WO2022216128A1

WO2022216128A1 - Fine-pitch semiconductor inspection device and fine-pitch semiconductor inspection method

Info

Publication number: WO2022216128A1
Application number: PCT/KR2022/005182
Authority: WO
Inventors: 정영배; 김종원; 유은지; 김형준; 이병주; 김기민
Original assignee: 주식회사 아이에스시
Priority date: 2021-04-09
Filing date: 2022-04-11
Publication date: 2022-10-13
Also published as: TWI820669B; TW202305372A

Abstract

The present invention relates to a fine-pitch semiconductor inspection device comprising: a connector for inspection in which a plurality of inspection sockets provided with multiple conductive portions are installed; a connector transfer part that grips and transfers the connector for inspection; a semiconductor transfer part that grips and transfers a semiconductor device; an inspection board for applying a signal for inspection to the inspection sockets; a first camera for photographing a pad of the inspection board and the conductive portions of the inspection sockets; a second camera for photographing a terminal of the semiconductor device and the conductive portions of the inspection sockets; and a control unit for receiving image data of the conductive portions, the terminal, and the pad received from the first camera and the second camera, and controlling the positions of the terminal, the conductive portions, and the pad so as to match.

Description

Fine-pitch semiconductor inspection device and fine-pitch semiconductor inspection method

The present invention relates to a fine-pitch semiconductor inspection apparatus and inspection method, and more particularly, to a fine-pitch semiconductor inspection apparatus and a fine-pitch semiconductor inspection method for inspecting the presence or absence of abnormality in a semiconductor device having terminals arranged at a fine pitch.

In an inspection process for determining whether a device to be inspected is defective, such as a manufactured semiconductor device, a connector for inspection is disposed between the device to be inspected and inspection equipment. The connector for inspection electrically connects the device to be inspected and the inspection equipment, and is used to determine whether the device to be inspected is defective based on whether the device to be inspected and the inspection equipment are energized.

If the terminal of the device under test is directly contacted with the pad of the test equipment without the connector for inspection, the pad of the test equipment may be worn out or damaged in the repeated inspection process, requiring replacement of the entire test equipment.

As such a connector for inspection, a structure in which a pin assembly unit assembled with a plurality of probe pins is assembled on a PCB board is known.

1 is a probe card 100 used for a conventional fine-pitch semiconductor inspection. Referring to FIG. 1 , the probe card 100 has a structure in which a pin assembly part in which a plurality of conductive parts exhibiting conductivity in the vertical direction, like the probe pin 101, is assembled to the PCB board 102, the probe pin ( 101) is in contact with the terminal of the semiconductor device and pressurized with a constant pressure. At this time, the probe card 100 transmits a test signal to the semiconductor device to check whether the semiconductor chip is in operation to determine whether the semiconductor device is abnormal.

Referring to FIG. 2 , the probe pin 101 is made of a metal material, and when the probe pin 101 is pressed with a constant pressure, the probe pin 101 is slightly bent in the horizontal direction to generate a stroke.

Referring to FIG. 3 , since the metal probe pin has high hardness, when pressed for inspection of the semiconductor device, the terminal 110 of the semiconductor device is damaged (deformed).

In addition, in recent years, the pitch of probe pins is also set to 200 mu m or less in order to inspect semiconductor device terminals having a fine pitch of 200 mu m or less. In this case, the pin assembly part is fixed to the PCB of the probe card by using the pin for fixing the position. When the precision is increased, there is a disadvantage in that the production cost of the semiconductor inspection device is increased.

The present invention was created to solve the above problems, and more specifically, a fine-pitch semiconductor inspection apparatus and a fine-pitch semiconductor inspection method that can increase the reliability of inspection by contacting terminals, pads, and conductive parts in one-to-one matching with each other. provided for technical purposes.

The present invention provides a fine-pitch semiconductor inspection apparatus and a fine-pitch semiconductor inspection method that enable precise electrical inspection by aligning inspection sockets, semiconductor devices, and inspection boards using image data of terminals, pads, and conductive parts photographed by a camera. for the technical purpose of providing

The present invention provides a fine-pitch semiconductor inspection apparatus and fine-pitch semiconductor inspection method that can significantly improve the lifespan of a connector for inspection by disposing a plurality of inspection sockets in a connector for inspection and sequentially using the inspection sockets to perform electrical inspection for the technical purpose of providing

A technical object of the present invention is to provide a fine-pitch semiconductor inspection apparatus and a fine-pitch semiconductor inspection method that can prevent damage to a pad or a terminal because a conductive part having excellent elasticity is applied to the inspection socket.

The fine-pitch semiconductor inspection apparatus of the present invention for achieving the above object,

A semiconductor inspection apparatus for performing an electrical inspection on a device to be inspected by electrically connecting a semiconductor device and an inspection board to each other, the semiconductor inspection apparatus comprising:

an inspection connector electrically connected to the semiconductor device and having a plurality of inspection sockets provided with a plurality of conductive parts extending in a vertical direction;

a connector transfer unit that grips and transfers the connector for inspection;

a semiconductor transfer unit that grips and transfers the semiconductor device;

an inspection board provided with a plurality of pads respectively connected to a plurality of conductive parts on an upper surface thereof, and applying a signal for inspection to the inspection socket in contact with the inspection socket;

a first camera positioned on the inspection board in a direction facing the upper surface of the inspection board and photographing the pad of the inspection board and the conductive part of the inspection socket;

a second camera positioned in a direction facing the lower surface of the test socket to photograph the terminal of the semiconductor device and the conductive part of the test socket; and

receiving the image data of the conductive part, the terminal, and the pad received from the first camera and the second camera, and measuring the positional coordinates of the test board, the test socket, and the semiconductor device;

and a control unit for controlling the connector transfer unit and the semiconductor transfer unit so that the positions of the terminal, the conductive unit and the pad coincide.

