TWI787302B - 一種二元銅銀合金體的製造方法、觸頭引腳以及使用二元銅銀合金的裝置 - Google Patents
一種二元銅銀合金體的製造方法、觸頭引腳以及使用二元銅銀合金的裝置 Download PDFInfo
- Publication number
- TWI787302B TWI787302B TW107123664A TW107123664A TWI787302B TW I787302 B TWI787302 B TW I787302B TW 107123664 A TW107123664 A TW 107123664A TW 107123664 A TW107123664 A TW 107123664A TW I787302 B TWI787302 B TW I787302B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- silver alloy
- contact pin
- silver
- contact
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/16—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling wire rods, bars, merchant bars, rounds wire or material of like small cross-section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F1/00—Springs
- F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
- F16F1/021—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant characterised by their composition, e.g. comprising materials providing for particular spring properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Conductive Materials (AREA)
- Connecting Device With Holders (AREA)
- Contacts (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-135081 | 2017-07-10 | ||
| JP2017135081 | 2017-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201909196A TW201909196A (zh) | 2019-03-01 |
| TWI787302B true TWI787302B (zh) | 2022-12-21 |
Family
ID=65001938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107123664A TWI787302B (zh) | 2017-07-10 | 2018-07-09 | 一種二元銅銀合金體的製造方法、觸頭引腳以及使用二元銅銀合金的裝置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20210088552A1 (enExample) |
| JP (3) | JPWO2019013163A1 (enExample) |
| KR (1) | KR102350158B1 (enExample) |
| CN (2) | CN113690656A (enExample) |
| TW (1) | TWI787302B (enExample) |
| WO (1) | WO2019013163A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2019013163A1 (ja) * | 2017-07-10 | 2020-02-06 | 株式会社協成 | 銅銀合金を用いた導電性部材、コンタクトピン及び装置 |
| JP7350307B2 (ja) * | 2019-10-30 | 2023-09-26 | 国立大学法人 名古屋工業大学 | Ag-グラフェン複合めっき膜金属製端子とその製造方法 |
| CN113555750A (zh) * | 2021-01-18 | 2021-10-26 | 陈彦 | 一种采用铜银合金制作0.782pin耳机插针的方法 |
| JP7322247B1 (ja) * | 2022-06-07 | 2023-08-07 | Swcc株式会社 | Cu-Ag合金線およびその製造方法 |
| WO2025094259A1 (ja) * | 2023-10-31 | 2025-05-08 | Swcc株式会社 | Cu-Ag合金線の製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006283146A (ja) * | 2005-04-01 | 2006-10-19 | Nikko Kinzoku Kk | 圧延銅箔及びその製造方法 |
| US20110133767A1 (en) * | 2009-05-29 | 2011-06-09 | Naoki Morita | Silver alloy having excellent contact resistance and antifouling property and suitable for use in prove pin |
| TW201144816A (en) * | 2010-02-12 | 2011-12-16 | Luzcom Inc | Manufacturing method for contact for current inspection jig, contact for current inspection jig manufactured using said method, and current inspection jig provided with said contact |
| TW201411135A (zh) * | 2012-07-25 | 2014-03-16 | Nidec Read Corp | 檢查用治具及接觸子 |
| TW201428110A (zh) * | 2012-08-03 | 2014-07-16 | Yamamoto Precious Metal Co Ltd | 合金材料、接觸探針及連接端子 |
