JP4216823B2 - プローブピン及び該ブロ−ブビンを備えたブロ−ブカ−ド - Google Patents
プローブピン及び該ブロ−ブビンを備えたブロ−ブカ−ド Download PDFInfo
- Publication number
- JP4216823B2 JP4216823B2 JP2005059926A JP2005059926A JP4216823B2 JP 4216823 B2 JP4216823 B2 JP 4216823B2 JP 2005059926 A JP2005059926 A JP 2005059926A JP 2005059926 A JP2005059926 A JP 2005059926A JP 4216823 B2 JP4216823 B2 JP 4216823B2
- Authority
- JP
- Japan
- Prior art keywords
- probe pin
- examples
- hardness
- wire
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
Claims (2)
- 重量パーセントでニッケル10〜30%と残部白金との合金からなるプローブピン。
- 請求項1記載のプローブピンを備えたプローブカード。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005059926A JP4216823B2 (ja) | 2005-03-04 | 2005-03-04 | プローブピン及び該ブロ−ブビンを備えたブロ−ブカ−ド |
TW094131996A TWI276807B (en) | 2005-03-04 | 2005-09-16 | Probe pins |
US11/237,544 US8183877B2 (en) | 2005-03-04 | 2005-09-28 | Material for probe pins |
KR1020050093254A KR100718577B1 (ko) | 2005-03-04 | 2005-10-05 | 프로브 핀용 재료 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005059926A JP4216823B2 (ja) | 2005-03-04 | 2005-03-04 | プローブピン及び該ブロ−ブビンを備えたブロ−ブカ−ド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005233967A JP2005233967A (ja) | 2005-09-02 |
JP4216823B2 true JP4216823B2 (ja) | 2009-01-28 |
Family
ID=35017027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005059926A Active JP4216823B2 (ja) | 2005-03-04 | 2005-03-04 | プローブピン及び該ブロ−ブビンを備えたブロ−ブカ−ド |
Country Status (4)
Country | Link |
---|---|
US (1) | US8183877B2 (ja) |
JP (1) | JP4216823B2 (ja) |
KR (1) | KR100718577B1 (ja) |
TW (1) | TWI276807B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014021465A1 (ja) | 2012-08-03 | 2014-02-06 | 山本貴金属地金株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
KR102536235B1 (ko) | 2022-02-10 | 2023-05-26 | 다나카 기킨조쿠 고교 가부시키가이샤 | Ag-Pd-Cu계 합금으로 이루어지는 프로브 핀용 재료 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8896075B2 (en) * | 2008-01-23 | 2014-11-25 | Ev Products, Inc. | Semiconductor radiation detector with thin film platinum alloyed electrode |
JP4213761B1 (ja) * | 2008-02-27 | 2009-01-21 | 田中貴金属工業株式会社 | 硬度、加工性、並びに、防汚特性に優れたイリジウム合金 |
US8269131B2 (en) * | 2008-02-28 | 2012-09-18 | Corning Incorporated | Nickel-containing flanges for use in direct resistance heating of platinum-containing vessels |
JP4808794B2 (ja) * | 2008-03-28 | 2011-11-02 | パナソニック株式会社 | 半導体検査装置 |
JP5074608B2 (ja) * | 2011-02-08 | 2012-11-14 | 田中貴金属工業株式会社 | プローブピン |
DE102012008907A1 (de) | 2012-05-08 | 2013-11-14 | Heraeus Materials Technology Gmbh & Co. Kg | Rhodiumlegierung zur Herstellung eines Drahts für Prüfnadeln |
JP6372952B2 (ja) * | 2013-10-25 | 2018-08-15 | 石福金属興業株式会社 | Pt基合金で構成されるプローブピン用材料、プローブピンの製造方法 |
CN105723225B (zh) | 2013-11-07 | 2019-01-11 | 贺利氏德国有限两合公司 | 测试针和制造测试针的方法 |
JP6243275B2 (ja) * | 2014-03-28 | 2017-12-06 | 田中貴金属工業株式会社 | イリジウム又はイリジウム合金からなる金属線材 |
JP2018175127A (ja) * | 2017-04-07 | 2018-11-15 | 東海電気株式会社 | 体内管導入物用マーカー及び体内管導入物,並びにそれらの製造方法 |
US10858722B2 (en) * | 2018-09-21 | 2020-12-08 | Deringer-Ney, Inc. | Platinum-nickel-based alloys, products, and methods of making and using same |
JP7300677B2 (ja) * | 2019-12-11 | 2023-06-30 | 石福金属興業株式会社 | Rh基合金からなるプローブピン用材料およびプローブピン |
EP3862759B1 (de) | 2020-02-04 | 2022-05-11 | Heraeus Deutschland GmbH & Co. KG | Manteldraht und verfahren zur herstellung von manteldrähten |
EP3878986A1 (de) | 2020-03-12 | 2021-09-15 | Heraeus Deutschland GmbH & Co KG | Draht und band mit bornitrid-nanoröhren für elektrische kontaktierungen |
US11990252B2 (en) * | 2020-04-17 | 2024-05-21 | National Technology & Engineering Solutions Of Sandia, Llc | Hermetic electrical feedthrough comprising a Pt—Ni-based pin alloy |
JP6997354B1 (ja) * | 2021-09-13 | 2022-02-04 | 田中貴金属工業株式会社 | 医療用Pt合金線材及び医療用Pt合金コイル |
JP7008861B1 (ja) | 2021-09-13 | 2022-02-10 | 田中貴金属工業株式会社 | 医療用Pt-W合金 |
CN118019867A (zh) | 2021-10-15 | 2024-05-10 | 田中贵金属工业株式会社 | 高硬度贵金属合金及其制造方法 |
