WO2011087215A2

WO2011087215A2 - Probe card

Info

Publication number: WO2011087215A2
Application number: PCT/KR2010/009143
Authority: WO
Inventors: 김형익; 이호준
Original assignee: 주식회사 미코티엔
Priority date: 2010-01-13
Filing date: 2010-12-21
Publication date: 2011-07-21
Also published as: WO2011087215A3; KR101674135B1; KR20110083053A

Abstract

A probe card comprises probe structures, substrate pieces, interface blocks, supporting boards, and circuit boards. The probe structures have probes that transmit and receive electric signals to and from a chip pad of an inspection target through physical contact. The substrate pieces are respectively arranged in the lower parts of the probe structures, are electrically connected with the probes, and are equipped with wires having different intervals on upper and lower surfaces. The interface blocks are respectively arranged in the lower parts of the substrate pieces, are respectively connected with the wires, and are equipped with connection members having the same intervals on upper and lower surfaces. The supporting boards have holes through which the interface blocks are inserted in order to be detachably attached thereto, respectively, and support the interface blocks. The circuit boards are arranged in the lower parts of the supporting boards, and are equipped with wires electrically connected with the connection members of the interface blocks, respectively.

Description

Probe card

The present invention relates to a probe card, more particularly a probe card comprising a probe in contact with a pad of a semiconductor element.

In general, a semiconductor device includes a Fab process for forming an electrical circuit including electrical devices on a silicon wafer used as a semiconductor substrate, and an EDS (electrical) for inspecting electrical characteristics of the semiconductor devices formed in the fab process. die sorting) and a package assembly process for encapsulating and individualizing the semiconductor devices with an epoxy resin.

The EDS process is performed to determine a defective semiconductor device among the semiconductor devices. The EDS process is performed using an inspection apparatus called a probe card. The probe card applies an electrical signal while the probe is in contact with a pad of the semiconductor elements, and determines a failure by a signal checked from the applied electrical signal.

As the size of the wafer increases and a plurality of chips are formed on a single wafer, a probe card for inspecting the chips is also enlarged. The probe card is attached to a plurality of probes on a ceramic substrate to simultaneously test the plurality of chips in contact. At this time, the ceramic substrate serves as a space converter for converting a narrow pitch terminal to a wide pitch, and the thermal expansion coefficient is similar to that of the silicon wafer, thereby minimizing the positional change of the probe and the chip pad of the wafer due to thermal deformation.

However, it is difficult to fabricate a probe card including a ceramic substrate having a large area corresponding to the size of the wafer, and when the probe is defective, it is difficult to selectively replace or repair only the defective probe.

The present invention provides a probe card that is easy to manufacture and maintain.

Probe card according to the invention is a probe structure having a probe for transmitting and receiving an electrical signal to and from the chip pad of the test object through physical contact, respectively disposed on the lower portion of the probe structure, is electrically connected to the probe and in the upper and lower surfaces Fragment substrates having wiring lines having different intervals, interface blocks respectively disposed under the fragment substrates, connected to the wiring lines, and having connection members having the same spacing on upper and lower surfaces thereof, and the interface blocks are detachable from each other. It may include a circuit board having a through hole that is inserted to be possible, and a support substrate for supporting the interface blocks and wires disposed under the support substrate, the wirings are electrically connected to the connection members of the interface blocks, respectively. .

According to one embodiment of the present invention, the interface blocks have a locking jaw at the top or the bottom and a guide pin protruding toward the support substrate from the locking jaw, the support substrate corresponds to the shape of the locking jaw and It may have a guide groove for receiving the guide pin on the bottom surface of the locking groove to align the position of the locking groove and the interface block for receiving the locking jaw.

According to one embodiment of the present invention, the probe card may further include fastening screws for fastening the interface blocks and the support substrate through the locking jaw of the interface blocks and the locking groove of the support substrate. .

According to one embodiment of the present invention, in order to prevent the support substrate from being deformed due to thermal expansion of the interface blocks, sidewalls of the interface blocks and through holes of the support substrate may be spaced apart from each other.