In the fine pitch semiconductor inspection apparatus,

The first camera may be an upper camera disposed on the inspection board, and the second camera may be a lower camera disposed under the inspection socket.

In the fine pitch semiconductor inspection apparatus,

The controller may control the connector transfer unit so that the pad and the conductive part are in one-to-one contact with each other by using the coordinates of the lower position of the conductive part of the test socket and the pad of the inspection board.

In the fine pitch semiconductor inspection apparatus,

The controller may control the semiconductor transfer unit so that the terminal of the semiconductor device and the upper portion of the conductive portion of the test socket contact each other in a one-to-one matching state using coordinates of the upper portion of the conductive portion.

In the fine pitch semiconductor inspection apparatus,

Some of the plurality of inspection sockets may be used for electrical inspection of a semiconductor device that requires inspection at the inspection position, and the rest may be arranged in a standby position.

In the fine pitch semiconductor inspection apparatus,

When the resistance of the inspection socket disposed at the inspection position is greater than or equal to a predetermined value, the control unit determines that the life of the inspection socket placed at the inspection position has expired, and sets one of the inspection sockets disposed in the standby position among the plurality of inspection sockets to the inspection position. It can be moved to perform an electrical test.

In the fine pitch semiconductor inspection apparatus,

The conductive part of the test socket,

A plurality of conductive particles may be vertically disposed in the elastic insulating material.

In the fine pitch semiconductor inspection apparatus,

An insulating part may be provided around the conductive part to support the conductive part and insulate it from the adjacent conductive part.

In the fine pitch semiconductor inspection apparatus,

The conductive part of the test socket,

It may be a pogo pin or a metal wire extending in the vertical direction.

In the fine pitch semiconductor inspection apparatus,

The connector for inspection further includes a frame in which a plurality of socket holes are formed, wherein the inspection socket may be respectively coupled to a plurality of socket holes of the frame.

In the fine pitch semiconductor inspection apparatus,

A connector tray in which a plurality of connectors for inspection can be accommodated is provided,

When the life of the connector for inspection is over, it can be replaced with another connector for inspection by the connector transfer unit.

The fine-pitch inspection apparatus of the present invention for achieving the above object is a fine-pitch semiconductor inspection apparatus for electrically connecting a semiconductor device and an inspection board to each other to perform an electrical inspection on a device to be inspected,

an inspection board provided with a plurality of pads respectively connected to a plurality of conductive parts and applying a signal for inspection to the inspection socket in contact with the inspection socket;

position detecting means for photographing the conductive part of the test socket, the terminal of the semiconductor device, and the pad of the test board; and

and a controller for controlling the connector transfer unit and the semiconductor transfer unit so that the conductive part, the terminal, and the pad are matched one-to-one by using the image data detected by the position detecting means.

In the fine pitch semiconductor inspection apparatus,

Some of the plurality of inspection sockets are brought into contact with the pad of the inspection board at the inspection position, and when the resistance value of the inspection socket placed at the inspection position is greater than a certain level, the service life is determined to be over and the other inspection socket is moved to the inspection position. You can control the connector transfer part.

In the fine pitch semiconductor inspection apparatus,

In the case where another test socket is moved to the test position by replacing the test socket at the end of its service life, the control unit may measure the positional coordinates of the conductive part by the optical means and control the connector transfer part to align with the terminal and the pad.

The fine-pitch semiconductor inspection method of the present invention for achieving the above object,

A semiconductor inspection method for performing an electrical inspection by moving a semiconductor device to an inspection socket, the semiconductor inspection method comprising:

(a) measuring the pad position of the inspection board; (b) measuring the upper position of the conductive part of the connector for inspection by moving the connector for inspection toward the inspection board; (c) measuring the lower position of the conductive part of the connector for inspection; (d) measuring a terminal position of the semiconductor device; (e) adjusting the position of the test connector so that the conductive part of the test connector and the pad of the test board match one-to-one; and (f) adjusting the position of the semiconductor device so that the terminal of the semiconductor device and the conductive part of the connector for inspection match one-to-one.

In the fine-pitch semiconductor inspection method,

The inspection connector is composed of a plurality of inspection sockets, and an electrical inspection is performed using any one of the inspection sockets. After repeating step f), an electrical test may be performed.

In the fine-pitch semiconductor inspection method,

When all the inspection sockets arranged in the inspection connector have reached the end of their lifespan, they can be replaced with other inspection connectors arranged in the connector tray.

In the fine-pitch semiconductor inspection method,

The first camera may be an upper camera positioned above the inspection board to face the upper surface of the inspection board.

In the fine-pitch semiconductor inspection method,

The second camera may be a lower camera located under the inspection socket to take an image of the lower portion of the conductive part of the inspection socket.

The present invention has the advantage of being able to perform a precise inspection by matching the terminals, pads, and conductive parts one-to-one with each other and thereby increasing the reliability of the fine-pitch inspection.

The present invention has the advantage of reducing the cost of precise inspection by aligning the inspection socket, the semiconductor device, and the inspection board by using the image data of the terminal, the pad, and the conductive part photographed by the camera.

The present invention can greatly improve the lifespan of the inspection connector by disposing a plurality of inspection sockets in the inspection connector and sequentially using the inspection sockets to perform an electrical inspection, thereby minimizing the cost of replacing the inspection socket. can

The present invention has the advantage of minimizing damage to the pad or terminal because the test socket is applied with a conductive part having excellent elasticity.

