JP4176133B1 - プローブピン - Google Patents
プローブピン Download PDFInfo
- Publication number
- JP4176133B1 JP4176133B1 JP2007150737A JP2007150737A JP4176133B1 JP 4176133 B1 JP4176133 B1 JP 4176133B1 JP 2007150737 A JP2007150737 A JP 2007150737A JP 2007150737 A JP2007150737 A JP 2007150737A JP 4176133 B1 JP4176133 B1 JP 4176133B1
- Authority
- JP
- Japan
- Prior art keywords
- hardness
- probe pin
- weight
- concentration
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000000956 alloy Substances 0.000 claims abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 11
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 229910052737 gold Inorganic materials 0.000 claims abstract description 6
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 claims description 6
- 238000001556 precipitation Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 25
- 230000003647 oxidation Effects 0.000 abstract description 8
- 238000007254 oxidation reaction Methods 0.000 abstract description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 11
- 239000010931 gold Substances 0.000 description 10
- 239000010949 copper Substances 0.000 description 9
- 238000007689 inspection Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007542 hardness measurement Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000004881 precipitation hardening Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910009038 Sn—P Inorganic materials 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
【解決手段】本発明は、Au、Ag、Pd、Cuからなり、Au濃度:40〜55重量%、Ag濃度:15〜30重量%、及び、PdとCuとの合計濃度:15〜40重量%であるプローブピン用の材料である。この材料は、更に、Ni、Zn、Coの少なくともいずれか1つの元素を0.6〜5重量%含むことができる。また、これらの合金は、300〜500℃で加熱することにより析出硬化させることができ、より硬度の高い材料とすることができる。
【選択図】 図1
Description
Claims (2)
- 半導体集積回路素子、液晶表示装置の複数の電極パッドに繰り返し接触し、半導体集積回路素子、液晶表示装置の電気的特性を検査するためのプローブピンにおいて、
Au、Ag、Pd、Cuからなり、Au濃度:40〜55重量%、Ag濃度:15〜30重量%、及び、PdとCuとの合計濃度:15〜40重量%である合金を、300〜500℃で加熱して析出硬化させ、硬度300〜450Hvとした材料からなるプローブピン。 - 析出硬化される合金は、更に、Ni、Zn、Coの少なくともいずれか1つの元素を0.6〜5重量%含む請求項1記載のプローブピン。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007150737A JP4176133B1 (ja) | 2007-06-06 | 2007-06-06 | プローブピン |
CN2008800191603A CN101715559B (zh) | 2007-06-06 | 2008-06-04 | 探针 |
EP08765081A EP2159581B1 (en) | 2007-06-06 | 2008-06-04 | Method of manufacturing probe pins |
KR1020097025628A KR101323027B1 (ko) | 2007-06-06 | 2008-06-04 | 프루브 핀 |
PCT/JP2008/060268 WO2008149886A1 (ja) | 2007-06-06 | 2008-06-04 | プローブピン用材料 |
US12/602,899 US8310254B2 (en) | 2007-06-06 | 2008-06-04 | Probe pin |
TW097120907A TWI375801B (en) | 2007-06-06 | 2008-06-05 | Probe pin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007150737A JP4176133B1 (ja) | 2007-06-06 | 2007-06-06 | プローブピン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4176133B1 true JP4176133B1 (ja) | 2008-11-05 |
JP2008304266A JP2008304266A (ja) | 2008-12-18 |
Family
ID=40056068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007150737A Expired - Fee Related JP4176133B1 (ja) | 2007-06-06 | 2007-06-06 | プローブピン |
Country Status (7)
Country | Link |
---|---|
US (1) | US8310254B2 (ja) |
EP (1) | EP2159581B1 (ja) |
JP (1) | JP4176133B1 (ja) |
KR (1) | KR101323027B1 (ja) |
CN (1) | CN101715559B (ja) |
TW (1) | TWI375801B (ja) |
WO (1) | WO2008149886A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014021465A1 (ja) | 2012-08-03 | 2014-02-06 | 山本貴金属地金株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
JP2015083955A (ja) * | 2013-10-25 | 2015-04-30 | 石福金属興業株式会社 | Pt基合金からなるプローブピン |
KR102536235B1 (ko) | 2022-02-10 | 2023-05-26 | 다나카 기킨조쿠 고교 가부시키가이샤 | Ag-Pd-Cu계 합금으로 이루어지는 프로브 핀용 재료 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4801757B2 (ja) * | 2009-05-29 | 2011-10-26 | 田中貴金属工業株式会社 | 接触抵抗、防汚特性に優れるプローブピン |
JP2011158329A (ja) * | 2010-01-29 | 2011-08-18 | Citizen Tohoku Kk | コンタクトプローブ及びこれを用いた電子回路試験装置 |
US20130292008A1 (en) * | 2010-12-09 | 2013-11-07 | Tokuriki Honten Co., Ltd. | Material for Electrical/Electronic Use |
JP4878401B1 (ja) * | 2011-05-17 | 2012-02-15 | 石福金属興業株式会社 | プローブピン用材料、プローブピン及びその製造方法 |
JP2013101043A (ja) * | 2011-11-08 | 2013-05-23 | Renesas Electronics Corp | 半導体装置の製造方法 |
