KR102350158B1 - 동은 합금을 이용한 도전성 부재, 접촉핀 및 장치 - Google Patents

동은 합금을 이용한 도전성 부재, 접촉핀 및 장치 Download PDF

Info

Publication number
KR102350158B1
KR102350158B1 KR1020207000426A KR20207000426A KR102350158B1 KR 102350158 B1 KR102350158 B1 KR 102350158B1 KR 1020207000426 A KR1020207000426 A KR 1020207000426A KR 20207000426 A KR20207000426 A KR 20207000426A KR 102350158 B1 KR102350158 B1 KR 102350158B1
Authority
KR
South Korea
Prior art keywords
copper
contact pin
silver
silver alloy
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020207000426A
Other languages
English (en)
Korean (ko)
Other versions
KR20200018576A (ko
Inventor
츠토무 사토
요시카즈 사카이
아키히로 기쿠치
Original Assignee
유나이티드 프리시젼 테크놀로지스 컴퍼니 리미티드
코쿠리츠켄큐카이하츠호징 붓시쯔 자이료 켄큐키코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 유나이티드 프리시젼 테크놀로지스 컴퍼니 리미티드, 코쿠리츠켄큐카이하츠호징 붓시쯔 자이료 켄큐키코 filed Critical 유나이티드 프리시젼 테크놀로지스 컴퍼니 리미티드
Publication of KR20200018576A publication Critical patent/KR20200018576A/ko
Application granted granted Critical
Publication of KR102350158B1 publication Critical patent/KR102350158B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B1/00Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/16Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling wire rods, bars, merchant bars, rounds wire or material of like small cross-section
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/02Making non-ferrous alloys by melting
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • C23F1/18Acidic compositions for etching copper or alloys thereof
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16FSPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F1/00Springs
    • F16F1/02Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
    • F16F1/021Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant characterised by their composition, e.g. comprising materials providing for particular spring properties
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06722Spring-loaded
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755Material aspects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005Copper or its alloys
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Connecting Device With Holders (AREA)
  • Contacts (AREA)
KR1020207000426A 2017-07-10 2018-07-09 동은 합금을 이용한 도전성 부재, 접촉핀 및 장치 Expired - Fee Related KR102350158B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-135081 2017-07-10
JP2017135081 2017-07-10
PCT/JP2018/025884 WO2019013163A1 (ja) 2017-07-10 2018-07-09 銅銀合金を用いた導電性部材、コンタクトピン及び装置

Publications (2)

Publication Number Publication Date
KR20200018576A KR20200018576A (ko) 2020-02-19
KR102350158B1 true KR102350158B1 (ko) 2022-01-12

Family

ID=65001938

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207000426A Expired - Fee Related KR102350158B1 (ko) 2017-07-10 2018-07-09 동은 합금을 이용한 도전성 부재, 접촉핀 및 장치

Country Status (6)

Country Link
US (1) US20210088552A1 (enExample)
JP (3) JPWO2019013163A1 (enExample)
KR (1) KR102350158B1 (enExample)
CN (2) CN113690656A (enExample)
TW (1) TWI787302B (enExample)
WO (1) WO2019013163A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019013163A1 (ja) * 2017-07-10 2020-02-06 株式会社協成 銅銀合金を用いた導電性部材、コンタクトピン及び装置
JP7350307B2 (ja) * 2019-10-30 2023-09-26 国立大学法人 名古屋工業大学 Ag-グラフェン複合めっき膜金属製端子とその製造方法
CN113555750A (zh) * 2021-01-18 2021-10-26 陈彦 一种采用铜银合金制作0.782pin耳机插针的方法
JP7322247B1 (ja) * 2022-06-07 2023-08-07 Swcc株式会社 Cu-Ag合金線およびその製造方法
WO2025094259A1 (ja) * 2023-10-31 2025-05-08 Swcc株式会社 Cu-Ag合金線の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326046A (ja) * 2000-05-17 2001-11-22 Enplas Corp コンタクトピン集合体、コンタクトピン組立体及び電気部品用ソケット
JP2006283146A (ja) * 2005-04-01 2006-10-19 Nikko Kinzoku Kk 圧延銅箔及びその製造方法
JP2016142644A (ja) * 2015-02-03 2016-08-08 株式会社日本マイクロニクス 電気的接続装置およびポゴピン
WO2016159316A1 (ja) * 2015-03-31 2016-10-06 日本発條株式会社 合金材料、コンタクトプローブおよび接続端子