According to one embodiment of the present invention, a distance between the interface blocks and the sidewalls of the through holes may be 60 to 300 μm.

According to one embodiment of the invention, the interface blocks are made of a plastic material, the support substrate may be made of a ceramic or metal material.

In example embodiments, the connection members may be pogo pins that elastically contact first wirings of the piece substrates and second wirings of the circuit board.

According to one embodiment of the present invention, the connecting members are conductive pins bonded by solder with the first wires of the piece substrates, the probe card is disposed between the support substrate and the circuit board, and the interface The electronic device may further include an interposer for electrically connecting the connection members of the blocks and the second wires of the circuit board.

According to one embodiment of the present invention, the probe structures each have a slit (slit), the guide plate having a locking jaw at both ends of the slit, coupled to the lower surface of the guide plate, penetrating corresponding to the slit A fixing plate having a hole and a body portion inserted into the slit so as to be caught by the locking jaw, and a lower portion of the body protruding into the lower surface of the guide plate, and both left and right ends fixed between the locking jaw and the upper surface of the fixing plate, respectively; A contact portion inserted into the slit and having a terminal portion protruding to the upper surface of the guide plate to contact the chip pad, and a terminal portion inserted into the through hole and the terminal portion protruding to the lower surface of the fixing plate to contact the wires of the engraving substrate. It may comprise a probe made.

The probe card according to the present invention may correspond to the size of a wafer without applying a large amount of engraving substrates to form a large-area ceramic substrate. In addition, the probe card can be easily fastened and replaced the interface blocks on the support substrate, it is easy to manufacture and maintain the probe card.

The interface block may be accurately aligned with the support substrate by using the guide hole of the support substrate and the guide pin of the interface block. In addition, since the interface block and the support substrate are spaced apart from each other, it is possible to prevent the support substrate from being deformed due to thermal expansion of the interface block.

1 is a cross-sectional view illustrating a probe card according to an embodiment of the present invention.

FIG. 2 is an enlarged view illustrating the probe structure shown in FIG. 1.

3 is an exploded perspective view of the probe structure shown in FIG. 2.

4 is an exploded cross-sectional view illustrating the coupling of the interface block and the support substrate shown in FIG. 1.

5 is a cross-sectional view for describing a probe card according to another exemplary embodiment of the present invention.

Hereinafter, an SOFC and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Referring to FIG. 1, the probe card 1000 is for inspecting a chip pad of a wafer, which is an inspection object, and includes probe structures 100, engraving substrates 200, interface blocks 300, and a support substrate. 400 and a circuit board 500.

FIG. 2 is an enlarged view for explaining the probe structure shown in FIG. 1, and FIG. 3 is an exploded perspective view of the probe structure shown in FIG. 2.

1 to 3, the probe structures 100 include a guide plate 110, a fixed plate 120, and a probe 130. The probe structure 100 has a structure in which the probe 130 is fixed between the guide plate 110 and the fixed plate 120.

The guide plate 110 has, for example, a rectangular plate shape. The shape of the guide plate 110 is not limited to a rectangular plate shape, and may have various shapes corresponding to the inspection object. The guide plate 110 has a first slit 112 for receiving and guiding the probe 130 at a central portion thereof. The first slit 112 is formed to penetrate in the vertical direction (eg, up and down direction). The guide plate 110 is provided with a plurality of first slits 112. The first slits 112 may be arranged in two rows staggered with each other, or may be arranged in two rows facing each other. Alternatively, the first slits 112 may be arranged to correspond to the arrangement of the chip pads of the inspection object. An inner side of the first slit 112 has a locking jaw (112a) so that the probe 130 is caught. The locking jaw 112a is formed at both ends of the left and right (eg, longitudinal directions) of the first slit 112. The locking jaw 112a is formed at a predetermined depth from the lower surface of the guide plate 110.

