JP2007523350A5 - - Google Patents

Download PDF

Info

Publication number
JP2007523350A5
JP2007523350A5 JP2006554211A JP2006554211A JP2007523350A5 JP 2007523350 A5 JP2007523350 A5 JP 2007523350A5 JP 2006554211 A JP2006554211 A JP 2006554211A JP 2006554211 A JP2006554211 A JP 2006554211A JP 2007523350 A5 JP2007523350 A5 JP 2007523350A5
Authority
JP
Japan
Prior art keywords
electronic device
probes
relative position
program product
relative movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006554211A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007523350A (ja
Filing date
Publication date
Priority claimed from US10/781,369 external-priority patent/US7218127B2/en
Application filed filed Critical
Publication of JP2007523350A publication Critical patent/JP2007523350A/ja
Publication of JP2007523350A5 publication Critical patent/JP2007523350A5/ja
Pending legal-status Critical Current

Links

JP2006554211A 2004-02-18 2005-02-15 装置のプロービング Pending JP2007523350A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/781,369 US7218127B2 (en) 2004-02-18 2004-02-18 Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
PCT/US2005/005087 WO2005081001A1 (en) 2004-02-18 2005-02-15 Probing a device

Publications (2)

Publication Number Publication Date
JP2007523350A JP2007523350A (ja) 2007-08-16
JP2007523350A5 true JP2007523350A5 (enExample) 2008-04-03

Family

ID=34838722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006554211A Pending JP2007523350A (ja) 2004-02-18 2005-02-15 装置のプロービング

Country Status (7)

Country Link
US (3) US7218127B2 (enExample)
EP (1) EP1716422A4 (enExample)
JP (1) JP2007523350A (enExample)
KR (1) KR20070007101A (enExample)
CN (1) CN1950709B (enExample)
TW (1) TWI392873B (enExample)
WO (1) WO2005081001A1 (enExample)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6525555B1 (en) * 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
US7202682B2 (en) 2002-12-20 2007-04-10 Formfactor, Inc. Composite motion probing
US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
US7218127B2 (en) * 2004-02-18 2007-05-15 Formfactor, Inc. Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
US7659739B2 (en) * 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US7733101B2 (en) * 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US9097740B2 (en) * 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US7759949B2 (en) * 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US8988091B2 (en) * 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7271606B1 (en) * 2005-08-04 2007-09-18 National Semiconductor Corporation Spring-based probe pin that allows kelvin testing
US7378734B2 (en) * 2006-05-30 2008-05-27 Touchdown Technologies, Inc. Stacked contact bump
US20070075717A1 (en) * 2005-09-14 2007-04-05 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US20070057685A1 (en) * 2005-09-14 2007-03-15 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
JP2007183193A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
US20070205269A1 (en) * 2006-03-02 2007-09-06 Lindon Mark L Method and system for the resale of prepaid cards and paper gift certificates
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US8436636B2 (en) * 2006-10-10 2013-05-07 Apple Inc. Methods and apparatuses for testing circuit boards
US8907689B2 (en) * 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US8362793B2 (en) 2006-11-07 2013-01-29 Apple Inc. Circuit boards including removable test point portions and configurable testing platforms
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US7671610B2 (en) * 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US8723546B2 (en) * 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US8230593B2 (en) * 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
DE202008013982U1 (de) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messsystem zum Bestimmen von Streuparametern
US8073019B2 (en) * 2009-03-02 2011-12-06 Jian Liu 810 nm ultra-short pulsed fiber laser
JP5384170B2 (ja) * 2009-03-31 2014-01-08 東京エレクトロン株式会社 コンタクトパラメータの設定方法、コンタクトパラメータの設定用プログラム及びコンタクトパラメータの設定用プログラムが記録された記録媒体
US8558554B2 (en) * 2009-04-21 2013-10-15 Johnstech International Corporation Electrically conductive Kelvin contacts for microcircuit tester
US9329204B2 (en) 2009-04-21 2016-05-03 Johnstech International Corporation Electrically conductive Kelvin contacts for microcircuit tester
US9229029B2 (en) 2011-11-29 2016-01-05 Formfactor, Inc. Hybrid electrical contactor
US20130271172A1 (en) * 2012-04-13 2013-10-17 Texas Instruments Incorporated Probe apparatus and method
KR101410991B1 (ko) * 2012-11-20 2014-06-23 리노정밀(주) 지그 장치
JP6155725B2 (ja) * 2013-03-19 2017-07-05 富士電機株式会社 半導体装置の検査方法及びその方法を用いた半導体装置の製造方法
US10302677B2 (en) 2015-04-29 2019-05-28 Kla-Tencor Corporation Multiple pin probes with support for performing parallel measurements
CN106935524B (zh) 2015-12-24 2020-04-21 台湾积体电路制造股份有限公司 探针卡和晶圆测试系统及晶圆测试方法
JP6877025B2 (ja) * 2016-03-23 2021-05-26 ヤマハファインテック株式会社 回路基板の検査方法、検査装置、及びプログラム
TWI637177B (zh) * 2016-12-23 2018-10-01 台灣福雷電子股份有限公司 用於測試半導體元件之系統及方法
KR20190021101A (ko) 2017-08-22 2019-03-05 삼성전자주식회사 프로브 카드, 프로브 카드를 포함한 테스트 장치, 그 프로브 카드를 이용한 테스트 방법 및 반도체 소자 제조방법
CN107942222A (zh) * 2017-11-21 2018-04-20 德淮半导体有限公司 测试机台及测试方法
TWI794990B (zh) * 2021-09-23 2023-03-01 牧德科技股份有限公司 電測治具扎針位置估算方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2487098A1 (fr) 1980-07-18 1982-01-22 Vandeputte Fils & Cie Dispositif de visualisation de donnees
US4506215A (en) 1981-06-30 1985-03-19 International Business Machines Corporation Modular test probe
US4780836A (en) * 1985-08-14 1988-10-25 Kabushiki Kaisha Toshiba Method of testing semiconductor devices using a probe card
US5012186A (en) * 1990-06-08 1991-04-30 Cascade Microtech, Inc. Electrical probe with contact force protection
JP3208734B2 (ja) 1990-08-20 2001-09-17 東京エレクトロン株式会社 プローブ装置
US5207585A (en) * 1990-10-31 1993-05-04 International Business Machines Corporation Thin interface pellicle for dense arrays of electrical interconnects
US5974662A (en) 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
JPH08153761A (ja) * 1994-11-25 1996-06-11 Shikahama Seisakusho:Kk プローブヘッドおよびプローブヘッドの支持機構
US5773987A (en) * 1996-02-26 1998-06-30 Motorola, Inc. Method for probing a semiconductor wafer using a motor controlled scrub process
US6140828A (en) * 1997-05-08 2000-10-31 Tokyo Electron Limited Prober and probe method
JP3423979B2 (ja) 1997-07-11 2003-07-07 東京エレクトロン株式会社 プローブ方法及びプローブ装置
DE19733861A1 (de) 1997-08-05 1999-02-25 Siemens Ag Vorrichtung und Verfahren zur Kontaktierung einer Meß-Sonde
JPH1174322A (ja) 1997-08-28 1999-03-16 Mitsubishi Electric Corp ウエハプローバー
JP3586106B2 (ja) * 1998-07-07 2004-11-10 株式会社アドバンテスト Ｉｃ試験装置用プローブカード
JP3484365B2 (ja) 1999-01-19 2004-01-06 シャープ株式会社 半導体装置用パッケージ、この半導体装置用パッケージのテスト時に使用するプローブカード、および、このプローブカードを用いたパッケージのテスト方法
JP3745184B2 (ja) 1999-03-25 2006-02-15 株式会社東京カソード研究所 プローブカード用探針及びその製造方法
US6250933B1 (en) * 2000-01-20 2001-06-26 Advantest Corp. Contact structure and production method thereof
KR100350513B1 (ko) * 2000-04-03 2002-08-28 박태욱 피디피 전극 검사 프로브장치
JP2001356134A (ja) * 2000-04-13 2001-12-26 Innotech Corp プローブカード装置およびそれに用いられるプローブ
DE10039336C2 (de) 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
CN2444311Y (zh) * 2000-08-15 2001-08-22 陈文杰 晶片测试装置
US6507207B2 (en) 2001-02-20 2003-01-14 Vinh T. Nguyen Contact probe pin for wafer probing apparatus
US6773987B1 (en) * 2001-11-17 2004-08-10 Altera Corporation Method and apparatus for reducing charge loss in a nonvolatile memory cell
CN100392408C (zh) * 2001-12-25 2008-06-04 住友电气工业株式会社 接触探头
JP2003254995A (ja) * 2001-12-25 2003-09-10 Sumitomo Electric Ind Ltd コンタクトプローブ
JP2003194847A (ja) * 2001-12-26 2003-07-09 Sumitomo Electric Ind Ltd コンタクトプローブ
US6668628B2 (en) 2002-03-29 2003-12-30 Xerox Corporation Scanning probe system with spring probe
US7202682B2 (en) * 2002-12-20 2007-04-10 Formfactor, Inc. Composite motion probing
JP4099412B2 (ja) 2003-03-19 2008-06-11 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
JP2005072143A (ja) 2003-08-21 2005-03-17 Tokyo Seimitsu Co Ltd プローブ装置
US7218127B2 (en) * 2004-02-18 2007-05-15 Formfactor, Inc. Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
US7068056B1 (en) 2005-07-18 2006-06-27 Texas Instruments Incorporated System and method for the probing of a wafer