1 is a plan view of a probe card mounted on a conventional semiconductor test board.

2 is a side view of a probe pin mounted on a conventional probe card;

3 is a plan view showing damage to a terminal of the semiconductor device after inspecting the semiconductor device with a metal probe pin;

4 is a diagram schematically showing the configuration of a fine-pitch semiconductor inspection apparatus according to an embodiment of the present invention.

5 is a view showing an example of an inspection socket as a component of the fine-pitch semiconductor inspection apparatus of the present invention.

6 is a view showing another example of an inspection socket, which is a configuration of the fine-pitch semiconductor inspection apparatus of the present invention.

7 to 12 are views showing the operation of performing an electrical inspection using the fine-pitch semiconductor inspection apparatus of the present invention.

13 is an enlarged view of a portion "B" of FIG. 12;

14 is a block diagram of a fine-pitch semiconductor inspection apparatus of the present invention.

15 is a flowchart of a method for inspecting a fine-pitch semiconductor according to the present invention.

Embodiments of the present disclosure are exemplified for the purpose of explaining the technical spirit of the present disclosure. The scope of the rights according to the present disclosure is not limited to the embodiments presented below or specific descriptions of these embodiments.

All technical and scientific terms used in this disclosure, unless otherwise defined, have the meanings commonly understood by one of ordinary skill in the art to which this disclosure belongs. All terms used in the present disclosure are selected for the purpose of more clearly describing the present disclosure and not to limit the scope of the present disclosure.

As used in this disclosure, expressions such as "comprising", "including", "having", etc. are open-ended terms connoting the possibility of including other embodiments, unless otherwise stated in the phrase or sentence in which the expression is included. (open-ended terms).

Expressions in the singular described in this disclosure may include the meaning of the plural unless otherwise stated, and the same applies to expressions in the singular in the claims.

Expressions such as “first” and “second” used in the present disclosure are used to distinguish a plurality of components from each other, and do not limit the order or importance of the corresponding components.

In the present disclosure, when a component is referred to as being “connected” or “connected” to another component, the component can be directly connected or connectable to the other component, or a new component It should be understood that other components may be connected or may be connected via other components.

As used in the present disclosure, the direction indicator of “upward” is based on the direction in which the test socket is positioned with respect to the test board, and the direction indicator of “downward” refers to a direction opposite to the upward direction. It should be understood that the direction indicator of “vertical direction” used in the present disclosure includes an upward direction and a downward direction, but does not mean a specific one of the upward direction and the downward direction.

With reference to examples shown in the accompanying drawings, embodiments are described. In the accompanying drawings, identical or corresponding components are assigned the same reference numerals. In addition, in the description of the embodiments below, overlapping description of the same or corresponding components may be omitted. However, even if description regarding components is omitted, it is not intended that such components are not included in any embodiment.

Embodiments described below and examples shown in the accompanying drawings relate to a semiconductor inspection apparatus for electrical connection between an inspection board and a device to be inspected. The semiconductor inspection apparatus of the embodiments may be used for electrical connection between the inspection apparatus and the inspected device during inspection of the inspected device. For example, the semiconductor inspection apparatus according to the embodiments may be used for testing a device under test in a post-process during a manufacturing process of the device under test. In the test process, since the device under test operates in a state in which the electrical signal is applied, it is possible to determine whether the device is defective in this process. An example of the test to which the test socket of the embodiments is applied is not limited to the above-described burn-in test.

4 illustrates an example to which the semiconductor inspection apparatus 10 according to an embodiment is applied. FIG. 4 schematically shows an inspection socket 22, an inspection board 50 on which the inspection socket 22 is disposed, and a semiconductor device 80 in contact with the inspection socket 22, of which those shown in FIG. The shape is merely exemplary.

As shown in FIG. 13 , the test socket 22 according to an exemplary embodiment is disposed between the test board 50 and the semiconductor device 80 . For the inspection of the semiconductor device 80 , the inspection socket 22 is in contact with the semiconductor device 80 in a state disposed in the inspection area on the inspection board 50 , respectively, and the inspection board 50 and the semiconductor device 80 . are electrically connected to each other. The inspection of the semiconductor device 80 is performed by the inspection board 50 via the inspection socket 22 .

The semiconductor device 80 may be, but is not limited to, a semiconductor package. A semiconductor device is a package in which a semiconductor IC chip, a plurality of lead frames, and a plurality of terminals 81 are packaged in a hexahedral shape using a resin material. The semiconductor IC chip may be a memory IC chip or a non-memory IC chip. As the terminal 81 , a pin, a solder ball, a micro bump, or the like may be used. The semiconductor device 80 shown in FIG. 4 has a plurality of hemispherical terminals 81 on its lower side.

The test board 50 may be configured to perform an electrical test of a semiconductor device. The test board 50 may have a plurality of pads 51 capable of outputting an electrical signal and receiving a response signal. The terminal 81 of the semiconductor device 80 is electrically connected to the pad 51 of the corresponding test board 50 through the test socket 22 . That is, the test socket 22 electrically connects the terminal 81 of the semiconductor device 80 and the corresponding terminal 81 of the test board 50 in the vertical direction VD, and the terminal 81 and An electrical test signal and a response signal are transmitted between the test boards 50 .

More specifically, the fine-pitch semiconductor inspection apparatus 10 of the present invention will be described as follows.