EP4325227A1 (de) | 2022-08-16 | 2024-02-21 | Heraeus Precious Metals GmbH & Co. KG | Bandförmiger verbundwerkstoff für prüfnadeln |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4846941A (en) * | 1986-07-01 | 1989-07-11 | E. I. Du Pont De Nemours And Company | Electroplating bath and process for maintaining plated alloy composition stable |
US4910091A (en) * | 1987-09-03 | 1990-03-20 | Air Products And Chemicals, Inc. | High hardness fine grained tungsten-carbon alloys |
JPH04337473A (ja) * | 1991-05-14 | 1992-11-25 | Tanaka Kikinzoku Kogyo Kk | 接触抵抗測定用プローブとその使用方法 |
US5139891A (en) * | 1991-07-01 | 1992-08-18 | Olin Corporation | Palladium alloys having utility in electrical applications |
JPH0511062U (ja) * | 1991-07-23 | 1993-02-12 | セイコー電子部品株式会社 | プローブ針 |
JPH06275365A (ja) * | 1993-03-18 | 1994-09-30 | Nippondenso Co Ltd | 金属チップの製造方法,製造装置,金属チップ及びスパークプラグ |
JP3417721B2 (ja) * | 1995-04-04 | 2003-06-16 | 三菱電機株式会社 | 走査プローブ顕微鏡の使用方法 |
AU6635296A (en) * | 1995-05-26 | 1996-12-18 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates wi th spring contacts |
JPH1038922A (ja) | 1996-07-26 | 1998-02-13 | Iwaki Electron Corp Ltd | プローブピン装置 |
US6683783B1 (en) * | 1997-03-07 | 2004-01-27 | William Marsh Rice University | Carbon fibers formed from single-wall carbon nanotubes |
JPH10332740A (ja) * | 1997-06-04 | 1998-12-18 | Toshiba Corp | プローブ針、プローブカードおよびプローブ針の製造方法 |
JP3164542B2 (ja) * | 1997-09-16 | 2001-05-08 | 日本電子材料株式会社 | プローブ及びそれを用いたプローブカード |
US6504223B1 (en) * | 1998-11-30 | 2003-01-07 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
TW508440B (en) * | 1999-12-27 | 2002-11-01 | Hoya Co Ltd | Probe structure and manufacturing method thereof |
US6415182B1 (en) * | 2000-01-31 | 2002-07-02 | Cts Corporation | Hermetic ground pin assembly and method of making |
JP3650722B2 (ja) * | 2000-05-18 | 2005-05-25 | 株式会社アドバンテスト | プローブカードおよびその製造方法 |
JP2002131334A (ja) * | 2000-10-24 | 2002-05-09 | Nec Yamaguchi Ltd | プローブ針、プローブカード、及びプローブカードの作製方法 |
US7244367B2 (en) * | 2001-12-11 | 2007-07-17 | Jds Uniphase Corporation | Metal alloy elements in micromachined devices |
JP4219642B2 (ja) * | 2002-08-30 | 2009-02-04 | 株式会社フルヤ金属 | 白金又は白金基合金の摩擦攪拌接合法及びその接合構造 |
JP4065787B2 (ja) * | 2002-08-30 | 2008-03-26 | 株式会社日立グローバルストレージテクノロジーズ | 磁気ヘッドおよび磁気記録再生装置 |
US7084650B2 (en) * | 2002-12-16 | 2006-08-01 | Formfactor, Inc. | Apparatus and method for limiting over travel in a probe card assembly |
US6852925B2 (en) * | 2003-05-23 | 2005-02-08 | Medtronic, Inc. | Feed-through assemblies having terminal pins comprising platinum and methods for fabricating same |
US7804232B2 (en) * | 2004-01-27 | 2010-09-28 | Ngk Spark Plug Co., Ltd. | Spark plug with high durability |
-
2005
- 2005-03-04 JP JP2005059926A patent/JP4216823B2/ja active Active
- 2005-09-16 TW TW094131996A patent/TWI276807B/zh active
- 2005-09-28 US US11/237,544 patent/US8183877B2/en active Active
- 2005-10-05 KR KR1020050093254A patent/KR100718577B1/ko active IP Right Grant
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014021465A1 (ja) | 2012-08-03 | 2014-02-06 | 山本貴金属地金株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
US9804198B2 (en) | 2012-08-03 | 2017-10-31 | Yamamoto Precious Metal Co., Ltd. | Alloy material, contact probe, and connection terminal |
KR102536235B1 (ko) | 2022-02-10 | 2023-05-26 | 다나카 기킨조쿠 고교 가부시키가이샤 | Ag-Pd-Cu계 합금으로 이루어지는 프로브 핀용 재료 |
EP4227426A1 (en) | 2022-02-10 | 2023-08-16 | Tanaka Kikinzoku Kogyo K.K. | Probe pin material including ag-pd-cu-based alloy |
US11807925B2 (en) | 2022-02-10 | 2023-11-07 | Tanaka Kikinzoku Kogyo K.K. | Probe pin material including Ag—Pd—Cu-based alloy |
Also Published As
Publication number | Publication date |
---|---|
TW200632325A (en) | 2006-09-16 |
KR100718577B1 (ko) | 2007-05-15 |
US8183877B2 (en) | 2012-05-22 |
TWI276807B (en) | 2007-03-21 |
JP2005233967A (ja) | 2005-09-02 |
US20060197542A1 (en) | 2006-09-07 |
KR20060096250A (ko) | 2006-09-11 |
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