KR20010111026A - 열전도성 실리콘 고무 조성물 - Google Patents

열전도성 실리콘 고무 조성물 Download PDF

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Publication number
KR20010111026A
KR20010111026A KR1020010031772A KR20010031772A KR20010111026A KR 20010111026 A KR20010111026 A KR 20010111026A KR 1020010031772 A KR1020010031772 A KR 1020010031772A KR 20010031772 A KR20010031772 A KR 20010031772A KR 20010111026 A KR20010111026 A KR 20010111026A
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KR
South Korea
Prior art keywords
component
silicone rubber
thermally conductive
rubber composition
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020010031772A
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English (en)
Korean (ko)
Inventor
에나미히로지
오니시마사유키
오카와다다시
아마코마사아키
Original Assignee
다우 코닝 도레이 실리콘 캄파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 다우 코닝 도레이 실리콘 캄파니 리미티드 filed Critical 다우 코닝 도레이 실리콘 캄파니 리미티드
Publication of KR20010111026A publication Critical patent/KR20010111026A/ko
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/045Polysiloxanes containing less than 25 silicon atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0812Aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020010031772A 2000-06-08 2001-06-07 열전도성 실리콘 고무 조성물 Withdrawn KR20010111026A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000171477A JP4646357B2 (ja) 2000-06-08 2000-06-08 熱伝導性シリコーンゴム組成物
JP2000-171477 2000-06-08

Publications (1)

Publication Number Publication Date
KR20010111026A true KR20010111026A (ko) 2001-12-15

Family

ID=18674023

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010031772A Withdrawn KR20010111026A (ko) 2000-06-08 2001-06-07 열전도성 실리콘 고무 조성물

Country Status (4)

Country Link
US (1) US20020010245A1 (https=)
EP (1) EP1162239A3 (https=)
JP (1) JP4646357B2 (https=)
KR (1) KR20010111026A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220144411A (ko) * 2020-03-05 2022-10-26 다우 글로벌 테크놀로지스 엘엘씨 전단 담화 열전도성 실리콘 조성물