The fine pitch semiconductor inspection apparatus 10 according to the present invention includes a connector for inspection 20 , a connector transfer unit 30 , a semiconductor transfer unit 40 , an inspection board 50 , a position detection means 60 , and a control unit 70 . is comprised of

The inspection connector 20 is disposed on the inspection board 50 and the semiconductor device 80 is placed thereon, and a plurality of inspection sockets 22 are provided. Specifically, one test connector 20 includes a frame 21 in which a plurality of socket holes 211 are formed, and a plurality of tests integrally coupled within a plurality of socket holes 211 of the frame 21 . It may include a socket 22 .

The frame 21 is capable of firmly supporting the plurality of inspection sockets 22 and has a rectangular plate shape, and a metal material or a non-metal material is used. As a metal material, iron, nickel, cobalt, stainless steel, titanium, tungsten, these alloys, etc. can be used. As a non-metal material, a resin material with high mechanical strength such as polyimide resin, polyester resin, polyaramid resin, polyamide resin, and epoxy resin is mixed with fiber reinforcement materials such as glass fiber, carbon fiber, silica fiber, and boron nitride fiber. Alternatively, carbon nanotubes, silicon nanowires, boron nitride nanotubes, etc. are mixed with nanowires, or a composite resin material mixed with inorganic materials such as graphene, silica, boron nitride, and alumina as a filler. Although it can be used, from the viewpoint of a small coefficient of linear thermal expansion, a composite resin material such as a polyimide resin or a glass fiber reinforced epoxy resin or a composite resin material such as an epoxy resin containing boron nitride as a filler is preferable.

The inspection connector 20 is provided with a plurality of inspection sockets 22 capable of performing an electrical inspection. It can save you a lot of time in

In addition, the inspection connector 20 is configured to be accommodated in a plurality of connector trays 90 arranged around the inspection board (50). The connector tray 90 is a storage box provided with a storage space in which a plurality of connectors for inspection 20 can be accommodated, and the connector tray 90 is arranged around the inspection board 50 so that any one of the connectors for inspection ( When replacement for 20) is required, the connector transfer unit 30 puts the connector 20 for inspection at the end of its life in the connector tray 90, takes out a new connector for inspection 20, and uses it to perform electrical inspection. can do.

The inspection socket 22 is inserted into the socket hole 211 of the frame 21 to perform an electrical inspection. A plurality of inspection sockets 22 are coupled to the frame 21 so that any one or a part of the plurality of inspection sockets 22 is located in the inspection area of the inspection board 50 to perform an electrical inspection. The other inspection sockets 22 not located in the inspection area are located in the waiting area and stand by for inspection. Specifically, the inspection area is a region where the pad 51 is located on the inspection board 50 and is a portion to which an electrical signal is applied, and the standby region is an area where the pad 51 is not located on the inspection board 50 and receives an electrical signal. This is the non-approved part.

If a test yield decrease (resistance increase of the conductive part 221) occurs while performing an electrical inspection in the inspection area, the other inspection socket 22 disposed in the standby position is moved to the inspection area to perform an electrical inspection. .

The inspection socket 22 is an anisotropically conductive sheet consisting of the conductive part 221 and the insulating part 222 is used.

Most of the anisotropic conductive sheet may be made of an elastic polymer material, and the anisotropic conductive sheet may have elasticity in a vertical direction (VD) and a horizontal direction (HD). When an external force is applied to the anisotropically conductive sheet downward in the vertical direction VD, the anisotropically conductive sheet may be elastically deformed in the downward direction and in the horizontal direction HD. The external force may be generated by the pusher pressing the semiconductor device 80 toward the anisotropic conductive sheet. By this external force, the terminal 81 of the semiconductor device 80 and the anisotropic conductive sheet may be in contact in the vertical direction VD, and the anisotropic conductive sheet and the pad 51 of the inspection board 50 may be in contact in the vertical direction VD. ) can be contacted. When the external force is removed, the anisotropically conductive sheet may be restored to its original shape.

The anisotropically conductive sheet includes a plurality of conductive parts 221 , and the conductive parts 221 are perpendicular to the terminal 81 of the semiconductor device 80 and the pad 51 of the inspection board 50 corresponding thereto (VD). ) to electrically connect them. The conductive portion 221 is in contact with the terminal 81 of the semiconductor device 80 at its upper end and is in contact with the upper end of the pad 51 at its lower end. Accordingly, the conductive portion 221 conducts conduction in the vertical direction between the corresponding pad 51 and the terminal 81 . Accordingly, the inspection signal of the inspection board 50 may be transmitted to the semiconductor device 80 through the pad 51 and the conductive part 221 of the inspection board 50 , and the response signal of the semiconductor device 80 is the terminal It may be transmitted from the 81 to the test board through the conductive part 221 and the pad 51 of the test board 50 .

The conductive part 221 may have a cylindrical shape extending in a vertical direction. In this cylindrical shape, the diameter at the middle may be smaller than the diameter at the top and bottom. The planar arrangement of the conductive parts 221 may vary according to the planar arrangement of the terminals 81 of the semiconductor device 80 . In an embodiment, the conductive parts 221 may be arranged in a pair of matrix shapes, but the arrangement is not limited thereto.

In an embodiment, the anisotropically conductive sheet includes an insulating part 222 that is spaced apart and insulated from the plurality of conductive parts 221 in a horizontal direction. The insulating part 222 may form a rectangular elastic region of the anisotropic conductive sheet. The plurality of conductive parts 221 are spaced apart and insulated from each other at equal or unequal intervals in the horizontal direction HD by the insulating part 222 . The insulating part 222 is formed as a single elastic body, and the plurality of conductive parts 221 are positioned on the insulating part 222 in the thickness direction (vertical direction VD) of the insulating part 222 .

