KR20070007101A - 장치의 탐침 방법 - Google Patents

장치의 탐침 방법 Download PDF

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Publication number
KR20070007101A
KR20070007101A KR1020067019009A KR20067019009A KR20070007101A KR 20070007101 A KR20070007101 A KR 20070007101A KR 1020067019009 A KR1020067019009 A KR 1020067019009A KR 20067019009 A KR20067019009 A KR 20067019009A KR 20070007101 A KR20070007101 A KR 20070007101A
Authority
KR
South Korea
Prior art keywords
electronic device
probe
terminals
terminal
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020067019009A
Other languages
English (en)
Korean (ko)
Inventor
티모시 이 쿠퍼
벤자민 엔 엘드리지
이고르 케이 칸드로스
로드 마텐스
게탄 엘 마튜
Original Assignee
폼팩터, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 폼팩터, 인코포레이티드 filed Critical 폼팩터, 인코포레이티드
Publication of KR20070007101A publication Critical patent/KR20070007101A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020067019009A 2004-02-18 2005-02-15 장치의 탐침 방법 Ceased KR20070007101A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/781,369 2004-02-18
US10/781,369 US7218127B2 (en) 2004-02-18 2004-02-18 Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component

Publications (1)

Publication Number Publication Date
KR20070007101A true KR20070007101A (ko) 2007-01-12

Family

ID=34838722

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067019009A Ceased KR20070007101A (ko) 2004-02-18 2005-02-15 장치의 탐침 방법

Country Status (7)

Country Link
US (3) US7218127B2 (enExample)
EP (1) EP1716422A4 (enExample)
JP (1) JP2007523350A (enExample)
KR (1) KR20070007101A (enExample)
CN (1) CN1950709B (enExample)
TW (1) TWI392873B (enExample)
WO (1) WO2005081001A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101410991B1 (ko) * 2012-11-20 2014-06-23 리노정밀(주) 지그 장치
KR20170110523A (ko) * 2016-03-23 2017-10-11 야마하 파인 테크 가부시키가이샤 회로 기판의 검사 방법, 검사 장치, 및 프로그램

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US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
US7218127B2 (en) * 2004-02-18 2007-05-15 Formfactor, Inc. Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
US7659739B2 (en) * 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7759949B2 (en) * 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US9097740B2 (en) * 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US8988091B2 (en) * 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7733101B2 (en) * 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US7271606B1 (en) * 2005-08-04 2007-09-18 National Semiconductor Corporation Spring-based probe pin that allows kelvin testing
US20070057685A1 (en) * 2005-09-14 2007-03-15 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US7378734B2 (en) * 2006-05-30 2008-05-27 Touchdown Technologies, Inc. Stacked contact bump
US20070075717A1 (en) * 2005-09-14 2007-04-05 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US7649367B2 (en) * 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
JP2007183193A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
US20070205269A1 (en) * 2006-03-02 2007-09-06 Lindon Mark L Method and system for the resale of prepaid cards and paper gift certificates
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US8436636B2 (en) * 2006-10-10 2013-05-07 Apple Inc. Methods and apparatuses for testing circuit boards
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US8362793B2 (en) * 2006-11-07 2013-01-29 Apple Inc. Circuit boards including removable test point portions and configurable testing platforms
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US7671610B2 (en) * 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US8723546B2 (en) * 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US8230593B2 (en) * 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
DE202008013982U1 (de) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messsystem zum Bestimmen von Streuparametern
US8073019B2 (en) * 2009-03-02 2011-12-06 Jian Liu 810 nm ultra-short pulsed fiber laser
JP5384170B2 (ja) * 2009-03-31 2014-01-08 東京エレクトロン株式会社 コンタクトパラメータの設定方法、コンタクトパラメータの設定用プログラム及びコンタクトパラメータの設定用プログラムが記録された記録媒体
US9329204B2 (en) 2009-04-21 2016-05-03 Johnstech International Corporation Electrically conductive Kelvin contacts for microcircuit tester
KR101399071B1 (ko) 2009-04-21 2014-05-27 존스테크 인터내셔널 코포레이션 마이크로회로 테스터용 전기 전도 켈빈 접점
US9229029B2 (en) 2011-11-29 2016-01-05 Formfactor, Inc. Hybrid electrical contactor
US20130271172A1 (en) * 2012-04-13 2013-10-17 Texas Instruments Incorporated Probe apparatus and method
JP6155725B2 (ja) * 2013-03-19 2017-07-05 富士電機株式会社 半導体装置の検査方法及びその方法を用いた半導体装置の製造方法
US10302677B2 (en) 2015-04-29 2019-05-28 Kla-Tencor Corporation Multiple pin probes with support for performing parallel measurements
CN106935524B (zh) 2015-12-24 2020-04-21 台湾积体电路制造股份有限公司 探针卡和晶圆测试系统及晶圆测试方法
TWI637177B (zh) * 2016-12-23 2018-10-01 台灣福雷電子股份有限公司 用於測試半導體元件之系統及方法
KR20190021101A (ko) 2017-08-22 2019-03-05 삼성전자주식회사 프로브 카드, 프로브 카드를 포함한 테스트 장치, 그 프로브 카드를 이용한 테스트 방법 및 반도체 소자 제조방법
CN107942222A (zh) * 2017-11-21 2018-04-20 德淮半导体有限公司 测试机台及测试方法
TWI794990B (zh) * 2021-09-23 2023-03-01 牧德科技股份有限公司 電測治具扎針位置估算方法

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US5207585A (en) * 1990-10-31 1993-05-04 International Business Machines Corporation Thin interface pellicle for dense arrays of electrical interconnects
US5974662A (en) 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
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JP3484365B2 (ja) 1999-01-19 2004-01-06 シャープ株式会社 半導体装置用パッケージ、この半導体装置用パッケージのテスト時に使用するプローブカード、および、このプローブカードを用いたパッケージのテスト方法
JP3745184B2 (ja) 1999-03-25 2006-02-15 株式会社東京カソード研究所 プローブカード用探針及びその製造方法
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US7068056B1 (en) 2005-07-18 2006-06-27 Texas Instruments Incorporated System and method for the probing of a wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101410991B1 (ko) * 2012-11-20 2014-06-23 리노정밀(주) 지그 장치
KR20170110523A (ko) * 2016-03-23 2017-10-11 야마하 파인 테크 가부시키가이샤 회로 기판의 검사 방법, 검사 장치, 및 프로그램

Also Published As

Publication number Publication date
CN1950709A (zh) 2007-04-18
US20070262767A1 (en) 2007-11-15
TW200538741A (en) 2005-12-01
US20050179455A1 (en) 2005-08-18
TWI392873B (zh) 2013-04-11
WO2005081001A1 (en) 2005-09-01
US20090085592A1 (en) 2009-04-02
US7218127B2 (en) 2007-05-15
JP2007523350A (ja) 2007-08-16
US7701243B2 (en) 2010-04-20
CN1950709B (zh) 2010-10-06
US7463043B2 (en) 2008-12-09
EP1716422A1 (en) 2006-11-02
EP1716422A4 (en) 2012-01-04

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