JP2017208390A - エキスパンドシート - Google Patents
エキスパンドシート Download PDFInfo
- Publication number
- JP2017208390A JP2017208390A JP2016098227A JP2016098227A JP2017208390A JP 2017208390 A JP2017208390 A JP 2017208390A JP 2016098227 A JP2016098227 A JP 2016098227A JP 2016098227 A JP2016098227 A JP 2016098227A JP 2017208390 A JP2017208390 A JP 2017208390A
- Authority
- JP
- Japan
- Prior art keywords
- expanded
- expanded sheet
- workpiece
- holding unit
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003292 glue Substances 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 43
- 239000012790 adhesive layer Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 17
- 239000002313 adhesive film Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 8
- 125000004122 cyclic group Chemical group 0.000 description 7
- 238000003672 processing method Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Abstract
Description
3 基材
3a 第1面(上面)
3b 第2面(下面)
5 糊層(粘着層、接着層)
5a 第1糊層
5b 第2糊層
7 セパレータフィルム
9 接着フィルム
11 被加工物
11a 第1面(表面)
11b 第2面(裏面)
13 デバイス
15 改質層
17 チップ
21 フレーム
31 エキスパンドシート
2 拡張装置
4 第1保持ユニット(第1保持手段)
6 第2保持ユニット(第2保持手段)
8 第3保持ユニット(第3保持手段)
10 第4保持ユニット(第4保持手段)
12 上側支持部材
14 下側支持部材
16 接触部材
22 拡張装置
24 支持構造
26 拡張ドラム
28 フレーム支持テーブル
30 クランプ
32 昇降機構
34 シリンダケース
36 ピストンロッド
A1 第1貼着領域
A2 第2貼着領域
D1 第1方向
D2 第2方向
Claims (2)
- 板状の被加工物が貼着された状態で拡張されるエキスパンドシートであって、
基材と、
該基材上で被加工物が貼着される位置に形成された第1糊層と、
該基材上で環状のフレームが貼着される位置に形成された第2糊層と、を備え、
該第1糊層と該第2糊層とを除く領域に該基材が露出していることを特徴とするエキスパンドシート。 - 請求項1に記載のエキスパンドシートであって、
該第1糊層上に、被加工物に接着される接着フィルムが配置されていることを特徴とするエキスパンドシート。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016098227A JP6723644B2 (ja) | 2016-05-16 | 2016-05-16 | エキスパンドシート |
CN201710327584.7A CN107442943B (zh) | 2016-05-16 | 2017-05-10 | 扩展片 |
KR1020170059284A KR102208848B1 (ko) | 2016-05-16 | 2017-05-12 | 익스팬드 시트 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016098227A JP6723644B2 (ja) | 2016-05-16 | 2016-05-16 | エキスパンドシート |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017208390A true JP2017208390A (ja) | 2017-11-24 |
JP6723644B2 JP6723644B2 (ja) | 2020-07-15 |
Family
ID=60415626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016098227A Active JP6723644B2 (ja) | 2016-05-16 | 2016-05-16 | エキスパンドシート |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6723644B2 (ja) |
KR (1) | KR102208848B1 (ja) |
CN (1) | CN107442943B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021022606A (ja) * | 2019-07-25 | 2021-02-18 | 株式会社ディスコ | ウェーハの分割方法及びウェーハの分割に用いるテープ |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60136331A (ja) * | 1983-12-19 | 1985-07-19 | ナショナル スタ−チ アンド ケミカル コ−ポレイション | ダイシング用フィルムから半導体チップの取外方法 |
JP2006093213A (ja) * | 2004-09-21 | 2006-04-06 | Hitachi Chem Co Ltd | 接着剤層付き半導体素子の製造方法 |
JP2006229021A (ja) * | 2005-02-18 | 2006-08-31 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP2009147201A (ja) * | 2007-12-17 | 2009-07-02 | Denki Kagaku Kogyo Kk | ダイシングシート、その製造方法、および電子部品の製造方法 |
JP2012069586A (ja) * | 2010-09-21 | 2012-04-05 | Nitto Denko Corp | ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法 |
WO2014157426A1 (ja) * | 2013-03-27 | 2014-10-02 | リンテック株式会社 | 保護膜形成用複合シート |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
ATE534142T1 (de) | 2002-03-12 | 2011-12-15 | Hamamatsu Photonics Kk | Verfahren zum auftrennen eines substrats |
KR100751182B1 (ko) * | 2006-07-25 | 2007-08-22 | 제일모직주식회사 | 박막 웨이퍼의 다이싱용 다이 본드 필름의 제조방법 |