The insulating part 222 made of an elastic body maintains the conductive part 221 in its shape. The insulating part 222 is made of an elastic polymer material, and has elastic force in the vertical direction (VD) and the horizontal direction (HD).

In detail, the insulating part 222 may be made of a cured silicone rubber material. For example, the insulating portion 222 may be formed by injecting and curing the liquid silicone rubber into the molding die. As a liquid silicone rubber material for molding the insulating part 222 , an addition type liquid silicone rubber, a condensation type liquid silicone rubber, a liquid silicone rubber containing a vinyl group or a hydroxyl group, etc. may be used. As a specific example, the liquid silicone rubber material may include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methylphenyl vinyl silicone raw rubber, and the like. In addition, as the silicon rubber material constituting the insulating part 222 , a silicon rubber material having excellent heat resistance may be used so that the test socket according to an embodiment can be applied to a burn-in test.

The conductive part 221 includes a plurality of conductive particles that are conductively contacted in the vertical direction (VD). The shape of the conductive particles may be spherical, columnar, fibrous, flat, or strip-shaped. The conductive particles may be formed by coating the surface of the core particles with a highly conductive metal. The core particles may be made of a metal material such as iron, nickel, cobalt, or a resin material having elasticity. As the highly conductive metal coated on the surface of the core particle, gold, silver, copper, rhodium, platinum, chromium, or the like may be used. Conductive particles contacted in the vertical or horizontal direction to be electrically conductive in the vertical direction form a conductive path of the conductive part 221 . For example, the conductive particles may be maintained in the shape of the conductive part 221 by the elastic polymer material forming the insulating part 222 .

On the other hand, the inspection socket 22 according to the present invention is not limited to the anisotropic conductive sheet. For example, as shown in FIG. 6 , it is also possible to use a pogo pin 24 . The pogo pin 24 is inserted into the housing 23 in which a plurality of insertion holes are formed, and includes a cylindrical barrel, an upper pin 241 protruding and protruding from the upper part of the barrel, and a lower pin 242 protruding and protruding from the lower part of the barrel. ) and a spring 243 disposed between the upper pin 241 and the lower pin 242 . When the terminal 81 of the semiconductor device 80 contacts the upper pin 241 , the spring 243 is configured to absorb an impact. The electrical signal applied from the pad 51 is configured to be transmitted to the terminal 81 of the semiconductor device 80 through the lower pin 242 , the spring 243 , and the upper pin 241 . On the other hand, the inspection socket 22 is not limited thereto, and it is possible to use a bent metal wire, of course, and various other means may be used as the conductive part 221 .

The connector transfer unit 30 is to grip and transfer the connector 20 for inspection. Specifically, the connector transfer unit 30 includes a first arm 31 movable in the X-Y-Z axis direction, and a gripping unit 32 disposed at an end of the first arm 31 and rotatable in the vertical direction VD. is comprised of Accordingly, the connector transfer unit 30 is movable in the X-Y-Z-Z' direction. The first arm 31 is composed of an X-axis arm 311, a Y-axis arm 312, and a Z-axis arm 313 to enable three-dimensional movement. A gripper 32 rotatable in the Z' direction is provided by gripping the connector 20 for inspection.

This connector transfer unit 30 is connected to the control unit 70, so that the inspection connector 20 is placed on the inspection board 50 according to an instruction from the control unit 70, or the inspection connector 20 is placed on the upper part of the lower camera. It can be moved so that it can be positioned. In addition, the connector 20 for inspection at the end of its life can be transferred to the connector tray 90 by the connector transfer unit 30 .

The semiconductor transfer unit 40 adsorbs and transfers the semiconductor device 80 . Specifically, the semiconductor transfer unit 40 includes a second arm 41 movable in the X-Y-Z axis direction, and an adsorption unit 42 disposed at an end of the second arm 41 and rotatable in the vertical direction VD. is comprised of Accordingly, the semiconductor transfer unit 40 is movable in the X-Y-Z-Z' direction. The second arm 41 is composed of an X-axis arm 411 , a Y-axis arm 412 , and a Z-axis arm 413 to enable three-dimensional movement, and the tip of the Z-axis arm 413 has A suction part 42 rotatable in the Z' direction is provided for adsorbing the semiconductor device 80 .

The semiconductor transfer unit 40 is connected to the control unit 70 so that the semiconductor device 80 is placed on the test socket 22 according to an instruction from the control unit 70 , or the terminal 81 of the semiconductor device 80 is lower The semiconductor device 80 may be moved so that it can be positioned above the lower camera to be photographed by the camera (second camera). In addition, the semiconductor device 80 on which the electrical test is completed may be transferred to the semiconductor tray 91 by the semiconductor transfer unit 40 .

The position detecting means 60 is to photograph the positions of the terminal 81, the pad 51, and the conductive part 221, and is connected to the control unit 70 to measure the position coordinates, and the first It includes a camera 61 and a second camera 62 .

The first camera 61 is positioned on the inspection board 50 in a direction facing the upper surface of the inspection board 50 , and includes the pad 51 of the inspection board 50 and the inspection socket 22 . The conductive part 221 is photographed. The first camera 61 is located on the pad 51 of the inspection board 50 and is configured to acquire image data for the pad 51 of the inspection board 50 . Specifically, the first camera 61 is an upper camera and is located on the inspection board 50 to take an image of the pad 51 of the inspection board 50, and together with the connector transfer unit 30, It is configured to take an image of the conductive part 221 of the inspection socket 22 of the inspection connector 20 transferred to the inspection area.

The pad image of the test board 50 photographed by the first camera 61 and the upper image of the conductive part 221 of the test socket 22 are transmitted to the controller 70 and the pad 51 by the controller 70 ) and an accurate positional coordinate for the conductive part 221 can be generated.

