserted, and an absorption pad installed at at least some of the adsorption pad accommodation portions to pick up the adsorption pads accommodated in the adsorption pad accommodation space; Including a pickup,
At least some of the adsorption pad accommodation portions provided with the adsorption pad pickup portion have the adsorption pad accommodation space vacated so that the adsorption pad can be separated from the pickers by the pad pick up portion and accommodated therein. At least some of the adsorption pad receiving unit is characterized in that the adsorption pad to be replaced so that the adsorption pad can be coupled to the picker removed. The method of claim 11,
The adsorption pad accommodation portion includes an accommodation portion body in which the plurality of adsorption pad accommodation spaces are formed.
The suction pad pick-up unit is installed in the receiving unit body, the device inspection apparatus, characterized in that the suction pad is inserted into the suction pad receiving space in a state coupled to the picker and then pick up the suction pad. The method of claim 12,
The suction pad pick-up part includes a moving member installed to cover the upper surface of the accommodating part body and to move in a direction parallel to the upper surface.
The moving member may include a plurality of through parts formed to be moved to the suction pad accommodation space through the suction pad coupled to the picker, and connected to each of the through parts, so that the suction pad is connected to the picker. And a plurality of engaging portions formed to allow the suction pad to move and to move only the picker when moved from the suction pad accommodation space in a coupled state. The method according to claim 13,
The suction pad is formed with a protrusion protruding more than the outer peripheral surface of the picker,
The locking portion is larger than the outer circumferential surface of the picker is formed smaller than the outer circumferential surface of the protruding portion device inspection device, characterized in that the suction pad is caught when the picker moves upward. The method according to any one of claims 1 to 5,
A loading buffer unit for receiving elements from the tray of the loading unit through a first transfer tool and temporarily loading the elements;
And an unloading buffer unit which is installed at a position opposite to the loading buffer unit with respect to the test unit and receives the elements that have been tested by the test unit. 16. The method of claim 15,
A first shuttle part and a second shuttle part receiving the elements from the loading buffer part by the one or more transfer tools and transferring the elements to the test part or receiving the elements from the test part and transferring the elements to the unloading buffer part; Device inspection apparatus characterized in that. 18. The method of claim 16,
The first shuttle unit and the second shuttle unit is installed to face each other centered on the test unit,
The first shuttle portion and the second shuttle portion are guide rails and a first device transfer position for receiving a device from the loading buffer part and moved along the guide rail, respectively, an element exchange position with the test part, and the unloading. And at least one shuttle plate which is alternately moved to a second device delivery position for delivering a device to a buffer unit. 18. The method of claim 16,
The transfer tool transfers the elements loaded on the shuttle plate to the test unit while moving between the first shuttle unit and the test unit, and between the second shuttle unit and the test unit, respectively, or from the test unit to the shuttle plate. Device inspection apparatus comprising a pair of transfer tools for transferring the device to the furnace.

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