KR102168908B1 - 폴리하이드록시폴리에테르 수지의 제조 방법, 폴리하이드록시폴리에테르 수지, 그 수지 조성물 및 그 경화물 - Google Patents

폴리하이드록시폴리에테르 수지의 제조 방법, 폴리하이드록시폴리에테르 수지, 그 수지 조성물 및 그 경화물 Download PDF

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Publication number
KR102168908B1
KR102168908B1 KR1020140033115A KR20140033115A KR102168908B1 KR 102168908 B1 KR102168908 B1 KR 102168908B1 KR 1020140033115 A KR1020140033115 A KR 1020140033115A KR 20140033115 A KR20140033115 A KR 20140033115A KR 102168908 B1 KR102168908 B1 KR 102168908B1
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KR
South Korea
Prior art keywords
resin
group
epoxy resin
polyhydroxypolyether
compound
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KR1020140033115A
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English (en)
Korean (ko)
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KR20140118800A (ko
Inventor
히데노리 노자와
마사오 군지
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
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Publication of KR20140118800A publication Critical patent/KR20140118800A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/0204—Polyarylenethioethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
KR1020140033115A 2013-03-29 2014-03-21 폴리하이드록시폴리에테르 수지의 제조 방법, 폴리하이드록시폴리에테르 수지, 그 수지 조성물 및 그 경화물 KR102168908B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-074292 2013-03-29
JP2013074292A JP6040085B2 (ja) 2013-03-29 2013-03-29 ポリヒドロキシポリエーテル樹脂の製造方法、ポリヒドロキシポリエーテル樹脂、その樹脂組成物、及びその硬化物

Publications (2)

Publication Number Publication Date
KR20140118800A KR20140118800A (ko) 2014-10-08
KR102168908B1 true KR102168908B1 (ko) 2020-10-22

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KR1020140033115A KR102168908B1 (ko) 2013-03-29 2014-03-21 폴리하이드록시폴리에테르 수지의 제조 방법, 폴리하이드록시폴리에테르 수지, 그 수지 조성물 및 그 경화물

Country Status (4)

Country Link
JP (1) JP6040085B2 (ja)
KR (1) KR102168908B1 (ja)
CN (1) CN104072750B (ja)
TW (1) TWI623566B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101788379B1 (ko) * 2015-06-09 2017-10-19 삼성에스디아이 주식회사 화학식 1 또는 2의 고분자 수지, 이를 포함하는 접착 필름 및 상기 접착 필름에 의해 접속된 반도체 장치
JP2017115055A (ja) * 2015-12-25 2017-06-29 日立化成株式会社 フェノキシ樹脂
JP6722485B2 (ja) * 2016-03-24 2020-07-15 日鉄ケミカル＆マテリアル株式会社 ビスフェノールｆ骨格含有フェノキシ樹脂、その製造方法、及びそれを用いた樹脂組成物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4675373A (en) * 1985-04-18 1987-06-23 Mitsui Petrochemical Industries, Ltd. Polyhydroxy polyether, process for its production, and its use
JPS62106925A (ja) * 1985-11-06 1987-05-18 Mitsui Petrochem Ind Ltd ポリヒドロキシポリエ−テルおよびその用途
JPS63146925A (ja) * 1986-08-20 1988-06-18 Mitsui Petrochem Ind Ltd ポリヒドロキシポリエ−テルおよびその用途
JPH08127651A (ja) * 1994-10-28 1996-05-21 Kureha Chem Ind Co Ltd フェノキシ樹脂の製造方法
JP3760612B2 (ja) 1997-12-18 2006-03-29 大日本インキ化学工業株式会社 エポキシ樹脂の製造方法
JP3809273B2 (ja) 1998-03-25 2006-08-16 東都化成株式会社 エポキシ樹脂組成物
JP2001127215A (ja) 1999-10-28 2001-05-11 Sumitomo Bakelite Co Ltd 液状樹脂組成物及びそれを用いた半導体装置
JP3747221B2 (ja) 1999-11-18 2006-02-22 ジャパンエポキシレジン株式会社 高分子エポキシ樹脂の製造方法及び塗料組成物
MY124944A (en) 2000-02-09 2006-07-31 Hitachi Chemical Co Ltd Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards
JP2002327162A (ja) 2001-03-01 2002-11-15 Hitachi Chem Co Ltd 異方導電性接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP4148789B2 (ja) 2003-01-28 2008-09-10 東都化成株式会社 液状エポキシ樹脂の分析方法
JP4449325B2 (ja) 2003-04-17 2010-04-14 住友ベークライト株式会社 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
JP5055830B2 (ja) 2005-06-03 2012-10-24 日立化成工業株式会社 ポリヒドロキシポリエーテル樹脂及びこれを用いた樹脂組成物、回路部材接続用接着剤並びに回路板
JP5376767B2 (ja) * 2007-03-26 2013-12-25 新日鉄住金化学株式会社 新規熱可塑性ポリヒドロキシポリエーテル樹脂及び、それを配合した樹脂組成物

Also Published As

Publication number Publication date
KR20140118800A (ko) 2014-10-08
CN104072750A (zh) 2014-10-01
TWI623566B (zh) 2018-05-11
JP2014198762A (ja) 2014-10-23
TW201437254A (zh) 2014-10-01
CN104072750B (zh) 2017-09-15
JP6040085B2 (ja) 2016-12-07

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