The second camera 62 is disposed in a position adjacent to the inspection board 50, and is located at the lower side and is configured to take an image in an upward direction. The second camera 62 may be positioned in a direction facing the lower surface of the inspection socket 22 to photograph the lower surface of the conductive part 221 of the inspection socket 22 . In addition, the second camera 62 may take a terminal image of the semiconductor device 80 that is absorbed and transported by the semiconductor transfer unit 40 .

Specifically, the second camera 62 is a lower camera, and may be located below the inspection board 50 , and is located near the inspection board 50 , and the conductive part 221 by the first camera 61 . When the inspection socket 22 on which the upper image is taken is transferred to the second camera 62 by the socket transfer unit, the lower image of the inspection socket 22 is photographed. When the semiconductor device 80 is transferred by the semiconductor transfer unit 40 after photographing the lower image of the inspection socket 22 , the second camera 62 captures the terminals 81 formed on the lower surface of the semiconductor device 80 . will take a video.

The image of the conductive part of the test socket 22 and the terminal image of the semiconductor device 80 photographed by the second camera 62 are transmitted to the controller 70, and the pad 51 and the It enables accurate positional coordinates for the conductive part 221 to be generated.

The control unit 70 is connected to the connector transfer unit 30 , the semiconductor transfer unit 40 , the inspection board 50 , the first camera 61 , and the second camera 62 to control the respective components. do.

Specifically, it is connected to the connector transfer unit 30 to precisely control the position of the connector 20 for inspection, and is connected to the semiconductor transfer unit 40 to precisely control the position of the semiconductor device 80 . do.

In addition, the control unit 70 is connected to the first camera 61 by using the image data transmitted by the first camera 61, the position coordinates of the pad 51 of the inspection board 50, the inspection socket 22 It is possible to accurately grasp the coordinates of the upper position of the conductive part 221 of the

The control unit 70 is connected to the second camera 62 and using the image data transmitted by the second camera 62, the coordinates of the lower position of the conductive part 221 of the test socket 22, the terminal ( 81) It becomes possible to acquire position coordinates.

In addition, the control unit 70 may be connected to the inspection board 50 to determine whether the semiconductor device 80 is defective or to check a decrease in test yield (increase in resistance of the conductive unit 221 ). In particular, when it is determined that the test yield is lowered, it is possible to control the replacement of the inspection socket 22 located in the inspection area with another inspection socket 22 . Specifically, the test socket 22 may be replaced so that an electrical test can be performed using the test socket 22 that has not expired among the test sockets 22 disposed in one test connector 20 .

The operation and effect on the semiconductor inspection apparatus 10 according to the present invention will be described in detail with reference to the accompanying drawings.

7 shows a state in which the pad 51 of the inspection board 50 is photographed by the first camera 61 . The first camera 61 located on the upper part of the inspection board 50 photographs the pad 51 present in the inspection area of the inspection board 50, and then transmits image data to the control unit 70 to transmit the image data to the pad ( 51) can be measured. (S100 in FIG. 15)

8 shows a state in which the upper portion of the conductive part 221 of the inspection socket 22 is photographed by the first camera 61 . After gripping any one of the connectors 20 for inspection from the connector tray 90, the connector transfer unit 30 places one of the inspection sockets 22 on the inspection area, and the first camera 61 is located on the inspection area. The conductive part 221 of the placed inspection socket 22 is photographed. After the image of the upper part of the conductive part 221 of the inspection socket 22 is captured by the first camera 61, the image data is transmitted to the control unit 70, and the control unit 70 controls the conductive part ( 221) The upper position coordinates are measured. (S200 in FIG. 15)

10 shows a state in which the lower portion of the conductive part 221 of the inspection socket 22 is photographed by the second camera 62 . After acquiring the image of the upper part of the conductive part 221 , the socket transfer unit moves the inspection connector 20 to a position directly above the second camera 62 to move the lower part of the conductive part 221 of the inspection socket 22 . will be filmed After an image of the lower portion of the conductive part 221 of the inspection socket 22 is photographed by the second camera 62, the image data is transmitted to the control unit 70, and the control unit 70 controls the conductive part ( 221) The lower position coordinates are measured. (S300 in FIG. 15)

11 shows that the inspection connector 20, whose upper and lower position coordinates of the conductive part 221 are measured, moves over the inspection board 50, and simultaneously moves the semiconductor device 80 by the semiconductor transfer unit 40 to the second camera. (62) indicates that the image of the terminal 81 of the semiconductor device 80 is taken by positioning it upward.

Specifically, the semiconductor device 80 is moved to the photographing position of the second camera 62 by the semiconductor transfer unit 40 , and accordingly, an image of the terminal 81 of the semiconductor device 80 can be photographed. The image data for the terminal 81 of the semiconductor device 80 obtained by the second camera 62 may be transmitted to the controller 70 to obtain positional coordinates for the terminal 81 of the semiconductor device 80 . there will be (S400 in FIG. 15)

In addition, the control unit 70 includes the position coordinates of the pad 51 of the inspection board 50 obtained by using the image data obtained by the first camera 61 and the second camera 62 and the position of the inspection socket 22 . The position offset between the position of the conductive part 221 of the inspection socket 22 and the pad 51 of the inspection board 50 is determined using the coordinates of the lower position of the conductive part 221 , and the socket uses the offset information. It allows precise positioning of the transfer part. After determining the position coordinates of the conductive part 221 of the inspection socket 22 and the position coordinates of the inspection board 50 to match the position coordinates of the conductive part 221 and the pad 51 in the horizontal direction (HD), Move the socket transport precisely. (S500 in FIG. 15)

