JP2007523350A - 装置のプロービング - Google Patents

装置のプロービング Download PDF

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Publication number
JP2007523350A
JP2007523350A JP2006554211A JP2006554211A JP2007523350A JP 2007523350 A JP2007523350 A JP 2007523350A JP 2006554211 A JP2006554211 A JP 2006554211A JP 2006554211 A JP2006554211 A JP 2006554211A JP 2007523350 A JP2007523350 A JP 2007523350A
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JP
Japan
Prior art keywords
electronic device
probe
terminal
terminals
contact
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Pending
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JP2006554211A
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English (en)
Japanese (ja)
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JP2007523350A5 (enExample
Inventor
ティモシー イー． クーパー，
ベンジャミン エヌ． エルドリッジ，
イゴア ケー． カンドロス，
ロッド マーテンズ，
ガエタン エル． マシュウ，
Original Assignee
フォームファクター， インコーポレイテッド
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Application filed by フォームファクター， インコーポレイテッド filed Critical フォームファクター， インコーポレイテッド
Publication of JP2007523350A publication Critical patent/JP2007523350A/ja
Publication of JP2007523350A5 publication Critical patent/JP2007523350A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2006554211A 2004-02-18 2005-02-15 装置のプロービング Pending JP2007523350A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/781,369 US7218127B2 (en) 2004-02-18 2004-02-18 Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
PCT/US2005/005087 WO2005081001A1 (en) 2004-02-18 2005-02-15 Probing a device

Publications (2)

Publication Number Publication Date
JP2007523350A true JP2007523350A (ja) 2007-08-16
JP2007523350A5 JP2007523350A5 (enExample) 2008-04-03

Family

ID=34838722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006554211A Pending JP2007523350A (ja) 2004-02-18 2005-02-15 装置のプロービング

Country Status (7)

Country Link
US (3) US7218127B2 (enExample)
EP (1) EP1716422A4 (enExample)
JP (1) JP2007523350A (enExample)
KR (1) KR20070007101A (enExample)
CN (1) CN1950709B (enExample)
TW (1) TWI392873B (enExample)
WO (1) WO2005081001A1 (enExample)

Cited By (2)

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US8395401B2 (en) 2009-03-31 2013-03-12 Tokyo Electron Limited Method for setting contact parameter and recording medium having program for setting contact parameter recorded thereon
TWI637177B (zh) * 2016-12-23 2018-10-01 台灣福雷電子股份有限公司 用於測試半導體元件之系統及方法

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US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
US7218127B2 (en) * 2004-02-18 2007-05-15 Formfactor, Inc. Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
US7733101B2 (en) * 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US8988091B2 (en) * 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
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US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US9097740B2 (en) * 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7759949B2 (en) * 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US7271606B1 (en) * 2005-08-04 2007-09-18 National Semiconductor Corporation Spring-based probe pin that allows kelvin testing
US20070057685A1 (en) * 2005-09-14 2007-03-15 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US20070075717A1 (en) * 2005-09-14 2007-04-05 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US7378734B2 (en) * 2006-05-30 2008-05-27 Touchdown Technologies, Inc. Stacked contact bump
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
JP2007183193A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
US20070205269A1 (en) * 2006-03-02 2007-09-06 Lindon Mark L Method and system for the resale of prepaid cards and paper gift certificates
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US8436636B2 (en) * 2006-10-10 2013-05-07 Apple Inc. Methods and apparatuses for testing circuit boards
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US8907689B2 (en) * 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US8362793B2 (en) * 2006-11-07 2013-01-29 Apple Inc. Circuit boards including removable test point portions and configurable testing platforms
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US7671610B2 (en) * 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US8723546B2 (en) * 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US8230593B2 (en) * 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
DE202008013982U1 (de) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messsystem zum Bestimmen von Streuparametern
US8073019B2 (en) * 2009-03-02 2011-12-06 Jian Liu 810 nm ultra-short pulsed fiber laser
EP2422205B1 (en) * 2009-04-21 2019-09-18 JohnsTech International Corporation Electrically conductive kelvin contacts for microcircuit tester
US9329204B2 (en) 2009-04-21 2016-05-03 Johnstech International Corporation Electrically conductive Kelvin contacts for microcircuit tester
US9229029B2 (en) 2011-11-29 2016-01-05 Formfactor, Inc. Hybrid electrical contactor
US20130271172A1 (en) * 2012-04-13 2013-10-17 Texas Instruments Incorporated Probe apparatus and method
KR101410991B1 (ko) * 2012-11-20 2014-06-23 리노정밀(주) 지그 장치
JP6155725B2 (ja) * 2013-03-19 2017-07-05 富士電機株式会社 半導体装置の検査方法及びその方法を用いた半導体装置の製造方法
US10302677B2 (en) * 2015-04-29 2019-05-28 Kla-Tencor Corporation Multiple pin probes with support for performing parallel measurements
CN106935524B (zh) 2015-12-24 2020-04-21 台湾积体电路制造股份有限公司 探针卡和晶圆测试系统及晶圆测试方法
JP6877025B2 (ja) * 2016-03-23 2021-05-26 ヤマハファインテック株式会社 回路基板の検査方法、検査装置、及びプログラム
KR20190021101A (ko) 2017-08-22 2019-03-05 삼성전자주식회사 프로브 카드, 프로브 카드를 포함한 테스트 장치, 그 프로브 카드를 이용한 테스트 방법 및 반도체 소자 제조방법
CN107942222A (zh) * 2017-11-21 2018-04-20 德淮半导体有限公司 测试机台及测试方法
TWI794990B (zh) * 2021-09-23 2023-03-01 牧德科技股份有限公司 電測治具扎針位置估算方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
JPH08153761A (ja) * 1994-11-25 1996-06-11 Shikahama Seisakusho:Kk プローブヘッドおよびプローブヘッドの支持機構

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Patent Citations (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8395401B2 (en) 2009-03-31 2013-03-12 Tokyo Electron Limited Method for setting contact parameter and recording medium having program for setting contact parameter recorded thereon
TWI637177B (zh) * 2016-12-23 2018-10-01 台灣福雷電子股份有限公司 用於測試半導體元件之系統及方法

Also Published As

Publication number Publication date
WO2005081001A1 (en) 2005-09-01
TWI392873B (zh) 2013-04-11
US7218127B2 (en) 2007-05-15
KR20070007101A (ko) 2007-01-12
EP1716422A4 (en) 2012-01-04
CN1950709A (zh) 2007-04-18
CN1950709B (zh) 2010-10-06
US20050179455A1 (en) 2005-08-18
US7701243B2 (en) 2010-04-20
TW200538741A (en) 2005-12-01
EP1716422A1 (en) 2006-11-02
US7463043B2 (en) 2008-12-09
US20090085592A1 (en) 2009-04-02
US20070262767A1 (en) 2007-11-15

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