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04173987A (ja) * 1990-11-02 1992-06-22 Kawasaki Steel Corp 銅接合体用エッチング液
JP3458036B2 (ja) * 1996-03-05 2003-10-20 メック株式会社 銅および銅合金のマイクロエッチング剤
JP2000199042A (ja) * 1998-11-04 2000-07-18 Showa Electric Wire & Cable Co Ltd Cu―Ag合金線材の製造方法およびCu―Ag合金線材
JP2002071714A (ja) * 2000-08-31 2002-03-12 Kanai Hiroaki プローブカード用プローブピン
JP3604087B2 (ja) * 2001-11-30 2004-12-22 昭和電線電纜株式会社 光ピックアップ装置のサスペンションワイヤ用線材及び光ピックアップ装置。
JP2004061265A (ja) * 2002-07-29 2004-02-26 Sumitomo Electric Ind Ltd 電気接点用微細部品およびその製造方法
CN1276984C (zh) * 2003-12-09 2006-09-27 中国科学院金属研究所 一种氧化铝弥散强化铜引线框架材料的制备方法
JP4020881B2 (ja) * 2004-04-13 2007-12-12 日鉱金属株式会社 Cu−Ni−Si−Mg系銅合金条
KR100584225B1 (ko) 2004-10-06 2006-05-29 황동원 전자장치용 콘택트
JP2007113093A (ja) * 2005-10-24 2007-05-10 Nikko Kinzoku Kk 高強度高導電性耐熱銅合金及びその製造方法
JP2007212139A (ja) * 2005-10-31 2007-08-23 Tokusen Kogyo Co Ltd プロ−ブカ−ド用プロ−ブピン
JP4176133B1 (ja) * 2007-06-06 2008-11-05 田中貴金属工業株式会社 プローブピン
JP2009014480A (ja) * 2007-07-04 2009-01-22 Koyo Technos:Kk 検査冶具
CN100557063C (zh) * 2008-04-18 2009-11-04 浙江大学 配合Cu-Ag合金冷拉拔加工的固溶及时效处理方法
JP2010242124A (ja) * 2009-04-01 2010-10-28 Tosoh Corp エッチング用組成物及びエッチング方法
JP4801757B2 (ja) * 2009-05-29 2011-10-26 田中貴金属工業株式会社 接触抵抗、防汚特性に優れるプローブピン
CN101643866A (zh) * 2009-08-21 2010-02-10 昆明贵金属研究所 高强高导CuAg合金材料及其制备方法
JP4572303B1 (ja) * 2010-02-12 2010-11-04 株式会社ルス・コム 通電検査治具用接触子の製造方法及び、これにより製造した通電検査治具用接触子、並びにこれを備えている通電検査治具
CN102031467B (zh) * 2010-11-29 2012-11-14 东北大学 一种利用磁场制备原位形变Cu-Ag复合材料的方法
JP5689013B2 (ja) * 2011-04-05 2015-03-25 日本電産サンキョーシーエムアイ株式会社 複合接点
CN102279666A (zh) * 2011-08-12 2011-12-14 牧东光电(苏州)有限公司 金属感应布线的触控面板及其制造方法
CN102925858B (zh) * 2011-10-23 2014-11-19 碳元科技股份有限公司 具有保护层结构的碳层材料
JP2014025737A (ja) * 2012-07-25 2014-02-06 Nidec-Read Corp 検査用治具及び接触子
US9804198B2 (en) * 2012-08-03 2017-10-31 Yamamoto Precious Metal Co., Ltd. Alloy material, contact probe, and connection terminal
JP6107234B2 (ja) * 2013-03-01 2017-04-05 山一電機株式会社 検査用プローブ、および、それを備えるicソケット
JP6491409B2 (ja) * 2013-12-27 2019-03-27 富士電機株式会社 接触子及び半導体試験装置
JP2018508753A (ja) * 2014-12-30 2018-03-29 テクノプローベ エス.ピー.エー. テストヘッド用の複数のコンタクトプローブを含む半製品および関連する製造方法
JP6556612B2 (ja) * 2015-12-04 2019-08-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN206179877U (zh) * 2016-11-04 2017-05-17 上海纳晶科技有限公司 一种微细金属线太阳能电池栅极
JP6915797B2 (ja) * 2017-01-26 2021-08-04 株式会社笠作エレクトロニクス プローブピン
JPWO2019013163A1 (ja) * 2017-07-10 2020-02-06 株式会社協成 銅銀合金を用いた導電性部材、コンタクトピン及び装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326046A (ja) * 2000-05-17 2001-11-22 Enplas Corp コンタクトピン集合体、コンタクトピン組立体及び電気部品用ソケット
JP2006283146A (ja) * 2005-04-01 2006-10-19 Nikko Kinzoku Kk 圧延銅箔及びその製造方法
JP2016142644A (ja) * 2015-02-03 2016-08-08 株式会社日本マイクロニクス 電気的接続装置およびポゴピン
WO2016159316A1 (ja) * 2015-03-31 2016-10-06 日本発條株式会社 合金材料、コンタクトプローブおよび接続端子