| JP2016142644A (ja) * | 2015-02-03 | 2016-08-08 | 株式会社日本マイクロニクス | 電気的接続装置およびポゴピン |
| TW201702392A (zh) * | 2015-03-31 | 2017-01-16 | 日本發條股份有限公司 | 合金材料、接觸探針及連接端子 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04173987A (ja) * | 1990-11-02 | 1992-06-22 | Kawasaki Steel Corp | 銅接合体用エッチング液 |
| JP3458036B2 (ja) * | 1996-03-05 | 2003-10-20 | メック株式会社 | 銅および銅合金のマイクロエッチング剤 |
| JP2000199042A (ja) * | 1998-11-04 | 2000-07-18 | Showa Electric Wire & Cable Co Ltd | Cu―Ag合金線材の製造方法およびCu―Ag合金線材 |
| JP2001326046A (ja) * | 2000-05-17 | 2001-11-22 | Enplas Corp | コンタクトピン集合体、コンタクトピン組立体及び電気部品用ソケット |
| JP2002071714A (ja) * | 2000-08-31 | 2002-03-12 | Kanai Hiroaki | プローブカード用プローブピン |
| JP3604087B2 (ja) * | 2001-11-30 | 2004-12-22 | 昭和電線電纜株式会社 | 光ピックアップ装置のサスペンションワイヤ用線材及び光ピックアップ装置。 |
| JP2004061265A (ja) * | 2002-07-29 | 2004-02-26 | Sumitomo Electric Ind Ltd | 電気接点用微細部品およびその製造方法 |
| CN1276984C (zh) * | 2003-12-09 | 2006-09-27 | 中国科学院金属研究所 | 一种氧化铝弥散强化铜引线框架材料的制备方法 |
| JP4020881B2 (ja) * | 2004-04-13 | 2007-12-12 | 日鉱金属株式会社 | Cu−Ni−Si−Mg系銅合金条 |
| KR100584225B1 (ko) | 2004-10-06 | 2006-05-29 | 황동원 | 전자장치용 콘택트 |
| JP2007113093A (ja) * | 2005-10-24 | 2007-05-10 | Nikko Kinzoku Kk | 高強度高導電性耐熱銅合金及びその製造方法 |
| JP2007212139A (ja) * | 2005-10-31 | 2007-08-23 | Tokusen Kogyo Co Ltd | プロ−ブカ−ド用プロ−ブピン |
| JP4176133B1 (ja) * | 2007-06-06 | 2008-11-05 | 田中貴金属工業株式会社 | プローブピン |
| JP2009014480A (ja) * | 2007-07-04 | 2009-01-22 | Koyo Technos:Kk | 検査冶具 |
| CN100557063C (zh) * | 2008-04-18 | 2009-11-04 | 浙江大学 | 配合Cu-Ag合金冷拉拔加工的固溶及时效处理方法 |
| JP2010242124A (ja) * | 2009-04-01 | 2010-10-28 | Tosoh Corp | エッチング用組成物及びエッチング方法 |
| CN101643866A (zh) * | 2009-08-21 | 2010-02-10 | 昆明贵金属研究所 | 高强高导CuAg合金材料及其制备方法 |
| CN102031467B (zh) * | 2010-11-29 | 2012-11-14 | 东北大学 | 一种利用磁场制备原位形变Cu-Ag复合材料的方法 |
| JP5689013B2 (ja) * | 2011-04-05 | 2015-03-25 | 日本電産サンキョーシーエムアイ株式会社 | 複合接点 |
| CN102279666A (zh) * | 2011-08-12 | 2011-12-14 | 牧东光电(苏州)有限公司 | 金属感应布线的触控面板及其制造方法 |
| CN102925858B (zh) * | 2011-10-23 | 2014-11-19 | 碳元科技股份有限公司 | 具有保护层结构的碳层材料 |
| JP6107234B2 (ja) * | 2013-03-01 | 2017-04-05 | 山一電機株式会社 | 検査用プローブ、および、それを備えるicソケット |
| JP6491409B2 (ja) * | 2013-12-27 | 2019-03-27 | 富士電機株式会社 | 接触子及び半導体試験装置 |
| JP2018508753A (ja) * | 2014-12-30 | 2018-03-29 | テクノプローベ エス.ピー.エー. | テストヘッド用の複数のコンタクトプローブを含む半製品および関連する製造方法 |
| JP6556612B2 (ja) * | 2015-12-04 | 2019-08-07 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| CN206179877U (zh) * | 2016-11-04 | 2017-05-17 | 上海纳晶科技有限公司 | 一种微细金属线太阳能电池栅极 |
| JP6915797B2 (ja) * | 2017-01-26 | 2021-08-04 | 株式会社笠作エレクトロニクス | プローブピン |
| JPWO2019013163A1 (ja) * | 2017-07-10 | 2020-02-06 | 株式会社協成 | 銅銀合金を用いた導電性部材、コンタクトピン及び装置 |
-
2018
- 2018-07-09 JP JP2018554604A patent/JPWO2019013163A1/ja active Pending
- 2018-07-09 KR KR1020207000426A patent/KR102350158B1/ko not_active Expired - Fee Related
- 2018-07-09 US US16/629,963 patent/US20210088552A1/en not_active Abandoned
- 2018-07-09 CN CN202110982794.6A patent/CN113690656A/zh active Pending
- 2018-07-09 TW TW107123664A patent/TWI787302B/zh not_active IP Right Cessation
- 2018-07-09 WO PCT/JP2018/025884 patent/WO2019013163A1/ja not_active Ceased
- 2018-07-09 CN CN201880044125.0A patent/CN110809805B/zh not_active Expired - Fee Related
-
2021
- 2021-02-03 JP JP2021015535A patent/JP2021099346A/ja active Pending
- 2021-12-20 JP JP2021206120A patent/JP2022050442A/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006283146A (ja) * | 2005-04-01 | 2006-10-19 | Nikko Kinzoku Kk | 圧延銅箔及びその製造方法 |
| US20110133767A1 (en) * | 2009-05-29 | 2011-06-09 | Naoki Morita | Silver alloy having excellent contact resistance and antifouling property and suitable for use in prove pin |
| TW201144816A (en) * | 2010-02-12 | 2011-12-16 | Luzcom Inc | Manufacturing method for contact for current inspection jig, contact for current inspection jig manufactured using said method, and current inspection jig provided with said contact |
| TW201411135A (zh) * | 2012-07-25 | 2014-03-16 | Nidec Read Corp | 檢查用治具及接觸子 |
| TW201428110A (zh) * | 2012-08-03 | 2014-07-16 | Yamamoto Precious Metal Co Ltd | 合金材料、接觸探針及連接端子 |
| JP2016142644A (ja) * | 2015-02-03 | 2016-08-08 | 株式会社日本マイクロニクス | 電気的接続装置およびポゴピン |
| TW201702392A (zh) * | 2015-03-31 | 2017-01-16 | 日本發條股份有限公司 | 合金材料、接觸探針及連接端子 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110809805A (zh) | 2020-02-18 |
| KR20200018576A (ko) | 2020-02-19 |
| CN113690656A (zh) | 2021-11-23 |
| JPWO2019013163A1 (ja) | 2020-02-06 |
| US20210088552A1 (en) | 2021-03-25 |
| JP2022050442A (ja) | 2022-03-30 |
| WO2019013163A1 (ja) | 2019-01-17 |
| CN110809805B (zh) | 2021-10-26 |
| TW201909196A (zh) | 2019-03-01 |
| KR102350158B1 (ko) | 2022-01-12 |
| JP2021099346A (ja) | 2021-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI787302B (zh) | 一種二元銅銀合金體的製造方法、觸頭引腳以及使用二元銅銀合金的裝置 | |
| KR101475979B1 (ko) | 미세 구조체 | |
| CN105489541A (zh) | 半导体制造装置用部件及其制造方法 | |
| JP2020169945A (ja) | 高速通信半導体用コンタクト及び半導体検査システム | |
| CN107130209A (zh) | 掩膜板、掩膜板的制造方法和蒸镀装置 | |
| CN115148615B (zh) | 芯片封装结构的修复方法 | |
| JP5693637B2 (ja) | 微細構造体の製造方法 | |
| JP2011150837A (ja) | 回路接続部材、導電性粒子および導電性粒子の製造方法 | |
| TWI887358B (zh) | 電子設備用檢查插座、其製造裝置和製造方法 | |
| JP5523941B2 (ja) | 金属充填微細構造体の製造方法 | |
| JP2002212763A (ja) | エッチング部品の製造方法 | |
| CN108046209A (zh) | 一种以su-8胶为回流焊阻焊层的mems元件低温封装方法 | |
| JP2011150836A (ja) | 回路接続部材、導電性粒子および導電性粒子の製造方法 | |
| JP2012049100A (ja) | 接続端子及び接続端子の製造方法 | |
| KR101083711B1 (ko) | 평판표시소자 검사용 점등 보드 및 그 제조방법 | |
| KR20220024107A (ko) | 금속 제품의 미세 가공 장치 및 금속 제품의 미세 가공 방법 | |
| KR101599422B1 (ko) | 강화유리에 금속 패턴을 형성하는 방법 | |
| JP2009277461A (ja) | 導電性部材パターンの製造方法 | |
| CN111150368A (zh) | 一种用来监测帕金森综合征的柔性振动传感器加工方法 | |
| JP2005520930A (ja) | ウェハ表面を電気メッキするための装置および方法 | |
| JPH0845941A (ja) | 半導体装置バンプの形成方法 | |
| TW201821382A (zh) | 附膜玻璃板之製造方法 | |
| CN111893527A (zh) | 纳米电极对及其制备方法 | |
| CN109659738B (zh) | 导电端子的触点保护层及其形成方法 | |
| TWI688832B (zh) | 精細金屬遮罩的製法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |