KR20140032931A - 수지 조성물 - Google Patents

수지 조성물 Download PDF

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Publication number
KR20140032931A
KR20140032931A KR1020137003717A KR20137003717A KR20140032931A KR 20140032931 A KR20140032931 A KR 20140032931A KR 1020137003717 A KR1020137003717 A KR 1020137003717A KR 20137003717 A KR20137003717 A KR 20137003717A KR 20140032931 A KR20140032931 A KR 20140032931A
Authority
KR
South Korea
Prior art keywords
resin composition
polymerization inhibitor
compound
resin
radical polymerization
Prior art date
Application number
KR1020137003717A
Other languages
English (en)
Korean (ko)
Inventor
가즈끼 이와야
Original Assignee
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Publication of KR20140032931A publication Critical patent/KR20140032931A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/14—Polysulfides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J147/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09K2200/0625—Polyacrylic esters or derivatives thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020137003717A 2011-07-07 2012-04-27 수지 조성물 KR20140032931A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011150872A JP4976575B1 (ja) 2011-07-07 2011-07-07 樹脂組成物
JPJP-P-2011-150872 2011-07-07
PCT/JP2012/061386 WO2013005471A1 (ja) 2011-07-07 2012-04-27 樹脂組成物

Publications (1)

Publication Number Publication Date
KR20140032931A true KR20140032931A (ko) 2014-03-17

Family

ID=46678849

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137003717A KR20140032931A (ko) 2011-07-07 2012-04-27 수지 조성물

Country Status (6)

Country Link
JP (1) JP4976575B1 (ja)
KR (1) KR20140032931A (ja)
CN (1) CN103097436A (ja)
MY (1) MY156182A (ja)
TW (1) TWI579310B (ja)
WO (1) WO2013005471A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170128269A (ko) * 2015-03-12 2017-11-22 나믹스 가부시끼가이샤 반도체 장치 및 이미지 센서 모듈
KR20190024897A (ko) * 2016-07-04 2019-03-08 나믹스 코포레이션 접착제 조성물, 경화물, 정밀 부품
KR20200103782A (ko) * 2017-12-28 2020-09-02 헨켈 아게 운트 코. 카게아아 에폭시 기재 조성물