In addition, the guide plate 110 has a fastening hole 114. The fastening hole 114 is provided to provide convenience such as alignment position alignment and coupling stability in the process of coupling the guide plate 110 and the fixed plate 120. The fixing protrusion 124 of the fixing plate 120 is inserted into the fastening hole 114. Therefore, the fastening hole 114 is provided corresponding to the fixing protrusion 124. The guide plate 110 is provided with one or more fastening holes 114, preferably a plurality of fastening holes 114. For example, four fastening holes 114 may be provided in the guide plate 110, and four fastening holes 114 may be provided at four corners of the guide plate 110, respectively.

Since the guide plate 110 serves to transmit electrical signals to the probes 130, the guide plate 110 is preferably made of an insulating material for insulation between the probes 130. For example, the guide plate 110 may include a ceramic material or a silicon material, and may be used alone or in combination thereof.

The fixing plate 120 is coupled to face the lower surface of the guide plate 110. The fixing plate 120 has a shape corresponding to the guide plate 110. For example, since the guide plate 110 has a square plate shape, the fixing plate 120 may also have a square plate shape. The fixing plate 120 is inserted into the first slit 112 of the guide plate 110 and pressurizes the lower side of the guided probe 130, and the probe 130 is fixed to the guide plate 110 by the pressing. It serves to fix between the plates (120). The fixing plate 120 has a through hole 122 corresponding to the first slit 112 of the guide plate 110 at a central portion thereof, and a part of the probe 130 is inserted into the through hole 122. Therefore, the through hole 122 is positioned to correspond to the arrangement position of the probe 130. The through hole 122 may have an open shape (or a rectangular shape) to accommodate the terminal portions 133 of the plurality of probes 130 arranged in a row by being inserted into the first slits 112. That is, when the probes 130 are arranged in two rows, the fixing plate 120 may be provided with two rectangular through holes 122 corresponding to the probes 130 arranged in each row. The width of the through hole 122 has a width smaller than the left and right length of the probe 130 so as to press the left and right ends of the probe 130.

The fixing plate 120 is made of an insulating material to insulate between the probes 130 in the same manner as the guide plate 110. Examples of the insulating material may include a ceramic material, a silicon material, may be used alone or mixed.

In addition, the fixing plate 120 is provided with a fixing protrusion 124 to provide convenience, such as alignment position alignment, coupling stability in the coupling with the guide plate 110. The fixing protrusion 124 corresponds to the fastening hole 114 formed in the guide plate 110. That is, the fixing protrusion 124 of the fixing plate 120 is provided in the number and position corresponding to the fastening holes 114. For example, when four fastening holes 114 are provided at four corners of the guide plate 110, four fixing protrusions 124 are provided at the four corners of the fixing plate 120. The fixing protrusion 124 may have a cylindrical shape, and the fastening hole 114 may have a circular shape as the fixing protrusion 134 has a cylindrical shape.

In the above description, the guide plate 110 is provided with a fastening hole 114, and the fixing plate 120 has been described as having a fixing protrusion 124 corresponding to the fastening hole 114. However, in contrast to the above, the fixing protrusion 124 may be provided in the guide plate 110, and the fastening hole 114 may be provided in the fixing plate 120.

In this embodiment, the probe structure 100 may include an adhesive film 102 interposed between the guide plate 110 and the fixed plate 120. The adhesive film 102 is provided for coupling the fixing plate 120 and the guide plate 110. The adhesive film 102 is provided with a hole 102a at a position corresponding to the fixing protrusion 124 so that the fixing protrusion 124 can pass therethrough. An example of the adhesive film 102 may include a non-conductive film (NCF). When the non-conductive film (NCF) is used as the adhesive film 102, the bonding process is about 180 ° C. to 220 ° C. with a non-conductive film (NCF) interposed between the fixing plate 120 and the guide plate 110. It is made by heating to a temperature of. As such, the coupling process of the guide plate 110 and the fixed plate 120 is performed at a relatively low temperature, thereby minimizing thermal deformation of the probe 130 and the peripheral components. Alternatively, other bonding means such as double-sided tape may be used as the adhesive film 102 interposed between the guide plate 110 and the fixed plate 120.