WO2014049874A1 (ja) * | 2012-09-28 | 2014-04-03 | 株式会社徳力本店 | 電気・電子機器用途のAg‐Pd‐Cu‐Co合金 |
JP6039101B2 (ja) | 2012-11-30 | 2016-12-07 | 本田技研工業株式会社 | 自動二輪車用プロジェクターライトアセンブリの追加ライト構造 |
CN110809805B (zh) * | 2017-07-10 | 2021-10-26 | 株式会社协成 | 使用铜银合金的导电性部件、触头引脚以及装置 |
WO2019130511A1 (ja) * | 2017-12-27 | 2019-07-04 | 株式会社徳力本店 | 析出硬化型Ag-Pd-Cu-In-B系合金 |
EP4325227A1 (de) * | 2022-08-16 | 2024-02-21 | Heraeus Precious Metals GmbH & Co. KG | Bandförmiger verbundwerkstoff für prüfnadeln |
CN117310234B (zh) * | 2023-11-30 | 2024-03-01 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试用钯合金探针套筒及其制造方法 |
Family Cites Families (14)
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US3767391A (en) | 1969-05-19 | 1973-10-23 | Pennwalt Corp | Tarnish resistant alloy |
SE368050B (ja) | 1972-08-25 | 1974-06-17 | Electrolux Ab | |
US5378971A (en) * | 1990-11-30 | 1995-01-03 | Tokyo Electron Limited | Probe and a method of manufacturing the same |
JPH05154719A (ja) * | 1991-11-29 | 1993-06-22 | Tanaka Kikinzoku Kogyo Kk | プローブピンの製造装置 |
JP3090389B2 (ja) * | 1993-11-24 | 2000-09-18 | 田中貴金属工業株式会社 | マルチワイヤープローブの製造方法 |
JPH1038922A (ja) | 1996-07-26 | 1998-02-13 | Iwaki Electron Corp Ltd | プローブピン装置 |
US5919320A (en) * | 1997-11-17 | 1999-07-06 | Leach & Garner Company | Nickel-free white gold alloy with reversible hardness characteristics |
CN1073637C (zh) * | 1998-03-04 | 2001-10-24 | 贵研铂业股份有限公司 | 电接触材料金基合金 |
JP3990539B2 (ja) * | 1999-02-22 | 2007-10-17 | 新日本製鐵株式会社 | メッキ密着性およびプレス成形性に優れた高強度溶融亜鉛メッキ鋼板および高強度合金化溶融亜鉛メッキ鋼板およびその製造方法 |
AU2001264297A1 (en) * | 2000-06-16 | 2001-12-24 | Nhk Spring Co. Ltd. | Microcontactor probe and electric probe unit |
WO2003031668A1 (fr) * | 2001-10-09 | 2003-04-17 | Kabushiki Kaisha Toshiba | Fil de tungstene, element de chauffage de cathode et filament pour lampe anti-vibrations |
JP2004093355A (ja) | 2002-08-30 | 2004-03-25 | Toshiba Corp | Pd合金系プローブピンおよびそれを用いたプローブピン装置 |
JP2004179327A (ja) * | 2002-11-26 | 2004-06-24 | Sharp Corp | 半導体用合金材料、該合金材料を用いた半導体チップ及びその製造方法 |
US7135078B1 (en) * | 2005-12-05 | 2006-11-14 | Leach & Garner Company | Nickel-free white gold alloy compositions with reversible hardness characteristics |
-
2007
- 2007-06-06 JP JP2007150737A patent/JP4176133B1/ja not_active Expired - Fee Related
-
2008
- 2008-06-04 CN CN2008800191603A patent/CN101715559B/zh not_active Expired - Fee Related
- 2008-06-04 WO PCT/JP2008/060268 patent/WO2008149886A1/ja active Application Filing
- 2008-06-04 EP EP08765081A patent/EP2159581B1/en not_active Not-in-force
- 2008-06-04 US US12/602,899 patent/US8310254B2/en active Active
- 2008-06-04 KR KR1020097025628A patent/KR101323027B1/ko active IP Right Grant
- 2008-06-05 TW TW097120907A patent/TWI375801B/zh active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014021465A1 (ja) | 2012-08-03 | 2014-02-06 | 山本貴金属地金株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
US9804198B2 (en) | 2012-08-03 | 2017-10-31 | Yamamoto Precious Metal Co., Ltd. | Alloy material, contact probe, and connection terminal |
JP2015083955A (ja) * | 2013-10-25 | 2015-04-30 | 石福金属興業株式会社 | Pt基合金からなるプローブピン |
KR102536235B1 (ko) | 2022-02-10 | 2023-05-26 | 다나카 기킨조쿠 고교 가부시키가이샤 | Ag-Pd-Cu계 합금으로 이루어지는 프로브 핀용 재료 |
EP4227426A1 (en) | 2022-02-10 | 2023-08-16 | Tanaka Kikinzoku Kogyo K.K. | Probe pin material including ag-pd-cu-based alloy |
US11807925B2 (en) | 2022-02-10 | 2023-11-07 | Tanaka Kikinzoku Kogyo K.K. | Probe pin material including Ag—Pd—Cu-based alloy |
Also Published As
Publication number | Publication date |
---|---|
CN101715559B (zh) | 2012-09-26 |
TW200916788A (en) | 2009-04-16 |
EP2159581A1 (en) | 2010-03-03 |
US8310254B2 (en) | 2012-11-13 |
EP2159581B1 (en) | 2012-10-31 |
JP2008304266A (ja) | 2008-12-18 |
WO2008149886A1 (ja) | 2008-12-11 |
KR101323027B1 (ko) | 2013-10-29 |
KR20100010506A (ko) | 2010-02-01 |
TWI375801B (en) | 2012-11-01 |
CN101715559A (zh) | 2010-05-26 |
EP2159581A4 (en) | 2011-06-29 |
US20100176833A1 (en) | 2010-07-15 |
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