KR102208848B1 - 익스팬드 시트 - Google Patents

익스팬드 시트 Download PDF

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Publication number
KR102208848B1
KR102208848B1 KR1020170059284A KR20170059284A KR102208848B1 KR 102208848 B1 KR102208848 B1 KR 102208848B1 KR 1020170059284 A KR1020170059284 A KR 1020170059284A KR 20170059284 A KR20170059284 A KR 20170059284A KR 102208848 B1 KR102208848 B1 KR 102208848B1
Authority
KR
South Korea
Prior art keywords
expand sheet
glue layer
holding unit
sheet
frame
Prior art date
Application number
KR1020170059284A
Other languages
English (en)
Korean (ko)
Other versions
KR20170129059A (ko
Inventor
다카시 모리
도루 다카자와
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20170129059A publication Critical patent/KR20170129059A/ko
Application granted granted Critical
Publication of KR102208848B1 publication Critical patent/KR102208848B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
KR1020170059284A 2016-05-16 2017-05-12 익스팬드 시트 KR102208848B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-098227 2016-05-16
JP2016098227A JP6723644B2 (ja) 2016-05-16 2016-05-16 エキスパンドシート

Publications (2)

Publication Number Publication Date
KR20170129059A KR20170129059A (ko) 2017-11-24
KR102208848B1 true KR102208848B1 (ko) 2021-01-27

Family

ID=60415626

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170059284A KR102208848B1 (ko) 2016-05-16 2017-05-12 익스팬드 시트

Country Status (3)

Country Link
JP (1) JP6723644B2 (ja)
KR (1) KR102208848B1 (ja)
CN (1) CN107442943B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021022606A (ja) * 2019-07-25 2021-02-18 株式会社ディスコ ウェーハの分割方法及びウェーハの分割に用いるテープ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100751182B1 (ko) 2006-07-25 2007-08-22 제일모직주식회사 박막 웨이퍼의 다이싱용 다이 본드 필름의 제조방법
JP2009147201A (ja) 2007-12-17 2009-07-02 Denki Kagaku Kogyo Kk ダイシングシート、その製造方法、および電子部品の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4664739A (en) * 1983-12-19 1987-05-12 Stauffer Chemical Company Removal of semiconductor wafers from dicing film
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
EP1635390B1 (en) 2002-03-12 2011-07-27 Hamamatsu Photonics K. K. Substrate dividing method
JP4923398B2 (ja) * 2004-09-21 2012-04-25 日立化成工業株式会社 接着剤層付き半導体素子の製造方法
JP2006229021A (ja) * 2005-02-18 2006-08-31 Disco Abrasive Syst Ltd ウエーハの分割方法
CN102093828A (zh) * 2007-09-14 2011-06-15 古河电气工业株式会社 晶片加工用带
JP2011077482A (ja) 2009-10-02 2011-04-14 Disco Abrasive Syst Ltd テープ拡張装置
JP4976531B2 (ja) * 2010-09-06 2012-07-18 日東電工株式会社 半導体装置用フィルム
JP2012069586A (ja) * 2010-09-21 2012-04-05 Nitto Denko Corp ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法
US9786541B2 (en) * 2011-09-30 2017-10-10 Lintec Corporation Dicing sheet with protective film forming layer and chip fabrication method
JP5980600B2 (ja) 2012-07-12 2016-08-31 株式会社ディスコ テープ拡張装置
JP5992277B2 (ja) * 2012-09-20 2016-09-14 株式会社ディスコ 加工方法
US10030174B2 (en) * 2013-03-27 2018-07-24 Lintec Corporation Composite sheet for forming protective film
KR102535477B1 (ko) * 2014-05-23 2023-05-23 가부시끼가이샤 레조낙 다이본드 다이싱 시트

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100751182B1 (ko) 2006-07-25 2007-08-22 제일모직주식회사 박막 웨이퍼의 다이싱용 다이 본드 필름의 제조방법
JP2009147201A (ja) 2007-12-17 2009-07-02 Denki Kagaku Kogyo Kk ダイシングシート、その製造方法、および電子部品の製造方法

Also Published As

Publication number Publication date
CN107442943A (zh) 2017-12-08
CN107442943B (zh) 2021-01-29
JP6723644B2 (ja) 2020-07-15
JP2017208390A (ja) 2017-11-24
KR20170129059A (ko) 2017-11-24

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E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
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