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100858836B1 (ko) * 2001-05-14 2008-09-17 다우 코닝 도레이 캄파니 리미티드 열전도성 실리콘 조성물
JP4588285B2 (ja) * 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP3807995B2 (ja) 2002-03-05 2006-08-09 ポリマテック株式会社 熱伝導性シート
JP3904469B2 (ja) * 2002-04-23 2007-04-11 信越化学工業株式会社 流動性を有する硬化性オルガノポリシロキサン組成物
JP2005042096A (ja) * 2003-07-04 2005-02-17 Fuji Polymer Industries Co Ltd 熱伝導性組成物及びこれを用いたパテ状放熱シートと放熱構造体
WO2005030874A1 (ja) * 2003-09-29 2005-04-07 Ge Toshiba Silicones Co., Ltd. 熱伝導性シリコーン組成物
TWI345576B (en) 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5154010B2 (ja) * 2005-10-27 2013-02-27 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性シリコーンゴム組成物
JP2007332104A (ja) * 2006-06-16 2007-12-27 Shin Etsu Chem Co Ltd 有機ケイ素化合物
TWI419931B (zh) * 2006-06-16 2013-12-21 信越化學工業股份有限公司 導熱聚矽氧潤滑脂組成物
JP4514058B2 (ja) * 2006-08-30 2010-07-28 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP2008150439A (ja) * 2006-12-14 2008-07-03 Momentive Performance Materials Japan Kk 熱伝導性シリコーン組成物及びそれを用いた塗布装置
US7462294B2 (en) * 2007-04-25 2008-12-09 International Business Machines Corporation Enhanced thermal conducting formulations
JP2009203373A (ja) * 2008-02-28 2009-09-10 Momentive Performance Materials Inc 熱伝導性シリコーン組成物
JP4656340B2 (ja) * 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP6014299B2 (ja) * 2008-09-01 2016-10-25 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び半導体装置
JP5103364B2 (ja) * 2008-11-17 2012-12-19 日東電工株式会社 熱伝導性シートの製造方法
JP5606104B2 (ja) * 2009-03-23 2014-10-15 株式会社アドマテックス 紫外線反射組成物及び紫外線反射成形品
DE102009017542A1 (de) * 2009-04-17 2010-10-28 Carl Freudenberg Kg Unsymmetrischer Separator
US8431220B2 (en) 2009-06-05 2013-04-30 Xerox Corporation Hydrophobic coatings and their processes
US8329301B2 (en) 2009-07-29 2012-12-11 Xerox Corporation Fluoroelastomer containing intermediate transfer members
EP2752101A1 (en) * 2011-08-29 2014-07-09 Koninklijke Philips N.V. A flexible lighting assembly, a luminaire, and a method of manufacturing a flexible layer
JP6038175B2 (ja) 2012-01-03 2016-12-07 フィリップス ライティング ホールディング ビー ヴィ 照明アセンブリ、光源、及び照明器具
EP2882821B1 (en) 2012-07-30 2020-06-03 Dow Silicones Corporation Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition
JP6569036B2 (ja) * 2013-10-17 2019-09-04 ダウ・東レ株式会社 硬化性シリコーン組成物および光半導体装置
KR101868327B1 (ko) * 2013-10-17 2018-07-23 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물 및 광 반도체 장치
JP6314797B2 (ja) * 2013-11-15 2018-04-25 信越化学工業株式会社 熱伝導性複合シート
KR102470706B1 (ko) * 2014-12-19 2022-11-28 다우 실리콘즈 코포레이션 축합 가교결합 입자의 제조 방법
WO2017012714A1 (en) * 2015-07-20 2017-01-26 Momentive Performance Materials Gmbh Asymmetrically substituted polyorganosiloxane derivatives
TWI738743B (zh) * 2016-03-23 2021-09-11 美商道康寧公司 金屬-聚有機矽氧烷
KR20190020776A (ko) * 2016-06-24 2019-03-04 다우 코닝 도레이 캄파니 리미티드 화장료용 분체의 처리제, 화장료용 분체 및 이를 배합한 화장료
KR102334773B1 (ko) * 2016-07-22 2021-12-03 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 열전도성 폴리오가노실록산 조성물
WO2018043270A1 (ja) 2016-09-01 2018-03-08 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物
CN110997841A (zh) 2017-06-26 2020-04-10 美国陶氏有机硅公司 硅酮-聚醚共聚物组合物、制备硅酮-聚醚共聚物组合物的方法和密封剂
CN111094458B (zh) * 2017-07-24 2022-03-29 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
EP3898780A2 (en) 2018-12-21 2021-10-27 Dow Silicones Corporation Silicone-organic copolymer, sealants comprising same, and related methods
WO2020131705A1 (en) 2018-12-21 2020-06-25 Dow Silicones Corporation Silicone-polyester copolymer, sealants comprising same, and related methods
US11760841B2 (en) 2018-12-21 2023-09-19 Dow Silicones Corporation Silicone-polycarbonate copolymer, sealants comprising same, and related methods
CA3122280A1 (en) 2018-12-21 2020-06-25 Dow Silicones Corporation Silicone-polyacrylate copolymer, sealants comprising same, and related methods
KR20210148204A (ko) 2019-03-29 2021-12-07 다우 도레이 캄파니 리미티드 다성분형 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체
EP4166614A4 (en) * 2020-07-02 2023-12-20 Fuji Polymer Industries Co., Ltd. SILICONE GEL COMPOSITION AND SILICONE GEL FILM
EP4410899A4 (en) * 2021-09-30 2025-04-09 Wacker Chemie AG Thermally conductive silicone composition and method for producing gap filler using said composition
JP2024014313A (ja) * 2022-07-22 2024-02-01 株式会社レゾナック 熱伝導組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2704732B2 (ja) * 1988-08-01 1998-01-26 東レ・ダウコーニング・シリコーン株式会社 硬化性液状オルガノポリシロキサン組成物
JP2741436B2 (ja) * 1991-06-24 1998-04-15 信越化学工業株式会社 表面処理アルミナ及びそれを含有する熱伝導性シリコーン組成物
JPH07268218A (ja) * 1994-03-31 1995-10-17 Toray Dow Corning Silicone Co Ltd シリコーンゴム組成物
JPH08157483A (ja) * 1994-11-30 1996-06-18 Toray Dow Corning Silicone Co Ltd 有機ケイ素化合物およびその製造方法
JPH08231724A (ja) * 1995-02-27 1996-09-10 Toray Dow Corning Silicone Co Ltd 有機ケイ素化合物およびその製造方法
JP3576639B2 (ja) * 1995-05-29 2004-10-13 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーンゴム組成物
JPH08208993A (ja) * 1995-11-27 1996-08-13 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
JP3999827B2 (ja) * 1996-01-31 2007-10-31 東レ・ダウコーニング株式会社 オルガノペンタシロキサンの製造方法
JP3835891B2 (ja) * 1997-05-23 2006-10-18 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JP4221089B2 (ja) * 1998-05-27 2009-02-12 東レ・ダウコーニング株式会社 シロキサンを含有する組成物
JP3543663B2 (ja) * 1999-03-11 2004-07-14 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
JP3874057B2 (ja) * 2000-03-01 2007-01-31 信越化学工業株式会社 キャップシール用液状シリコーンゴム組成物、キャップのシール方法及びキャップ
KR100858836B1 (ko) * 2001-05-14 2008-09-17 다우 코닝 도레이 캄파니 리미티드 열전도성 실리콘 조성물

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220144411A (ko) * 2020-03-05 2022-10-26 다우 글로벌 테크놀로지스 엘엘씨 전단 담화 열전도성 실리콘 조성물

Also Published As

Publication number Publication date
US20020010245A1 (en) 2002-01-24
JP4646357B2 (ja) 2011-03-09
EP1162239A3 (en) 2002-03-27
JP2001348483A (ja) 2001-12-18
EP1162239A2 (en) 2001-12-12

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Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20010607

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