The probe 130 directly contacts the chip pad to transfer an electrical signal to each other. The probe 130 is guided by being inserted into the first slit 112 of the guide plate 110 and fixed between the guide plate 110 and the fixed plate 120. In probe structure 100, a plurality of probes 130 are generally provided.

The probe 130 may have a thin thickness (for example, a thin plate shape), and may include a body 131, a contact 132, and a terminal 133. The probe 130 is preferably a body portion 131, the contact portion 132 and the terminal portion 133 is formed in a unitary structure.

The body portion 131 has a length corresponding to the first slit 112, the width of the vertical direction is slightly larger than the depth of the locking step (112a). The body portion 132 is inserted into the first slit 112 such that both left and right ends thereof are caught by the engaging jaw 112a of the first slit 112. That is, when the body portion 132 is inserted by a predetermined depth by the locking step 112a, it is no longer inserted. The upper portion of the body portion 132 is inserted into the first slit 112, the lower portion is protruded to the lower surface of the guide plate 110. In other words, since the vertical width of the body portion 131 has a width larger than the depth of the locking step 112a, the lower portion of the body portion 131 is the lower surface of the guide plate 110 as shown in FIG. 3. It is protruding. A lower portion of the body portion 131 protruding to the lower surface of the guide plate 110 generates a gap between the guide plate 110 and the fixed plate 120. Since the coupling pressure (eg, bonding pressure) of the guide plate 110 and the fixed plate 120 is applied to the body portion 131 by the play of the body portion 131, the body portion 131 is the guide plate 110. ) And the fixing plate 120 is firmly fixed. Here, the fixing plate 120 is provided with a through hole 122 corresponding to the first slit 112, so that the left and right ends of the body portion 131 are pressed by the play. That is, the body portion 131 has a form in which both left and right ends are pressed and fixed between the locking jaw 112a and the upper surface of the fixing plate 120, respectively.

The contact part 132 extends upward from the body part 131. Therefore, the contact portion 132 is inserted into the first slit 112 of the guide plate 110, and the end portion is formed to protrude to the upper surface of the guide plate 110. The contact part 132 directly contacts the chip pad of the test object. The contact part 132 is formed to be in elastic contact with the chip pad of the inspection object. For example, the contact portion 132 may be formed of a contact pillar 132a, a contact beam portion 132b, and a contact tip portion 132c. The contact pillar 132a has a standing structure extending upward from the body portion 131. The contact beam part 132b extends in the form of a cantilever in the horizontal direction from the end of the contact pillar 132a. That is, the contact beam portion 132b extends in the longitudinal direction of the first slit 112 from the end of the contact pillar 132a. The contact tip portion 132c has a standing structure extending upward from the end of the contact beam portion 132b. At least the contact tip portion 132b protrudes from the contact portion 132 to the upper surface of the guide plate 110. The contact portion 132 bends the cantilever-shaped contact beam portion 132b by the vertical pressure generated when the contact tip portion 132c contacts the chip pad, and the contact beam portion 132b returns when the pressure is removed. . Thus, the contact portion 132 elastically contacts the chip pad.

The terminal portion 133 extends downward from the body portion 131. Thus, the terminal portion 133 is inserted into the through hole 122 of the fixing plate 120, the end portion is formed so as to project to the lower surface of the fixing plate 120. The terminal unit 133 serves to receive an electrical signal for testing the inspection object. The terminal unit 133 is formed to elastically contact a contact (not shown) for transmitting an electrical signal for a test. For example, the terminal part 133 may include a terminal pillar 133a, a terminal beam part 133b, and a terminal tip part 133c. The terminal pillar 133a has a standing structure extending downward from the lower end of the body portion 131. The terminal beam part 133b extends from the end of the terminal pillar 133a in the form of a cantilever along a horizontal direction (eg, the longitudinal direction of the first slit 112). The terminal tip portion 133c has a standing structure extending downward from the end of the terminal beam portion 133b. At least the terminal tip part 133c of the terminal part 133 is provided to protrude toward the lower surface of the fixing plate 120.