MY153006A (en) * | 2007-09-14 | 2014-12-31 | Furukawa Electric Co Ltd | Wafer processing film |
JP2011077482A (ja) | 2009-10-02 | 2011-04-14 | Disco Abrasive Syst Ltd | テープ拡張装置 |
JP4976531B2 (ja) * | 2010-09-06 | 2012-07-18 | 日東電工株式会社 | 半導体装置用フィルム |
CN103797567B (zh) * | 2011-09-30 | 2018-05-11 | 琳得科株式会社 | 具有保护膜形成层的切割膜片和芯片的制造方法 |
JP5980600B2 (ja) | 2012-07-12 | 2016-08-31 | 株式会社ディスコ | テープ拡張装置 |
JP5992277B2 (ja) * | 2012-09-20 | 2016-09-14 | 株式会社ディスコ | 加工方法 |
JPWO2015178369A1 (ja) * | 2014-05-23 | 2017-04-20 | 日立化成株式会社 | ダイボンドダイシングシート |
-
2016
- 2016-05-16 JP JP2016098227A patent/JP6723644B2/ja active Active
-
2017
- 2017-05-10 CN CN201710327584.7A patent/CN107442943B/zh active Active
- 2017-05-12 KR KR1020170059284A patent/KR102208848B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60136331A (ja) * | 1983-12-19 | 1985-07-19 | ナショナル スタ−チ アンド ケミカル コ−ポレイション | ダイシング用フィルムから半導体チップの取外方法 |
JP2006093213A (ja) * | 2004-09-21 | 2006-04-06 | Hitachi Chem Co Ltd | 接着剤層付き半導体素子の製造方法 |
JP2006229021A (ja) * | 2005-02-18 | 2006-08-31 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP2009147201A (ja) * | 2007-12-17 | 2009-07-02 | Denki Kagaku Kogyo Kk | ダイシングシート、その製造方法、および電子部品の製造方法 |
JP2012069586A (ja) * | 2010-09-21 | 2012-04-05 | Nitto Denko Corp | ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法 |
WO2014157426A1 (ja) * | 2013-03-27 | 2014-10-02 | リンテック株式会社 | 保護膜形成用複合シート |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021022606A (ja) * | 2019-07-25 | 2021-02-18 | 株式会社ディスコ | ウェーハの分割方法及びウェーハの分割に用いるテープ |
Also Published As
Publication number | Publication date |
---|---|
CN107442943A (zh) | 2017-12-08 |
JP6723644B2 (ja) | 2020-07-15 |
KR20170129059A (ko) | 2017-11-24 |
CN107442943B (zh) | 2021-01-29 |
KR102208848B1 (ko) | 2021-01-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5313036B2 (ja) | 粘着テープの拡張方法 | |
JP2014236034A (ja) | ウェーハの加工方法 | |
JP2019110198A (ja) | 被加工物の加工方法 | |
JP2016111188A (ja) | 離間装置および離間方法 | |
JP2007173770A (ja) | テープの貼り替え方法及び該テープの貼り替え方法を使用した基板の分割方法 | |
CN111095493A (zh) | 薄型化板状部件的制造方法以及薄型化板状部件的制造装置 | |
JP6033116B2 (ja) | 積層ウェーハの加工方法および粘着シート | |
JP2007294748A (ja) | ウェーハ搬送方法 | |
JP2016127124A (ja) | 離間装置および離間方法 | |
TW201842559A (zh) | 分割方法 | |
JP3196099U (ja) | 離間装置 | |
JP2017208390A (ja) | エキスパンドシート | |
JP6611130B2 (ja) | エキスパンドシート | |
KR20200044001A (ko) | 박형화 판상 부재의 제조 방법, 및 제조 장치 | |
JP6047392B2 (ja) | 分割装置および分割方法 | |
US10103055B2 (en) | Expansion sheet, expansion sheet manufacturing method, and expansion sheet expanding method | |
JP6723643B2 (ja) | エキスパンドシート | |
KR20210058606A (ko) | 웨이퍼 확장 장치 | |
JP6386866B2 (ja) | 離間装置および離間方法 | |
JP2023032665A (ja) | 基板の分割方法 | |
TWI807124B (zh) | 晶圓擴張方法以及晶圓擴張裝置 | |
CN104425334A (zh) | 半导体装置的制造方法以及半导体制造装置 | |
JP2015133442A (ja) | ウェーハの加工方法 | |
JP6393575B2 (ja) | 離間装置および離間方法 | |
JP2004335909A (ja) | 板状部材の分割方法及び分割装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190320 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20191105 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191112 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200107 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200331 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200529 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200623 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200623 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6723644 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |