JP4646357B2 - 熱伝導性シリコーンゴム組成物 - Google Patents

熱伝導性シリコーンゴム組成物 Download PDF

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Publication number
JP4646357B2
JP4646357B2 JP2000171477A JP2000171477A JP4646357B2 JP 4646357 B2 JP4646357 B2 JP 4646357B2 JP 2000171477 A JP2000171477 A JP 2000171477A JP 2000171477 A JP2000171477 A JP 2000171477A JP 4646357 B2 JP4646357 B2 JP 4646357B2
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JP
Japan
Prior art keywords
group
component
weight
parts
silicone rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000171477A
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English (en)
Japanese (ja)
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JP2001348483A5 (https=
JP2001348483A (ja
Inventor
博司 江南
正之 大西
直 大川
雅章 尼子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
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Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2000171477A priority Critical patent/JP4646357B2/ja
Priority to US09/871,258 priority patent/US20020010245A1/en
Priority to KR1020010031772A priority patent/KR20010111026A/ko
Priority to EP01304972A priority patent/EP1162239A3/en
Publication of JP2001348483A publication Critical patent/JP2001348483A/ja
Publication of JP2001348483A5 publication Critical patent/JP2001348483A5/ja
Application granted granted Critical
Publication of JP4646357B2 publication Critical patent/JP4646357B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2000171477A 2000-06-08 2000-06-08 熱伝導性シリコーンゴム組成物 Expired - Fee Related JP4646357B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000171477A JP4646357B2 (ja) 2000-06-08 2000-06-08 熱伝導性シリコーンゴム組成物
US09/871,258 US20020010245A1 (en) 2000-06-08 2001-05-31 Thermally conductive silicone rubber composition
KR1020010031772A KR20010111026A (ko) 2000-06-08 2001-06-07 열전도성 실리콘 고무 조성물
EP01304972A EP1162239A3 (en) 2000-06-08 2001-06-07 Thermally conductive silicone rubber composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000171477A JP4646357B2 (ja) 2000-06-08 2000-06-08 熱伝導性シリコーンゴム組成物

Publications (3)

Publication Number Publication Date
JP2001348483A JP2001348483A (ja) 2001-12-18
JP2001348483A5 JP2001348483A5 (https=) 2007-06-28
JP4646357B2 true JP4646357B2 (ja) 2011-03-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000171477A Expired - Fee Related JP4646357B2 (ja) 2000-06-08 2000-06-08 熱伝導性シリコーンゴム組成物

Country Status (4)

Country Link
US (1) US20020010245A1 (https=)
EP (1) EP1162239A3 (https=)
JP (1) JP4646357B2 (https=)
KR (1) KR20010111026A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12037460B2 (en) 2019-03-29 2024-07-16 Dow Toray Co., Ltd. Multi-component type thermally conductive silicone-gel composition, thermally conductive material and heat-emission structure

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JP4588285B2 (ja) * 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP3807995B2 (ja) 2002-03-05 2006-08-09 ポリマテック株式会社 熱伝導性シート
JP3904469B2 (ja) * 2002-04-23 2007-04-11 信越化学工業株式会社 流動性を有する硬化性オルガノポリシロキサン組成物
JP2005042096A (ja) * 2003-07-04 2005-02-17 Fuji Polymer Industries Co Ltd 熱伝導性組成物及びこれを用いたパテ状放熱シートと放熱構造体
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JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5154010B2 (ja) * 2005-10-27 2013-02-27 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性シリコーンゴム組成物
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TWI419931B (zh) * 2006-06-16 2013-12-21 信越化學工業股份有限公司 導熱聚矽氧潤滑脂組成物
JP4514058B2 (ja) * 2006-08-30 2010-07-28 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
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US7462294B2 (en) * 2007-04-25 2008-12-09 International Business Machines Corporation Enhanced thermal conducting formulations
JP2009203373A (ja) * 2008-02-28 2009-09-10 Momentive Performance Materials Inc 熱伝導性シリコーン組成物
JP4656340B2 (ja) * 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP6014299B2 (ja) * 2008-09-01 2016-10-25 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び半導体装置
JP5103364B2 (ja) * 2008-11-17 2012-12-19 日東電工株式会社 熱伝導性シートの製造方法
JP5606104B2 (ja) * 2009-03-23 2014-10-15 株式会社アドマテックス 紫外線反射組成物及び紫外線反射成形品
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US8431220B2 (en) 2009-06-05 2013-04-30 Xerox Corporation Hydrophobic coatings and their processes
US8329301B2 (en) 2009-07-29 2012-12-11 Xerox Corporation Fluoroelastomer containing intermediate transfer members
EP2752101A1 (en) * 2011-08-29 2014-07-09 Koninklijke Philips N.V. A flexible lighting assembly, a luminaire, and a method of manufacturing a flexible layer
JP6038175B2 (ja) 2012-01-03 2016-12-07 フィリップス ライティング ホールディング ビー ヴィ 照明アセンブリ、光源、及び照明器具
EP2882821B1 (en) 2012-07-30 2020-06-03 Dow Silicones Corporation Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition
JP6569036B2 (ja) * 2013-10-17 2019-09-04 ダウ・東レ株式会社 硬化性シリコーン組成物および光半導体装置
KR101868327B1 (ko) * 2013-10-17 2018-07-23 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물 및 광 반도체 장치
JP6314797B2 (ja) * 2013-11-15 2018-04-25 信越化学工業株式会社 熱伝導性複合シート
KR102470706B1 (ko) * 2014-12-19 2022-11-28 다우 실리콘즈 코포레이션 축합 가교결합 입자의 제조 방법
WO2017012714A1 (en) * 2015-07-20 2017-01-26 Momentive Performance Materials Gmbh Asymmetrically substituted polyorganosiloxane derivatives
TWI738743B (zh) * 2016-03-23 2021-09-11 美商道康寧公司 金屬-聚有機矽氧烷
KR20190020776A (ko) * 2016-06-24 2019-03-04 다우 코닝 도레이 캄파니 리미티드 화장료용 분체의 처리제, 화장료용 분체 및 이를 배합한 화장료
KR102334773B1 (ko) * 2016-07-22 2021-12-03 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 열전도성 폴리오가노실록산 조성물
WO2018043270A1 (ja) 2016-09-01 2018-03-08 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物
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Cited By (1)

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Publication number Priority date Publication date Assignee Title
US12037460B2 (en) 2019-03-29 2024-07-16 Dow Toray Co., Ltd. Multi-component type thermally conductive silicone-gel composition, thermally conductive material and heat-emission structure

Also Published As

Publication number Publication date
US20020010245A1 (en) 2002-01-24
KR20010111026A (ko) 2001-12-15
EP1162239A3 (en) 2002-03-27
JP2001348483A (ja) 2001-12-18
EP1162239A2 (en) 2001-12-12

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