Similar Documents

Publication Publication Date Title
JP2007523350A5 (enExample)
US20090134897A1 (en) Apparatus and method for limiting over travel in a probe card assembly
KR20090071644A (ko) 탄소 나노튜브 프로브의 제작 방법 및 사용 방법
JP2007523350A (ja) 装置のプロービング
MY147876A (en) Probe card
JP2008506112A (ja) 膜懸垂プローブを具えるプローブヘッド
JPWO2009013809A1 (ja) コンタクタ、プローブカード及びコンタクタの実装方法。
CN104880658B (zh) 用于加速度传感器的测试装置
CN109804254A (zh) 多引脚密集阵列电阻率探针
JP2013088288A (ja) 検査装置及び検査システム
JP2009139298A (ja) プローブカード
CN108735618B (zh) 对器件进行测试和封装的方法
JP4847907B2 (ja) 半導体検査装置
WO2009147804A1 (ja) プローブ装置製造方法
JP2016105059A (ja) カンチレバー型プローブ、及びプローブカード
JP7101457B2 (ja) 電気的接続装置
JP2006170700A (ja) プローブ校正用治具、校正用治具付きプローブカードおよび半導体ウェハ測定装置
TWI737765B (zh) 用於晶圓測試接觸件之堆疊立柱凸塊接觸及其相關方法
TW200937020A (en) Probes of vertical probe card
JP2012068043A (ja) 平面回路基板の電気検査装置及び電気検査方法
JP2007225581A5 (enExample)
KR100555612B1 (ko) 판재 절개형 프로브 및 이의 제조방법
JP4019852B2 (ja) 半導体回路測定装置
JP2007225581A (ja) 格子状配列プローブ組立体
KR100446551B1 (ko) 화산형 프로브, 이의 제조방법 및 이를 구비한프로브카드