KR20140026257A - 표시 장치 - Google Patents
표시 장치 Download PDFInfo
- Publication number
- KR20140026257A KR20140026257A KR1020130093245A KR20130093245A KR20140026257A KR 20140026257 A KR20140026257 A KR 20140026257A KR 1020130093245 A KR1020130093245 A KR 1020130093245A KR 20130093245 A KR20130093245 A KR 20130093245A KR 20140026257 A KR20140026257 A KR 20140026257A
- Authority
- KR
- South Korea
- Prior art keywords
- insulating film
- film
- substrate
- transistor
- oxide semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/062—Light-emitting semiconductor devices having field effect type light-emitting regions, e.g. light-emitting High-Electron Mobility Transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2012-184336 | 2012-08-23 | ||
| JP2012184336 | 2012-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20140026257A true KR20140026257A (ko) | 2014-03-05 |
Family
ID=50147200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020130093245A Withdrawn KR20140026257A (ko) | 2012-08-23 | 2013-08-06 | 표시 장치 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10008630B2 (https=) |
| JP (8) | JP2014059553A (https=) |
| KR (1) | KR20140026257A (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015052991A1 (ja) * | 2013-10-09 | 2015-04-16 | シャープ株式会社 | 半導体装置およびその製造方法 |
| KR102107008B1 (ko) | 2013-12-16 | 2020-05-29 | 삼성디스플레이 주식회사 | 유기 발광 표시장치 및 그의 제조방법 |
| JP2015200753A (ja) * | 2014-04-07 | 2015-11-12 | 株式会社ジャパンディスプレイ | 表示装置 |
| TWI831924B (zh) | 2014-04-25 | 2024-02-11 | 日商半導體能源研究所股份有限公司 | 顯示裝置及電子裝置 |
| CN113540130A (zh) * | 2014-10-28 | 2021-10-22 | 株式会社半导体能源研究所 | 显示装置、显示装置的制造方法及电子设备 |
| KR102391904B1 (ko) * | 2014-12-17 | 2022-04-27 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
| CN104600222B (zh) * | 2015-02-04 | 2016-10-19 | 京东方科技集团股份有限公司 | 封装方法、显示面板及显示装置 |
| US9964799B2 (en) * | 2015-03-17 | 2018-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device, display module, and electronic device |
| KR102734238B1 (ko) | 2016-03-04 | 2024-11-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 그 제작 방법, 및 상기 반도체 장치를 포함하는 표시 장치 |
| KR102497896B1 (ko) * | 2016-09-16 | 2023-02-08 | 세키스이가가쿠 고교가부시키가이샤 | 유기 일렉트로 루미네선스 표시 소자용 봉지제 |
| CN109219772A (zh) * | 2017-01-04 | 2019-01-15 | 积水化学工业株式会社 | 液晶显示元件用密封剂、上下导通材料和液晶显示元件 |
| CN110018600B (zh) * | 2019-05-09 | 2021-01-01 | 深圳市华星光电技术有限公司 | 阵列基板及液晶显示面板 |
| CN110808270A (zh) * | 2019-11-12 | 2020-02-18 | 杭州追猎科技有限公司 | 一种有机发光面板封装结构 |
| KR20220082982A (ko) * | 2020-12-10 | 2022-06-20 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
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| KR20200052993A (ko) | 2010-12-03 | 2020-05-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 산화물 반도체막 및 반도체 장치 |
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| JP6035007B2 (ja) * | 2010-12-10 | 2016-11-30 | 富士通株式会社 | Mis型の窒化物半導体hemt及びその製造方法 |
| KR20120085057A (ko) * | 2011-01-21 | 2012-07-31 | 삼성디스플레이 주식회사 | 액정표시장치 및 그 제조방법 |
| WO2012105189A1 (ja) | 2011-02-01 | 2012-08-09 | シャープ株式会社 | 表示装置及びその製造方法 |
| JP2012255840A (ja) * | 2011-06-07 | 2012-12-27 | Japan Display West Co Ltd | 表示装置および電子機器 |
| JP6059566B2 (ja) | 2012-04-13 | 2017-01-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| DE112013002407B4 (de) | 2012-05-10 | 2024-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung |
| KR20200019269A (ko) * | 2012-06-29 | 2020-02-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
-
2013
- 2013-08-06 KR KR1020130093245A patent/KR20140026257A/ko not_active Withdrawn
- 2013-08-09 US US13/962,999 patent/US10008630B2/en not_active Expired - Fee Related
- 2013-08-19 JP JP2013169467A patent/JP2014059553A/ja not_active Withdrawn
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2018
- 2018-12-03 JP JP2018226731A patent/JP6611898B2/ja active Active
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2019
- 2019-10-29 JP JP2019196540A patent/JP6903111B2/ja active Active
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2021
- 2021-06-22 JP JP2021103294A patent/JP7085676B2/ja active Active
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2022
- 2022-06-06 JP JP2022091380A patent/JP7268227B2/ja active Active
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2023
- 2023-04-20 JP JP2023069306A patent/JP7483093B2/ja active Active
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2024
- 2024-04-30 JP JP2024073434A patent/JP2024114691A/ja not_active Withdrawn
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Also Published As
| Publication number | Publication date |
|---|---|
| JP7483093B2 (ja) | 2024-05-14 |
| JP2019070816A (ja) | 2019-05-09 |
| JP7085676B2 (ja) | 2022-06-16 |
| JP2025137593A (ja) | 2025-09-19 |
| JP2022126691A (ja) | 2022-08-30 |
| JP2023103262A (ja) | 2023-07-26 |
| US10008630B2 (en) | 2018-06-26 |
| JP7268227B2 (ja) | 2023-05-02 |
| JP2014059553A (ja) | 2014-04-03 |
| JP6611898B2 (ja) | 2019-11-27 |
| JP6903111B2 (ja) | 2021-07-14 |
| JP2024114691A (ja) | 2024-08-23 |
| JP2020030419A (ja) | 2020-02-27 |
| US20140054582A1 (en) | 2014-02-27 |
| JP2021167957A (ja) | 2021-10-21 |
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