12 shows precise positioning of the semiconductor device 80 after placing it in the test socket 22 . (S600 in FIG. 15)

Specifically, based on the image data transmitted by the first camera 61 and the second camera 62 , the upper coordinates of the conductive part 221 of the test socket 22 and the terminal 81 of the semiconductor device 80 The coordinates are measured and the offset is calculated by comparing the measured position of the conductive part 221 with the position of the terminal 81 , and accordingly, the semiconductor transfer part 40 is precisely adjusted to the test socket 22 and the semiconductor device 80 . to match the positions of In more detail, after confirming the position coordinates where the terminal 81 of the semiconductor device 80 coincides with the conductive parts 221 of the test socket 22 in the horizontal direction (HD), the semiconductor transfer part 40 is precisely moved move it

Thereafter, the semiconductor device 80 is pressed so that the terminal 81 of the semiconductor device 80 is vertically pressed against the conductive portion 221 of the test socket 22 to be in an electrically conductive state, and then When a predetermined electrical signal is applied from the inspection board 50, the signal is transmitted to the conductive part 221 and the semiconductor device 80, and a predetermined electrical inspection is performed (S700 in FIG. 15).

The semiconductor device 80 on which the electrical test is completed is transferred to the semiconductor tray by the semiconductor transfer unit 40 , and an electric test is performed using the new semiconductor device 80 .

In the inspection process, if the test yield is lowered such as an increase in the resistance of the conductive part 221, the control unit 70 determines that the life of the inspection socket 22 has expired, and accordingly, the control unit 70 controls the existing inspection socket ( 22) to perform an electrical test with a new test socket 22 instead. Specifically, the inspection socket 22 disposed in the standby position is moved to the inspection area, the coordinates of the upper part of the conductive part 221 are measured by the first camera 61 , and the conductive part 221 is moved to the second camera 62 side. ) After measuring the lower coordinates, new alignment is performed using the coordinates of the terminal 81 of the semiconductor device 80 that needs to be inspected, and then a predetermined electrical inspection is performed.

After all of the plurality of inspection sockets 22 provided in the inspection connector 20 are used, it moves to the connector tray, the existing inspection connector 20 is accommodated in the tray, and the new inspection connector 20 is taken out. Using this, the electrical inspection is performed while newly performing the above-described steps such as location recognition.

According to the inspection apparatus 10 according to the present invention, measures such as tolerance management are required for the inspection socket 22 and the inspection board 50 in order to perform a precise inspection on the semiconductor device 80 having a fine pitch. Since the offset is controlled by using the data recognized by the optical means such as the first and second cameras without the use of the high-precision motor drive shaft, there is an advantage that a very precise test is possible at a low cost.

In addition, when a plurality of inspection sockets 22 are installed in one inspection connector 20 and the life of any one inspection socket 22 expires, the other inspection socket 22 is moved to the inspection area to perform electrical inspection. As a result, the overall lifespan of the socket is improved and the time required for inspection can be significantly reduced.

In addition, since the connector tray in which a plurality of inspection connectors 20 are disposed is disposed in the device, and a plurality of inspection connectors 20 are initially disposed and the inspection connector 20 can be automatically replaced, the inspection Since the downtime of the inspection device 10 according to the replacement of the connector 20 can be greatly reduced, there is an advantage that the operation rate can be increased.

Although the upper camera and the lower camera are exemplified as the position detecting means in the above embodiment, the present invention is not limited thereto, and the left camera and the right camera may be added or changed. That is, it is possible to use the upper camera and the left camera mixedly, or the lower camera and the right camera to be used together, and if necessary, it is possible to use all of the upper, lower, left, and right cameras.

In the above-described embodiment, it is exemplified that the transfer device is movable in the X, Y, Z, and Z' directions, but it is not limited thereto, and it is possible to move in two dimensions or move in a straight line or rotation about various other axes. .

In addition, although the camera is exemplified as an optical means in the above-described embodiment, the present invention is not limited thereto, and various means can be used as long as the positional coordinates of the conductive part, the terminal, and the pad can be accurately confirmed.

In addition, the above-described inspection method is only an example, and the order may be variously changed. For example, the steps of measuring the upper position of the conductive part, measuring the lower position of the conductive part, measuring the terminal position of the semiconductor device, adjusting the position of the connector for inspection, and adjusting the position of the semiconductor device are not sequential, After each step is mutually changed and the position of the connector for inspection is adjusted, it is possible to change the order, such as measuring the position of the terminal of the semiconductor device.

Although the present invention has been described in detail with reference to preferred embodiments above, the present invention is not necessarily limited to these embodiments and modifications, and various modifications may be made within the scope without departing from the technical spirit of the present invention.

Claims

A semiconductor inspection apparatus for performing an electrical inspection on a semiconductor device by electrically connecting a semiconductor device and an inspection board to each other, the semiconductor inspection apparatus comprising:

an inspection connector electrically connected to the semiconductor device and having a plurality of inspection sockets provided with a plurality of conductive parts extending in a vertical direction;

a connector transfer unit that grips and transfers the connector for inspection;

a semiconductor transfer unit that grips and transfers the semiconductor device;

an inspection board provided with a plurality of pads respectively connected to a plurality of conductive parts on an upper surface thereof, and applying a signal for inspection to the inspection socket in contact with the inspection socket;

a first camera positioned on the inspection board in a direction facing the upper surface of the inspection board and photographing the pad of the inspection board and the conductive part of the inspection socket;

a second camera positioned in a direction facing the lower surface of the test socket to photograph the terminal of the semiconductor device and the conductive part of the test socket; and

receiving the image data of the conductive part, the terminal, and the pad received from the first camera and the second camera, and measuring the positional coordinates of the test board, the test socket, and the semiconductor device;

and a control unit for controlling the connector transfer unit and the semiconductor transfer unit so that the positions of the terminal, the conductive portion and the pad coincide.
According to claim 1,