The probe 130 has a length shorter than that of the contact beam portion 132b. As such, this is to allow the contact portion 132 to have a smaller elasticity than the terminal portion 133. Since the contact portion 132 frequently contacts the chip pad every time the inspection is performed, it is preferable that the relatively small elasticity can suppress deformation. On the other hand, since the terminal portion 133 is used for a long time when the probe structure 100 is installed, it is preferable that the elastic contact is relatively large because stable contact should be prioritized. Therefore, the length of the contact beam part 132b has a length longer than that of the terminal beam part 133b so that the contact part 132 has a relatively smaller elasticity than the terminal part 133. In contrast, the probe 130 may have the same length as the contact beam part 132b and the terminal beam part 133b.

The probe 130 may have a symmetrical shape with respect to the contact portion 132 and the terminal portion 133 based on the body portion 131. For example, the contact pillar 132a and the terminal pillar 133a are located at the left side of the body 131 in the same manner, and the contact tip 132c and the terminal tip 133c are identical to each other of the body 131. It is located on the right side. As such, since the contact portion 132 and the terminal portion 133 are symmetrical with each other, the contact pressure received by the contact portion 132 and the contact pressure received by the terminal portion 133 cancel each other to suppress twisting of the probe 130. It is preferable. Alternatively, the contact portion 132 and the terminal portion 133 may have an asymmetrical shape with respect to the body portion 131.

The probe 130 is made of a conductive material because it serves to transfer the electrical signal between the tester and the test object. For example, the probe 130 may include a nickel-cobalt alloy (Ni-Co), a nickel-iron alloy (Ni-Fe), a nickel-palladium alloy (Ni-Pd), or a nickel-cobalt-tungsten alloy (Ni- Co-W) may be included.

In the above, the probe structure 100 is illustrated as including the probes 130 formed of three pairs of rows, so that one probe structure 100 may inspect three chips. That is, one probe structure 100 may inspect a plurality of chips. As another example, the probe structure 100 may include a probe 130 having a pair of rows, and one probe structure 100 may inspect one chip.

Referring back to FIG. 1, the piece substrates 200 are disposed under the probe structures 100, respectively. The probe structures 100 may be attached to upper surfaces of the engraving substrates 200 by an attachment member (not shown). An example of the adhesive member may be an anisotropic nonconductive film (NCF).

The piece substrates 200 have a plurality of first wires 210. The first wires 210 are connected to the probes 130 of the probe structures 100, respectively. The spacing of the first wirings 210 on the upper surface of the engraving substrates 200 and the spacing of the first wirings 210 on the lower surface of the engraving substrates 200 are different from each other. In detail, the distance between the first wires 210 is greater than the distance between the first wires 210 on the upper surface. Therefore, the piece substrates 200 serve as a space transducer for converting a narrow pitch into a wide pitch.

1 and 4, the interface blocks 300 and the support substrate 400 are disposed under the piece substrates 200.

The interface blocks 300 are disposed under the piece substrates 200 and have connection members 310. Examples of the connection member 310 may include a pogo pin. The connection members 310 are electrically connected to the first wires 210 and the second wires 510 of the circuit board 500 to be described later. Since the pogo pin has elasticity, the connection members 310 may be in contact with the first wires 210 and the second wires 510.

The connection members 310 are disposed to penetrate the interface blocks 300 up and down. For example, the connection member 310 is inserted into the through holes formed in the upper and lower interface blocks 300 in a state in which the interface blocks 300 are separated into upper and lower portions, respectively, and then the upper and lower portions. The coupling members 310 may be disposed in the interface blocks 300 by combining the interface blocks 300. As another example, the connection members 310 may be inserted into the interface blocks 300 by inserting the connection members 310 into the through holes formed in the interface blocks 300 above or below the interface blocks 300. Can be placed in. Thus, the spacing between the connecting members 310 in the interface blocks 300 is constant.

The interface blocks 300 each have a locking step 320 and a guide pin 330. The locking jaw 320 extends in a horizontal direction from both sides of the lower end of the interface block 300. The guide pin 330 protrudes upward from the locking jaw 320 toward the support substrate 400.