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WO2015098875A1 (ja) 2013-12-24 2015-07-02 株式会社ブリヂストン 接着シート、その製造方法及び積層体
US9328274B2 (en) * 2014-03-07 2016-05-03 Prc-Desoto International, Inc. Michael acceptor-terminated urethane-containing fuel resistant prepolymers and compositions thereof
JP6547221B2 (ja) * 2014-12-16 2019-07-24 リンテック株式会社 ダイ接着用接着剤
WO2016143777A1 (ja) * 2015-03-12 2016-09-15 ナミックス株式会社 樹脂組成物、接着剤、および封止剤
CN106554245A (zh) * 2015-09-30 2017-04-05 中国石油化工股份有限公司 一种苯乙烯精馏阻聚剂及其配置、应用方法
WO2017077928A1 (ja) * 2015-11-04 2017-05-11 三菱レイヨン株式会社 硬化性組成物、接着剤、コーティング層を有する物品、繊維強化複合材料、ポッティング剤および硬化性組成物キット
JP6699145B2 (ja) * 2015-11-30 2020-05-27 味の素株式会社 光および熱硬化性樹脂組成物
JP6864436B2 (ja) * 2016-03-24 2021-04-28 ナミックス株式会社 樹脂組成物、接着剤、硬化物、半導体装置
JP6948114B2 (ja) 2016-06-15 2021-10-13 デクセリアルズ株式会社 熱硬化型エポキシ樹脂組成物、及びその製造方法
US11466159B2 (en) 2016-07-26 2022-10-11 Ppg Industries Ohio, Inc. Particles having surfaces functionalized with 1,1-di-activated vinyl compounds
US10987697B2 (en) 2016-07-26 2021-04-27 Ppg Industries Ohio, Inc. Multi-layer curable compositions containing 1,1-di-activated vinyl compound products and related processes
EP3491079B1 (en) 2016-07-26 2023-06-07 PPG Industries Ohio, Inc. Electrodepositable coating compositions containing 1,1-di-activated vinyl compounds
EP3490724B1 (en) 2016-07-26 2023-09-20 PPG Industries Ohio, Inc. Polyurethane coating compositions containing 1,1-di-activated vinyl compounds and related coatings and processes
ES2930756T3 (es) 2016-07-26 2022-12-21 Ppg Ind Ohio Inc Composiciones de recubrimiento curables catalizadas por ácido que contienen compuestos vinílicos 1,1-diactivado y recubrimientos y procesos relacionados
US11613076B2 (en) 2016-07-26 2023-03-28 Ppg Industries Ohio, Inc. Three-dimensional printing processes using 1,1-di-activated vinyl compounds
CN109804025B (zh) 2016-07-26 2022-01-11 Ppg工业俄亥俄公司 含有1,1-二活化的乙烯基化合物的可固化组合物和相关的涂料和方法
JP6873489B2 (ja) * 2016-09-12 2021-05-19 ナミックス株式会社 樹脂組成物、接着剤、封止材、ダム剤、および半導体装置
US10934411B2 (en) 2016-09-30 2021-03-02 Ppg Industries Ohio, Inc. Curable compositions containing 1,1-di-activated vinyl compounds that cure by pericyclic reaction mechanisms
CN110431168B (zh) * 2017-03-29 2022-04-29 味之素株式会社 固化性组合物及构造物
JP6935233B2 (ja) * 2017-05-19 2021-09-15 日本ペイント・オートモーティブコーティングス株式会社 クリヤー塗料組成物及びクリヤー塗膜の形成方法
EP3747933B1 (en) 2018-01-30 2023-06-07 Namics Corporation Resin composition and cured material of same, adhesive, semiconductor device, and electronic component
WO2020080391A1 (ja) 2018-10-17 2020-04-23 ナミックス株式会社 樹脂組成物
CN112250866B (zh) * 2019-07-22 2023-04-07 江汉大学 一种以硫醚为主链的自由基型光固化树脂的制备方法
CN112745770A (zh) * 2019-10-31 2021-05-04 味之素株式会社 固化性组合物
EP3960828A1 (en) * 2020-08-31 2022-03-02 Henkel AG & Co. KGaA Resin composition and cured product thereof
TW202309233A (zh) * 2021-06-28 2023-03-01 日商納美仕有限公司 樹脂組成物及接著劑
JPWO2023286700A1 (ja) 2021-07-14 2023-01-19
KR20240032949A (ko) 2021-07-14 2024-03-12 나믹스 가부시끼가이샤 경화성 수지 조성물
TW202311430A (zh) 2021-07-14 2023-03-16 日商納美仕有限公司 硬化性樹脂組成物
WO2023017752A1 (ja) 2021-08-10 2023-02-16 ナミックス株式会社 樹脂組成物及び接着剤
CN117940488A (zh) * 2021-09-15 2024-04-26 纳美仕有限公司 树脂组合物、电子部件用粘接剂、及其固化物、以及电子部件

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170128269A (ko) * 2015-03-12 2017-11-22 나믹스 가부시끼가이샤 반도체 장치 및 이미지 센서 모듈
KR20190024897A (ko) * 2016-07-04 2019-03-08 나믹스 코포레이션 접착제 조성물, 경화물, 정밀 부품
KR20200103782A (ko) * 2017-12-28 2020-09-02 헨켈 아게 운트 코. 카게아아 에폭시 기재 조성물

Also Published As

Publication number Publication date
TW201305224A (zh) 2013-02-01
JP4976575B1 (ja) 2012-07-18
JP2014077024A (ja) 2014-05-01
WO2013005471A1 (ja) 2013-01-10
MY156182A (en) 2016-01-15
TWI579310B (zh) 2017-04-21
CN103097436A (zh) 2013-05-08

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