The first camera is an upper camera disposed on the inspection board, and the second camera is a lower camera disposed under the inspection socket.
According to claim 1,

The control unit, fine-pitch semiconductor inspection apparatus, characterized in that by using the coordinates of the lower position of the conductive part of the test board and the test socket to control the connector transfer unit so that the pad and the conductive part are in one-to-one contact with each other.
According to claim 1,

The control unit, fine-pitch semiconductor inspection apparatus, characterized in that by using the coordinates of the upper position of the upper portion of the conductive portion of the terminal and the inspection socket to control the semiconductor transfer unit so that the terminal and the conductive portion are in one-to-one contact with each other.
According to claim 1,

Some of the plurality of inspection sockets are used for electrical inspection of a semiconductor device that requires inspection at the inspection position, and the rest are arranged in a standby position.
6. The method of claim 5,

When the resistance of the inspection socket disposed at the inspection position is greater than or equal to a predetermined value, the control unit determines that the life of the inspection socket placed at the inspection position has expired, and sets one of the inspection sockets disposed in the standby position among the plurality of inspection sockets to the inspection position. A fine-pitch semiconductor inspection apparatus, characterized in that it is moved to perform an electrical inspection.
According to claim 1,

The conductive part of the test socket,

A fine-pitch semiconductor inspection apparatus, characterized in that a plurality of conductive particles are vertically arranged in an elastic insulating material.
8. The method of claim 7,

A fine-pitch semiconductor inspection apparatus, characterized in that an insulating part is provided around the conductive part to support the conductive part and insulate it from the adjacent conductive part.
According to claim 1,

The conductive part of the test socket,

A fine-pitch semiconductor inspection device, characterized in that it is a pogo pin or a metal wire extending in the vertical direction.
According to claim 1,

The test connector further comprises a frame in which a plurality of socket holes are formed, wherein the test socket is coupled to the plurality of socket holes of the frame, respectively.
According to claim 1,

A connector tray in which a plurality of connectors for inspection can be accommodated is provided,

Fine-pitch semiconductor inspection apparatus, characterized in that it can be replaced with another connector for inspection by the connector transfer unit when the life of the connector for inspection has expired.
In the fine-pitch semiconductor inspection apparatus that electrically connects a semiconductor device and an inspection board to each other to perform an electrical inspection on the semiconductor device,

an inspection connector electrically connected to the semiconductor device and having a plurality of inspection sockets provided with a plurality of conductive parts extending in a vertical direction;

a connector transfer unit that grips and transfers the connector for inspection;

a semiconductor transfer unit that grips and transfers the semiconductor device;

an inspection board provided with a plurality of pads respectively connected to a plurality of conductive parts and applying a signal for inspection to the inspection socket in contact with the inspection socket;

position detecting means for detecting positions of the conductive part of the test socket, the terminals of the semiconductor device, and the pads of the test board; and

and a control unit for controlling the connector transfer unit and the semiconductor transfer unit so that the conductive unit, the terminal, and the pad are matched one-to-one by using the position data detected from the position detecting means.
13. The method of claim 12,

Some of the plurality of inspection sockets are brought into contact with the pad of the inspection board at the inspection position, and when the resistance value of the inspection socket placed at the inspection position is greater than a certain level, the service life is determined to be over and the other inspection socket is moved to the inspection position. A fine-pitch semiconductor inspection device, characterized in that it controls the connector transfer unit.
14. The method of claim 13,

In the case of moving the other inspection socket to the inspection position by replacing the inspection socket at the end of its life, the control unit measures the position coordinates of the conductive part by the position detection means and controls the connector transfer part to align with the terminals and pads. A fine-pitch semiconductor inspection device.
A semiconductor inspection method for performing an electrical inspection by moving a semiconductor device to an inspection board, the semiconductor inspection method comprising:

(a) measuring the pad position of the inspection board;

(b) measuring the upper position of the conductive part of the connector for inspection by moving the connector for inspection toward the inspection board;

(c) measuring the lower position of the conductive part of the connector for inspection;

(d) measuring a terminal position of the semiconductor device;

(e) adjusting the position of the test connector so that the conductive part of the test connector and the pad of the test board match one-to-one; and

(f) adjusting the position of the semiconductor device so that the terminal of the semiconductor device and the conductive part of the connector for inspection match one-to-one; A semiconductor inspection method comprising a.
16. The method of claim 15,

(g) performing an electrical test on the semiconductor device by applying an electrical signal from the test board to the test socket;
16. The method of claim 15,

The inspection connector is composed of a plurality of inspection sockets, and an electrical inspection is performed using any one of the inspection sockets. A semiconductor inspection method, characterized in that the electrical inspection is performed after repeating step f).
18. The method of claim 17,

A semiconductor inspection method, characterized in that when the lifespan of all the inspection sockets arranged in the inspection connector is expired, it is replaced with another inspection connector arranged in the connector tray.
16. The method of claim 15,

In step (a), the inspection board is a semiconductor inspection method, characterized in that the image is taken by an upper camera located on the upper portion of the inspection board to face the upper surface of the inspection board.
16. The method of claim 15,

The second camera is a semiconductor inspection method, characterized in that the lower camera is located under the inspection socket so as to take an image of the lower portion of the conductive part of the inspection socket.