Also Published As

Publication number Publication date
CN110809805A (zh) 2020-02-18
KR20200018576A (ko) 2020-02-19
CN113690656A (zh) 2021-11-23
JPWO2019013163A1 (ja) 2020-02-06
US20210088552A1 (en) 2021-03-25
JP2022050442A (ja) 2022-03-30
TWI787302B (zh) 2022-12-21
WO2019013163A1 (ja) 2019-01-17
CN110809805B (zh) 2021-10-26
TW201909196A (zh) 2019-03-01
JP2021099346A (ja) 2021-07-01

Similar Documents

Publication Publication Date Title
KR102350158B1 (ko) 동은 합금을 이용한 도전성 부재, 접촉핀 및 장치
JP5043617B2 (ja) 異方導電性部材およびその製造方法
Lee et al. 2D single‐crystalline copper nanoplates as a conductive filler for electronic ink applications
JP4572303B1 (ja) 通電検査治具用接触子の製造方法及び、これにより製造した通電検査治具用接触子、並びにこれを備えている通電検査治具
KR20100093066A (ko) 미세 구조체
JP2008039502A (ja) 接触子およびその製造方法
JP2020169945A (ja) 高速通信半導体用コンタクト及び半導体検査システム
JP5804726B2 (ja) 微細構造体の製造方法
JP2002294483A5 (enExample)
JP5693637B2 (ja) 微細構造体の製造方法
CN110534400B (zh) 准分子灯
JP2011150837A (ja) 回路接続部材、導電性粒子および導電性粒子の製造方法
JP4592738B2 (ja) 回路基板の製造方法および回路基板の検査方法
US9797046B2 (en) Method for etching metal or metal oxide by ozone water, method for smoothing surface of metal or metal oxide by ozone water, and patterning method using ozone water
US20230093356A1 (en) Electronic device inspection socket, and device and method for manufacturing same
JP2011150836A (ja) 回路接続部材、導電性粒子および導電性粒子の製造方法
KR20220024107A (ko) 금속 제품의 미세 가공 장치 및 금속 제품의 미세 가공 방법
KR101599422B1 (ko) 강화유리에 금속 패턴을 형성하는 방법
JP2009128269A (ja) 加速度センサの製造方法および加速度センサ
JP2009277461A (ja) 導電性部材パターンの製造方法
JP2006342402A (ja) 構造体の製造方法
CN111893527A (zh) 纳米电极对及其制备方法
JP2007056346A (ja) 無電解ニッケルめっき浴およびそれを用いた無電解めっき方法
KR20100126030A (ko) 솔더 범프 형성용 템플릿의 제조방법

Legal Events

Date Code Title Description
A201 Request for examination
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

X701 Decision to grant (after re-examination)
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20250108

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20250108