The support substrate 400 has through holes 410 into which the interface blocks 300 are detachably inserted, respectively, and supports the interface blocks 300. The interface blocks 300 may be inserted into the through holes 410 to be easily coupled to the support substrate 400, and may be removed from the through holes 410 to be easily separated from the support substrate 400. Can be.

In addition, the support substrate 400 has a locking groove 420 and the guide hole 430. The locking groove 420 is formed on the lower surfaces of the through holes 410 and corresponds to the shape of the locking jaw 320 and accommodates the locking jaw 320. The guide hole 430 is formed on the bottom surface of the locking groove 420, and accommodates the guide pin 330.

In the above, the locking step 320 and the guide pin 330 is provided at the lower end of the interface block 300, the locking groove 420 and the guide hole 430 is the lower surface of the support substrate 400 Although described as being provided in the, the locking jaw 320 and the guide pin 330 is provided on the upper end of the interface block 300, the locking groove 420 and the guide hole 430 is the support substrate ( 400 may be provided on the upper surface.

When the interface block 300 is inserted into the through hole 410 of the support substrate 400, the guide pin 330 is accommodated in the guide hole 430, thereby facilitating the position of the interface block 300. Can be sorted correctly.

The interface blocks 300 and the support substrate 400 are fastened by fastening screws 440. The fastening screws 440 fasten the locking jaw 320 of the interface block 300 and the locking groove 420 of the support substrate 400. Since the interface block 300 can be easily fastened to the support substrate 400, the assembly of the interface block 300 is easy. In addition, when the interface block 300 has a defect, the interface block 300 can be easily separated from the support substrate 400 by loosening the fastening screws 440 so that the interface block 300 can be easily removed. It is easy to replace.

The interface blocks 300 are made of a plastic material and are manufactured by inserting the connection members 310 after being molded by an injection method. Since the interface blocks 300 are injection molded of the plastic material, the interface blocks 300 may be easily manufactured, and the interface blocks 300 may be rapidly manufactured in large quantities. The coefficient of thermal expansion of the interface block 300 is about 15 to 50 ㎛ / m · ℃.

The support substrate 400 may include a ceramic or metal material. The metal material may include an iron alloy material. The iron alloys include iron-nickel alloys (invar), iron-nickel-cobalt alloys (super invar), iron-cobalt-nickel alloys (stainless invar) and iron-lead alloys. Etc. can be mentioned. The thermal expansion coefficient of the support substrate 400 may be about 4 to 12 ㎛ / m · ℃.

The interface blocks 300 and the support substrate 400 are spaced apart from each other. In detail, sidewalls of the interface blocks 300 and the through holes 410 are spaced apart from each other. In the high temperature test of the probe card 1000, the support substrate 400 may be prevented from being deformed due to thermal expansion of the interface blocks 300.

The interface blocks 300 and the sidewalls of the through holes 410 may be spaced apart by a predetermined distance D. Specifically, the gap D may be calculated by adding the thermal expansion amount of the interface block 300, the processing tolerance and the assembly tolerance of the interface block 300 and the support substrate 400. The thermal expansion amount of the interface block 300 is variable according to the material of the interface block 300 and the longest cross-sectional length of the interface block 300. In addition, processing tolerances and assembly tolerances may vary according to materials of the interface block 300 and the support substrate 400.

When the distance D between the interface blocks 300 and the sidewalls of the through holes 410 is less than about 60 μm, the processing tolerance and the assembly tolerance are small, so that the support substrate 200 and the interface block 300 are smaller. It is difficult to process and assemble them, and the gap D is so narrow that the interface block 300 may be in contact with the support substrate 400 while thermally expanding. Thus, the support substrate 400 may be deformed. In addition, when the distance D between the interface blocks 300 and the sidewalls of the through holes 410 exceeds about 300 μm, the processing tolerance and the assembly tolerance are large, so that the support substrate 200 and the interface may be larger. Machining and assembling of the blocks 300 is easy, but the spacing D is too wide, making it difficult to align the interface block 300 with the support substrate 400 accurately, and due to thermal expansion of the interface block 300, the interface block Poor contact between the pogo pins 310 of the 300 and the first wiring 210 of the engraving substrate 200 may occur. Therefore, the distance D between the interface blocks 300 and the sidewalls of the through holes 410 may be about 60 to 300 μm.

For example, when the longest cross section of the interface block 300 having a thermal expansion coefficient of about 15 to 50 μm / m · ° C. is about 8 to 13 mm, and the inspection of the chip is performed at a temperature of about 80 ° C., The thermal expansion coefficient of the interface block 300, which is calculated by multiplying the thermal expansion coefficient of the interface block 300 by the temperature change amount and the longest cross section, is about 10 to 50 μm. The processing tolerance of the interface blocks 300 and the support substrate 400 is about 30 to 40 μm, and the assembly tolerance is about 20 to 30 μm. Therefore, it is more preferable that the said gap D is about 60-120 micrometers.

Meanwhile, the piece substrates 200 may be attached to the support substrate 400 by an attachment member. Examples of the attachment member include an anisotropic nonconductive film. After the piece substrates 200 are attached to the base substrate 400, the interface blocks 300 may be inserted into the through holes 410 from the bottom of the support substrate 400, respectively.

As another example, the piece substrates 200 may be attached to the interface blocks 300, respectively. In this case, the size of the piece of substrate 200 and the size of the interface block 300 is the same, the piece of substrate 200 and the interface block 300 is the through hole from the bottom of the support substrate 400 410 may be inserted respectively.

Referring back to FIG. 1, the circuit board 500 has a flat plate shape and is disposed below the support substrate 400. The circuit board 500 has second wires 510 electrically connected to the connection members 310 of the interface blocks 300, respectively.

Meanwhile, a connection terminal is formed along the edge of the upper surface of the lower surface of the circuit board 500 to connect with the pogo pin of the test head, and the connection terminal is electrically connected to the second wirings 510.

Although not shown, a reinforcing plate may be provided on the lower surface of the circuit board 500. The reinforcing plate reinforces the circuit board 500 to prevent deformation such as bending or warping of the circuit board 500. The reinforcement plate is made of a metal material. Examples of the metal material include aluminum, aluminum alloys, iron or iron alloys.

As described above, the probe card 1000 may correspond to the size of the wafer by applying the piece substrates 200. Therefore, since the large-area ceramic substrate is unnecessary, the probe card 1000 can be easily manufactured.

In addition, since the probe card 1000 may easily fasten and replace the interface blocks 300 on the support substrate 400, the probe card 1000 may be easily manufactured and maintained.

Referring to FIG. 5, the probe card 2000 is for inspecting a chip pad of a wafer which is an inspection object, and includes probe structures 1100, engraving substrates 1200, interface blocks 1300, and a support substrate. 1400, interposer 1500, and circuit board 1600.

The connection member 1310 of the interface block 1300 has a conductive pin shape, the connection member 1310 and the first wires 1210 of the piece substrates 1200 are bonded by solder, and the support substrate ( The probe structures 1100, the engraving substrates 1200, the interface blocks 1300, and the support substrate 1400, except that the interposer 1500 is disposed between the 1400 and the circuit board 1600. ) And the circuit board 1600, the probe structures 100, the piece substrates 200, the interface blocks 300, the support substrate 400, and the circuit board 500 are described with reference to FIGS. 1 to 4. The description is substantially the same as for.

Since the connection member 1310 has a conductive pin shape, the connection member 1310 may be poorly connected to the first wires 1210 of the piece substrates 1200. Since the connection members 1310 and the first wirings 1210 of the engraving substrates 1200 are bonded by solder, the connection members 1310 and the first wirings 1210 may be stably connected.

Since the connection members 1310 of the interface blocks 1300 have a conductive pin shape, contact with the second wires 1610 of the circuit board 1600 may be poor. The interposer 1500 is disposed between the support substrate 1400 and the circuit board 1600 and is elastically connected to the connection member 1310 of the interface blocks 1300 and the second of the circuit board 1600. The connection member 1310 and the second wiring 1610 are electrically connected to each other by pressurizing the wirings 1610.

In detail, the interposer 1500 includes connecting members 1510 and a supporting member 1520 supporting the connecting members 1510.

The connecting members 1510 are made of a conductive elastic material. Due to the elastic force of the connectors 1510, the connectors 1510 may contact the connection member 1310 and the second wiring 1610. Therefore, the connecting members 1510 electrically connect the connecting member 1310 and the second wiring 1610.

The support member 1520 has a flat plate shape and supports the connecting members 1510. Therefore, the connector 1510 may maintain the contact state with the connection member 1310 and the second wiring 1610. Since the support member 1520 is made of an insulating material, a short circuit between the connecting members 1510 may be prevented.

On the other hand, the connection member 1310 may further include a head having a larger area than the connection member 1310 at one end. When assembling the connection member 1310 and the interface block 1300, the head serves as a locking jaw so that the connection member 1310 can be easily assembled to the interface block 1300.

In addition, the head increases the area in which the connecting member 1310 may contact the connecting members 1510 of the interposer 1500. Therefore, the connecting member 1310 may stably contact the connecting members 1510 of the interposer 1500.

As described above, the probe card 2000 may correspond to the size of the wafer by applying the engraving substrates 1200. Therefore, since the large-area ceramic substrate is unnecessary, the probe card 2000 can be easily manufactured.

In addition, since the probe card 2000 can easily fasten and replace the interface blocks 1300 to the support substrate 1400, the probe card 2000 can be easily manufactured and maintained.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

Claims

Probe structures having a probe for transmitting and receiving an electrical signal to the chip pad of the test object through physical contact;

Pieces of substrates disposed under the probe structures, the pieces of substrate being electrically connected to the probes and having wires different from each other on upper and lower surfaces thereof;

Interface blocks disposed under the piece substrates, the interface blocks being connected to the wires and having connection members having equal intervals on upper and lower surfaces thereof;

A support substrate having through holes through which the interface blocks are detachably inserted, and supporting the interface blocks; And

And a circuit board disposed under the support substrate, the circuit board having wires electrically connected to the connection members of the interface blocks, respectively.
According to claim 1, The interface block has a locking jaw at the top or bottom and a guide pin protruding toward the support substrate from the locking jaw,

The support substrate has a shape corresponding to the shape of the locking jaw and has a guide groove for receiving the guide pin on the bottom surface of the locking groove to align the position of the locking groove and the interface block for receiving the locking jaw. Probe card.
The probe card of claim 2, further comprising fastening screws that penetrate the locking jaw of the interface blocks and the locking groove of the support substrate to fasten the interface blocks and the support substrate.
The probe card of claim 2, wherein sidewalls of the interface blocks and the through holes are spaced apart from each other to prevent the support substrate from being deformed due to thermal expansion of the interface blocks.
The probe card of claim 4, wherein a distance between the interface blocks and the sidewalls of the through holes is 60 to 300 μm.
The probe card of claim 1, wherein the interface blocks are made of plastic, and the support substrate is made of ceramic or metal.
The probe card of claim 1, wherein the connection members are pogo pins which elastically contact first wirings of the piece substrates and second wirings of the circuit board.
The method of claim 1, wherein the connection members are conductive pins bonded by solder with the first wires of the piece substrates.

And an interposer disposed between the support substrate and the circuit board and electrically connecting the connection members of the interface blocks and the second wires of the circuit board.
The method of claim 1, wherein the probe structures are each:

A guide plate having a slit and having a latching jaw at both ends of the slit;

A fixing plate coupled to a lower surface of the guide plate and having a through hole corresponding to the slit; And

A body portion inserted into the slit so as to be caught by the locking jaw and a lower portion of the lower portion protruding into the lower surface of the guide plate, and both left and right ends fixed respectively between the locking jaw and the upper surface of the fixing plate; And a probe formed of a contact portion protruding to an upper surface of the guide plate and contacting the chip pad, and a terminal portion inserted into the through hole and having a terminal portion protruding to a lower surface of the fixing plate to contact wires of the engraving substrate. A probe card characterized by the above-mentioned.